CN113745202A

CN113745202A - Packaging module, manufacturing method thereof and electronic equipment

Info

Publication number: CN113745202A
Application number: CN202110626262.9A
Authority: CN
Inventors: 郭学平
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-06-04
Filing date: 2021-06-04
Publication date: 2021-12-03
Also published as: WO2022252888A1

Abstract

The application provides a packaging module, a manufacturing method thereof and electronic equipment. The packaging module adopts a double-sided packaging technology, different devices in the module are packaged on two sides of a packaging substrate respectively, and grooves can be dug on the FPC to form through grooves. When the FPC (namely a soft board) is interconnected with the packaging substrate (namely a hard board), a device close to one side of the FPC is placed in the through groove of the FPC, so that the integration level of the packaging module is improved. In addition, after the grooves are dug in the FPC, welding pads can be arranged around the through grooves in the FPC, so that the quantity of the interconnection pins of the FPC and the packaging substrate is increased, the application of a high-density interconnection scene is met, and the overall performance of the packaging module is improved.

Description

Packaging module, manufacturing method thereof and electronic equipment

Technical Field

The present disclosure relates to the field of chip packaging technologies, and in particular, to a package module, a manufacturing method thereof, and an electronic device.

Background

With the development of the miniaturization requirement of the terminal device, the internal space of the terminal device may have small and irregular features, and a Flexible Printed Circuit (FPC) is generally used to implement signal interconnection. In chip packaging, signal transmission in a chip/device module can be realized by adopting interconnection between a flexible board (such as a flexible printed circuit board (FPC)) and a hard board (such as a packaging substrate).

With the development of System In Package (SiP) technology, double-sided packaging technology is generally adopted. At present, due to the limitation of the interconnection structure of the soft board and the hard board, in a double-sided packaging scene, the thickness of the double-sided packaging module adopting the interconnection of the soft board and the hard board is generally thicker, which is not beneficial to the miniaturization of terminal equipment.

Disclosure of Invention

The embodiment of the application provides a packaging module, a manufacturing method thereof and electronic equipment, and in a scene of chip packaging by using a double-sided packaging technology, the thickness of the packaging module adopting a soft board and hard board interconnection technology can be reduced, and the application scene and performance of the packaging module are improved.

In a first aspect, the present application provides a package module. The package module includes: the packaging substrate, the first device, the second device and the flexible printed circuit board FPC. Wherein the first device is packaged on the first side of the package substrate. The second device is packaged on the second side of the package substrate. The first surface of the FPC is welded with the second surface of the packaging substrate, a through groove is formed in the position, corresponding to the second device, of the FPC, and the second device is located in the through groove of the FPC.

Based on the packaging module, the packaging module adopts a double-sided packaging technology to respectively package different devices in the module on two sides of the packaging substrate, and grooves can be dug on the FPC to form through grooves. When the FPC (namely a soft board) is interconnected with the packaging substrate (namely a hard board), a device close to one side of the FPC is placed in the through groove of the FPC, so that the integration level of the packaging module is improved. In addition, after the grooves are dug in the FPC, welding pads can be arranged around the through grooves in the FPC, so that the quantity of the interconnection pins of the FPC and the packaging substrate is increased, the application of a high-density interconnection scene is met, and the overall performance of the packaging module is improved.

With reference to the first aspect, in one possible design manner, the first device includes one or more of a solder chip, a WB chip, and a passive device.

With reference to the first aspect, in one possible design manner, the second device includes one or more of a solder chip, a WB chip, and a passive device.

For example, in a battery protection panel scenario, the battery protection panel circuitry may include a control chip, a protection chip, passive devices (e.g., capacitors, resistors), MOS switches, and the like. In this scenario, the first device may include a control chip, a protection chip, and a passive device. The second device may be a MOS switch.

For another example, in a bluetooth headset scenario, a bluetooth master chip, a passive device, a radio frequency chip, an antenna, and a memory are included in the bluetooth headset. The radio frequency chip can include a radio frequency transmitting channel and a radio frequency receiving channel. The radio frequency transmit channel may include a Low Noise Amplifier (LNA) and a filter; the radio frequency receive channel may include a filter and a Power Amplifier (PA). In this scenario, the first device may include a bluetooth master chip, a passive device, and a radio frequency chip. The second device may be a memory.

With reference to the first aspect, in one possible design, the size of the through-groove matches the size of the second device. In this case, the area of the groove in the FPC can be reduced, so that the number of second pads can be increased, and the through-current capability between the FPC and the package substrate can be improved.

With reference to the first aspect, in one possible design manner, a first pad is disposed at an edge of the second surface of the package substrate; a second bonding pad is arranged on the first surface of the FPC; the first bonding pad and the second bonding pad are welded to interconnect the packaging substrate and the FPC.

In combination with the first aspect, in a possible design manner, a plurality of second pads are disposed on the first surface of the FPC at intervals along a circumference of the through groove, and a plurality of first pads corresponding to the plurality of second pads are disposed on the second surface of the package substrate. Therefore, the number of the interconnection pins of the FPC and the packaging substrate can be increased, the application of a high-density interconnection scene is met, and the overall performance of the packaging module is improved.

With reference to the first aspect, in one possible design, a distance between the adjacent second pads is less than 0.3 mm, and the first pads and the second pads are soldered by a reflow soldering process. Therefore, on one hand, the space between the bonding pads can be smaller, high-density interconnection between the FPC and the packaging substrate is realized, and the through-current capacity is improved; on the other hand, the reflow soldering process can avoid the series soldering problem between the welding pads, so that the yield of the packaging module is improved, and the reliability of the packaging module is further improved.

In combination with the first aspect, in a possible design mode, one side of the second device, which is far away from the package substrate, is covered with heat-conducting glue, the second surface of the FPC is connected with a heat-conducting plate, and the heat-conducting plate is bonded and attached with the heat-conducting glue. Under the condition, the second device can be radiated through the heat-conducting glue and the heat-conducting plate, so that the performance and the reliability of the packaging module are improved.

In combination with the first aspect, in a possible design manner, the thermal conductive adhesive is a Thermal Interface Material (TIM). After the heat-conducting glue is bonded and attached to the heat-conducting plate, the heat-conducting glue can fill air gaps, so that the contact thermal resistance is reduced, and the heat dissipation performance is improved.

With reference to the first aspect, in one possible design, the heat conducting plate is connected to an edge of the through groove in the FPC, and the heat conducting plate covers the through groove. Under the condition, the area of the heat conducting plate can be increased so as to increase the heat dissipation area and improve the heat dissipation efficiency of the packaging module.

In a second aspect, the present application provides a method for manufacturing a package module. The method comprises the following steps: and respectively packaging the first device and the second device on the first surface and the second surface of the packaging substrate to form a first module. And welding the first module on the first surface of the FPC with the through groove, and enabling the second device to be located in the through groove of the FPC.

With reference to the second aspect, in a possible design, welding a first module on a first surface of the FPC provided with the through groove includes: and printing solder paste on the second bonding pad of the first surface of the FPC provided with the through groove. And welding the first bonding pads on the second surface of the packaging substrate to the corresponding second bonding pads through a reflow soldering process. In this case, compared with a laser welding process, the reflow soldering process does not need special equipment, and has low soldering cost and high soldering efficiency. Under the less condition of a plurality of second pad intervals, reflow soldering technology compares in hot pressing molten tin welding (hot bar) technology, can avoid the series welding problem between the pad to improve the yields of encapsulation module, and then improve the reliability of encapsulation module.

With reference to the second aspect, in a possible design manner, the method further includes: and covering the side of the second device far away from the packaging substrate with heat-conducting glue. And the second surface of the FPC is connected with a heat conducting plate, so that the heat conducting plate is bonded and attached with the heat conducting glue.

In a third aspect, the present application provides an electronic device. The electronic device comprises an external component and any one of the possible package modules of the first aspect. The package module is coupled to the external device for communicating with the external device.

In a fourth aspect, the present application provides a battery protection plate. The electronic protection board comprises a board-to-board BTB connector and any one of the possible package modules as described above in the first aspect. Wherein the BTB connector is coupled with the first side of the FPC. And a charging pin for connecting a charging battery cell is also arranged on the second surface of the FPC.

With reference to the fourth aspect, in a possible design manner, the first device in the package module includes a control chip, a protection chip, and a passive device.

With reference to the fourth aspect, in a possible design manner, the second device in the package module includes a first MOS switch and a second MOS switch.

In a fifth aspect, the present application provides a bluetooth headset. The bluetooth headset comprises a board-to-board BTB connector and any one of the possible packaging modules as described above in relation to the first aspect. Wherein the BTB connector is for connecting one of an antenna, audio, or a power source. The BTB connector is coupled with the first side of the FPC.

With reference to the fifth aspect, in a possible design manner, the first device in the package module includes a bluetooth main control chip, a passive device, and a radio frequency chip.

With reference to the fifth aspect, in a possible design manner, the second device in the package module includes a memory.

With reference to the fifth aspect, in a possible design manner, the package module may further include an antenna. The antenna may be attached to the first side or the second side of the FPC and coupled with the FPC. Therefore, the antenna is directly attached to the FPC, and the antenna is easy to realize.

With reference to the fifth aspect, in a possible design manner, the package module may further include an antenna. The antenna may be mounted to a side of the first molding layer away from the package substrate, and a first conductor pillar is disposed in the first molding layer, one end of the first conductor pillar being coupled to the package substrate, and the other end of the first conductor pillar being coupled to the antenna. The first plastic packaging layer is used for plastic packaging of the first device. So, can improve under the bluetooth scene, the integrated level of encapsulation module reduces the size of encapsulation module.

It can be understood that any of the above-provided methods for manufacturing a package module, an electronic device, and the like can be implemented by the above-provided corresponding package module, or can be associated with the above-provided corresponding package module, and therefore, the beneficial effects achieved by the method can refer to the beneficial effects in the above-provided package module, and are not described herein again.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a schematic cross-sectional view illustrating a package module according to an embodiment of the disclosure;

fig. 3 is a schematic top view of an FPC according to an embodiment of the present application;

fig. 4 is a flowchart illustrating a method for manufacturing a package module according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of an intermediate structure for performing the formation of S401 in FIG. 4;

FIG. 6 is a schematic diagram of another intermediate structure for performing the formation of S401 in FIG. 4;

FIG. 7 is a schematic structural diagram illustrating the formation of S401 in FIG. 4;

FIG. 8 is a schematic diagram of the process of S402 in FIG. 4;

fig. 9 is a schematic structural diagram of another package module according to an embodiment of the present disclosure;

fig. 10 is a flowchart illustrating another method for manufacturing a package module according to an embodiment of the present disclosure;

FIG. 11 is a schematic structural diagram illustrating the formation of S1001 in FIG. 10;

FIG. 12 is a schematic diagram of a structure for performing S1002 formation in FIG. 10;

fig. 13 is a schematic structural diagram formed in another process for manufacturing a package module according to an embodiment of the present disclosure;

fig. 14 is a schematic structural diagram of another package module according to an embodiment of the present disclosure;

fig. 15 is a schematic view of a package structure of a battery protection board according to an embodiment of the present disclosure;

fig. 16 is a schematic diagram of a package structure of a bluetooth headset according to an embodiment of the present application;

fig. 17 is a schematic diagram of a package structure of another bluetooth headset according to an embodiment of the present application;

fig. 18 is a schematic view of a package structure of another bluetooth headset according to an embodiment of the present application.

Reference numerals:

01-an electronic device; 10-an external component part; 20-packaging the module; 101-a package substrate; 1011-first pad; 1012-a first side of a package substrate; 1013-a second side of the package substrate; 102-a first device; 1021-bonding the chip; 1022 — a passive device; 1023-WB chips; 103-a second device; 104-FPC; 1041-a second pad; 1042-through slots; 1043-a first side of an FPC; 1044-a second side of the FPC; a 105-BTB connector; 106-heat conducting glue; 107-heat conducting plate; 108-a first molding layer; 109-adhesive glue; 30-battery protection plate; 2011-control chip; 2012-passive devices; 2013-protecting the chip; 2031 — a first MOS switch; 2032 — second MOS switch; 3011, Bluetooth main control chip, 3012 passive device, and 3013 radio frequency chip; 304-an antenna; 305-first conductor column.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

Further, in the present application, directional terms such as "upper" and "lower" are defined with respect to a schematically-disposed orientation of components in the drawings, and it is to be understood that these directional terms are relative concepts that are used for descriptive and clarity purposes and that will vary accordingly with respect to the orientation in which the components are disposed in the drawings.

In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate. Furthermore, the term "coupled" may be a manner of making electrical connections that communicate signals. "coupled" may be a direct electrical connection or an indirect electrical connection through intervening media.

With the development of miniaturization demand of electronic devices, the internal space of the electronic devices may have small and irregular features, and signal interconnection is generally implemented using a Flexible Printed Circuit (FPC). In chip packaging, signal transmission in a chip/device module can be realized by adopting interconnection between a flexible board (such as a flexible printed circuit board (FPC)) and a hard board (such as a packaging substrate).

With the development of System In Package (SiP) technology, double-sided packaging technology is generally adopted. Currently, the interconnection between the flexible board and the hard board is generally implemented by a Board To Board (BTB) connector, a Zero Insertion Force (ZIF) connector, and the like. Due to the limitation of the interconnection structure of the soft board and the hard board, in a double-sided packaging scene, the thickness of the double-sided packaging module adopting the interconnection of the soft board and the hard board is generally thicker, which is not beneficial to the miniaturization of the terminal equipment.

The embodiment of the application provides electronic equipment. The electronic device includes a mobile phone (mobile phone), a tablet computer (pad), a computer, an intelligent wearable product (e.g., a smart watch, a smart bracelet), a Virtual Reality (VR) terminal device, an Augmented Reality (AR) terminal device, and other electronic products. The embodiment of the present application does not specifically limit the specific form of the electronic device.

As shown in fig. 1, the electronic device 01 includes an external component 10 and at least one package module 20 coupled to the external component 10. The package module 20 may be coupled to the external component 10 through a BTB connector, so that the package module 20 and the external component 10 realize signal transmission. The external connection component 10 may be a Printed Circuit Board (PCB) or other packaging module, and the PCB may be packaged with other chips.

The package module 20 described above provides an improved interconnection structure of the flexible board and the rigid board to reduce the thickness of the package module 20, and thus the thickness of the electronic device 01. The package module 20 will be described in detail below.

In some embodiments of the present application, as shown in fig. 2, the package module 20 includes a package substrate 101, a first device 102, a second device 103, and a Flexible Printed Circuit (FPC) 104. The package substrate 101 is a carrier for chip packaging, and the package substrate 101 includes one or more wiring layers, which can provide electrical connection for a plurality of chips disposed on the package substrate 101, so as to implement the functions of the packaged chips. The first device 102 and the second device 103 may each include one or more of a passive device 1022, a Wire Bonding (WB) chip 1023 and a solder chip 1021, and may further include a Ball Grid Array (BGA) device, a Land Grid Array (LGA) device, or a quad flat no-lead (QFN) device that has been packaged, and the embodiment of the present application is not particularly limited.

The first device 102 is packaged on the first side 1012 of the package substrate 101. For example, as shown in fig. 2, the first device 102 may be coupled to the first side 1012 of the package substrate 101, and may be encapsulated by the first encapsulation layer 108. The first device includes a passive device 1022, a WB chip 1023, and a solder chip 1021. The passive devices 1022 may be coupled to the package substrate 101 by Surface Mount Technology (SMT) during packaging. WB chip 1023 refers to a chip whose circuit structure is coupled to package substrate 101 by metal wires at the time of chip packaging. At the time of packaging, the WB chip 1023 may be coupled with the package substrate 101 by a metal wire (wire). The bonded chip 1021 is a chip that couples the circuit structure of the chip to the package substrate 101 by means of bonding (e.g., bonding pads and solder balls) during chip packaging. When packaging, the solder chip 1021 may be coupled with the package substrate 101 by soldering.

After the first device 102 is coupled to the package substrate 101, the first molding compound layer 108 may encapsulate devices or chips in the first device 102 to achieve isolation between different devices or chips and isolation between the devices or chips and external devices. The first molding compound layer 108 may be made of thermosetting material formed by mixing resin and filler, wherein the resin may be resin material such as epoxy resin, and the filler may be silicon oxide (SiO)₂) Or Boron Nitride (BN), and the like, and the filler can adjust the properties of the resin, thereby realizing the material properties of high thermal conductivity, high melting point, and low Coefficient of Thermal Expansion (CTE). Of course, the material of the first molding layer 108 may also be other types of materials, such as ceramic or glass, and the embodiment of the present invention is not limited in particular.

It should be noted that, in order to implement signal shielding, a metal or conductive material layer may be manufactured as a shielding layer on the outer surface of the first plastic package layer 108 (i.e., a surface of the first plastic package layer 108 away from the package substrate 101) and a side surface of the package substrate 101 through a sputtering or spraying process, so as to effectively prevent the first device 102 from interfering with the magnetically sensitive device outside the package module, and prevent the interfering magnetic signal outside the package module from affecting the performance of each device in the first device 102, thereby improving the reliability of the package module.

The second device 103 is mounted on the second surface 1013 of the package substrate 101. Illustratively, as shown in fig. 2, the second device 103 includes two bonding chips 1021. The solder chip 1021 is coupled to the package substrate 101 by soldering.

When the FPC104 is interconnected with the package substrate 101, generally, the first surface 1043 of the FPC104 is soldered to the second surface 1013 of the package substrate 101 through a pad, for example, a first pad 1011 may be disposed at an edge of the second surface 1013 of the package substrate 101, a second pad 1041 may be disposed on the first surface 1043 of the FPC104, and the first pad 1011 and the second pad 1041 are soldered to interconnect the package substrate 101 and the FPC 104.

If other devices are packaged on the second surface 1013 of the package substrate 101, when the FPC104 is soldered to the package substrate 101, only the second pads 1041 are disposed at one edge of the FPC104, and at this time, the number of pads where the FPC104 is soldered to the package substrate 101 (i.e., the number of pins for interconnecting the FPC104 and the package substrate 101) is greatly limited, and the FPC104 extends a lot in a direction away from the package substrate 101, so that the integration level of the package module 20 is low.

If there are more pads between the FPC104 and the package substrate 101 (i.e. there are more interconnection pins, such as the first pad 1011 and the second pad 1041, between the FPC104 and the package substrate 101), the overlapping area between the FPC104 and the package substrate 101 is very large, so that the second surface 1013 of the package substrate 101 cannot be packaged with any more devices, and thus the package module 20 has a larger thickness and a lower integration level.

However, in the embodiment of the present invention, the first surface 1043 of the FPC104 is soldered to the second surface 1013 of the package substrate 101, and the FPC104 is provided with a through groove 1042 at a position corresponding to the second device 103, and the second device 103 is located in the through groove 1042 of the FPC 104. That is, after the through grooves 1042 are formed in the FPC104 (i.e., the FPC104 is grooved), a plurality of second pads 1041 may be formed on the first surface of the FPC104 at intervals along a circumference of the through grooves 1042, as shown in fig. 3. To interconnect the FPC104 and the package substrate 101, a plurality of first pads 1011 corresponding to the second pads 1041 may be disposed on the second surface 1013 of the package substrate 101. When the FPC104 is interconnected with the package substrate 101, the interconnection between the FPC104 and the package substrate 101 can be realized by the corresponding welding of the first pad 1011 and the second pad 1041, so that the number of interconnection pins of the FPC104 and the package substrate 101 is increased, the application in a high-density interconnection scene is satisfied, and the overall performance of the package module is improved. In a high-density interconnection scenario, for example, the distance between adjacent second pads 1041 is less than 0.3 millimeters (mm), a reflow soldering process may be used to solder between the first pads 1011 and the second pads 1041.

Moreover, the second pads 1041 are disposed around the through grooves 1042 in the FPC104, which can increase the current capacity from the FPC104 to the package substrate 101, and improve the performance of the package module. In the embodiment of the present application, the pitch of the second pads 1041 in the FPC104 may be set to 0.3 to 0.5 mm, thereby further improving the current capacity of the FPC104 to the package substrate.

It should be understood that in a scenario where the number of interconnection pins of the FPC104 and the package substrate 101 is less required, the first pad 1011 may be disposed at only one edge of the second surface 1013 of the package substrate 101, and the corresponding second pad 1041 may be disposed on the FPC 104.

In addition, after the FPC104 is interconnected with the package substrate 101, the second device 103 packaged on the second surface 1013 of the package substrate 101 may be disposed at a position of the second surface 1013 of the package substrate 101 corresponding to the through groove 1042 of the FPC104, so that the device module can be packaged on both surfaces of the package substrate 101, thereby improving the integration of the package module and reducing the thickness of the package module.

It should be noted that the size of the through groove 1042 in the FPC104 may match the size of the second device 103. That is, the through groove 1042 can just place the second device 103 therein. In this case, the area of the cutout in the FPC104 can be reduced, so that the number of the second pads 1041 can be increased, and the current capacity between the FPC104 and the package substrate 101 can be improved.

As shown in fig. 4, the method for manufacturing the package module 20 includes:

s401, the first device 102 and the second device 103 are packaged on the first surface 1012 and the second surface 1013 of the package substrate 101 to form a first module.

Illustratively, for SMT devices (such as passive devices 1022), solder paste may be printed on the first side 1012 of the package substrate 101, such that the SMT devices are attached to the first side 1012 of the package substrate 101 and coupled to the package substrate 101, as shown in fig. 5. For the WB chip 1023, the substrate of the chip may be first faced to the package substrate 101, the WB chip 1023 is attached to the first surface 1012 of the package substrate 101 by using a tape-bonding or dispensing method, and then the circuit structure of the WB chip 1023 is connected with the package substrate 101 through a metal wire, so as to achieve interconnection and signal transmission between the WB chip 1023 and the package substrate 101. For the solder chip 1021, the solder surface (i.e., the surface on which the solder balls of the chip are disposed) of the solder chip 1021 is directed toward the package substrate 101, and the solder chip 1021 is soldered to the package substrate 101 by means of reflow soldering, laser welding, or the like, so as to achieve interconnection and signal transmission between the solder chip 1021 and the package substrate 101.

As shown in fig. 6, after mounting or interconnection between the device module and the package substrate 101 is achieved, the package substrate 101 or the device module may be processed using a plasma (plasma) process. After the plasma treatment, the device can be packaged and wrapped by a plastic packaging process, and the gap between the device and the gap between the device and the packaging substrate 101 need to be packaged and wrapped by plastic packaging.

As shown in fig. 7, taking the second device 103 including two solder chips 1021 as an example, the solder chip 1021 may face the solder surface toward the package substrate 101, and the solder chip 1021 may be soldered to the package substrate 101 by means of reflow soldering, laser soldering, and the like, so as to achieve interconnection and signal transmission between the solder chip 1021 and the package substrate 101.

S402, a first module is soldered on the FPC104 having the through groove 1042, and the second device 103 is positioned in the through groove 1042 of the FPC 104.

Exemplarily, as shown in fig. 8, the FPC104 is fixed by a tooling fixture and the FPC104 is kept flat. For example, the FPC104 may be fixed and kept flat by vacuum suction; or a cover plate with magnetic adsorption can be added on the tooling fixture to fix and keep the FPC104 flat. Then, solder paste may be printed on the first surface 1043 of the FPC104 at a position corresponding to the second pad 1041 by printing a steel mesh. Next, the package substrate 101 (i.e., the first module) on which the second device 103 and the first device 102 are packaged is soldered to the FPC104 through a reflow soldering process or a laser soldering process, that is, the first pads 1011 on the package substrate 101 are soldered to the second pads 1041 on the FPC104 correspondingly. Also, as shown in fig. 8, a BTB connector may also be soldered to the FPC 104.

It should be noted that, compared with the laser welding process, the reflow soldering process does not need special equipment, and has low soldering cost and high soldering efficiency. Under the less condition of a plurality of second pad intervals, reflow soldering technology compares in hot pressing molten tin welding (hot bar) technology, can avoid the series welding problem between the pad to improve the yields of encapsulation module, and then improve the reliability of encapsulation module.

In order to prevent the solder joints between the device module (such as the first device 102 and the second device 103) and the package substrate 101 from falling off and the solder joints between the package substrate 101 and the FPC104 from falling off, underfill may be filled between the device module and the solder joints of the package substrate 101 and between the package substrate 101 and the solder joints of the FPC104, so as to improve the reliability of the package module.

In some embodiments of the present application, as shown in fig. 9, in a scenario with a higher heat dissipation requirement, a device with high power consumption (for example, a MOS device) may be packaged on the second side of the package substrate 101 as a device in the second device 103. At this time, the side of the second device 103 away from the package substrate 101 may be covered with the thermal conductive adhesive 106, the thermal conductive plate 107 is connected to the second surface 1044 of the FPC104, and the thermal conductive plate 107 and the thermal conductive adhesive 106 are bonded to each other, so as to dissipate heat of the devices in the second device 103, thereby improving performance and reliability of the package module.

In addition, in order to improve the heat dissipation efficiency, the heat conducting plate 107 may be connected to the edge of the through groove 1042 in the FPC104, and the heat conducting plate 107 covers the through groove 1042 and the second device 103 in the through groove 1042, so as to improve the area of the heat conducting plate 107, and the heat conducting plate 107 is bonded to the heat conducting glue 106, so that the heat of the device can be conducted to the heat conducting plate 107 through the heat conducting glue 106, so as to achieve rapid heat dissipation of the device.

It should be noted that, according to the actual situation of the package module, the thermal conductive adhesive 106 may be a complete thermal conductive adhesive film, and covers the area of the second device 103, may also be a colloid structure in the area of the second device 103, and may also be a colloid structure in the whole space area between the second device 103 and the FPC104, so that the thermal conductive adhesive 106 wraps the whole second device 103, and the heat dissipation performance of the whole package module is improved to the maximum extent. Therefore, the structure and coverage of the thermal conductive paste 106 are not particularly limited in the embodiments of the present application.

In addition, the heat conducting plate 107 may also be used for structural reinforcement of the FPC104, and serve as a structural reinforcement plate of the FPC104 to improve the structural stability of the FPC104, thereby improving the structural stability and reliability of the package module.

As shown in fig. 10, the method for manufacturing the package module 20 based on the method for manufacturing the package module shown in fig. 4 may further include:

s1001, a side of the second device 103 away from the package substrate 101 and a side of the FPC104 away from the package substrate 101 are covered with the thermal conductive paste 106.

For example, as shown in fig. 11, after the above S402 is completed, the structure formed by performing S402 is turned over by 180 degrees, so that the second side 1044 of the FPC104 faces upward. At this time, the side of the second device 103 away from the package substrate 101 and the side of the FPC104 away from the package substrate 101 may be covered with the thermal conductive paste 106, the thermal conductive paste 106 is attached to the chip or device in the second device 103, and the thermal conductive paste 106 is attached to the second surface 1044 of the FPC 104. The adhesive-coated area of the thermal conductive adhesive 106 on the FPC104 may be determined by the size of the thermal conductive plate 107.

S1002, bonding the heat conducting plate 107 to the second surface 1044 of the FPC104, so that the heat conducting plate 107 is bonded to the heat conducting adhesive 106.

For example, as shown in fig. 12, after the completion of the above-mentioned S1001, the heat conducting plate 107 may be directly covered on the heat conducting glue 106, so that the heat conducting plate 107 is adhered to the heat conducting glue 106.

The thermal conductive paste 106 is a Thermal Interface Material (TIM). After the heat conducting glue 106 is bonded with the heat conducting plate 107, the heat conducting glue can fill air gaps, reduce thermal contact resistance and improve heat dissipation performance.

When the heat conducting plate 107 is used as a structural reinforcing plate for the FPC104, before the step S402 is executed, the FPC104 may be fixed by a tool, the adhesive glue 109 is covered on the second surface 1044 of the FPC104, the heat conducting plate 107 is attached to the second surface 1044 of the FPC104, and the heat conducting plate 107 may cover the through groove 1042 in the FPC104, so as to form the structure shown in (a) in fig. 13. After the thermal conductive plate 107 is attached to the FPC104, the first surface 1043 of the FPC104 is faced upward, and the through groove 1042 in the FPC104 is covered with the thermal conductive paste 106, so as to form the structure shown in fig. 13 (b). At this time, the above S402 may be executed again, and the first module is soldered on the FPC104 provided with the through groove 1042, so that the second device 103 is located in the through groove 1042 of the FPC104, and the second device 103 and the thermal conductive adhesive 106 are tightly attached to form the structure shown in (c) in fig. 13, thereby implementing the fabrication of the package module 20.

It should be understood that the adhesive glue 109 described above may be used with TIM glue as with the thermal paste 106; a common adhesive having adhesive properties, such as an epoxy-based adhesive, may also be used, and the examples of the present application are not particularly limited. The heat conducting plate 107 has a structure that is matched with the thickness of the second device 103 packaged on the second surface 1013 of the package substrate 101, and the heat conducting plate 107 may be a heat conducting plate having a planar structure as shown in fig. 9 in this embodiment of the present application, or may be a heat conducting plate having a special structure that is matched with the thickness of the second device 103. Specifically, as shown in fig. 14, when the thickness of the second device 103 in the package module 20 exceeds the distance from the second surface 1044 of the FPC104 to the second surface 1013 of the package substrate 101, the heat conducting plate 107 is a heat conducting plate with a special-shaped structure, for example, a groove structure is formed by digging a groove in the middle of the heat conducting plate 107, so as to accommodate the second device 103 after the heat conducting plate 107 is bonded to the FPC 104.

The application scenario of the encapsulation module is illustrated by two specific examples.

For example, the battery protection board may be implemented by using the package module of fig. 2 or fig. 4. As shown in fig. 15, the battery protection board 30 includes a BTB connector 105 and the above-mentioned package module of fig. 2 or fig. 4. Wherein the BTB connector 105 is used to connect a power supply, and the BTB connector 105 is coupled with the first face 1043 of the FPC 104. A charging electrode (such as the first electrode 204 and the second electrode 205 in fig. 15) for connecting the battery cell is further disposed on the second side 1044 of the FPC 104.

In this battery protection board 30, as shown in fig. 15, the first device 102 may include a control chip 2011, a protection chip 2013, and a passive device 2012. The second device 103 may include a first MOS switch 2031 and a second MOS switch 2032, the first MOS switch 2031 and the second MOS switch 2032 being connected in series. The protection chip 2013 can be used for detecting the charging or discharging state of the battery. The control chip 2011 may control the first MOS switch 2031 and the second MOS switch to be turned on or off according to a charging or discharging state of the battery provided by the protection chip 2013. The passive device 2012 may be a resistor or capacitor or the like in the battery protection circuit to ensure the normal operation of the circuit.

The battery protection plate 30 may provide overcharge protection, overdischarge protection, and the like. The working principle of the battery protection plate 30 is as follows:

in a charging scenario, the battery protection plate 30 may provide overcharge protection. At this time, the protection chip 2013 may detect that the battery is in a charging state, and the protection chip 2013 may send a charging signal to the control chip 2011, so that the control chip 2011 controls the first MOS switch 2031 and the second MOS switch 2032 to be turned on, so that the charging loop is opened, and the BTB connector 105 may input a charging current into the charging loop to charge the battery. In this case, the control chip 2011 can monitor in real time whether the voltage across the battery exceeds the overcharge cutoff voltage. When the voltage across the battery exceeds the overcharge cut-off voltage and the duration that the voltage across the battery exceeds the overcharge cut-off voltage exceeds the preset time, the control chip 2011 may control the second MOS switch 2032 to turn off, so that the charging loop is cut off, and at this time, the battery is not charged any more, thereby protecting the battery.

In a discharge scenario, the battery protection plate 30 may provide over-discharge protection. At this time, the protection chip 2013 may detect that the battery is in a discharging state, and the protection chip 2013 may send a discharging signal to the control chip 2011, so that the control chip 2011 controls the first MOS switch 2031 to be turned on, so that the discharging loop is opened. In this case, the control chip 2011 may monitor whether the voltage across the battery is less than or equal to the over-discharge cutoff voltage in real time. When the voltage across the battery is less than or equal to the overdischarge cutoff voltage and the time when the voltage across the battery is less than or equal to the overdischarge cutoff voltage exceeds the preset time, the control chip 2011 may control the first MOS switch 2031 to turn off, so that the discharge loop is cut off, and at this time, the battery is no longer discharged, thereby protecting the battery.

It should be noted that, in the battery protection board 30, a relatively large current may exist in the whole battery protection board circuit structure in a charging scene of the battery, so that the first MOS switch 2031 and the second MOS switch 2032 generate relatively large heat loss, and gradually increase the temperature, which affects the performance of the battery. In this case, the first MOS switch 2031 and the second MOS switch 2032 in the battery protection board 30 may be disposed on the second surface of the package substrate 101, and the heat in the first MOS switch 2031 and the second MOS switch 2032 is transferred to the heat conducting board 107 through the heat conducting glue 106, so as to dissipate the heat of the battery protection board 30 and improve the thermal performance experience of the battery protection board.

In addition, in the battery protection board 30, by providing the plurality of second pads in the FPC, the overall current capacity of the battery protection board can be increased, thereby improving the charging efficiency and satisfying the long-term endurance requirement of the battery in the case of increasing the battery capacity.

For example two, the bluetooth headset may be implemented by using the package module of fig. 2 or fig. 4. As shown in fig. 16, the bluetooth headset 40 may include a BTB connector 105 and the package module of fig. 2 or fig. 4. Wherein the BTB connector 105 may be used to connect an antenna, audio or power source, etc., and the BTB connector 105 is coupled with the first side 1043 of the FPC 104.

In the bluetooth headset 40, as shown in fig. 16, the first device 102 may include a bluetooth main control chip 3011, a passive device 3012 (such as a capacitor, a resistor, and the like), a radio frequency chip 3013, and the like. The second device 103 may be a device such as a memory (Nor flash) 3031. The rf chip 3013 may include an rf transmitting channel and an rf receiving channel. The radio frequency transmit path may include a low noise amplifier LNA and a filter; the radio frequency receive path may include a filter and a power amplifier PA.

When the bluetooth headset is in an operating state, signals, programs, or data in the bluetooth main control chip 3011 may be buffered and stored in the memory 3021, and radio frequency signals sent by the bluetooth main control chip 3011 may be transmitted to the FPC104 through the package substrate 101 after passing through the filter and the LNA, and then transmitted to the BTB connector 105 through the FPC104, so that the radio frequency signals may be transmitted to the antenna to communicate with an external device. Of course, the signal may also be received by an antenna, and transmitted to the bluetooth main control chip 3011 through the power amplifier PA and the filter, so as to finally implement the transceiving communication between the bluetooth headset 40 and the external device.

The encapsulation of the internal circuit of the bluetooth headset is realized through the encapsulation module of fig. 2 or fig. 4, so that the integration level of the encapsulation module is higher, the encapsulation module is smaller, and the requirement of miniaturization is met.

In addition, the package module in the bluetooth headset 40 may further include an antenna 304. As shown in fig. 17, the antenna 304 may be attached to the first side 1043 or the second side 1044 of the FPC 104. Specifically, if the BTB connector 105 is coupled to the first face 1043 of the FPC104, the antenna 304 may be attached to the second face 1044 of the FPC104 and coupled to the second face of the FPC104, thereby enabling communication between the antenna 304 and the bluetooth main control chip 3011.

As shown in fig. 18, the antenna 304 may also be attached to a side of the first molding layer 108 away from the package substrate 101, and a first conductor pillar 305 is disposed in the first molding layer 108, one end of the first conductor pillar 305 is coupled to the package substrate 101, and the other end of the first conductor pillar 305 is coupled to the antenna 304, so as to implement communication between the antenna 304 and the bluetooth master chip 3011.

It should be noted that the first conductive pillar 305 may be a pillar structure made of a metal conductive material, such as copper, nickel, tungsten, and the like. The conductor column can be any column body structure such as a cylinder, a triangular prism, a circular truncated cone-shaped column body structure and the like, and the embodiment of the application is not particularly limited.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A package module, comprising: the packaging substrate, the first device, the second device and the flexible printed circuit board FPC;

the first device is packaged on the first surface of the packaging substrate;

the second device is packaged on the second side of the packaging substrate;

the first surface of the FPC is welded with the second surface of the packaging substrate, a through groove is formed in the position, corresponding to the second device, of the FPC, and the second device is located in the through groove of the FPC.

2. The package module of claim 1, wherein the first device comprises one or more of a solder die, a WB die, and a passive device.

3. The package module according to claim 1 or 2, wherein the second device comprises one or more of a solder die, a WB die, and a passive device.

4. The package module according to any one of claims 1 to 3, wherein the through-slots have a size that matches a size of the second device.

5. The package module according to any one of claims 1 to 4, wherein the package substrate is provided with a first pad at an edge position of the second surface; a second bonding pad is arranged on the first surface of the FPC; the first bonding pad and the second bonding pad are welded, so that the packaging substrate and the FPC are interconnected.

6. The package module according to claim 5, wherein the first surface of the FPC has a plurality of second pads spaced around the through-slot, and the second surface of the package substrate has a plurality of first pads corresponding to the plurality of second pads.

7. The package module according to any one of claims 1 to 6, wherein a side of the second device away from the package substrate is covered with a thermally conductive adhesive, a thermally conductive plate is bonded to the second surface of the FPC, and the thermally conductive plate is bonded to the thermally conductive adhesive.

8. The package module of claim 7, wherein the thermally conductive plate is attached to the FPC at edges of the through slots, and the thermally conductive plate covers the through slots.

9. A method for manufacturing a package module includes:

respectively packaging a first device and a second device on a first surface and a second surface of the packaging substrate to form a first module;

and welding the first module on the first surface of the FPC provided with a through groove, and enabling the second device to be located in the through groove of the FPC.

10. The method of claim 9, wherein the soldering the first module on the first side of the FPC provided with the through-slots comprises:

printing solder paste on a second bonding pad on the first surface of the FPC with the through groove;

and welding the first bonding pads on the second surface of the packaging substrate to the corresponding second bonding pads through a reflow soldering process.

11. The method according to claim 9 or 10, characterized in that the method further comprises:

covering a side of the second device far away from the packaging substrate and a second surface of the FPC with heat conducting glue;

and bonding a heat conducting plate on the second surface of the FPC to bond and attach the heat conducting plate and the heat conducting glue.

12. An electronic device comprising an external component and the package module according to any one of claims 1 to 8; the package module is coupled to the external component.