CN113721386A - Backlight module for increasing Mini LED light-emitting angle and manufacturing method thereof - Google Patents

Backlight module for increasing Mini LED light-emitting angle and manufacturing method thereof Download PDF

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Publication number
CN113721386A
CN113721386A CN202110946479.8A CN202110946479A CN113721386A CN 113721386 A CN113721386 A CN 113721386A CN 202110946479 A CN202110946479 A CN 202110946479A CN 113721386 A CN113721386 A CN 113721386A
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China
Prior art keywords
pcb
convex lens
mini led
support frame
backlight module
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CN202110946479.8A
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Chinese (zh)
Inventor
王科
李泉涌
彭友
吴疆
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Coreach Electronic Technology Co ltd
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Coreach Electronic Technology Co ltd
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Priority to CN202110946479.8A priority Critical patent/CN113721386A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133609—Direct backlight including means for improving the color mixing, e.g. white
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133611—Direct backlight including means for improving the brightness uniformity
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention discloses a backlight module for increasing the light-emitting angle of a MiniLED and a manufacturing method thereof, wherein the backlight module comprises a PCB (printed circuit board), a MiniLED lamp bead, a support frame and a driving module; the upper surface of the PCB is provided with a support frame, and the support frame is welded on the upper surface of the PCB through soldering tin; the driving module is welded on the surface of the PCB and is positioned on the upper surface or the lower surface of the PCB; the LED lamp comprises a PCB and a MiniLED lamp bead, wherein the upper surface of the PCB is provided with the MiniLED lamp bead, the MiniLED lamp bead comprises a MiniLED chip, a first convex lens and a second convex lens, and the MiniLED chip is welded on a lamp bead bonding pad on the upper surface of the PCB; the PCB board is wrapped up in first convex lens, and the shape of first convex lens is the ellipsoid, and first convex lens top is provided with the second convex lens, and the shape of second convex lens is the ellipsoid. The invention has the characteristics of large light-emitting angle, uniform light emission, shortened process steps, improved productivity, reduced production cost and low light mixing distance.

Description

Backlight module for increasing Mini LED light-emitting angle and manufacturing method thereof
Technical Field
The invention relates to a backlight module for increasing the exit angle of a Mini LED and a manufacturing method thereof, in particular to a backlight module for increasing the exit angle of a Mini LED and a manufacturing method thereof, which have the advantages of large emission angle, uniform light emission, shortened process steps, improved productivity, reduced production cost and low light mixing distance.
Background
With the development of display panel technology, people are increasingly pursuing lighter, thinner and larger flexible display screens. The conventional TFT-LCD is a rigid backlight using a glass substrate and a fixed curvature, and thus it cannot satisfy a flexible display. The OLED is a self-luminous device and does not have liquid crystal, so it is easy to implement a flexible display, but it has disadvantages of short lifespan, poor reliability, and high cost, so it cannot implement a large-sized flexible display. Therefore, the Mini LED has come into play, inherits the advantages of high color gamut and high contrast of the OLED, and simultaneously has the advantages of long service life, high reliability, light weight, thinness, large splicing size and the like,
however, the conventional Mini LED backlight module has high processing difficulty, low productivity and high processing cost; in addition, the light intensity at the top end of the Mini LED lamp bead is larger, and the light mixing distance OD (optical distance) cannot be further reduced, so that the thickness of the backlight module cannot be further reduced.
Disclosure of Invention
The invention aims to provide a backlight module which has a large light-emitting angle, is uniform in light emission, shortens the process steps, improves the productivity, reduces the production cost, has a low light mixing distance and increases the light-emitting angle of a Mini LED and a manufacturing method thereof.
The purpose of the invention can be realized by the following technical scheme:
a backlight module for increasing the exit angle of a Mini LED comprises a PCB, Mini LED lamp beads, a support frame and a driving module;
the upper surface of the PCB is provided with a support frame, and the support frame is welded on the upper surface of the PCB through soldering tin;
the driving module is welded on the surface of the PCB and is positioned on the upper surface or the lower surface of the PCB;
the Mini LED lamp bead is arranged on the upper surface of the PCB and comprises a Mini LED chip, a first convex lens and a second convex lens, and the Mini LED chip is welded on a lamp bead bonding pad on the upper surface of the PCB; the PCB is wrapped in the first convex lens, the first convex lens is in an ellipsoidal shape, the top end of the first convex lens is provided with a second convex lens, and the second convex lens is in an ellipsoidal shape;
the back surface of the PCB is fixed on the back plate, and a reflector plate, a diffusion plate, a quantum dot film, a prism lens and a liquid crystal screen are arranged above the PCB;
the backlight module comprises a plurality of PCB plates, and the edges of two adjacent PCB plates are spliced and fixed on a back plate; fluorescent ink is arranged on the upper surfaces of two adjacent PCBs at the splicing seam, and the fluorescent ink covers the upper surfaces of the PCBs in a spraying or brushing mode; the upper reflecting sheet of the fluorescent ink covering part of the PCB is hollowed;
the bottom surface of the support frame is provided with a bonding pad, and the bonding pad on the bottom surface of the support frame is matched with a support bonding pad arranged on the upper surface of the PCB;
the first convex lens sprays glue to the surface of the Mini LED chip through a ceramic piezoelectric valve glue dispenser, and after solidification, the first convex lens of the semi-ellipsoidal convex lens is formed on the surface of the PCB; spraying shading glue to the top end of the first convex lens through a ceramic piezoelectric valve glue dispenser, and forming a second convex lens of the ellipsoidal convex lens on the surface of the first convex lens after the shading glue is cured, wherein the second convex lens covers the outer surface of the top end of the first convex lens;
the first convex lens is formed by curing transparent glue; the second convex lens is composed of transparent adhesive and TiO2Mixing and curing the powder; the viscosity of the transparent glue for the raw materials of the first convex lens and the second convex lens is 4000-23000 Pa & s; TiO of second convex lens2The concentration of the powder is 0.5-10%;
the distance between every two adjacent Mini LED lamp beads is 6-36 mm, and the size of a Mini LED chip in each Mini LED lamp bead is 50-300 mu m;
the distance between the top end of the first convex lens and the upper surface of the PCB is 0.7-1.1 mm, and the diameter of the first convex lens is 2.5-3.6 mm;
the distance between the top end of the second convex lens and the upper surface of the PCB is 0.71-1.2 mm, and the diameter of the second convex lens is 0.5-4.5 mm; the light mixing height OD of the backlight module is 3-12 mm;
a method for manufacturing a backlight module for increasing the light-emitting angle of a Mini LED comprises the following steps:
step one, PCB loading: mounting the PCB on a conveyor through a carrier;
step two, printing: the conveyor conveys the carrier carrying the PCB into a screen printing machine, the screen printing machine positions the PCB, the fluorescent ink is brushed on the edge of the PCB, and then baking and curing are carried out;
the conveyor conveys the carrier of the PCB with the cured fluorescent ink into a solder paste printer, and after the solder paste printer positions the PCB, a steel mesh is pressed down onto the PCB; the solder paste on the steel mesh is brushed on the steel mesh through a brush, penetrates through the holes of the steel mesh and covers the bonding pad on the upper surface of the PCB;
step three, SPI detection: the printed PCB is contrasted and detected through an SPI detection database of a solder paste detection machine; the qualified PCB board is sent into the step four by a conveyor; the PCB which detects the unqualified solder paste is returned to the second step after being cleaned with the solder paste;
step four, pasting the patch: the conveyor sends the PCB qualified through SPI detection into a chip mounter, and a chip mounter suction nozzle accurately places the Mini LED chip and the support frame on a corresponding bonding pad of the PCB;
step five, AOI optical detection: the conveyor sends the PCB after being pasted with the patches to an AOI optical detection machine, the AOI optical detection machine detects the Mini LED chip, the support frame, the position of the corresponding bonding pad and the front and back of the Mini LED chip on the PCB, and the PCB which is qualified in the detection is sent to the sixth step; detecting that the unqualified PCB takes down the Mini LED chip and the support frame with wrong positions, reprocessing the solder pad solder paste on the PCB, and performing surface mounting and AOI optical detection again;
step six, reflow soldering: the conveyor conveys the PCB loaded with the Mini LED chip and the support frame into a reflow furnace, and after reflow soldering, the Mini LED chip and the support frame are both soldered on corresponding positions of the PCB;
step seven, detection and repair: the PCB welded with the Mini LED chip and the support frame is sequentially subjected to AOI optical detection to detect the welding appearance of the Mini LED chip and the support frame, a low-current testing machine tests the circuit on-off condition of the PCB, and the qualified PCB enters the step eight; detecting abnormal positions of unqualified PCB boards, and replacing or re-welding the Mini LED chip and the support frame;
step eight, dispensing and baking: the conveyor conveys the PCB to a ceramic piezoelectric valve dispenser, and the ceramic piezoelectric valve dispenser sprays transparent glue to the surface of the Mini LED chip; then, the PCB is sent into an oven, and the transparent glue is cured and baked to form a first convex lens;
step nine, secondary dispensing and baking: sending the PCB cured to form the first convex lens into a ceramic piezoelectric valve dispenser again, and spraying shading glue on the top surface of the first lens by the ceramic piezoelectric valve dispenser; then, the PCB is sent into a baking oven, and the mixed glue solution is cured and baked to form a second convex lens;
step ten, optical evaluation: sending the PCB into a luminance instrument, connecting working voltage and working current to the PCB, testing the overall optical characteristics of the lamp beads on the PCB, and recording the overall optical characteristics on the label paper in the step twelve;
eleventh, pasting a reflector plate: attaching a reflector plate with a matched size to the upper surface of the PCB;
step twelve, appearance inspection and packaging: and (4) carrying out appearance inspection on the PCB, putting the PCB qualified in detection into a packaging bag for sealing and packaging, and pasting note paper on the outer surface of the packaging bag.
The invention provides a backlight module for increasing the light-emitting angle of a Mini LED and a manufacturing method thereof, and the backlight module has the characteristics of large light-emitting angle, uniform light emission, shortened process steps, improved productivity, reduced production cost and low light mixing distance. The invention has the beneficial effects that: the defect of color cast is easy to occur in the display above the splicing joint of two adjacent PCBs, so that the upper surface of the joint of the PCBs is covered by fluorescent ink, the fluorescent ink is used for absorbing partial blue light emitted by the Mini LED lamp beads, the light mixing ratio of the blue light above the joint of the PCBs and red light and green light which are excited out of the quantum dot film is adjusted, and the light emitting uniformity of the backlight module is improved;
brushing tin paste on a Mini LED chip bonding pad and a support bonding pad on the upper surface of the PCB through steel mesh printing, then placing the Mini LED chip and the support frame on the surface of the PCB, and welding the Mini LED chip and the support frame on the upper surface of the PCB in a reflow soldering mode; in the prior art, the support frame is adhered to the upper surface of the PCB through the viscose, so that the adhesion strength is low, and a plurality of working procedures are needed; the support frame and the Mini LED chip are welded on the upper surface of the PCB together through the solder paste, so that the process steps are shortened, the productivity is improved, and the production cost is reduced;
light emitted by a Mini LED chip in the Mini LED lamp bead is diffused by the first convex lens, so that the light emitting angle is enlarged; after light emitted from the surface of the top end of the first convex lens covered by the second convex lens is scattered and shielded by the second convex lens, the light intensity at the top end of the Mini LED lamp bead is weakened, so that the light intensity irradiated on the diffusion sheet is more uniform, and the backlight module emits light uniformly;
when the Mini LED chip in the Mini LED lamp bead emits light, the light intensity at the top end is strong; the light entering the second convex lens passes through the TiO in the second convex lens2The particles are absorbed after reflection, and the light intensity at the top end of the Mini LED lamp bead is weakened; so that the backlight module emits light uniformly;
according to the single Mini LED lamp bead in the backlight module, the light emitting angle of 50% of total light intensity is about 165 degrees, compared with the light emitting angle of 110 degrees of a Mini LED chip without a convex lens, the light emitting angle is larger, light emitting is more uniform, the light mixing distance OD is reduced, and the ultrathin backlight module is realized.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a schematic front structural view of a backlight module for increasing the light-emitting angle of a Mini LED according to the present invention;
FIG. 2 is a schematic diagram of a back side structure of a backlight module for increasing the light-emitting angle of a Mini LED according to the present invention;
FIG. 3 is a schematic diagram of a Mini LED lamp bead structure of a backlight module for increasing the exit angle of a Mini LED lamp of the present invention;
FIG. 4 is a light distribution curve of a lens-free single Mini LED chip of the backlight module for increasing the exit angle of the Mini LED of the present invention;
FIG. 5 is a light distribution curve of a single Mini LED lamp bead of the backlight module for increasing the exit angle of the Mini LED;
FIG. 6 is a diagram of a uniformity test object of a backlight module for increasing the exit angle of a Mini LED according to the present invention;
FIG. 7 is a chart of uniformity testing of a backlight module with increased exit angle of Mini LED according to the present invention;
fig. 8 is a schematic diagram of a luminance meter test point of the backlight module for increasing the exit angle of the Mini LED according to the present invention.
In the figure: 1. a PCB board; 2. a Mini LED lamp bead; 21. a first convex lens; 22. a second convex lens; 3. a support frame; 4. a driving module.
Detailed Description
The purpose of the invention can be realized by the following technical scheme:
a backlight module for increasing the exit angle of a Mini LED (light emitting diode) is disclosed, and referring to Figs. 1-3, the backlight module comprises a PCB (printed Circuit Board) 1, a Mini LED lamp bead 2, a support frame 3 and a driving module 4;
the upper surface of the PCB 1 is provided with a support frame 3, and the support frame 3 is welded on the upper surface of the PCB 1 through soldering tin;
the surface of the PCB 1 is welded with a driving module 4, and the driving module 4 is positioned on the upper surface or the lower surface of the PCB 1;
the upper surface of the PCB board 1 is provided with a Mini LED lamp bead 2, the Mini LED lamp bead 2 comprises a Mini LED chip, a first convex lens 21 and a second convex lens 22, and the Mini LED chip is welded on a lamp bead bonding pad on the upper surface of the PCB board 1; the PCB 1 is wrapped in a first convex lens 21, the shape of the first convex lens 21 is an ellipsoid, a second convex lens 22 is arranged at the top end of the first convex lens 21, and the shape of the second convex lens 22 is an ellipsoid;
the back surface of the PCB board 1 is fixed on the back plate, and a reflecting sheet, a diffusion plate, a quantum dot film, a prism sheet and a liquid crystal screen are arranged above the PCB board 1;
the backlight module comprises a plurality of PCB boards 1, and the edges of two adjacent PCB boards 1 are spliced and fixed on a back plate; fluorescent ink is arranged on the upper surfaces of two adjacent PCB boards 1 at the splicing seam, and the fluorescent ink covers the upper surfaces of the PCB boards 1 in a spraying or brushing way; the upper reflecting sheet of the fluorescent ink covering part of the PCB 1 is hollowed; the defect of color cast is easy to occur in the display above the splicing joint of two adjacent PCB boards 1, so that the fluorescent ink covers the upper surface of the joint of the PCB boards 1, partial blue light emitted by the Mini LED lamp beads 2 is absorbed by the fluorescent ink, the mixing ratio of the blue light above the joint of the PCB boards 1 and red light and green light which are excited out of the quantum dot film is adjusted, and the light emitting uniformity of the backlight module is improved;
a bonding pad is arranged on the bottom surface of the support frame 3, and the bonding pad on the bottom surface of the support frame 3 is matched with a support bonding pad arranged on the upper surface of the PCB board 1; brushing tin paste on a Mini LED chip bonding pad and a support bonding pad on the upper surface of the PCB 1 through steel mesh printing on the upper surface of the PCB 1, then placing the Mini LED chip and the support frame 3 on the surface of the PCB 1, and welding the Mini LED chip and the support frame on the upper surface of the PCB 1 in a reflow soldering mode; in the prior art, the support frame is adhered to the upper surface of the PCB 1 through the viscose, so that the adhesion strength is low, and a plurality of working procedures are needed; the support frame 3 and the Mini LED chip are welded on the upper surface of the PCB 1 together through solder paste, so that the process steps are shortened, the productivity is improved, and the production cost is reduced;
the first convex lens 21 sprays glue to the surface of the Mini LED chip through a ceramic piezoelectric valve dispenser, and after solidification, the first convex lens 21 of the semi-ellipsoidal convex lens is formed on the surface of the PCB 1; then spraying shading glue to the top end of the first convex lens 21 through a ceramic piezoelectric valve dispenser, forming a second convex lens 22 of a plate ellipsoidal convex lens on the surface of the first convex lens 21 after the shading glue is cured, and covering the outer surface of the top end of the first convex lens 21 with the second convex lens 22; the light emitted by the Mini LED chip in the Mini LED lamp bead 2 is diffused by the first convex lens 21, so that the light emitting angle is enlarged; after light emitted from the surface of the top end of the first convex lens 21 covered by the second convex lens 22 is scattered and shielded by the second convex lens 22, the light intensity at the top end of the Mini LED lamp bead 2 is weakened, so that the light intensity irradiated on the diffusion sheet is more uniform, and the backlight module emits light uniformly;
the first convex lens 21 is formed by curing transparent glue; the second convex lens 22 is made of transparent adhesive and TiO2Mixing and curing the powder; the viscosity of the transparent glue used as the raw materials of the first convex lens 21 and the second convex lens 22 is 4000-23000 Pa.s; TiO of the second convex lens 222The powder concentration is 0.5-10%(ii) a When the Mini LED chip in the Mini LED lamp bead 2 emits light, the light intensity at the top end is strong; the light entering the second convex lens 22 passes through the TiO in the second convex lens 222The particles are absorbed after reflection, and the light intensity at the top end of the Mini LED lamp bead 2 is weakened; so that the backlight module emits light uniformly;
the distance between every two adjacent Mini LED lamp beads 2 is 6-36 mm, and the size of a Mini LED chip in each Mini LED lamp bead 2 is 50-300 mu m;
the distance between the top end of the first convex lens 21 and the upper surface of the PCB board 1 is 0.7-1.1 mm, and the diameter of the first convex lens 21 is 2.5-3.6 mm;
the distance between the top end of the second convex lens 22 and the upper surface of the PCB board 1 is 0.71-1.2 mm, and the diameter of the second convex lens 22 is 0.5-4.5 mm; the light mixing height OD of the backlight module is 3-12 mm;
a method for manufacturing a backlight module for increasing the light-emitting angle of a Mini LED comprises the following steps:
step one, PCB loading: mounting the PCB on a conveyor through a carrier;
step two, printing: the conveyor conveys the carrier carrying the PCB into a screen printing machine, the screen printing machine positions the PCB, the fluorescent ink is brushed on the edge of the PCB, and then baking and curing are carried out;
the conveyor conveys the carrier of the PCB with the cured fluorescent ink into a solder paste printer, and after the solder paste printer positions the PCB, a steel mesh is pressed down onto the PCB; the solder paste on the steel mesh is brushed on the steel mesh through a brush, penetrates through the holes of the steel mesh and covers the bonding pad on the upper surface of the PCB;
step three, SPI detection: the printed PCB is contrasted and detected through an SPI detection database of a solder paste detection machine; the qualified PCB board is sent into the step four by a conveyor; the PCB which detects the unqualified solder paste is returned to the second step after being cleaned with the solder paste;
step four, pasting the patch: the conveyor sends the PCB qualified through SPI detection into a chip mounter, and a chip mounter suction nozzle accurately places the Mini LED chip and the support frame on a corresponding bonding pad of the PCB;
step five, AOI optical detection: the conveyor sends the PCB after being pasted with the patches to an AOI optical detection machine, the AOI optical detection machine detects the Mini LED chip, the support frame, the position of the corresponding bonding pad and the front and back of the Mini LED chip on the PCB, and the PCB which is qualified in the detection is sent to the sixth step; detecting that the unqualified PCB takes down the Mini LED chip and the support frame with wrong positions, reprocessing the solder pad solder paste on the PCB, and performing surface mounting and AOI optical detection again;
step six, reflow soldering: the conveyor conveys the PCB loaded with the Mini LED chip and the support frame into a reflow furnace, and after reflow soldering, the Mini LED chip and the support frame are both soldered on corresponding positions of the PCB;
step seven, detection and repair: the PCB welded with the Mini LED chip and the support frame is sequentially subjected to AOI optical detection to detect the welding appearance of the Mini LED chip and the support frame, a low-current testing machine tests the circuit on-off condition of the PCB, and the qualified PCB enters the step eight; detecting abnormal positions of unqualified PCB boards, and replacing or re-welding the Mini LED chip and the support frame;
step eight, dispensing and baking: the conveyor conveys the PCB to a ceramic piezoelectric valve dispenser, and the ceramic piezoelectric valve dispenser sprays transparent glue to the surface of the Mini LED chip; then, the PCB is sent into an oven, and the transparent glue is cured and baked to form a first convex lens;
step nine, secondary dispensing and baking: sending the PCB cured to form the first convex lens into a ceramic piezoelectric valve dispenser again, and spraying shading glue on the top surface of the first lens by the ceramic piezoelectric valve dispenser; then, the PCB is sent into a baking oven, and the mixed glue solution is cured and baked to form a second convex lens;
step ten, optical evaluation: sending the PCB into a luminance instrument, connecting working voltage and working current to the PCB, testing the overall optical characteristics of the lamp beads on the PCB, and recording the overall optical characteristics on the label paper in the step twelve;
eleventh, pasting a reflector plate: attaching a reflector plate with a matched size to the upper surface of the PCB;
step twelve, appearance inspection and packaging: carrying out appearance inspection on the PCB, putting the PCB qualified in detection into a packaging bag for sealing and packaging, and pasting note paper on the outer surface of the packaging bag;
under the same working driving current and voltage conditions, the light distribution curves of the Mini LED chip without the convex lens on the PCB and the Mini LED lamp bead on the PCB are respectively shown in fig. 4 and 5;
as shown in fig. 4, in the Mini LED chip without the convex lens, the light emitting angle of 50% of the total light intensity is about 110 °, and the light emitting angle of 10% of the total light intensity is about 160 °;
as shown in fig. 5, the Mini LED lamp bead with the first convex lens and the second convex lens added has a light emitting angle of about 165 ° for 50% of the total light intensity, and a light emitting angle of about 180 ° for 10% of the total light intensity;
in the single Mini LED lamp bead in the backlight module, the light emitting angle of 50% of the total light intensity is about 165 degrees, compared with the light emitting angle of 110 degrees of a Mini LED chip without a convex lens, the light emitting angle is larger, the light emitting is more uniform, the light mixing distance OD is reduced, and the ultrathin backlight module is realized;
as shown in FIGS. 6 to 8, the uniformity test: under the condition of ensuring certain input current and voltage, the uniformity of 9 points of the backlight module is measured to be 80% by adopting 9-point comparison through a UL-10 luminance meter.
The working principle of the invention is as follows:
the invention is characterized in that a support frame is arranged on the upper surface of a PCB and is welded on the upper surface of the PCB through soldering tin; the driving module is welded on the surface of the PCB and is positioned on the upper surface or the lower surface of the PCB; the Mini LED lamp bead is arranged on the upper surface of the PCB and comprises a Mini LED chip, a first convex lens and a second convex lens, and the Mini LED chip is welded on a lamp bead bonding pad on the upper surface of the PCB; the PCB is wrapped in the first convex lens, the first convex lens is in an ellipsoidal shape, the top end of the first convex lens is provided with a second convex lens, and the second convex lens is in an ellipsoidal shape;
the defect of color cast is easy to occur in the display above the splicing joint of two adjacent PCBs, so that the upper surface of the joint of the PCBs is covered by fluorescent ink, the fluorescent ink is used for absorbing partial blue light emitted by the Mini LED lamp beads, the light mixing ratio of the blue light above the joint of the PCBs and red light and green light which are excited out of the quantum dot film is adjusted, and the light emitting uniformity of the backlight module is improved;
brushing tin paste on a Mini LED chip bonding pad and a support bonding pad on the upper surface of the PCB through steel mesh printing, then placing the Mini LED chip and the support frame on the surface of the PCB, and welding the Mini LED chip and the support frame on the upper surface of the PCB in a reflow soldering mode; in the prior art, the support frame is adhered to the upper surface of the PCB through the viscose, so that the adhesion strength is low, and a plurality of working procedures are needed; the support frame and the Mini LED chip are welded on the upper surface of the PCB together through the solder paste, so that the process steps are shortened, the productivity is improved, and the production cost is reduced;
light emitted by a Mini LED chip in the Mini LED lamp bead is diffused by the first convex lens, so that the light emitting angle is enlarged; after light emitted from the surface of the top end of the first convex lens covered by the second convex lens is scattered and shielded by the second convex lens, the light intensity at the top end of the Mini LED lamp bead is weakened, so that the light intensity irradiated on the diffusion sheet is more uniform, and the backlight module emits light uniformly;
when the Mini LED chip in the Mini LED lamp bead emits light, the light intensity at the top end is strong; the light entering the second convex lens passes through the TiO in the second convex lens2The particles are absorbed after reflection, and the light intensity at the top end of the Mini LED lamp bead is weakened; so that the backlight module emits light uniformly;
according to the single Mini LED lamp bead in the backlight module, the light emitting angle of 50% of total light intensity is about 165 degrees, compared with the light emitting angle of 110 degrees of a Mini LED chip without a convex lens, the light emitting angle is larger, light emitting is more uniform, the light mixing distance OD is reduced, and the ultrathin backlight module is realized.
The invention provides a backlight module for increasing the light-emitting angle of a Mini LED and a manufacturing method thereof, and the backlight module has the characteristics of large light-emitting angle, uniform light emission, shortened process steps, improved productivity, reduced production cost and low light mixing distance. The invention has the beneficial effects that: the defect of color cast is easy to occur in the display above the splicing joint of two adjacent PCBs, so that the upper surface of the joint of the PCBs is covered by fluorescent ink, the fluorescent ink is used for absorbing partial blue light emitted by the Mini LED lamp beads, the light mixing ratio of the blue light above the joint of the PCBs and red light and green light which are excited out of the quantum dot film is adjusted, and the light emitting uniformity of the backlight module is improved;
brushing tin paste on a Mini LED chip bonding pad and a support bonding pad on the upper surface of the PCB through steel mesh printing, then placing the Mini LED chip and the support frame on the surface of the PCB, and welding the Mini LED chip and the support frame on the upper surface of the PCB in a reflow soldering mode; in the prior art, the support frame is adhered to the upper surface of the PCB through the viscose, so that the adhesion strength is low, and a plurality of working procedures are needed; the support frame and the Mini LED chip are welded on the upper surface of the PCB together through the solder paste, so that the process steps are shortened, the productivity is improved, and the production cost is reduced;
light emitted by a Mini LED chip in the Mini LED lamp bead is diffused by the first convex lens, so that the light emitting angle is enlarged; after light emitted from the surface of the top end of the first convex lens covered by the second convex lens is scattered and shielded by the second convex lens, the light intensity at the top end of the Mini LED lamp bead is weakened, so that the light intensity irradiated on the diffusion sheet is more uniform, and the backlight module emits light uniformly;
when the Mini LED chip in the Mini LED lamp bead emits light, the light intensity at the top end is strong; the light entering the second convex lens passes through the TiO in the second convex lens2The particles are absorbed after reflection, and the light intensity at the top end of the Mini LED lamp bead is weakened; so that the backlight module emits light uniformly;
according to the single Mini LED lamp bead in the backlight module, the light emitting angle of 50% of total light intensity is about 165 degrees, compared with the light emitting angle of 110 degrees of a Mini LED chip without a convex lens, the light emitting angle is larger, light emitting is more uniform, the light mixing distance OD is reduced, and the ultrathin backlight module is realized.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.

Claims (9)

1. A backlight module for increasing the exit angle of a Mini LED comprises a PCB (printed circuit board) board (1), Mini LED lamp beads (2), a support frame (3) and a driving module (4), and is characterized in that;
the upper surface of the PCB (1) is provided with a support frame (3), and the support frame (3) is welded on the upper surface of the PCB (1) through soldering tin;
the surface of the PCB (1) is welded with a driving module (4), and the driving module (4) is positioned on the upper surface or the lower surface of the PCB (1);
the LED lamp comprises a PCB (1), and is characterized in that a Mini LED lamp bead (2) is arranged on the upper surface of the PCB (1), the Mini LED lamp bead (2) comprises a Mini LED chip, a first convex lens (21) and a second convex lens (22), and the Mini LED chip is welded on a lamp bead welding pad on the upper surface of the PCB (1); the PCB (1) is wrapped in the first convex lens (21), the first convex lens (21) is in an ellipsoid shape, the second convex lens (22) is arranged at the top end of the first convex lens (21), and the second convex lens (22) is in an ellipsoid shape.
2. The backlight module for increasing the light-emitting angle of the Mini LED as claimed in claim 1, wherein the back of the PCB (1) is fixed on the back plate, and a reflective sheet, a diffusion plate, a quantum dot film, a prism sheet and a liquid crystal screen are placed above the PCB (1).
3. The backlight module for increasing the light-emitting angle of the Mini LED as claimed in claim 1, wherein the backlight module comprises a plurality of PCB boards (1), and the edges of two adjacent PCB boards (1) are spliced and fixed on the back plate; the upper surfaces of two adjacent PCB boards (1) at the splicing seam are coated with fluorescent ink, and the fluorescent ink is coated on the upper surfaces of the PCB boards (1) in a spraying or brushing way; the upper reflecting sheet of the fluorescent ink covering part of the PCB (1) is hollowed.
4. The backlight module for increasing the light-emitting angle of the Mini LED as claimed in claim 1, wherein the first convex lens (21) is formed by spraying glue on the surface of the Mini LED chip by a ceramic piezoelectric valve dispenser, and after curing, forming the first convex lens (21) of the semi-ellipsoidal convex lens on the surface of the PCB (1); and then, spraying shading glue to the top end of the first convex lens (21) through a ceramic piezoelectric valve glue dispenser, forming a second convex lens (22) of the ellipsoidal convex lens on the surface of the first convex lens (21) after the shading glue is cured, and covering the outer surface of the top end of the first convex lens (21) by the second convex lens (22).
5. The backlight module for increasing the light-emitting angle of a Mini LED as claimed in claim 1, wherein the first convex lens (21) is formed by curing a transparent glue; the second convex lens (22) is made of transparent adhesive and TiO2Mixing and curing the powder; the viscosity of the transparent glue used as the raw materials of the first convex lens (21) and the second convex lens (22) is 4000-23000 Pa & s; TiO of the second convex lens (22)2The powder concentration is 0.5-10%.
6. The backlight module for increasing the light-emitting angle of the Mini LED as claimed in claim 1, wherein the bottom surface of the support frame (3) is provided with a bonding pad, and the bonding pad on the bottom surface of the support frame (3) is matched with the supporting bonding pad arranged on the upper surface of the PCB (1).
7. The backlight module for increasing the light-emitting angle of the Mini LED as claimed in claim 1, wherein the distance between adjacent Mini LED lamp beads (2) is 6-36 mm, and the size of the Mini LED chip in the Mini LED lamp bead (2) is 50-300 μm;
the distance between the top end of the first convex lens (21) and the upper surface of the PCB (1) is 0.7-1.1 mm, and the diameter of the first convex lens (21) is 2.5-3.6 mm.
8. The backlight module for increasing the light-emitting angle of a Mini LED as claimed in claim 1, wherein the distance between the top end of the second convex lens (22) and the upper surface of the PCB (1) is 0.71-1.2 mm, and the diameter of the second convex lens (22) is 0.5-4.5 mm; the light mixing height OD of the backlight module is 3-12 mm.
9. A method for manufacturing a backlight module for increasing the light-emitting angle of a Mini LED is characterized by comprising the following steps:
step one, PCB loading: mounting the PCB on a conveyor through a carrier;
step two, printing: the conveyor conveys the carrier carrying the PCB into a screen printing machine, the screen printing machine positions the PCB, the fluorescent ink is brushed on the edge of the PCB, and then baking and curing are carried out;
the conveyor conveys the carrier of the PCB with the cured fluorescent ink into a solder paste printer, and after the solder paste printer positions the PCB, a steel mesh is pressed down onto the PCB; the solder paste on the steel mesh is brushed on the steel mesh through a brush, penetrates through the holes of the steel mesh and covers the bonding pad on the upper surface of the PCB;
step three, SPI detection: the printed PCB is contrasted and detected through an SPI detection database of a solder paste detection machine; the qualified PCB board is sent into the step four by a conveyor; the PCB which detects the unqualified solder paste is returned to the second step after being cleaned with the solder paste;
step four, pasting the patch: the conveyor sends the PCB qualified through SPI detection into a chip mounter, and a chip mounter suction nozzle accurately places the Mini LED chip and the support frame on a corresponding bonding pad of the PCB;
step five, AOI optical detection: the conveyor sends the PCB after being pasted with the patches to an AOI optical detection machine, the AOI optical detection machine detects the Mini LED chip, the support frame, the position of the corresponding bonding pad and the front and back of the Mini LED chip on the PCB, and the PCB which is qualified in the detection is sent to the sixth step; detecting that the unqualified PCB takes down the Mini LED chip and the support frame with wrong positions, reprocessing the solder pad solder paste on the PCB, and performing surface mounting and AOI optical detection again;
step six, reflow soldering: the conveyor conveys the PCB loaded with the Mini LED chip and the support frame into a reflow furnace, and after reflow soldering, the Mini LED chip and the support frame are both soldered on corresponding positions of the PCB;
step seven, detection and repair: the PCB welded with the Mini LED chip and the support frame is sequentially subjected to AOI optical detection to detect the welding appearance of the Mini LED chip and the support frame, a low-current testing machine tests the circuit on-off condition of the PCB, and the qualified PCB enters the step eight; detecting abnormal positions of unqualified PCB boards, and replacing or re-welding the Mini LED chip and the support frame;
step eight, dispensing and baking: the conveyor conveys the PCB to a ceramic piezoelectric valve dispenser, and the ceramic piezoelectric valve dispenser sprays transparent glue to the surface of the Mini LED chip; then, the PCB is sent into an oven, and the transparent glue is cured and baked to form a first convex lens;
step nine, secondary dispensing and baking: sending the PCB cured to form the first convex lens into a ceramic piezoelectric valve dispenser again, and spraying shading glue on the top surface of the first lens by the ceramic piezoelectric valve dispenser; then, the PCB is sent into a baking oven, and the mixed glue solution is cured and baked to form a second convex lens;
step ten, optical evaluation: sending the PCB into a luminance instrument, connecting working voltage and working current to the PCB, testing the overall optical characteristics of the lamp beads on the PCB, and recording the overall optical characteristics on the label paper in the step twelve;
eleventh, pasting a reflector plate: attaching a reflector plate with a matched size to the upper surface of the PCB;
step twelve, appearance inspection and packaging: and (4) carrying out appearance inspection on the PCB, putting the PCB qualified in detection into a packaging bag for sealing and packaging, and pasting note paper on the outer surface of the packaging bag.
CN202110946479.8A 2021-08-18 2021-08-18 Backlight module for increasing Mini LED light-emitting angle and manufacturing method thereof Pending CN113721386A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114942546A (en) * 2022-05-31 2022-08-26 深圳市宏普欣电子科技有限公司 Mini LED backlight module with large light-emitting angle
CN115308947A (en) * 2022-08-15 2022-11-08 深圳市南极光电子科技股份有限公司 Backlight module applied to Mini LED and assembling method thereof
CN116731555A (en) * 2023-05-23 2023-09-12 惠州市炬能量电子科技有限公司 Fluorescent ink applied to MiniLED, miniLED module and use method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102011952A (en) * 2009-09-04 2011-04-13 佛山市国星光电股份有限公司 Method for making LED (Light Emitting Diode) light resource module and product made by the method
US20150192278A1 (en) * 2013-07-04 2015-07-09 Boe Technology Group Co., Ltd. Led support, led and backlight module
CN209624949U (en) * 2019-03-21 2019-11-12 深圳Tcl新技术有限公司 A kind of liquid crystal display die set and its display device
CN212255964U (en) * 2020-06-30 2020-12-29 惠州视维新技术有限公司 Lamp bead, backlight module and display device
CN212694219U (en) * 2020-08-18 2021-03-12 深圳市康冠科技股份有限公司 Mini-LED backlight module and display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102011952A (en) * 2009-09-04 2011-04-13 佛山市国星光电股份有限公司 Method for making LED (Light Emitting Diode) light resource module and product made by the method
US20150192278A1 (en) * 2013-07-04 2015-07-09 Boe Technology Group Co., Ltd. Led support, led and backlight module
CN209624949U (en) * 2019-03-21 2019-11-12 深圳Tcl新技术有限公司 A kind of liquid crystal display die set and its display device
CN212255964U (en) * 2020-06-30 2020-12-29 惠州视维新技术有限公司 Lamp bead, backlight module and display device
CN212694219U (en) * 2020-08-18 2021-03-12 深圳市康冠科技股份有限公司 Mini-LED backlight module and display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114942546A (en) * 2022-05-31 2022-08-26 深圳市宏普欣电子科技有限公司 Mini LED backlight module with large light-emitting angle
CN115308947A (en) * 2022-08-15 2022-11-08 深圳市南极光电子科技股份有限公司 Backlight module applied to Mini LED and assembling method thereof
CN116731555A (en) * 2023-05-23 2023-09-12 惠州市炬能量电子科技有限公司 Fluorescent ink applied to MiniLED, miniLED module and use method thereof

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