CN110650613A - Heat dissipation regulation and control method and device for electric cabinet and air conditioning unit - Google Patents
Heat dissipation regulation and control method and device for electric cabinet and air conditioning unit Download PDFInfo
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- CN110650613A CN110650613A CN201910849597.XA CN201910849597A CN110650613A CN 110650613 A CN110650613 A CN 110650613A CN 201910849597 A CN201910849597 A CN 201910849597A CN 110650613 A CN110650613 A CN 110650613A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004378 air conditioning Methods 0.000 title claims abstract description 13
- 230000033228 biological regulation Effects 0.000 title claims description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 51
- 238000005057 refrigeration Methods 0.000 claims abstract description 26
- 230000001105 regulatory effect Effects 0.000 claims abstract description 5
- 230000009467 reduction Effects 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 6
- 238000004590 computer program Methods 0.000 claims description 2
- 230000003750 conditioning effect Effects 0.000 claims 1
- 238000004134 energy conservation Methods 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 230000001276 controlling effect Effects 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 7
- 230000004044 response Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000011897 real-time detection Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a method and a device for regulating and controlling heat dissipation of an electric cabinet and an air conditioning unit. Wherein, the method comprises the following steps: detecting the temperature in the electric control box; when the temperature is between a preset maximum temperature and a preset minimum temperature, triggering a semiconductor refrigerating sheet to refrigerate so as to realize heat dissipation of the electric cabinet; and further adjusting the semiconductor refrigeration piece according to the temperature drop rate in the electric control box. According to the invention, the temperature in the electric control box is intelligently and dynamically detected, the semiconductor refrigerating capacity is dynamically controlled, the unit energy consumption is reduced while the reliability of electric elements is ensured, the reliability is high, the energy conservation is strong, and the engineering adaptability is stronger.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to a heat dissipation regulation and control method and device for an electric cabinet and an air conditioning unit.
Background
With the continuous development of industrial technology, people have higher and higher requirements on air conditioning units. The protection level requirement of the electric cabinet of the air conditioning unit is higher and higher, the sealing performance of the electric cabinet is better and better, and the heat dissipation of the electric cabinet becomes a primary problem. If the heating value of the components in the electric control box can not be timely reduced below a limit value, the electric components can lose efficacy due to high temperature, and the operation stability and reliability of the air conditioning unit are reduced.
Therefore, how to effectively reduce the temperature in the electric control box and further ensure the stable operation of the whole machine is a problem to be solved urgently by the personnel in the technical field.
Aiming at the problem of how to intelligently regulate and control the heat dissipation of the electric cabinet in the prior art, an effective solution is not provided at present.
Disclosure of Invention
The embodiment of the invention provides a heat dissipation regulation and control method and device of an electric cabinet and an air conditioning unit, and aims to solve the problem of how to intelligently regulate and control heat dissipation of the electric cabinet in the prior art.
In order to solve the technical problem, the invention provides a heat dissipation regulation and control method of an electric cabinet, wherein the method comprises the following steps: detecting the temperature in the electric control box; when the temperature is between a preset maximum temperature and a preset minimum temperature, triggering a semiconductor refrigerating sheet to refrigerate so as to realize heat dissipation of the electric cabinet; and further adjusting the semiconductor refrigeration piece according to the temperature drop rate in the electric control box.
Further, according to the temperature drop rate adjustment in the automatically controlled case semiconductor refrigeration piece, include: comparing the temperature reduction rate with a preset rate; if the temperature drop rate is larger than the preset rate, closing the refrigerating sheets with the number of the refrigerating sheets in the preset proportion in the semiconductor refrigerating sheets; and if the temperature reduction rate is not greater than the preset rate, keeping the number of the semiconductor refrigerating pieces unchanged.
Further, the preset proportion is calculated by the following formula: the predetermined ratio is 1-delta T0/△T。
Further, after detecting the temperature in the electric control box, the method further comprises: when the temperature exceeds the preset maximum temperature, triggering the electric cabinet to protect shutdown; and triggering a refrigerating program for closing the semiconductor refrigerating sheet when the temperature is lower than the preset minimum temperature.
The invention also provides a heat dissipation regulation and control device of the electric cabinet, wherein the device comprises: the temperature sensor is arranged in the electric control box and used for detecting the temperature in the electric control box; and the refrigeration regulation and control module is used for triggering the semiconductor refrigeration piece to refrigerate when the temperature is between the preset maximum temperature and the preset minimum temperature, and further regulating the semiconductor refrigeration piece according to the temperature drop rate in the electric control box.
Further, the refrigeration regulation module comprises: the comparison unit is used for comparing the temperature reduction rate with a preset rate; the first processing unit is used for closing the refrigerating pieces with the quantity of the preset proportion in the semiconductor refrigerating pieces when the temperature reduction rate is larger than the preset rate; and the second processing unit is used for keeping the number of the semiconductor refrigerating pieces unchanged when the temperature reduction rate is less than or equal to the preset rate.
Further, the preset proportion is calculated by the following formula: the predetermined ratio is 1-delta T0/△T。
Further, the apparatus further comprises: the protection module is used for triggering the electric control box to shut down in a protection mode when the temperature in the electric control box exceeds the preset maximum temperature; and when the temperature in the electric control box is lower than the preset lowest temperature, triggering a refrigeration program for closing the semiconductor refrigeration sheet.
The invention provides an air conditioning unit which comprises an electric cabinet, wherein the electric cabinet comprises the heat dissipation regulation and control device of the electric cabinet.
The invention also provides a computer-readable storage medium, on which a computer program is stored, characterized in that the program realizes the above-mentioned method when executed by a processor.
By applying the technical scheme of the invention, the temperature in the electric control box is intelligently and dynamically detected, the refrigerating capacity of the semiconductor is dynamically controlled, the reliability of electric elements is ensured, the energy consumption of a unit is reduced, the reliability is high, the energy conservation is strong, and the engineering adaptability is stronger.
Drawings
Fig. 1 is a flowchart of a method for regulating and controlling heat dissipation of an electric cabinet according to an embodiment of the present invention;
FIG. 2 is a temperature detection control flow chart of a totally-enclosed electric cabinet according to an embodiment of the invention;
fig. 3 is a block diagram of a heat dissipation control device of an electric cabinet according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and "a plurality" typically includes at least two.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The words "if", as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in the article or device in which the element is included.
Alternative embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Example 1
Fig. 1 is a flowchart of a method for regulating and controlling heat dissipation of an electric cabinet according to an embodiment of the present invention, as shown in fig. 1, the method includes the following steps:
step S101, detecting the temperature in the electric control box;
step S102, when the temperature is between a preset maximum temperature and a preset minimum temperature, triggering a semiconductor refrigeration sheet to refrigerate so as to realize heat dissipation of an electric cabinet; and further adjusting the semiconductor refrigerating sheet according to the temperature drop rate in the electric control box.
The temperature in the automatically controlled case is detected through intelligence developments to this embodiment, and then dynamic control semiconductor refrigerating output, when guaranteeing electrical components reliability, reduces the unit energy consumption, and the reliability is high, and energy-conservation nature is strong, and engineering adaptability is stronger.
It should be noted that, the electric cabinet mentioned in this embodiment includes a heat dissipation assembly, and the heat dissipation assembly includes: the semiconductor refrigerating sheet comprises a refrigerating surface and a radiating surface; the cold dissipation structure is arranged on the refrigerating surface and used for dissipating cold; and the heat dissipation structure is arranged on the heat dissipation surface and used for dissipating heat. The electric cabinet includes the casing, and the semiconductor refrigeration piece is installed on the casing, and above-mentioned cold structure that looses is located the inside of casing, and heat radiation structure is located the outside of casing.
In the embodiment, the temperature is detected in real time according to a temperature sensor in the electric control box, and when the temperature exceeds a preset maximum temperature, the electric control box is triggered to be shut down in a protection manner; and triggering to close the refrigerating program of the semiconductor refrigerating sheet when the temperature is lower than the preset minimum temperature. Namely, the electronic control box is shut down and protected in time when the temperature is abnormally high, and the heat dissipation is stopped when the temperature is abnormally low. Therefore, the electric control box is comprehensively protected and safely monitored.
And if the temperature in the electric cabinet is between the preset maximum temperature and the preset minimum temperature, triggering the semiconductor refrigerating sheet to refrigerate so as to realize the heat dissipation of the electric cabinet. And then, further monitoring the temperature drop rate in the electric control box so as to adjust the semiconductor refrigeration piece. The rate of temperature drop is the degree of temperature decrease per unit time.
Specifically, comparing the temperature drop rate with a preset rate; if the temperature drop rate is larger than the preset rate, closing the refrigerating sheets with the number of the preset proportion in the semiconductor refrigerating sheets; if the temperature drop rate is less than or equal to the preset rate, the number of the semiconductor refrigerating pieces is kept unchanged. The preset proportion is calculated by the following formula: the predetermined ratio is 1-delta T0/. DELTA.T. If the number of the preset ratio is not an integer, then rounding down may be performed. For example, if the calculated preset ratio is 1/3, the number of the preset ratios is (1/3) × 10 ═ 3.333. For this case, a round may be rounded down to 4. Based on this, can be in real time according to the temperature variation condition of electric cabinet, adjust the refrigerating output of semiconductor refrigeration piece, and then control the heat dissipation situation of electric cabinet, avoid the wasting of resources when keeping effectively radiating, avoid the electric cabinet temperature unusual.
The invention provides a heat dissipation method of an electric cabinet of an air conditioning unit, which is based on the physical principle of the Peltier effect and utilizes semiconductor refrigeration to cool the electric cabinet. The electric cabinet is designed in a totally-enclosed manner, so that the dustproof and moistureproof capacity of the electric cabinet is improved, the temperature in the electric cabinet is reduced, the influence of the environment on internal electric elements is greatly reduced, the service life of the electric elements is prolonged, and the operation stability and reliability of the unit are ensured.
Example 2
Fig. 2 is a temperature detection control flow chart of a totally-enclosed electric cabinet according to an embodiment of the invention, and as shown in fig. 2, the specific control concept is as follows:
an electric cabinet temperature sensor is arranged in the electric cabinet, the temperature in the electric cabinet is detected in real time, and then the data for opening the semiconductor refrigeration sheet is controlled, so that energy conservation and emission reduction are realized while the reliability of the electric cabinet is ensured:
1. detecting the temperature in the electric control box in real time, and detecting the temperature T in the electric control boxExtreme limit≥T≥T0And when the semiconductor refrigeration program is started, the semiconductor refrigeration and heat dissipation are carried out:
detecting the temperature drop rate in the electric control box, wherein the temperature drop rate in the electric control box is more than delta T0Rounding off downwards (1-DeltaT)0V Δ T) these number of semiconductor chilling plates;
detecting the temperature drop rate in the electric control box, wherein when the temperature drop rate in the electric control box is less than or equal to delta T0The number of the semiconductor refrigerating pieces is kept unchanged.
2. Detecting the temperature in the electric control box in real time, wherein when the temperature T in the electric control box is more than TExtreme limitAnd when the machine set is stopped, the machine set is protected.
3. Detecting the temperature in the electric control box in real time, wherein when the temperature T in the electric control box is less than T0And when the temperature is higher than the preset temperature, closing the semiconductor refrigeration program.
It should be noted that, in the present embodiment, for the real-time detection of the temperature in the oven and the real-time detection of the temperature drop rate, the detection may be adjusted to be periodic detection or periodic detection according to actual requirements. T in this embodiment represents the in-box temperature of the electric cabinet, TExtreme limitRepresents the maximum temperature, T, that can be sustained in the electric cabinet0The lowest set temperature in the electric control box is shown, the temperature drop rate in the electric control box is shown by delta T, and the delta T0Indicating the rate of temperature drop set in the electronic control box.
The invention improves the dustproof and moistureproof capacity of the electric control box of the unit, ensures the temperature in the electric control box to be within the reliability range, prolongs the service life of electric components and ensures the operation stability and reliability of the unit.
Example 3
Corresponding to the heat dissipation regulation and control method of the electric cabinet introduced in fig. 1, this embodiment provides a heat dissipation regulation and control device of an electric cabinet, as shown in a block diagram of a structure of the heat dissipation regulation and control device of the electric cabinet in fig. 3, the device includes:
the temperature sensor 10 is arranged in the electric control box and used for detecting the temperature in the electric control box;
and the refrigeration regulation and control module 20 is used for triggering the semiconductor refrigeration piece to refrigerate when the temperature is between the preset maximum temperature and the preset minimum temperature, and further adjusting the semiconductor refrigeration piece according to the temperature drop rate in the electric control box.
The temperature in the automatically controlled case is detected through intelligence developments to this embodiment, and then dynamic control semiconductor refrigerating output, when guaranteeing electrical components reliability, reduces the unit energy consumption, and the reliability is high, and energy-conservation nature is strong, and engineering adaptability is stronger.
In order to monitor the temperature change condition of the electric cabinet in real time, the refrigerating capacity of the semiconductor refrigerating sheet is adjusted, and then the heat dissipation condition of the electric cabinet is controlled. Above-mentioned refrigeration regulation and control module includes: the comparison unit is used for comparing the temperature reduction rate with a preset rate; the first processing unit is used for closing the refrigerating pieces with the quantity of the preset proportion in the semiconductor refrigerating pieces when the temperature reduction rate is larger than the preset rate; and the second processing unit is used for keeping the number of the semiconductor refrigerating pieces unchanged when the temperature reduction rate is less than or equal to the preset rate. The preset proportion is calculated by the following formula: the predetermined ratio is 1-delta T0/. DELTA.T. Therefore, the effective heat dissipation of the electric cabinet is kept, the resource waste is avoided, and the temperature abnormity of the electric cabinet is avoided.
The above-mentioned device still includes: the protection module is used for triggering the electric control box to protect the electric control box to stop when the temperature in the electric control box exceeds a preset maximum temperature; and when the temperature in the electric control box is lower than the preset minimum temperature, triggering a refrigeration program for closing the semiconductor refrigeration sheet. Namely, the electronic control box is shut down and protected in time when the temperature is abnormally high, and the heat dissipation is stopped when the temperature is abnormally low. Therefore, the electric control box is comprehensively protected and safely monitored.
This embodiment still provides an air conditioning unit, including the electric cabinet, this electric cabinet includes the heat dissipation regulation and control device of the electric cabinet of above-mentioned introduction.
The air conditioning unit can execute the method provided by the embodiment of the invention, and has the corresponding functional modules and beneficial effects of the execution method. For technical details that are not described in detail in this embodiment, reference may be made to the method provided by the embodiment of the present invention.
Example 4
The embodiment of the present invention provides software for implementing the technical solutions described in the above embodiments and preferred embodiments.
The embodiment of the invention provides a nonvolatile computer storage medium, wherein a computer executable instruction is stored in the computer storage medium and can execute a heat dissipation regulation and control method of an electric cabinet in any method embodiment.
The storage medium stores the software, and the storage medium includes but is not limited to: optical disks, floppy disks, hard disks, erasable memory, etc.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A heat dissipation regulation and control method of an electric cabinet is characterized by comprising the following steps:
detecting the temperature in the electric control box;
when the temperature is between a preset maximum temperature and a preset minimum temperature, triggering a semiconductor refrigerating sheet to refrigerate so as to realize heat dissipation of the electric cabinet; and further adjusting the semiconductor refrigeration piece according to the temperature drop rate in the electric control box.
2. The method of claim 1, wherein adjusting the semiconductor chilling plate further according to a rate of temperature drop in the electrical cabinet comprises:
comparing the temperature reduction rate with a preset rate;
if the temperature drop rate is larger than the preset rate, closing the refrigerating sheets with the number of the refrigerating sheets in the preset proportion in the semiconductor refrigerating sheets;
and if the temperature reduction rate is not greater than the preset rate, keeping the number of the semiconductor refrigerating pieces unchanged.
3. The method according to claim 2, wherein the preset ratio is calculated by the following formula: the predetermined ratio is 1-delta T0/△T。
4. The method of claim 1, wherein after detecting the temperature in the electrical cabinet, the method further comprises:
when the temperature exceeds the preset maximum temperature, triggering the electric cabinet to protect shutdown;
and triggering a refrigerating program for closing the semiconductor refrigerating sheet when the temperature is lower than the preset minimum temperature.
5. A heat dissipation regulation and control device of electric cabinet, its characterized in that, the device includes:
the temperature sensor is arranged in the electric control box and used for detecting the temperature in the electric control box;
and the refrigeration regulation and control module is used for triggering the semiconductor refrigeration piece to refrigerate when the temperature is between the preset maximum temperature and the preset minimum temperature, and further regulating the semiconductor refrigeration piece according to the temperature drop rate in the electric control box.
6. The apparatus of claim 5, wherein the refrigeration conditioning module comprises:
the comparison unit is used for comparing the temperature reduction rate with a preset rate;
the first processing unit is used for closing the refrigerating pieces with the quantity of the preset proportion in the semiconductor refrigerating pieces when the temperature reduction rate is larger than the preset rate;
and the second processing unit is used for keeping the number of the semiconductor refrigerating pieces unchanged when the temperature reduction rate is less than or equal to the preset rate.
7. The apparatus of claim 6, wherein the predetermined ratio is calculated by the following formula: the predetermined ratio is 1-delta T0/△T。
8. The apparatus of claim 5, further comprising:
the protection module is used for triggering the electric control box to shut down in a protection mode when the temperature in the electric control box exceeds the preset maximum temperature; and when the temperature in the electric control box is lower than the preset lowest temperature, triggering a refrigeration program for closing the semiconductor refrigeration sheet.
9. An air conditioning unit comprising an electric cabinet, characterized in that the electric cabinet comprises a heat dissipation regulation and control device of the electric cabinet of any one of claims 5 to 8.
10. A computer-readable storage medium, on which a computer program is stored, which program, when being executed by a processor, carries out the method according to any one of claims 1 to 4.
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CN201910849597.XA CN110650613A (en) | 2019-09-09 | 2019-09-09 | Heat dissipation regulation and control method and device for electric cabinet and air conditioning unit |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113865054A (en) * | 2021-10-09 | 2021-12-31 | 广东美的制冷设备有限公司 | Heat dissipation control method and device of air conditioner and air conditioner |
CN114294856A (en) * | 2021-12-13 | 2022-04-08 | 迈克医疗电子有限公司 | Method, device, medium, equipment and instrument for improving Peltier refrigeration efficiency |
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CN105365523A (en) * | 2015-12-09 | 2016-03-02 | 刘景平 | Electric automobile energy-saving air-conditioner based on semiconductor refrigeration and control method thereof |
US20160219755A1 (en) * | 2015-01-23 | 2016-07-28 | Tai-Sol Electronics Co., Ltd. | Thermoelectric-cooling-chip-based heat-disspating system |
CN109357328A (en) * | 2018-10-17 | 2019-02-19 | 宁波奥克斯电气股份有限公司 | A kind of electric-controlled plate controller for heat sink and method and air conditioner |
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CN103957679A (en) * | 2014-03-27 | 2014-07-30 | 美的集团股份有限公司 | Electric control box, heat radiation system applied to electric control box and control method thereof |
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CN105365523A (en) * | 2015-12-09 | 2016-03-02 | 刘景平 | Electric automobile energy-saving air-conditioner based on semiconductor refrigeration and control method thereof |
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CN113865054A (en) * | 2021-10-09 | 2021-12-31 | 广东美的制冷设备有限公司 | Heat dissipation control method and device of air conditioner and air conditioner |
CN114294856A (en) * | 2021-12-13 | 2022-04-08 | 迈克医疗电子有限公司 | Method, device, medium, equipment and instrument for improving Peltier refrigeration efficiency |
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