CN114710881B - Semimetallized hole routing processing method and thick copper semihole circuit board - Google Patents
Semimetallized hole routing processing method and thick copper semihole circuit board Download PDFInfo
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- CN114710881B CN114710881B CN202210253467.1A CN202210253467A CN114710881B CN 114710881 B CN114710881 B CN 114710881B CN 202210253467 A CN202210253467 A CN 202210253467A CN 114710881 B CN114710881 B CN 114710881B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The application provides a half-metallized hole routing processing method and a thick copper half-hole circuit board. The method comprises the steps of obtaining a routing image of an electroplating plate; determining a routing half-hole rail remaining parameter according to the routing image; and carrying out inscribing operation on the electroplating plate according to the routing half-hole track remaining parameters to obtain a thick copper half-hole circuit board, wherein the inscribing operation is used for propping a copper layer in a half-metallized hole of the electroplating plate against the inner wall of the half-metallized hole when routing. Under the condition based on the gong board image, obtain the current gong board track parameter of electroplate plate, be convenient for confirm the required gong of current electroplate plate and remove part and gong and remove the orbit to confirm the position that forms half metallized hole, finally according to above-mentioned gong board condition, make in-hole copper layer by the extrusion in-hole on half metallized hole's inner wall in gong remove the in-process, effectively reduced the perk probability of downthehole copper layer, thereby reduced the probability that the downthehole appearance of half metallized is draped over one's shoulders effectively, and then reduced the probability of scrapping of circuit board effectively.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a half-metallized hole routing processing method and a thick copper half-hole circuit board.
Background
Along with the application of circuit boards to various electronic devices, miniaturization is being realized among more and more electronic products, wherein the circuit boards with semi-metallized holes are used as main circuit boards of communication modules such as Bluetooth, NBIOT (Narrow Band Internet of Things ) modules and the like. The half-metallized holes are designed to leave only half of the metallized holes on the outline of the PCB, and the other half is turned off during the molding process, which is commonly used on power boards, personal consumer products or backplanes. During the welding process, the side surface of the half-metallized hole is used as a matching surface for compression joint, and in most cases is used as a daughter board of the mother board, and the half-metallized hole of the daughter board and the pins of the mother board or the component are welded together to enhance the welding performance.
However, when the circuit board with the traditional half-metallized holes is subjected to half-hole treatment, the situation that copper sheets are tilted frequently occurs when the copper sheets in the holes are removed by the milling cutter due to the ductility and toughness of the metallized layers attached to the hole walls, so that the problem that burrs remain at the positions of the half-metallized holes, namely burrs exist on the residual copper layers of the half-metallized holes, the rejection rate is too high, and the production cost is increased.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a semi-metallized hole routing processing method capable of effectively reducing the rejection rate and a thick copper semi-hole circuit board.
The aim of the invention is realized by the following technical scheme:
a method of semi-metallized hole routing, the method comprising:
acquiring a routing image of the electroplating plate;
determining a routing half-hole rail remaining parameter according to the routing image;
and carrying out inscribing operation on the electroplating plate according to the routing half-hole track remaining parameters to obtain a thick copper half-hole circuit board, wherein the inscribing operation is used for propping a copper layer in a half-metallized hole of the electroplating plate against the inner wall of the half-metallized hole when routing.
In one embodiment, the acquiring a routing image of the plating plate includes: obtaining the coordinates of copper deposition holes of the electroplating plate; and acquiring the routing image according to the coordinates of the copper deposition holes.
In one embodiment, the determining the routing half-hole rail remaining parameter according to the routing image includes: acquiring a routing track boundary of the electroplated board according to the routing image; detecting whether the routing track boundary is matched with a preset boundary or not; when the routing track boundary is matched with the preset boundary, acquiring a stay removal image according to the routing image; and obtaining a gong board removing and reserving value according to the removing and reserving image, wherein the gong board removing and reserving value corresponds to the gong board removing and reserving area of the electroplating board.
In one embodiment, the obtaining the gong board removal retention value according to the removal retention image further includes: detecting whether the routing dividing and reserving value is matched with a first preset dividing and reserving value or not; when the routing removal retention value is matched with the first preset removal retention value, a first routing direction value is obtained according to the routing image; and acquiring a first gong rotation complement value according to the first gong direction value and the first preset dividing and remaining value.
In one embodiment, the performing an inscribing operation on the plating plate according to the routing half-hole rail retention parameter includes: detecting whether the first gong rotation complement value is matched with a first preset rotation complement value or not; when the first gong rotation complement value is matched with the first preset rotation complement value, a right-hand left-hand feeding signal is sent to a gong control system so as to control the gong to perform clockwise left-hand feeding rotation on the electroplating plate.
In one embodiment, the detecting whether the first gong rotation complement value matches a first preset rotation complement value further includes: and when the rotation complement value of the first milling cutter is not matched with the first preset rotation complement value, a left-hand right-hand feeding signal is sent to the milling control system so as to control the milling cutter to feed the electroplating plate anticlockwise and right-hand.
In one embodiment, the detecting whether the routing divide residual matches a first preset divide residual further includes: when the routing removal retention value is not matched with the first preset removal retention value, detecting whether the routing removal retention value is matched with a second preset removal retention value; when the routing dividing and reserving value is matched with the second preset dividing and reserving value, acquiring a second routing direction value according to the routing image; and obtaining a second gong rotation complement value according to the second gong direction value and the second preset dividing and remaining value.
In one embodiment, the performing an inscribing operation on the plating plate according to the routing half-hole rail retention parameter includes: detecting whether the second gong rotation complement value is matched with a second preset rotation complement value; and when the second gong rotation complement value is matched with the second preset rotation complement value, sending a right-hand feeding signal to a gong control system so as to control the gong to perform clockwise right-hand feeding rotation on the electroplating plate.
In one embodiment, the detecting whether the second gong rotation complement value matches a second preset rotation complement value further includes: and when the second gong rotation complement value is not matched with the second preset rotation complement value, a left-hand feeding signal is sent to the gong control system so as to control the gong to perform anticlockwise left-hand feeding rotation on the electroplating plate.
The thick copper half-hole circuit board is prepared by adopting the half-metallized hole routing processing method in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
under the condition based on the routing image, acquire the current routing track parameter of electroplate plate, be convenient for confirm the required routing of current electroplate plate and remove the track, so as to confirm the position that forms half metallized hole, finally according to above-mentioned routing condition, make the downthehole copper layer of routing in-process by the extrusion on half metallized hole's inner wall, the tangential cutting effort that makes downthehole copper layer receive is towards half metallized hole's inner wall, the perk probability of downthehole copper layer has been reduced effectively, thereby the probability that appears the burr in the half metallized hole has been reduced effectively, and then the probability of scrapping of circuit board has been reduced effectively.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a semi-metallized hole routing process in one embodiment;
fig. 2 is a schematic view of a processing state of the semi-metallized hole routing processing method shown in fig. 1.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The invention relates to a semi-metallized hole routing processing method. In one embodiment, the semi-metallized hole routing processing method comprises the steps of obtaining routing images of an electroplated board; determining a routing half-hole rail remaining parameter according to the routing image; and carrying out inscribing operation on the electroplating plate according to the routing half-hole track remaining parameters to obtain a thick copper half-hole circuit board, wherein the inscribing operation is used for propping a copper layer in a half-metallized hole of the electroplating plate against the inner wall of the half-metallized hole when routing. Under the condition based on the routing image, acquire the current routing track parameter of electroplate plate, be convenient for confirm the required routing of current electroplate plate and remove the track, so as to confirm the position that forms half metallized hole, finally according to above-mentioned routing condition, make the downthehole copper layer of routing in-process by the extrusion on half metallized hole's inner wall, the tangential cutting effort that makes downthehole copper layer receive is towards half metallized hole's inner wall, the perk probability of downthehole copper layer has been reduced effectively, thereby the probability that appears the burr in the half metallized hole has been reduced effectively, and then the probability of scrapping of circuit board has been reduced effectively.
Please refer to fig. 1, which is a flowchart illustrating a semi-metallized hole routing method according to an embodiment of the present invention. The semi-metallized hole routing processing method comprises the following steps of partial or whole.
S100: and obtaining a gong image of the electroplating plate.
In this embodiment, the plating board is a preset copper board subjected to drilling, copper deposition, outer dry film, image plating and drying treatment, and as a copper board with semi-metallized holes, each drilling position on the plating board needs to be positioned so as to form a needed semi-metallized hole at a corresponding drilling position, namely, at least part of drilling holes on the plating board are subjected to semi-hole treatment, wherein the routing image shows all drilling distribution conditions of the plating board, thereby facilitating the subsequent determination of the position, direction and routing removal of a routing board at the corresponding drilling position.
S200: and determining a routing half-hole track remaining parameter according to the routing image.
In this embodiment, the routing image is a current surface image of the plating board, the routing image displays a drilling hole on which a half-metallized hole needs to be formed, the routing image positions a drilling hole on which the half-metallized hole is to be formed, so as to form routing parameters required in a half-hole processing process, namely routing half-hole track reserved parameters, specifically, routing half-hole track reserved parameters comprise a routing direction, a routing boundary and a routing reserved area, wherein the routing direction is a routing movement track direction of a routing on the plating board, the routing boundary is routing track coordinates of the routing on the plating board, and the routing reserved area is a copper plate area required to be reserved after the routing is routing.
S300: and carrying out inscribing operation on the electroplating plate according to the routing half-hole track remaining parameters to obtain a thick copper half-hole circuit board, wherein the inscribing operation is used for propping a copper layer in a half-metallized hole of the electroplating plate against the inner wall of the half-metallized hole when routing.
In this embodiment, the routing half-hole track is reserved as a routing motion parameter of the routing on the electroplating board, and the routing half-hole track is reserved as a routing standard parameter for routing on the electroplating board, so that the routing working state of the routing is determined according to the routing half-hole track reserved parameter. The inscription operation is according to routing half hole rail stays the parameter and carries out, for example, after having confirmed routing direction, routing boundary and routing reserve area, the routing carries out inwards extrusion cutting to the copper plate position that will form half metallized hole place on the electroplate board, be convenient for the routing extrude the copper layer that is located the reserve area on the drilling inner wall, and will be located the copper layer that removes the region and directly routing, wherein, the routing is when contacting with the copper layer of drilling, the routing thrust provides effort for the direction of movement of routing, the routing still produces tangential force at the copper layer, make the copper layer in the reserve area receive inwards tangential cutting effort, tangential cutting effort this moment is towards the drilling inner wall in the reserve area, be convenient for support the copper layer in the reserve area and press in the downthehole of this area, effectively reduce the perk probability of the downthehole copper layer of reserve area, thereby effectively reduced the probability that the front appears in the half metallized hole.
In the above embodiments, under the condition based on the routing image, the current routing track parameter of the plating board is obtained, so that the routing part and routing track required by the current plating board are convenient to determine, so that the position of the half-metallized hole is convenient to determine, and finally according to the routing condition, the copper layer in the hole is extruded on the inner wall of the half-metallized hole in the routing process, namely, the tangential cutting acting force applied to the copper layer in the hole faces the inner wall of the half-metallized hole, the raising probability of the copper layer in the hole is effectively reduced, the probability of the flash in the half-metallized hole is effectively reduced, and the rejection probability of the circuit board is effectively reduced.
In one embodiment, the acquiring a routing image of the plating plate includes: obtaining the coordinates of copper deposition holes of the electroplating plate; and acquiring the routing image according to the coordinates of the copper deposition holes. In this embodiment, the coordinates of the copper deposition holes are coordinates of a to-be-formed half-metallized hole on the electroplating plate, the copper deposition holes of the electroplating plate are holes formed after drilling and copper deposition treatment, and the positions of the copper deposition holes to be formed half-metallized holes are determined, so that the area needing to be processed by routing is conveniently located based on the coordinates, and therefore the image acquisition of the area on the electroplating plate where the half-metallized holes are needed, namely, the routing image is acquired, and further, routing parameters needed by the half-hole treatment are conveniently determined according to the routing image.
In one embodiment, the determining the routing half-hole rail remaining parameter according to the routing image includes: acquiring a routing track boundary of the electroplated board according to the routing image; detecting whether the routing track boundary is matched with a preset boundary or not; when the routing track boundary is matched with the preset boundary, acquiring a stay removal image according to the routing image; and obtaining a gong board removing and reserving value according to the removing and reserving image, wherein the gong board removing and reserving value corresponds to the gong board removing and reserving area of the electroplating board. In this embodiment, the routing image includes coordinates of a to-be-formed half-metallized hole on the plating board, and coordinates of a plurality of half-metallized holes form corresponding boundaries on the plating board, that is, the routing track boundaries. The preset boundary is a standard boundary formed for a plurality of half-metallized holes, for example, the preset boundary is an edge of the electroplating plate, and whether the routing track boundary is matched with the preset boundary or not is detected, that is, whether the routing track boundary is mutually perpendicular to the edge of the electroplating plate or not is detected. The routing track boundary is matched with the preset boundary, a plurality of straight lines where half-metallized holes are to be formed are shown to be perpendicular to the edges of the electroplating plate, namely, routing tracks on the electroplating plate are shown to be overlapped with the straight lines where the half-metallized holes are to be formed, half-hole routing is conveniently carried out on the electroplating plate, and therefore, the reserved portion and the removal portion of the electroplating plate after half-hole processing are conveniently obtained, further, the routing value is conveniently determined according to the reserved portion and the removal portion. The remaining portion and the removing portion are left and right areas of the plating plate, which are similar to the above, and are not described here again, but only need to be ensured to be different from the previous mark value.
Further, the obtaining the routing board removal and retention value according to the removal and retention image further includes: detecting whether the routing dividing and reserving value is matched with a first preset dividing and reserving value or not; when the routing removal retention value is matched with the first preset removal retention value, a first routing direction value is obtained according to the routing image; and acquiring a first gong rotation complement value according to the first gong direction value and the first preset dividing and remaining value. In this embodiment, the routing removal retention value corresponds to a routing removal retention area of the plating board, and when the retention and removal areas of the plating board are different, the routing removal retention value also changes accordingly, so that the routing removal retention value corresponds to the location of the retention area of the plating board one to one. The first preset dividing and reserving value corresponds to one of the reserved areas of the electroplating plate, specifically, an upper portion and a lower portion are formed after half-hole treatment of the electroplating plate, and the first preset dividing and reserving value corresponds to the reserved area of the electroplating plate as a lower half portion. The routing removing reserved value is matched with the first preset reserved value, so that the reserved area in the electroplating plate is the lower half part of the routing removing reserved value, the routing direction of the electroplating plate is determined at the moment, namely, the first routing direction value is acquired, the movement track direction of the routing is conveniently determined under the condition that the lower half part of the electroplating plate is reserved, and accordingly, parameters corresponding to the rotation and feed direction of the routing are conveniently determined, namely, the first routing rotation complement value is conveniently determined.
Still further, the performing an inscribing operation on the plating plate according to the routing half-hole rail retention parameter includes: detecting whether the first gong rotation complement value is matched with a first preset rotation complement value or not; when the first gong rotation complement value is matched with the first preset rotation complement value, a right-hand left-hand feeding signal is sent to a gong control system so as to control the gong to perform clockwise left-hand feeding rotation on the electroplating plate. In this embodiment, the first gong rotation complement value is obtained based on the first gong direction value and the first preset division remaining value, where the first gong direction value corresponds to a feeding direction of the gong, the first preset division remaining value corresponds to a gong division area of the gong to be processed by the gong, and the first gong rotation complement value effectively shows a movement track and a manner of the gong in a half-hole processing process, and the first preset rotation complement value is a standard gong working state corresponding to when the gong performs half-hole processing on the electroplated board, specifically, the first preset rotation complement value corresponds to a forward rotation and a forward feeding of the gong, for example, the forward rotation is clockwise rotation of the gong, and the forward feeding is a movement direction of the gong from a left side to a right side of the electroplated board when the remaining portion and the removing portion of the electroplated board are upper and lower. The first gong rotation complement value is matched with the first preset rotation complement value, the gong mode determined by the gong image is right-handed left-handed, namely, the gong is fed from the left side of the electroplating plate and keeps rotating clockwise, the lower half part of the electroplating plate is a reserved part, the gong is rotated clockwise from the left side of the electroplating plate, a copper layer in a reserved area in a drilled hole is conveniently extruded to the inner wall of the drilled hole in the reserved area, and the tilting probability of the copper layer in the reserved area is reduced.
Still further, the detecting whether the first gong rotation complement value is matched with a first preset rotation complement value further includes: and when the rotation complement value of the first milling cutter is not matched with the first preset rotation complement value, a left-hand right-hand feeding signal is sent to the milling control system so as to control the milling cutter to feed the electroplating plate anticlockwise and right-hand. In this embodiment, the reserved area of the plating plate is the lower half, and the rotation complement value of the first milling cutter is not matched with the first preset rotation complement value, which indicates that the feeding direction of the milling cutter is changed, that is, indicates that the milling cutter starts to mill from the right side of the plating plate. The turning control system sends a left-handed right-handed signal to the turning control system, changes the rotation direction of the turning tool, enables the turning tool to rotate in a left-handed mode, namely anticlockwise, and enables the turning tool to rotate anticlockwise from the right side of the electroplating plate, see figure 2 in detail, so that a copper layer in a reserved area in a drilled hole is conveniently extruded to the inner wall of the drilled hole in the reserved area, and the tilting probability of the copper layer in the reserved area is reduced.
In one embodiment, the detecting whether the routing divide residual matches a first preset divide residual further includes: when the routing removal retention value is not matched with the first preset removal retention value, detecting whether the routing removal retention value is matched with a second preset removal retention value; when the routing dividing and reserving value is matched with the second preset dividing and reserving value, acquiring a second routing direction value according to the routing image; and obtaining a second gong rotation complement value according to the second gong direction value and the second preset dividing and remaining value. In this embodiment, the routing removal retention value corresponds to a routing removal retention area of the plating board, and when the retention and removal areas of the plating board are different, the routing removal retention value also changes accordingly, so that the routing removal retention value corresponds to the location of the retention area of the plating board one to one. The second preset dividing and reserving value corresponds to another condition of the reserved area of the electroplating plate, specifically, an upper portion and a lower portion are formed after half-hole treatment of the electroplating plate, and the second preset dividing and reserving value corresponds to the reserved area of the electroplating plate as an upper half portion. The gong board removing and reserving value is not matched with the first preset removing and reserving value and is matched with the second preset removing and reserving value, so that the reserved area in the electroplating board is the upper half part of the reserved area, the gong board direction of the electroplating board is determined at the moment, namely, the second gong board direction value is acquired, the movement track direction of the gong knife under the condition that the upper half part of the electroplating board is reserved is convenient to determine, and accordingly follow-up determination of parameters corresponding to the rotation and feed direction of the gong knife is facilitated, namely, the second gong knife rotation complement value is convenient.
Further, the performing an inscribing operation on the plating plate according to the routing half-hole rail retention parameter includes: detecting whether the second gong rotation complement value is matched with a second preset rotation complement value; and when the second gong rotation complement value is matched with the second preset rotation complement value, sending a right-hand feeding signal to a gong control system so as to control the gong to perform clockwise right-hand feeding rotation on the electroplating plate. In this embodiment, the second gong rotation complement value is obtained based on the second gong direction value and the second preset division complement value, where the second gong direction value corresponds to a feeding direction of the gong, the second preset division complement value corresponds to a gong division area where the gong needs to be applied to the plating plate, the second gong rotation complement value effectively shows a movement track and a manner of the gong in a half-hole processing process, the second preset rotation complement value is another standard gong operation state corresponding to when the gong performs half-hole processing on the plating plate, and there is a distinction between the standard gong operation state corresponding to the second preset rotation complement value, specifically, the second preset rotation complement value corresponds to a forward rotation and a reverse rotation complement of the gong, for example, the forward rotation is clockwise rotation of the gong, and the reverse rotation is a direction of the plating side from the right side of the gong when the remaining portion and the removal portion of the plating plate are upper and lower portions. The second gong rotation complement value is matched with the second preset rotation complement value, so that the gong mode determined by the gong image is right-handed, namely, the gong is fed from the right side of the electroplating plate and keeps rotating clockwise, at the moment, the upper half part of the electroplating plate is a reserved part, the gong is rotated clockwise from the right side of the electroplating plate, a copper layer in a reserved area in a drilled hole is conveniently extruded to the inner wall of the drilled hole in the reserved area, and the tilting probability of the copper layer in the reserved area is reduced.
Still further, the detecting whether the second gong rotation complement value matches a second preset rotation complement value further includes: and when the second gong rotation complement value is not matched with the second preset rotation complement value, a left-hand feeding signal is sent to the gong control system so as to control the gong to perform anticlockwise left-hand feeding rotation on the electroplating plate. In this embodiment, the reserved area of the plating plate is an upper half portion, and the second turning complement value is not matched with the second preset turning complement value, which indicates that the feeding direction of the turning tool is changed, that is, indicates that the turning tool will perform turning and removing from the left side of the plating plate. The routing control system sends a left-handed signal to change the rotation direction of the routing tool, so that the rotation mode of the routing tool is left-handed, namely anticlockwise, and the routing tool is anticlockwise rotated from the left side of the electroplating plate, so that a copper layer in a reserved area in a drilled hole is conveniently extruded to the inner wall of the drilled hole in the reserved area, and the tilting probability of the copper layer in the reserved area is reduced.
It can be appreciated that in the process of performing semi-metallized hole routing, the routing tool performs routing on the electroplated plate, the routing tool performs routing on the position on the electroplated plate, where the position on the electroplated plate where the semi-hole needs to be formed, by means of its high-frequency rotational momentum, and under the condition that the routing tool is pushed by the pushing machine, the routing tool performs fixed-point directional cutting on the electroplated plate along a specified direction, so as to obtain the corresponding semi-metallized hole. However, when the milling cutter performs milling cutting on the electroplated board, since the electroplated board is formed by stacking a plurality of layers of different materials, the milling cutting speed of the milling cutter has a certain influence, for example, copper layer lines on the electroplated board have a large impeding effect on the rotating speed of the milling cutter, namely, the rigid friction between the metal material of the milling cutter and the metal layer on the electroplated board greatly influences the milling cutting efficiency of the milling cutter on the electroplated board, and in the long-term friction between the milling cutter and the electroplated board, after the rotating speed of the milling cutter is reduced, the milling cutter cannot cut off the copper layer in the half hole quickly, particularly for some thick copper plates, so that the milling cutter is easy to wind part of copper layers on the electroplated board on the copper layer lines, and then is easy to attach the part of copper layers on other positions, thereby causing the copper quantity change of other positions, further causing the increase of resistance of the other positions and finally influencing the probability of forming the copper layer lines, and causing the line to be failed to rise.
In order to effectively ensure the efficiency of the routing processing of the semi-metallized holes, the incision operation is performed on the electroplating plate according to the routing semi-hole track retention parameters, and the method comprises the following steps:
acquiring the milling rotating speed of a milling cutter;
acquiring a gong cutting moment according to the gong cutting rotating speed;
obtaining a plate layer ounce value according to the gong image;
carrying out moment fusion filtering treatment on the gong moment and the plate layer ounce value to obtain a turning thickness fusion ratio;
detecting whether the thickness-to-melting ratio is smaller than a preset melting ratio or not;
and when the thickness-turning ratio is smaller than the preset melting ratio, sending a lifting signal to a routing control system so as to increase the rotating speed of the routing.
In this embodiment, the routing rotational speed is a rotational speed of the routing blade during a current operation, the magnitude of the routing rotational speed determines a routing speed of the plating plate, the routing momentum moment is obtained according to the routing rotational speed, under a condition of performing circular motion based on the routing blade, that is, a rotational direction of the routing blade and a particle rotational angle in unit time are fixed, and a momentum sum of the routing blade is determined according to the magnitude of the routing rotational speed, wherein the routing momentum moment is used as one momentum component moment of the routing blade, that is, the routing momentum moment is a rotational momentum moment of the routing blade, that is, the routing momentum moment is an angular momentum of the routing blade, and the routing momentum moment not only corresponds to the rotational speed of the routing blade, but also can represent a position change condition of the routing blade, so as to determine a rotational speed of the routing blade when the routing blade contacts with a copper layer in a half hole. The routing image comprises image acquisition of each core plate on the electroplating plate, and the copper layer has good ductility and uniform ductility, so that the ductility percentage is certain under the condition of the same volume. After the volume of the copper layer is determined, the thickness of the copper layer is also fixed, wherein the ounce value of the plate layer is the collection of the volume of the copper layer on the electroplating plate, namely, the collection of the area and the thickness of each core plate in the routing image is used for conveniently determining the thickness and the distribution range of the copper layer on each core plate on the electroplating plate, so that the working state of the routing, such as the rotating speed at the corresponding position, is convenient to determine.
The gong cutting moment and the board layer ounce value are subjected to moment fusion filtering, the cutting rotation moment of the gong cutter and the thickness distribution of the electroplating board are fused and filtered, and the gong cutter is convenient to distinguish gong cutting working modes of a copper area and a copper-free area, so that the condition that quick gong cutting cannot be performed in the copper area is effectively avoided. The thickness-to-melt ratio is the relative ratio between the cutting rotation moment of the milling cutter and the thickness of the electroplating plate, the momentum of the milling cutter comprises the power of the milling cutter in the moving direction and the momentum along the tangential direction of the milling cutter, the milling moment corresponds to the momentum along the tangential direction, the thickness and the surface area of the core plate are fused in the ounce value of the plate layer, the thickness of a copper-free area in the core plate is screened, namely the thickness of the copper-free area is filtered, so that the thickness-to-melt ratio is used as the correlation ratio between the milling moment of the milling cutter and the thickness distribution of the copper layer of the electroplating plate, and the accuracy of the ratio between the milling moment of the milling cutter and the thickness distribution of the copper layer of the electroplating plate is ensured. The preset melting ratio is a corresponding thickness-turning melting ratio when the milling cutter rapidly cuts a plating plate with a certain copper thickness in a standard time, a critical value of copper layer winding cannot be generated, and the preset melting ratio is a reference standard value and is used for determining whether the rotating speed of the milling cutter reaches the standard rotating speed. The thickness-turning ratio is smaller than the preset melting ratio, which indicates that the rotation speed of the milling cutter is lower at this moment, and the copper layer is easy to wind when semi-hole treatment is carried out, so that in order to avoid the occurrence of the above situation, a lifting signal is sent to the milling control system at this moment, so that the rotation speed of the milling cutter is conveniently increased, and the precise control of the rotation speed control of the milling cutter is conveniently realized. In another embodiment, when the thickness-turning ratio is greater than or equal to the preset ratio, in order to reduce the power consumption of the adjustment control of the rotation speed of the milling cutter, a dimension-turning signal is sent to the milling control system so as to maintain the rotation speed of the milling cutter at the current rotation speed.
Further, the milling cutter is made of hard alloy because of the problem of copper layer winding caused by insufficient rotating speed, for example, the milling cutter is made of high-speed steel, has the characteristics of high hardness, wear resistance and heat resistance, a small amount of copper layers are easily worn and consumed when being in friction contact with other copper layers when being wound on the milling cutter, the influence on subsequent half-hole treatment is small, and the rotating speed of the milling cutter is lifted too much at the moment, so that the energy consumption of mechanical equipment is easy to be excessively large. In order to reduce the probability of overlarge energy consumption caused by overlarge lifting quantity of the rotating speed of the milling cutter, namely to reduce production cost, when the thickness-turning ratio quantity is smaller than the preset melting ratio quantity, a lifting signal is sent to a milling control system so that the rotating speed of the milling cutter is increased, and then the method further comprises the following steps:
acquiring a feed image of the milling cutter;
acquiring the copper layer flashing frequency according to the feeding image;
performing difference processing on the copper layer flash frequency and a preset flash frequency to obtain a copper flash difference value;
detecting whether the copper flash difference value is smaller than or equal to 0;
and when the copper flash difference value is smaller than or equal to 0, a first rotation increasing signal is sent to the routing control system so that the rotation speed increasing amount of each time of the routing is equal.
In this embodiment, the feeding image is an image obtained from a feeding direction when the milling cutter performs milling cutting on the electroplating plate, and the feeding image is used for displaying a real-time surface image of the milling cutter during milling cutting, so as to be convenient for determining a surface copper rolling condition of the milling cutter during milling cutting on the electroplating plate. The copper layer lightening flash frequency is the number of times of copper layers appearing on the surface of the milling cutter in unit time, and as the milling cutter is made of high-speed steel, the color between the milling cutter and the copper layers is greatly different, so that the number of times of copper layers appearing in unit time can be conveniently determined according to the surface color difference condition of the milling cutter, and the copper rolling quantity on the milling cutter can be effectively determined. The preset flashing frequency is the frequency corresponding to the consumption of the copper layer quantity wound on the milling cutter by abrasion, namely the copper quantity wound on the milling cutter can be rapidly ground at the moment, and the copper flashing frequency is the difference value between the current copper layer flashing frequency of the milling cutter and the standard copper layer flashing frequency, so that whether the current copper quantity wound on the surface of the milling cutter exceeds the standard or not can be conveniently determined. The copper flash difference value is smaller than or equal to 0, which indicates that the current copper quantity wound on the surface of the gong cutter is at a lower level, namely that the copper layer on the surface of the gong cutter is smaller and is easy to abrade when contacting with copper layers at other positions, and at the moment, a first ascending signal is sent to the gong board control system, so that the rotational speed increment of the gong cutter is equal every time, the rotational speed increment of the gong cutter is kept equal, the rotational speed increment of the gong cutter is kept at a lower level, and the energy waste caused by overlarge rotational speed increment of the gong cutter is effectively reduced. In another embodiment, when the copper flash difference value is greater than 0, a second rotation increasing signal is sent to the routing control system, so that the ratio of two adjacent rotation speeds of the routing is equal. The copper flash difference value is greater than 0, which indicates that the current winding copper quantity on the surface of the milling cutter is in a higher level, the rotating speed of the milling cutter needs to be rapidly increased, a second rotation increasing signal is sent to the milling control system, so that the ratio of two adjacent rotating speeds of the milling cutter is equal, the rotating speed of the milling cutter is increased in an equal ratio, and the rotating speed of the milling cutter is conveniently and rapidly increased to meet the requirements of semi-metallized hole milling treatment.
In one embodiment, the application further provides a thick copper half-hole circuit board, which is prepared by the half-metallized hole routing processing method in any embodiment. In this embodiment, the semi-metallized hole routing processing method includes obtaining a routing image of an electroplated board; determining a routing half-hole rail remaining parameter according to the routing image; and carrying out inscribing operation on the electroplating plate according to the routing half-hole track remaining parameters to obtain a thick copper half-hole circuit board, wherein the inscribing operation is used for propping a copper layer in a half-metallized hole of the electroplating plate against the inner wall of the half-metallized hole when routing. Under the condition based on the routing image, acquire the current routing track parameter of electroplate plate, be convenient for confirm the required routing of current electroplate plate and remove the track, so as to confirm the position that forms half metallized hole, finally according to above-mentioned routing condition, make the downthehole copper layer of routing in-process by the extrusion on half metallized hole's inner wall, the tangential cutting effort that makes downthehole copper layer receive is towards half metallized hole's inner wall, the perk probability of downthehole copper layer has been reduced effectively, thereby the probability that appears the burr in the half metallized hole has been reduced effectively, and then the probability of scrapping of circuit board has been reduced effectively.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (5)
1. A method of semi-metallized hole routing, comprising:
acquiring a routing image of the electroplating plate;
determining a routing half-hole rail remaining parameter according to the routing image;
performing inscribing operation on the electroplating plate according to the routing half-hole track retention parameters to obtain a thick copper half-hole circuit board, wherein the inscribing operation is used for propping a copper layer in a half-metallized hole of the electroplating plate against the inner wall of the half-metallized hole when routing;
wherein, acquire the gong board image of electroplate board, include:
obtaining the coordinates of copper deposition holes of the electroplating plate;
collecting the routing image according to the copper deposition hole coordinates;
the method for determining the routing half-hole track remaining parameters according to the routing image comprises the following steps:
acquiring a routing track boundary of the electroplated board according to the routing image;
detecting whether the routing track boundary is matched with a preset boundary or not;
when the routing track boundary is matched with the preset boundary, acquiring a stay removal image according to the routing image;
and obtaining a gong board removing and reserving value according to the removing and reserving image, wherein the gong board removing and reserving value corresponds to the gong board removing and reserving area of the electroplating board.
2. The method of semi-metallized hole routing according to claim 1, wherein the obtaining a routing divide-by-hold value according to the divide-by-hold image further comprises:
detecting whether the routing dividing and reserving value is matched with a first preset dividing and reserving value or not;
when the routing removal retention value is matched with the first preset removal retention value, a first routing direction value is obtained according to the routing image;
acquiring a first gong rotation complement value according to the first gong direction value and the first preset dividing and reserving value;
and detecting whether the gong board removing reserved value is matched with a second preset removing reserved value or not when the gong board removing reserved value is not matched with the first preset removing reserved value;
when the routing dividing and reserving value is matched with the second preset dividing and reserving value, acquiring a second routing direction value according to the routing image;
and obtaining a second gong rotation complement value according to the second gong direction value and the second preset dividing and remaining value.
3. The method of semi-metallized hole routing according to claim 2, wherein the inscribing the plating plate according to the routing parameters comprises:
detecting whether the first gong rotation complement value is matched with a first preset rotation complement value or not;
when the first gong rotation complement value is matched with the first preset rotation complement value, a right-hand left-hand feeding signal is sent to a gong control system so as to control the gong to perform clockwise left-hand feeding rotation on the electroplating plate; and when the first gong rotation complement value is not matched with the first preset rotation complement value, sending a left-hand right-hand feeding signal to the gong control system so as to control the gong to perform anticlockwise right-hand feeding rotation on the electroplating plate.
4. The method of semi-metallized hole routing according to claim 2, wherein the inscribing the plating plate according to the routing parameters comprises:
detecting whether the second gong rotation complement value is matched with a second preset rotation complement value;
when the second gong rotation complement value is matched with the second preset rotation complement value, a right-hand feeding signal is sent to a gong control system so as to control the gong to perform clockwise right-hand feeding rotation on the electroplating plate; and when the second gong rotation complement value is not matched with the second preset rotation complement value, sending a left-hand feeding signal to the gong control system so as to control the gong to perform anticlockwise left-hand feeding rotation on the electroplating plate.
5. A thick copper half-hole circuit board, characterized in that the thick copper half-hole circuit board is prepared by adopting the half-metallized hole routing treatment method as claimed in any one of claims 1 to 4.
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| CN202210253467.1A CN114710881B (en) | 2022-03-15 | 2022-03-15 | Semimetallized hole routing processing method and thick copper semihole circuit board |
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| CN202210253467.1A CN114710881B (en) | 2022-03-15 | 2022-03-15 | Semimetallized hole routing processing method and thick copper semihole circuit board |
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| CN104936387A (en) * | 2015-05-21 | 2015-09-23 | 东莞市五株电子科技有限公司 | Printed circuit board metalized half via hole machining method |
| CN106132094A (en) * | 2016-08-26 | 2016-11-16 | 广东冠锋科技股份有限公司 | A kind of half bore processing method of half bore circuit board |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
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| CN114710881A (en) | 2022-07-05 |
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