CN214239646U - Full-automatic pad pasting of LED wafer pastes mark equipment - Google Patents
Full-automatic pad pasting of LED wafer pastes mark equipment Download PDFInfo
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- CN214239646U CN214239646U CN202022455509.9U CN202022455509U CN214239646U CN 214239646 U CN214239646 U CN 214239646U CN 202022455509 U CN202022455509 U CN 202022455509U CN 214239646 U CN214239646 U CN 214239646U
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 108
- 230000005540 biological transmission Effects 0.000 claims abstract description 65
- 238000002372 labelling Methods 0.000 claims abstract description 24
- 239000012528 membrane Substances 0.000 claims description 25
- 238000005096 rolling process Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 52
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
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Abstract
The utility model discloses a full-automatic pad pasting and labeling device of LED wafer, which comprises a box body, wherein an adsorption device, a transmission device, a pad pasting device and a labeling device are arranged in the box body in sequence from one side to the other side, the transmission device is arranged between the adsorption device and the pad pasting device in a reciprocating way, a loading platform is arranged below the adsorption device, the adsorption device comprises a first adsorption plate and a first lifting cylinder, the first adsorption plate is fixedly connected with the top of the box body through the first lifting cylinder, the transmission device comprises a transmission frame, a transmission plate, a chute and a second lifting cylinder, the chute is fixedly connected with the top of the box body, one end of the transmission frame is fixedly connected with the chute, the other end of the transmission frame is fixedly connected with the transmission plate through the second lifting cylinder, the utility model has scientific and reasonable structure, safe and convenient use, integrated pad pasting and labeling, and uses the division procedure as the framework at each station, the stable and quick production of the transmission film, the film pasting and the labeling is achieved.
Description
Technical Field
The utility model relates to a LED wafer technical field specifically is a full-automatic pad pasting of LED wafer pastes mark equipment.
Background
The chip is one of the main raw materials of LED, the luminous component of LED, the most core part of LED, the quality of chip will determine the performance of LED directly, when LED encapsulates, the chip is neatly arranged on the wafer membrane, in the production process of crystalline grain, it is comparatively important step to carry out the pad pasting to the chip, play the effect of protection wafer, at present, the protection film that is applied to the wafer back that supplies in the market all does not super clean surface protection film, this protection film has soft or hard moderate, reduce the fragment and take place, advantages such as good thickness homogeneity, divide the membrane into three types according to the specific nature of protection film: blue membrane, ultraviolet membrane and pyrocondensation membrane, the artifical pad pasting is adopted to traditional pad pasting mode, but artifical pad pasting has following problem: the time and the labor are consumed, the transmission efficiency needs to be improved, and the labor cost is greatly increased; the film wrinkles exist on the wafer due to the fact that the protective film cannot be adhered flatly during manual film pasting, and the yield of the wafer is reduced, so that people urgently need a full-automatic film pasting and labeling device for LED wafers to solve the problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a full-automatic film sticking and labeling device for LED wafers, which aims to solve the problems that the manual film sticking and the labor consumption are caused by time consumption in the background technology, the transmission efficiency is to be improved, and the labor cost is greatly increased; the problem that the protective film cannot be flatly adhered during manual film pasting, so that the film wrinkles exist on the wafer, and the yield of the wafer is reduced.
In order to solve the technical problem, the utility model provides a following technical scheme: the full-automatic film sticking and labeling equipment for the LED wafer comprises a box body, wherein an adsorption device, a transmission device, a film sticking device and a labeling device are sequentially arranged in the box body from one side to the other side, the transmission device is arranged between the adsorption device and the film sticking device in a reciprocating mode, an objective table is arranged below the adsorption device, the adsorption device comprises a first adsorption plate and a first lifting cylinder, and the first adsorption plate is fixedly connected with the top of the box body through the first lifting cylinder;
the wafer of waiting the pad pasting is placed on the objective table, make first adsorption plate descend through first lift cylinder and adsorb the wafer to first adsorption plate bottom, then make first adsorption plate rise through first lift cylinder, convey the wafer to the pad pasting device through transmission device this moment, carry out the pad pasting to the wafer on the pad pasting device, utilize the mark device to paste the mark on the membrane of wafer after the pad pasting is accomplished, automatic transmission between all processes can improve pad pasting efficiency effectively.
Further, the transmission device comprises a transmission frame, a transmission plate, a sliding groove and a second lifting cylinder, the sliding groove is fixedly connected with the top of the box body, one end of the transmission frame is fixedly connected with the sliding groove, the other end of the transmission frame is fixedly connected with the transmission plate through the second lifting cylinder, and the transmission plate moves back and forth between the film sticking device and the first adsorption plate through the sliding groove;
when the transmission frame moves to one side of the adsorption device, the first adsorption plate and the transmission plate are overlapped up and down, the transmission plate is attached to the first adsorption plate through the second lifting cylinder, the wafer moves to the transmission plate from the first adsorption plate at the moment, the transmission of crystal grains is realized, the wafer can be protected, the damage of the wafer is avoided, the transmission frame and the transmission plate can move back and forth between the film sticking device and the adsorption device through the sliding groove, and the efficient transmission of the wafer can be carried out.
Further, the film sticking device comprises a blade, a second adsorption plate and a third lifting cylinder, the second adsorption plate is fixedly connected with the top of the box body through the third lifting cylinder, and a film sticking table is arranged below the second adsorption plate; one side of the film sticking table is provided with a manipulator, and the other side of the film sticking table is provided with a film carrying table; one side of the film carrying platform is provided with a film rolling frame;
roll up the membrane frame and roll up there being the membrane, the one end of membrane is placed in the carrier film bench, the carrier film bench is used for preventing the fracture in the middle of the membrane, utilize the manipulator to press from both sides the membrane on the carrier film bench and get to the pad pasting bench, can cut the membrane through the blade between carrier film bench and the pad pasting bench and open, the pad pasting bench is an independent membrane this moment, it moves on the spout through the transmission frame to be located the wafer on the transmission board, convey the wafer to the second adsorption plate, the adsorption plate carries out the wafer pad pasting through the adsorption plate and the laminating of third lift cylinder decline.
Further, one side of the film sticking table is in fit connection with the film carrying table through a blade, one end of the film carrying table is provided with a cylinder, and the cylinder is fixedly connected with the bottom of the blade;
the blade is located between pad pasting platform and the year membrane platform, can make the blade carry out the linear motion that makes a round trip in the laminating department of pad pasting platform and year membrane platform through the cylinder, can cut the membrane, the wafer pad pasting of being convenient for.
Further, the labeling device comprises a mechanical arm, one end of the mechanical arm is fixedly connected with the bottom of the box body, and the other end of the mechanical arm is fixedly connected with the third adsorption plate;
the third adsorption plate is adsorbed with a label, the label is attached to the wafer film through the movement of the mechanical arm, the mechanical arm principle is simple, the structure is simple, and the wafer film is attached through the attaching device after the film attaching is completed.
Furthermore, a plurality of adsorption air holes are formed in the bottoms of the first adsorption plate, the second adsorption plate and the third adsorption plate, and the tops of the first adsorption plate, the second adsorption plate and the third adsorption plate are fixedly connected with a vacuum pump through air pipes;
utilize the absorption gas pocket to adsorb the wafer, can control through the controller between trachea and the vacuum pump for the absorption gas pocket can adsorb or not adsorb wantonly, and the absorption gas pocket has avoided the wafer breakage to appear.
Compared with the prior art, the utility model discloses the beneficial effect who reaches is:
1. this pad pasting equipment's streamlined automatic operation can reduce the cost of labor in a large number, can avoid the wafer to appear damaged in transmission course effectively, the yield that leads to the wafer pad pasting is not high, through adsorption plate with the wafer, transmit to fixing device, replace the fixed mode of traditional wafer, the adsorption gas pocket can not lead to the fact the damage to the wafer when adsorbing the wafer, simultaneously, the membrane fold can not appear, the problem that the pad pasting is uneven, and, the adsorption gas pocket simple structure, the principle is simple, can fix and transmit the wafer high-efficiently.
2. The film sticking and labeling are integrated, the full-automatic film sticking and labeling equipment distinguishes each processing station on the hardware, and the work division procedure is used as the framework at each station, so that the stable and quick production of the transmission film, the film sticking and the labeling is achieved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a side view of the case of the present invention;
fig. 2 is a side view of the transfer device of the present invention;
FIG. 3 is a schematic structural view of a first adsorption plate of the present invention;
fig. 4 is a schematic structural view of the blade of the present invention;
FIG. 5 is a schematic structural view of the film sticking device of the present invention;
in the figure: 1. a box body; 2. an adsorption device; 3. a transmission device; 4. a film pasting device; 5. a labeling device; 6. an object stage; 7. a first adsorption plate; 8. a second adsorption plate; 9. a third adsorption plate; 10. a first lifting cylinder; 11. a second lifting cylinder; 12. a third lifting cylinder; 13. a cylinder; 14. a transmission rack; 15. a transmission plate; 16. a chute; 17. a blade; 18. a manipulator; 19. a film carrying platform; 20. a film rolling frame; 21. a film pasting table; 22. a mechanical arm; 23. adsorbing the air holes; 24. an air tube; 25. a vacuum pump.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b): referring to fig. 1-5, the present invention provides a technical solution: the full-automatic film sticking and labeling equipment for the LED wafers comprises a box body 1, wherein an adsorption device 2, a transmission device 3, a film sticking device 4 and a labeling device 5 are sequentially arranged in the box body 1 from one side to the other side, the transmission device 3 moves back and forth between the adsorption device 2 and the film sticking device 4, an objective table 6 is arranged below the adsorption device 2, the objective table 6 is used for placing wafers to be subjected to film sticking, the adsorption device 2 comprises a first adsorption plate 7 and a first lifting cylinder 10, the first adsorption plate 7 is fixedly connected with the top of the box body 1 through the first lifting cylinder 10, the first lifting cylinder 10 is used for driving the first adsorption plate 7 to descend to the surface of the objective table 6 to suck the wafers finely, after the wafers are attached to the first adsorption plate 7, the first lifting cylinder 10 drives the first adsorption plate 7 to ascend, the transmission device 3 is used for transmitting the wafers to be subjected to film sticking from the adsorption device 2 to the film sticking device 4, and the film sticking device 4 is used for film sticking, the labeling device 5 is used for labeling;
the transmission device 3 comprises a transmission frame 14, a transmission plate 15, a sliding groove 16 and a second lifting cylinder 11, the sliding groove 16 is fixedly connected with the top of the box body 1, the sliding groove 16 can enable the transmission frame 14 to move, the second lifting cylinder 11 is used for driving the transmission plate 15 to move up and down, one end of the transmission frame 14 is fixedly connected with the sliding groove 16, the other end of the transmission frame 14 is fixedly connected with the transmission plate 15 through the second lifting cylinder 11, the transmission plate 15 moves back and forth between the film sticking device 4 and the first adsorption plate 7 through the transmission frame 14 and the sliding groove 16, and the transmission plate 15 is used for receiving the wafers adsorbed on the first adsorption plate 7;
the film sticking device 4 comprises a blade 17, a second adsorption plate 8 and a third lifting cylinder 12, the second adsorption plate 8 is fixedly connected with the top of the box body 1 through the third lifting cylinder 12, and a film sticking table 21 is arranged right below the second adsorption plate 8; one side of the film sticking table 21 is provided with a manipulator 18, and the other side is provided with a film carrying table 19; a film rolling frame 20 is arranged on one side of the film carrying table 19, the second adsorption plate 8 is used for adsorbing the wafer transmitted by the transmission plate 15, the third lifting cylinder 12 is used for driving the second adsorption plate 8 to descend to the surface of the film sticking table 21, one end of the film is placed on the film carrying table 19, the film rolling frame 20 is used for rolling and stretching the film, and the manipulator 18 is used for clamping the film on the film carrying table 19 to the film sticking table;
one side of the film sticking table 21 is attached and connected with the film carrying table 19 through the blade 17, one end of the film carrying table 19 is provided with the cylinder 13, the cylinder 13 is fixedly connected with the bottom of the blade 17, the cylinder 13 is used for driving the blade 17 to do reciprocating linear motion between the positions of the film sticking table 21 and the film carrying table 19 at the attaching side, and the blade 17 is used for cutting a film;
the labeling device 5 comprises a mechanical arm 22, one end of the mechanical arm 22 is fixedly connected with the bottom of the box body 1, the other end of the mechanical arm 22 is fixedly connected with a third adsorption plate 9, and the third adsorption plate is used for adsorbing a label to be labeled;
the bottoms of the first adsorption plate 7, the second adsorption plate 8 and the third adsorption plate 9 are all provided with a plurality of adsorption air holes 23, the adsorption air holes 23 play a role of air suction and are used for adsorbing wafers, the tops of the first adsorption plate 7, the second adsorption plate 8 and the third adsorption plate 9 are all fixedly connected with a vacuum pump 25 through an air pipe 24, the vacuum pump 25 is controlled through a controller, the air pipe 24 is used for air suction, the free adsorption function of the adsorption air holes 23 can be realized, and the controller controls the vacuum pump 25 to enable the first adsorption plate 7 to realize the adsorption and desorption functions in the prior art and is disclosed, so the description is omitted;
the utility model discloses a theory of operation: the controller controls the vacuum pump 25 to suck air through the air pipe 24, so that the adsorption air hole 23 achieves the adsorption effect;
firstly, a wafer to be filmed is placed on an object stage 6, a first lifting cylinder 10 enables a first adsorption plate 7 to descend, the wafer is adsorbed to the bottom of the first adsorption plate 7, then the first adsorption plate 7 is enabled to ascend through a first lifting cylinder 11, a transmission frame 14 moves to one side of the first adsorption plate 7 through a sliding groove 16 at the moment, a transmission plate 15 is located below the first adsorption plate 7, the first adsorption plate and the transmission plate 15 are overlapped up and down, the transmission plate 15 ascends through a second lifting cylinder 11 and is attached to the first adsorption plate 7, and the wafer is moved to the transmission plate 15 from the first adsorption plate 7 at the moment;
then the wafer is moved to one side of the film sticking device 4 on the sliding chute 16 through the transmission plate 15, the transmission plate 15 is positioned below the second adsorption plate 8 at the moment, the transmission plate 15 is lifted through the second lifting cylinder 11 to be adhered to the second adsorption plate 8, the wafer is moved to the second adsorption plate 8 from the transmission plate 15 at the moment, and then the transmission device 3 reciprocates to carry out transmission of the next wafer;
utilize manipulator 18 to press from both sides the membrane on the membrane platform 19 and get to pad pasting platform 21, cylinder 13 drives blade 17 and cuts out a membrane, and there is an independent membrane on the pad pasting platform 21, and third lift cylinder 12 drives second adsorption plate 8 and descends to pad pasting platform 21 at this moment and carries out the pad pasting with the membrane laminating, and arm 22 removes to utilize third adsorption plate 9 to absorb the label, pastes it to the good membrane of wafer subsides afterwards.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a full-automatic pad pasting of LED wafer pastes mark equipment which characterized in that: the labeling device comprises a box body (1), wherein an adsorption device (2), a transmission device (3), a film sticking device (4) and a labeling device (5) are sequentially arranged in the box body (1) from one side to the other side, the transmission device (3) makes a round trip between the adsorption device (2) and the film sticking device (4), an objective table (6) is arranged below the adsorption device (2), the adsorption device (2) comprises a first adsorption plate (7) and a first lifting cylinder (10), and the first adsorption plate (7) is fixedly connected with the top of the box body (1) through the first lifting cylinder (10);
the conveying device (3) comprises a conveying frame (14), a conveying plate (15), a sliding groove (16) and a second lifting cylinder (11), the sliding groove (16) is fixedly connected with the top of the box body (1), the other end of the conveying frame (14) is fixedly connected with the conveying plate (15) through the second lifting cylinder (11), and the conveying plate (15) makes a round trip between the film sticking device (4) and the first adsorption plate (7) through the conveying frame (14) and the sliding groove (16).
2. The full-automatic LED wafer film-sticking and labeling equipment as claimed in claim 1, wherein: the film sticking device (4) comprises a blade (17), a second adsorption plate (8) and a third lifting cylinder (12), the second adsorption plate (8) is fixedly connected with the top of the box body (1) through the third lifting cylinder (12), and a film sticking table (21) is arranged under the second adsorption plate (8); a manipulator (18) is arranged on one side of the film sticking table (21), and a film carrying table (19) is arranged on the other side of the film sticking table; and a film rolling frame (20) is arranged on one side of the film carrying platform (19).
3. The full-automatic LED wafer film-sticking and labeling equipment as claimed in claim 2, wherein: pad pasting platform (21) one side is passed through blade (17) and is connected with the laminating of year membrane platform (19), it is equipped with cylinder (13) to carry membrane platform (19) one end, cylinder (13) and blade (17) bottom fixed connection.
4. The full-automatic LED wafer film-sticking and labeling equipment as claimed in claim 2, wherein: labeling device (5) include arm (22), arm (22) one end and box (1) bottom fixed connection, arm (22) other end and third adsorption plate (9) fixed connection.
5. The full-automatic LED wafer film and label sticking device according to claim 4, characterized in that: the bottom of each of the first adsorption plate (7), the second adsorption plate (8) and the third adsorption plate (9) is provided with a plurality of adsorption air holes (23), and the tops of the first adsorption plate (7), the second adsorption plate (8) and the third adsorption plate (9) are fixedly connected with a vacuum pump (25) through air pipes (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022455509.9U CN214239646U (en) | 2020-10-29 | 2020-10-29 | Full-automatic pad pasting of LED wafer pastes mark equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022455509.9U CN214239646U (en) | 2020-10-29 | 2020-10-29 | Full-automatic pad pasting of LED wafer pastes mark equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214239646U true CN214239646U (en) | 2021-09-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022455509.9U Expired - Fee Related CN214239646U (en) | 2020-10-29 | 2020-10-29 | Full-automatic pad pasting of LED wafer pastes mark equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214239646U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113954491A (en) * | 2021-09-24 | 2022-01-21 | 珠海市科弥光电有限公司 | Composite film laminating mechanism |
| CN116573262A (en) * | 2023-07-13 | 2023-08-11 | 常州集励微电子科技有限公司 | PCB conveying device and conveying method for LED module |
-
2020
- 2020-10-29 CN CN202022455509.9U patent/CN214239646U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113954491A (en) * | 2021-09-24 | 2022-01-21 | 珠海市科弥光电有限公司 | Composite film laminating mechanism |
| CN116573262A (en) * | 2023-07-13 | 2023-08-11 | 常州集励微电子科技有限公司 | PCB conveying device and conveying method for LED module |
| CN116573262B (en) * | 2023-07-13 | 2023-09-05 | 常州集励微电子科技有限公司 | PCB conveying device and conveying method for LED module |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210921 |