CN113871340B - Novel wafer film pasting process - Google Patents
Novel wafer film pasting process Download PDFInfo
- Publication number
- CN113871340B CN113871340B CN202111132834.4A CN202111132834A CN113871340B CN 113871340 B CN113871340 B CN 113871340B CN 202111132834 A CN202111132834 A CN 202111132834A CN 113871340 B CN113871340 B CN 113871340B
- Authority
- CN
- China
- Prior art keywords
- vacuum
- wafer
- positioning
- film pasting
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of wafer film pasting, in particular to a novel wafer film pasting process, which comprises a workbench, wherein a bearing plate is arranged on the lower side in the workbench, a vacuum machine is arranged at the end part of the bearing plate, a film pasting assembly is arranged at the end part of the workbench, the film pasting assembly comprises a vacuum film pasting table, a support column, a wafer main body, a positioning frame, a positioning shaft, a connecting rod, a first connecting shaft, a connecting rod, a positioning block, a second connecting shaft, a vacuum cover and an electric telescopic rod, the vacuum cover and the vacuum film pasting table can be connected simply and conveniently in a connecting mode through the positioning shaft and the connecting rod in a sliding mode through the driving end of the electric telescopic rod, the stability of pressing connection between the vacuum cover and the vacuum film pasting table is high through the positioning block, the vacuum film pasting effect of the wafer main body is good through the vacuum cover and the vacuum film pasting table in a corresponding and adaptive arrangement, the film pasting effect of the wafer main body is good through vacuum adsorption, and the film pasting efficiency and the quality of the wafer main body are high.
Description
Technical Field
The invention relates to the technical field of wafer film pasting, in particular to a novel wafer film pasting process.
Background
For some thin wafers with protruding solder balls and gold balls on the surfaces of chips, the conventional film pasting method is to adsorb the wafer on a worktable with the front side of the wafer facing downwards, and then to press the film on the front side of the wafer by using a roller, so that the protruding solder balls and the gold balls are easily crushed in the film pasting process, and the wafer is cracked.
Regarding the film-pasting problem of thin wafer with protruding solder balls and gold balls on the surface of the chip, a new wafer film-pasting process is needed to improve the above problem.
Disclosure of Invention
The present invention is directed to a novel wafer film pasting process to solve the problems of the background art mentioned above.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a new wafer pad pasting technology, includes the workstation, there is the loading board the inside downside of workstation, the tip of loading board is provided with the vacuum machine, the tip of workstation is provided with the pad pasting subassembly, the pad pasting subassembly includes vacuum pad pasting platform, support column, wafer main part, locating rack, location axle, linking pole, first switching axle, switching pole, locating piece, second switching axle, vacuum cover and electric telescopic handle.
As a preferable scheme of the invention, a vacuum tube is arranged on the left rear side of the end part of the vacuum film sticking table, a support column is arranged on the front side of the end part of the vacuum film sticking table, a wafer main body is arranged on the end part of the support column, positioning blocks are slidably arranged inside the left side and the right side of the positioning frame, connecting rods are rotatably arranged at two ends of the positioning shaft, a first rotating shaft is rotatably arranged at the other end of each connecting rod, rotating rods are rotatably arranged at two ends of the first rotating shaft, a second rotating shaft is arranged at the other end of each rotating rod, a vacuum cover is arranged on the inner side wall of each positioning block, and an electric telescopic rod is arranged on the left front side of the end part of the workbench.
As the preferable scheme of the invention, the middle of the grabbing and switching rod is rotatably connected with the positioning block through a small circular shaft, and the positioning shaft is fixedly connected with the workbench.
As a preferable scheme of the present invention, a positioning chute is formed in the left front side of the left side of the adapter rod, and the driving end of the electric telescopic rod is slidably connected to the adapter rod through a positioning circular shaft.
As a preferable scheme of the invention, the vacuum cover is correspondingly matched with the vacuum film sticking table, and the vacuum film sticking table is arranged at the end part of the workbench.
According to a preferable scheme of the invention, the positioning frame is positioned at the end part of the workbench and is arranged corresponding to the vacuum film sticking table, the vacuum pressure gauge is arranged on the left side of the front surface of the vacuum film sticking table, and the vacuum tube is connected with the vacuum machine through the connecting tube.
A novel wafer film pasting process comprises the following film pasting process steps:
s1, placing a wafer main body with the back face upward and the edge suspended in the air by adopting a supporting column supporting center, and then placing a film on the wafer main body;
s2, the electric telescopic rod pulls the counter-rotating connecting rod to enable the vacuum cover and the vacuum film sticking table to be sealed and covered, the vacuum machine works to enable the vacuum cover and the vacuum film sticking table to be vacuum, and the wafer main body is well attached to the film through vacuum adsorption.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the vacuum film sticking table, the driving end of the electric telescopic rod is connected with the adapter rod in a sliding mode through the positioning round shaft, so that the vacuum cover and the vacuum film sticking table can be connected and operated simply and conveniently, and the vacuum cover and the vacuum film sticking table can be connected in a pressing mode through the arranged positioning block in a high-stability mode.
2. According to the invention, the vacuum cover and the vacuum film pasting table are correspondingly and adaptively arranged, so that the vacuum film pasting effect of the wafer main body is better, the vacuum adsorption is utilized to ensure that the film pasting effect of the wafer main body is good, and the film pasting efficiency and the film pasting quality of the wafer main body are high.
Drawings
FIG. 1 is a schematic overall front view of the present invention;
FIG. 2 is a schematic rear view of a portion of the present invention;
FIG. 3 is a schematic view of a vacuum lamination station according to the present invention.
In the figure: 1. a work table; 101. a carrier plate; 102. a vacuum machine; 2. a film pasting component; 201. a vacuum film pasting table; 202. a support column; 203. a wafer body; 204. a positioning frame; 205. positioning the shaft; 206. a connecting rod; 207. a first transfer shaft; 208. a transfer lever; 209. positioning blocks; 210. a second transfer shaft; 211. a vacuum hood; 212. an electric telescopic rod; 213. a vacuum tube; 214. and a positioning chute.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In order that the invention may be readily understood, a more complete description of the invention briefly described above will be rendered by reference to the appended drawings, which illustrate several embodiments of the invention, but which are capable of being practiced in many different forms and are not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, the present invention provides a technical solution:
the utility model provides a novel wafer pad pasting technology, includes workstation 1, there is the loading board 101 the inside downside of workstation 1, and the tip of loading board 101 is provided with vacuum machine 102, and the tip of workstation 1 is provided with pad pasting subassembly 2, and pad pasting subassembly 2 includes vacuum pad pasting platform 201, support column 202, wafer main part 203, locating rack 204, location axle 205, join pole 206, first switching axle 207, switching pole 208, locating piece 209, second switching axle 210, vacuum hood 211 and electric telescopic handle 212.
In an embodiment, referring to fig. 1, 2, and 3, a vacuum tube 213 is disposed on a rear left end of the vacuum film pasting table 201, a support column 202 is disposed on a front end of the vacuum film pasting table 201, a wafer main body 203 is disposed on an end of the support column 202, positioning blocks 209 are slidably disposed inside left and right sides of the positioning frame 204, coupling rods 206 are rotatably disposed on two ends of the positioning shaft 205, a first coupling shaft 207 is rotatably disposed on the other end of the coupling rod 206, adapter rods 208 are rotatably disposed on two ends of the first coupling shaft 207, a second coupling shaft 210 is disposed on the other end of the adapter rod 208, a vacuum hood 211 is disposed on an inner side wall of the positioning block 209, an electric telescopic rod 212 is disposed on a front left end of the table 1, the middle of the coupling rod 208 is rotatably connected to the positioning block 209 through a small circular shaft, the positioning shaft 205 is fixedly connected to the table 1, a positioning chute 214 is disposed on a front left side of the adapter rod 208, a driving end of the electric telescopic rod 212 is slidably connected to the adapter rod 208 through a positioning circular shaft, the positioning circular shaft 212 is slidably connected to the adapter rod 208, the driving end of the vacuum film pasting table 201 through the positioning circular shaft, and the vacuum hood 211 can be conveniently connected to the vacuum film pasting table 201, and the vacuum film pasting table 201 through the positioning block 209, and the vacuum film pasting table 201.
In an embodiment, referring to fig. 1, 2 and 3, the vacuum cover 211 is correspondingly adapted to the vacuum film sticking table 201, the vacuum film sticking table 201 is located at an end of the working table 1, the positioning frame 204 is located at an end of the working table 1 and is correspondingly arranged to the vacuum film sticking table 201, a vacuum manometer is arranged at a left side of a front surface of the vacuum film sticking table 201, the vacuum pipe 213 is connected to the vacuum machine 102 through a connecting pipe, the vacuum cover 211 and the vacuum film sticking table 201 are correspondingly adapted to each other, so that a vacuum film sticking effect of the wafer body 203 is good, the wafer body 203 is well stuck to the film by using vacuum adsorption, and the film sticking efficiency and quality of the wafer body 203 are high.
A novel wafer film pasting process comprises the following film pasting process steps:
s1, placing the wafer main body 203 with the back face upward and the edge of the wafer main body 203 with the supporting column 202 supporting the center in a suspended mode, and then placing a film on the wafer main body 203;
s2, the electric telescopic rod 212 pulls the rotating connecting rod 208 to enable the vacuum cover 211 and the vacuum film sticking table 201 to be sealed and covered, the vacuum machine 102 works to enable the vacuum cover 211 and the vacuum film sticking table 201 to be vacuumized, and the wafer main body 203 is well stuck with the film through vacuum adsorption.
The working principle is as follows: when the vacuum laminating machine is used, the back face of the wafer main body 203 faces upwards, the edge of the wafer main body 203 is placed in a suspension mode through the supporting column 202, then a film is placed on the wafer main body 203, the rotating connecting rod 208 is pulled through the electric telescopic rod 212, the vacuum cover 211 and the vacuum laminating table 201 are sealed and covered, the vacuum machine 102 works, vacuum is achieved between the vacuum cover 211 and the vacuum laminating table 201, the wafer main body 203 is well laminated with the film through vacuum adsorption, the vacuum cover 211 and the vacuum laminating table 201 can be connected simply and conveniently through the arranged driving end of the electric telescopic rod 212 and the sliding connection of the positioning round shaft and the rotating connecting rod 208, the vacuum cover 211 and the vacuum laminating table 201 can be connected in a sliding mode, the laminating connection stability of the vacuum cover 211 and the vacuum laminating table 201 is high through the arranged positioning block 209, the vacuum cover 211 and the vacuum laminating table 201 are correspondingly matched, the vacuum laminating effect of the wafer main body 203 is good, and the laminating effect of the wafer main body 203 and the film quality are good through the vacuum adsorption.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a wafer pad pasting device, includes workstation (1), its characterized in that: a bearing plate (101) is arranged on the lower side in the workbench (1), a vacuum machine (102) is arranged at the end part of the bearing plate (101), a film sticking assembly (2) is arranged at the end part of the workbench (1), and the film sticking assembly (2) comprises a vacuum film sticking table (201), a support column (202), a wafer main body (203), a positioning frame (204), a positioning shaft (205), a joint rod (206), a first joint shaft (207), a joint rod (208), a positioning block (209), a second joint shaft (210), a vacuum cover (211) and an electric telescopic rod (212);
a vacuum tube (213) is arranged on the left rear side of the end portion of the vacuum film pasting table (201), a support column (202) is arranged on the front side of the end portion of the vacuum film pasting table (201), a wafer main body (203) is arranged on the end portion of the support column (202), positioning blocks (209) are slidably mounted inside the left side and the right side of the positioning frame (204), connecting rods (206) are rotatably mounted at two ends of the positioning shaft (205), a first rotating shaft (207) is rotatably mounted at the other end of the connecting rod (206), a switching rod (208) is rotatably mounted at two ends of the first rotating shaft (207), a second rotating shaft (210) is mounted at the other end of the switching rod (208), a vacuum cover (211) is mounted on the inner side wall of the positioning block (209), and an electric telescopic rod (212) is arranged on the left front side of the end portion of the workbench (1);
the middle of the adapter rod (208) is rotatably connected with the positioning block (209) through a small round shaft, and the positioning shaft (205) is fixedly connected with the workbench (1);
the left front side of the adapter rod (208) is provided with a positioning sliding groove (214), and the driving end of the electric telescopic rod (212) is connected with the adapter rod (208) in a sliding mode through a positioning circular shaft.
2. The wafer film pasting device according to claim 1, wherein: the vacuum cover (211) is correspondingly matched with the vacuum film sticking table (201), and the vacuum film sticking table (201) is arranged at the end part of the workbench (1).
3. The wafer film laminating device of claim 1, wherein: the end part of the positioning frame (204) positioned on the workbench (1) is arranged corresponding to the vacuum film sticking table (201), the left side of the front surface of the vacuum film sticking table (201) is provided with a vacuum pressure gauge, and the vacuum tube (213) is connected with the vacuum machine (102) through a connecting tube.
4. A wafer laminating process using the wafer laminating apparatus according to any one of claims 1 to 3, wherein: the method comprises the following film pasting process steps:
s1, placing a wafer main body (203) with the back face upward and the edge of the wafer main body (203) with the center supported by a support pillar (202) in a suspended manner, and then placing a film on the wafer main body (203);
s2, the rotating connecting rod (208) is pulled through the electric telescopic rod (212), the vacuum cover (211) and the vacuum film sticking table (201) are sealed and covered, the vacuum machine (102) works to enable the vacuum cover (211) and the vacuum film sticking table (201) to be vacuumized, and the wafer body (203) is well attached to the film through vacuum adsorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111132834.4A CN113871340B (en) | 2021-09-27 | 2021-09-27 | Novel wafer film pasting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111132834.4A CN113871340B (en) | 2021-09-27 | 2021-09-27 | Novel wafer film pasting process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113871340A CN113871340A (en) | 2021-12-31 |
| CN113871340B true CN113871340B (en) | 2022-11-25 |
Family
ID=78990997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111132834.4A Active CN113871340B (en) | 2021-09-27 | 2021-09-27 | Novel wafer film pasting process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113871340B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130384B (en) * | 2022-12-16 | 2023-10-24 | 江苏宝浦莱半导体有限公司 | Semiconductor wafer film pasting technology |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208906609U (en) * | 2018-09-26 | 2019-05-28 | 东莞市译码半导体有限公司 | A kind of vacuum chip mounter |
| CN111710620A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | Film sticking device |
| CN112172118A (en) * | 2020-09-24 | 2021-01-05 | 江苏赛博宇华科技有限公司 | Mobile phone film processing equipment |
| CN112786497B (en) * | 2021-03-03 | 2023-12-22 | 芯钛科半导体设备(上海)有限公司 | Inverted vacuum wafer film pasting device |
-
2021
- 2021-09-27 CN CN202111132834.4A patent/CN113871340B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113871340A (en) | 2021-12-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113871340B (en) | Novel wafer film pasting process | |
| CN201769384U (en) | Workpiece adsorption device for pressing machine, and pressing tool thereof | |
| CN212991126U (en) | OLED vacuum laminating packaging equipment | |
| CN214239646U (en) | Full-automatic pad pasting of LED wafer pastes mark equipment | |
| CN220081878U (en) | Full-automatic pressfitting machine | |
| CN210525828U (en) | Film pasting type plastic liquid crystal film pasting device capable of avoiding generation of bubbles | |
| CN209797787U (en) | Vacuum glass air exhaust device | |
| CN110127128A (en) | A kind of adhesive tape rubberizing mechanism | |
| CN213010724U (en) | Unloader is used in magnet steel equipment | |
| CN214418431U (en) | Plastic product outer surface grinding device | |
| CN211594492U (en) | Vacuum pump-free small-size screen printing plate film pasting device | |
| CN210633453U (en) | Polishing and grinding device for stamping parts | |
| CN209830417U (en) | Car sheet metal component cutting equipment | |
| CN210175265U (en) | Rubberizing mechanism | |
| CN209920068U (en) | Plank cutting positioner that production table chair was used | |
| CN211054403U (en) | Laminating tool of fixed protection film | |
| CN214692111U (en) | Upper and lower copper foil suction transfer machine | |
| CN217348421U (en) | Metal plate packaging device | |
| CN219131728U (en) | Battery pole piece polishing device | |
| CN110436181A (en) | Lithium battery coiling core tests transfer equipment | |
| CN218698204U (en) | Seal installation tool | |
| CN218839900U (en) | Film sticking machine | |
| CN214824807U (en) | Automatic subsides mark double-end adsorption structure of pasting of PCB board | |
| CN219009238U (en) | Automatic sealing ring feeding mechanism for battery processing | |
| CN214395844U (en) | Laminated negative pressure cabin for glass processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |