CN113539902A - Packaging structure of semiconductor chip - Google Patents
Packaging structure of semiconductor chip Download PDFInfo
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- CN113539902A CN113539902A CN202110804971.1A CN202110804971A CN113539902A CN 113539902 A CN113539902 A CN 113539902A CN 202110804971 A CN202110804971 A CN 202110804971A CN 113539902 A CN113539902 A CN 113539902A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000009792 diffusion process Methods 0.000 claims abstract description 111
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 98
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 98
- 239000010703 silicon Substances 0.000 claims abstract description 98
- 235000012431 wafers Nutrition 0.000 claims abstract description 79
- 238000005520 cutting process Methods 0.000 claims abstract description 49
- 238000012546 transfer Methods 0.000 claims abstract description 33
- 238000009434 installation Methods 0.000 claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims description 50
- 238000003466 welding Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 238000007599 discharging Methods 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 12
- 241000252254 Catostomidae Species 0.000 claims description 8
- 230000032258 transport Effects 0.000 claims description 5
- 230000000007 visual effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 238000005457 optimization Methods 0.000 description 7
- 238000012544 monitoring process Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000005267 amalgamation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012258 culturing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
The invention relates to a semiconductor chip related device, in particular to a semiconductor chip packaging structure, in the chip processing industry, a plurality of chips are cultured independently and assembled at intervals through perforated silicon sheets, so as to realize the function under the condition of smaller volume and area, but the processing difficulty is high, the rejection rate is higher, a transfer diffusion device is installed and fixed on an installation main body, an assembly device is installed and fixed on the installation main body, the packaging structure is installed and fixed on the installation main body, the installation main body is provided with other devices and circuit devices on the cultured and generated wafers, the transfer diffusion device is used for transferring and cutting the whole silicon wafer and mutually separating the single silicon wafers after cutting to generate more circuit lifting space utilization rates, the assembly device is used for realizing the split assembly of the packaging structure to form the packaging structure to realize 3D packaging, the function of replacing a single damaged wafer, reducing the production cost and improving the heat dissipation efficiency is completed.
Description
Technical Field
The invention relates to semiconductor chip related equipment, in particular to a packaging structure of a semiconductor chip.
Background
With the progress of the development era of science and technology, more and more high-end equipment is introduced into our life and work, in the chip processing industry, the size of a chip is required to be compressed as much as possible, the normal use or certain promotion of the performance and the function of the chip is ensured on the premise of size reduction, for the current 3D packaging technology which is not completely mature, the function of the chip is completed under the condition of smaller volume and area by carrying out interval assembly on a plurality of chips after independent culture and through perforated silicon sheets, but the processing difficulty is large, and the rejection rate is higher.
The comparison document (china invention CN202010418945.0 shangli shandong) discloses a manufacturing method of a chip packaging structure and the chip packaging structure, which has better sealing performance, but high space utilization rate and rejection rate, the packaged wafer is plane packaging and has poorer capability of adapting to portable equipment, and the comparison document (china invention CN201810910116.7 xianwei) discloses a multi-chip packaging structure of an integrated chip packaging structure and a manufacturing method thereof, which have the defects of difficult disassembly after stacking and poor heat dissipation capability, thus inventing a semiconductor chip packaging structure.
Disclosure of Invention
The invention relates to a semiconductor chip related device, in particular to a semiconductor chip packaging structure, wherein other devices are installed through an installation main body, circuit devices on a generated wafer are cultured, a transfer diffusion device is used for transferring and cutting the whole silicon wafer and mutually separating single silicon wafers after cutting to generate more circuits, so that the space utilization rate is improved, an assembling device is used for realizing the split assembly of the packaging structure to form the packaging structure to realize 3D packaging, the function of replacing a single damaged wafer is completed, the production cost is reduced, and the heat dissipation efficiency is improved.
For solving above-mentioned technical problem, a semiconductor chip's packaging structure, including the installation main part, transport the diffusion equipment, assembly quality, packaging structure, through the installation main part other device of installation and cultivate the circuit device on the formation wafer, transport the diffusion equipment and provide and transport whole silicon wafer, the cutting and separate each other between the monolithic silicon wafer that will after the cutting and promote space utilization in order to generate more lines, assembly quality realizes that packaging structure's amalgamation equipment becomes packaging structure and realizes the 3D encapsulation, accomplish and to replace single damaged wafer, reduce manufacturing cost and improve the function of radiating efficiency, its characterized in that: the transfer diffusion device is fixedly installed on the installation main body, the assembling device is fixedly installed on the installation main body, and the packaging structure is fixedly installed on the installation main body.
As a further optimization of the technical solution, the mounting main body of the semiconductor chip packaging structure of the present invention includes a housing, a transmission case, and a wiring module, wherein the housing is mounted and fixed on the transmission case, and the wiring module is mounted and fixed on the transmission case.
As a further optimization of the technical scheme, the transferring and diffusing device of the packaging structure of the semiconductor chip comprises a transferring linear motor, a cutting linear motor, a steering spline shaft, a steering sliding gear, a rotating shaft, a cutting mounting bracket, a laser cutter, a whole silicon wafer, a diffusing sucker support plate, a movable hinge plate, a vent pipe upright post, a diffusing shaft, a double-head screw rod, a diffusing bevel gear I, a diffusing bevel gear II and a screw rod rotating bracket, wherein the transferring linear motor is fixedly installed on a transmission case, the cutting linear motor is fixedly installed on a shell, the steering spline shaft is rotatably installed on the transmission case through a bearing, the steering sliding gear is slidably installed on the steering spline shaft, the rotating shaft is rotatably installed on the transmission case through a bearing, the cutting mounting bracket is fixedly installed on the cutting linear motor, the laser cutter is fixedly installed on the cutting mounting bracket, the diffusion shaft is rotatably installed at the center of the rotating shaft through a bearing, the lead screw rotating support is rotatably installed on the diffusion shaft through a bearing, the double-headed lead screw is rotatably installed on the lead screw rotating support through a bearing, the double-headed lead screw is rotatably installed on the rotating shaft through a bearing, the ventilating pipe upright post is in threaded installation on the double-headed lead screw, the diffusion sucker support plate is fixedly installed on the ventilating pipe upright post, the movable hinge plate is hinged to the diffusion sucker support plate, the diffusion sucker is fixedly installed on the diffusion sucker support plate, the whole silicon crystal is adsorbed on the diffusion sucker through an air source negative pressure, the diffusion bevel gear I is meshed with the bevel gear on the diffusion shaft, the diffusion bevel gear I is fixedly installed on the double-headed lead screw, the diffusion bevel gear II is meshed with the bevel gear on the diffusion shaft, and the diffusion bevel gear II is fixedly installed on the double-headed lead screw.
As a further optimization of the technical scheme, the assembling device of the packaging structure of the semiconductor chip comprises an assembling linear motor, a diffusion spline shaft, a diffusion sliding gear, an assembling arm, a chip shell feeding groove, a chip shell feeding lead screw, a steering platform, an ultrasonic welding machine, an ultrasonic welding head cylinder, a finished product groove, an assembling material groove support, an assembling auxiliary linear motor, a slide rail slide block, a y-axis cylinder support, a y-axis cylinder, a z-axis cylinder support, a z-axis cylinder, a vision system, an assembling suction cup clamping block, an assembling suction cup, a silicon sheet discharging groove, a hinge joint discharging groove, a swing head motor support, a swing head transmission shaft, a swing head motor, a swing head suction cup platform and an auxiliary assembling suction cup, wherein the assembling linear motor is installed and fixed on a shell, the diffusion spline shaft is rotatably installed on a transmission box through a bearing, the diffusion sliding gear is slidably installed on the diffusion spline shaft, an assembly arm is fixedly installed on an assembly linear motor, a chip shell feeding groove is fixedly installed on the surface of a transmission case, a chip shell feeding screw rod is installed on the transmission case through a screw nut and a screw thread, a platform at the front end of the chip shell feeding screw rod is slidably installed on the chip shell feeding groove, a steering platform is rotatably installed on the transmission case through a bearing, an ultrasonic welding machine is fixedly installed on the transmission case, an ultrasonic welding head cylinder is fixedly installed on the ultrasonic welding machine, a finished product groove is fixedly positioned on the ultrasonic welding machine, an assembly material groove support is fixedly installed on a shell, an assembly auxiliary linear motor is fixedly installed on the shell, a slide rail end of a slide rail slide block is fixedly installed on the assembly arm, a y-axis cylinder support is fixedly installed on the assembly arm, a y-axis cylinder body is fixedly installed on a y-axis cylinder support, a z-axis cylinder support is fixedly installed on a slide block end of the slide rail slide block, and the z-axis cylinder support is fixedly installed on a piston rod end of the y-axis cylinder, the Z-axis cylinder body is fixedly installed on a Z-axis cylinder support, the vision system is fixedly installed on the Z-axis cylinder support, an assembling sucker clamping block is fixedly installed at the piston rod end of a Z-axis cylinder, an assembling sucker is fixedly installed on the assembling sucker clamping block, a silicon sheet discharging groove is fixedly installed on an assembling material groove support, a hinge joint discharging groove is fixedly installed on the assembling material groove support, a swing motor support is fixedly installed on an assembling auxiliary linear motor, a swing transmission shaft is rotatably installed on the swing motor support through a bearing, a swing motor is fixedly installed on the swing motor support, a swing sucker platform is fixedly installed on the swing transmission shaft, and an auxiliary assembling sucker is fixedly installed on a swing sucker platform.
As a further optimization of the technical scheme, the packaging structure of the semiconductor chip comprises a chip shell, a PCB substrate, ball welding points, a cutting culture silicon wafer, a silicon wafer, an assembly hinge and a top cover silicon wafer, wherein the chip shell is welded and installed on the PCB substrate, the ball welding points are welded and installed on the PCB substrate, the cutting culture silicon wafer is installed and fixed on the PCB substrate, the silicon wafer is installed and fixed on the cutting culture silicon wafer, the assembly hinge is installed and fixed on the cutting culture silicon wafer, the top cover silicon wafer is installed and fixed on the assembly hinge, and the packaging structure is arranged.
As a further optimization of the technical scheme, the transport and diffusion device of the semiconductor chip packaging structure of the invention comprises a plurality of diffusion suckers, diffusion sucker support plates, movable hinge plates and vent pipe columns.
As a further optimization of the technical solution, the assembling device of the packaging structure of the semiconductor chip of the invention has two slide rail sliders and two auxiliary assembling suckers.
As a further optimization of the technical scheme, the packaging structure of the semiconductor chip of the invention has three assembly hinges, five cutting culture silicon wafers and five silicon wafer illustration examples and a plurality of ball welding points.
The packaging structure of the semiconductor chip has the beneficial effects that:
the invention relates to semiconductor chip related equipment, in particular to a semiconductor chip packaging structure, which realizes the installation of other devices and circuit devices on a cultured and generated wafer through an installation main body, a transfer diffusion device is used for transferring and cutting the whole silicon wafer and mutually separating single silicon wafers after cutting to generate more circuits so as to improve the space utilization rate, an assembling device is used for realizing the split assembly of the packaging structure into the packaging structure to realize 3D packaging, and the functions of replacing single damaged wafers, reducing the production cost and improving the heat dissipation efficiency are realized.
Drawings
The invention is described in further detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the overall structure of the present invention.
Fig. 3 is a third schematic view of the overall structure of the present invention.
Fig. 4 is a schematic structural diagram of the mounting main body of the present invention.
FIG. 5 is a first structural diagram of the transfer diffusion device of the present invention.
FIG. 6 is a schematic structural diagram of a transfer diffusion device of the present invention.
Fig. 7 is a first structural diagram of an assembling device according to the present invention.
Fig. 8 is a second structural schematic diagram of the assembling device of the present invention.
Fig. 9 is a third schematic structural diagram of an assembling device of the present invention.
Fig. 10 is a first structural diagram of a package structure according to the present invention.
Fig. 11 is a second schematic view of a package structure according to the present invention.
Fig. 12 is a third schematic structural diagram of the package structure of the present invention.
In the figure: a mounting body 1; a housing 1-1; a transmission case 1-2; wiring modules 1-3; a transfer diffusion device 2; a transfer linear motor 2-1; cutting the linear motor 2-2; 2-3 of a steering spline shaft; 2-4 of a steering sliding gear; 2-5 of a rotating shaft; cutting the mounting bracket 2-6; 2-7 parts of a laser cutter; 2-8 parts of whole silicon wafer; 2-9 parts of a diffusion sucker; 2-10 of a diffusion sucker support plate; 2-11 parts of movable hinge plate; 2-12 upright posts of the vent pipe; 2-13 parts of a diffusion shaft; 2-14 parts of a double-end screw rod; 2-15 parts of a diffusion bevel gear I; 2-16 parts of a diffusion bevel gear II; the screw rod rotates the support 2-17; an assembling device 3; assembling a linear motor 3-1; 3-2 of a diffusion spline shaft; 3-3 of a diffusion sliding gear; assembling arms 3-4; a chip shell feeding groove is 3-5; 3-6 of chip shell feeding screw rods; 3-7 of a steering platform; 3-8 parts of an ultrasonic welding machine; 3-9 parts of an ultrasonic welding head cylinder; 3-10 parts of a finished product tank; assembling material groove brackets 3-11; assembling auxiliary linear motors 3-12; 3-13 slide rail sliding blocks; y-axis cylinder supports 3-14; y-axis cylinders 3-15; 3-16 of a z-axis cylinder support; z-axis cylinders 3-17; visual system 3-18; assembling the sucker clamping blocks 3-19; assembling 3-20 parts of a sucker; a silicon sheet discharge chute 3-21; hinge joint discharge chutes 3-22; 3-23 parts of a swing motor bracket; 3-24 parts of a head swinging transmission shaft; 3-25 of a head swinging motor; 3-26 of a swing head sucker platform; auxiliary assembly suction cups 3-27; a package structure 4; 4-1 of a chip shell; a PCB substrate 4-2; 4-3 of ball welding spots; cutting and culturing the silicon wafer 4-4; 4-5 of silicon sheet; assembling hinges 4-6; top cap silicon sheets 4-7.
Detailed Description
The first embodiment is as follows:
in order to solve the above technical problems, a semiconductor chip package structure includes an installation body 1, a transfer diffusion device 2, an assembly device 3, and a package structure 4, wherein other devices are installed through the installation body 1, and circuit devices on a generated wafer are cultured, the transfer diffusion device 2 provides transfer and cutting of a whole silicon wafer and the silicon wafers are separated from each other after cutting to generate more circuits to improve space utilization, the assembly device 3 realizes 3D packaging of the package structure 4, completes replacement of a single damaged wafer, reduces production cost, and improves heat dissipation efficiency, and is characterized in that: the transfer diffusion device 2 is fixedly installed on the installation body 1, the assembling device 3 is fixedly installed on the installation body 1, and the packaging structure 4 is fixedly installed on the installation body 1.
The second embodiment is as follows:
the present embodiment is described below with reference to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, and 12, and the present embodiment further describes the present embodiment, in which the mounting body 1 includes a housing 1-1, a transmission case 1-2, and a wiring module 1-3, the housing 1-1 is mounted and fixed on the transmission case 1-2, and the wiring module 1-3 is mounted and fixed on the transmission case 1-2.
The third concrete implementation mode:
the present embodiment is described below with reference to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, and the present embodiment further describes the present embodiment, where the transfer diffusion device 2 includes a transfer linear motor 2-1, a cutting linear motor 2-2, a steering spline shaft 2-3, a steering sliding gear 2-4, a rotation shaft 2-5, a cutting mounting bracket 2-6, a laser cutter 2-7, a whole silicon crystal 2-8, a diffusion sucker 2-9, a diffusion sucker bracket plate 2-10, a movable hinge plate 2-11, a vent pipe column 2-12, a diffusion shaft 2-13, a double-headed lead screw 2-14, a diffusion bevel gear one 2-15, a diffusion bevel gear two 2-16, and a lead screw rotating bracket 2-17, the cut and ground rotation shaft 2-8 is placed on the diffusion sucker 2-9, the whole silicon crystal 2-8 is transferred to a cutting station for waiting for cutting through a transfer linear motor 2-1, a laser cutter 2-7 cuts the whole silicon crystal 2-8 along with the driving of the cutting linear motor 2-2, then a steering sliding gear 2-4 is shifted and meshed with a gear on a rotating shaft 2-5 under the control of the east-west direction 1-2, the cutting linear motor 2-2 drives the laser cutter 2-7 to cut again after driving the whole silicon crystal 2-8 to rotate for 90 degrees, the whole silicon crystal 2-8 is cut into small silicon crystals, then the steering sliding gear 2-4 is separated from the gear on the rotating shaft 2-5, the transfer linear motor 2-1 transfers the whole silicon crystal 2-8 to the next station, and a transmission case 1-2 shifts a diffusion sliding gear 3-3 to be meshed with a pinion on the rotating shaft 2-5 after reaching, the diffusion shaft 2-13 is driven to rotate, the gear on the diffusion shaft 2-13 is meshed with the first diffusion bevel gear 2-15 and the second diffusion bevel gear 2-16 to drive the screw rod rotating bracket 2-17 to rotate around the diffusion shaft 2-13, the double-head screw rod 2-14 rotates to drive the vent pipe upright post 2-12 to diffuse outwards, the movable hinge plate 2-11 is unfolded along with the hinge, so that the cut small silicon crystal blocks are separated from each other, the structure shown in figure 6 is taken as an example, other small silicon crystals are attracted, fixed and diffused by a similar array structure, then the diffusion sliding gear 3-3 is separated from the pinion on the rotating shaft 2-5, then the transfer linear motor 2-1 transfers the cut and cultured silicon wafer 4-4 to the lower part of the wiring module 1-3, and the silicon wafer is cultured by lines and semiconductor components to form the cut and cultured silicon wafer 4-4, a transfer linear motor 2-1 is fixedly arranged on a transmission case 1-2, a cutting linear motor 2-2 is fixedly arranged on a shell 1-1, a steering spline shaft 2-3 is rotatably arranged on the transmission case 1-2 through a bearing, a steering sliding gear 2-4 is slidably arranged on the steering spline shaft 2-3, a rotating shaft 2-5 is rotatably arranged on the transmission case 1-2 through a bearing, a cutting installation bracket 2-6 is fixedly arranged on the cutting linear motor 2-2, a laser cutter 2-7 is fixedly arranged on a cutting installation bracket 2-6, a diffusion shaft 2-13 is rotatably arranged at the center of the rotating shaft 2-5 through a bearing, a screw rod rotating bracket 2-17 is rotatably arranged on the diffusion shaft 2-13 through a bearing, a double-head screw rod 2-14 is rotatably arranged on the screw rod rotating bracket 2-17 through a bearing, the double-head screw 2-14 is rotatably installed on the rotating shaft 2-5 through a bearing, the air pipe upright post 2-12 is installed on the double-head screw 2-14 in a threaded mode, the diffusion sucker support plate 2-10 is installed and fixed on the air pipe upright post 2-12, the movable hinge plate 2-11 is installed on the diffusion sucker support plate 2-10 in a hinged mode, the diffusion sucker 2-9 is installed and fixed on the diffusion sucker support plate 2-10, the whole silicon crystal 2-8 is adsorbed on the diffusion sucker 2-9 through air source negative pressure, the diffusion bevel gear I2-15 is meshed with a bevel gear on the diffusion shaft 2-13, the diffusion bevel gear I2-15 is installed and fixed on the double-head screw 2-14, the diffusion bevel gear II 2-16 is meshed with a bevel gear on the diffusion shaft 2-13, and the diffusion bevel gear II 2-16 is installed and fixed on the double-head screw 2-14.
The fourth concrete implementation mode:
the following describes the present embodiment with reference to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, and 12, and the present embodiment further describes the present embodiment, where the assembling device 3 includes an assembling linear motor 3-1, a diffusion spline shaft 3-2, a diffusion sliding gear 3-3, an assembling arm 3-4, a chip shell feeding slot 3-5, a chip shell feeding screw 3-6, a steering platform 3-7, an ultrasonic welder 3-8, an ultrasonic welding head cylinder 3-9, a finished product slot 3-10, an assembling material slot support 3-11, an assembling auxiliary linear motor 3-12, a slide rail slider 3-13, a y-axis cylinder support 3-14, a y-axis cylinder 3-15, a z-axis cylinder support 3-16, a z-axis cylinder 3-17, a vision system 3-18, and a vision system, Assembling a sucker clamping block 3-19, assembling suckers 3-20, silicon slice discharging chutes 3-21, hinge joint discharging chutes 3-22, swing motor supports 3-23, swing transmission shafts 3-24, swing motors 3-25, swing sucker platforms 3-26 and auxiliary assembling suckers 3-27, wherein the assembling linear motor 3-1 drives an assembling arm 3-4 to move above a cut and cultured silicon wafer 4-4, then the position is judged by a vision system 3-18 and the cut and cultured silicon wafer 4-4 is sucked, the concrete action is completed by the cooperation of the assembling linear motor 3-1, a y-axis cylinder 3-15, a z-axis cylinder 3-17 and the assembling suckers 3-20, and the auxiliary assembling linear motor 3-12 drives the swing sucker platforms 3-26 to move after sucking, so that the auxiliary assembly sucker 3-27 sucks the silicon sheet discharging groove 3-21 and the material to be assembled, such as the silicon sheet 4-5, the assembly hinge 4-6, the top cover silicon sheet 4-7, etc., in the hinge joint discharging groove 3-22, then the head swinging motor 3-25 is started to drive the head swinging transmission shaft 3-24 to rotate 180 degrees, then the assembly auxiliary linear motor 3-12 drives the head swinging transmission shaft to horizontally displace, the assembly of the packaging structure is carried out along with the monitoring of the vision system 3-18, after the single assembly, the assembly arm 3-4 sucks and cuts the cultured silicon sheet 4-4 to the steering platform 3-7, the steering platform 3-7 rotates, the assembly arm 3-4 sucks and cuts the cultured silicon sheet 4-4 again through the assembly silicon sheet 3-20 for the next assembly, when the assembly of the main body structure of the single packaging structure 4 except the chip shell 4-1 is completed, transferring to a steering platform 3-7, then lifting a chip shell feeding screw rod 3-6, lifting a chip shell 4-1 in a chip shell feeding groove 3-5, sucking the chip shell to a packaging structure 4 to be packaged by an assembling sucking disc 3-20 and putting down, then extending out an ultrasonic welding head cylinder 3-9, lifting a transfer platform 3-7, welding the chip shell 4-1 on a PCB substrate 4-2 in the packaging structure 4 through the action of an ultrasonic welding machine 3-8 to finish packaging, installing and fixing an assembling linear motor 3-1 on a shell 1-1, installing a diffusion spline shaft 3-2 on a transmission case 1-2 through a bearing in a rotating way, installing a diffusion sliding gear 3-3 on the diffusion spline shaft 3-2 in a sliding way, installing and fixing an assembling arm 3-4 on the assembling linear motor 3-1, a chip shell feeding groove 3-5 is fixedly arranged on the surface of a transmission case 1-2, a chip shell feeding screw rod 3-6 is arranged on the transmission case 1-2 through a screw rod nut thread, a platform at the front end of the chip shell feeding screw rod 3-6 is slidably arranged on the chip shell feeding groove 3-5, a steering platform 3-7 is rotatably arranged on the transmission case 1-2 through a bearing, an ultrasonic welding machine 3-8 is fixedly arranged on the transmission case 1-2, an ultrasonic welding head cylinder 3-9 is fixedly arranged on an ultrasonic welding machine 3-8, a finished product groove 3-10 is fixedly positioned on the ultrasonic welding machine 3-8, an assembly material groove support 3-11 is fixedly arranged on the shell 1-1, an assembly auxiliary linear motor 3-12 is fixedly arranged on the shell 1-1, and a sliding rail end of a sliding rail sliding block 3-13 is fixedly arranged on an assembly arm 3-4, a y-axis cylinder support 3-14 is fixedly arranged on an assembly arm 3-4, a y-axis cylinder 3-15 cylinder body is fixedly arranged on the y-axis cylinder support 3-14, a z-axis cylinder support 3-16 is fixedly arranged at the slide block end of a slide rail slide block 3-13, a z-axis cylinder support 3-16 is fixedly arranged at the piston rod end of the y-axis cylinder 3-15, a z-axis cylinder 3-17 cylinder body is fixedly arranged on the z-axis cylinder support 3-16, a vision system 3-18 is fixedly arranged on the z-axis cylinder support 3-16, an assembly sucker clamping block 3-19 is fixedly arranged at the piston rod end of the z-axis cylinder 3-17, an assembly sucker 3-20 is fixedly arranged on an assembly sucker clamping block 3-19, a silicon sheet discharge chute 3-21 is fixedly arranged on an assembly material chute support 3-11, the hinge joint discharging chute 3-22 is fixedly installed on an assembling material chute support 3-11, the swing motor support 3-23 is fixedly installed on an assembling auxiliary linear motor 3-12, the swing transmission shaft 3-24 is rotatably installed on the swing motor support 3-23 through a bearing, the swing motor 3-25 is fixedly installed on the swing motor support 3-23, the swing suction cup platform 3-26 is fixedly installed on the swing transmission shaft 3-24, and the auxiliary assembling suction cup 3-27 is fixedly installed on the swing suction cup platform 3-26.
The fifth concrete implementation mode:
the following describes the present embodiment with reference to FIGS. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12. the present embodiment further describes the first embodiment, the package structure 4 includes a chip housing 4-1, a PCB substrate 4-2, ball bonding points 4-3, cut and cultured silicon wafers 4-4, a silicon wafer 4-5, an assembly hinge 4-6, and a top cover silicon wafer 4-7, the chip housing 4-1 is soldered on the PCB substrate 4-2, the ball bonding points 4-3 are soldered on the PCB substrate 4-2, the cut and cultured silicon wafer 4-4 is mounted and fixed on the PCB substrate 4-2, the silicon wafer 4-5 is mounted and fixed on the cut and cultured silicon wafer 4-4, the assembly hinge 4-6 is mounted and fixed on the silicon wafer 4-5, the assembly hinge 4-6 is mounted and fixed on the cut and cultured silicon wafer 4-4, the top silicon cover 4-7 is fixed on the assembly hinge 4-6, and the package structure 4 is fixed on the steering platform 3-7.
The sixth specific implementation mode:
the third embodiment is further described below with reference to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, and 12, in which a plurality of diffusion suction cups 2 to 9, diffusion suction cup support plates 2 to 10, movable hinge plates 2 to 11, and vent pipe columns 2 to 12 are provided in the transfer diffusion device 2.
The seventh embodiment:
the present embodiment is described below with reference to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, and 12, and the fourth embodiment is further described, in which two slide rail sliders 3 to 13 and two auxiliary assembly suction cups 3 to 27 are provided in the assembly device 3.
The specific implementation mode is eight:
the present embodiment will be described with reference to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, and 12, and the present embodiment further describes an embodiment five, in which three assembly hinges 4-6 are provided in the package structure 4, five pieces of cut silicon wafers 4-4 and 4-5 are provided in the illustrated example, and a plurality of ball bonding points 4-3 are provided.
The working principle of the invention is as follows:
a packaging structure of a semiconductor chip is characterized in that before use, whether the connection condition between devices meets requirements is checked, a rotating shaft 2-8 which is well cut and ground is placed on a diffusion sucker 2-9, the whole silicon wafer 2-8 is transferred to a cutting station to wait for cutting through a transfer linear motor 2-1, a laser cutter 2-7 cuts the whole silicon wafer 2-8 along with the driving of the cutting linear motor 2-2, then a steering sliding gear 2-4 is shifted and meshed with a gear on the rotating shaft 2-5 through the control of the transmission of the east-west direction 1-2, the whole silicon wafer 2-8 is driven to rotate for 90 degrees, then the cutting linear motor 2-2 drives the laser cutter 2-7 to cut again, and the whole silicon wafer 2-8 is cut into small silicon wafers, then the steering sliding gear 2-4 is disengaged from a gear on the rotating shaft 2-5, the whole silicon wafer 2-8 is transferred to the next station by the transfer linear motor 2-1, the rear transmission case 1-2 is reached to shift the diffusion sliding gear 3-3 to be meshed with a pinion on the rotating shaft 2-5 to drive the diffusion shaft 2-13 to rotate, the gear on the diffusion shaft 2-13 is meshed with the diffusion bevel gear I2-15 and the diffusion bevel gear II 2-16 to drive the screw rod rotating bracket 2-17 to rotate around the diffusion shaft 2-13, simultaneously the double-head screw rod 2-14 rotates to drive the vent pipe upright post 2-12 to diffuse outwards, simultaneously the movable hinge plate 2-11 is unfolded along with the hinge, so that the cut small silicon wafer blocks are separated from each other, the structure shown in figure 6 is an example, other small wafers are attracted, fixed and diffused by a similar array structure, then the diffusion sliding gear 3-3 is disengaged from a pinion on the rotating shaft 2-5, then the transfer linear motor 2-1 transfers the cut cultured silicon wafer 4-4 to the lower part of a wiring module 1-3, the silicon wafer is cultured into the cut cultured silicon wafer 4-4 by a circuit and a semiconductor component, the wiring module is generated by the prior art but not the invention point, then the assembly linear motor 3-1 drives an assembly arm 3-4 to move to the upper part of the cut cultured silicon wafer 4-4, then the position is judged by a vision system 3-18 and the cut cultured silicon wafer 4-4 is sucked, the concrete action is completed by the cooperation of the assembly linear motor 3-1, a y-axis cylinder 3-15, a z-axis cylinder 3-17 and an assembly sucker 3-20, after the silicon wafer is sucked, the auxiliary assembly linear motor 3-12 drives the swinging head sucker platform 3-26 to move, so that the auxiliary assembly sucker 3-27 sucks the silicon wafer discharging groove 3-21 and the silicon wafer 4-5 of the material to be assembled in the hinge joint discharging groove 3-22, the assembly hinge 4-6, the top cover silicon wafer 4-7 and the like, then the swinging head motor 3-25 is started to drive the swinging head transmission shaft 3-24 to rotate 180 degrees, the assembly auxiliary linear motor 3-12 drives the horizontal displacement, the assembly of the packaging structure is carried out along with the monitoring of the visual system 3-18, after the single assembly, the assembly arm 3-4 sucks and cuts the cultured silicon wafer 4-4 to the steering platform 3-7, the steering platform 3-7 rotates, the assembly arm 3-4 sucks and cuts the cultured silicon wafer 4-4 again through the assembled silicon wafer 3-20, and (3) carrying out next-step assembly, transferring the single packaging structure 4 to a steering platform 3-7 after the main body structure except the chip shell 4-1 is assembled, then lifting a chip shell feeding screw rod 3-6 to lift the chip shell 4-1 in a chip shell feeding groove 3-5, sucking the chip shell 4-1 to be packaged to the packaging structure 4 to be packaged by an assembly sucking disc 3-20 and putting down, then extending an ultrasonic welding head cylinder 3-9, lifting the transfer platform 3-7, and welding the chip shell 4-1 on a PCB substrate 4-2 in the packaging structure 4 under the action of an ultrasonic welding machine 3-8 to finish the packaging action.
It is to be understood that the above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and that various changes, modifications, additions and substitutions which are within the spirit and scope of the present invention and which may be made by those skilled in the art are also within the scope of the present invention.
Claims (8)
1. The utility model provides a semiconductor chip's packaging structure, includes installation main part (1), transports diffusion equipment (2), assembly device (3), packaging structure (4), its characterized in that: the transfer diffusion device (2) is fixedly installed on the installation main body (1), the assembling device (3) is fixedly installed on the installation main body (1), and the packaging structure (4) is fixedly installed on the installation main body (1).
2. The semiconductor chip package structure of claim 1, wherein: the installation main body (1) comprises a shell (1-1), a transmission case (1-2) and a wiring module (1-3), wherein the shell (1-1) is fixedly installed on the transmission case (1-2), and the wiring module (1-3) is fixedly installed on the transmission case (1-2).
3. The semiconductor chip package structure of claim 1, wherein: the transfer diffusion device (2) comprises a transfer linear motor (2-1), a cutting linear motor (2-2), a steering spline shaft (2-3), a steering sliding gear (2-4), a rotating shaft (2-5), a cutting mounting bracket (2-6), a laser cutter (2-7), a whole silicon wafer (2-8), a diffusion sucker (2-9), a diffusion sucker support plate (2-10), a movable hinge plate (2-11), a vent pipe upright post (2-12), a diffusion shaft (2-13), a double-end lead screw (2-14), a diffusion bevel gear I (2-15), a diffusion bevel gear II (2-16) and a lead screw rotating bracket (2-17), wherein the transfer linear motor (2-1) is fixedly arranged on a transmission case (1-2), a cutting linear motor (2-2) is fixedly arranged on a shell (1-1), a steering spline shaft (2-3) is rotatably arranged on a transmission case (1-2) through a bearing, a steering sliding gear (2-4) is slidably arranged on the steering spline shaft (2-3), a rotating shaft (2-5) is rotatably arranged on the transmission case (1-2) through a bearing, a cutting mounting bracket (2-6) is fixedly arranged on the cutting linear motor (2-2), a laser cutter (2-7) is fixedly arranged on the cutting mounting bracket (2-6), a diffusion shaft (2-13) is rotatably arranged at the center of the rotating shaft (2-5) through a bearing, a lead screw rotating bracket (2-17) is rotatably arranged on the diffusion shaft (2-13) through a bearing, a double-head lead screw (2-14) is rotatably arranged on the lead screw rotating bracket (2-17) through a bearing, the double-head screw rod (2-14) is rotatably arranged on the rotating shaft (2-5) through a bearing, the vent pipe upright post (2-12) is arranged on the double-head screw rod (2-14) in a threaded manner, the diffusion sucker support plate (2-10) is fixedly arranged on the vent pipe upright post (2-12), the movable hinge plate (2-11) is hinged on the diffusion sucker support plate (2-10), the diffusion sucker (2-9) is fixedly arranged on the diffusion sucker support plate (2-10), the whole silicon crystal (2-8) is adsorbed on the diffusion sucker (2-9) through air source negative pressure, the diffusion bevel gear I (2-15) is meshed with the bevel gear on the diffusion shaft (2-13), the diffusion bevel gear I (2-15) is fixedly arranged on the double-head screw rod (2-14), the diffusion bevel gear II (2-16) is meshed with the bevel gear on the diffusion shaft (2-13), and the second diffusion bevel gear (2-16) is fixedly arranged on the double-end screw rod (2-14).
4. The semiconductor chip package structure of claim 1, wherein: the assembling device (3) comprises an assembling linear motor (3-1), a diffusing spline shaft (3-2), a diffusing sliding gear (3-3), an assembling arm (3-4), a chip shell feeding groove (3-5), a chip shell feeding lead screw (3-6), a steering platform (3-7), an ultrasonic welding machine (3-8), an ultrasonic welding head cylinder (3-9), a finished product groove (3-10), an assembling material groove support (3-11), an assembling auxiliary linear motor (3-12), a sliding rail sliding block (3-13), a y-axis cylinder support (3-14), a y-axis cylinder (3-15), a z-axis cylinder support (3-16), a z-axis cylinder (3-17), a visual system (3-18), an assembling sucker clamping block (3-19), Assembling suckers (3-20), silicon sheet discharge chutes (3-21), hinge joint discharge chutes (3-22), swing motor supports (3-23), swing transmission shafts (3-24), swing motors (3-25), swing sucker platforms (3-26) and auxiliary assembling suckers (3-27), wherein the assembling linear motor (3-1) is fixedly installed on a shell (1-1), a diffusion spline shaft (3-2) is rotatably installed on a transmission case (1-2) through a bearing, a diffusion sliding gear (3-3) is slidably installed on the diffusion spline shaft (3-2), an assembling arm (3-4) is fixedly installed on the assembling linear motor (3-1), a chip case upper trough (3-5) is fixedly installed on the surface of the transmission case (1-2), a chip shell feeding screw rod (3-6) is arranged on a transmission case (1-2) through a screw rod nut, a platform at the front end of the chip shell feeding screw rod (3-6) is slidably arranged on a chip shell feeding groove (3-5), a steering platform (3-7) is rotatably arranged on the transmission case (1-2) through a bearing, an ultrasonic welding machine (3-8) is fixedly arranged on the transmission case (1-2), an ultrasonic welding head cylinder (3-9) is fixedly arranged on the ultrasonic welding machine (3-8), a finished product groove (3-10) is fixedly positioned on the ultrasonic welding machine (3-8), an assembly material groove support (3-11) is fixedly arranged on a shell (1-1), an assembly auxiliary linear motor (3-12) is fixedly arranged on the shell (1-1), a sliding rail end of a sliding rail sliding block (3-13) is fixedly arranged on an assembly arm (3-4), a y-axis cylinder support (3-14) is fixedly arranged on an assembly arm (3-4), a y-axis cylinder (3-15) cylinder body is fixedly arranged on the y-axis cylinder support (3-14), a z-axis cylinder support (3-16) is fixedly arranged at the slide block end of a slide rail slide block (3-13), a z-axis cylinder support (3-16) is fixedly arranged at the piston rod end of the y-axis cylinder (3-15), a z-axis cylinder (3-17) cylinder body is fixedly arranged on the z-axis cylinder support (3-16), a vision system (3-18) is fixedly arranged on the z-axis cylinder support (3-16), an assembly sucker clamping block (3-19) is fixedly arranged at the piston rod end of the z-axis cylinder (3-17), and an assembly sucker (3-20) is fixedly arranged on the assembly sucker clamping block (3-19), the silicon sheet discharging grooves (3-21) are fixedly installed on the assembled material groove support (3-11), the hinge joint discharging grooves (3-22) are fixedly installed on the assembled material groove support (3-11), the swing motor support (3-23) is fixedly installed on the assembling auxiliary linear motor (3-12), the swing transmission shaft (3-24) is rotatably installed on the swing motor support (3-23) through a bearing, the swing motor (3-25) is fixedly installed on the swing motor support (3-23), the swing sucker platform (3-26) is fixedly installed on the swing transmission shaft (3-24), and the auxiliary assembling sucker (3-27) is fixedly installed on the swing sucker platform (3-26).
5. The semiconductor chip package structure of claim 1, wherein: the packaging structure (4) comprises a chip shell (4-1), a PCB substrate (4-2), ball welding points (4-3), cutting culture silicon wafers (4-4), silicon wafers (4-5), an assembly hinge (4-6) and a top cover silicon wafer (4-7), wherein the chip shell (4-1) is welded on the PCB substrate (4-2), the ball welding points (4-3) are welded on the PCB substrate (4-2), the cutting culture silicon wafers (4-4) are installed and fixed on the PCB substrate (4-2), the silicon wafers (4-5) are installed and fixed on the cutting culture silicon wafers (4-4), the assembly hinge (4-6) is installed and fixed on the silicon wafers (4-5), the assembly hinge (4-6) is installed and fixed on the cutting culture silicon wafers (4-4), the top silicon cover (4-7) is fixed on the assembly hinge (4-6), and the package structure (4) is fixed on the turning platform (3-7).
6. The semiconductor chip package structure of claim 3, wherein: the transfer diffusion device (2) is provided with a plurality of diffusion suckers (2-9), diffusion sucker support plates (2-10), movable hinge plates (2-11) and vent pipe columns (2-12).
7. The semiconductor chip package structure of claim 4, wherein: the number of the sliding rail sliding blocks (3-13) and the auxiliary assembling suction cups (3-27) in the assembling device (3) is two.
8. The semiconductor chip package structure of claim 5, wherein: the packaging structure (4) has three assembly hinges (4-6), five cutting culture silicon wafers (4-4) and five silicon wafers (4-5) in the illustration example, and a plurality of ball welding points (4-3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110804971.1A CN113539902A (en) | 2021-07-16 | 2021-07-16 | Packaging structure of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110804971.1A CN113539902A (en) | 2021-07-16 | 2021-07-16 | Packaging structure of semiconductor chip |
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| Publication Number | Publication Date |
|---|---|
| CN113539902A true CN113539902A (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110804971.1A Withdrawn CN113539902A (en) | 2021-07-16 | 2021-07-16 | Packaging structure of semiconductor chip |
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| CN (1) | CN113539902A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313938A (en) * | 2023-05-16 | 2023-06-23 | 无锡惠芯半导体有限公司 | Semiconductor chip packaging device |
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2021
- 2021-07-16 CN CN202110804971.1A patent/CN113539902A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313938A (en) * | 2023-05-16 | 2023-06-23 | 无锡惠芯半导体有限公司 | Semiconductor chip packaging device |
| CN116313938B (en) * | 2023-05-16 | 2023-07-25 | 无锡惠芯半导体有限公司 | Semiconductor chip packaging device |
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Application publication date: 20211022 |