CN113677148B - Self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate and preparation method and application thereof - Google Patents
Self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate and preparation method and application thereof Download PDFInfo
- Publication number
- CN113677148B CN113677148B CN202110767772.8A CN202110767772A CN113677148B CN 113677148 B CN113677148 B CN 113677148B CN 202110767772 A CN202110767772 A CN 202110767772A CN 113677148 B CN113677148 B CN 113677148B
- Authority
- CN
- China
- Prior art keywords
- mastoid
- area
- micro
- reinforced
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 230000003075 superhydrophobic effect Effects 0.000 title claims abstract description 35
- 238000007789 sealing Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 65
- 238000001816 cooling Methods 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 28
- 238000003491 array Methods 0.000 claims abstract description 23
- 238000011049 filling Methods 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract description 7
- 210000001595 mastoid Anatomy 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 230000008595 infiltration Effects 0.000 claims description 11
- 238000001764 infiltration Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 230000004048 modification Effects 0.000 claims description 7
- 238000012986 modification Methods 0.000 claims description 7
- 229910052755 nonmetal Inorganic materials 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000009832 plasma treatment Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 150000002843 nonmetals Chemical class 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 239000013043 chemical agent Substances 0.000 claims 1
- 238000009736 wetting Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 28
- 238000009835 boiling Methods 0.000 abstract description 18
- 230000008859 change Effects 0.000 abstract description 8
- 239000003507 refrigerant Substances 0.000 description 17
- 239000012071 phase Substances 0.000 description 11
- 238000012546 transfer Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000009466 transformation Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007385 chemical modification Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- 206010033799 Paralysis Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000004334 fluoridation Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000010862 gear shaping Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses a self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced cooling plate, wherein the surface of the reinforced cooling plate comprises a first area and a second area; the surface of the reinforced radiating plate in the first area is distributed with micro-mastoid arrays, the surface of the reinforced radiating plate in the second area is distributed with micro-mastoid arrays, and liquid metal is encapsulated in gaps of the micro-mastoid arrays; the contact area of the reinforced radiating plate and the heating device comprises a second area. The first area of the reinforced heat radiation plate comprises a large-area super-hydrophobic reinforced boiling structure, so that liquid-gas phase change can be obviously promoted, and the liquid cooling heat radiation performance is improved; the second area has a gap self-filling type close-contact function, so that the contact thermal resistance with a heating device can be greatly reduced, and the interface heat conduction efficiency is improved. Meanwhile, the reinforced heat dissipation plate has the advantages of low cost, convenience in assembly and disassembly, stable performance and simple preparation process, and has good application prospects in the fields of data center servers, space flight thermal control equipment, advanced power batteries and the like.
Description
Technical Field
The invention relates to the technical field of heat dissipation equipment. More particularly, it relates to a self-contact super-hydrophobic immersed phase-change liquid-cooled reinforced heat-dissipating plate.
Background
With the progress and development of the microelectronics industry, the cooling and heat dissipation requirements for devices with high heat generation density are increasing year by year, and the immersed phase-change liquid cooling technology has begun to replace the traditional air cooling means by means of air cooling, so that the immersion phase-change liquid cooling technology is expected to become a main heat dissipation mode in the fields of future data center servers (application publication numbers CN 104597994A and CN 106774741A), aerospace thermal control equipment (application publication numbers CN 110213934A and CN 112013427A), advanced power batteries (application publication numbers CN 110729526A and CN 111883876A) and the like.
The immersed phase-change liquid cooling is a heat dissipation technology for completely immersing a solid heating device (a heat source) into a liquid refrigerant medium (such as water, a fluorinated liquid and other refrigerants), and realizing cooling by means of latent heat absorption of liquid-gas phase change such as evaporation or boiling of the refrigerant medium, wherein the heat transfer per unit volume (namely heat dissipation efficiency) can be improved 3500 times compared with air cooling. However, to satisfy a high heat generation density (heat flux density 100W/cm 2 The above) cooling requirements of the device (application publication numbers CN 112188808A, CN 111352489A) still present a significant challenge.
The provision of enhanced heat sink components has proven to further enhance the submerged phase change liquid cooling energy efficiency, with plate-type components (which may be referred to collectively as "enhanced heat sink") being the most common. As the tie for connecting the heating device and the refrigerant medium, the bottom surface of the reinforced heat-dissipating plate is usually in direct contact with the heating device or forms a package, and other parts are completely immersed by the refrigerant medium, so that the phase-change liquid cooling is reinforced by guiding heat transfer and increasing heat exchange area. According to the principle, reducing the contact thermal resistance with the heating device and promoting the liquid-gas phase change of the refrigerant medium are the main stream design directions of the reinforced heat dissipation plate. However, the reinforced heat dissipation parts reported so far at most involve the use of sintered copper particle surfaces to enhance the boiling of the refrigerant (application publication number CN 107894823A), and the problem of contact thermal resistance of the heat generating device has not been focused, and the latter usually needs to rely on additionally added thermal interface materials (such as heat conductive silicone grease, heat conductive pad, heat conductive glue, heat conductive paste, phase change material, graphite flake, etc.). However, even the most advanced liquid metal thermal interface materials at present (application publication numbers CN 106929733A, CN 107052308A, CN 110330943A), the thermal conductivity fails to exceed 100W m - 1 K -1 Far lower than solid metal materials (e.g., copper with a thermal conductivity of about 400W m -1 K -1 ). Such peripheral thermal interfaces not only increase cost, but also present assembly difficulties and operational and maintenance risks: once the assembly process fails to completely exclude air at the contact interface (thermal conductivity of only about 0.024Wm -1 K -1 ) The thermal resistance is greatly increased, and the cooling and heat dissipation are blocked; once complex components (without conductive metal doped particles) in the thermal interface gradually run off into the refrigerant medium, the refrigerant property is destroyed, the liquid cooling energy efficiency is reduced, and the electronic device is also hidden from short circuit and even system paralysis. In addition, the existing sintered copper particle (application publication number CN 107894823A) reinforced heat dissipation scheme has the defects of complex working procedure, high energy consumption, limited actual processing area, lack of precise control on structure and morphology and the like.
Therefore, it is necessary to provide a reinforced heat dissipation plate which greatly reduces contact thermal resistance, improves interface heat conduction efficiency, and comprises a large-area super-hydrophobic reinforced boiling structure.
Disclosure of Invention
The invention aims to provide a self-sealing super-hydrophobic immersed phase-change liquid-cooling reinforced cooling plate, wherein a first area of the reinforced cooling plate comprises a large-area super-hydrophobic reinforced boiling structure, so that liquid-gas phase transformation can be remarkably promoted, and the liquid-cooling heat dissipation performance is improved; the second area has a gap self-filling type close-contact function, so that the contact thermal resistance with a heating device can be greatly reduced, and the interface heat conduction efficiency is improved.
The invention further aims at providing a preparation method of the self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate.
The invention also aims to provide an application of the self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate.
The immersed phase-change liquid cooling refers to that a heating device is completely immersed in a liquid refrigerant medium, and the low boiling point and high latent heat characteristics of the refrigerant medium are utilized, so that the liquid-gas phase-change latent heat absorption is utilized to continuously transfer heat during boiling, and the cooling effect is achieved.
The reinforced heat dissipation plate is a plate type heat dissipation part suitable for an immersed phase-change liquid cooling scene, is usually arranged between a heating device and a refrigerant medium, the bottom of the reinforced heat dissipation plate is in direct contact with the heating device or forms a package, other parts of the reinforced heat dissipation plate are completely immersed by the refrigerant medium, and the heat transfer area is increased by guiding heat transfer so as to promote the absorption of latent heat of liquid-gas phase change.
The prior art has high heating density (heat flux density 100W/cm) 2 Above) the immersed phase-change liquid cooling of the electronic device, the used enhanced heat dissipation component cannot achieve both contact heat conduction and phase-change heat transfer. Aiming at the technical defects, the invention provides the reinforced heat dissipation plate with the self-filling high-heat-conductivity close contact area and the large-area super-hydrophobic reinforced boiling structure, which combines the reduction of contact thermal resistance and the promotion of liquid-gas phase transformation, and provides a brand-new optimized solution for the submerged phase-change liquid-cooled reinforced heat dissipation.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the surface of the reinforced cooling plate comprises a first area and a second area; the surface of the reinforced radiating plate in the first area is distributed with micro-mastoid arrays, the surface of the reinforced radiating plate in the second area is distributed with micro-mastoid arrays, and liquid metal is encapsulated in gaps of the micro-mastoid arrays; the contact area of the reinforced radiating plate and the heating device comprises a second area.
The surface of the reinforced radiating plate comprises a first area and a second area, wherein the contact area of the reinforced radiating plate and the heating device comprises the second area. When the reinforced heat-dissipating plate is tightly assembled with the heating device, the inner packaging liquid metal which is solid at normal temperature is heated and melted, quickly and uniformly infiltrates and automatically completely fills the gap (eliminates air) at the interface, reduces contact thermal resistance, improves heat conduction efficiency, and ensures that the average temperature rate of solid-liquid phase change of the liquid metal in the second area is more than 1cm 2 And/s, to obtain a material (such as copper, thermal conductivity of about 400W m) close to the main material of the reinforced heat dissipation plate -1 K -1 ) Is a very high thermal conductivity; the micro mastoid arrays distributed in the first area can provide ultra-large area vaporization nucleation sites as an enhanced boiling structure, promote liquid-gas phase transformation and improve liquid cooling performance.
Preferably, the micrometric mastoid is cone-shaped or columnar;
preferably, the height of the micro mastoid is 5 μm to 500 μm, the equivalent diameter is 10 μm to 1000 μm, and the distance between adjacent micro mastoid is 10 μm to 1000 μm.
Preferably, the height of a single micrometric mastoid is 10 μm to 400 μm, the equivalent diameter is 30 μm to 800 μm, and the spacing between adjacent micrometric mastoid is 30 μm to 800 μm.
More preferably, the height of individual micrometric mastoid is 30 μm to 300 μm, the equivalent diameter is 50 μm to 500 μm, and the spacing between adjacent micrometric mastoid is 50 μm to 500 μm.
Further preferably, the height of individual micrometric mastoid is 50 μm to 200 μm, the equivalent diameter is 100 μm to 200 μm, and the spacing between adjacent micrometric mastoid is 100 μm to 200 μm.
The height of the micro mastoid in the invention determines the thickness of the liquid metal packaged in the micro mastoid array gap, and based on the process technology, the liquid metal with the thickness of 5-500 μm can be obtained, which is an ultrathin thickness which cannot be realized by the traditional thermal interface, so the material is saved, and the cost is lower.
The spacing between adjacent micro-mastoid is 10 μm to 1000 μm, which as will be appreciated by those skilled in the art, determines the size of the gaps in the array of micro-mastoid.
Preferably, the micro mastoid surface has a nano-pleat morphology;
the specific surface area of the micron mastoid with the nano-fold morphology is larger, the vaporization core is more, the bubble movement retardation is smaller, the boiling enhancement effect is stronger, the liquid-gas phase transformation is promoted, and the liquid cooling performance is improved.
Preferably, the thickness of the nano-folds is 5 nm-500 nm. For example, the thickness of the nano-folds includes, but is not limited to, 10nm to 400nm, 30nm to 300nm, or 10nm to 200nm, etc.
Preferably, the surface of the micro mastoid array has special wettability, wherein the surface of the micro mastoid in the first area is super-hydrophobic, and the adhesion force of the micro mastoid to submerged bubbles is less than 20 mu N so as to ensure that the phase-change bubbles are quickly separated; the super-hydrophilic liquid metal on the surface of the micro-mastoid in the second area has a static contact angle smaller than 10 degrees to liquid metal microdroplets in an air or oxygen-free environment, so that the liquid metal is very easy to uniformly spread into a thin layer after infiltrating the surface of the micro-mastoid array, and stable packaging of the liquid metal is ensured.
Preferably, a spacer is present between the first region and the second region. The isolation belt can prevent liquid metal in the second area from leaking to the first area along the gap.
Preferably, the micro-mastoid arrays distributed in the first region and the second region are different in size. The size of the micro-mastoid arrays in the first area mainly influences the enhanced boiling effect, the size of the micro-mastoid arrays in the second area mainly determines the contact thermal resistance between the enhanced heat dissipation plate and the heating device, and in the practical application process, the sizes of the micro-mastoid arrays distributed in the first area and the second area can be set according to the requirements, and the two sizes can be the same or different.
Preferably, the micro-mastoid arrays within the first region may have different sizes. One possible implementation is that the micro mastoid array of different portions in the first region may be sized differently and may be designed according to specific needs, without limitation in the art with respect to its specific form.
Preferably, the area of the contact area between the reinforced heat dissipation plate and the heat generating device is not smaller than the second area, that is, the area of the contact area between the reinforced heat dissipation plate and the heat generating device is larger than or equal to the second area, and the liquid metal must be located in the contact area entirely.
Preferably, the melting point of the liquid metal is higher than room temperature but lower than the steady operation temperature of the heat generating device; thus, the liquid metal is solid at normal temperature, and is converted into liquid at working state, and the gas is discharged to reduce thermal resistance and realize phase change heat absorption to realize rapid temperature uniformity, thus obtaining ultrahigh heat conduction efficiency.
Preferably, the liquid metal is selected from gallium, indium, tin, bismuth or alloys thereof, or doped mixtures thereof with other metals, oxides of other metals, non-metals or non-metal oxides; the other metal is selected from copper, aluminum, gold, silver, tungsten, rhodium or iridium, and the nonmetal is carbon or silicon.
Further preferably, the carbon includes, but is not limited to, diamond, graphene, carbon nanotubes, or the like.
The purpose of doping other substances in the liquid metal is to adjust the melting point of the liquid metal so that the liquid metal can meet the requirement of the liquid state at normal temperature and the liquid state at the working state. In order to match with heating devices with different operating temperatures, in practical application, the composition and the proportion of each element in the doping mixture are any composition and proportion meeting the requirements.
The liquid metal is doped with other substances only for adjusting the melting point, so that the cost is lower compared with the prior art that expensive auxiliary agents are required to be added for improving the performance of the liquid metal.
Preferably, the gaps of the second region micro mastoid array are all filled with liquid metal. In order to remove the air of the contact area of the reinforced heat dissipation plate and the heating device to the maximum extent, the packaging liquid level of the liquid metal is equal to the height of the micron mastoid, namely, the gap is completely filled with the liquid metal, so that the flatness is ensured, and the error is not more than +/-0.5 mm.
Preferably, the main material of the reinforced heat dissipation plate includes, but is not limited to, copper or its alloy or its oxide, aluminum or its alloy or its oxide, iron or its alloy or its oxide, stainless steel, gold, silver, silicon or its oxide or its doped semiconductor, etc.
Preferably, the main body of the reinforced heat dissipation plate comprises two modes of complete filling and partial filling. Wherein, the complete filling relates to a conventional solid heat dissipation plate, such as fins, fin wanes, heat sinks and the like; partial filling involves heat-dissipating plates based on the principle of "heat pipes" (the remaining space is filled with a low-pressure refrigerant medium to form an evaporation-condensation internal cycle), such as heat pipes, vapor-vapor plates, cold plates, etc.
Preferably, the basic appearance of the reinforced heat dissipation plate is a flat plate, and at least comprises two functional surfaces, namely a top surface (upper surface) and a bottom surface (lower surface).
Preferably, the reinforced heat dissipation plate has additional appearance meeting the actual needs of the integrated circuit, including but not limited to screw hole structures reserved for the installation of matched devices, fastening structures supplemented for improving mechanical strength, fin structures added for improving coolant flow, grooves or prismatic table structures cut for avoiding other electronic components, and the like.
The preparation method of the self-close-contact super-hydrophobic immersed phase-change liquid-cooled reinforced heat-dissipating plate comprises the following steps of: the integral forming of the heat radiation plate is enhanced, the micro-mastoid array is formed by etching the surface of the heat radiation plate, the infiltration property of the micro-mastoid array is regulated and controlled, and the liquid metal in the second area is encapsulated.
Preferably, the integral molding method of the reinforced heat dissipation plate includes, but is not limited to, casting, forging, rolling, stamping, drawing, injection, welding, cutting, hinge, gear shaping, nesting, grinding and polishing, powder metallurgy, 3D printing, and the like.
Preferably, the etching method for forming the micro mastoid array by etching the surface of the reinforced radiating plate is laser integrated etching. The laser integrated etching can simultaneously form the nano-folds of the micro-mastoid array and the micro-mastoid surface. Specific methods of implementation include laser travel paths, laser filling processes, laser photothermal action, and laser repeated processing, see applicant's issued patent (application publication number CN 109974512A).
One of the purposes of regulating and controlling the infiltration property of the micro mastoid array is to enable the surface of the first area of the reinforced radiating plate to obtain the super-hydrophobic property (the adhesion force of bubbles under liquid is less than 20 mu N) for the refrigerant medium so as to be beneficial to the rapid detachment of phase-change bubbles; another object is to obtain the property of the second region of the super-philic liquid metal (static contact angle less than 10 °) to facilitate stable encapsulation of the liquid metal. Preferably, the method for regulating the infiltration property of the micro mastoid array comprises chemical reagent modification, functional medium deposition, thermal modification, plasma treatment, ozone treatment or ultraviolet irradiation.
Further preferably, the method of functional dielectric deposition includes, but is not limited to, such as chemical vapor deposition, physical vapor deposition, atomic layer deposition, or the like. The thermal modification adopts a method such as calcination or annealing.
Preferably, the encapsulation of the liquid metal in the second region comprises the steps of: preheating the reinforced heat dissipation plate, then infiltrating and filling the molten liquid metal into the gaps of the second region micro mastoid arrays, and then cooling and solidifying to complete the encapsulation of the liquid metal.
Preferably, the reinforced heat spreader plate is preheated to 20 ℃ and above the melting temperature of the liquid metal, so as to prevent interference or retardation of the infiltration filling of the liquid metal in the array gap due to partial or complete solidification of the liquid metal.
When the liquid metal is metal simple substance or alloy, the infiltration process can be directly carried out after the liquid metal is melted; if the liquid metal is a doping mixture, the metal simple substance or alloy is heated and melted, then other metal or nonmetal substances to be doped are supplemented, and the liquid metal is fully and uniformly mixed by using methods such as physical grinding or mechanical stirring.
Preferably, the method of liquid metal infiltration filling includes, but is not limited to, natural infiltration filling, vacuum or pressure assisted infiltration filling, optically or electrically or magnetically induced infiltration filling, and the like.
Preferably, the temperature of the reduced solidification is at least 5 ℃ below the solidification temperature of the liquid metal, ensuring complete solidification of the liquid metal.
The self-sealing super-hydrophobic immersed phase-change liquid-cooling reinforced heat-dissipating plate provided by the invention has the advantages of 'reducing contact thermal resistance' and 'promoting liquid-gas phase transformation', and particularly supports high heating density (heat flux density 100W/cm) 2 Above) electronics cooling heat dissipation, including but not limited to meeting practical application requirements in fields such as data center servers, aerospace thermal management equipment, advanced power batteries, and the like.
The beneficial effects of the invention are as follows:
the self-sealing super-hydrophobic immersed phase-change liquid-cooled intensified heat-dissipating plate provided by the invention comprises a first area and a second area. Wherein the contact thermal resistance between the second area and the heating device is lower, the heat transfer and the temperature uniformity are faster, and the temperature uniformity rate of the solid-liquid phase change of the liquid metal is more than 1cm 2 And can automatically fill the gap between the contact surface of the heat-generating device and the heat-generating device to obtain a material (such as copper, thermal conductivity of about 400W m) -1 K -1 ) Is a very high thermal conductivity. Meanwhile, the specific surface area of the micro mastoid array in the first area is larger, the vaporization core is more, the adhesion retardation to phase-change bubbles is weaker, the boiling enhancement heat transfer performance is better, and particularly, the high heating density (heat flux density 100W/cm) is supported 2 The above) electronic device can reduce the initial overheat temperature of the refrigerant medium by 8-32 ℃ compared with the boiling point thereof, and the submerged phase-change liquid cooling performance is improved by more than 10 times compared with the surface of a conventional heat dissipation part and by more than 1 time compared with the surface of commercial sintered copper particles.
In addition, compared with the existing product, the reinforced heat radiation plate has the advantages of low cost, convenience in assembly and disassembly, stable performance, natural leakage prevention, simple, flexible and controllable preparation process, short period, high precision and easiness in mass production, and has good application prospect in the fields such as a data center server, space thermal control equipment, an advanced power battery and the like.
Drawings
The following describes the embodiments of the present invention in further detail with reference to the drawings.
Fig. 1 shows a schematic diagram of a self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat sink in example 1.
Fig. 2 shows an enlarged plan view and a cross-sectional front view of a first region distributed on the upper surface (top surface) of the reinforced heat spreader plate in example 1.
Fig. 3 shows an enlarged bottom view and a front cross-sectional view of a first region and a second region distributed on the lower surface (bottom surface) of the reinforced heat dissipation plate in embodiment 1.
Fig. 4 is a 3D view of a schematic product of the self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate in embodiment 1, which meets the actual needs of an integrated circuit.
Wherein, 1-strengthen the cooling plate; 2-reinforcing the upper surface (top surface) of the heat dissipating plate; 3-reinforcing the lower surface (bottom surface) of the heat dissipating plate; 4-a first area distributed on the upper surface (top surface) of the reinforced heat dissipation plate; 5-a micro mastoid array within the first region; 6-a second area distributed on the lower surface (bottom surface) of the reinforced heat dissipation plate; 7-a first area distributed on the lower surface (bottom surface) of the reinforced heat dissipation plate; 8-isolation belt; 9-micrometric mastoid process in the first region; 10-nanofolds of the surface of the microcosmic mastoid in the first region; 11-micro mastoid array gap in the first region; 12-liquid metal in the second zone; 13-plate; 14-land (additional appearance); 15-fastening tape (additional appearance); 16-screw hole (additional appearance); 17-micrometre mastoid process in the second region.
Detailed Description
In order to more clearly illustrate the present invention, the present invention will be further described with reference to preferred embodiments and the accompanying drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and that this invention is not limited to the details given herein.
Example 1
The self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate comprises a first area and a second area on the surface of the reinforced heat dissipation plate; the surface of the reinforced radiating plate in the first area is distributed with micro-mastoid arrays, the surface of the reinforced radiating plate in the second area is distributed with micro-mastoid arrays, and liquid metal is encapsulated in gaps of the micro-mastoid arrays; the contact area of the reinforced radiating plate and the heating device comprises a second area. The liquid metal in the second area can self-fill the gap of the heating device, and the high heat conduction efficiency is achieved. As shown in fig. 1 to 3, the specific scheme is as follows:
the heat dissipating plate 1 was reinforced by casting and formed with copper (thermal conductivity of about 400W m -1 K -1 ) The material is completely filled, the basic appearance is a standard flat plate with the dimensions of 100mm multiplied by 60mm multiplied by 3mm, and no additional appearance is generated. After preliminary surface grinding and polishing, forming a first area 4 on the upper surface (top surface) 2 and forming a first area 7 and a second area 6 on the lower surface (bottom surface) 3 by laser integrated etching; the area of the second region 6 encapsulated with the liquid metal is 38mm multiplied by 38mm, the second region 6 is contacted with a chip with the area of 40mm multiplied by 40mm, and a separation band 8 is arranged between the second region 6 and the first region 7. The surface of the micro-mastoid 9 of the first region 4 and 7 has nano-wrinkles 10, the height of the micro-mastoid 9 in the first region is 60 μm, the equivalent diameter is about 50 μm, the thickness of the nano-wrinkles 10 on the surface is about 500nm, and the width of the micro-mastoid array gap 11 in the first region is about 50 μm. The size of the micro-mastoid 17 in the second region 6 corresponds to the size of the micro-mastoid 9 in the first region.
By 1.0mol L -1 Sodium hydroxide and 0.5mol L -1 The sodium persulfate solution is chemically modified to obtain super-hydrophobic property, wherein the adhesion force of bubbles under liquid is less than 10 mu N, on the first area 4 distributed on the upper surface (top surface) of the reinforced radiating plate and the first area 7 distributed on the lower surface (bottom surface) of the reinforced radiating plate. By 1.0mol L -1 The hydrochloric acid modifies the 6-micrometer mastoid array in the second area to obtain super-philic liquid metal property, and the liquid metal 12 gallium simple substance (melting point about 30 ℃) is naturally infiltrated and filled by heating at the constant temperature of 60 ℃, and the liquid metal 12 in the second area 6 is obtained after the uniform encapsulation of the 3-micrometer mastoid array gap at the bottom surface is completed and then refrigerated and cooled at the temperature of 0 ℃ for solidification for 2 hours.
In the embodiment, the reinforced heat dissipation plate has low contact thermal resistance, fast heat transfer and temperature uniformity, and can complete the uniform temperature distribution of the upper surface 100mm multiplied by 60mm region within 50s at 60 ℃ for measurementTo obtain the total heat conductivity as high as 395.4W m -1 K -1 。
In the embodiment, the reinforced heat dissipation plate has large specific surface area, more vaporization cores, weak adhesion and retardation to phase-change bubbles and excellent reinforced boiling effect, the initial overheat temperature of bulk water boiling can be reduced by 32 ℃, the initial overheat temperature of electronic fluoridation liquid boiling can be reduced by 8 ℃, and the reinforced boiling heat transfer performance is improved by 10 times compared with the conventional copper heat dissipation surface.
In the embodiment, the main body of the reinforced heat dissipation plate is made of the most commonly used red copper, the liquid metal is the simplest simple elemental gallium, and only an ultrathin layer with the thickness of 20 mu m is required to be formed, so that the advantages of economy and low cost of materials and the like are fully reflected; meanwhile, the preparation processes of casting molding, surface polishing, laser etching, chemical modification and the like are simple and controllable, and the large-scale production is easy.
Example 2
The self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat-dissipating plate product meeting the actual needs of integrated circuits comprises the following specific scheme:
the solid red copper reinforced heat dissipating plate formed by cutting, punching, polishing and polishing is shown in fig. 4, and the basic appearance is a flat plate 13 with the size of 120mm multiplied by 78mm multiplied by 2mm, the additional appearance comprises a prismatic table 14 with the bottom surface centered by 40mm multiplied by 8mm, a fastening band 15 with the side wing centered by 55mm multiplied by 9mm multiplied by 8mm, and a screw hole 16 with the diameter of 7mm reserved at a specific position. The micron mastoid arrays are integrally etched by utilizing laser, and the micron mastoid arrays are distributed on the upper surface and the lower surface of the flat plate 13, the periphery and the bottom surface of the prismatic table 14, the upper surface and the lower surface as well as the side surface of the fastening belt 15; wherein the second region of the bottom surface of the land 14 has an area of 38mm by 38mm and is in contact with a chip having an area of 40mm by 40mm, the height of the micro-mastoid in the second region of the bottom surface of the land 14 is 20 μm, and the height of the micro-mastoid in the first region of the surface of the land 14 is 40 μm. The height of the micro mastoid in the first area of the other surface of the reinforced heat dissipation plate is 60 μm. In addition, other structural parameters of the micro-mastoid were consistent, including an equivalent diameter of the pyramidal micro-mastoid of about 30 μm, a nano-pleat thickness of the micro-mastoid surface of about 50nm, and a spacing between adjacent micro-mastoid of 30 μm. Super-oleophobic properties were obtained by 200W plasma treatment with 1.0mol L -1 Sodium hydroxide solution to 38mm x 38mm pyramid bottom surfaceThe super-hydrophilic liquid metal property is obtained by chemical modification, the liquid metal indium tin bismuth alloy (indium 50%, tin 20%, bismuth 30%, melting point about 60 ℃) is subjected to induction infiltration and filled into the micro mastoid array on the bottom surface of the pyramid, and the liquid metal indium tin bismuth alloy is naturally cooled and solidified for 12 hours after uniform encapsulation.
The reinforced heat dissipation plate product in the embodiment can be abutted against a real data center server, the prismatic table can effectively avoid other electronic elements on the main board, and the fastening belt and the screw holes are convenient for tightly loading the reinforced heat dissipation plate contacted with the chip; the ultra-large area (almost covering all functional surfaces) enhanced boiling structure can obviously promote the liquid-gas phase transformation behavior of the refrigerant medium and improve the immersed phase-change liquid cooling performance. The micro immersed phase-change liquid cooling test shows that the reinforced heat dissipation plate of the embodiment enables the heat dissipation plate to be 300-420W/cm 2 The working temperature of the high heating density electronic device is 68-74 ℃, and the immersed phase-change liquid cooling performance is improved by more than 1 time compared with the surface of commercial sintered copper particles.
Example 3
The basic appearance, the dimensional parameters and the subsequent preparation method of the self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat-dissipating plate product are consistent with those of the embodiment 2 except that the heat pipe type red copper vapor chamber is formed by using 3D printing, injection, welding and other processes in the forming stage.
Comparative example 1
The process for preparing the reinforced heat spreader of comparative example 1 was identical to that of example 3 except that in example 3 the micro-mastoid array gaps in the second region were encapsulated with liquid metal, whereas in the reinforced heat spreader of comparative example no liquid metal was encapsulated, and the contact surface was filled with commercial indium metal fins.
In example 3, the heat sink plate product was repeatedly loaded and unloaded in a micro-immersion phase-change liquid cooling apparatus and tested 60 times, no side leakage of liquid metal was found, and the micro-immersion phase-change liquid cooling test showed that the heat sink plate product was 180-320W/cm 2 The working temperature of the high heating density electronic device is 58-62 ℃ and 300W/cm 2 While the operating temperature fluctuation error of the heat-generating density electronic device is + -2.6deg.C, comparative example 1 in which the contact surface is filled with a commercial indium metal heat sink has complicated handling steps of 180-320W/cm 2 The working temperature of the high heating density electronic device is 58-72 ℃ and 300W/cm 2 The fluctuation error of the working temperature of the electronic device is up to +/-12.4 ℃, which fully shows the advantages of convenient loading and unloading, stable performance, natural leakage prevention and the like.
It should be understood that the foregoing examples of the present invention are provided for the purpose of illustration only and are not intended to limit the embodiments of the present invention, and that various other changes and modifications can be made by one skilled in the art based on the foregoing description, and it is not intended to be exhaustive of all the embodiments, and all obvious changes and modifications that come within the scope of the invention are defined by the following claims.
Claims (15)
1. The self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced cooling plate is characterized in that the surface of the reinforced cooling plate comprises a first area and a second area; the surface of the reinforced radiating plate in the first area is distributed with micro-mastoid arrays, the surface of the reinforced radiating plate in the second area is distributed with micro-mastoid arrays, and liquid metal is encapsulated in gaps of the micro-mastoid arrays; the contact area of the reinforced radiating plate and the heating device comprises a second area;
the surface of the micro mastoid array has special wettability, wherein the surface of the micro mastoid in the first area is super-hydrophobic, and the adhesion force to submerged bubbles is less than 20 mu N; the second region of the ultra-hydrophilic liquid metal on the surface of the micron mastoid has a static contact angle of less than 10 degrees to liquid metal droplets in an air or oxygen-free environment;
the area of the contact area of the reinforced heat dissipation plate and the heating device is not smaller than that of the second area.
2. The self-sealing super-hydrophobic submerged phase-change liquid-cooled reinforced heat dissipating plate of claim 1, wherein the micro-mastoid is cone-shaped or columnar.
3. The self-sealing super-hydrophobic submerged phase-change liquid-cooled reinforced heat-dissipating plate according to claim 1, wherein the height of the micro-mastoid is 5-500 μm, the equivalent diameter is 10-1000 μm, and the distance between adjacent micro-mastoid is 10-1000 μm.
4. The self-sealing superhydrophobic submerged phase-change liquid-cooled reinforced heat dissipation plate of claim 1, the micro mastoid surface having a nano-rugosity morphology.
5. The self-sealing super-hydrophobic submerged phase-change liquid-cooled reinforced heat dissipation plate of claim 4, wherein the thickness of the nano-folds is 5-500 nm.
6. The self-sealing super-hydrophobic submerged phase-change liquid-cooled reinforced heat dissipation plate of claim 1, wherein a separation strip is present between the first region and the second region.
7. The self-sealing superhydrophobic submerged phase-change liquid-cooled reinforced heat dissipation plate of claim 1, wherein the micro mastoid arrays distributed in the first region and the second region are different in size.
8. The self-sealing superhydrophobic submerged phase-change liquid-cooled intensified heat dissipation plate of claim 1, the gaps of the second-region micron mastoid array being entirely filled with liquid metal.
9. The self-sealing super-hydrophobic submerged phase-change liquid-cooled reinforced heat spreader plate of claim 1, wherein the liquid metal has a melting point above room temperature but below the steady-state operating temperature of the heat-generating device.
10. The self-sealing super-hydrophobic submerged phase-change liquid-cooled reinforced heat dissipating plate according to claim 1, wherein the liquid metal is selected from gallium, indium, tin, bismuth or alloys thereof, or doped mixtures thereof with other metals, oxides of other metals, non-metals or non-metal oxides; the other metal is selected from copper, aluminum, gold, silver, tungsten, rhodium or iridium, and the nonmetal is carbon or silicon.
11. A method for preparing the self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate as claimed in any one of claims 1 to 10, comprising the following steps: the integral forming of the heat radiation plate is enhanced, the micro-mastoid array is formed by etching the surface of the heat radiation plate, the infiltration property of the micro-mastoid array is regulated and controlled, and the liquid metal in the second area is encapsulated.
12. The method of claim 11, wherein the etching method for forming the micro-mastoid array by etching the surface of the reinforced heat sink is laser integrated etching.
13. The method of claim 11, wherein the method of modulating the wetting properties of the micro-mastoid array comprises chemical agent modification, functional medium deposition, thermal modification, plasma treatment, ozone treatment, or ultraviolet irradiation.
14. The method of manufacturing according to claim 11, wherein the liquid metal encapsulation in the second region comprises the steps of: preheating the reinforced heat dissipation plate, then infiltrating and filling the molten liquid metal into the gaps of the second region micro mastoid arrays, and then cooling and solidifying to complete the encapsulation of the liquid metal.
15. The use of a self-sealing super-hydrophobic submerged phase-change liquid-cooled reinforced heat-dissipating plate according to any one of claims 1-10 in the fields of data center servers, aerospace thermal control equipment, advanced power batteries.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110767772.8A CN113677148B (en) | 2021-07-07 | 2021-07-07 | Self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110767772.8A CN113677148B (en) | 2021-07-07 | 2021-07-07 | Self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113677148A CN113677148A (en) | 2021-11-19 |
| CN113677148B true CN113677148B (en) | 2024-01-19 |
Family
ID=78538912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110767772.8A Active CN113677148B (en) | 2021-07-07 | 2021-07-07 | Self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113677148B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI809641B (en) * | 2022-01-05 | 2023-07-21 | 艾姆勒科技股份有限公司 | Immersion-cooling type heat-dissipation plate |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275209A (en) * | 2007-03-30 | 2008-10-01 | 清华大学 | Thermal interfacial material and method for preparing same |
| CN101747870A (en) * | 2009-12-18 | 2010-06-23 | 东南大学 | Preparation method, use method and preparation device of heat dissipation interface material |
| CN101864280A (en) * | 2010-05-20 | 2010-10-20 | 中国科学院苏州纳米技术与纳米仿生研究所 | Thermal interface material for packaging and radiating chip and preparation method thereof |
| CN101899288A (en) * | 2009-05-27 | 2010-12-01 | 清华大学 | Thermal interface material and preparation method thereof |
| CN103643099A (en) * | 2013-12-16 | 2014-03-19 | 曹帅 | Liquid metal thermal interface material used at 150 DEG C and preparation method thereof |
| CN109974512A (en) * | 2019-03-21 | 2019-07-05 | 中国科学院理化技术研究所 | A kind of micro-nano complex intensifying boiling structure of material surface and its preparation method and application |
| CN110014718A (en) * | 2019-04-28 | 2019-07-16 | 大连海事大学 | A method of gallium base thermal interface material applications are enhanced into interface heat transfer in aluminium substrate |
| CN112188815A (en) * | 2020-11-01 | 2021-01-05 | 程嘉俊 | Liquid cooling head and liquid cooling radiator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011057105A2 (en) * | 2009-11-06 | 2011-05-12 | The University Of Akron | Materials and methods for thermal and electrical conductivity |
| US11191187B2 (en) * | 2019-04-30 | 2021-11-30 | Deere & Company | Electronic assembly with phase-change material for thermal performance |
-
2021
- 2021-07-07 CN CN202110767772.8A patent/CN113677148B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275209A (en) * | 2007-03-30 | 2008-10-01 | 清华大学 | Thermal interfacial material and method for preparing same |
| CN101899288A (en) * | 2009-05-27 | 2010-12-01 | 清华大学 | Thermal interface material and preparation method thereof |
| CN101747870A (en) * | 2009-12-18 | 2010-06-23 | 东南大学 | Preparation method, use method and preparation device of heat dissipation interface material |
| CN101864280A (en) * | 2010-05-20 | 2010-10-20 | 中国科学院苏州纳米技术与纳米仿生研究所 | Thermal interface material for packaging and radiating chip and preparation method thereof |
| CN103643099A (en) * | 2013-12-16 | 2014-03-19 | 曹帅 | Liquid metal thermal interface material used at 150 DEG C and preparation method thereof |
| CN109974512A (en) * | 2019-03-21 | 2019-07-05 | 中国科学院理化技术研究所 | A kind of micro-nano complex intensifying boiling structure of material surface and its preparation method and application |
| CN110014718A (en) * | 2019-04-28 | 2019-07-16 | 大连海事大学 | A method of gallium base thermal interface material applications are enhanced into interface heat transfer in aluminium substrate |
| CN112188815A (en) * | 2020-11-01 | 2021-01-05 | 程嘉俊 | Liquid cooling head and liquid cooling radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113677148A (en) | 2021-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9512291B2 (en) | High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites | |
| US7169650B2 (en) | Semi-solid metal injection methods for electronic assembly thermal interface | |
| US20070187074A1 (en) | Heat dissipating apparatus having micro-structure layer and method of fabricating the same | |
| US20110127013A1 (en) | Heat-radiating component and method of manufacturing the same | |
| CN106929733B (en) | A kind of compound liquid metal thermal interface material of foamed aluminium | |
| CN113675159A (en) | Inner-packaging self-adaptive uniform-temperature thermal interface based on liquid metal infiltration and preparation method and application thereof | |
| CN109894602A (en) | A kind of high thermal conductivity composite heat interfacial material with two-phase co-continuous communicating structure | |
| CN113677148B (en) | Self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate and preparation method and application thereof | |
| CN102378547A (en) | Vapor chamber | |
| CN111725144A (en) | High-temperature electronic packaging substrate material device based on gas-liquid phase change and preparation method thereof | |
| CN107816907A (en) | A kind of micro-nano compound structure surface is heat sink and its method for enhanced heat exchange | |
| CN111826542B (en) | Copper-based diamond gradient heat dissipation material and preparation method thereof | |
| CN107052308B (en) | A kind of liquid metal thermal interface material that foam copper is compound | |
| CN113758325A (en) | VC radiator with built-in copper/diamond sintered wick and preparation method thereof | |
| CN112582361A (en) | Enhanced boiling structure and preparation method and application thereof | |
| CN201785338U (en) | Composite heat-dissipating graphite material | |
| CN215600351U (en) | Enhanced boiling structure and electronic chip | |
| CN108754422B (en) | Method for realizing spreading of gallium-based liquid metal on surface of solid sheet | |
| CN210073819U (en) | Heat dissipation type chip fan-out structure | |
| CN110944493B (en) | Metal-based composite material device based on gas-liquid phase change and preparation method thereof | |
| CN106637194A (en) | Surface treatment method for CPU cover | |
| CN210671097U (en) | Radiating gasket and electronic component | |
| CN109930022B (en) | Graphene/diamond mixed reinforced copper-based composite material and preparation method thereof | |
| CN106957980B (en) | With the liquid metal thermal interface material from gain performance | |
| Yan et al. | Experimental investigation on optimization of the performance of gallium-based liquid metal with high thermal conductivity as thermal interface material for efficient electronic cooling |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |