CN113676631A

CN113676631A - Camera module and electronic equipment

Info

Publication number: CN113676631A
Application number: CN202110908380.9A
Authority: CN
Inventors: 刘帆; 宋功发
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-08-09
Filing date: 2021-08-09
Publication date: 2021-11-19
Anticipated expiration: 2041-08-09
Also published as: CN113676631B

Abstract

The application discloses camera module and electronic equipment, above-mentioned camera module includes: the camera lens comprises a circuit board, an image processing sensor, a base, a supporting seat and a lens assembly; the base is provided with an accommodating cavity, the base further comprises an opening communicated with the accommodating cavity, the circuit board is covered at the opening, cooling liquid is filled in the accommodating cavity, and the image processing sensor is embedded in the circuit board; the supporting seat is arranged on one side, away from the base, of the circuit board, the lens assembly is arranged on the supporting seat, the supporting seat is provided with a cavity, the circuit board is provided with a fluid channel, and the cavity is communicated with the accommodating cavity through the fluid channel.

Description

Camera module and electronic equipment

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a camera module and electronic equipment.

Background

With the progress of science and technology, the popularity of electronic devices is higher and higher. Electronic devices are often provided with a camera module to facilitate the shooting of images and videos by users. Present electronic equipment generally sets and has set the anti-shake function to promote image quality, the anti-shake mode includes optics anti-shake, electron anti-shake and cloud platform anti-shake etc. to the camera module that adopts cloud platform anti-shake, need install the camera unsettled on the cloud platform supporting seat usually, make the camera possess the ability of relative cloud platform supporting seat motion with the help of actuating mechanism, realize cloud platform anti-shake purpose. However, because the power consumption of the camera is high, the heat of the camera is difficult to be dissipated out of the camera module, and the service life of the camera module is seriously influenced.

Disclosure of Invention

The application aims at providing a camera module and electronic equipment, can solve the camera module heat dissipation difficulty that adopts the cloud platform anti-shake at present, influences camera module life's problem.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a camera module, including: the camera lens comprises a circuit board, an image processing sensor, a base, a supporting seat and a lens assembly;

the base is provided with an accommodating cavity, the base further comprises an opening communicated with the accommodating cavity, the circuit board is covered at the opening, cooling liquid is filled in the accommodating cavity, and the image processing sensor is embedded in the circuit board; the supporting seat is arranged on one side, away from the base, of the circuit board, the lens assembly is arranged on the supporting seat, the supporting seat is provided with a cavity, the circuit board is provided with a fluid channel, and the cavity is communicated with the accommodating cavity through the fluid channel.

According to a camera module that this application embodiment provided, the supporting seat includes the body, the body is annular structure, the protruding bellying that is equipped with of inner wall of body, the body with be equipped with in the bellying the cavity.

According to a camera module that this application embodiment provided, be equipped with on the circuit board run through in the via hole of circuit board, image processing sensor locates the via hole, the bellying with image processing sensor keeps away from one side looks butt of base.

According to the camera module provided by the embodiment of the application, a gap is reserved between the outer peripheral surface of the image processing sensor and the circuit board.

According to the camera module provided by the embodiment of the application, the extending direction of the cavity in the protruding part is the same as the extending direction of the protruding part.

According to the camera module that this application embodiment provided, be equipped with in the bellying a plurality of cavities, a plurality of cavities along with the extending direction's of bellying vertical direction arranges in proper order, this is internal the cavity with in the bellying a plurality of cavities communicate.

According to a camera module that this application embodiment provided, the camera module still includes the micropump, the micropump is located hold the chamber, the micropump with the circuit board electricity is connected, the micropump is used for ordering about coolant liquid circulation flow in hold the chamber fluid passage with between the cavity.

According to the camera module that this application embodiment provided, the image processing sensor with be equipped with the heat conduction adhesive linkage between the diapire that holds the chamber.

According to the camera module that this application embodiment provided, the supporting seat with the circuit board is integrated into one piece structure.

In a second aspect, an embodiment of the present application provides an electronic device, including: the camera module is provided.

In the embodiment of this application, the heat transfer that produces after the image processing sensor work is to the coolant liquid, the coolant liquid is the evaporation of being heated, produce steam, thereby absorb the heat, steam is under the effect of buoyancy lift, through fluid channel arrival cavity, the supporting seat carries out heat exchange with external world or camera lens subassembly this moment, become liquid after the steam condensation, liquid this moment returns to and holds the chamber under the effect of gravity, with this heat dissipation that realizes the image processing sensor, ensure that the temperature of image processing sensor accords with the operating temperature requirement.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application;

fig. 2 is a second schematic structural diagram of a camera module according to an embodiment of the present application;

reference numerals:

1: an image processing sensor; 2: a circuit board;

3: a base; 4: cooling liquid;

5: a thermally conductive adhesive layer; 6: a lens assembly;

61: an optical filter; 62: an optical lens;

63: a voice coil motor; 7: an accommodating chamber;

8: an opening; 9: a micro-pump;

10: a supporting seat; 101: a body;

102: a boss portion; 11: a fluid channel;

12: a cavity; 13: a gap.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "first direction", "second direction", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

As shown in fig. 1, the camera module of the embodiment of the present application includes: circuit board 2, image processing sensor 1, base 3, supporting seat 10 and lens subassembly 6.

The lens assembly 6 includes an optical filter 61, a voice coil motor 63 and an optical lens 62, the optical filter 61 is used for filtering infrared rays, the optical lens 62 is installed on the voice coil motor 63, and the voice coil motor 63 is used for realizing a focusing function.

The base 3 has and holds chamber 7, and the base 3 still includes and holds the opening 8 that chamber 7 communicates, and opening 8 department is located to the circuit board 2 lid, that is to say, under the condition that opening 8 department was located to the circuit board 2 lid, holds chamber 7 and can be isolated with external.

The accommodating cavity 7 is filled with cooling liquid 4, and the cooling liquid 4 can be fluorocarbon. The image processing sensor 1 is embedded in the circuit board 2, and the image processing sensor 1 is electrically connected with the circuit board 2.

The image processing sensor 1 may be in contact with the cooling liquid 4, or a gap may exist between the image processing sensor 1 and the cooling liquid 4.

In order to ensure the maximum contact area between the image processing sensor 1 and the cooling liquid 4, the image processing sensor 1 may be arranged parallel to the circuit board 2. At this time, the entire bottom surface of the image processing sensor 1 is in contact with the coolant 4, thereby improving heat dissipation efficiency.

In order to arrange the image processing sensor 1 on the circuit board 2, the circuit board 2 is provided with a via hole penetrating the circuit board 2, or the circuit board 2 is provided with a blind hole on one side facing the base 3.

For example, the circuit board 2 is provided with a via hole penetrating through the circuit board 2, the image processing sensor 1 is provided in the via hole, or the circuit board 2 is provided with a blind hole on a side facing the base 3, and the image processing sensor 1 is provided in the blind hole.

The supporting seat 10 is disposed on one side of the circuit board 2 away from the base 3, and the lens assembly is disposed on the supporting seat 10. The support base 10 is provided with a cavity 12, the circuit board 2 is provided with a fluid channel 11, and the cavity 12 is communicated with the accommodating cavity 7 through the fluid channel 11.

In which a through hole is provided in the circuit board 2 to form the above-mentioned fluid passage 11, the through hole penetrating through opposite sides thereof. The number of the fluid passages 11 may be one, two, or more than two, for example, a plurality of fluid passages 11 are arranged at intervals in order in the radial direction of the circuit board.

In this application embodiment, the heat transfer that image processing sensor 1 produced after the work is to coolant liquid 4, coolant liquid 4 is heated the evaporation, produce steam, thereby absorb the heat, steam is under the effect of buoyancy lift, reach cavity 12 through fluid passage 11, supporting seat 10 carries out heat exchange with external world or lens subassembly this moment, become liquid after the steam condensation, liquid at this moment returns to and holds chamber 7 under the effect of gravity, with this heat dissipation that realizes image processing sensor 1, ensure that the temperature of image processing sensor 1 accords with the operating temperature requirement.

Compared with common heat conduction and air convection, the image processing sensor has the advantages that evaporation cooling is carried out through the cooling liquid 4, heat transfer efficiency is improved, and the temperature of the image processing sensor 1 can be effectively reduced.

In an alternative embodiment, as shown in fig. 2, the supporting seat 10 includes a body 101, the body 101 is a ring structure, a protrusion 102 is protruded on an inner wall of the body 101, and a cavity 12 is disposed in the body 101 and the protrusion 102.

In the case that the plurality of fluid passages 11 are sequentially arranged at intervals in the radial direction of the circuit board, the interior of the body 101 may be provided with cavities 12 extending in the first direction, the interior of the boss 102 is provided with the cavities 12 extending in the first direction, and the fluid passages 11 are in one-to-one communication with the cavities 12.

In an alternative embodiment, the cavity 12 in the boss 102 extends in the same direction as the boss 102.

It should be noted that, in order to improve the heat exchange capability of the support seat 10 with the outside or the lens assembly, a cavity 12 extending along the first direction may be provided inside the body 101, a cavity 12 extending along the second direction is provided inside the protrusion 102, a plurality of cavities 12 may be provided inside the protrusion 102, the plurality of cavities 12 inside the protrusion 102 are sequentially arranged along the first direction, and the plurality of cavities 12 inside the protrusion 102 are communicated with the cavity 12 inside the body 101. The first direction is perpendicular to the second direction, for example, the first direction is a height direction of the support seat 10.

It can be understood that the cavity 12 extending along the second direction is provided in the protrusion 102, so as to ensure that the heat exchange capability of the support 10 with the outside or the lens assembly is maximally improved under the condition that the height of the support 10 is unchanged.

In an alternative embodiment, a plurality of cavities 12 are provided in the boss 102, the plurality of cavities 12 are arranged in series in a direction perpendicular to the extending direction of the boss 102, and the cavities 12 in the body 101 communicate with the plurality of cavities 12 in the boss 102.

For example, the interior of the body 101 may be provided with one cavity 12 extending along a first direction, the boss 102 may be provided with three cavities 12 extending along a second direction, the three cavities 12 in the boss 102 are sequentially arranged along the first direction, and the three cavities 12 in the boss 102 are communicated with one cavity 12 in the interior of the body 101.

In an alternative embodiment, a via hole penetrating through the circuit board 2 is formed on the circuit board 2, and in a case that the image processing sensor 1 is disposed in the via hole, the protrusion 102 abuts against a side of the image processing sensor 1 away from the base 3.

It should be noted that the protrusion 102 is formed to extend along the radial direction of the body 101, and the length of the protrusion 102 needs to ensure that the protrusion contacts with the side of the image processing sensor 1 away from the base 3.

Wherein, one side of bellying 102 and image processing sensor 1 contacts, can effectively conduct the heat that image processing sensor 1 produced to the body 101 through bellying 102 and dispel the heat, and supporting seat 10 can bring certain heat-retaining effect in addition, can store image processing sensor 1's instantaneous heating.

In an alternative embodiment, a gap 13 is left between the outer circumferential surface of the image processing sensor 1 and the circuit board 2.

It should be noted that the accommodating chamber 7 may serve as an evaporation chamber, and the cavity 12 may serve as a condensation chamber, and in the case where the gap 13 is left between the outer peripheral surface of the image processing sensor 1 and the circuit board 2, the protrusion 102 may serve as a top wall of the evaporation chamber, so that leakage of the cooling liquid 4 and the vapor can be avoided.

In the case where the accommodating chamber 7 is filled with the cooling liquid 4, the cooling liquid 4 can enter the gap 13, and the image processing sensor 1 is immersed in the cooling liquid 4, so that heat generated by the image processing sensor 1 can be quickly and efficiently taken away.

In an alternative embodiment, a thermally conductive adhesive layer 5 is provided between the image processing sensor 1 and the bottom wall of the receiving cavity 7.

The thermal adhesive layer 5 may be a thermal double-sided tape.

For example, a via hole penetrating the circuit board 2 is formed in the circuit board 2, the image processing sensor 1 is provided in the via hole, and the heat conductive adhesive layer 5 is provided between the side of the image processing sensor 1 facing the bottom wall of the accommodating chamber 7 and the bottom wall of the accommodating chamber 7.

Or, in the case that the circuit board 2 is provided with a blind hole on the side facing the base 3, and the image processing sensor 1 is provided with the blind hole, the heat-conducting adhesive layer 5 is provided between the side of the image processing sensor 1 facing the bottom wall of the accommodating cavity 7 and the bottom wall of the accommodating cavity 7.

It should be noted that, image processing sensor 1 is continuous with the diapire that holds chamber 7 through heat conduction adhesive linkage 5, and the heat that image processing sensor 1 produced this moment can transmit to heat conduction adhesive linkage 5, and heat conduction adhesive linkage 5 is arranged in coolant liquid 4, through setting up heat conduction adhesive linkage 5, has increased the heat transfer area with coolant liquid 4 equivalently to can take away the heat that image processing sensor 1 produced fast effectively.

In an alternative embodiment, the base 3 is made of a thermally conductive material.

The base 3 is made of, for example, a steel sheet.

It should be noted that, image processing sensor 1 links to each other with the diapire that holds chamber 7 through heat conduction adhesive linkage 5, the heat that image processing sensor 1 produced this moment at first transmits to heat conduction adhesive linkage 5, secondly, the heat is transmitted to base 3 by heat conduction adhesive linkage 5 again, and heat conduction adhesive linkage 5 is located coolant liquid 4, through setting up heat conduction adhesive linkage 5 and adopting base 3 made by the heat conduction material, equivalent to increased the heat transfer area with coolant liquid 4, thereby can take away the heat that image processing sensor 1 produced effectively fast.

In an alternative embodiment, the camera module further includes a micro pump 9, the micro pump 9 is disposed in the accommodating chamber 7, and the micro pump 9 is configured to drive the cooling liquid 4 to circulate among the accommodating chamber 7, the fluid channel 11 and the cavity 12.

Two micro pumps 9 may be provided, and the two micro pumps 9 are respectively located at two sides of the image processing sensor 1. The number of the micropumps 9 can be more than two, the number of the micropumps 9 can be selected according to the actual working condition, and the specific number is not specifically limited herein.

It should be noted that a micro pump 9 may be installed on the side of the circuit board 2 contacting the cooling liquid 4, the circuit board 2 is electrically connected to the micro pump 9, and the circuit board 2 can provide power for the micro pump 9.

When the micro pump 9 is started, the disturbance of the cooling liquid 4 can be enhanced, and the heat generated by the image processing sensor 1 is transferred by forced convection, thereby improving the heat exchange efficiency.

The micro pump 9 may be a piezoelectric pump, and the piezoelectric pump mainly includes a piezoelectric vibrator. Under the condition that an alternating current power supply is applied to two ends of the piezoelectric vibrator, the piezoelectric vibrator is radially compressed under the action of an electric field, and tensile stress is generated inside the piezoelectric vibrator, so that the piezoelectric vibrator is bent and deformed. When the piezoelectric vibrator is bent in the positive direction, the piezoelectric vibrator is stretched, the volume of a pump cavity is increased, the pressure of fluid in the cavity is reduced, a pump valve is opened, and cooling liquid 4 enters the pump cavity; when the piezoelectric vibrator is bent reversely, the piezoelectric vibrator contracts, the volume of a pump cavity is reduced, the pressure of fluid in the cavity is increased, a pump valve is closed, and the liquid in the pump cavity is extruded and discharged, so that smooth continuous directional flow is formed.

In an alternative embodiment, the supporting base 10 and the circuit board 2 are formed as an integral structure.

It should be noted that, the supporting seat 10 is directly molded and injection-molded On the circuit board 2 by using an MOC (molding On chip) process, so that the cooling liquid 4 can flow circularly between the accommodating cavity 7, the fluid channel 11 and the cavity 12, and no leakage occurs, and the supporting seat 10 made of a plastic material by using the MOC process has a higher thermal conductivity, and can effectively enhance the heat transfer between the image processing sensor 1 and the supporting seat 10.

In addition, an embodiment of the present application further provides an electronic device, including: the camera module is provided.

The electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, and the like. The embodiment of the present application does not specifically limit the specific type of the electronic device.

It should be noted that, the electronic device using the camera module described above can discharge the heat generated by the image processing sensor 1 in time while achieving the anti-shake function, so that the electronic device has good photographing performance and quality.

In the description herein, references to the description of the term "alternative implementations" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. The utility model provides a camera module which characterized in that includes: the camera lens comprises a circuit board, an image processing sensor, a base, a supporting seat and a lens assembly;

the base is provided with an accommodating cavity, the base further comprises an opening communicated with the accommodating cavity, the circuit board is covered at the opening, cooling liquid is filled in the accommodating cavity, and the image processing sensor is embedded in the circuit board;

the supporting seat is arranged on one side, away from the base, of the circuit board, the lens assembly is arranged on the supporting seat, the supporting seat is provided with a cavity, the circuit board is provided with a fluid channel, and the cavity is communicated with the accommodating cavity through the fluid channel.

2. The camera module according to claim 1, wherein the supporting base includes a body, the body is a ring-shaped structure, a protrusion is protruded on an inner wall of the body, and the cavity is formed in the body and the protrusion.

3. The camera module according to claim 2, wherein the circuit board is provided with a via hole penetrating through the circuit board, the image processing sensor is provided in the via hole, and the protrusion abuts against a side of the image processing sensor away from the base.

4. The camera module of claim 3, wherein a gap is left between an outer peripheral surface of the image processing sensor and the circuit board.

5. The camera module of claim 2, wherein the cavity in the boss extends in the same direction as the boss.

6. The camera module according to claim 5, wherein the plurality of cavities are provided in the protruding portion, the plurality of cavities are sequentially arranged in a direction perpendicular to an extending direction of the protruding portion, and the cavities in the body communicate with the plurality of cavities in the protruding portion.

7. The camera module according to any one of claims 1 to 6, further comprising a micro pump disposed in the accommodating chamber, the micro pump being electrically connected to the circuit board, the micro pump being configured to circulate the cooling fluid between the accommodating chamber, the fluid channel and the cavity.

8. The camera module according to any one of claims 1 to 6, wherein a heat-conducting adhesive layer is disposed between the image processing sensor and the bottom wall of the accommodating cavity.

9. The camera module of any one of claims 1-6, wherein the supporting base and the circuit board are integrally formed.

10. An electronic device, comprising: the camera module of any one of claims 1 to 9.