CN113881382A - 一种导热性的环氧灌封材料 - Google Patents
一种导热性的环氧灌封材料 Download PDFInfo
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Abstract
本发明为一种导热性的环氧灌封材料。该灌封材料是将有机组分环氧树脂、稀释剂、固化剂和促进剂,以及导热性无机填料,室温下复合、灌封,于40~60℃下完成固化。本发明通过导热性无机填料提高了灌封材料固化后的导热效率,通过功能性固化剂显著改善了导热性无机填料与环氧树脂基体之间的相互作用,有利于提高导热和力学性能。环氧灌封材料不含有害的挥发物,利于环保。
Description
技术领域
本发明涉及电子元器件的灌封材料,并且更具体地涉及一种有机/无机复合的环氧树脂高导热性灌封材料。
背景技术
环氧树脂灌封电子元器件,可以阻隔空气、水分和二氧化碳,改善电子元器件、电子元器件组合、线路板的工作环境,延长元器件的使用寿命,也可以提高电子元器件在运输和使用过程中的稳定性,防止振荡、撞击等机械力对电子元器件、电子元器件组合、线路板的破坏。但传统的环氧树脂灌封材料在固化之后的导热能力有限,电子元器件、电子元器件组合、线路板在工作过程中产生的热量不能很好地及时导出。因为散热能力欠佳,导致电子元器件的热量积聚、温度升高,直接影响了电子元器件的工作状态和使用寿命。
CN105229078公开了一种环氧浇注树脂体系,所公开的环氧树脂体系对水、盐雾、无机酸、碱和大多数有机溶剂具有的良好抗性。所述的环氧树脂具有低粘度,同时保持有利的物理、热和电性质。所述的环氧浇注树脂体系可用于至少部分地覆盖电子元件或装置,比市场同类产品的热导率提高24%,导电率提高9.5%,固化环氧树脂的物理性能提高10%至20%。虽然所公开的材料可以通过使用非氧化铝填充的环氧树脂(例如使用氮化硼)得到诸如热导率的有利性质,但是这些明显更昂贵。因此,所公开的材料是具有优于其同类中其它环氧树脂的改善性质的经济有效途径。该树脂体系分为树脂部分(A部分)和硬化剂部分(B部分),二者混合在一起从而开始反应。双酚F环氧树脂、丁基缩水甘油醚、环氧炭黑分散体、氧化铝、磷盐、氢氧化铝和聚磷酸铵为A部分,聚乙二醇二胺和聚胺共混物为B部分。重量为5%至10%的聚乙二醇二胺在体系中作为反应剂。环氧树脂和硬化剂混合在一起形成树脂,将该树脂倾倒入容器中固化。然后,将混合的树脂在60℃下固化2小时。该专利使用了价位较高的双酚F环氧树脂,氢氧化铝的质量用量为9%,氧化铝的质量用量高达54%,无机材料填料提高了材料体系对环境破坏因素的抵抗作用,但填料的用量过高,不利于基本的力学性能,如抗压强度和冲击强度。另外,氢氧化铝作为无机非金属氧化物,通常作为普通填料使用,可以提高材料的抗磨损、磨耗性能,但不利于体系的散热。
CN 103450638公开了一种环氧浇注干式变压器用高导热环氧树脂的制备方法,它利用氮化硼粒子的高导热性,将微米级氮化硼颗粒加入环氧树脂中。经过48-50℃下超声波分散、球磨和高速离心分散,灌封后继续加温145-150℃固化3小时,同时将热压成型机压力维持在30MPa。复合材料中的氮化硼颗粒可以在环氧基体内部形成导热通道,从而提高整个复合材料的导热性能。
本专利发明了一种导热性的环氧灌封材料,更具体地涉及一种有机/无机复合的环氧树脂高导热性灌封材料。它包括有机组分环氧树脂、稀释剂、固化剂和促进剂,以及导热性无机填料,室温下复合、灌封,于40~60℃下完成固化。
发明内容
本发明的目的在于提供一种导热性的环氧灌封材料。该灌封材料是将有机组分环氧树脂、稀释剂、固化剂和促进剂,以及导热性无机填料,室温下复合、灌封,于40~60℃下完成固化。通过导热性无机填料提高灌封材料固化后的导热效率。
本发明的技术方案为:
一种导热性的环氧灌封材料。该灌封材料是将有机组分与导热性无机填料室温下复合、灌封,于40~60℃下完成固化。其原料配比为:
所述的有机组分包括环氧树脂、稀释剂、固化剂和促进剂。所述的环氧树脂为双酚A型环氧树脂E-51、E-44中的一种或两种,稀释剂为1,4-丁二醇二缩水甘油醚、乙二醇二缩水甘油醚、丁基缩水甘油醚中的一种或两种,固化剂为聚酰胺650、N、N-二甲基苯胺和改性脂肪胺593中的一种或两种,促进剂为2,4,6-三(二甲氨基甲基)苯酚。
所述的功能性固化剂为多巴胺。
所述的导热性无机填料为微米级氮化硼粉末。
本发明的有益效果是:
(1)本发明的导热性的环氧灌封材料固化后,在强度良好的基础上提高了导热性,提高了对电子元器件的保护作用。
(2)多巴胺既可以与导热性无机填料氮化硼产生化学键合,又可以固化环氧树脂,显著改善了氮化硼粉末与环氧树脂基体之间的相互作用,有利于提高导热和力学性能。
(3)氮化硼的导热能力强、绝缘性高,提高了环氧灌封材料的散热能力,对电子元器件、电子元器件组合、线路板无不利影响。
(4)固化物不含有害的挥发物,利于环保。
具体实施方式
下面结合实例进一步说明:
实施例一
35份氮化硼粉末,加入15份多巴胺的水溶液,三羟甲基氨基甲烷调节pH值,搅拌均匀后室温干燥48小时后使用。100份双酚A型环氧树脂E-51和32份1,4-丁二醇二缩水甘油醚加至搅拌罐中搅拌,加入20份聚酰胺650、2份2,4,6-三(二甲氨基甲基)苯酚以及35份经过多巴胺处理的氮化硼粉末。室温下混合均匀,除去气泡后灌封、50℃下完成固化。
实施例二
实施步骤同例一,不同之处在于:多巴胺由15份改为8份、聚酰胺650由20份改为27份。
实施例三
实施步骤同例一,不同之处在于:氮化硼由35份改为25份。
对比例
实施步骤同例一,不同之处在于:灌封材料未添加氮化硼。
性能测量:方法同实施例一。
附表 本发明导热性的环氧灌封材料的性能
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施方式仅限于此,对于本发明所属技术领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干简单的推演或替换,都应当视为属于本发明由所提交的权利要求书确定专利保护范围。
本发明未尽事宜为公知技术。
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CN115651582A (zh) * | 2022-12-07 | 2023-01-31 | 河北工业大学 | 一种导热增韧绝缘环氧树脂结构胶的制备方法 |
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CN115651582A (zh) * | 2022-12-07 | 2023-01-31 | 河北工业大学 | 一种导热增韧绝缘环氧树脂结构胶的制备方法 |
CN115651582B (zh) * | 2022-12-07 | 2023-09-22 | 河北工业大学 | 一种导热增韧绝缘环氧树脂结构胶的制备方法 |
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