CN112235937A - Press-fit connection structure between circuit boards and press-fit connection method thereof - Google Patents
Press-fit connection structure between circuit boards and press-fit connection method thereof Download PDFInfo
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- CN112235937A CN112235937A CN202010960240.1A CN202010960240A CN112235937A CN 112235937 A CN112235937 A CN 112235937A CN 202010960240 A CN202010960240 A CN 202010960240A CN 112235937 A CN112235937 A CN 112235937A
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- layer
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- outer sealing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses a press-fit connection structure between circuit boards, which comprises an outer sealing part, an inner core part and a base layer part, wherein the outer sealing part and the inner core part are in press-fit connection through UV curing adhesive layers, the inner core part and the base layer part are in press-fit connection through UV curing adhesive layers, the outer sealing part comprises a transparent protection layer and a silicon-aluminum foil layer, the silicon-aluminum foil layer is connected to the bottom side surface of the transparent protection layer, the inner core part comprises a water-soluble organic thin film layer, a flexible circuit board and a flexible layer, the flexible circuit board is connected to the bottom side surface of the water-soluble organic thin film layer, the flexible layer is connected to the bottom side. The invention ensures that the silicon-aluminum foil layer and the steel plate are uniformly heated, the pressing heating speed is stable, the pressure distribution is stable, the glue filling is uniform and smooth, the glue overflow phenomenon is prevented, the yield of the pressed product is high, the pressing is fast, the quality monitoring of the production process is convenient, the production parameters are adjusted in time, and the quality yield is effectively improved.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a press-fit connection structure and a press-fit connection method between circuit boards.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, and the FPC circuit board (the FPC circuit board is also called as a flexible circuit board, namely a flexible printed circuit board which is made of polyimide or polyester film as a base material and has the characteristics of high reliability and excellent flexibility, high wiring density, light weight, thin thickness and good bending property) and the flexible-rigid combination board FPC and PCB are born and developed, so that a new product of the flexible-rigid combination board is promoted. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
The circuit board is pressed by heating and melting the prepreg under high temperature and high pressure, and the prepreg flows and is converted into a solidified sheet. Therefore, one or more inner-layer etched back plates subjected to blackening or browning treatment are bonded with copper foils to form a multi-layer plate, but the existing pressing structure needs to stack and typeset the multi-layer plate one by one and then press the multi-layer plate, so that the position deviation is easy to occur in the pressing process, and the layering phenomenon caused by uneven pressure is possibly caused.
Disclosure of Invention
The invention aims to overcome the defects that in the prior art, a lamination structure needs to stack and typeset a plurality of layers of plates and then performs lamination, the position deviation is easy to occur in the lamination process, and the lamination phenomenon caused by uneven pressure is possibly caused, so that the lamination connection structure and the lamination connection method between circuit boards are provided.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a pressfitting connection structure between circuit board, includes outer sealing, inner core portion and basic unit portion, outer sealing all carries out the pressfitting through UV solidification bond line with inner core portion, inner core portion and basic unit portion and is connected, outer sealing includes transparent inoxidizing coating and silicon aluminium foil layer, silicon aluminium foil layer is connected in transparent inoxidizing coating base side, inner core portion includes water-soluble organic thin layer, flexible line way board and flexible layer, flexible line way board connects in water-soluble organic thin layer base side, the flexible layer is connected in flexible line way board base side, basic unit includes green silica gel layer and steel sheet, green silica gel layer connection is to the side on the steel sheet.
Preferably, the thickness of the green silica gel layer is 1.5-2.5 mm, and the green silica gel layer is made of glass fiber cloth and silicon rubber mixed materials.
Preferably, the thickness of the water-soluble organic thin film layer is 10-18 μm, and the water-soluble organic thin film layer is a polyolefin wax thin film.
Preferably, the thickness of the transparent protective layer is 1-3mm, and the transparent protective layer is of a double-layer or single-layer structure.
Preferably, the thickness of the silicon aluminum foil layer is 2-5 mm.
A press-fit connection method between circuit boards comprises the following steps:
s1, checking whether the machine table is clean, checking whether the silicon aluminum foil layer and the steel plate are deformed or not, whether the outer sealing part, the inner core part and the base layer part are damaged or folded or not, checking whether the raw materials are wrong or not, and then carrying out production;
s2: laminating and typesetting, wherein firstly, dust impurities on the surfaces of the outer sealing part, the inner core part and the base layer part are removed by using dust-sticking cloth or dust-sticking paper, then the outer sealing part, the inner core part and the base layer part are sequentially laminated, and a worker needs to wear gloves or finger sleeves during laminating operation;
s3: positioning, namely rivet positioning and welding spot positioning, sleeving an outer sealing part, an inner core part and a base layer part of a pre-drilled positioning hole on a template provided with a rivet according to a typesetting sequence, punching the rivet by using a nail punching device to position the rivet, sleeving the outer sealing part, the inner core part and the base layer part of the pre-drilled positioning hole on the template provided with the positioning pin according to the typesetting sequence, heating a plurality of fixing points, melting and solidifying and positioning by using a prepreg through heating, and then performing appearance finishing;
s4: and (3) pressurizing, namely positioning the outer sealing part, the inner core part and the base layer part on a pressing table of a pressing machine, starting a power supply of the pressing equipment, pressurizing to 0.1-0.4MPA, and controlling the pressing temperature to be between 160 and 170 ℃ for 20-30 seconds, so that the UV curing adhesive layers between the outer sealing part and the inner core part and between the inner core part and the base layer part are completely filled without glue overflow.
Preferably, in the S4 process, the outer sealing portion, the inner core portion, and the base portion are located by using a positioning hole pattern punched in advance in cooperation with the guide pins, 4 slot holes are punched on four sides of the board, two slot holes are formed in a group, and the two slot holes are respectively located in the X/Y direction, wherein one group is designed asymmetrically, so as to start anti-reflection.
Preferably, in the S2 process, the raw materials with the same size need to be selected for lamination and typesetting.
Preferably, the pressing machine in the S4 process is a cabin pressing machine, and the heating rate in the pressing process is kept stable, and the time for reaching the highest temperature is not less than 10 seconds.
Compared with the prior art, the invention has the beneficial effects that:
1. the multilayer plate is divided into an outer sealing part, an inner core part and a base layer part in advance, and positioning holes of each part are positioned in advance, so that the problem of layer deviation in the pressing process is avoided.
2. The silicon-aluminum foil layer and the steel plate are uniformly heated, the pressing heating speed is stable, the pressure distribution is stable, the glue filling is uniform and smooth, the glue overflow phenomenon is prevented, the yield of the pressed product is high, the pressing is fast, the quality monitoring of the production process is convenient, the production parameters are adjusted in time, and the quality yield is effectively improved.
Drawings
Fig. 1 is a schematic structural diagram of a press-fit connection structure between circuit boards according to the present invention;
fig. 2 is a flow chart of a method for press-fit connection between circuit boards according to the present invention;
fig. 3 is a flowchart illustrating a process of a method S3 for press-fit connection between circuit boards according to the present invention.
In the figure: 1-outer sealing part, 101-transparent protective layer, 102-silicon aluminum foil layer, 2-inner core part, 201-water-soluble organic film layer, 202-flexible circuit board, 203-flexible layer, 3-base layer part, 301-green silica gel layer, 302-steel plate and 4-UV curing adhesive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example one
Referring to fig. 1-3, a press-fit connection structure between circuit boards, comprising an outer seal portion 1, an inner core portion 2 and a base portion 3, wherein the outer seal portion 1 and the inner core portion 2, the inner core portion 2 and the base portion 3 are all press-fit connected by a UV curable adhesive layer 4, the outer seal portion 1 comprises a transparent protective layer 101 and a silicon aluminum foil layer 102, the thickness of the transparent protective layer 101 is 1mm, the transparent protective layer 101 is a double-layer or single-layer structure, the thickness of the silicon aluminum foil layer 102 is 2mm, the silicon aluminum foil layer 102 is connected to the bottom side surface of the transparent protective layer 101, the inner core portion 2 comprises a water-soluble organic thin film layer 201, a flexible circuit board 202 and a flexible layer 203, the flexible circuit board 202 is connected to the bottom side surface of the water-soluble organic thin film layer 201, the thickness of the water-soluble organic thin film layer 201 is 10 μm, the water-soluble organic thin film, the thickness of the green silica gel layer 301 is 1.5mm, the green silica gel layer 301 is made of glass fiber cloth and silicon rubber mixed materials, and the green silica gel layer 301 is connected to the upper side face of the steel plate 302.
The pressing connection method of the pressing structure between the circuit boards comprises the following steps:
s1, checking whether the machine table is clean, checking whether the silicon aluminum foil layer 102 and the steel plate 302 have deformation, whether the outer sealing part 1, the inner core part 2 and the base layer part 3 have damage or wrinkles, checking whether the error is caused, and checking that the production can be carried out after the raw materials are good;
s2: firstly, removing dust impurities on the surfaces of the outer sealing part 1, the inner core part 2 and the base layer part 3 by using dust-sticking cloth or dust-sticking paper, then sequentially laminating the outer sealing part 1, the inner core part 2 and the base layer part 3, wherein a worker needs to wear gloves or finger sleeves during laminating operation, and raw materials with the same size are selected for laminating and typesetting in the S2 process;
s3: positioning, wherein the positioning process comprises two parts, namely rivet positioning and welding spot positioning, an outer sealing part 1, an inner core part 2 and a base layer part 3 which are pre-drilled with positioning holes are sleeved on a template provided with a rivet according to the typesetting sequence, the rivet is punched by a nail punch to be positioned, the outer sealing part 1, the inner core part 2 and the base layer part 3 which are pre-drilled with positioning holes are sleeved on the template provided with the positioning pins according to the typesetting sequence, then a plurality of fixing points are heated, a prepreg is heated, melted, solidified and positioned, and then appearance finishing processing is carried out;
s4: pressurizing, positioning the outer sealing part 1, the inner core part 2 and the base layer part 3 after a pressing table of a pressing machine, punching 4 slot holes on four sides of a board, wherein the two slot holes are in a group and are respectively positioned in an X/Y direction, the group is in an asymmetrical design in the S4 process, starting a power supply of the pressing equipment, pressurizing to 0.1MPA, controlling the pressing temperature to be 160 and lasting for 20 seconds, so that UV curing adhesive layers 4 between the outer sealing part 1 and the inner core part 2 and between the inner core part 2 and the base layer part 3 are completely filled and have no glue overflow phenomenon, the pressing machine adopts a cabin pressing type pressing machine, the heating rate of the pressing process is kept stable, and the time of 10 seconds is required after the highest temperature is reached.
In the invention, the multilayer plate is divided into an outer sealing part 1, an inner core part 2 and a base layer part 3 in advance, and a positioning hole which is punched in advance is used for positioning each part, so that the problem of layer deviation in the pressing process is avoided, the silicon-aluminum foil layer and the steel plate are uniformly heated, the pressing temperature rise speed is stable, the pressure distribution is stable, the glue filling is uniform and smooth, the glue overflow phenomenon is prevented, the yield of the pressed product is high, the quick pressing is convenient for quality monitoring in the production process, the production parameters are adjusted in time, and the quality qualification rate is effectively improved.
Example two
A press-fit connection structure between circuit boards comprises an outer sealing part 1, an inner core part 2 and a base layer part 3, wherein the outer sealing part 1, the inner core part 2 and the base layer part 3 are in press-fit connection through a UV curing adhesive layer 4, the outer sealing part 1 comprises a transparent protective layer 101 and a silicon aluminum foil layer 102, the thickness of the transparent protective layer 101 is 3mm, the transparent protective layer 101 is of a double-layer or single-layer structure, the thickness of the silicon aluminum foil layer 102 is 5mm, the silicon aluminum foil layer 102 is connected to the bottom side surface of the transparent protective layer 101, the inner core part 2 comprises a water-soluble organic film layer 201, a flexible circuit board 202 and a flexible layer 203, the flexible circuit board 202 is connected to the bottom side surface of the water-soluble organic film layer 201, the thickness of the water-soluble organic film layer 201 is 18 mu m, the water-soluble organic film layer 201 is a polyolefin wax film, the flexible layer, the thickness of the green silica gel layer 301 is 2.5mm, the green silica gel layer 301 is made of glass fiber cloth and silicon rubber mixed materials, and the green silica gel layer 301 is connected to the upper side face of the steel plate 302.
The pressing connection method of the pressing structure between the circuit boards comprises the following steps:
s1, checking whether the machine table is clean, checking whether the silicon aluminum foil layer 102 and the steel plate 302 have deformation, whether the outer sealing part 1, the inner core part 2 and the base layer part 3 have damage or wrinkles, checking whether the error is caused, and checking that the production can be carried out after the raw materials are good;
s2: firstly, removing dust impurities on the surfaces of the outer sealing part 1, the inner core part 2 and the base layer part 3 by using dust-sticking cloth or dust-sticking paper, then sequentially laminating the outer sealing part 1, the inner core part 2 and the base layer part 3, wherein a worker needs to wear gloves or finger sleeves during laminating operation, and raw materials with the same size are selected for laminating and typesetting in the S2 process;
s3: positioning, wherein the positioning process comprises two parts, namely rivet positioning and welding spot positioning, an outer sealing part 1, an inner core part 2 and a base layer part 3 which are pre-drilled with positioning holes are sleeved on a template provided with a rivet according to the typesetting sequence, the rivet is punched by a nail punch to be positioned, the outer sealing part 1, the inner core part 2 and the base layer part 3 which are pre-drilled with positioning holes are sleeved on the template provided with the positioning pins according to the typesetting sequence, then a plurality of fixing points are heated, a prepreg is heated, melted, solidified and positioned, and then appearance finishing processing is carried out;
s4: pressurizing, positioning the outer sealing part 1, the inner core part 2 and the base layer part 3 after a pressing table of a pressing machine, punching 4 slot holes on four sides of a board, wherein the two slot holes are in a group and are respectively positioned in an X/Y direction, the group is in an asymmetrical design in the S4 process, starting a pressing device power supply to pressurize to 0.4MPA, controlling the pressing temperature to be heated to 170 ℃ for 30 seconds, so that UV curing adhesive layers 4 between the outer sealing part 1 and the inner core part 2 and between the inner core part 2 and the base layer part 3 are completely filled and have no glue overflow phenomenon, selecting a cabin pressing type pressing machine for the pressing machine, keeping the temperature rising rate stable in the pressing process, and keeping 15 seconds after the highest temperature is reached.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. A press-fit connection structure between circuit boards comprises an outer sealing part (1), an inner core part (2) and a base layer part (3), and is characterized in that the outer sealing part (1), the inner core part (2) and the base layer part (3) are in press-fit connection through a UV curing adhesive layer (4), the outer sealing part (1) comprises a transparent protective layer (101) and a silicon-aluminum foil layer (102), the silicon-aluminum foil layer (102) is connected to the bottom side surface of the transparent protective layer (101), the inner core part (2) comprises a water-soluble organic film layer (201), a flexible circuit board (202) and a flexible layer (203), the flexible circuit board (202) is connected to the bottom side surface of the water-soluble organic film layer (201), the flexible layer (203) is connected to the bottom side surface of the flexible circuit board (202), the base layer part (3) comprises a green silica gel layer (301) and a steel, the green silica gel layer (301) is connected to the upper side face of the steel plate (302).
2. The pressing connection structure of circuit boards as claimed in claim 1, wherein the thickness of the green silica gel layer (301) is 1.5-2.5 mm, and the green silica gel layer (301) is made of a mixture of glass fiber cloth and silicon rubber.
3. The structure of claim 1, wherein the thickness of the water-soluble organic thin film layer (201) is 10-18 μm, and the water-soluble organic thin film layer (201) is a polyolefin wax film.
4. The structure of claim 1, wherein the thickness of the transparent protective layer (101) is 1-3mm, and the transparent protective layer (101) has a double-layer or single-layer structure.
5. The structure of claim 1, wherein the thickness of the silicon aluminum foil layer (102) is 2-5 mm.
6. A method for press-fit connection between circuit boards is a press-fit connection method of a press-fit connection structure between circuit boards in any one of claims 1 to 4, and is characterized by comprising the following steps:
s1, checking whether the machine table is clean, checking whether the silicon aluminum foil layer (102) and the steel plate (302) have deformation, whether the outer sealing part (1), the inner core part (2) and the base layer part (3) have damage or wrinkles, checking whether the raw materials are wrong and then checking whether the raw materials are good;
s2: the lamination typesetting is that firstly, dust and sundries on the surfaces of the outer sealing part (1), the inner core part (2) and the base layer part (3) are removed by dust-sticking cloth or dust-sticking paper, then the outer sealing part (1), the inner core part (2) and the base layer part (3) are laminated in sequence, and a worker needs to wear gloves or finger sleeves during lamination operation;
s3: positioning, wherein the positioning process comprises two parts, namely rivet positioning and welding spot positioning, an outer sealing part (1), an inner core part (2) and a base layer part (3) of which positioning holes are pre-drilled are sleeved on a template provided with willow nails according to the typesetting sequence, the willow nails are punched by a nail punch to be positioned, the outer sealing part (1), the inner core part (2) and the base layer part (3) of which positioning holes are pre-drilled are sleeved on the template provided with positioning pins according to the typesetting sequence, a plurality of fixing points are heated, a prepreg is heated, melted, solidified and positioned, and then appearance finishing processing is carried out;
s4: and (2) pressurizing, after the outer sealing part (1), the inner core part (2) and the base layer part (3) are positioned on a pressing table of a pressing machine, starting a power supply of the pressing equipment, pressurizing to 0.1-0.4MPA, and controlling the pressing temperature to be between 160 ℃ and 170 ℃ for 20-30 seconds, so that the UV curing adhesive layer (4) between the outer sealing part (1) and the inner core part (2) and between the inner core part (2) and the base layer part (3) is completely filled without glue overflow phenomenon.
7. The method according to claim 6, wherein in the step S4, the outer sealing part (1), the inner core part (2) and the substrate part (3) are positioned by using a pre-punched positioning hole pattern and guiding pins, and 4 slot holes are punched on the four sides of the board, two of the slot holes are in a group, and the slot holes are respectively positioned in the X/Y direction, wherein one group is designed asymmetrically in order to start anti-reaction.
8. The method as claimed in claim 6, wherein in step S2, raw materials with the same size are selected for lamination and typesetting.
9. The structure and method according to claim 1, wherein the stitching machine used in S4 is a cabin stitching machine, and the heating rate of the stitching process is kept constant, and the duration of heating to the maximum temperature is not less than 10 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010960240.1A CN112235937A (en) | 2020-09-14 | 2020-09-14 | Press-fit connection structure between circuit boards and press-fit connection method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010960240.1A CN112235937A (en) | 2020-09-14 | 2020-09-14 | Press-fit connection structure between circuit boards and press-fit connection method thereof |
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| Publication Number | Publication Date |
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| CN112235937A true CN112235937A (en) | 2021-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010960240.1A Withdrawn CN112235937A (en) | 2020-09-14 | 2020-09-14 | Press-fit connection structure between circuit boards and press-fit connection method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI788075B (en) * | 2021-10-29 | 2022-12-21 | 大陸商鵬鼎控股（深圳）股份有限公司 | Method of manufacturing flexible wiring substrate group |
-
2020
- 2020-09-14 CN CN202010960240.1A patent/CN112235937A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI788075B (en) * | 2021-10-29 | 2022-12-21 | 大陸商鵬鼎控股（深圳）股份有限公司 | Method of manufacturing flexible wiring substrate group |
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Application publication date: 20210115 |
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