CN111818252B - Electronic equipment and camera module thereof - Google Patents
Electronic equipment and camera module thereof Download PDFInfo
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- CN111818252B CN111818252B CN202010899048.6A CN202010899048A CN111818252B CN 111818252 B CN111818252 B CN 111818252B CN 202010899048 A CN202010899048 A CN 202010899048A CN 111818252 B CN111818252 B CN 111818252B
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- camera
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
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- Aviation & Aerospace Engineering (AREA)
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Abstract
The application discloses electronic equipment and camera module thereof belongs to the communication equipment field, and camera module includes camera, supporting seat and radiating part, the camera sets up one side of supporting seat, the radiating part connect in the camera orientation the surface of supporting seat, the radiating part is semiconductor refrigeration device, just the refrigeration side orientation of radiating part the camera, the heat production side orientation of radiating part the supporting seat, the radiating part with the supporting seat interval sets up, the supporting seat is equipped with the through hole, the space of the mutually opposite sides of supporting seat passes through the through hole communicates each other. Above-mentioned technical scheme can solve the camera module heat dissipation difficulty that adopts the cloud platform anti-shake at present, influences camera module life's problem.
Description
Technical Field
This application belongs to communication equipment technical field, concretely relates to electronic equipment and camera module thereof.
Background
With the progress of science and technology, the popularity of electronic devices is higher and higher. Electronic devices are often provided with a camera module to facilitate the shooting of images and videos by users. Present electronic equipment generally sets and has set the anti-shake function to promote image quality, the anti-shake mode includes optics anti-shake, electron anti-shake and cloud platform anti-shake etc. to the camera module that adopts cloud platform anti-shake, need install the camera unsettled on the cloud platform supporting seat usually, make the camera possess the ability of relative cloud platform supporting seat motion with the help of actuating mechanism, realize cloud platform anti-shake purpose. However, because the power consumption of the camera is high, the heat of the camera is difficult to be dissipated out of the camera module, and the service life of the camera module is seriously influenced.
Disclosure of Invention
The application discloses electronic equipment and camera module thereof can solve the camera module heat dissipation difficulty that adopts the cloud platform anti-shake at present, influences camera module life's problem.
In order to solve the above problem, the embodiments of the present application are implemented as follows:
in a first aspect, an embodiment of the application provides a camera module, it includes camera, supporting seat and heat dissipation portion, the camera sets up one side of supporting seat, the heat dissipation portion connect in the camera orientation the surface of supporting seat, the heat dissipation portion is semiconductor refrigeration device, just the refrigeration side orientation of heat dissipation portion the camera, the heat production side orientation of heat dissipation portion the supporting seat, the heat dissipation portion with the supporting seat interval sets up, the supporting seat is equipped with the through hole, the space of the mutually opposite sides of supporting seat passes through the through hole communicates each other.
In a second aspect, an embodiment of the present application provides an electronic device, which includes the above camera module.
In the camera module disclosed in the application, the camera setting is in one side of supporting seat, and the radiating part is connected in one side of camera towards the supporting seat, and radiating part and supporting seat interval set up, camera and supporting seat swing joint to realize the purpose of cloud platform anti-shake. The heat dissipation part connected to the camera is a semiconductor refrigeration device, and the refrigeration side of the heat dissipation part faces the camera, so that the camera can transfer the heat of the camera to the heat dissipation part, and the temperature of the camera is reduced; simultaneously, the heat production side of radiating part is towards the supporting seat, be equipped with the through hole on the supporting seat, because the heat transfer of camera to radiating part for the atmospheric pressure in the space between radiating part and the supporting seat risees, and then the gaseous opposite side that passes through the through hole to the supporting seat that is located between radiating part and the supporting seat flows, thereby take the heat out to the camera module outside along with gaseous flow, further prevent the high temperature of camera and camera module, guarantee that camera module has higher life.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic structural diagram of a camera module disclosed in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a support seat in the camera module disclosed in the embodiment of the present application;
fig. 3 is another schematic structural diagram of a support seat in the camera module disclosed in the embodiment of the present application;
fig. 4 is a schematic structural diagram of a support seat in the camera module disclosed in the embodiment of the present application;
fig. 5 is a schematic structural diagram of a heat dissipation portion in the camera module disclosed in the embodiment of the present application.
Description of reference numerals:
100-camera,
200-support seat, 210-through hole, 211-first through hole, 212-second through hole,
300-a heat dissipating part, 310-a first heat conducting part, 320-a second heat conducting part, 330-a first electrically conducting part, 340-a second electrically conducting part,
400-pyrolytic graphite heat-conducting sheet,
500-cloud platform support.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 5, an embodiment of the present application discloses a camera module, which includes a camera 100, a supporting base 200, and a heat dissipation portion 300.
The camera 100 is disposed on one side of the supporting base 200, and parameters such as a focal length and pixels of the camera 100 may be determined according to actual requirements, which is not limited herein. The supporting seat 200 can be made of hard materials, so that the supporting seat 200 can provide stable supporting effect for the whole camera module, and the size and the shape of the supporting seat 200 can be determined according to actual requirements.
The heat dissipation part 300 is connected on the surface of the camera 100 facing the support base 200, the heat dissipation part 300 is a semiconductor refrigeration device, the refrigeration side of the heat dissipation part 300 faces the camera 100, and in the use process of the camera module, the heat dissipation part 300 in the power-on state can transmit the heat on the refrigeration side to the heat generation side, so that the temperature of the camera 100 is reduced. Specifically, the heat dissipation portion 300 may be fixedly connected to a surface of the camera head 100 facing the support base 200 by bonding or clamping, the heat dissipation portion 300 may include at least one pair of conductive portions to be connected to a power supply, and the conductive portions may be made of bismuth telluride. Optionally, the heat dissipation portion 300 may include multiple pairs of conductive portions, and the cold ends of the multiple pairs of conductive portions are located on the same side, so that the hot ends of the multiple pairs of conductive portions are located on the same side, thereby achieving the purpose of improving the heat dissipation capability of the heat dissipation portion 300.
Moreover, the heat dissipation part 300 and the support base 200 are arranged at intervals, the size of the interval between the heat dissipation part 300 and the support base 200 can be determined according to the actual conditions such as the size and the activity amplitude of the camera 100, and the camera 100 is movably connected with the support base 200, so that the camera 100 can move relative to the support base 200, and the purpose of preventing the tripod head from shaking is achieved. The heat generating side of the heat dissipating part 300 faces the support base 200, the support base 200 is provided with a through hole 210, and the spaces on the opposite sides of the support base 200 can be communicated with each other through the through hole 210, so that the heat on the heat generating side of the heat dissipating part 300 can be exhausted out of the camera module through the through hole 210 along with the flow of the gas.
Optionally, the number of the through holes 210 may be one, and the through holes 210 may be disposed toward the heat dissipation portion 300, so as to shorten a distance that the gas flows through between a side of the support 200 facing the heat dissipation portion 300 and a side of the support 200 away from the heat dissipation portion 300 as much as possible, and improve the flow efficiency of the gas between spaces at two opposite sides of the support 200. In addition, the shape and size of the through hole 210 may be determined according to actual requirements, as shown in fig. 2 and 3, the through hole 210 may have an oval or rectangular structure, and of course, the through hole 210 may also have other shapes such as a circle or a polygon, which is not limited herein.
In the camera module disclosed in the present application, camera 100 sets up in one side of supporting seat 200, and heat dissipation portion 300 is connected in one side of camera 100 towards supporting seat 200, and heat dissipation portion 300 sets up with supporting seat 200 interval, camera 100 and supporting seat 200 swing joint to make camera 100 can be relative supporting seat 200 activity, realize the purpose of cloud platform anti-shake. Moreover, the heat dissipation part 300 connected to the camera 100 is a semiconductor refrigeration device, and the cooling side of the heat dissipation part 300 faces the camera 100, so that the camera 100 can transfer its own heat to the heat dissipation part 300, and the temperature of the camera 100 is lowered; meanwhile, the heat-generating side of the heat-dissipating part 300 faces the support base 200, the through hole 210 is formed in the support base 200, and the heat of the camera 100 is transferred to the heat-dissipating part 300, so that the air pressure in the space between the heat-dissipating part 300 and the support base 200 is increased, and further, the air between the heat-dissipating part 300 and the support base 200 flows to the other side of the support base 200 through the through hole 210, so that the heat is brought out of the camera module along with the flowing of the air, the temperature of the camera 100 and the camera module is further prevented from being too high, and the camera module is guaranteed to have longer service life.
Certainly, the camera module further includes, for example, a pan/tilt. Optionally, the driving mechanism is a motor, an electro-deformable member, an electromagnetic driving structure, or the like. The camera 100, the driving mechanism and other components can be connected with the main board of the electronic device through the electric connection module, so that the purposes of information and instruction interaction, energy supply and the like are achieved.
Optionally, supporting seat 200 is metallic structure, under this condition, can guarantee that supporting seat 200 can provide higher protective effect for camera 100, optionally, cloud platform support 500 also is metallic structure to further promote the guard action to camera 100, and can guarantee that the structural strength of whole camera module is higher.
Optionally, along the optical axis direction of the camera 100, the projection of the heat dissipation portion 300 can be made to cover the camera 100, so that the area of the heat dissipation portion 300 is increased, and any position of the camera 100 corresponds to the manner of the partial structure of the heat dissipation portion 300, when the heat dissipation efficiency of the camera 100 is further improved, it can be further ensured that each position of the camera 100 has higher heat dissipation efficiency, the temperature of each position on the camera 100 is relatively average, and the camera 100 is further ensured to have longer service life.
Optionally, the heat dissipation portion 300 is fixedly connected with the camera 100 through a heat conductive adhesive, so that while the heat dissipation portion 300 and the camera 100 are ensured to form a reliable fixed connection effect, a heat conduction effect between the heat dissipation portion 300 and the camera 100 can be improved, and thus the heat dissipation effect of the camera 100 is further improved. Wherein, camera 100 includes parts such as circuit board, sensitization chip and camera lens, and a side surface at the circuit board is connected to the sensitization chip, and the camera lens sets up with the sensitization chip is relative, and heat dissipation portion 300 can adopt the heat-conducting glue to paste and establish the one side that deviates from the sensitization chip at the circuit board.
Optionally, the heat dissipation portion 300 includes a first heat conduction portion 310, a second heat conduction portion 320, a first conductive portion 330, and a second conductive portion 340, where the first heat conduction portion 310 and the second heat conduction portion 320 are both insulating structural members, the first heat conduction portion 310 is attached to the surface of the camera 100 facing the support base 200, and the second heat conduction portion 320 is attached to the surface of the support base 200 facing the camera 100. The first conductive portion 330 is connected to the first conductive portion 310, the second conductive portion 340 is connected to the second conductive portion 340, and the first conductive portion 330 is electrically connected to the second conductive portion 340. With the above technical solution, heat can be transferred from the camera 100 to the first conductive part 330 through the first heat conduction part 310, and from the second conductive part 340 to the support base 200 through the second heat conduction part 320, so that heat exchange efficiency between the camera 100 and the support base 200 can be further improved; moreover, the situation of electrical connection between the semiconductor device and the camera 100 can be prevented, and the camera module is ensured to have longer service life and higher safety performance.
Alternatively, the first heat conduction part 310 and the second heat conduction part 320 may be made of ceramic materials, which allows heat to be transferred between the camera head 100 and the first heat conduction part 310 and between the support base 200 and the second heat conduction part 320 more uniformly. More specifically, the number of the first heat conduction portion 310 and the number of the second heat conduction portion 320 are both one, the number of the first conductive portions 330 and the number of the second conductive portions 340 are both multiple, each of the multiple first conductive portions 330 can be connected to a side surface of the first heat conduction portion 310 away from the camera 100, and each of the multiple second conductive portions 340 is connected to a side surface of the second heat conduction portion 320 facing the camera 100, so that the assembly difficulty of the heat dissipation portion 300 is reduced, and meanwhile, the heat dissipation performance of the heat dissipation portion 300 can be improved under the condition that the multiple first conductive portions 330 and the multiple second conductive portions 340 work simultaneously. The first conductive parts 330 and the second conductive parts 340 are alternately connected to form a conductive assembly, and opposite ends of the conductive assembly are respectively connected to the positive electrode and the negative electrode of the power supply.
Optionally, a pyrolytic graphite heat conducting sheet 400 is attached to a side surface of the supporting seat 200 facing away from the camera 100, so that the efficiency of transferring heat out of the camera module can be further improved. The Pyrolytic Graphite heat conducting Sheet 400 is a Sheet-shaped heat conducting structure made of Pyrolytic Graphite (PGS), and can be mounted on a side surface of the supporting seat 200 away from the camera 100 in ways such as attaching. Further, the pyrolytic graphite heat-conducting sheet 400 can be adhered to the surface of the support seat 200 by means of materials such as heat-conducting glue, so that the thermal transmission efficiency is further improved while the higher fixing effect is ensured between the pyrolytic graphite heat-conducting sheet 400 and the support seat 200. Specifically, can make pyrolytic graphite conducting strip 400 cover the surface that supporting seat 200 deviates from camera 100, promote pyrolytic graphite conducting strip 400's heat radiating area on the one hand, on the other hand can also guarantee that the heat transfer efficiency of arbitrary position department is all relatively higher on supporting seat 200.
Further, can set up the through-hole in the relative region of through-hole 210 on pyrolytic graphite conducting strip 400 and supporting seat 200 to guarantee that camera 100's temperature rises, be located the supporting seat 200 towards the gaseous pressure of camera 100 one side and rise under the circumstances, gaseous still can exchange with the camera module outside through-hole 210 on the supporting seat 200 and the through-hole on pyrolytic graphite conducting strip 400 within the camera module, make the radiating efficiency of camera module can obtain further promotion.
As described above, the number of the through holes 210 is one, and in other embodiments of the present application, optionally, the number of the through holes 210 is at least two, and when the number of the through holes 210 is multiple, the size of each through hole 210 is relatively small, so as to reduce adverse effects on the structural strength of the support base 200 caused by the arrangement of the through holes 210 as much as possible, and under the effect of the through holes 210, the spaces on the opposite sides of the support base 200 can be communicated with each other through the through holes 210.
When the number of the through-holes 210 is large, the division of the through-holes 210 can be made more clear, and for example, a part of the through-holes 210 may be the exhaust through-holes 210, and another part of the through-holes 210 may be the intake through-holes 210. Optionally, the through holes 210 include a first through hole 211 and a second through hole 212, and in the working process of the camera module, the gas outside the camera module can flow into the camera module through the first through hole 211, and the gas inside the camera module can flow out of the camera module through the second through hole 212, so that the exchange of the gas inside the camera module and the gas outside the camera module is more orderly, and the heat dissipation efficiency of the camera module is further improved. Further, by providing the first through-hole 211 and the second through-hole 212 at an interval, the probability of interference of the gas flowing through the first through-hole 211 and the second through-hole 212 can be further reduced. Accordingly, the shape and size of the first through hole 211 and the second through hole 212, and the size of the space therebetween can be determined according to actual requirements, and are not limited herein.
Optionally, the camera module disclosed in the embodiment of the present application further includes a gas circulation device, and the gas circulation device may be an axial fan or a cross flow fan. The gas circulation device may be disposed at one side of the support base 200, and the gas circulation device is communicated with the other side of the support base 200 through the through hole 210, so as to further improve the flow efficiency of the gas between the spaces at the two opposite sides of the support base 200 by means of the gas circulation device. Furthermore, the gas circulation device can be disposed on a side of the supporting base 200 away from the camera 100, so as to ensure that the space utilization rate in the camera module is relatively high.
Alternatively, the number of the first through holes 211 is plural, the plural first through holes 211 arranged at intervals constitute a first hole group, and the first hole group and the second through holes 212 are arranged at intervals. When the number of the first through holes 211 is large, it is possible to prevent a blockage of one first through hole 211 from affecting the process of exchanging gas between the inside and the outside of the camera module. Moreover, when the first through holes 211 are provided in a plurality, and the first through holes 211 are arranged at intervals, more areas between the camera 100 and the support base 200 can be directly communicated with the outside through the first through holes 211, so that the exchange efficiency of air inside and outside the camera module is improved. The shapes of the first through holes 211 may be the same or different, and optionally, each of the first through holes 211 may have a rectangular structure, and the first through holes 211 are arranged at intervals and uniformly.
Similarly, the number of the second through holes 212 may also be multiple, and the second through holes 212 arranged at intervals form a second hole group, and the first hole group and the second hole group are arranged at intervals. Adopt under the circumstances of above-mentioned technical scheme, can shorten the gaseous flow path of more positions departments between camera 100 and supporting seat 200 to further promote the inside and outside efficiency and the thorough degree that carry out gas exchange of camera module, promote the heat exchange efficiency of camera module.
Specifically, the shapes of the plurality of second through holes 212 may be the same or different, and optionally, the plurality of first through holes 211 and the plurality of second through holes 212 are all rectangular structures. In addition, when the number of the through holes 210 formed in the support base 200 is increased, the size of each through hole 210 may be appropriately reduced to ensure that the support base 200 has high structural strength.
The electronic device disclosed by the embodiment of the application can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, which is not limited in this embodiment of the application.
In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. The camera module is characterized by comprising a camera (100), a supporting seat (200) and a heat dissipation portion (300), wherein the camera (100) is arranged on one side of the supporting seat (200), the heat dissipation portion (300) is connected to the surface, facing the supporting seat (200), of the camera (100), the heat dissipation portion (300) is a semiconductor refrigeration device, the refrigeration side of the heat dissipation portion (300) faces the camera (100), the heat production side of the heat dissipation portion (300) faces the supporting seat (200), the heat dissipation portion (300) and the supporting seat (200) are arranged at intervals, a through hole (210) is formed in the supporting seat (200), and spaces on two opposite sides of the supporting seat (200) are communicated with each other through the through hole (210).
2. The camera module according to claim 1, wherein the projection of the heat dissipating portion (300) covers the camera (100) in an optical axis direction of the camera (100).
3. The camera module according to claim 1, wherein the heat dissipating portion (300) is fixedly connected to the camera (100) by a thermally conductive adhesive.
4. The camera module according to claim 1, wherein the heat dissipation portion (300) comprises a first heat conduction portion (310), a second heat conduction portion (320), a first conductive portion (330), and a second conductive portion (340), the first heat conduction portion (310) and the second heat conduction portion (320) are both insulating structural members, the first heat conduction portion (310) is attached to the camera (100), the second heat conduction portion (320) faces the support base (200), the first conductive portion (330) is connected to the first heat conduction portion (310), the second conductive portion (340) is connected to the second conductive portion (340), and the first conductive portion (330) is electrically connected to the second conductive portion (340).
5. The camera module according to claim 1, wherein the number of the through holes (210) is at least two, and the camera module comprises a first through hole (211) and a second through hole (212), and the first through hole (211) and the second through hole (212) are arranged at a distance.
6. The camera module according to claim 5, wherein the number of the first through holes (211) is plural, the plural first through holes (211) arranged at intervals form a first hole group, and the first hole group and the second through holes (212) are arranged at intervals.
7. The camera module according to claim 6, wherein the number of the second through holes (212) is plural, the plural second through holes (212) are arranged at intervals to form a second hole group, and the first hole group and the second hole group are arranged at intervals.
8. The camera module according to claim 1, wherein a pyrolytic graphite heat conducting sheet (400) is attached to a surface of the support base (200) facing away from the heat dissipating portion (300).
9. The camera module according to claim 1, wherein the support base (200) is a metal structural member.
10. An electronic device, comprising the camera module of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010899048.6A CN111818252B (en) | 2020-08-31 | 2020-08-31 | Electronic equipment and camera module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010899048.6A CN111818252B (en) | 2020-08-31 | 2020-08-31 | Electronic equipment and camera module thereof |
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| Publication Number | Publication Date |
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| CN111818252A CN111818252A (en) | 2020-10-23 |
| CN111818252B true CN111818252B (en) | 2022-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010899048.6A Active CN111818252B (en) | 2020-08-31 | 2020-08-31 | Electronic equipment and camera module thereof |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113676631B (en) * | 2021-08-09 | 2023-05-26 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131398A (en) * | 2006-11-21 | 2008-06-05 | Sony Corp | Heat dissipation structure of imaging apparatus and imaging apparatus |
| CN201226073Y (en) * | 2008-07-10 | 2009-04-22 | 福州图森图像技术有限公司 | Digital camera with heat-dissipating structure |
| CN101707669B (en) * | 2009-11-26 | 2011-02-02 | 天津市电视技术研究所 | Semiconductor refrigeration camera shield |
| CN204089956U (en) * | 2014-06-03 | 2015-01-07 | 广东欧珀移动通信有限公司 | There is camera module and the mobile phone of refrigerating function |
| CN104104854B (en) * | 2014-08-04 | 2017-02-15 | 中国电子科技集团公司第四十四研究所 | CCD camera with cooler |
| CN208337704U (en) * | 2018-05-28 | 2019-01-04 | 河南领帅电子科技有限公司 | A kind of infrared spherical camera |
| CN208890902U (en) * | 2018-09-05 | 2019-05-21 | 浙江华睿科技有限公司 | A kind of video camera cooling mechanism and video camera |
| CN208798072U (en) * | 2018-10-25 | 2019-04-26 | 程化亮 | A kind of monitoring camera |
| CN209517311U (en) * | 2019-03-29 | 2019-10-18 | 徐州威卡电子控制技术有限公司 | Camera radiator structure suitable for hot environment |
| CN210041979U (en) * | 2019-08-01 | 2020-02-07 | 广州美电恩智电子科技有限公司 | Conch camera convenient to heat dissipation |
| CN210578835U (en) * | 2019-11-08 | 2020-05-19 | 上海摩象网络科技有限公司 | Portable camera |
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