CN113784512B - Method for manufacturing semi-metallized hole of circuit board - Google Patents
Method for manufacturing semi-metallized hole of circuit board Download PDFInfo
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- CN113784512B CN113784512B CN202110910514.0A CN202110910514A CN113784512B CN 113784512 B CN113784512 B CN 113784512B CN 202110910514 A CN202110910514 A CN 202110910514A CN 113784512 B CN113784512 B CN 113784512B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to the technical field of circuit board manufacturing, and provides a method for manufacturing a semi-metallized hole of a circuit board, which comprises the following steps: providing a substrate, wherein the substrate is provided with a metalized hole and a region to be formed; processing the substrate by a first routing tool according to a first path, wherein the first path comprises a first lower tool point and a first processing point, the first lower tool point is positioned inside or outside the metallized hole, and the first processing point is intersected with the metal side edge of the metallized hole; and processing the substrate by a second routing tool according to a second path, wherein the second path is intersected with the first processing point, the second path comprises a second lower cutting point and a second processing point, and the second lower cutting point and the first lower cutting point are respectively positioned at two sides of the metal side edge. The invention also provides a circuit board. The method for manufacturing semi-metallized holes of circuit board of the present invention can prevent the metal side of the semi-metallized hole from generating burrs when processing the semi-metallized hole. The circuit board of the present invention has no burr and high quality.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board semi-metallized hole manufacturing method and a circuit board.
Background
When the circuit board is required to be applied to a communication wireless power amplifier product, a semi-metallized hole or a semi-metallized groove is usually required to be designed in the printed circuit board, the designed semi-metallized hole or semi-metallized groove can realize the conduction function of a round hole, and can be welded and fixed through the hole wall of the semi-hole, so that the pins of components are fixed, and the printed circuit board is a conventional design in the printed circuit board.
In the existing semi-metallized hole manufacturing method, a drill or a milling cutter is often used for milling the semi-metallized holes, burrs are often left on the metal side walls and the hole rings of the semi-metallized holes after the semi-metallized holes are machined, and the burrs are often removed at the later stage in order to ensure the quality of a circuit board, so that time and labor are wasted.
Disclosure of Invention
The invention provides a circuit board semi-metallized hole manufacturing method and a circuit board, which can prevent burrs from being generated on a metal side wall and a hole ring of a semi-metallized hole when the semi-metallized hole is processed.
An embodiment of a first aspect of the present application provides a method for manufacturing a semi-metallized hole of a circuit board, including:
providing a substrate, wherein a metalized hole and a to-be-formed area are arranged on the substrate, the boundary of the to-be-formed area comprises a plurality of forming lines and partial metal side edges of the metalized hole, and the metal side edges comprise metal side walls and hole rings;
processing the substrate by a first routing tool according to a first path, wherein the first path comprises a first lower tool point and a first processing point, the first lower tool point is positioned inside or outside the metallized hole, and the first processing point is intersected with the metal side edge of the metallized hole;
and processing the substrate by a second routing tool according to a second path, wherein the second path is intersected with the first processing point, the second path comprises a second lower tool point and a second processing point, the second lower tool point and the first lower tool point are respectively positioned at two sides of the metal side edge, and the second processing point is positioned in the region to be formed or is intersected with one of the forming lines.
In some embodiments, the first path includes a first sub-path and a second sub-path connected at an included angle, the first sub-path is arranged in parallel with one of the forming lines, one end of the first sub-path is a first lower cutting point, the first lower cutting point is located inside the metallized hole, a connection point of the first sub-path and the second sub-path is a first processing point, and the other end of the second sub-path is located outside the metallized hole and inside the region to be formed; and when the second routing knife processes the substrate according to a second path, the second path is parallel to the first sub-path.
In some of these embodiments, the first sub-path and the second sub-path include an angle of 120 ° to 150 °.
In some embodiments, the second path comprises a third sub-path and a fourth sub-path which are connected at an included angle, one end of the third sub-path is a second cutting point, the fourth sub-path is coincident with one of the forming lines, one end of the fourth sub-path is a second processing point, and the fourth sub-path is arranged in parallel with the first sub-path; and when the second routing tool processes the substrate according to a second path, the fourth sub-path intersects with the first processing point.
In some of these embodiments, the third sub-path and the fourth sub-path are arranged vertically.
In some embodiments, the first lower tool point is located outside the metallized hole when a first routing tool is used to process the substrate according to a first path; the second path comprises a fifth sub-path and a sixth sub-path which are connected in an included angle, one end of the fifth sub-path is a third lower cutting point, the third lower cutting point is positioned outside the metallized hole, a connection point of the sixth sub-path and the fifth sub-path is a second lower cutting point, the other end of the sixth sub-path is a second processing point, the fifth sub-path is intersected with the metal side edge of the metallized hole, and the sixth sub-path is intersected with the first processing point.
In some of these embodiments, the angle between the fifth sub-path and the sixth sub-path is 120 ° to 150 °.
In some embodiments, the first gong cutter and the second gong cutter rotate in opposite directions.
In some of these embodiments, the diameter of the first gong cutter is less than the diameter of the second gong cutter.
A circuit board is processed by the circuit board semi-metallized hole manufacturing method according to the first aspect.
The method for manufacturing the semi-metallized hole of the circuit board provided by the embodiment of the invention has the beneficial effects that: the substrate is processed by the first routing tool according to the first path, the metal side edge is cut into a notch with a bulge, the second routing tool is processed according to the second path, the notch on the metal side edge is secondarily processed from the other side of the metal side edge, the bulge on the notch can be removed, the metal side edge cannot generate a flash, the metal side wall and the hole ring of the semi-metallized hole are prevented from generating the flash when the semi-metallized hole is processed, and the flash is not required to be additionally removed in a later stage.
The circuit board of the invention can not generate burrs on the metal side edges of the semi-metallized holes when the semi-metallized holes on the circuit board are processed, the processing efficiency is high, and the quality is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a flow chart of a method for making semi-metallized holes in a circuit board according to one embodiment of the invention;
FIG. 2 is a schematic diagram of an unprocessed substrate in one embodiment of the invention;
FIG. 3 is a schematic diagram of a metal side edge of a substrate after a first routing tool processes the substrate according to a first path according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a metal side edge of a substrate after a second routing tool processes the substrate according to a second path in one embodiment of the present invention;
fig. 5 is a schematic structural diagram of a substrate when a first routing tool processes the substrate in fig. 2 according to a first route according to a first embodiment of the present invention;
fig. 6 is a schematic structural diagram of a substrate after a first routing tool processes the substrate in fig. 2 according to a first path according to a first embodiment of the present invention;
FIG. 7 is a schematic structural view of the metal side of FIG. 5 after being processed by a first routing tool;
fig. 8 is a schematic structural diagram of a substrate when a second routing knife is used to process the substrate in fig. 6 according to a second path according to the first embodiment of the present invention;
fig. 9 is a schematic structural diagram of a substrate after a second routing knife processes the substrate in fig. 6 according to a second path according to the first embodiment of the present invention;
FIG. 10 is a schematic structural view of the metal side of FIG. 8 after being processed by a second routing tool;
FIG. 11 is a schematic view of the substrate of FIG. 9 after further processing;
FIG. 12 is a schematic view of the substrate of FIG. 11 after further processing;
fig. 13 is a schematic structural diagram of a substrate with semi-metallized holes, which is obtained after the substrate in fig. 12 is further processed;
FIG. 14 is a schematic structural view of an unprocessed substrate according to a second embodiment of the present invention;
FIG. 15 is a schematic diagram of a substrate according to a second embodiment of the present invention, when a first routing tool is used to process the substrate of FIG. 14 according to a first path;
FIG. 16 is a schematic view of the metal side of FIG. 15 after being processed by a first routing tool;
fig. 17 is a schematic structural diagram of a substrate in the second embodiment of the present invention, when a second routing knife is used to process the substrate in fig. 15 according to a second path;
fig. 18 is a schematic structural diagram of the substrate after the second routing knife processes the substrate in fig. 15 according to the second embodiment of the present invention;
FIG. 19 is a schematic view of the metal side of FIG. 18 after being processed by a second routing tool;
FIG. 20 is a schematic view of the substrate of FIG. 18 after further processing;
FIG. 21 is a schematic view of the substrate of FIG. 20 after further processing;
fig. 22 is a schematic structural diagram of a substrate with semi-metallized holes, which is obtained by further processing the substrate in fig. 21.
The designations in the figures mean:
100. a substrate; 10. a metallized hole; 11. a metal side; 20. a region to be molded; 21. forming a wire; 30. a first path; 31. a first lower knife point; 32. a first processing point; 33. a first sub-path; 34. a second sub-path; 40. a second path; 41. a second lower cutting point; 42. a second processing point; 43. a third sub-path; 44. a fourth sub-path; 45. a fifth sub-path; 46. a sixth sub-path; 47. a third cutting point; 48. a seventh sub-path; 50. semi-metallized holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In order to explain the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, an embodiment of a first aspect of the present application provides a method for manufacturing a half-metallized hole of a circuit board, including:
s10: providing a substrate 100, wherein the substrate 100 is provided with a metallized hole 10 and a region to be formed 20, the boundary of the region to be formed 20 comprises a plurality of forming lines 21 and a part of a metal side 11 of the metallized hole 10, and the metal side 11 comprises a metal side wall and a hole ring.
Specifically, the substrate 100 is a circuit board after cutting, inner layer circuit, inner layer AOI, pressing, primary drilling, primary routing, copper plate deposition, pulse plating, back drilling, resin plugging, copper plate deposition, outer layer circuit, and outer layer etching.
The metallized hole 10 has a metal side 11, the metal side 11 comprising a metal sidewall and a hole ring.
The region to be formed 20 is used for the subsequent processing into semi-metallized holes, i.e. the side edge of the subsequent semi-metallized hole is partially formed by the forming line 21 and partially formed by the metal side edge 11 of the metallized hole 10, so that the part of the metal side edge 11 which does not form the side edge of the semi-metallized hole needs to be removed when processing the semi-metallized hole.
Wherein, the cutting refers to cutting the core plates with required sizes according to the inner core plates required by the lamination structure established by a client.
The inner layer circuit refers to a circuit of each layer of the inner layer of the core board manufactured according to the inner layer wiring design of customers.
The inner layer AOI refers to the step of fully inspecting whether each inner layer circuit meets the design requirements of the product.
The lamination refers to the lamination of the core board to obtain the daughter board, the mixed pressure is not allowed in the same lamination opening, the expansion and contraction are controlled by +/-3 mil, the dielectric thickness of the back drilling layer is controlled by +/-10%, and the board thickness is controlled by +/-5%.
The primary drilling is to drill holes on the daughter board, the daughter board is produced by using an A-type drilling machine, and the hole position precision Cpk is more than or equal to 1.33.
The step of routing the board once means routing holes or grooves for manufacturing the metallized holes 10 on the daughter board.
The copper plating plate is used for plating the routed holes or grooves with copper in a copper plating plate electric mode to form metalized holes 10.
The pulse plating is to thicken the copper, control the depth capability to 90%, and thicken the metal sidewall and the ring of the metallized hole 10 to the design requirement to obtain the metal side 11.
The back drilling adopts a special back drilling drill tip, the depth control precision of a back drilling machine table is controlled by +/-0.05 mm, and the Cpk capacity needs to meet the requirement that the Cpk capacity is more than or equal to 1.33. The alignment of back drilling is less than 0.075mm.
Normally making resin plug holes during resin plug hole, grinding the resin by 100 percent to pass through AOI inspection of the resin plug holes, and confirming whether the problems of poor plug hole and back drilling leakage exist.
When the outer layer is etched, etching is normally manufactured, and the line width and the line distance are controlled according to FA parameters.
S20: and processing the substrate 100 by a first routing tool according to a first path 30, wherein the first path 30 comprises a first lower tool point 31 and a first processing point 32, the first lower tool point 31 is located inside or outside the metallized hole 10, and the first processing point 32 intersects with the metal side edge 11 of the metallized hole 10.
Specifically, the first lower cutting point 31 is located inside the region 20 to be formed or coincides with a part of the forming line 21, the first routing tool moves from the first lower cutting point 31 to the first processing point 32 for cutting the metal side 11, when the first routing tool reaches the first processing point 32 intersecting with the metal side 11 of the belonging hole, the processing is stopped, and at this time, a notch with a protrusion is cut on the metal side 11, as shown in fig. 3.
Please refer to fig. 1 to 8 in the following steps.
S30: and processing the substrate 100 by a second routing tool according to a second path 40, wherein the second path 40 intersects with the first processing point 32, the second path 40 comprises a second lower cutting point 41 and a second processing point 42, the second lower cutting point 41 and the first lower cutting point 31 are respectively positioned at two sides of the metal side edge 11, and the second processing point 42 is positioned in the region 20 to be formed or intersects with one of the forming lines 21.
Specifically, the second gong sword can be same gong sword with first gong sword, or not be same gong sword, do not do the restriction here, second lower knife point 41 is located the inside of waiting to become regional 20 or coincides with partial forming line 21, the second gong sword is moved to second processing point 42 by second lower knife point 41 for carry out cutting process to metal side 11, when the second gong sword passes the bellied breach in area on the metal side 11, get rid of the protruding cutting on the breach, because the second gong sword carries out secondary operation from the opposite side of metal side 11 to the breach on the metal side 11, metal side 11 can not produce the flash yet, as shown in fig. 4.
According to the method for manufacturing the semi-metallized hole of the circuit board, provided by the embodiment of the invention, the first routing tool is used for processing the substrate 100 according to the first path 30, the metal side 11 is cut into a notch with a protrusion, the second routing tool is used for processing the substrate 100 according to the second path 40, the notch on the metal side 11 is processed for the second time from the other side of the metal side 11, the protrusion on the notch can be removed, and the metal side 11 does not generate burrs, so that burrs are prevented from being generated at the metal side wall and the hole ring of the semi-metallized hole when the semi-metallized hole is processed, and additional removal in a later period is not needed.
Referring to fig. 5, 6 and 7, in the first embodiment, one entire side of the half-plated hole is the metal side 11, one entire side of the half-plated hole is the forming line 21, the first path 30 includes a first sub-path 33 and a second sub-path 34 connected at an included angle, the first sub-path 33 is arranged in parallel with one of the forming lines 21, one end of the first sub-path 33 is the first lower cutting point 31, the first lower cutting point 31 is located inside the plated hole 10, a connection point of the first sub-path 33 and the second sub-path 34 is the first processing point 32, and the other end of the second sub-path 34 is located outside the plated hole 10 and inside the region to be formed 20; when the second routing tool processes the substrate 100 in the second path 40, the second path 40 is arranged in parallel with the first sub-path 33.
Through adopting above-mentioned scheme, after processing base plate 100 according to first route 30 with first gong sword, the breach department of metal side 11 only has the arch in the one side that follow-up remains, as shown in fig. 7, when processing base plate 100 according to second route 40 with the second gong sword that will be spent, only need get rid of this side bulge, conveniently control the position of second gong sword, if can hug closely the second gong sword that the breach has bellied one side metal side 11, and keep away from the metal side 11 of breach opposite side, the machining area is little, the process velocity is fast, also can prevent that the second gong sword from when getting rid of the protruding on the breach, gong falls the hole ring of metallization hole 10 tip.
Referring to fig. 5, in the first embodiment, the included angle between the first sub-path 33 and the second sub-path 34 is 120 ° -150 °, such as 120 °, 135 °, 140 °, or 150 °.
By adopting the scheme, the hole rings at the end parts of the metalized holes 10 can be prevented from being milled off when the second milling cutter removes the bulges on the gaps.
Referring to fig. 8, 9 and 10, in the first embodiment, the second path 40 includes a third sub-path 43 and a fourth sub-path 44 connected at an included angle, one end of the third sub-path 43 is a second lower cutting point 41, the fourth sub-path 44 coincides with one of the forming lines 21 and one end thereof is a second processing point 42, and the fourth sub-path 44 is arranged in parallel with the first sub-path 33; when the second routing tool processes the substrate 100 according to the second path 40, the fourth sub-path 44 intersects the first processing point 32.
By adopting the scheme, the bulges on the notch can be removed by cutting, as shown in fig. 10, the lower knife position of the second routing knife is conveniently controlled, the lower knife is convenient to cut, and the forming line 21 can be processed while the second routing knife processes the metal side edge 11 so as to obtain the side edge of the forming area, so that the working time is saved.
Referring to fig. 8, in the first embodiment, the third sub-path 43 and the fourth sub-path 44 are vertically disposed. By adopting the scheme, the feeding path of the second milling cutter can be conveniently controlled.
Referring to fig. 5 to 13, in the first embodiment, after the two adjacent metallized holes 10 are sequentially processed by using the above-mentioned method for manufacturing semi-metallized holes of a circuit board, a plurality of forming lines 21 are connected to a part of the metal side edge 11 of the metallized hole 10 to obtain the region to be formed 20, at this time, only by dropping the substrate 100 inside the region to be formed 20, the semi-metallized hole 50 can be processed on the substrate 100, so that the dropping of the substrate 100 inside the region to be formed 20 can directly process the forming line 21 by adjusting the positions of the first path 30 and the second path 40, or additionally set other paths to process the forming line 21.
Referring to fig. 14, 15 and 16, in the second embodiment, one entire side of the half-metalized hole is a combination of the metal side 11 and the forming line 21, and one entire side of the half-metalized hole is the forming line 21, and when the first routing knife is used for processing the substrate 100 according to the first path 30, the first lower knife point 31 is located outside the metalized hole 10.
Referring to fig. 17, 18 and 19, the second path 40 includes a fifth sub-path 45 and a sixth sub-path 46 which are connected at an included angle, one end of the fifth sub-path 45 is a third lower cutting point 47, the third lower cutting point 47 is located outside the metallized hole 10, the connection point of the sixth sub-path 46 and the fifth sub-path 45 is a second lower cutting point 41, the other end of the sixth sub-path 46 is a second processing point 42, the fifth sub-path 45 intersects with the metal side 11 of the metallized hole 10, and the sixth sub-path 46 intersects with the first processing point 32.
By adopting the above scheme, one end of the fifth sub-path 45 in the second path 40 is the third lower cutting point 47, so that when the second routing knife is used for processing the substrate 100 according to the second path 40, the metal side 11 required to be reserved is effectively prevented from being scratched when the second routing knife is used for cutting.
Optionally, a seventh sub-path 48 may be added after the sixth sub-path 46 to process the forming wire 21.
Referring to FIG. 17, in the second embodiment, the included angle between the fifth sub-path 45 and the sixth sub-path 46 is 120-150, such as 120, 135, 140 or 150.
By adopting the scheme, the second routing knife can be prevented from processing the metal side edge 11, and the ring at the end part of the metallized hole 10 is routed.
Referring to fig. 14 to 22, in the second embodiment, after the two adjacent metallized holes 10 are sequentially processed by using the above-mentioned method for manufacturing semi-metallized holes of a circuit board, a plurality of molding lines 21 are connected to a part of the metal side edge 11 of the metallized hole 10 to obtain the region to be molded 20, at this time, only the substrate 100 inside the region to be molded 20 needs to be dropped, and the semi-metallized hole 50 can be processed on the substrate 100, so that the substrate 100 inside the region to be molded 20 can be dropped to directly process the molding line 21 by adjusting the positions of the first path 30 and the second path 40, or other paths can be additionally provided to process the molding line 21.
Referring to fig. 5, 8, 15 and 17, in some embodiments, the first and second gongs rotate in opposite directions.
Through adopting above-mentioned scheme, after first gong sword processed metal side 11, rotatory first gong sword can produce burr or perk with metal side 11 along direction of rotation, and reuse and first gong sword opposite direction of rotation's second gong sword to metal side 11 and process, can revise and get rid of foretell burr or perk.
Optionally, the substrate is processed by a gong machine with forward and reverse rotation functions.
In some of these embodiments, the diameter of the first gong cutter is smaller than the diameter of the second gong cutter.
Through adopting above-mentioned scheme, avoid using the second gong sword to carry out secondary machining to the breach on the metal side 11 after the processing of first gong sword, the second gong sword can't touch the arch on the breach and get rid of it, and the diameter of first gong sword is less than the diameter of second gong sword, can guarantee that the second gong sword touches the arch on the breach and gets rid of it, conveniently controls the position and the precision of second gong sword.
Optionally, the diameter of the first gong-knife may be 0.8mm to 1.2mm, such as 0.8mm, 0.9mm, 1.0mm, 1.1mm or 1.2mm, preferably 0.8mm, and the diameter of the second gong-knife is 1.0mm to 1.4mm, such as 1.0mm, 1.1mm, 1.2mm, 1.3mm or 1.4mm, preferably 1.0mm.
The invention provides a circuit board which is processed by the circuit board semi-metallized hole manufacturing method in the first aspect.
The circuit board of the invention has the advantages that the metal side edge of the semi-metallized hole can not generate burrs when the semi-metallized hole on the circuit board is processed, the processing efficiency is high, and the quality is guaranteed.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (8)
1. A method for manufacturing a semi-metallized hole of a circuit board is characterized by comprising the following steps:
providing a substrate, wherein a metalized hole and a to-be-formed area are arranged on the substrate, the boundary of the to-be-formed area comprises a plurality of forming lines and partial metal side edges of the metalized hole, and the metal side edges comprise metal side walls and hole rings;
processing the substrate by a first routing tool according to a first path, wherein the first path comprises a first lower tool point and a first processing point, the first lower tool point is located inside the metallized hole, the first processing point is intersected with the metal side edge of the metallized hole, the first path comprises a first sub-path and a second sub-path which are connected through an included angle, the first sub-path is arranged in parallel with one of the forming lines, one end of the first sub-path is the first lower tool point, the connection point of the first sub-path and the second sub-path is the first processing point, and the other end of the second sub-path is located outside the metallized hole and inside the region to be formed;
processing the substrate by a second routing tool according to a second path, wherein the second path is intersected with the first processing point, the second path comprises a second lower tool point and a second processing point, the second lower tool point and the first lower tool point are respectively positioned at two sides of the metal side edge, the second processing point is intersected with one of the forming lines, the second path comprises a third sub-path and a fourth sub-path which are connected in an included angle, one end of the third sub-path is the second lower tool point, the fourth sub-path is overlapped with one of the forming lines, one end of the fourth sub-path is the second processing point, the fourth sub-path is parallel to the first sub-path, and the fourth sub-path is intersected with the first processing point.
2. A method for making semi-metallized holes on a circuit board according to claim 1, characterized in that the angle between the first sub-path and the second sub-path is 120 ° to 150 °.
3. The method of claim 1, wherein the third sub-path and the fourth sub-path are arranged vertically.
4. The method of claim 1, wherein the first lower cutting point is located outside the metallized hole when a first routing tool is used to process the substrate according to a first path; the second path comprises a fifth sub-path and a sixth sub-path which are connected in an included angle, one end of the fifth sub-path is a third lower cutting point, the third lower cutting point is positioned outside the metallized hole, a connection point of the sixth sub-path and the fifth sub-path is a second lower cutting point, the other end of the sixth sub-path is a second processing point, the fifth sub-path is intersected with the metal side edge of the metallized hole, and the sixth sub-path is intersected with the first processing point.
5. A method for making semi-metallized holes in a circuit board according to claim 4, characterized in that the angle between the fifth sub-path and the sixth sub-path is 120 ° -150 °.
6. The method for manufacturing semi-metallized holes of a circuit board according to claim 1, wherein the first routing knife and the second routing knife rotate in opposite directions.
7. The method for manufacturing semi-metallized holes of circuit board according to claim 1, wherein the diameter of the first routing knife is smaller than the diameter of the second routing knife.
8. A circuit board manufactured by the method for manufacturing semi-metallized holes of the circuit board according to any one of claims 1 to 7.
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| CN202110910514.0A CN113784512B (en) | 2021-08-09 | 2021-08-09 | Method for manufacturing semi-metallized hole of circuit board |
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| CN202110910514.0A CN113784512B (en) | 2021-08-09 | 2021-08-09 | Method for manufacturing semi-metallized hole of circuit board |
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| CN102744583A (en) * | 2012-06-30 | 2012-10-24 | 胜宏科技（惠州）股份有限公司 | PCB (Printed circuit board) semi-metallized hole forming method |
| CN103179802A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Metal half-hole forming method and printed circuit board manufacture method |
| CN106102314A (en) * | 2016-07-05 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | A kind of many bridgings position, Small Distance bound edge printed wiring board and preparation method thereof |
| CN112996258A (en) * | 2021-02-21 | 2021-06-18 | 四川英创力电子科技股份有限公司 | One-step forming processing method of half-hole plate and printed circuit board |
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2021
- 2021-08-09 CN CN202110910514.0A patent/CN113784512B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179802A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Metal half-hole forming method and printed circuit board manufacture method |
| CN102744583A (en) * | 2012-06-30 | 2012-10-24 | 胜宏科技（惠州）股份有限公司 | PCB (Printed circuit board) semi-metallized hole forming method |
| CN106102314A (en) * | 2016-07-05 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | A kind of many bridgings position, Small Distance bound edge printed wiring board and preparation method thereof |
| CN112996258A (en) * | 2021-02-21 | 2021-06-18 | 四川英创力电子科技股份有限公司 | One-step forming processing method of half-hole plate and printed circuit board |
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