CN113597101A - Circuit board, module board and manufacturing method thereof - Google Patents
Circuit board, module board and manufacturing method thereof Download PDFInfo
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- CN113597101A CN113597101A CN202110744663.4A CN202110744663A CN113597101A CN 113597101 A CN113597101 A CN 113597101A CN 202110744663 A CN202110744663 A CN 202110744663A CN 113597101 A CN113597101 A CN 113597101A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The application provides a circuit board, a module board and a manufacturing method thereof. The method for manufacturing the module board comprises the following steps: acquiring the aperture data of a semi-metallized hole to be formed of the module plate; judging whether the aperture data of the semi-metallized hole is larger than or equal to a preset value; if so, processing a metal forming hole at the position adjacent to the semi-metallized hole formed on the module board; carrying out metallization treatment in the metal forming hole to form a metal layer; starting from the metal layer, adopting a left-handed cutter row cutter first preset path to the semi-metallized hole to be formed along the anticlockwise direction, and starting from the metal layer, adopting a right-handed cutter row cutter second preset path to the semi-metallized hole to be formed along the clockwise direction; and processing and forming a semi-metallized hole on the module plate. In the manufacturing method of the module board, the semi-metallized hole which is processed and formed does not have the problem of copper sheet tilting or flash residue at least in the area adjacent to the metal layer.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board, a module board and a manufacturing method thereof.
Background
The hole wall of a semi-metallized hole of a traditional module board has the problem of copper sheet tilting or flash residue particularly at the position with large change of the contour curvature of the hole wall. Specifically, copper wires or burrs remain on the hole walls of the semi-metallized holes, which is a problem that a manufacturer of a downstream SMT (Surface Mounted Technology, Surface assembly Technology) is prone to have infirm welding points, insufficient welding, short circuit bridging and the like during a pin welding process, and therefore the problem of copper skin tilting or burrs on the hole walls of the semi-metallized holes is not accepted by the SMT manufacturer. In order to avoid the problem of copper sheet tilting or flash, the problem of manually removing copper wires or flash is mostly adopted in the processing of semi-metallized holes of the module board, so that the production of the module board is time-consuming and labor-consuming, the quality is not easy to control, and the mass production delivery period cannot be met.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a circuit board, a module board and a manufacturing method thereof for solving the technical problems.
The purpose of the invention is realized by the following technical scheme:
a method of manufacturing a modular plate, comprising:
acquiring the aperture data of the semi-metallized hole to be formed of the module plate;
judging whether the aperture data of the semi-metallized hole is larger than or equal to a preset value;
if so, processing a metal forming hole at the position adjacent to the semi-metallized hole formed on the module board;
carrying out metallization treatment in the metal forming hole to form a metal layer;
starting from the metal layer, adopting a left-handed cutter row cutter first preset path to the position of the semi-metallized hole to be formed along the anticlockwise direction, and starting from the metal layer, adopting a right-handed cutter row cutter second preset path to the position of the semi-metallized hole to be formed along the clockwise direction;
and machining and forming a semi-metallized hole on the module board, wherein the first preset path and the second preset path are intersected with the outline of the hole wall of the semi-metallized hole.
In one embodiment, if not, a metal forming hole is processed on the module board adjacent to the inner side of the routing contour line to be routed;
carrying out graphic electroplating treatment on the module board to form a metal layer in the metal forming hole, wherein two cross points which are respectively a first cross point and a second cross point are sequentially distributed along the anticlockwise direction between the metal layer of the metal forming hole and the routing contour line;
machining and forming one of the semi-metallized holes at a second intersection point of the module plate by adopting a right-hand cutter;
carrying out mirror image inversion on the module board;
machining and forming another half-metallized hole at the first intersection point of the reversed module plate by adopting a right-hand cutter;
and carrying out routing processing on the routing contour line of the module board.
In one embodiment, the number of the metal forming holes is multiple, and the multiple metal forming holes are distributed at intervals along the circumferential direction of the routing contour line.
In one embodiment, the step of forming one of the half-metallized holes at the second intersection point of the module board by using a right-hand cutter is specifically as follows:
and machining and forming one of the semi-metallized holes in a drilling and cutting direction which forms a preset angle with the extending direction of the routing contour line by adopting a right-handed cutter at a second intersection point of the module board.
In one embodiment, the step of machining and forming another half-metallized hole by using a right-hand tool at the first intersection point of the reversed module board specifically comprises the following steps:
and machining and forming another semi-metallized hole in the drilling direction of the preset angle with the extending direction of the routing contour line by adopting a right-handed cutter at the first intersection point of the reversed module board.
In one embodiment, the predetermined angle is greater than or equal to 50 ° to 70 °.
In one embodiment, the first predetermined path extends tangentially to the contour of the wall of the semi-metallized hole.
In one embodiment, the second predetermined path extends tangentially to the contour of the wall of the semi-metallized hole.
In one embodiment, the predetermined value is greater than or equal to 1.5 mm.
A module board is manufactured by the manufacturing method of any one of the above embodiments.
A circuit board comprises the module board.
Compared with the prior art, the invention has at least the following advantages:
the manufacturing method of the module board comprises the steps of firstly, acquiring the aperture data of the semi-metallized hole to be formed of the module board; then judging whether the aperture data of the semi-metallized hole is larger than or equal to a preset value; if so, firstly processing a metal forming hole at the adjacent position of the formed semimetal hole of the module board, and then carrying out metallization treatment in the metal forming hole to form a metal layer, thus forming a stable conductive metal layer at the adjacent position of the formed semimetal slide hole in advance; then starting from the metal layer, adopting a left-handed cutter to perform a first preset path to the position of the semi-metallized hole to be formed along the anticlockwise direction, so that the copper sheet adjacent to the first preset path is pushed and overturned to the position of the semi-metallized hole to be formed in advance, starting from the metal layer, adopting a right-handed cutter to perform a second preset path to the position of the semi-metallized hole to be formed along the clockwise direction, and so that the copper sheet adjacent to the second preset path is also pushed and overturned to the position of the semi-metallized hole to be formed in advance; and finally, processing and forming the semi-metallized hole on the module board, wherein the first preset path and the second preset path are intersected with the outline of the hole wall of the semi-metallized hole, so that the problem that the copper sheet is tilted or the flash is remained in the area of the semi-metallized hole at least adjacent to the metal layer can be avoided, the situation that the copper sheet is tilted or the flash is remained can be completely avoided by the area outline of the adjacent metal layer of the formed semi-metallized hole, the batch mechanical production can be realized, and the produced module board does not need to manually remove the copper wire or the flash.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic flow chart illustrating a method for manufacturing a module board according to an embodiment;
fig. 2 is a schematic structural view illustrating a process of processing a module board in step S105 of the method of manufacturing the module board shown in fig. 1;
fig. 3 is a schematic structural view illustrating a process of processing a module board in step S109 of the manufacturing method of the module board shown in fig. 1;
fig. 4 is a schematic structural view illustrating a process of processing a module board in step S111 of the manufacturing method of the module board shown in fig. 1;
FIG. 5 is a schematic flow chart showing a method of manufacturing a module board according to another embodiment;
fig. 6 is a schematic structural view illustrating the processing of a module board in step S115 of the method for manufacturing a module board shown in fig. 5;
fig. 7 is a schematic structural view illustrating the processing of the module board in step S121 of the method for manufacturing the module board shown in fig. 5;
fig. 8 is a schematic structural view illustrating the processing of the module board in step S123 of the method for manufacturing the module board shown in fig. 5.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a method of manufacturing a module board according to an embodiment is used to manufacture the module board. So-called module boards are used for mounting chips or other electronic components and the like by the SMT process. Further, the manufacturing method of the module board includes a part or all of the following steps:
and S101, acquiring the aperture data of the semi-metallized hole to be formed of the module board.
In this embodiment, the aperture data of the half-metallized hole to be formed of the module board is obtained, that is, the aperture size of the half-metallized hole to be formed of the module board is obtained.
S103, judging whether the aperture data of the semi-metallized holes are larger than or equal to a preset value.
In this embodiment, it is determined whether the data of the hole diameter of the half-metallized hole is greater than or equal to a predetermined value, and the predetermined value is adjusted according to the material or the requirement of the module board before processing.
And S105, if so, processing a metal forming hole at the position adjacent to the semi-metallized hole formed on the module board.
In this embodiment, if the aperture data of the half-metallized hole is greater than or equal to the predetermined value, referring to fig. 2, it is a schematic structural diagram of the module board processed in step S105 of the manufacturing method of the module board shown in fig. 1, where the position where the half-metallized hole is formed is indicated by a dotted line. And processing a metal forming hole 14 at a position adjacent to the formed semi-metallized hole 12 of the module board 10, namely processing a metal forming hole at a position adjacent to the formed semi-metallized hole of the module board, so that the processing and forming position of the metal forming hole is arranged adjacent to the forming position of the semi-metallized hole, so that the pin of the subsequent packaged component is reliably conductive. Specifically, the module board is provided with conductive sites 16, with metal forming holes and semi-metallized holes both disposed adjacent the conductive sites.
S107, carrying out metallization treatment in the metal forming hole to form a metal layer.
As shown in fig. 2, in the present embodiment, a metallization process is performed in the metal forming hole to form the metal layer 18, i.e., the metal layer is formed in the metal forming hole 14. In one embodiment, the metal layer may be a copper layer or a silver layer with excellent conductivity.
And S109, starting from the metal layer, adopting a first preset path of a left-handed cutter row cutter in the anticlockwise direction to the position of the semi-metallized hole to be formed, and starting from the metal layer, adopting a second preset path of a right-handed cutter row cutter in the clockwise direction to the position of the semi-metallized hole to be formed.
As shown in fig. 3, which is a schematic structural diagram of the module board processed in step S109 of the manufacturing method of the module board shown in fig. 1, the positions where the half-metallized holes are formed are indicated by dotted lines. In this embodiment, a left-handed tool 20 is used to move the first predetermined path 21 in the counterclockwise direction from the metal layer 18 to the contour of the hole wall of the semi-metallized hole 12 to be formed, so that the contour of the hole wall of the semi-metallized hole to be formed and the area adjacent to the metal layer on the module board are first subjected to the operation of removing the copper skin or the flash, because the left-handed tool is used to move the contour of the hole wall of the semi-metallized hole to be formed and the copper skin of the area adjacent to the metal layer are pushed and turned to one side of the position of the semi-metallized hole to be formed in advance, and a right-handed tool 30 is used to move the second predetermined path 31 in the clockwise direction from the metal layer 18 to the contour of the hole wall of the semi-metallized hole 12 to be formed, so that the contour of the hole wall of the semi-metallized hole to be formed on the module board and the area adjacent to the metal layer are first subjected to the operation of removing the copper skin or the flash, due to the fact that the right-handed cutter is used for cutting, the outline of the hole wall of the semi-metallized hole to be formed and the copper sheet of the area adjacent to the metal layer are pushed and turned to one side of the position of the semi-metallized hole to be formed in advance. In one embodiment, either "clockwise" or "counterclockwise" is defined as being perpendicular to the machine plane of the current operation of the module board.
And S111, processing and forming a semi-metallized hole on the module board, wherein the first preset path and the second preset path are intersected with the outline of the hole wall of the semi-metallized hole.
As shown in fig. 4, in the present embodiment, a semi-metallized hole 12 is formed in the module board 10, and both the first predetermined path and the second predetermined path intersect with the contour of the hole wall of the semi-metallized hole, so that the first predetermined path and the second predetermined path are at least partially located in the forming area of the semi-metallized hole, and thus there is no problem of copper skin warpage or flash at least at the position adjacent to the metal layer on the hole wall formed by the semi-metallized hole, so that the semi-metallized hole is reliably conductive through the metal layer. In one embodiment, the intersection between the outline of the hole wall of the semi-metallized hole and the metal layer is an arc segment, the arc segment sequentially includes a first arc end point and a second arc end point along the clockwise direction, the step of starting from the metal layer and adopting a left-handed tool row knife first predetermined path along the counterclockwise direction to the position where the semi-metallized hole is to be formed, and the step of starting from the metal layer and adopting a right-handed tool row knife second predetermined path along the clockwise direction to the position where the semi-metallized hole is to be formed specifically includes: starting from the metal layer, a first preset path of the left-handed cutter row cutter is adopted at least to a first arc-shaped end point along the anticlockwise direction, and starting from the metal layer, a second preset path of the right-handed cutter row cutter is adopted at least to a second arc-shaped end point along the clockwise direction, so that copper skin or flash existing at the junction of the hole wall of the semi-metallized hole and the metal layer is reliably removed.
The manufacturing method of the module board comprises the steps of firstly, acquiring the aperture data of the semi-metallized hole to be formed of the module board; then judging whether the aperture data of the semi-metallized hole is larger than or equal to a preset value; if so, firstly processing a metal forming hole at the adjacent position of the formed semimetal hole of the module board, and then carrying out metallization treatment in the metal forming hole to form a metal layer, thus forming a stable conductive metal layer at the adjacent position of the formed semimetal slide hole in advance; then starting from the metal layer, adopting a left-handed cutter to perform a first preset path to the position of the semi-metallized hole to be formed along the anticlockwise direction, so that the copper sheet adjacent to the first preset path is pushed and overturned to the position of the semi-metallized hole to be formed in advance, starting from the metal layer, adopting a right-handed cutter to perform a second preset path to the position of the semi-metallized hole to be formed along the clockwise direction, and so that the copper sheet adjacent to the second preset path is also pushed and overturned to the position of the semi-metallized hole to be formed in advance; and finally, processing and forming the semi-metallized hole on the module board, wherein the first preset path and the second preset path are intersected with the outline of the hole wall of the semi-metallized hole, so that the problem that the copper sheet is tilted or the flash is remained in the area of the semi-metallized hole at least adjacent to the metal layer can be avoided, the situation that the copper sheet is tilted or the flash is remained can be completely avoided by the area outline of the adjacent metal layer of the formed semi-metallized hole, the batch mechanical production can be realized, and the produced module board does not need to manually remove the copper wire or the flash.
As shown in fig. 5, in one embodiment, in S113, if not, a metal forming hole is processed on the module board adjacent to the inner side of the routing contour to be routed.
Referring to fig. 6, which is a schematic structural diagram of the module board processed in step S115 of the manufacturing method of the module board shown in fig. 5, wherein a dotted line indicates a position where the routing contour line is processed, in this embodiment, if not, that is, if the aperture data of the semi-metal hole is smaller than a predetermined value, a metal forming hole 14 is processed on the module board 10 at an inner side adjacent to the routing contour line 15 to be routed. In one embodiment, the number of the metal forming holes is multiple, and the multiple metal forming holes are distributed at intervals along the circumferential direction of the routing contour line, so that a plurality of semi-metallized holes can be formed in the module board in a machining mode, and a plurality of pins of an electronic component can be mounted at the same time.
And S115, carrying out graphic electroplating treatment on the module board to form a metal layer in the metal forming hole, wherein two cross points which are distributed in sequence along the anticlockwise direction exist between the metal layer of the metal forming hole and the routing contour line and are respectively a first cross point and a second cross point.
As shown in fig. 6, in this embodiment, the module board 10 is subjected to a pattern plating process to form a metal layer 18 in the metal forming hole 14, wherein two intersections, namely a first intersection 181 and a second intersection 183, exist between the metal layer of the metal forming hole and the routing contour line, and are sequentially distributed along the counterclockwise direction. Specifically, the routing contour line is rectangular, and two cross points exist on one side of the metal layer of the metal forming hole and one side of the routing contour line. In one embodiment, the number of the metal forming holes is more than two, and two cross points exist between the metal layer of each metal forming hole and one side of the routing contour line.
And S117, machining and forming one semi-metallized hole at the second intersection point of the module board by adopting a right-hand cutter.
As shown in fig. 6 and 7, in this embodiment, one of the half-metallized holes 12 is formed at the second intersection 183 of the module board by using a right-handed cutter, so that the copper sheet of the inner wall of the metal forming hole adjacent to the routing contour line is cut off and removed in advance, and thus the problem of copper sheet tilting or burr residue does not exist on the inner wall of the half-metallized hole. In one embodiment, the semi-metallized hole has a diameter less than the diameter of the metal forming hole, and the semi-metal hole intersects the metal forming hole.
And S119, carrying out mirror image inversion on the module board.
In this embodiment, the module board is mirror-inverted so that the module board is turned over from the front side to the back side. One semi-metallized hole is machined and formed on the front surface of the module board, and the module board is subjected to mirror image inversion so as to continuously machine the other semi-metallized hole on the reverse surface of the module board by adopting the same right-handed cutter.
And S121, machining and forming another semi-metallized hole at the first intersection point of the reversed module board by adopting a right-handed cutter.
In this embodiment, another semi-metallized hole is formed at the first intersection of the reversed module board by machining with a right-handed cutter, so that the copper sheet of the inner wall of the metal forming hole adjacent to the routing contour line is cut off in advance, and the problem of copper sheet tilting or flash residue does not exist on the inner wall of the semi-metallized hole machined in this way. Specifically, another semi-metallized hole is formed on the reverse side of the module board in a machining mode, and therefore the copper sheet is removed in advance at the first intersection and the second intersection where the metal forming hole and the routing contour line intersect.
And S123, routing and cutting on the routing and cutting contour line of the module board.
As shown in fig. 7 and 8, in this embodiment, routing processing is performed on the routing contour line 15 of the module board 10 to remove redundant board edge waste and the metal layer outside the routing contour line of the module board, so that the semi-metallized hole smaller than the predetermined value is processed, and thus the semi-metallized hole with any aperture size is mechanically processed, so that the produced module board does not need to manually remove copper wires or burrs, and meanwhile, the applicability of the manufacturing method of the module board is improved.
In one embodiment, after the step of forming another semi-metallized hole at the first intersection point of the reversed module board by using the right-hand tool, the method for manufacturing the module board further comprises the following steps: the template is etched to remove excess copper foil.
In one embodiment, the step of forming one of the half-metallized holes at the second intersection point of the module board by using a right-hand cutter is specifically as follows: and machining and forming one of the semi-metallized holes in a drilling and cutting direction which forms a preset angle with the extending direction of the routing contour line by adopting a right-handed cutter at a second intersection point of the module board. In one embodiment, the step of machining and forming another half-metallized hole by using a right-hand tool at the first intersection point of the reversed module board specifically comprises the following steps: and machining and forming another semi-metallized hole in the drilling direction of the preset angle with the extending direction of the routing contour line by adopting a right-handed cutter at the first intersection point of the reversed module board. In this embodiment, the right-handed cutter is adopted to drill and cut two semi-metallized holes on two opposite sides of the module board respectively, the tool changing is not needed, the direction of the feed is not needed to be adjusted, the included angles between the drilling and cutting tangent directions of the two times of drilling and cutting processing and the extending direction of the milling cutting contour line are equal and are preset angles, namely, the included angles between the tangent line of the cut-off point of the hole wall of the semi-metallized hole obtained by the two times of drilling and cutting processing and the track of the milling cutter processing milling cutting contour line are equal and are preset angles.
In one embodiment, the predetermined angle is greater than or equal to 50 ° to 70 °. In the present embodiment, the predetermined angle may be 60 °. Because the routing contour line of the module board has a certain distance from the center of the through hole, the cutting angle of the milling cutter is changed, copper in the hole is not easy to be pulled out, and the problem that the hole wall of the semi-metallized hole has copper sheet warpage or flash is avoided.
In one embodiment, the extending direction of the first predetermined path is tangent to the contour of the hole wall of the semi-metallized hole, so that the row knife length of the cutter is reduced, and the copper skin or flash existing at the position where the hole wall of the semi-metallized hole is connected with the metal layer can be reliably removed.
In one embodiment, the extending direction of the second predetermined path is tangent to the contour of the hole wall of the semi-metallized hole, so that the row knife length of the cutter is reduced, and the copper skin or flash existing at the position where the hole wall of the semi-metallized hole is connected with the metal layer can be reliably removed.
In one embodiment, the predetermined value is greater than or equal to 1.5 mm. In the present embodiment, the predetermined value is 1.5 mm. It is understood that in other embodiments, the predetermined value may be adjusted to other values as desired.
The application also provides a module board manufactured by the manufacturing method of the module board in any embodiment.
The application also provides a circuit board, which comprises the module board in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
the manufacturing method of the module board comprises the steps of firstly, acquiring the aperture data of the semi-metallized hole to be formed of the module board; then judging whether the aperture data of the semi-metallized hole is larger than or equal to a preset value; if so, firstly processing a metal forming hole at the adjacent position of the formed semimetal hole of the module board, and then carrying out metallization treatment in the metal forming hole to form a metal layer, thus forming a stable conductive metal layer at the adjacent position of the formed semimetal slide hole in advance; then starting from the metal layer, adopting a left-handed cutter to perform a first preset path to the position of the semi-metallized hole to be formed along the anticlockwise direction, so that the copper sheet adjacent to the first preset path is pushed and overturned to the position of the semi-metallized hole to be formed in advance, starting from the metal layer, adopting a right-handed cutter to perform a second preset path to the position of the semi-metallized hole to be formed along the clockwise direction, and so that the copper sheet adjacent to the second preset path is also pushed and overturned to the position of the semi-metallized hole to be formed in advance; and finally, processing and forming the semi-metallized hole on the module board, wherein the first preset path and the second preset path are intersected with the outline of the hole wall of the semi-metallized hole, so that the problem that the copper sheet is tilted or the flash is remained in the area of the semi-metallized hole at least adjacent to the metal layer can be avoided, the situation that the copper sheet is tilted or the flash is remained can be completely avoided by the area outline of the adjacent metal layer of the formed semi-metallized hole, the batch mechanical production can be realized, and the produced module board does not need to manually remove the copper wire or the flash.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method of manufacturing a modular plate, comprising:
acquiring the aperture data of the semi-metallized hole to be formed of the module plate;
judging whether the aperture data of the semi-metallized hole is larger than or equal to a preset value;
if so, processing a metal forming hole at the position adjacent to the semi-metallized hole formed on the module board;
carrying out metallization treatment in the metal forming hole to form a metal layer;
starting from the metal layer, adopting a left-handed cutter row cutter first preset path to the position of the semi-metallized hole to be formed along the anticlockwise direction, and starting from the metal layer, adopting a right-handed cutter row cutter second preset path to the position of the semi-metallized hole to be formed along the clockwise direction;
and machining and forming a semi-metallized hole on the module board, wherein the first preset path and the second preset path are intersected with the outline of the hole wall of the semi-metallized hole.
2. The method of claim 1, wherein if not, metal forming holes are formed in the module board adjacent to the inner sides of the routing contours to be routed;
carrying out graphic electroplating treatment on the module board to form a metal layer in the metal forming hole, wherein two cross points which are respectively a first cross point and a second cross point are sequentially distributed along the anticlockwise direction between the metal layer of the metal forming hole and the routing contour line;
machining and forming one of the semi-metallized holes at a second intersection point of the module plate by adopting a right-hand cutter;
carrying out mirror image inversion on the module board;
machining and forming another half-metallized hole at the first intersection point of the reversed module plate by adopting a right-hand cutter;
and carrying out routing processing on the routing contour line of the module board.
3. The method of claim 2, wherein the number of the metal forming holes is plural, and the plural metal forming holes are spaced apart from each other in a circumferential direction of the routing contour line.
4. The method for manufacturing a module board according to claim 2, wherein the step of forming one of the half-metallized holes at the second intersection of the module board by using a right-hand tool is specifically as follows:
machining and forming one of the semi-metallized holes in a drilling and cutting direction which forms a preset angle with the extending direction of the routing contour line by adopting a right-handed cutter at a second intersection point of the module board;
the step of machining and forming another semi-metallized hole by adopting a right-hand cutter at the first intersection point of the reversed module plate specifically comprises the following steps:
and machining and forming another semi-metallized hole in the drilling direction of the preset angle with the extending direction of the routing contour line by adopting a right-handed cutter at the first intersection point of the reversed module board.
5. The method of manufacturing a module board according to claim 4, wherein the predetermined angle is 50 ° to 70 °.
6. The method of manufacturing a modular plate as claimed in claim 1, wherein the first predetermined path extends tangentially to the contour of the wall of the semi-metallized hole.
7. The method of manufacturing a modular plate as claimed in claim 1, wherein the second predetermined path extends tangentially to the contour of the wall of the semi-metallized hole.
8. The method for manufacturing a module board according to any one of claims 1 to 7, wherein the predetermined value is 1.5mm or more.
9. A module board manufactured by the method for manufacturing a module board according to any one of claims 1 to 8.
10. A circuit board comprising the modular board of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110744663.4A CN113597101B (en) | 2021-06-30 | 2021-06-30 | Circuit board, module board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2000124612A (en) * | 1998-01-19 | 2000-04-28 | Toshiba Corp | Wiring board, its manufacturing method, and electrical equipment with wiring board |
| CN101969746A (en) * | 2010-11-04 | 2011-02-09 | 沪士电子股份有限公司 | Method for removing electroplating copper locally in hollowed-out area of printed circuit board |
| US20150264804A1 (en) * | 2011-11-03 | 2015-09-17 | Zhuhai Founder Tech Hi-Density Electronic Co Ltd. | Pcb back drill detection method and pcb plating |
| CN112040652A (en) * | 2020-08-24 | 2020-12-04 | 胜宏科技（惠州）股份有限公司 | Forming method for improving PTH half-hole burrs |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000124612A (en) * | 1998-01-19 | 2000-04-28 | Toshiba Corp | Wiring board, its manufacturing method, and electrical equipment with wiring board |
| CN101969746A (en) * | 2010-11-04 | 2011-02-09 | 沪士电子股份有限公司 | Method for removing electroplating copper locally in hollowed-out area of printed circuit board |
| US20150264804A1 (en) * | 2011-11-03 | 2015-09-17 | Zhuhai Founder Tech Hi-Density Electronic Co Ltd. | Pcb back drill detection method and pcb plating |
| CN112040652A (en) * | 2020-08-24 | 2020-12-04 | 胜宏科技（惠州）股份有限公司 | Forming method for improving PTH half-hole burrs |
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