CN212255964U

CN212255964U - Lamp bead, backlight module and display device

Info

Publication number: CN212255964U
Application number: CN202021250371.2U
Authority: CN
Inventors: 付文静; 李泽龙
Original assignee: Huizhou Shiwei New Technology Co Ltd
Current assignee: Huizhou Shiwei New Technology Co Ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2020-12-29
Anticipated expiration: 2030-06-30
Also published as: WO2022001048A1

Abstract

The utility model discloses a lamp pearl, backlight unit and display device. The lamp bead comprises a support, a light-emitting chip, a packaging layer and a light ray adjusting layer; the bracket is provided with a containing groove; the light-emitting chip is arranged at the bottom of the accommodating groove; the packaging layer fills the accommodating groove and wraps the light-emitting chip; the light ray adjusting layer is arranged on the outer surface of the packaging layer so as to reflect part of light rays emitted by the light emitting chip and transmit part of the light rays; the thickness of the light ray adjusting layer gradually decreases from the middle part to the edge. The utility model discloses technical scheme sets up the light regulation layer through the surface at the encapsulated layer, and this light regulation layer can reflect the partial light that sends the luminescence chip, can realize having increased the effect of the light-emitting angle of light.

Description

Lamp bead, backlight module and display device

Technical Field

The utility model relates to a display device technical field, in particular to lamp pearl, use backlight unit of this lamp pearl and use this backlight unit's display device.

Background

The backlight mode of the liquid crystal television is mainly of a side-in type and a direct type. The lateral backlight mode mainly places a light source at the lateral side, so that the liquid crystal television can be thinned, but cannot realize more partition control; the direct type backlight mode is mainly characterized in that a light source is arranged at the bottom of the back plate, but because the light emitting angle of a traditional LED (light emitting diode) lamp is generally small, the distance between two adjacent LED lamps cannot be too large, so that a better light emitting effect can be realized only by arranging more LED lamps, and the production cost is improved.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a lamp pearl aims at improving the less problem of luminous angle.

In order to achieve the above purpose, the utility model provides a lamp bead, which comprises a bracket, a light emitting chip, a packaging layer and a light adjusting layer; the bracket is provided with a containing groove; the light-emitting chip is arranged at the bottom of the accommodating groove; the packaging layer fills the accommodating groove and wraps the light-emitting chip; the light ray adjusting layer is arranged on the outer surface of the packaging layer so as to reflect part of light rays emitted by the light emitting chip and transmit part of the light rays; the thickness of the light ray adjusting layer is gradually decreased from the middle to the edge.

Optionally, the light ray adjusting layer includes a connecting portion and a plurality of reflective particles disposed in the connecting portion, the connecting portion is connected to the outer surface of the encapsulation layer, and the thickness of the connecting portion gradually decreases from the middle portion to the edge.

Optionally, the top surface of the encapsulation layer includes a central portion and an edge portion disposed at an edge of the central portion, and the light ray adjustment layer at least covers the central portion.

Optionally, the light regulating layer covers only the central portion.

Optionally, the light emitting chip is arranged at the center of the bottom of the accommodating groove, and the light adjusting layer is of a symmetrical structure relative to the central axis of the accommodating groove.

Optionally, the support is a transparent support; and/or the packaging layer is a transparent packaging layer; and/or the top surface of the packaging layer is in a cambered surface.

Optionally, the cambered edge of the encapsulation layer abuts against the bracket.

Optionally, the arc surface protrudes from the top of the bracket.

The utility model also provides a backlight module, which comprises a circuit board, a reflecting layer, a diffusion plate, an optical membrane and the lamp bead, wherein the lamp bead and the reflecting layer are arranged on the same side of the circuit board, and the light-emitting chip is electrically connected with the circuit board; the diffuser plate is located the lamp pearl deviates from one side of circuit board, the optics diaphragm is located the diffuser plate deviates from one side of lamp pearl.

The utility model also provides a display device, including foretell backlight unit.

The utility model discloses technical scheme has seted up the storage tank on through the support, and luminous chip locates holding tank bottom, packaging layer packing storage tank and parcel luminous chip, then can have better protection effect to the luminous chip of locating in the storage tank, and can also guarantee that the light that luminous chip sent can shine away through the opening of storage tank. Further, through setting up the light regulation layer at the surface of packaging layer, and this light regulation layer can reflect the partial light that sends the luminescence chip, transmits another partial light that sends the luminescence chip, makes the place outside the light-emitting angle that the luminescence chip originally also have the light to jet out to make the light-emitting angle of lamp pearl great. Furthermore, the thickness of the light ray adjusting layer is gradually reduced from the middle to the edge, so that the effect of reducing the brightness of the middle of the lamp bead and enabling the brightness of the lamp bead in each direction to be uniform as much as possible is achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural view of an embodiment of the lamp bead of the present invention;

FIG. 2 is a schematic structural view of a bracket in a lamp bead of the present invention;

fig. 3 is a schematic structural diagram of an embodiment of the backlight module of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Lamp bulb	110	Support frame
111	Containing groove	120	Light emitting chip
				130	Encapsulation layer	131	Spherical surface
1301	Center part	1302	Edge part
				140	Light regulating layer	141	Connecting part
142	Reflective particles	200	Circuit board
				300	Diffusion plate	400	Optical film
500	Support column

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a lamp pearl 100.

In the embodiment of the present invention, please refer to fig. 1 and fig. 2 in combination, the lamp bead 100 includes a bracket 110, a light emitting chip 120, a packaging layer 130 and a light adjusting layer 140; the bracket 110 is provided with a containing groove 111; the light emitting chip 120 is disposed at the bottom of the accommodating groove 111; the encapsulation layer 130 fills the receiving groove 111 and wraps the light emitting chip 120; the light ray adjusting layer 140 is disposed on an outer surface of the encapsulation layer 130 to reflect a part of light rays emitted by the light emitting chip 120 and transmit a part of light rays; the thickness of the light adjusting layer 140 is gradually decreased from the middle to the edge.

The accommodating groove 111 is formed on the bracket 110, the light emitting chip 120 is disposed at the bottom of the accommodating groove 111, and the packaging layer 130 fills the accommodating groove 111 and wraps the light emitting chip 120, so that the light emitting chip 120 can be protected. Specifically, the shape of the receiving groove 111 may not be limited. In order to have a better light emitting effect, the receiving groove 111 may be cylindrical or truncated cone-shaped. Further, the bottom width of the receiving groove may be smaller than the opening width thereof, so that the bottom thickness of the bracket 110 is large, the supporting strength of the bracket 110 is enhanced, and the stability of the light emitting chip 120 and the encapsulation layer 130 in the receiving groove is ensured. In addition, the width of the bottom of the accommodating groove is smaller than the width of the opening, and the encapsulation layer 130 is located on the side of the light emitting chip 120 facing the opening of the accommodating groove, so that the encapsulation layer 130 can more completely cover the light emitting surface of the light emitting chip 120, and can ensure that the light emitting angle of the light emitting chip 120 after passing through the encapsulation layer 130 is larger. The light emitting chip 120 may be a light emitting diode chip, such as an LED chip, an OLED chip, or the like, which can emit light by being energized.

Further, the light adjusting layer 140 is disposed on the outer surface of the package layer 130, so that the light emitted from the light emitting chip 120 passes through the package layer 130 and then passes through the light adjusting layer 140 to adjust the emergent light. The utility model discloses light adjustment layer 140 among the technical scheme can reflect the partial light that sends luminescence chip 120, and partial light transmits, makes to increase the light-emitting angle of light when making in the light that light adjustment layer 140 sent luminescence chip 120 reflect, and then has realized the effect of great light-emitting angle. Specifically, in order to ensure that the light adjusting layer 140 can achieve the effects of reflection and transmission, the light adjusting layer 140 may have a transparent layer connected to the encapsulation layer 130 and a reflective structure disposed on the transparent layer, where the reflective structure may be a tiny reflective sheet or reflective particles 142, or the surface of the light adjusting layer 140 may be a rough structure to achieve the effects of reflection and transmission at the same time. When the minute reflective sheet or reflective particles 142 are disposed in the light-transmitting layer, light emitted from the light-emitting chip 120 and passing through the minute reflective sheet or reflective particles 142 is emitted, and light not passing through the minute reflective sheet or reflective particles 142 directly passes through the light-transmitting layer. Wherein the reflective particles 142 may be SiO₂、TiO₂Or other reflective particles 142.

It can be understood that, when the light emitting chip 120 is disposed at the bottom of the receiving groove 111, it is usually disposed at the center of the bottom or near the center, so the light intensity at the middle of the lamp bead 100 is generally stronger. The utility model discloses the thickness through with light regulation layer 140 among the technical scheme is steadilyd decrease gradually by the direction at middle part to edge, then can reduce the luminance at lamp pearl 100 middle parts, makes the light of lamp pearl 100 each direction comparatively even as far as possible. The utility model discloses emitting chip 120 among the technical scheme is LED chip (emitting diode) or other light emitting sources, and wherein when emitting chip 120 is the LED chip, it can be blue light LED chip, ruddiness LED chip or other light LED chips etc..

The utility model discloses technical scheme has seted up storage tank 111 on through support 110, and luminous chip 120 locates storage tank 111 bottom, packaging layer 130 and fills storage tank 111 and parcel luminous chip 120, then can have better protection effect to the luminous chip 120 of locating in storage tank 111, and can also guarantee that the light that luminous chip 120 sent can shine away through the opening of storage tank 111. Further, through setting up light regulation layer 140 at the surface of packaging layer 130, and this light regulation layer 140 can reflect the partial light that sends emitting chip 120, transmits another partial light that emitting chip 120 sent, makes that emitting chip 120 originally the place other than the light-emitting angle also has the light to jet out to make the luminous angle of lamp pearl 100 great. Further, the thickness of the light adjusting layer 140 is gradually decreased from the middle to the edge, so that the brightness of the middle of the lamp bead 100 is reduced, and the brightness of the lamp bead 100 in all directions is uniform as much as possible.

Further, as shown in fig. 1, the light adjusting layer 140 includes a connection portion 141 and a plurality of reflective particles 142, the connection portion 141 is connected to the outer surface of the encapsulation layer 130, and the thickness of the connection portion 141 gradually decreases from the middle to the edge; the plurality of reflective particles 142 are uniformly dispersed in the connection part 141.

By disposing the plurality of reflective particles 142 uniformly dispersed inside the connection portion 141 and connecting the connection portion 141 to the outer surface of the package layer 130, a part of the light passing through the package layer 130 can directly penetrate through the connection portion 141, and another part of the light passes through the reflective particles 142 and then is reflected, thereby increasing the light-emitting angle. The plurality of reflective particles 142 are uniformly dispersed, so that the reflected light when the light passes through the light adjusting layer 140 is uniform, the brightness of the light is uniformly adjusted by the whole light adjusting layer 140, and a good light emitting effect is ensured. Specifically, mode such as connecting portion 141 accessible bonding or magnetism are inhaled is connected in the surface of encapsulating layer 130, the utility model discloses as long as guarantee that connecting portion 141 can connect in the surface of encapsulating layer 130 among the technical scheme can.

It is understood that, in order to achieve the effect that a part of light can penetrate through the encapsulation layer 130 and the light adjustment layer 140, the connection portions 141 of the encapsulation layer 130 and the light adjustment layer 140 are made of light-transmitting materials, wherein the encapsulation layer 130 and the connection portions 141 can be made of transparent materials, or the encapsulation layer 130 and/or the connection portions 141 can be made of semitransparent materials, as long as the encapsulation layer 130 and the connection portions 141 can transmit light. Specifically, in order to realize the laminating effect of connecting portion 141 and encapsulating layer 130, the utility model provides an embodiment: after dispensing the encapsulant layer 130, pre-baking is performed, then the material of the connection portion 141 is injected onto the surface of the encapsulant layer 130 by using a mold, and finally baking is performed to bond the encapsulant layer 130 and the connection portion 141. Furthermore, in order to make the connection portion 141 be able to better adhere to the package layer 130, the connection portion 141 in this embodiment may be made of the same material as the package layer 130.

Further, in order to have better luminance, the utility model discloses technical scheme in encapsulating layer 130 be transparent encapsulating layer 130. Specifically, the material of the encapsulation layer 130 may be transparent glue such as silica gel or epoxy resin glue.

Of course, the connection portion 141 may also be a transparent connection portion 141, which may be made of the same material as the encapsulation layer 130.

In order to further improve light-emitting angle and light-emitting luminance, the utility model discloses transparent support 110 also can be chooseed for use to support 110 among the technical scheme. Therefore, when the light reflected by the light adjusting layer 140 passes through the bracket 110, the light can also directly pass through the bracket 110 to emit light, and the light emitting angle is increased. The transparent bracket 110 may be made of transparent PCT (poly (1, 4-cyclohexanedimethanol terephthalate)) material, transparent PPA (polyphosphoric acid), EMC (epoxy resin injection molding compound), SMC (sheet molding compound), BT (synthesized from bismaleimide and cyanate ester resin), and the like, and of course, a high-hardness transparent material such as glass fiber and the like may be added to the materials to improve the hardness of the bracket 110, so that the bracket 110 has a better supporting effect and does not affect the light transmission effect.

Further, as shown in fig. 1, in order to further improve the uniformity of light emission, in the present embodiment, the top surface of the encapsulation layer 130 includes a central portion 1301 and an edge portion 1302 disposed at the edge of the central portion 1301, and the light regulating layer 140 at least covers the central portion 1301.

The light regulating layer 140 covers at least the central portion 1301, the light regulating layer 140 may cover only the central portion 1301, or the light regulating layer 140 may cover both the central portion 1301 and the edge portion 1302. It can be understood that the light passing through the edge of the encapsulation layer 130 is weaker than the light passing through the middle of the encapsulation layer 130, and therefore, optionally, the light adjusting layer 140 may only cover the central portion 1301, but not the edge portion 1302 of the encapsulation layer 130, and then a part of the light may directly pass through the edge portion 1302 of the encapsulation layer 130, thereby avoiding further weakening of the light intensity passing through the edge portion 1302 of the encapsulation layer 130, and achieving a better light output effect. It can be understood that the light ray adjusting layer 140 covers the central portion 1301 of the package layer 130, so that the light ray passing through the light ray adjusting layer 140 is slightly weaker, the difference between the light emitting brightness of the central portion 1301 and the light emitting brightness of the edge portion 1302 is reduced, and a more uniform light emitting effect is achieved. Of course, in other embodiments, if the light of the edge portion 1302 is still found to have a high brightness during the debugging process, the light adjusting layer 140 may also cover the entire outer surface of the packaging layer 130.

Further, as shown in fig. 1, the light emitting chip 120 is disposed at the center of the bottom of the accommodating groove 111, and the light adjusting layer 140 is symmetrical to the central axis of the accommodating groove 111.

By disposing the light emitting chip 120 at the center of the bottom of the receiving groove 111, the light emitted from the light emitting chip 120 through the opening of the receiving groove 111 is symmetrical. In addition, the light ray adjusting layer 140 is symmetrical with respect to the central axis of the receiving groove 111, so that the light rays emitted from the light ray adjusting layer 140 are symmetrical, and the light rays emitted from the light ray adjusting layer 140 are more uniform by combining the scheme that the thickness of the light ray adjusting layer 140 is gradually reduced from the middle to the edge.

Further, as shown in fig. 1, in the present embodiment, the top surface of the encapsulation layer 130 is an arc surface 131.

Cambered surface 131 is set to through the top surface with packaging layer 130, then can increase the light-emitting angle of light on the one hand, on the other hand still can carry out the spotlight to the light that emitting chip 120 sent for most light can jet out through packaging layer 130, has reduced light loss, has promoted the luminance of light-emitting, so, through promoting light-emitting angle and light-emitting luminance, then can reduce emitting chip 120's use quantity in backlight unit, production cost is reduced. Specifically, the arc surface 131 may be a spherical arc surface or other surfaces having an arc.

Further, as shown in fig. 1, the edge of the arc 131 of the encapsulation layer 130 abuts against the bracket 110.

With such an arrangement, the light emitted from the light emitting chip 120 needs to be emitted through the arc surface 131 of the encapsulation layer 130, so as to ensure a larger light emitting angle. In addition, the edge of the arc 131 of the encapsulation layer 130 abuts against the support 110, so that the connection between the encapsulation layer 130 and the support 110 can improve the good air tightness of the light emitting chip 120, and the light emitting chip 120 is protected well.

Further, as shown in fig. 1, the arc surface 131 is disposed to protrude from the top surface of the bracket 110.

With such an arrangement, the encapsulation layer 130 can completely cover the opening of the accommodating groove, so that on one hand, light emitted by the light emitting chip 120 is emitted through the arc surface 131 when passing through the opening of the accommodating groove, thereby increasing the emitting angle; on the other hand, the arc surface 131 protrudes from the top surface of the bracket 110, so that the distance from the arc surface 131 to the light emitting chip 120 is equal to the distance from the bracket 110 to the light emitting chip 120, thereby ensuring that the light emitted from all positions is uniform.

Of course, in other embodiments, the arc surface 131 may not protrude from the top surface of the bracket 110 for improving the central brightness.

The utility model discloses still provide a backlight unit, as shown in fig. 3, this backlight unit includes circuit board 200, reflection stratum, diffuser plate 300, optics diaphragm 400 and lamp pearl 100, and above-mentioned embodiment is referred to this lamp pearl 100's concrete structure, because this backlight unit has adopted all technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and here is no longer repeated one by one. The lamp bead 100 and the reflecting layer are arranged on the same side of the circuit board 200, and the light-emitting chip 120 is electrically connected with the circuit board 200; diffuser plate 300 is located lamp pearl 100 and is deviated from one side of circuit board 200, and optical diaphragm 400 is located diffuser plate 300 and is deviated from one side of lamp pearl 100.

The light emitting chip 120 is electrically connected to the circuit board 200, such that the on and off of the light emitting chip 120 can be controlled by the circuit board 200. The lamp beads 100 and the reflecting layer are arranged on the same side of the circuit board 200, so that light rays emitted by the lamp beads 100 can be reflected through the reflecting layer, and the utilization rate of the light rays is improved. Diffuser plate 300 is located lamp pearl 100 and deviates from one side of circuit board 200, and then the light that lamp pearl 100 sent can diffuse in order to realize breaing up luminous flux, the more even effect of light-emitting through diffuser plate 300. The optical film 400 includes one or more of a diffuser, a brightness enhancement sheet, a DBEF (brightness enhancement film), etc., to achieve the effect of adding light and/or changing the direction of polarization.

Specifically, the circuit board 200 may be an aluminum substrate or an FR4 board, the reflective layer may be a plate-shaped body, which may be attached to the circuit board 200, or the circuit board 200 may be further coated with a white reflective ink to form the reflective layer. Furthermore, a quantum dot film may be disposed between the diffusion plate 300 and the optical film 400 to improve the color gamut of the backlight module. For example, when the light emitting chip 120 is a blue LED chip, red quantum dots and green quantum dots may be disposed in the quantum dot film, and both the red quantum dots and the green quantum dots include one or more of iii-v group elements, ii-vi group elements, organic-inorganic hybrid perovskites, and all-inorganic perovskite cesium-lead halide quantum dot materials. Specifically, the compound composed of group III-V elements includes any one of CdSe, CaSe, SrSe, ZnSe, CdTe, MgTe, ZnTe, SrTe, MgSe, CaTe, BaSe, BaTe, ZnS, CaS, MgS, SrS, BaS and CdS; the second compound composed of II-VI elements comprises one of GaAs, GaN, GaP, InP, InN and InAs; organic materialsThe inorganic hybrid perovskite comprises CH₃NH₃PbX₃Wherein X ═ Cl, Br, I; the all-inorganic perovskite cesium lead halogen quantum dots comprise CsPbX₃Wherein X ═ Cl, Br, I. In addition, the size of the red quantum dot can be preferably 4 nm-10 nm, and the peak wavelength of the red light excited by the red quantum dot is 610 nm-650 nm; the green quantum dot size can be preferably 2 nm-7 nm, and the peak wavelength of the red light excited by the green quantum dot is 510 nm-560 nm.

A support column 500 can be arranged between the diffusion plate 300 and the reflection plate, and the surface of the support column 500 can be coated with reflective ink, so that light emitted by the lamp beads 100 can be further reflected, and the light emitted by the lamp beads 100 can be reflected to the diffusion plate 300 as much as possible. Specifically, the supporting column 500 may be cylindrical, conical, prismatic, or pyramidal, and the like, and in consideration of optical visual effect, the supporting column 500 may preferably have a conical surface or a pyramidal surface, so that on one hand, the cross-sectional area of the top end of the supporting column 500 is small, and a large dark black area is avoided at a position of the display screen of the display device corresponding to the supporting column 500; on the other hand, the side surface of the conical surface or the pyramid surface can better reflect the light emitted by the lamp bead 100 towards the diffusion plate 300, so that the utilization rate of the light is improved, and the display brightness of the display screen is improved.

The utility model discloses still provide a display device, this display device includes backlight unit, and this backlight unit's concrete structure refers to above-mentioned embodiment, because this display device has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, no longer gives unnecessary detail here.

The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A lamp bead, its characterized in that includes:

the bracket is provided with a containing groove;

the light-emitting chip is arranged at the bottom of the accommodating groove;

the packaging layer is filled in the accommodating groove and wraps the light-emitting chip; and

the light ray adjusting layer is arranged on the outer surface of the packaging layer and used for reflecting part of light rays emitted by the light emitting chip and transmitting part of the light rays; the thickness of the light ray adjusting layer is gradually decreased from the middle to the edge.

2. The lamp bead of claim 1, wherein the light regulating layer comprises a connecting portion and a plurality of reflective particles disposed in the connecting portion, the connecting portion is connected to an outer surface of the encapsulation layer, and a thickness of the connecting portion gradually decreases from a middle portion to an edge.

3. The lamp bead of claim 1, wherein the top surface of the encapsulation layer includes a central portion and an edge portion disposed at an edge of the central portion, and the light regulating layer covers at least the central portion.

4. The lamp bead of claim 3, wherein said light regulating layer covers only said central portion.

5. The lamp bead according to any one of claims 1 to 4, wherein the light emitting chip is disposed at the center of the bottom of the accommodating groove, and the light adjusting layer is symmetrical with respect to the central axis of the accommodating groove.

6. The lamp bead according to any one of claims 1-4, wherein the support is a transparent support;

and/or the packaging layer is a transparent packaging layer;

and/or the top surface of the packaging layer is in a cambered surface.

7. The lamp bead of claim 6, wherein the cambered edge of the encapsulation layer abuts the bracket.

8. The lamp bead of claim 6, wherein the arc surface protrudes from a top of the support.

9. A backlight module is characterized by comprising a circuit board, a reflecting layer, a diffusion plate, an optical membrane and the lamp bead as claimed in any one of claims 1 to 8, wherein the lamp bead and the reflecting layer are arranged on the same side of the circuit board, and the light-emitting chip is electrically connected with the circuit board; the diffuser plate is located the lamp pearl deviates from one side of circuit board, the optics diaphragm is located the diffuser plate deviates from one side of lamp pearl.

10. A display device comprising the backlight module according to claim 9.