CN204167293U - A kind of high power electronic switch module - Google Patents
A kind of high power electronic switch module Download PDFInfo
- Publication number
- CN204167293U CN204167293U CN201420660174.6U CN201420660174U CN204167293U CN 204167293 U CN204167293 U CN 204167293U CN 201420660174 U CN201420660174 U CN 201420660174U CN 204167293 U CN204167293 U CN 204167293U
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- switch module
- electronic switch
- high power
- power electronic
- oxygen
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Abstract
The utility model discloses a kind of high power electronic switch module, they some power devices comprising substrate and arrange on the substrate, this substrate is aluminium base, this aluminium base is provided with one deck ceramic insulation heat-conducting layer, this ceramic insulation heat-conducting layer is provided with one deck oxygen-free copper layer, and this some power device surface mount is on this oxygen-free copper layer.High power electronic switch module of the present utility model, its power device surface mount is on oxygen-free copper circuit layer, first the heat that power device produces when running is evenly distributed on the more large-area oxygen-free copper layer of metal backing of specific power device by oxygen-free copper layer, and then by being transmitted on aluminium base after very thin ceramic insulation heat-conducting layer, then horizontal heat transfer is done by aluminium base, the burn-off poower flow of power device is distributed on larger area, thus little, the manufacturability of high power electronic switch module thermal resistance of the present utility model and reliability better.
Description
Technical field
The utility model relates to a kind of high power electronic switch module, particularly relates to a kind of high power density power model based on aluminium base.
Background technology
High power electronic switch module due to power very high, namely general 2 kilowatts ± 100 watts be at last high power, and heat is larger, and therefore heat dispersion requirement is higher.Existing high power electronic switch module is provided with high voltage power device, and the traditional radiator structure of high voltage power device is: then power device is installed on radiator by insulating heat-conductive pad.The problems such as this radiator structure exists that thermal resistance is large, manufacturability and poor reliability, such as, after being dismounted for multiple times, heat conductive pad performance greatly reduces, damaged, causes short circuit, unfavorable to the consistency of technique.Need special Tu to protect in the occasion that humidity is larger in addition, be unfavorable for maintenanceability requirement.
Utility model content
In view of this, the utility model provides a kind of high power electronic switch module, its thermal resistance is little, manufacturability and reliability better.
The utility model realizes like this, a kind of high power electronic switch module, they some power devices comprising substrate and arrange on the substrate, this substrate is aluminium base, this aluminium base is provided with one deck ceramic insulation heat-conducting layer, this ceramic insulation heat-conducting layer is provided with one deck oxygen-free copper layer, and this some power device surface mount is on this oxygen-free copper layer.
As the further improvement of such scheme, the thickness of this ceramic insulation heat-conducting layer is 40um.
As the further improvement of such scheme, the thickness of this oxygen-free copper layer is 175um.
As the further improvement of such scheme, this high power electronic switch module integrates encapsulation.Preferably, this high power electronic switch module also comprises at least one red copper post, signal plug, embedding shell, this some power device and this red copper post, this signal plug are electrically connected, this embedding shell and this aluminium base assemble and this this red copper post, this signal plug all appear through this embedding shell, and this embedding shell offers casting glue mouth.
High power electronic switch module of the present utility model, its power device surface mount is on oxygen-free copper circuit layer, first the heat that power device produces when running is evenly distributed on the more large-area oxygen-free copper layer of metal backing of specific power device by oxygen-free copper layer, and then by being transmitted on aluminium base after very thin ceramic insulation heat-conducting layer, then horizontal heat transfer is done by aluminium base, the burn-off poower flow of power device is distributed on larger area, thus little, the manufacturability of high power electronic switch module thermal resistance of the present utility model and reliability better.
Accompanying drawing explanation
The hierarchical structure schematic diagram of the high power electronic switch module that Fig. 1 provides for the utility model better embodiment.
Fig. 2 is the encapsulating structure schematic diagram of high power electronic switch module in Fig. 1.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with accompanying drawing and embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, the high power electronic switch module that the utility model better embodiment provides comprises substrate 1 and is arranged on the some power devices 2 on this substrate 1.This substrate 1 is aluminium base, this aluminium base is provided with one deck ceramic insulation heat-conducting layer 3, and this ceramic insulation heat-conducting layer 3 is provided with one deck oxygen-free copper layer 4, and power device 2 surface mount is on this oxygen-free copper layer 4.Power device 2 generally passes through scolding tin 5 surface mount on this oxygen-free copper layer 4.Oxygen-free copper layer 4 conducts electricity, heat conduction.
High power electronic switch module of the present utility model, its power device 2 surface mount is on oxygen-free copper circuit layer 4, first the heat that power device 2 produces when running is evenly distributed on the more large-area oxygen-free copper layer 4 of metal backing of specific power device 2 by oxygen-free copper layer 4, and then by being transmitted on aluminium base after very thin ceramic insulation heat-conducting layer 3, then horizontal heat transfer is done by aluminium base, the burn-off poower flow of power device 2 is distributed on larger area, thus high power electronic switch module thermal resistance of the present utility model is little, manufacturability and reliability better.
The thickness of this ceramic insulation heat-conducting layer 3 is preferably 40um, the thickness of this oxygen-free copper layer 4 is preferably 175um, such heat dispersion is best, the heat radiation thermal resistance of power device 2 is made to reduce nearly 4 times relative to traditional electric insulation radiating mode, its mechanical performance is very excellent again simultaneously, improves the resistance to external shock, vibrations.
This high power electronic switch module can integrate encapsulation, particularly, incorporated by reference to Fig. 2, this high power electronic switch module can comprise at least one red copper post 6 (being illustrated for three in the present embodiment), signal plug 7, embedding shell 8.Power device 2 and this red copper post 6, this signal plug 7 are electrically connected, and this embedding shell 8 assembles with this aluminium base and this this red copper post 6, this signal plug 7 all appear through this embedding shell 8, and this embedding shell 8 offers casting glue mouth 9.
First with special heating station, the power device 2 on aluminium base and red copper post 1, signal plug 5 are welded in fig. 2.The substrate 1 welded is put into Ultrasonic Cleaning, puts into baking oven 55 ° of oven dry in 4 hours.Embedding shell 8 is put into Ultrasonic Cleaning, puts into baking oven 55 ° of oven dry in 4 hours.The aluminium base of having dried and embedding shell 8 take out assembling, and assemble rear glue and banding is coated, indoor placement is solidified for 8 hours.Hand wears pvc sterile gloves, gets out two component silica gel, stirs silica gel respectively 5 minutes with two glass bars.Each 20 grams of two paper cups poured respectively into by silica gel, vacuumize.From casting glue mouth 9, glue is poured between aluminium base and embedding shell 8, static the depositing of the aluminium base that embedding is good can be tested for 48 hours.
The as a whole parts of high power electronic switch module integral reinforcing of the present utility model, reduce temperature gradient and the temperature of inner member and power device 2, improve between inner member, circuit and insulate, be conducive to device miniaturization, lightweight; Avoid element, circuit directly exposes, improve the waterproof of device, humidity resistance, and improve serviceability and steadiness parameter.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (5)
1. a high power electronic switch module, they some power devices comprising substrate and arrange on the substrate, it is characterized in that: this substrate is aluminium base, this aluminium base is provided with one deck ceramic insulation heat-conducting layer, this ceramic insulation heat-conducting layer is provided with one deck oxygen-free copper layer, and this some power device surface mount is on this oxygen-free copper layer.
2. high power electronic switch module as claimed in claim 1, is characterized in that: the thickness of this ceramic insulation heat-conducting layer is 40um.
3. high power electronic switch module as claimed in claim 1 or 2, is characterized in that: the thickness of this oxygen-free copper layer is 175um.
4. high power electronic switch module as claimed in claim 1, is characterized in that: this high power electronic switch module integrates encapsulation.
5. high power electronic switch module as claimed in claim 4, it is characterized in that: this high power electronic switch module also comprises at least one red copper post, signal plug, embedding shell, this some power device and this red copper post, this signal plug are electrically connected, this embedding shell and this aluminium base assemble and this this red copper post, this signal plug all appear through this embedding shell, and this embedding shell offers casting glue mouth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420660174.6U CN204167293U (en) | 2014-11-06 | 2014-11-06 | A kind of high power electronic switch module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420660174.6U CN204167293U (en) | 2014-11-06 | 2014-11-06 | A kind of high power electronic switch module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204167293U true CN204167293U (en) | 2015-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420660174.6U Expired - Fee Related CN204167293U (en) | 2014-11-06 | 2014-11-06 | A kind of high power electronic switch module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204167293U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110481324A (en) * | 2019-07-15 | 2019-11-22 | 新乡市光明电器有限公司 | Load control circuit, load control mould group and electric control box |
-
2014
- 2014-11-06 CN CN201420660174.6U patent/CN204167293U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110481324A (en) * | 2019-07-15 | 2019-11-22 | 新乡市光明电器有限公司 | Load control circuit, load control mould group and electric control box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150218 Termination date: 20161106 |
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| CF01 | Termination of patent right due to non-payment of annual fee |