CN113573566A - Four-arm chip mounter - Google Patents

Four-arm chip mounter Download PDF

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Publication number
CN113573566A
CN113573566A CN202110820612.5A CN202110820612A CN113573566A CN 113573566 A CN113573566 A CN 113573566A CN 202110820612 A CN202110820612 A CN 202110820612A CN 113573566 A CN113573566 A CN 113573566A
Authority
CN
China
Prior art keywords
axis guide
axis
chip mounter
guide rail
guide rails
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110820612.5A
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Chinese (zh)
Inventor
吴志达
程治国
邱仁贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Moje Intelligent Equipment Co ltd
Original Assignee
Guangdong Moje Intelligent Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Moje Intelligent Equipment Co ltd filed Critical Guangdong Moje Intelligent Equipment Co ltd
Priority to CN202110820612.5A priority Critical patent/CN113573566A/en
Publication of CN113573566A publication Critical patent/CN113573566A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/022Feeding of components with orientation of the elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention discloses a four-arm chip mounter, which comprises a rack, wherein a feeding device is arranged in the middle of the rack, Y-axis guide rails are respectively installed at the left end and the right end of the rack, X-axis guide rails are movably installed at the front end and the rear end of each Y-axis guide rail, chip mounting heads are movably installed on the inner sides of the X-axis guide rails, a flying station is installed on the rack below the X-axis guide rails, one end of the flying station extends outwards out of the rack, a binocular camera is installed on the rack on one side of the flying station, each chip mounting head comprises a chip rod, a Z-axis linear motor and an R-axis motor, the Z-axis linear motor drives the chip rod to move up and down along a Z axis, the R-axis motor drives the chip rod to horizontally rotate, and the chip components on the flying station are installed on a PCB in the feeding device through the movement of the X-axis direction, the Y-axis direction, the Z-axis direction and the R-axis direction. The chip mounting head of the chip mounter can move in four axes, has a flexible structure, and realizes quick and accurate chip mounting operation.

Description

Four-arm chip mounter
Technical Field
The invention relates to the technical field of PCB (printed circuit board) surface mounting processing, in particular to a four-arm surface mounting machine.
Background
The chip mounter is also called a mounter and a surface mounting system, and is configured behind a dispensing machine or a screen printer in a production line, and is equipment for accurately placing surface mounting components on a PCB (printed circuit board) pad by moving a mounting head, and the production line is divided into manual operation and full-automatic operation. The full four-arm chip mounter is equipment for realizing full-automatic component mounting at high speed and high precision, and is the most critical and complex equipment in the whole SMT (surface mount technology) production. Chip mounters are main devices in SMT production lines, have been developed from early low-speed mechanical chip mounters to high-speed optical centering chip mounters, and have been developed towards multifunctional and flexible connection modularization.
However, most of the existing chip mounters can only realize single-axis movement, are inflexible in structure and not high in chip mounting precision, cannot realize the automation of raw materials and PCB loading, and cause the production efficiency to be low, so that the technical scheme of the application is urgently needed to solve the problems.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a four-arm chip mounter which can realize the automation of feeding and mounting and can mount PCBs (printed circuit boards) with different sizes, so that the production efficiency is high.
The invention is realized in such a way, and provides a four-arm chip mounter which comprises a rack, wherein a feeding device is arranged in the middle of the rack, Y-axis guide rails are respectively installed at the left end and the right end of the rack, X-axis guide rails are movably installed at the front end and the rear end of each Y-axis guide rail, chip mounting heads are movably installed on the inner sides of the X-axis guide rails, a flying station is installed on the rack below the X-axis guide rails, one end of the flying station extends out of the rack, a binocular camera is installed on the rack on one side of the flying station, each chip mounting head comprises a chip rod, a Z-axis linear motor and an R-axis motor, the Z-axis linear motor drives the chip rod to move up and down along a Z axis, the R-axis motor drives the chip rod to rotate horizontally, and chip elements on the flying station are installed on a PCB (printed circuit board) in the feeding device through the movement of the X-axis direction, the Y-axis direction, the Z-axis direction and the R-axis direction.
Further, material feeding unit includes two sets of conveying guide rails, be equipped with the flat belt by the conveying motor driven in the conveying guide rail, splint mechanism, splint cylinder, backstop mechanism and inductor are installed to the conveying guide rail inboard, splint mechanism is used for pressing from both sides tightly the PCB board. The conveying guide rails are installed on the linear guide rails, the ball screws in the linear guide rails are driven by the width adjusting motors, and the interval between the two groups of conveying guide rails is adjusted by moving on the linear guide rails.
Furthermore, two limit sensors and a zero return sensor are arranged on the X-axis guide rail, the two limit sensors are respectively arranged at two ends of the X-axis guide rail, and the zero return sensor is arranged on the inner side close to one limit sensor.
Furthermore, a patch head on the X-axis guide rail is connected to a power supply through a mute tank chain, so that the patch head can keep stable power supply in the moving process.
Furthermore, a gigabit network interface is arranged on the binocular camera, and images shot by the binocular camera at high speed are transmitted to the host computer through the gigabit network interface for processing.
Furthermore, the left side and the right side of the rack are provided with trapezoidal bases, the middle parts of the bases are arranged in a hollow mode, and two sides of the bottom of each base are provided with supporting legs.
Furthermore, the bottom of the Y-axis guide rail is connected with the rack through a support column, and the top of the Y-axis guide rail is provided with a protective cover which is arranged in an inverted U shape.
Furthermore, a sliding block is installed at the bottom of one end of the X-axis guide rail and moves on the Y-axis guide rail.
Furthermore, the Y-axis guide rails are provided with two groups, each group of Y-axis guide rails is provided with two groups of X-axis guide rails, and a group of flight arrival stations is correspondingly arranged below the X-axis guide rails.
Furthermore, the feeder station comprises a feeder seat, a feeder clamping plate and a material belt cutter are arranged in the feeder seat, and a waste outlet is arranged at the bottom of the feeder seat.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that: the paster pole that sets up will fly to reach on the PCB board in the material feeding unit of the paster component of standing position through the removal of X axle direction, Y axle direction, Z axle direction and R axle direction, can realize pay-off and paste the automation of subsides and can paste the subsides to the PCB board of not unidimensional for production efficiency is high.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
fig. 1 is a schematic perspective view of a four-arm chip mounter according to an embodiment of the present invention.
Fig. 2 is a schematic top view of the four-arm chip mounter according to the embodiment shown in fig. 1.
Fig. 3 is an enlarged structural schematic view of a feeding device in the four-arm chip mounter according to the embodiment shown in fig. 1.
Fig. 4 is an enlarged structural diagram of an X-axis guide rail in the four-arm chip mounter according to the embodiment shown in fig. 1.
Fig. 5 is an enlarged structural schematic diagram of a pick-and-place head in the four-arm pick-and-place machine of the embodiment shown in fig. 1.
Fig. 6 is an enlarged structural diagram of a position of the boomerang station in the four-arm chip mounter according to the embodiment shown in fig. 1.
Fig. 7 is a schematic view of an enlarged structure of a binocular camera in the four-arm chip mounter according to the embodiment shown in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
As shown in fig. 1 to 7, the four-arm chip mounter according to the embodiment includes a frame 1, a feeding device 2 is disposed in the middle of the frame 1, Y-axis guide rails 3 are respectively mounted at the left and right ends of the frame 1, X-axis guide rails 4 are movably mounted at the front and rear ends of the Y-axis guide rails 3, chip mounting heads 5 are movably mounted on the inner sides of the X-axis guide rails 4, a flying station 6 is mounted on the frame 1 below the X-axis guide rails 4, and the flying station 6 is a component for automatically conveying chip mounting components. One end of the flight arrival station 6 extends out of the rack 1, a binocular camera 8 is installed on the rack 1 on one side of the flight arrival station 6, the binocular camera 8 shoots the patch element, and the type and the position of the patch element are identified after compensation through a host algorithm. The chip mounting head 5 comprises a chip mounting rod 51, a Z-axis linear motor 52 and an R-axis motor 53, wherein the Z-axis linear motor 52 drives the chip mounting rod 51 to move up and down along a Z axis, the R-axis motor 53 drives the chip mounting rod 51 to rotate horizontally, chip components flying to the station 6 are mounted on a PCB (printed circuit board) in the feeding device 2 by the chip mounting rod 5 through movement in the X axis direction, the Y axis direction, the Z axis direction and the R axis direction, and specifically, a suction nozzle is arranged at the bottom of the chip mounting rod 5 and used for sucking the chip components.
As shown in fig. 3, in some embodiments, the feeding device 2 includes two sets of conveying rails 21, a flat belt 211 driven by a conveying motor 210 is disposed in each conveying rail 21, a clamping mechanism 22, a clamping cylinder 23, a stopping mechanism 24 and a sensor 25 are disposed inside each conveying rail 21, the clamping mechanism 22 is used for clamping the PCB, the conveying rails 21 are disposed on linear rails 26, a ball screw 27 in each linear rail 26 is driven by a widening motor 28, the interval between the two sets of conveying rails 21 is adjusted by moving on the linear rails 26, when in use, the PCB is moved and conveyed on the flat belt 211 of the conveying rails 21, the stopping mechanism 24 serves as a stop to prevent the PCB from sliding off the conveying rails 21, the sensor 25 is used for detecting the position of the PCB, the positions between the two sets of conveying rails 21 are close, at this time, the clamping cylinder 23 can clamp the PCB, thereby facilitating the patch attaching operation.
As shown in fig. 4, in some embodiments, two limit sensors 41 and one return-to-zero sensor 42 are disposed on the X-axis guide rail 4, the two limit sensors 41 are disposed at two ends of the X-axis guide rail 4, the return-to-zero sensor 42 is disposed at an inner side close to one of the limit sensors 41, and the limit sensors 41 and the return-to-zero sensor 42 are used for detecting a position of the placement head 5 to ensure an accuracy of the placement process.
As shown in fig. 4, in some embodiments, the placement head 5 on the X-axis guide rail 4 is connected to a power supply via a mute tank chain 43 so that the placement head 5 can keep the power supply stable during movement.
As shown in fig. 7, in some embodiments, a gigabit network interface 81 is provided on the binocular camera 8, and the images captured by the binocular camera 8 at high speed are transmitted to the host for processing through the gigabit network interface 81, and the gigabit network interface 81 is adopted to enable the data transmission speed to be fast.
In some embodiments, trapezoidal bases 11 are arranged on the left side and the right side of the rack 1, the middle of each base 11 is arranged in a hollow manner, and supporting legs 12 are arranged on the two sides of the bottom of each base 11 to ensure the stability of the bottom of the rack 1.
In some embodiments, the bottom of the Y-axis guide rail 3 is connected to the frame 1 through a pillar 31, the top of the Y-axis guide rail 3 is provided with a protective cover 32 in an inverted U-shape, and the protective cover 32 has a protective effect on the X-axis guide rail 4 installed on the Y-axis guide rail 3.
In some embodiments, a slider 44 is installed at the bottom of one end of the X-axis guide rail 4, and the slider 44 moves on the Y-axis guide rail 3, so that the X-axis guide rail 4 can move smoothly on the Y-axis guide rail 3.
In some embodiments, two sets of Y-axis guide rails 3 are provided, two sets of X-axis guide rails 4 are installed on each set of Y-axis guide rails 3, one set of femto station 6 is correspondingly provided below each set of X-axis guide rails 4, and four sets of femto station 6 and four sets of chip mounter heads 5 are provided together, so that the working efficiency of the whole chip mounter is improved, and the above components are uniformly distributed on the rack 1, and the compactness of the whole structure can be ensured at the same time.
In some embodiments, the feeder station 6 includes a feeder seat 61, a feeder clamp plate 62 and a tape cutter 63 are disposed in the feeder seat 61, a waste outlet 64 is installed at the bottom of the feeder seat 61, and the tape cutter 63 can cut off patch elements connected together in the feeder station 6 at equal intervals, so as to facilitate the picking up of the patch head 5.
The foregoing is a preferred embodiment of the present invention, and it should be noted that it would be apparent to those skilled in the art that various modifications and enhancements can be made without departing from the principles of the invention, and such modifications and enhancements are also considered to be within the scope of the invention.

Claims (10)

1. The four-arm chip mounter is characterized by comprising a frame (1), wherein a feeding device (2) is arranged in the middle of the frame (1), Y-axis guide rails (3) are respectively installed at the left end and the right end of the frame (1), X-axis guide rails (4) are movably installed at the front end and the rear end of each Y-axis guide rail (3), chip mounting heads (5) are movably installed on the inner sides of the X-axis guide rails (4), a flying station (6) is installed on the frame (1) below the X-axis guide rails (4), one end of the flying station (6) extends out of the frame (1), a binocular camera (8) is installed on the frame (1) on one side of the flying station (6), each chip mounting head (5) comprises a chip mounting rod (51), a Z-axis linear motor (52) for driving the chip mounting rod (51) to move up and down along the Z axis, and an R-axis motor (53) for driving the chip mounting rod (51) to rotate horizontally, and the patch element on the flight arrival station (6) is arranged on the PCB in the feeding device (2) by the patch rod (5) through the movement in the X-axis direction, the Y-axis direction, the Z-axis direction and the R-axis direction.
2. The four-arm chip mounter according to claim 1, wherein the feeding device (2) comprises two sets of conveying rails (21), a flat belt (211) driven by a conveying motor (210) is arranged in each conveying rail (21), a clamping mechanism (22), a clamping cylinder (23), a stopping mechanism (24) and a sensor (25) are mounted on the inner side of each conveying rail (21), the clamping mechanism (22) is used for clamping a PCB, the conveying rails (21) are mounted on linear rails (26), ball screws (27) in the linear rails (26) are driven by a widening motor (28), and the interval between the two sets of conveying rails (21) is adjusted by moving on the linear rails (26).
3. The four-arm chip mounter according to claim 1, wherein two limit sensors (41) and one return-to-zero sensor (42) are provided on the X-axis guide rail (4), the two limit sensors (41) are respectively provided at two ends of the X-axis guide rail (4), and the return-to-zero sensor (42) is provided inside the X-axis guide rail near one of the limit sensors (41).
4. A four-arm chip mounter according to claim 3, wherein the chip mounter head (5) on said X-axis guide rail (4) is connected to a power supply through a mute tank chain (43), so that the chip mounter head (5) can keep the power supply stable during the movement.
5. The four-arm chip mounter according to claim 1, wherein a gigabit network interface (81) is provided on the binocular camera (8), and images shot at high speed by the binocular camera (8) are transmitted to a host computer for processing through the gigabit network interface (81).
6. The four-arm chip mounter according to claim 1, wherein trapezoidal bases (11) are arranged on the left side and the right side of the mounter (1), the middle of each base (11) is hollow, and supporting legs (12) are arranged on two sides of the bottom of each base (11).
7. The four-arm chip mounter according to claim 1, wherein the bottom of the Y-axis guide rail (3) is connected with the frame (1) through a pillar (31), and a protective cover (32) in an inverted U-shaped arrangement is mounted on the top of the Y-axis guide rail (3).
8. The four-arm chip mounter according to claim 1, wherein a slider ((44)) is mounted at the bottom of one end of the X-axis guide rail (4), and the slider (44) moves on the Y-axis guide rail (3).
9. The four-arm chip mounter according to claim 1, wherein there are two sets of Y-axis guide rails (3), two sets of X-axis guide rails (4) are mounted on each set of Y-axis guide rails (3), and a set of landing stations (6) is correspondingly disposed below each set of X-axis guide rails (4).
10. The four-arm chip mounter according to claim 1, wherein the feeder station (6) comprises a feeder base (61), a feeder clamp plate (62) and a material belt cutter (63) are arranged in the feeder base (61), and a waste outlet (64) is mounted at the bottom of the feeder base (61).
CN202110820612.5A 2021-07-20 2021-07-20 Four-arm chip mounter Pending CN113573566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110820612.5A CN113573566A (en) 2021-07-20 2021-07-20 Four-arm chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110820612.5A CN113573566A (en) 2021-07-20 2021-07-20 Four-arm chip mounter

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CN113573566A true CN113573566A (en) 2021-10-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117054442A (en) * 2023-10-11 2023-11-14 苏州英诺威视半导体设备有限公司 Side defect detection equipment for chip

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102905477A (en) * 2012-08-24 2013-01-30 广东工业大学 Cantilever type efficient chip mounter
CN205648219U (en) * 2016-05-26 2016-10-12 东莞市正向智能科技有限公司 Four module LED crowds paste machine with adjustable pay -off track
CN106304677A (en) * 2015-05-14 2017-01-04 广东木几智能装备有限公司 Both arms bull chip mounter
CN106714470A (en) * 2017-02-27 2017-05-24 深圳市易通自动化设备有限公司 Chip mounter with independently working X axis and Y axis
CN106973518A (en) * 2017-02-27 2017-07-21 深圳市易通自动化设备有限公司 A kind of efficient automatic chip mounting equipment
CN107666825A (en) * 2016-07-27 2018-02-06 深圳市祈飞科技有限公司 Automatically slotting patch machine

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102905477A (en) * 2012-08-24 2013-01-30 广东工业大学 Cantilever type efficient chip mounter
CN106304677A (en) * 2015-05-14 2017-01-04 广东木几智能装备有限公司 Both arms bull chip mounter
CN205648219U (en) * 2016-05-26 2016-10-12 东莞市正向智能科技有限公司 Four module LED crowds paste machine with adjustable pay -off track
CN107666825A (en) * 2016-07-27 2018-02-06 深圳市祈飞科技有限公司 Automatically slotting patch machine
CN106714470A (en) * 2017-02-27 2017-05-24 深圳市易通自动化设备有限公司 Chip mounter with independently working X axis and Y axis
CN106973518A (en) * 2017-02-27 2017-07-21 深圳市易通自动化设备有限公司 A kind of efficient automatic chip mounting equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117054442A (en) * 2023-10-11 2023-11-14 苏州英诺威视半导体设备有限公司 Side defect detection equipment for chip
CN117054442B (en) * 2023-10-11 2023-12-22 苏州英诺威视半导体设备有限公司 Side defect detection equipment for chip

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Application publication date: 20211029