CN214542140U - Blue membrane removing device - Google Patents
Blue membrane removing device Download PDFInfo
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- CN214542140U CN214542140U CN202120504162.4U CN202120504162U CN214542140U CN 214542140 U CN214542140 U CN 214542140U CN 202120504162 U CN202120504162 U CN 202120504162U CN 214542140 U CN214542140 U CN 214542140U
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Abstract
The utility model relates to a blue film removing device, which comprises a crystal expanding area used for expanding crystals of a wafer to be demoulded before demoulding; the demolding area comprises a sucker, a wafer to be demolded is placed on the sucker, a plurality of vacuum suction holes are formed in the sucker, an external air source vacuumizes the vacuum suction holes to adsorb one surface of a blue film of the wafer to be demolded on the sucker, and a heating element used for heating the wafer to be demolded is arranged on the peripheral edge of the sucker; the collecting area is used for placing and collecting the wafer subjected to the blue film removal in the mold removing area; expand and be provided with xz axle between brilliant district, demoulding district and the collecting region and remove the subassembly, xz axle removes the subassembly and is used for will treating drawing of patterns wafer and removes to expanding brilliant district, demoulding district in proper order and the wafer after the membrane of will blue peeling and collects the district, the utility model discloses have the convenient membrane of blue peeling and avoid the effect of wafer damage.
Description
Technical Field
The utility model relates to a technical field that the wafer was made, concretely relates to blue membrane device takes off.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. The wafer can be processed into various circuit device structures to become integrated circuit products with specific electrical functions.
The wafer has a plurality of chips and patterns on both sides, and is generally manufactured by a wet etching process or electroplating. When processing a pattern on one surface of a wafer, a layer of blue film is usually pasted on the other surface of the wafer, and the surface which does not need to be processed is protected by the blue film, so that the pattern on the surface is prevented from being damaged. When the processing is finished, the blue film needs to be removed, and the blue film is usually adhered to the surface of the wafer tightly, which causes the wafer to be damaged easily when the blue film is removed.
SUMMERY OF THE UTILITY MODEL
Therefore, the technical problem to be solved by the present invention is to overcome the defect of the prior art that the adhesion of the blue film and the wafer surface is tight and the wafer is easily damaged, thereby providing a blue film removing device.
A decoherence film apparatus comprising:
the wafer expanding area is used for expanding the wafers to be demoulded before demoulding;
the demolding area comprises a sucker, a wafer to be demolded is placed on the sucker, a plurality of vacuum suction holes are formed in the sucker, an external air source vacuumizes the vacuum suction holes to adsorb one surface of a blue film of the wafer to be demolded on the sucker, and a heating element used for heating the wafer to be demolded is arranged on the peripheral edge of the sucker;
the collecting area is used for placing and collecting the wafer subjected to the blue film removal in the mold removing area;
and an xz-axis moving assembly is arranged among the wafer expanding area, the demolding area and the collecting area and is used for sequentially moving the wafer to be demolded to the wafer expanding area and the demolding area and moving the wafer subjected to blue film removal to the collecting area.
Furthermore, a plurality of bosses are arranged on one surface, where the wafer to be demoulded is placed, of the sucker, and the bosses are evenly arranged on one surface, where the wafer is placed, of the sucker.
Further, still include the base, expand brilliant district, demoulding area and collecting region all install on the base.
Further, the heating member includes annular hot plate, the sucking disc is located the hot plate inboard, be provided with the connecting rod that is used for erectting the hot plate between hot plate and the base.
Furthermore, a gap which is convenient for being connected with an external air source pipeline is reserved between the sucker and the base.
Further, the collecting region comprises a collecting box arranged on the base, the top end of the collecting box is open, a placing plate is arranged in the collecting box and is abutted against the inner side wall of the collecting box, a compression spring is arranged between the placing plate and the bottom of the collecting box, one end of the compression spring is abutted against the placing plate, and the other end of the compression spring is connected with the bottom of the collecting box.
Furthermore, a sliding groove is vertically formed in the inner side wall of the collecting box, a sliding block is arranged on the side wall of the placing plate, and the sliding block is located in the sliding groove and slides in the sliding groove along the vertical direction.
Further, xz axle removes subassembly is including setting up the x axle on the base and removing the cylinder, expand brilliant district, demoulding district and place the district and arrange the setting along the x axle direction, be provided with the mount pad on the x axle removes the cylinder, x axle removes the cylinder drive mount pad and removes along the x axle direction, be provided with z axle on the mount pad and remove the cylinder, be provided with the mounting panel on the z axle removes the cylinder, z axle removes the cylinder drive mounting panel and removes along the z axle direction, the mounting panel bottom is provided with a plurality of vacuum suction pens that are used for holding the wafer.
The utility model discloses technical scheme has following advantage:
1. the utility model provides a blue film removing device, which comprises a crystal expansion area used for expanding crystals of a wafer to be demoulded before demoulding; the demolding area comprises a sucker, a wafer to be demolded is placed on the sucker, a plurality of vacuum suction holes are formed in the sucker, an external air source vacuumizes the vacuum suction holes to adsorb one surface of a blue film of the wafer to be demolded on the sucker, and a heating element used for heating the wafer to be demolded is arranged on the peripheral edge of the sucker; the collecting area is used for placing and collecting the wafer subjected to the blue film removal in the mold removing area; an xz-axis moving component is arranged among the wafer expanding area, the demolding area and the collecting area, and is used for sequentially moving the wafer to be demolded to the wafer expanding area and the demolding area and moving the wafer subjected to blue film demolding to the collecting area, when the device is used, the wafer to be demolded is moved to the wafer expanding area through the xz-axis moving component, the wafer is uniformly diffused to the periphery, at the moment, the blue film on the wafer can be displaced with the wafer, so that the tightness between the blue film and the wafer is reduced, the subsequent blue film demolding is convenient to carry out, after the wafer is expanded, the wafer to be demolded is placed on the sucker on the demolding area through the xz-axis moving component again, an external air source adsorbs the surface, provided with the blue film, of the wafer to be demolded on the sucker through the vacuum suction hole, at the moment, the heating component is started, under the action of the heating component, so that the wafer is heated, the temperature between the wafer and the blue film is increased, so that the viscosity between the wafer and the blue film is reduced, the blue film is more conveniently torn off from the wafer, the wafer is driven to move through the xz-axis moving assembly, and the blue film is sucked by the vacuum suction holes, so that the blue film is more convenient to use.
2. The utility model provides a blue membrane device takes off, the sucking disc is placed and is treated one side of drawing of patterns wafer and be provided with a plurality of bosss, the boss evenly sets up on the sucking disc places the one side of wafer, when will treating drawing of patterns wafer and place on the sucking disc, boss on the sucking disc and the blue membrane contact on the wafer this moment, leave the space between blue membrane and the sucking disc, when outside air supply holds the blue membrane through the vacuum suction hole, this moment because leave little space between vacuum suction hole and the blue membrane, when the blue membrane is inhaled on the vacuum suction hole, the blue membrane of boss department is still contradicted with the boss this moment, thereby pull down blue membrane part from the wafer, thereby make things convenient for follow-up to take off the blue membrane, use convenience more.
3. The utility model provides a blue membrane device takes off, the heating member includes annular hot plate, the sucking disc is located the hot plate inboard, be provided with the connecting rod that is used for shelving the hot plate between hot plate and the base, will treat drawing of patterns wafer and place on the sucking disc to inhale the hole through the vacuum and hold the blue membrane, start the hot plate this moment, thereby the hot plate begins work and heats treating drawing of patterns wafer on the sucking disc, thereby make the viscosity between wafer and the blue membrane reduce, make things convenient for follow-up removal subassembly through xz and drive wafer and blue membrane and break away from, take off the blue membrane from the wafer.
4. The utility model provides a decoherence membrane device, leave the space that conveniently inserts outside air supply pipeline between sucking disc and the base, thereby space between sucking disc and the base can hold the pipeline of outside air supply bottom the sucking disc to carry out the evacuation in the vacuum suction hole, hold the wafer on the sucking disc.
5. The utility model provides a membrane device takes off blue, the collecting region is including setting up the collecting box on the base, the uncovered setting in collecting box top, be provided with in the collecting box and place the board, place board and collecting box inside wall conflict, it is provided with compression spring to place between board and the collecting box bottom, compression spring one end with place the board conflict, the other end and collecting box bottom are connected, thereby place the wafer that takes off blue membrane through the collecting box, after the wafer takes off blue membrane on the sucking disc, thereby remove the subassembly through the xz axle and remove the wafer that the drawing of patterns is good to the collecting box in place the board on, place gravity on the board this moment and increase to make compression spring receive compression length to reduce, place the board and remove to the collecting box bottom, the convenience is collected next wafer and is placed.
6. The utility model provides a blue membrane device takes off, the vertical sliding tray that is provided with on the collecting box inside wall, it is provided with the sliding block on the board lateral wall to place, the sliding block is located the sliding tray and slides along vertical direction in the sliding tray, is placing the board and removes the in-process, and the sliding block slides in the sliding tray this moment to the messenger places the board and only removes along vertical direction, can not take place rotation in a circumferential direction.
7. The utility model provides a blue membrane removing device, the xz axis moving component comprises an x axis moving cylinder erected on a base, the crystal expanding area, the demoulding area and the placing area are arranged along the x axis direction, a mounting seat is arranged on the x axis moving cylinder, the x axis moving cylinder drives the mounting seat to move along the x axis direction, a z axis moving cylinder is arranged on the mounting seat, a mounting plate is arranged on the z axis moving cylinder, the z axis moving cylinder drives the mounting plate to move along the z axis direction, a plurality of vacuum suction pens for sucking the wafer are arranged at the bottom of the mounting plate, during the demoulding process of the wafer, the mounting seat slides on the x axis moving cylinder, thereby controlling the z axis moving cylinder to move, when the z axis moving cylinder moves to the wafer, the z axis moving cylinder starts to work, thereby driving the vacuum suction pens to move along the wafer direction, therefore, the wafer is sucked by the vacuum suction pen, and is driven to move so as to demould the wafer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the blue film removing device of the present invention;
FIG. 2 is a cross-sectional view of the internal structure of the suction cup of the present invention;
fig. 3 is a cross-sectional view of the internal structure of the middle collecting box of the present invention.
Description of reference numerals:
1. a base; 2. a crystal expansion area; 3. a demolding area; 31. a suction cup; 32. vacuum suction holes; 33. a heating member; 331. heating plates; 332. a connecting rod; 4. a collection region; 41. a collection box; 42. placing the plate; 43. a compression spring; 5. a void; 6. a sliding groove; 7. a slider; 8. an xz-axis moving assembly; 81. an x-axis moving cylinder; 82. a mounting seat; 83. a z-axis moving cylinder; 84. mounting a plate; 85. a vacuum suction pen; 9. and (4) a boss.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Examples
Referring to fig. 1-3, the utility model provides a decoherence membrane device, including base 1, expand brilliant district 2, drawing of patterns district 3 and collecting region 4 and all set up on installation base 1. The wafer expanding area 2 is provided with a wafer expanding machine which is arranged on the base 1 and used for expanding the wafers to be demoulded before demoulding. Demoulding district 3 includes sucking disc 31, waits to demold the wafer and places on sucking disc 31, has seted up a plurality of vacuum suction holes 32 on sucking disc 31, and the outside air supply will wait to demold blue membrane one side of wafer and adsorb on sucking disc 31 to vacuum suction holes 32 evacuation, and sucking disc 31 week is provided with and is used for treating the heating member 33 that demold the wafer and carry out the heating. The collecting region 4 is used for placing and collecting the wafer after being subjected to the blue stripping in the stripping region 3. An xz-axis moving assembly 8 is arranged among the crystal expanding area 2, the demolding area 3 and the collecting area 4, and the xz-axis moving assembly 8 is used for sequentially moving the wafer to be demolded to the crystal expanding area 2 and the demolding area 3 and moving the wafer after the blue film is removed to the collecting area 4.
When the device is used, the wafer to be demoulded is moved into the wafer expanding area 2 through the xz-axis moving component 8, the wafer is uniformly diffused to the periphery, at the moment, the blue film on the wafer can be displaced with the wafer, so that the tightness between the blue film and the wafer is reduced, the subsequent blue film removing is convenient, after the wafer is expanded, the wafer to be demoulded is placed on the sucking disc 31 on the demould area 3 through the xz-axis moving component 8 again, the external air source adsorbs the side, provided with the blue film, of the wafer to be demoulded on the sucking disc 31 through the vacuum sucking hole 32, at the moment, the heating component 33 is started, under the action of the heating component 33, the wafer is heated, in the heating process, the temperature between the wafer and the blue film is increased, so that the viscosity between the wafer and the blue film is reduced, at the moment, the blue film is more convenient to be torn off from the wafer, the xz-axis moving component 8 drives the wafer to move, the blue film is sucked by the vacuum suction hole 32 at this time, thereby being more convenient.
The one side that the sucking disc 31 placed the wafer of treating the drawing of patterns is provided with a plurality of bosss 9, boss 9 evenly sets up on the one side that the wafer was placed to sucking disc 31, when the wafer was placed on sucking disc 31 to treat the drawing of patterns, boss 9 on sucking disc 31 and the blue membrane contact on the wafer this moment, leave space 5 between blue membrane and the sucking disc 31, when external air source passed through vacuum suction hole 32 and held the blue membrane, this moment because leave little space 5 between vacuum suction hole 32 and the blue membrane, when the blue membrane was inhaled on vacuum suction hole 32, the blue membrane of boss 9 department remained and boss 9 contradict this moment, thereby pull down blue membrane part from the wafer piece, thereby make things convenient for follow-up to take off the blue membrane, it is more convenient to use.
The heating member 33 includes a ring-shaped heating plate 331, the suction cup 31 is located inside the heating plate 331, and a connecting rod 332 for supporting the heating plate 331 is disposed between the heating plate 331 and the base 1. The wafer to be demoulded is placed on the sucking disc 31, the blue film is sucked through the vacuum sucking hole 32, the heating plate 331 is started at the moment, the heating plate 331 starts to work so as to heat the wafer to be demoulded on the sucking disc 31, so that the viscosity between the wafer and the blue film is reduced, the wafer and the blue film can be conveniently separated from each other by driving the wafer and the blue film to be taken down from the wafer through the xz moving assembly in the follow-up process.
Leave the space 5 that conveniently inserts the outside air supply pipeline between sucking disc 31 and the base 1, thereby the space 5 between sucking disc 31 and the base 1 can hold the pipeline of outside air supply in sucking disc 31 bottom to carry out the evacuation in the vacuum suction hole 32, hold the wafer on sucking disc 31.
The collecting region 4 comprises a collecting box 41 arranged on the base 1, the top end of the collecting box 41 is open, a placing plate 42 is arranged in the collecting box 41, the placing plate 42 is abutted to the inner side wall of the collecting box 41, a compression spring 43 is arranged between the placing plate 42 and the bottom of the collecting box 41, one end of the compression spring 43 is abutted to the placing plate 42, and the other end of the compression spring is connected to the bottom of the collecting box 41. Thereby place the good wafer of decolourization membrane through collecting box 41, after the wafer takes off the blue membrane on sucking disc 31, thereby remove the subassembly 8 through the xz axle this moment and remove the good wafer of drawing of patterns to the board 42 of placing in collecting box 41 on, place the board 42 and go up gravity and increase this moment to make compression spring 43 receive the reduction of compression length, place the board 42 and remove to collecting box 41 bottom, conveniently collect and place next wafer.
The collecting box 41 is vertically provided with a sliding groove 6 on the inner side wall, the placing plate 42 is provided with a sliding block 7 on the side wall, the sliding block 7 is positioned in the sliding groove 6 and slides in the sliding groove 6 along the vertical direction, and in the moving process of the placing plate 42, the sliding block 7 slides in the sliding groove 6 at the moment, so that the placing plate 42 only moves along the vertical direction, and circumferential rotation cannot occur.
The xz-axis moving assembly 8 comprises an x-axis moving cylinder 81 erected on the base 1, a crystal expansion area 2, a demolding area 3 and a placing area are arranged along the x-axis direction, and a z-axis moving cylinder 83 is a rodless cylinder. The x-axis moving cylinder 81 is provided with a mounting seat 82, the x-axis moving cylinder 81 drives the mounting seat 82 to move along the x-axis direction, the mounting seat 82 is provided with a z-axis moving cylinder 83, the z-axis moving cylinder 83 is provided with a mounting plate 84, the z-axis moving cylinder 83 drives the mounting plate 84 to move along the z-axis direction, and the bottom of the mounting plate 84 is provided with a plurality of vacuum suction pens 85 for sucking wafers. In the process of demolding the wafer, at the moment, the mounting seat 82 slides on the x-axis moving cylinder 81, so that the z-axis moving cylinder 83 is controlled to move, when the z-axis moving cylinder 83 moves to the wafer, the z-axis moving cylinder 83 starts to work at the moment, the vacuum suction pen 85 is driven to move towards the wafer, the wafer is sucked through the vacuum suction pen 85, and the wafer is driven to move to demold the wafer.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (8)
1. A blue stripping apparatus, comprising:
the wafer expanding area (2) is used for expanding the wafers to be demoulded before demoulding;
the demolding area (3) comprises a sucking disc (31), a wafer to be demolded is placed on the sucking disc (31), a plurality of vacuum suction holes (32) are formed in the sucking disc (31), an external air source vacuumizes the vacuum suction holes (32) to adsorb one surface of a blue film of the wafer to be demolded on the sucking disc (31), and heating elements (33) used for heating the wafer to be demolded are arranged on the peripheral edge of the sucking disc (31);
the collecting region (4) is used for placing and collecting the wafer subjected to the blue film removal in the mold removing region (3);
an xz-axis moving assembly (8) is arranged among the wafer expanding area (2), the demolding area (3) and the collecting area (4), and the xz-axis moving assembly (8) is used for sequentially moving the wafer to be demolded to the wafer expanding area (2) and the demolding area (3) and moving the wafer after the blue film is removed to the collecting area (4).
2. The film removing device according to claim 1, wherein a plurality of bosses (9) are arranged on the side of the suction cup (31) where the wafer to be removed is placed, and the bosses (9) are uniformly arranged on the side of the suction cup (31) where the wafer is placed.
3. The decoherence film device according to claim 1, further comprising a base (1), wherein the crystal expansion region (2), the demolding region (3) and the collecting region (4) are all mounted on the base (1).
4. The apparatus for removing blue film according to claim 3, wherein said heating member (33) comprises a ring-shaped heating plate (331), said suction cup (31) is located inside said heating plate (331), and a connecting rod (332) for supporting said heating plate (331) is provided between said heating plate (331) and said base (1).
5. The blue stripping device according to claim 3, characterized in that a gap (5) is left between the suction cup (31) and the base (1) for conveniently connecting an external air source pipeline.
6. The membrane de-bluing device according to claim 3, characterized in that the collecting area (4) comprises a collecting box (41) disposed on the base (1), the collecting box (41) is disposed with an open top, a placing plate (42) is disposed in the collecting box (41), the placing plate (42) abuts against the inner side wall of the collecting box (41), a compression spring (43) is disposed between the placing plate (42) and the bottom of the collecting box (41), one end of the compression spring (43) abuts against the placing plate (42), and the other end is connected with the bottom of the collecting box (41).
7. The blue stripping device according to claim 6, characterized in that the collecting box (41) is vertically provided with a sliding groove (6) on the inner side wall, the placing plate (42) is provided with a sliding block (7) on the side wall, and the sliding block (7) is positioned in the sliding groove (6) and slides in the sliding groove (6) along the vertical direction.
8. The decoherence film device according to claim 3, wherein the xz-axis moving assembly (8) comprises an x-axis moving cylinder (81) erected on the base (1), the crystal expanding area (2), the demolding area (3) and the placing area are arranged along the x-axis direction, a mounting seat (82) is arranged on the x-axis moving cylinder (81), the x-axis moving cylinder (81) drives the mounting seat (82) to move along the x-axis direction, a z-axis moving cylinder (83) is arranged on the mounting seat (82), a mounting plate (84) is arranged on the z-axis moving cylinder (83), the z-axis moving cylinder (83) drives the mounting plate (84) to move along the z-axis direction, and a plurality of vacuum suction pens (85) for sucking the wafer are arranged at the bottom of the mounting plate (84).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120504162.4U CN214542140U (en) | 2021-03-09 | 2021-03-09 | Blue membrane removing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120504162.4U CN214542140U (en) | 2021-03-09 | 2021-03-09 | Blue membrane removing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214542140U true CN214542140U (en) | 2021-10-29 |
Family
ID=78261808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120504162.4U Active CN214542140U (en) | 2021-03-09 | 2021-03-09 | Blue membrane removing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214542140U (en) |
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2021
- 2021-03-09 CN CN202120504162.4U patent/CN214542140U/en active Active
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