CN113676631B

CN113676631B - Camera module and electronic equipment

Info

Publication number: CN113676631B
Application number: CN202110908380.9A
Authority: CN
Inventors: 刘帆; 宋功发
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-08-09
Filing date: 2021-08-09
Publication date: 2023-05-26
Anticipated expiration: 2041-08-09
Also published as: CN113676631A

Abstract

The application discloses camera module and electronic equipment, above-mentioned camera module includes: the image processing device comprises a circuit board, an image processing sensor, a base, a supporting seat and a lens assembly; the base is provided with a containing cavity, the base further comprises an opening communicated with the containing cavity, the circuit board is covered at the opening, cooling liquid is filled in the containing cavity, and the image processing sensor is embedded in the circuit board; the lens assembly is arranged on the support seat, a cavity is formed in the support seat, a fluid channel is formed in the circuit board, and the cavity is communicated with the accommodating cavity through the fluid channel.

Description

Camera module and electronic equipment

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a camera module and electronic equipment.

Background

With the progress of technology, the popularity of electronic devices is increasing. A camera module is usually configured in an electronic device, so that a user can conveniently shoot images and videos. The current electronic equipment is usually provided with an anti-shake function to improve imaging quality, the anti-shake mode comprises optical anti-shake, electronic anti-shake, cradle head anti-shake and the like, and for a camera module adopting cradle head anti-shake, a camera is usually required to be mounted on a cradle head supporting seat in a suspended manner, and the camera is enabled to have the capability of moving relative to the cradle head supporting seat by virtue of a driving mechanism, so that cradle head anti-shake is realized. However, because the power consumption of the camera is higher, the heat of the camera is difficult to be dissipated out of the camera module, and the service life of the camera module is seriously influenced.

Disclosure of Invention

The application aims at providing a camera module and electronic equipment, can solve the problem that the camera module of current adoption cloud platform anti-shake dispels the heat difficultly, influences camera module life.

In order to solve the technical problems, the application is realized as follows:

in a first aspect, an embodiment of the present application provides a camera module, including: the image processing device comprises a circuit board, an image processing sensor, a base, a supporting seat and a lens assembly;

the base is provided with a containing cavity, the base further comprises an opening communicated with the containing cavity, the circuit board is covered at the opening, cooling liquid is filled in the containing cavity, and the image processing sensor is embedded in the circuit board; the lens assembly is arranged on the support seat, a cavity is formed in the support seat, a fluid channel is formed in the circuit board, and the cavity is communicated with the accommodating cavity through the fluid channel.

According to the camera module provided by the embodiment of the application, the supporting seat comprises a body, the body is of an annular structure, the inner wall of the body is convexly provided with a protruding portion, and the body and the protruding portion are internally provided with the cavity.

According to the camera module provided by the embodiment of the application, the through hole penetrating through the circuit board is formed in the circuit board, the image processing sensor is arranged in the through hole, and the protruding portion is abutted to one side, away from the base, of the image processing sensor.

According to the camera module provided by the embodiment of the application, a gap is reserved between the outer peripheral surface of the image processing sensor and the circuit board.

According to the camera module provided by the embodiment of the application, the extending direction of the cavity in the protruding portion is the same as the extending direction of the protruding portion.

According to the camera module provided by the embodiment of the application, the plurality of cavities are formed in the protruding portion, the plurality of cavities are sequentially arranged along the vertical direction of the extending direction of the protruding portion, and the cavities in the body are communicated with the plurality of cavities in the protruding portion.

According to the camera module provided by the embodiment of the application, the camera module further comprises a micro pump, the micro pump is arranged in the accommodating cavity and electrically connected with the circuit board, and the micro pump is used for driving the cooling liquid to circularly flow in the accommodating cavity, the fluid channel and the cavity.

According to the camera module provided by the embodiment of the application, the heat conduction bonding layer is arranged between the image processing sensor and the bottom wall of the accommodating cavity.

According to the camera module provided by the embodiment of the application, the supporting seat and the circuit board are of an integrated structure.

In a second aspect, an embodiment of the present application proposes an electronic device, including: the camera module.

In the embodiment of the application, the heat that produces after the image processing sensor work is transmitted to the coolant liquid, and the coolant liquid is heated and evaporated, produces steam to absorb the heat, steam reachs the cavity through fluid passage under the effect of buoyancy, and the supporting seat carries out heat exchange with external world or camera lens subassembly this moment, and the steam condensate becomes liquid after the back, and the liquid of this moment returns to the chamber of holding under the effect of gravity to this heat dissipation that realizes image processing sensor ensures that image processing sensor's temperature accords with the operating temperature requirement.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, wherein:

fig. 1 is one of schematic structural diagrams of a camera module according to an embodiment of the present application;

FIG. 2 is a second schematic diagram of a camera module according to an embodiment of the present application;

reference numerals:

1: an image processing sensor; 2: a circuit board;

3: a base; 4: a cooling liquid;

5: a thermally conductive adhesive layer; 6: a lens assembly;

61: a light filter; 62: an optical lens;

63: a voice coil motor; 7: a receiving chamber;

8: an opening; 9: a micropump;

10: a support base; 101: a body;

102: a boss; 11: a fluid channel;

12: a cavity; 13: a gap.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, it should be understood that the azimuth or positional relationship indicated by the terms "first direction", "second direction", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of description of the present application and simplification of description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application.

As shown in fig. 1, a camera module according to an embodiment of the present application includes: a circuit board 2, an image processing sensor 1, a base 3, a support base 10, and a lens assembly 6.

The lens assembly 6 includes a filter 61, a voice coil motor 63, and an optical lens 62, the filter 61 is used for filtering infrared rays, the optical lens 62 is mounted on the voice coil motor 63, and the voice coil motor 63 is used for realizing a focusing function.

The base 3 has a receiving cavity 7, the base 3 further includes an opening 8 communicating with the receiving cavity 7, and the circuit board 2 is covered at the opening 8, that is, in the case that the circuit board 2 is covered at the opening 8, the receiving cavity 7 can be isolated from the outside.

The accommodating chamber 7 is filled with a cooling liquid 4, and the cooling liquid 4 may be fluorocarbon. The image processing sensor 1 is embedded in the circuit board 2, and the image processing sensor 1 is electrically connected with the circuit board 2.

The image processing sensor 1 may be in contact with the cooling liquid 4, or a gap may exist between the image processing sensor 1 and the cooling liquid 4.

Wherein the image processing sensor 1 may be arranged parallel to the circuit board 2 in order to ensure a maximum contact area between the image processing sensor 1 and the cooling liquid 4. At this time, the entire bottom surface of the image processing sensor 1 is in contact with the cooling liquid 4, thereby improving the heat dissipation efficiency.

In order to arrange the image processing sensor 1 on the circuit board 2, the circuit board 2 is provided with a via hole penetrating through the circuit board 2, or a blind hole is arranged on one side of the circuit board 2 facing the base 3.

For example, the circuit board 2 is provided with a via hole penetrating through the circuit board 2, the image processing sensor 1 is arranged in the via hole, or a blind hole is arranged on one side of the circuit board 2 facing the base 3, and the image processing sensor 1 is arranged in the blind hole.

The supporting seat 10 is arranged on one side of the circuit board 2 far away from the base 3, and the lens component is arranged on the supporting seat 10. The support seat 10 is provided with a cavity 12, the circuit board 2 is provided with a fluid channel 11, and the cavity 12 is communicated with the accommodating cavity 7 through the fluid channel 11.

Wherein through holes are provided in the circuit board 2 to form the above-mentioned fluid passages 11, the through holes penetrating through opposite sides thereof. The number of the fluid passages 11 may be one, two, or more, for example, a plurality of the fluid passages 11 may be sequentially spaced in the radial direction of the circuit board.

In this application embodiment, the heat that produces after image processing sensor 1 work is transmitted to coolant liquid 4, coolant liquid 4 is heated and evaporates, produce steam, thereby absorb the heat, steam reachs cavity 12 through fluid channel 11 under the effect of buoyancy, supporting seat 10 carries out heat exchange with external world or camera lens subassembly this moment, become liquid after the steam condensation, the liquid of this moment returns to holding chamber 7 under the effect of gravity, with this heat dissipation that realizes image processing sensor 1, ensure that the temperature of image processing sensor 1 accords with the operating temperature requirement.

Compared with the common heat conduction and air convection, the evaporative cooling is performed through the cooling liquid 4, so that the heat transfer efficiency is improved, and the temperature of the image processing sensor 1 can be effectively reduced.

In an alternative embodiment, as shown in fig. 2, the supporting seat 10 includes a body 101, where the body 101 is in an annular structure, a boss 102 is convexly disposed on an inner wall of the body 101, and a cavity 12 is disposed in the body 101 and the boss 102.

In the case where the plurality of fluid passages 11 are sequentially arranged at intervals in the radial direction of the circuit board, the inside of the body 101 may be provided with the cavities 12 extending in the first direction, and the inside of the boss 102 is provided with the cavities 12 extending in the first direction, and the fluid passages 11 are in one-to-one correspondence with the cavities 12.

In an alternative embodiment, the cavity 12 within the boss 102 extends in the same direction as the boss 102.

It should be noted that, in order to enhance the heat exchange capability between the support base 10 and the outside or the lens assembly, the body 101 may have a cavity 12 extending along the first direction, the boss 102 may have a plurality of cavities 12 extending along the second direction, the plurality of cavities 12 in the boss 102 may be sequentially arranged along the first direction, and the plurality of cavities 12 in the boss 102 are communicated with the cavity 12 in the body 101. The first direction and the second direction are perpendicular, for example, the first direction is a height direction of the support base 10.

It will be appreciated that the provision of the cavity 12 extending in the second direction within the boss 102 ensures that the heat exchange capacity of the support base 10 with the outside world or the lens assembly is maximized without changing the height of the support base 10.

In an alternative embodiment, the plurality of cavities 12 are provided in the boss 102, the plurality of cavities 12 being arranged in sequence in a direction perpendicular to the extending direction of the boss 102, the cavities 12 in the body 101 being in communication with the plurality of cavities 12 in the boss 102.

For example, the body 101 may have a cavity 12 extending in a first direction, three cavities 12 extending in a second direction are provided in the boss 102, the three cavities 12 in the boss 102 are arranged in sequence in the first direction, and the three cavities 12 in the boss 102 are in communication with one cavity 12 in the body 101.

In an alternative embodiment, a via hole penetrating through the circuit board 2 is provided on the circuit board 2, and in a case where the image processing sensor 1 is provided in the via hole, the boss 102 abuts against a side of the image processing sensor 1 away from the base 3.

It should be noted that the protruding portion 102 is formed to extend in the radial direction of the body 101, and the length of the protruding portion 102 needs to be ensured to be in contact with the side of the image processing sensor 1 away from the base 3.

The protruding portion 102 is in contact with one side of the image processing sensor 1, so that heat generated by the image processing sensor 1 can be effectively conducted to the body 101 through the protruding portion 102 to dissipate heat, and in addition, the supporting seat 10 can bring a certain heat storage effect, so that instantaneous heat of the image processing sensor 1 can be stored.

In an alternative embodiment, a gap 13 is left between the outer peripheral surface of the image processing sensor 1 and the circuit board 2.

It should be noted that, the accommodating chamber 7 may be used as an evaporation chamber, the cavity 12 may be used as a condensation chamber, and the protrusion 102 may be used as a top wall of the evaporation chamber in a case where a gap 13 is left between the outer peripheral surface of the image processing sensor 1 and the circuit board 2, so that leakage of the cooling liquid 4 and the steam can be avoided.

In the case where the accommodating chamber 7 is filled with the cooling liquid 4, the cooling liquid 4 can enter the gap 13, and the image processing sensor 1 at this time corresponds to being immersed in the cooling liquid 4, so that heat generated by the image processing sensor 1 can be quickly and efficiently taken away.

In an alternative embodiment, a thermally conductive adhesive layer 5 is provided between the image processing sensor 1 and the bottom wall of the receiving cavity 7.

The heat-conducting adhesive layer 5 may be a heat-conducting double-sided adhesive tape.

For example, a via hole penetrating the circuit board 2 is provided in the circuit board 2, the image processing sensor 1 is provided in the via hole, and a heat conductive adhesive layer 5 is provided between the side of the image processing sensor 1 facing the bottom wall of the accommodating chamber 7 and the bottom wall of the accommodating chamber 7.

Alternatively, a blind hole is formed in the circuit board 2 on a side facing the base 3, and a heat conductive adhesive layer 5 is provided between the side of the image processing sensor 1 facing the bottom wall of the accommodating chamber 7 and the bottom wall of the accommodating chamber 7 when the image processing sensor 1 is disposed in the blind hole.

It should be noted that, the image processing sensor 1 is connected to the bottom wall of the accommodating cavity 7 through the heat conducting adhesive layer 5, at this time, the heat generated by the image processing sensor 1 can be transferred to the heat conducting adhesive layer 5, and the heat conducting adhesive layer 5 is located in the cooling liquid 4, and by setting the heat conducting adhesive layer 5, the heat exchange area with the cooling liquid 4 is increased, so that the heat generated by the image processing sensor 1 can be taken away quickly and effectively.

In an alternative embodiment, the base 3 is made of a thermally conductive material.

For example, the base 3 is made of steel sheet.

It should be noted that, the image processing sensor 1 is connected to the bottom wall of the accommodating cavity 7 through the heat conducting adhesive layer 5, at this time, the heat generated by the image processing sensor 1 is firstly transferred to the heat conducting adhesive layer 5, and secondly, the heat is transferred to the base 3 through the heat conducting adhesive layer 5, and the heat conducting adhesive layer 5 is located in the cooling liquid 4, and by setting the heat conducting adhesive layer 5 and adopting the base 3 made of the heat conducting material, the heat exchange area with the cooling liquid 4 is increased, so that the heat generated by the image processing sensor 1 can be quickly and effectively carried away.

In an alternative embodiment, the camera module further comprises a micro pump 9, the micro pump 9 being arranged in the receiving chamber 7, the micro pump 9 being arranged to drive the cooling liquid 4 to circulate between the receiving chamber 7, the fluid channel 11 and the cavity 12.

The number of the micropumps 9 may be two, and the two micropumps 9 are respectively located at two sides of the image processing sensor 1. The number of the micro pumps 9 may be more than two, and the number of the micro pumps 9 may be selected according to actual working conditions, and the specific number is not limited herein.

The micro pump 9 may be mounted on a side of the circuit board 2 in contact with the coolant 4, the circuit board 2 is electrically connected to the micro pump 9, and the circuit board 2 can supply electric power to the micro pump 9.

In the case where the micropump 9 is started, the disturbance of the coolant 4 can be enhanced, and the heat generated by the image processing sensor 1 is transferred by forced convection, thereby improving the heat exchange efficiency.

The micropump 9 may be a piezoelectric pump, and the piezoelectric pump mainly includes a piezoelectric vibrator. Under the condition that alternating current power supplies are applied to the two ends of the piezoelectric vibrator, the piezoelectric vibrator is radially compressed under the action of an electric field, and tensile stress is generated inside the piezoelectric vibrator, so that the piezoelectric vibrator is bent and deformed. When the piezoelectric vibrator is bent forwards, the piezoelectric vibrator stretches, the volume of a pump cavity is increased, the pressure of fluid in the cavity is reduced, a pump valve is opened, and cooling liquid 4 enters the pump cavity; when the piezoelectric vibrator bends reversely, the piezoelectric vibrator contracts, the volume of the pump cavity is reduced, the pressure of fluid in the cavity is increased, the pump valve is closed, and the liquid in the pump cavity is extruded and discharged, so that gentle continuous directional flow is formed.

In an alternative embodiment, the support base 10 is integrally formed with the circuit board 2.

It should be noted that, the support base 10 is directly molded and injection molded on the circuit board 2 by adopting the MOC (Molding On Chip) process, so that the cooling liquid 4 can circularly flow among the accommodating cavity 7, the fluid channel 11 and the cavity 12, no leakage can occur, and the support base 10 made of plastic material by the MOC process has a higher heat conductivity coefficient, so that the heat transfer between the image processing sensor 1 and the support base 10 can be effectively enhanced.

In addition, the embodiment of the application also provides electronic equipment, which comprises: the camera module.

The electronic equipment comprises, but is not limited to, a mobile phone, a tablet personal computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device and the like. The specific type of the electronic device is not specifically limited in the embodiments of the present application.

It should be noted that, the electronic device adopting the camera module has the anti-shake function and can timely discharge the heat generated by the image processing sensor 1, so that the electronic device has good photographing performance and quality.

In the description of the present specification, reference to the term "alternative implementations" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A camera module, comprising: the image processing device comprises a circuit board, an image processing sensor, a base, a supporting seat and a lens assembly;

the base is provided with a containing cavity, the base further comprises an opening communicated with the containing cavity, the circuit board is covered at the opening, cooling liquid is filled in the containing cavity, and the image processing sensor is embedded in the circuit board;

the lens assembly is arranged on one side of the circuit board away from the base, the supporting seat is provided with a cavity, the circuit board is provided with a fluid channel, the cavity is communicated with the accommodating cavity through the fluid channel, and the cavity is isolated from the outside.

2. The camera module of claim 1, wherein the support base comprises a body, the body is of an annular structure, a protruding portion is protruding on the inner wall of the body, and the cavities are formed in the body and the protruding portion.

3. The camera module of claim 2, wherein the circuit board is provided with a via penetrating through the circuit board, the image processing sensor is arranged in the via, and the protruding portion is abutted to one side, away from the base, of the image processing sensor.

4. A camera module according to claim 3, wherein a gap is left between the outer peripheral surface of the image processing sensor and the circuit board.

5. The camera module of claim 2, wherein the cavity in the boss extends in the same direction as the boss.

6. The camera module according to claim 5, wherein a plurality of the cavities are provided in the boss, the plurality of the cavities being arranged in order in a direction perpendicular to an extending direction of the boss, the cavity in the body being in communication with the plurality of the cavities in the boss.

7. The camera module of any one of claims 1 to 6, further comprising a micropump disposed in the receiving cavity, the micropump being electrically connected to the circuit board, the micropump configured to drive the cooling fluid to circulate between the receiving cavity, the fluid channel, and the cavity.

8. The camera module of any one of claims 1 to 6, wherein a thermally conductive adhesive layer is provided between the image processing sensor and the bottom wall of the receiving cavity.

9. The camera module of any of claims 1-6, wherein the support base and the circuit board are of an integrally formed structure.

10. An electronic device, comprising: the camera module of any one of claims 1 to 9.