CN111826542B - Copper-based diamond gradient heat dissipation material and preparation method thereof - Google Patents
Copper-based diamond gradient heat dissipation material and preparation method thereof Download PDFInfo
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- CN111826542B CN111826542B CN202010615991.XA CN202010615991A CN111826542B CN 111826542 B CN111826542 B CN 111826542B CN 202010615991 A CN202010615991 A CN 202010615991A CN 111826542 B CN111826542 B CN 111826542B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
Abstract
The invention relates to the field of heat dissipation materials, in particular to a copper-based diamond gradient heat dissipation material and a preparation method thereof. The copper-based diamond gradient heat dissipation material component is in a semicircular annular groove shape, the inner wall of the copper-based diamond gradient heat dissipation material component is a diamond-copper composite layer, and the outer wall of the copper-based diamond gradient heat dissipation material component is a copper layer. Methods of making the assembly are also provided. Through the scheme, the matching degree of the gradient heat dissipation material and the optical fiber curved surface is ensured, and the processing precision and the heat dissipation efficiency are guaranteed. Meanwhile, the defects that the conventional copper and diamond composite material is difficult to process and is difficult to form a uniform curved surface are overcome.
Description
Technical Field
The invention relates to the field of heat dissipation materials, in particular to a copper-based diamond composite material component and a preparation method of the composite material component.
Background
The functional requirements for various devices in the fields of electronics, aerospace, military, industry, medical treatment and the like are higher and higher, and the power density of correlator (parts) is increased, so that great difficulty and higher challenge are brought to heat dissipation. Particularly in the military and aerospace fields, high power density or high packing density devices emit large amounts of heat when operated. If the heat is not dissipated in time, the failure rate and the failure rate of the power device can be greatly increased. The diamond/copper composite material with high thermal conductivity has very wide application, such as a clamping rod of a structure function integrated heat dissipation assembly for a high-power traveling wave tube (a satellite communication, electronic interference and radar receiving power source), a heat dissipation substrate of an active phased array antenna, heat dissipation of a neutralizer of a satellite ion thruster, an outer ring of a Hall thruster, a satellite-borne large-scale integrated circuit and a packaging material of a CPU, LED illumination heat dissipation outside a space station cabin and the like.
The natural diamond has very high thermal conductivity up to 2000W/m.K and excellent thermophysical performance. However, the preparation of the large-size block heat conduction material from the pure diamond is difficult and expensive. The heat conductivity of the pure copper is relatively high and can reach 400W/m.K, which is higher than that of most commercial heat dissipation materials at present, but the coefficient of thermal expansion of the pure copper is larger. In view of the above factors, researchers make diamond and copper into composite materials, and utilize the advantages of the diamond and the copper to combine excellent thermophysical properties with appropriate mechanical properties to prepare the diamond/copper high thermal conductivity composite materials with high thermal conductivity, adjustable density and thermal expansion coefficient, certain mechanical properties, stable chemical properties and near net shape of the products.
The method for manufacturing the heat dissipation component by using the diamond is various, but most of the methods are diamond composite materials, namely, diamond particles or powder and other metal powder are mixed and fused to form a composite material. For example, in patent CN106795596A, diamond powder, silver or silver alloy and compound of group iv element are melt mixed and molded. Then, as shown in patent CN104630527A, a copper material is processed into a final size of a diamond/copper product as a mold, diamond single crystal/plating diamond particles are poured into the mold for compaction, then a binder solution is dripped, then the diamond porous skeleton blank is prepared by vacuum treatment at the temperature of 200-600 ℃, then the diamond porous skeleton blank and a copper alloy/pure copper mold are packed together for hot isostatic pressing treatment, and the composite material is obtained after cooling.
The problem of rapid heat dissipation is one of the key factors restricting the development of high-power lasers and high-integration semiconductor devices. The composite material in the prior art greatly reduces the excellent heat-conducting property of diamond, and the heat-conducting property added on the basis of metal is limited. In addition, another problem is encountered in that the prior art methods are generally applied to the preparation of planar heat dissipation components, and when used in the field of optical fiber heat dissipation, the expected effect is far from being achieved.
Disclosure of Invention
The invention provides a diamond and copper-based composite material with high thermal conductivity aiming at the requirement of optical fiber heat dissipation and a preparation method of the copper-based composite material.
A preparation method of a copper-based diamond gradient heat dissipation material component comprises the following steps:
(1) processing copper into a semicircular annular groove;
(2) uniformly hot-pressing single crystal diamond on the inner wall of the semicircular annular copper groove
(3) Filling copper powder into gaps of the diamond particles, and compacting by using a die;
(4) and sintering at high temperature to form the copper-based diamond gradient heat dissipation material component.
Through processing into circular recess with the copper earlier, guaranteed the size precision of appearance spare, the outer wall that remains the copper recess simultaneously can ensure the exterior structure precision, and the good separation performance of pure copper can be convenient for contact with the heat dissipation medium simultaneously, and the convenience is direct to set up the heat dissipation runner on the surface, increases substantially the radiating efficiency. Meanwhile, the welding performance of the diamond and copper composite material is guaranteed, and the structure of adding radiating fins on the surface of pure copper is facilitated.
Further, in an embodiment, the method further comprises the step of arranging a heat dissipation flow channel on the outer side wall of the copper-based diamond gradient heat dissipation material.
Further, in another embodiment, the method also comprises the step of arranging heat dissipation fins on the outer side wall of the copper-based diamond gradient heat dissipation material.
Further, the single crystal diamond particles have a particle diameter of 5 to 500 μm;
furthermore, the particle size of the copper powder is 1-500 μm, and the particle size of the copper powder is smaller than that of the diamond particles in order to ensure that the copper powder can fully fill gaps of the diamond particles.
It is further preferred that the copper powder particle size is less than 1/2, further less than 1/5 and further less than 1/10 of the diamond particle size.
Furthermore, the copper is preferably red copper with excellent conductivity.
Further, the high-temperature sintering temperature is preferably 750-950 ℃.
Further, the sintering temperature is 750-950 ℃.
Further, the temperature of the uniform hot-pressing step is 700-800 ℃, the pressure is 50MPa-200MPa, and the time is 5-30min.
The invention also provides a copper-based diamond gradient heat dissipation material component which is in a semicircular annular groove shape, wherein the inner wall of the component is a diamond-copper composite layer, and the outer wall of the component is a copper layer.
Further, copper in the copper-based diamond gradient heat dissipation material is red copper.
Further, a heat conduction flow channel is arranged on the outer wall of the copper-based diamond gradient heat dissipation material.
Further, in another embodiment, the outer wall of the copper-based diamond gradient heat dissipation material is provided with heat dissipation fins.
Further, the copper-based diamond gradient heat dissipation material is prepared by the method.
Furthermore, the invention also provides an optical fiber heat dissipation structure, which comprises an optical fiber and two semi-circular groove-shaped copper-based diamond gradient heat dissipation material components covering the surface of the optical fiber, wherein the two semi-circular groove-shaped copper-based diamond gradient heat dissipation material components are opposite.
Further, the semicircular groove-shaped copper-based diamond gradient heat dissipation material assembly is prepared by the method.
Has the advantages that:
(1) through the scheme, the matching degree of the gradient heat dissipation material and the optical fiber curved surface is ensured, and the processing precision and the heat dissipation efficiency are guaranteed.
(2) By the scheme, the defects that the conventional copper and diamond composite material is difficult to process and is difficult to form an even curved surface are overcome.
Drawings
FIG. 1 is a schematic view of a semicircular annular groove
FIG. 2 is a schematic diagram of a copper-based diamond gradient heat dissipation material assembly
FIG. 3 is a schematic top view of a copper-based diamond gradient heat sink material assembly
1: diamond-copper composite layer, 2: a copper layer.
Detailed Description
The technical scheme of the invention is further explained by combining the attached drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Example 1
In this example, red copper was used as a raw material, single crystal diamond particles having a particle size of 100 μm were used as a diamond raw material, and copper powder having a particle size D50 of 20 μm was used as a sintering raw material. The method comprises the following specific steps:
(1) processing red copper into a semicircular annular groove;
(2) uniformly hot-pressing the single crystal diamond on the inner wall of the semicircular annular copper groove, wherein the hot-pressing temperature is 800 ℃;
(3) filling copper powder into gaps of the diamond particles, and compacting by using a die;
(4) sintering at 900 ℃ to form the copper-based diamond gradient heat dissipation material component.
The thermal conductivity of the diamond-copper composite layer was found to be 592W/m.k.
Example 2
In this example, red copper was used as a raw material, single crystal diamond particles having a particle size of 150 μm were used as a diamond raw material, and copper powder having a particle size D50 of 50 μm was used as a sintering raw material. The method comprises the following specific steps:
(1) processing red copper into a semicircular annular groove;
(2) uniformly hot-pressing the single crystal diamond on the inner wall of the semicircular annular copper groove, wherein the hot-pressing temperature is 750 ℃;
(3) filling copper powder into gaps of the diamond particles, and compacting by using a die;
(4) sintering at 850 ℃ to form the copper-based diamond gradient heat dissipation material component.
The thermal conductivity of the diamond-copper composite layer was tested to be 581W/m.k.
Example 3
In this example, red copper was used as a raw material, single crystal diamond particles having a particle size of 100 μm were used as a diamond raw material, and copper powder having a particle size D50 of 20 μm was used as a sintering raw material. The method comprises the following specific steps:
(1) processing red copper into a semicircular annular groove;
(2) uniformly hot-pressing the single crystal diamond on the inner wall of the semicircular annular copper groove, wherein the hot-pressing temperature is 850 ℃;
(3) filling copper powder into gaps of the diamond particles, and compacting by using a die;
(4) sintering at the high temperature of 950 ℃ to form the copper-based diamond gradient heat dissipation material component.
The thermal conductivity of the diamond-copper composite layer was examined to be 610W/m.k.
Comparative example 1
In this example, red copper was used as a raw material, single crystal diamond particles having a particle size of 100 μm were used as a diamond raw material, and copper powder having a particle size D50 of 20 μm was used as a sintering raw material. The method comprises the following specific steps:
(1) mixing diamond and red copper powder, wherein the volume percentage of the diamond is 60%;
(2) hot-pressing the mixed powder into a composite material sheet;
(3) the optical fiber is bent in a groove shape according to the shape of the optical fiber.
In the test process, the states of diamond bulges, cracks and the like can appear in the bending process, so that the bonding with the optical fiber is not facilitated, and the heat is uniformly radiated.
Claims (10)
1. A preparation method of a copper-based diamond gradient heat dissipation material component is characterized by comprising the following steps:
(1) processing copper into a semicircular annular groove;
(2) uniformly hot-pressing the single crystal diamond on the inner wall of the semicircular annular copper groove;
(3) filling copper powder into gaps of the diamond particles, and compacting by using a die;
(4) and sintering at high temperature to form the copper-based diamond gradient heat dissipation material component.
2. The method for preparing a copper-based diamond gradient heat dissipating material assembly according to claim 1, wherein: and (4) arranging a heat dissipation flow channel on the outer side wall of the copper-based diamond gradient heat dissipation material.
3. The method for preparing a copper-based diamond gradient heat dissipating material assembly according to claim 1, wherein: and (4) arranging heat dissipation fins on the outer side wall of the copper-based diamond gradient heat dissipation material.
4. The method for preparing a copper-based diamond gradient heat dissipating material assembly according to claim 1, wherein: the grain size of the single crystal diamond particles is 5 to 500 μm.
5. The method for preparing a copper-based diamond gradient heat dissipating material assembly according to claim 1, wherein: the particle size of the copper powder is 1-500 mu m.
6. The method for preparing a copper-based diamond gradient heat dissipating material assembly according to claim 5, wherein: the copper powder particle size is less than 1/2 of the diamond particle size.
7. The method for preparing a copper-based diamond gradient heat dissipating material assembly according to claim 1, wherein: the sintering temperature is 750-950 ℃.
8. The method for preparing a copper-based diamond gradient heat dissipating material assembly according to claim 1, wherein: the temperature of the uniform hot-pressing step is 700-800 ℃.
9. A copper-based diamond gradient heat dissipation material component is characterized in that: the copper-based diamond gradient heat dissipation material component is in a semicircular annular groove shape, the inner wall of the copper-based diamond gradient heat dissipation material component is a diamond-copper composite layer, the outer wall of the copper-based diamond gradient heat dissipation material component is a copper layer, and the copper-based diamond gradient heat dissipation material component is prepared by the preparation method of any one of claims 1 to 8.
10. The copper-based diamond gradient heat dissipating material assembly of claim 9, wherein: the outer wall of the copper-based diamond gradient heat dissipation material is provided with a heat conduction flow channel, or the outer wall of the copper-based diamond gradient heat dissipation material is provided with heat dissipation fins.
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| CN113758327B (en) * | 2021-08-13 | 2022-06-17 | 中南大学 | Composite VC radiator containing copper/diamond sintered liquid absorption cores and preparation method thereof |
| CN113957285B (en) * | 2021-10-29 | 2022-12-02 | 成都惠锋智造科技有限公司 | Preparation method of composite material |
| CN114000004B (en) * | 2021-10-29 | 2023-06-13 | 成都惠锋智造科技有限公司 | Preparation method of heat-conducting composite material |
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| CN101831584A (en) * | 2009-03-10 | 2010-09-15 | 北京有色金属研究总院 | High heat-conducting copper-based composite material and preparation method thereof |
| CN104060117A (en) * | 2014-07-08 | 2014-09-24 | 武汉理工大学 | Preparation method for diamond/copper-based composite material |
| CN104630527A (en) * | 2014-12-30 | 2015-05-20 | 北京安泰钢研超硬材料制品有限责任公司 | Method for preparing copper-based diamond composite material |
| CN105506355A (en) * | 2015-12-25 | 2016-04-20 | 北京有色金属研究总院 | Diamond/copper gradient composite material and preparation method thereof |
| CN108118174A (en) * | 2017-12-29 | 2018-06-05 | 中南大学 | A kind of preparation method of carbon nanotube reinforced copper-base composite material |
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|---|---|---|---|---|
| EP2428590B1 (en) * | 2001-11-09 | 2018-08-15 | Sumitomo Electric Industries, Ltd. | Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
| US20100117252A1 (en) * | 2008-11-10 | 2010-05-13 | John Bourque | Solid composition having enhanced physical and electrical properties |
| EP3451376A1 (en) * | 2017-09-04 | 2019-03-06 | The Provost, Fellows, Foundation Scholars, and The Other Members of Board, of The College of The Holy and Undivided Trinity of Queen Elizabeth | Thermal structures for dissipating heat and methods for manufacture thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101831584A (en) * | 2009-03-10 | 2010-09-15 | 北京有色金属研究总院 | High heat-conducting copper-based composite material and preparation method thereof |
| CN104060117A (en) * | 2014-07-08 | 2014-09-24 | 武汉理工大学 | Preparation method for diamond/copper-based composite material |
| CN104630527A (en) * | 2014-12-30 | 2015-05-20 | 北京安泰钢研超硬材料制品有限责任公司 | Method for preparing copper-based diamond composite material |
| CN105506355A (en) * | 2015-12-25 | 2016-04-20 | 北京有色金属研究总院 | Diamond/copper gradient composite material and preparation method thereof |
| CN108118174A (en) * | 2017-12-29 | 2018-06-05 | 中南大学 | A kind of preparation method of carbon nanotube reinforced copper-base composite material |
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Address after: 410205 East of the first floor, 2nd floor, 7th floor, 8th floor, Building B8, Luguyuyuan, No. 27 Wenxuan Road, Changsha High-tech Development Zone, Changsha, Hunan Province Patentee after: Aerospace Science and Industry (Changsha) New Materials Research Institute Co.,Ltd. Address before: 410205 7th floor, building B8, Lugu Enterprise Square, Yuelu District, Changsha City, Hunan Province Patentee before: CHANGSHA ADVANCED MATERIALS INDUSTRIAL RESEARCH INSTITUTE Co.,Ltd. |