CN113582125B - Super-slip packaging device and packaging method thereof - Google Patents
Super-slip packaging device and packaging method thereof Download PDFInfo
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- CN113582125B CN113582125B CN202110825464.6A CN202110825464A CN113582125B CN 113582125 B CN113582125 B CN 113582125B CN 202110825464 A CN202110825464 A CN 202110825464A CN 113582125 B CN113582125 B CN 113582125B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B5/00—Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00198—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
Abstract
The invention provides an ultra-sliding packaging device and a packaging method thereof, wherein the ultra-sliding packaging device comprises an ultra-sliding substrate, a packaging plate and an ultra-sliding sheet, wherein the ultra-sliding substrate and the packaging plate are enclosed to form a cavity, at least one ultra-sliding sheet is arranged in the cavity, the ultra-sliding sheet is provided with an ultra-sliding surface, one side of the ultra-sliding substrate facing the packaging plate is provided with an atomic-level flat surface, the ultra-sliding surface is attached to the atomic-level flat surface, all the ultra-sliding sheets are bonded by adopting bonding sheets, all the ultra-sliding sheets can be uniformly transferred to a part to be packaged, and the bonding layers of the bonding sheets are removed, so that all the ultra-sliding sheets are uniformly separated from the bonding sheets and fall onto the part to be packaged, the transfer efficiency can be greatly improved, meanwhile, the bonding sheets can be packaging plates, the transfer and the packaging can be completed in the same step, the whole packaging speed is improved, and the ultra-sliding sheet transfer process can not influence the ultra-sliding surface and the atomic-level flat surface on the ultra-sliding substrate.
Description
Technical Field
The invention belongs to the technical field of structural super-slip, and particularly relates to a super-slip packaging device and a packaging method thereof.
Background
The structural ultra-slip is one of ideal schemes for solving the friction and abrasion problems, and the structural ultra-slip refers to the phenomenon that friction and abrasion between two van der Waals solid surfaces (such as two-dimensional material surfaces of graphene, molybdenum disulfide and the like) which are smooth at atomic level and are in non-metric contact are almost zero. The current manufacturing method of the super-slip sheet is that after the super-slip sheet is processed into a graphite island with a target size, a certain external force is applied to separate the dissociation surfaces inside the graphite island to form a super-slip interface, and the super-slip graphite island element which can be independently controlled and endowed with functionalization is formed by the upper structure of the HOPG substrate which is separated from the background.
However, due to the limitation of the grain size of the high-orientation pyrolytic graphite, the graphite islands are required to be cut firstly in the current processing of the super-slip sheets, and then each independent graphite island is separated respectively, so that the size of each super-slip sheet is smaller, and meanwhile, if the super-slip sheets are required to be put into use, the super-slip sheets are required to be packaged in the device, so that impurities such as dust and the like are prevented from affecting the flatness of the super-slip surface. Multiple super-slip sheets are generally required in one super-slip device, and the transfer efficiency is low, so that the super-slip sheet is difficult to be suitable for mass production. And the super-slip sheet may be damaged or the substrate is flattened due to improper operation during the transfer process, resulting in lower yield of the product.
Disclosure of Invention
The invention aims to provide an ultra-smooth packaging device and a packaging method thereof, which are used for solving the technical problems that the packaging efficiency is lower and an ultra-sliding sheet or a flat substrate is possibly damaged due to improper operation in the prior art.
In order to achieve the above purpose, the invention adopts the following technical scheme: provided is an ultra-slip packaging device, including: including super smooth base, package plate and super gleitbretter, super smooth base with the package plate encloses and closes and form the cavity, at least one super gleitbretter is located in the cavity, just super gleitbretter has super smooth surface, super smooth base orientation super smooth base one side of gleitbretter has atomic level smooth surface, super smooth surface with atomic level smooth surface laminating and super smooth contact, super gleitbretter in atomic level smooth surface is last to be moved.
Further, the super-slip substrate comprises a substrate and an electrode layer, wherein the electrode layer is arranged in the substrate and is used for driving the super-slip sheet to move; preferably, the electrode layer is disposed inside the substrate.
Further, a supporting frame is arranged on the outer side of the super-slip substrate, and the packaging plate is arranged on the supporting frame, preferably, the height of the supporting frame is higher than the thickness of the super-slip sheet.
Further, a plurality of through holes are formed in the packaging plate, and preferably, the through holes are uniformly formed in the packaging plate, or the through holes are located at the periphery of the super-sliding plate.
The invention also discloses a packaging method of the ultra-smooth packaging device, which comprises the following steps:
bonding all the super-sliding sheets by adopting bonding sheets, wherein one side, far away from the bonding sheets, of all the super-sliding sheets is provided with a super-sliding surface;
transferring the bonding sheet to a part to be packaged, wherein one side surface of the part to be packaged facing the bonding sheet is an atomic level flat surface, and the ultra-sliding surface of the ultra-sliding sheet faces the atomic level flat surface;
and removing the adhesive sheet or the adhesive layer of the adhesive sheet so that the super slip sheet falls onto the atomically flat surface.
Further, the component to be packaged comprises an ultra-smooth substrate and an electrode layer, wherein the electrode layer is arranged in the ultra-smooth substrate, and one side surface of the ultra-smooth substrate, which faces the ultra-smooth sheet, is an atomic-level flat surface.
Further, the processing method of the component to be packaged comprises the following steps: sequentially depositing a substrate, an electrode layer and an insulating layer, wherein the surface of the insulating layer is the atomic-level flat surface; or depositing a formed substrate, wherein the surface of the substrate is an atomic level flat surface, a groove is formed in the substrate, and an electrode layer is deposited in the groove.
Further, the adhesive sheet is provided with a package plate and an adhesive layer, and in the step of removing the adhesive layer, a plurality of through holes are formed in the adhesive sheet, and a removing liquid for removing the adhesive layer enters between the package plate and the component to be packaged through the through holes.
Further, the preparation method of the super-slip sheet comprises the following steps:
the adhesive sheets are respectively arranged on two sides of the super-slide island with the multi-layer structure, the super-slide island is divided into two super-slide blocks along any layer of the super-slide island, and any super-slide block is adhered to the adhesive sheets;
the super-slider is divided into a plurality of super-slider sheets, and the super-slider sheets are bonded with the bonding sheets.
Further, when the super-slip sheet is divided, cutting is performed according to the grain boundary of the super-slip sheet, so that no grain boundary exists in the super-slip sheet.
The ultra-smooth packaging device provided by the invention has the beneficial effects that:
1. the packaging plate is arranged above the super-sliding substrate, the super-sliding sheet can slide in the cavity between the packaging plate and the super-sliding substrate, the super-sliding sheet can be packaged and protected by the packaging plate, and the super-sliding sheet packaging device is simple in structure and high in practicality and can realize packaging of the super-sliding sheet and the super-sliding substrate.
2. All the super-slip sheets are bonded by adopting the bonding sheets, so that the super-slip sheets can be simultaneously and uniformly transferred, and only the bonding layers of the bonding sheets are removed, so that all the super-slip sheets are uniformly separated from the bonding sheets and fall onto the parts to be packaged, and the transfer efficiency can be greatly improved; the adhesive sheet can also be a packaging plate at the same time, so that the transfer and packaging can be completed in the same step, the overall packaging speed is improved, and the transfer process of the super-slip sheet can not influence the super-slip surface and the atomic level flat surface.
3. The bonding sheets are adopted to dissociate the oversized super-sliding island, the oversized super-sliding island is cut after dissociation, each cut super-sliding sheet is provided with a super-sliding surface, and the bonding sheets bonded with a plurality of super-sliding sheets are directly transferred onto the parts to be packaged at the moment, so that packaging can be realized, and the preparation and packaging of the super-sliding island are carried out by adopting the bonding sheets, so that the production and transfer efficiency of the whole process are greatly improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a process flow of a method for manufacturing a super-slider according to an embodiment of the present invention;
fig. 2 is a schematic process flow diagram of a packaging method of an ultra-smooth packaged device according to an embodiment of the present invention.
Wherein, each reference sign in the figure:
1. a component to be packaged; 11. an ultra-smooth substrate; 12. an electrode layer; 13. a support frame; 2. an adhesive sheet; 21. a package plate; 22. an adhesive layer; 23. a through hole; 3. super-smooth island; 4. a super slider; 5. super-slip sheets.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The phenomenon of friction coefficient of the order of thousandths or less has been known in literature for more than ten years as "ultra-slip" due to long-term failure to achieve large-scale ultra-slip; the first phenomenon that the frictional wear caused by the non-metric contact is almost zero is changed into 'structural lubrication', and the 'super-slip' refers to the phenomenon that the frictional wear caused by the non-metric contact is almost zero.
Example 1
Referring to fig. 2 together, the ultra-smooth package device provided by the present invention will now be described. The super-slip packaging device comprises a super-slip substrate 11, a packaging plate 21 and a super-slip sheet 5, wherein the super-slip substrate 11 and the packaging plate 21 are enclosed to form a cavity, and the super-slip sheet 5 is arranged in the cavity. The outer side of the super-slide base 11 is provided with a supporting frame 13, the packaging plate 21 is arranged on the supporting frame 13, and the height Gao Yuchao of the supporting frame 13 is equal to the height of the slide sheet 5. Or, the outer side of the packaging plate 21 is provided with a supporting frame 13, the top of the supporting frame 13 is fixedly connected with the packaging plate 21, and the bottom of the packaging plate 21 is abutted against the ultra-sliding substrate 11.
The number of the super-slip sheets 5 is one or more, at least one super-slip surface is provided on the super-slip sheets 5, for example, the lower surface of the super-slip sheets 5 is a super-slip surface, wherein the super-slip surface is an atomically smooth two-dimensional material with a self-recovery function, the material of the super-slip sheets 5 is preferably a graphite sheet or other material with a super-slip surface, and preferably a material with super-slip properties such as graphite, single-layer/few-layer graphene and the like is attached on the lower surface. The height and bottom area of each super-slide 5 may be the same or different.
The side of the super slip base 11 facing the package plate 21 has an atomically flat surface on which the super slip surface is attached, enabling a zero wear sliding of the super slip sheet 5 on the atomically flat surface. The atomic level flat surface is free of burrs at the edge and has an internal area of at least 10×10um 2 No burrs or pits in the range of (a).
The super-slip substrate 11 is provided with a substrate (not marked in the figure) and an electrode layer 12, the electrode layer 12 is arranged in the substrate, the electrode layer 12 is a driving electrode, and the super-slip sheet 5 can be driven by electricity to move horizontally; preferably, the electrode layer 12 is buried in the substrate, and the arrangement of the electrode does not affect the flatness of the substrate surface.
Wherein, can be provided with a plurality of through-hole 23 on the package board 21, the setting of this through-hole 23 is convenient outside get into the inside of packaging device to the solution that gets rid of for the adhesive linkage 22 that is used for bonding super slide sheet 5 gets rid of, can be unified get rid of all super slide sheet 5 and package board 21 or bonding sheet 2, and the removal mode is simple swift, can not produce the influence to super slide face and the atomic level smooth surface of super slide sheet 5.
Adopt package plate 21 direct lid to close on super smooth base 11, super gleitbretter 5 can be in the cavity slip between package plate 21 and super smooth base 11, can adopt package plate 21 to encapsulate and protect super gleitbretter 5, its simple structure and practicality are high.
In other embodiments of the present invention, the supporting frame 13 may also be a separate component, where the supporting frame 13 abuts against the package board 21 and the super-slip base 11, respectively, and is not limited in particular herein.
In other embodiments of the present invention, optical driving, thermal driving, magnetic driving or other driving methods may be used for the movement of the super slide sheet 5, and different driving elements may be embedded in the substrate, which is not limited in particular herein.
In other embodiments of the present invention, the electrode layer 12 may also be disposed within the outer support frame 13 or within the package plate 21, and may also be disposed outside of the entire super-slip package device, without being limited in particular herein.
Example 2
Referring to fig. 1 and fig. 2, as a method for packaging a super-slider 5 provided by the present invention, the method includes the following processing steps:
s1, the bonding sheets 2 are respectively stuck on two sides of the super-slide island 3 with the multilayer structure, the bonding sheets 2 are respectively stuck in the direction perpendicular to the multilayer structure, the bonding sheets 2 respectively divide the super-slide island 3 towards two directions, the super-slide island 3 can be divided along any hierarchy, one super-slide island 3 is divided into two super-slide blocks 4, and the two super-slide blocks 4 are respectively stuck on the two bonding sheets 2.
The super-sliding island 3 is a material with a multi-layer structure, and can be made of a hierarchical material such as a graphite block or a graphene material with excellent quality and clear hierarchy.
Preferably, prior to the separation of the islands by the bonding sheet 2, the islands are pried by a blade or other material that allows the separation of the cut sheets so that the islands can be separated along the level to be segmented. Of course, the relative movement of the adhesive sheet 2 may also be directly employed to cause the sliding separation of the graphite islands, which is not particularly limited herein.
S2, etching is carried out on the super-slider 4 at any side, the super-slider 4 is divided into a plurality of super-sliders 5 with smaller sizes, the super-sliders 5 can be cut according to preset positions, the sizes and the positions of the super-sliders 5 can be cut according to the requirements of the components 1 to be packaged, and certain rejection rates possibly exist.
S3, one or more super-slip sheets 5 are transferred to the component 1 to be packaged, the component 1 to be packaged comprises a super-slip substrate 11, one side surface of the super-slip substrate 11, which faces the super-slip sheets 5, is an atomic-level flat surface, and the super-slip sheets 5 are placed on the atomic-level flat surface, so that abrasion-free sliding can be realized.
Preferably, the component 1 to be packaged may further include an electrode layer 12, where the electrode layer 12 is disposed inside or outside the super-slip substrate 11, or the electrode layer 12 may not be disposed.
Preferably, the component 1 to be packaged further comprises a supporting frame 13, the supporting frame 13 is located on the super-sliding base 11, and the packaging board 21 is arranged on the supporting frame 13. The arrangement manner of the supporting frame 13 may be identical to that of the supporting frame 13 in embodiment 1, and will not be described here.
S4, removing the bonding sheet 2 or the bonding layer 22 of the bonding sheet 2, so that the super-slip sheet 5 falls onto the atomic level flat surface, wherein the distance between the super-slip sheet 5 and the atomic level flat surface is generally micro-scale or nano-scale, and the distance is smaller, so after the bonding layer 22 which constrains the movement of the super-slip sheet 5 is removed, the super-slip sheet 5 is close to the atomic level flat surface, and the super-slip sheet 5 does not damage the super-slip sheet 5 or the atomic level flat surface when being close to the atomic level flat surface.
All the super-slip sheets 5 are bonded by the bonding sheet 2, all the super-slip sheets 5 can be uniformly transferred to the component 1 to be packaged, and the bonding layer 22 of the bonding sheet 2 is removed, so that all the super-slip sheets 5 are uniformly separated from the bonding sheet 2 and fall onto the component 1 to be packaged, and the transfer efficiency can be greatly improved.
Preferably, the adhesive sheet 2 may further include a package board 21 and an adhesive layer 22, where the package board 21 is still remained after the adhesive layer 22 is removed, so that the packaging step can be completed quickly, so that the transferring and the packaging can be completed in the same step, and the overall packaging speed is improved.
The removal of the bonding layer 22 generally adopts a wet etching mode, the packaging plate 21 needs to encapsulate the whole part 1 to be encapsulated, so if the bonding layer 22 needs to be removed, a plurality of through holes 23 need to be formed in the part 21 to be encapsulated, so that etching liquid enters the part 1 to be encapsulated, the bonding layer 22 is etched and removed, all the super-sliding sheets 5 and the packaging plate 21 or the bonding sheet 2 can be uniformly removed, the removal mode is simple and rapid, and the super-sliding surface and the atomic level flat surface of the super-sliding sheets 5 cannot be influenced.
The bonding sheet 2 is adopted to dissociate the large-size super-sliding island 3, and then the large-size super-sliding island 3 is cut after dissociation, the cutting method is to cut according to the size of crystal grains and the sequence of crystal boundaries, so that each cut super-sliding island 3 has a super-sliding surface, namely, the cut super-sliding island 3 is the super-sliding sheet 5, at the moment, the bonding sheet 2 bonded with a plurality of super-sliding sheets 5 is directly transferred onto the component 1 to be packaged, so that packaging can be realized, and the preparation and packaging of the super-sliding island 3 are transferred by adopting the bonding sheet 2, thereby greatly improving the production and transfer efficiency of the whole flow.
In other embodiments of the present invention, in step S2, the super-slip sheet 5 may be divided by an AFM scanner in advance, and after determining the grain boundary position and size of the super-slip sheet 5, the super-slip sheet 4 is cut, so that no grain boundary exists in a single super-slip sheet 5, which not only can ensure the super-slip rate of the super-slip sheet 5, but also can improve the yield of the whole package component.
In other embodiments of the present invention, in step S4, the adhesive sheet 2 may also be directly an adhesive layer 22, and when the adhesive layer 22 is removed, the super-slip sheet 5 directly falls onto the atomically flat surface, and when the adhesive layer 22 is completely removed, the package board 21 packaged on the component to be packaged 1 is further processed, so that all the packages can be realized.
Example 3
Referring to fig. 2, as a packaging method of an ultra-slip packaging device provided by the present invention, the difference between the embodiment and the embodiment 2 is mainly that the processing method of the ultra-slip sheet 5, that is, steps S1 and S2, in this embodiment, the processing of the ultra-slip sheet 5 includes the following processing steps:
s1, preparing a plurality of super-slip sheets 5, wherein the super-slip sheets 5 are independently prepared and detected, and then transferred to a substrate, and the super-slip surfaces of all the super-slip sheets 5 are positioned on the same side. The preparation method of the super-slip sheet 5 can adopt the processing and manufacturing methods of the super-slip sheet 5 in the prior art;
s2, all the super-slip sheets 5 are uniformly bonded by the bonding sheets 2, and a plurality of super-slip sheets 5 are transferred at the same time, so that the transfer efficiency of the super-slip sheets 5 can be improved.
The one or more super-slip sheets 5 are arranged on a substrate according to a preset arrangement rule, all the super-slip sheets 5 are stably bonded by the bonding sheet 2, and the super-slip surfaces of all the super-slip sheets 5 are positioned on one side far away from the bonding sheet 2, so that the super-slip contact can be realized after all the super-slip sheets 5 are arranged on the component 1 to be packaged.
In order to enable the super-slip sheets 5 to be stably bonded, the substrate enables the heights of the top surfaces of all super-slip sheets 5 to be uniform or close, and the bonding sheet 2 can achieve the effect of bonding all super-slip sheets 5 when being bent at a certain angle or not. Alternatively, the adhesive sheet 2 is a flexible material, and the adhesive sheet 2 may be compressed and adhere all of the super slip sheets 5, which is not limited in particular herein.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (9)
1. The encapsulation method of the ultra-smooth encapsulation device is characterized by comprising the following steps:
adhesive sheets are respectively arranged on two sides of the super-slide island with the multi-layer structure, the super-slide island is divided into two super-slide blocks along any layer of the super-slide island, and any super-slide block is adhered to the adhesive sheets;
dividing the super-sliding block into a plurality of super-sliding blocks, bonding the super-sliding blocks with the bonding sheets, wherein one side of each super-sliding block, which is far away from the bonding sheet, is provided with a super-sliding surface;
transferring the bonding sheet to a part to be packaged, wherein one side surface of the part to be packaged facing the bonding sheet is an atomic level flat surface, and the ultra-sliding surface of the ultra-sliding sheet faces the atomic level flat surface;
removing the adhesive sheet or the adhesive layer of the adhesive sheet, so that the super-slip sheet falls onto the atomic level flat surface, wherein the adhesive sheet is provided with a packaging plate and an adhesive layer, a plurality of through holes are formed in the adhesive sheet, and removing liquid for removing the adhesive layer enters between the packaging plate and the component to be packaged through the through holes;
the component to be packaged comprises an ultra-smooth substrate and an electrode layer, wherein the electrode layer is arranged in the ultra-smooth substrate, and one side surface of the ultra-smooth substrate, which faces the ultra-smooth sheet, is an atomic-level flat surface.
2. The encapsulation method of the ultra-smooth encapsulated device of claim 1, wherein: the processing method of the component to be packaged comprises the following steps: sequentially depositing a substrate, an electrode layer and an insulating layer, wherein the surface of the insulating layer is the atomic-level flat surface; or depositing a formed substrate, wherein the surface of the substrate is an atomic level flat surface, a groove is formed in the substrate, and an electrode layer is deposited in the groove.
3. The encapsulation method of the ultra-smooth encapsulated device of claim 1, wherein: and cutting according to the grain boundary of the super-slip sheet when the super-slip sheet is segmented, so that no grain boundary exists in the super-slip sheet.
4. A super-slip packaged device processed by the packaging method of the super-slip packaged device according to any one of claims 1 to 3, characterized in that: the packaging board comprises an ultra-sliding substrate, a packaging board and an ultra-sliding sheet, wherein the ultra-sliding substrate and the packaging board are enclosed to form a cavity, at least one ultra-sliding sheet is arranged in the cavity, the ultra-sliding sheet is provided with an ultra-sliding surface, one side of the ultra-sliding substrate, which faces towards the ultra-sliding sheet, is provided with an atomic-level flat surface, the ultra-sliding surface is attached to the atomic-level flat surface and is in ultra-sliding contact with the atomic-level flat surface, the ultra-sliding sheet moves on the atomic-level flat surface, and a plurality of through holes are formed in the packaging board;
the super-slip substrate comprises a substrate and an electrode layer, wherein the electrode layer is arranged in the substrate and used for driving the super-slip sheet to move.
5. The ultra-slip encapsulation device of claim 4, wherein: the electrode layer is arranged in the substrate.
6. The ultra-slip encapsulation device of claim 4, wherein: the outer side of the super-smooth substrate is provided with a supporting frame, and the packaging plate is arranged on the supporting frame.
7. The ultra-slip encapsulation device of claim 6, wherein: the height of the supporting frame is higher than the thickness of the super-slip sheet.
8. The ultra-slip encapsulation device of claim 4, wherein: the through holes are uniformly formed in the packaging plate.
9. The ultra-slip encapsulation device of claim 8, wherein: the through holes are positioned at the periphery of the super-slip sheet.
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