CN109333844B - Silicon wafer splitting device and silicon wafer scribing processing system - Google Patents
Silicon wafer splitting device and silicon wafer scribing processing system Download PDFInfo
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- CN109333844B CN109333844B CN201811222638.4A CN201811222638A CN109333844B CN 109333844 B CN109333844 B CN 109333844B CN 201811222638 A CN201811222638 A CN 201811222638A CN 109333844 B CN109333844 B CN 109333844B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 132
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 132
- 239000010703 silicon Substances 0.000 title claims abstract description 132
- 238000012545 processing Methods 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 89
- 230000007306 turnover Effects 0.000 claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims abstract description 14
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000007599 discharging Methods 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 114
- 238000013461 design Methods 0.000 description 7
- 241000252254 Catostomidae Species 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000012634 fragment Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to a silicon wafer splitting device and a silicon wafer scribing processing system. The silicon wafer splitting device comprises a base frame, a fixed splitting sucker, a rotary splitting sucker, a turnover mechanism, a driving mechanism and a suction nozzle assembly; the rotary split sucker is arranged at the upper end of the base frame, and one side of the rotary split sucker, which is close to the fixed split sucker, is rotationally connected with the upper end of the base frame; the turnover mechanism is arranged on the base frame and is in transmission connection with the lower part of the rotary lobe sucker, and the turnover mechanism can drive the rotary lobe sucker to turn over; the fixed split sucker is provided with a hole site penetrating the fixed split sucker up and down, the suction nozzle component is arranged at the hole site, the driving mechanism is in transmission connection with the suction nozzle component and can drive the suction nozzle component to move upwards to extend to the upper part of the hole site or move downwards to the upper end of the suction nozzle component which is not higher than the upper end of the hole site, and the suction nozzle component can be driven to rotate horizontally. The advantages are that: the method can realize effective slicing after scribing the silicon wafer, can adjust the angle and the direction of a pair of slices, is beneficial to subsequent production and processing, and improves the subsequent production and processing efficiency.
Description
Technical Field
The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer splitting device and a silicon wafer scribing processing system.
Background
Under the condition that the power generation efficiency of the solar cell is certain, the power generation power of the assembly can be improved by a method of welding after the cell is split. In the prior art, when the solar cell is broken, a laser beam is generally adopted to scribe the cell to a certain depth along the position to be broken, and then mechanical force is adopted to break the cell along the scribing position. In the prior art, various breaking devices are provided, each device has advantages and disadvantages, the overall efficiency of equipment is improved, and the integration of the equipment and a production line is always the pursued theme.
At present, a silicon wafer in the prior art is generally a square silicon wafer, and four sides of the silicon wafer are provided with chamfers. When the silicon wafer is conveyed after being cracked, especially when the conveying belt is used for conveying, the problem that the directions are not uniform (the chamfering directions are not consistent) exists, the equipment needs to be increased for turning the directions, waste exists in the equipment cost and the time cost, and the follow-up high-efficiency production and processing are not facilitated.
Disclosure of Invention
The invention aims to solve the technical problem of providing a silicon wafer splitting device and a silicon wafer scribing processing system, which effectively overcome the defects of the prior art.
The technical scheme for solving the technical problems is as follows:
the silicon wafer splitting device comprises a base frame, a fixed splitting sucker, a rotary splitting sucker, a turnover mechanism, a driving mechanism and a suction nozzle assembly;
the fixed split sucker is horizontally arranged on one side of the upper end of the base frame;
the rotary split sucker is arranged on the other side of the upper end of the base frame, and one side of the rotary split sucker, which is close to the fixed split sucker, is rotationally connected with the upper end of the base frame;
the turnover mechanism is arranged on the base frame and is in transmission connection with the lower part of the rotary split sucker, and can drive the rotary split sucker to turn upwards to be horizontal and level with the upper part of the rotary split sucker or to turn downwards and incline;
the fixed split sucker is provided with a hole site penetrating through the fixed split sucker vertically, the suction nozzle assembly is arranged at the hole site, the driving mechanism is arranged on the base frame and is in transmission connection with the suction nozzle assembly, and the driving mechanism can drive the suction nozzle assembly to move upwards to extend to the upper part of the hole site or move downwards to the upper end of the suction nozzle assembly which is not higher than the upper end of the hole site and can drive the suction nozzle assembly to rotate horizontally;
the upper surfaces of the fixed split sucker and the rotary split sucker are adsorption surfaces.
The beneficial effects of the invention are as follows: the method can realize effective slicing after scribing the silicon wafer, can adjust the angle and the direction of a pair of slices, is beneficial to subsequent production and processing, and improves the subsequent production and processing efficiency.
On the basis of the technical scheme, the invention can be improved as follows.
Further, the base frame comprises a bottom plate and two side plates, the bottom plate is horizontally arranged, the two side plates are respectively and vertically arranged at two ends of the upper end of the bottom plate and are parallel to each other, two ends of the fixed split sucker are respectively connected and fixed with one sides of the upper ends of the two side plates, the rotary split sucker is arranged between the other sides of the upper ends of the two side plates, two ends of one side of the rotary split sucker, which are close to the fixed split sucker, are respectively and rotatably connected with the two side plates, and the turnover mechanism and the driving mechanism are respectively fixed on the bottom plate.
The base frame has the beneficial effects that the base frame is simple in design and is beneficial to the installation of the fixed split sucker and the rotary split sucker.
Further, the turnover mechanism is an air cylinder, a bracket is fixed on the base frame, the turnover mechanism is rotatably arranged on the bracket, and a telescopic rod of the turnover mechanism is in transmission connection with the other side of the lower part of the rotary lobe sucker.
The beneficial effect of adopting above-mentioned further scheme is that do benefit to the installation, convenient to use.
Further, the driving mechanism comprises a jacking mechanism and a rotating mechanism, the jacking mechanism is installed on the base frame and located below the fixed split sucker, the rotating mechanism is installed at the driving end of the jacking mechanism, the suction nozzle assembly is installed at the driving end of the rotating mechanism, the jacking mechanism can drive the rotating mechanism to drive the suction nozzle assembly to move upwards to extend to the upper side of the hole site or move downwards to the upper end of the hole site, and the rotating mechanism can drive the suction nozzle assembly to rotate.
The driving mechanism has the beneficial effects that the driving mechanism is reasonable in design, convenient and simple to operate and use, and the suction nozzle assembly is effectively used for driving the rotation direction adjustment of the sliced silicon wafers, so that the follow-up processing production or transportation is facilitated.
Further, the jacking mechanism is a sliding table cylinder.
The adoption of the further scheme has the beneficial effect of being beneficial to the stable lifting of the whole suction nozzle assembly.
Further, the rotating mechanism is a swinging cylinder.
The adoption of the further scheme has the beneficial effect of being beneficial to the rotation of the sliced silicon wafers.
Further, the suction nozzle assembly comprises a suction nozzle fixing frame and a plurality of suction nozzles, wherein the suction nozzle fixing frame is fixed at the driving end of the rotating mechanism, and the suction nozzles are uniformly embedded at the upper end part of the suction nozzle fixing frame.
The suction nozzle assembly has the beneficial effects of simple design and convenience in installation.
The silicon wafer scribing processing system comprises a laser scribing module, a silicon wafer transferring module, a silicon wafer feeding and conveying module, a silicon wafer slicing and discharging and conveying module and a silicon wafer splitting device as claimed in any one of the above-mentioned claims, which are respectively arranged on a workbench surface; the silicon wafer feeding and conveying module is arranged at a position close to the laser scribing module and used for conveying the silicon wafer to be processed to the laser scribing module, the silicon wafer transferring module is used for conveying the silicon wafer which is scribed by the laser scribing module to the silicon wafer splitting device and transferring a pair of split wafers which are split by the silicon wafer splitting device to the split silicon wafer discharging and conveying module.
The beneficial effects are that: the silicon wafer scribing processing system has reasonable design, can effectively complete a series of production of scribing, splitting and slicing of the battery piece, and has high production efficiency.
Further, the silicon wafer transfer module comprises a cross-shaped mechanical rotating arm and a rotary driving device, wherein the mechanical rotating arm is horizontally arranged, the end part of each rotating arm is provided with a sucking disc, the rotary driving device is arranged between the two silicon wafer splitting devices, the driving end of the rotary driving device is in transmission connection with the middle part of the mechanical rotating arm, and the sucking discs at the end parts of the two rotating arms, which are positioned on the same straight line, of the mechanical rotating arm group can respectively rotate to the upper parts of the two silicon wafer splitting devices, the upper parts of the feeding ends of the splitting silicon wafer blanking conveying module and the laser scribing module.
The double-station processing method has the beneficial effects that double-station processing is realized, and the processing efficiency is greatly improved.
Drawings
FIG. 1 is a schematic diagram of a silicon wafer breaking device according to the present invention;
FIG. 2 is a schematic diagram of the structure of the silicon wafer breaking device before breaking;
FIG. 3 is a schematic diagram of the structure of the silicon wafer breaking device after breaking;
FIG. 4 is a schematic diagram of the driving mechanism in the silicon wafer breaking device of the present invention;
fig. 5 is a schematic top view of the system for dicing a silicon wafer according to the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
1. a base frame 2, a fixed split sucker 3, a rotary split sucker 4, a turnover mechanism 5, a driving mechanism 6 and a suction nozzle component, 11, a bottom plate, 12, side plates, 51, a lifting mechanism, 52, a rotating mechanism, 61, a suction nozzle fixing frame, 62 and a suction nozzle;
100. the device comprises a silicon wafer splitting device 200, a laser scribing module 210, a rotary processing workbench 300, a silicon wafer transferring module 400, a silicon wafer feeding and conveying module to be processed 500 and a silicon wafer splitting and discharging and conveying module.
Detailed Description
The principles and features of the present invention are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
Embodiment one: as shown in fig. 1 to 4, the silicon wafer breaking device of the present embodiment includes a base frame 1, a fixed breaking suction cup 2, a rotary breaking suction cup 3, a turnover mechanism 4, a driving mechanism 5 and a suction nozzle assembly 6;
the fixed split sucker 2 is horizontally arranged on one side of the upper end of the base frame 1;
the rotary split sucker 3 is arranged on the other side of the upper end of the base frame 1, and one side of the rotary split sucker close to the fixed split sucker 2 is rotationally connected with the upper end of the base frame 1;
the turnover mechanism 4 is arranged on the base frame 1 and is in transmission connection with the lower part of the rotary split sucker 3, and the turnover mechanism 4 can drive the rotary split sucker 3 to turn upwards to be horizontal and level with the upper part of the rotary split sucker 3 or to turn downwards and incline;
the fixed split sucker 2 is provided with a hole site penetrating through the fixed split sucker vertically, the suction nozzle assembly 6 is arranged at the hole site, the driving mechanism 5 is arranged on the base frame 1 and is in transmission connection with the suction nozzle assembly 6, the driving mechanism 5 can drive the suction nozzle assembly 6 to move upwards to extend above the hole site or move downwards to the upper end of the suction nozzle assembly 6 which is not higher than the upper end of the hole site, and the suction nozzle assembly 6 can be driven to rotate horizontally;
the upper surfaces of the fixed split sucker 2 and the rotary split sucker 3 are adsorption surfaces.
Considering that the silicon wafer is generally rectangular, the fixed split chuck 2 and the rotary split chuck 3 are each rectangular plate-like structures, and the long sides of the two sides are close to each other and form a split gap.
It should be noted that: the fixed split sucker 2, the rotary split sucker 3 and the suction nozzle assembly 6 are respectively externally connected with a negative pressure device, so that negative pressure is formed on the adsorption surfaces of the fixed split sucker 2, the rotary split sucker 3 and the suction nozzle assembly 6.
Before splitting, the fixed split sucker 2 and the rotary split sucker 3 are in a horizontal state, the upper surfaces of the fixed split sucker 2 and the rotary split sucker 3 are flush, a silicon wafer (square silicon wafer, four right angles of the square silicon wafer are all chamfered) subjected to middle scribing is horizontally placed on the fixed split sucker 2 and the rotary split sucker 3, the scribing part is overlapped with the upper and lower projections of a split gap, the negative pressure device is started, negative pressure is generated on the adsorption surfaces of the fixed split sucker 2 and the rotary split sucker 3, the silicon wafer is tightly adsorbed, the turnover mechanism 4 drives the rotary split sucker 3 to turn over and incline, the silicon wafer with the scribing part is broken into two split pieces, the negative pressure device is controlled to operate to cancel the negative pressure on the adsorption surface of the fixed split sucker 2, meanwhile, the suction nozzle assembly 6 generates negative pressure, the split pieces on the upper surface of the rotary split sucker 3 are adsorbed on the suction nozzle assembly 6, the driving mechanism 5 operates to drive the suction nozzle assembly 6 to rise, the split pieces adsorbed on the rotary split sucker 3 to the upper side, the split sucker 3 is synchronous, the driving mechanism 5 drives the split sucker 6 to rotate horizontally to rotate 180 degrees, the split blades to enable the split 6 to be adsorbed on the two sides to be in the same direction, the two chamfer positions are simultaneously, and the two chamfer positions are simultaneously transferred to the two chamfer positions of the split sucker assembly can be uniformly machined, and the two chamfer positions can be simultaneously guaranteed, and the two chamfer positions can be machined and finished.
By adopting the scheme, the silicon wafer is rotated after splitting, the silicon wafer is in the same direction on the splitting device, special rotating equipment is not required to be added, integration is facilitated, and time and equipment cost are saved.
Preferably, the base frame 1 includes a bottom plate 11 and two side plates 12, the bottom plate 11 is horizontally disposed, the two side plates 12 are vertically disposed at two ends of an upper end of the bottom plate 11, and are parallel to each other, two ends of the fixed split suction cup 2 are connected and fixed with one side of an upper end of the two side plates 12, the rotating split suction cup 3 is disposed between the other sides of the upper ends of the two side plates 12, two ends of a side of the rotating split suction cup 3, which is close to the fixed split suction cup 2, are respectively connected with the two side plates 12 in a rotating manner, the turnover mechanism 4 and the driving mechanism 5 are respectively fixed on the bottom plate 11, and the whole base frame 1 is relatively simple in structural design, and is very convenient for reasonable installation of the fixed split suction cup 2 and the rotating split suction cup 3.
The two ends of the fixed split sucker 2 and the rotary split sucker 3 are respectively fixed with rectangular connecting plates, so that the two connecting plates are connected with the upper end of the base frame 1 (the connecting plates at the two ends of the fixed split sucker 2 and the rotary split sucker 3 are connected with the base frame 1, and the normal use area and structure of the fixed split sucker 2 and the rotary split sucker 3 are not reduced).
Preferably, the turnover mechanism 4 is a cylinder, specifically, a double-shaft cylinder, a bracket is fixed on the base frame 1, the turnover mechanism 4 is rotatably mounted on the bracket, specifically, a cylinder body is rotatably mounted on the bracket, a telescopic rod at the upper end of the cylinder body is in transmission connection with the other side of the lower part of the rotary lobe sucking disc 3, and a telescopic rod at the lower end of the cylinder body is hinged with the base frame 1, so that the use is simple and convenient.
Of course, the turning mechanism 4 may be a structure or a product having a similar function, such as an electric push rod or a hydraulic rod.
In some embodiments, the driving mechanism 5 includes a lifting mechanism 51 and a rotating mechanism 52, the lifting mechanism 51 is mounted on the base frame 1 and is located below the fixed lobe chuck 2, the rotating mechanism 52 is mounted on a driving end of the lifting mechanism 51, the suction nozzle assembly 6 is mounted on the driving end of the rotating mechanism 52, the lifting mechanism 51 can drive the rotating mechanism 52 to drive the suction nozzle assembly 6 to move upwards to extend above the hole site or move downwards to an upper end of the hole site, the rotating mechanism 52 can drive the suction nozzle assembly 6 to rotate, and through smart combination of the two mechanisms, different operations of lifting and rotating of the suction nozzle assembly 6 are achieved.
Preferably, the rotation center of the rotation mechanism 52 is far away from the scribing position (crack) of the silicon wafer, and most preferably, is arranged between the center line parallel to the scribing direction and the dicing edge in the vertical direction of the scribing of the silicon wafer.
The purpose of the arrangement is that after the sliced silicon wafer completes 180-degree rotation, the sliced silicon wafer is separated from another sliced silicon wafer by a certain distance, so that the problem of stacking adhesion in the process of conveying the silicon wafers (the sliced silicon wafer is called as a sliced silicon wafer hereinafter) is avoided.
Preferably, the lifting mechanism 51 is a sliding table cylinder, which is convenient to use, and of course, may be a straight guide rail (a linear guide rail or a ball screw pair) which is vertically arranged, or may be other structures or products with lifting function.
Preferably, the rotating mechanism 52 is a swing cylinder, which is convenient to use, but may also be a motor or other structure or product with the same type of function.
Preferably, the suction nozzle assembly 6 includes a suction nozzle fixing frame 61 and a plurality of suction nozzles 62, the suction nozzle fixing frame 61 is fixed at the driving end of the rotating mechanism 52, the suction nozzles 62 are uniformly embedded at the upper end of the suction nozzle fixing frame 61, the upper end of the suction nozzle 62 is a suction end (surface), each suction nozzle is externally connected with a negative pressure device, and the suction nozzle assembly 6 is simple in design, convenient and firm to install.
It should be noted that: one side of the lower part of the suction nozzle fixing frame 61 is provided with a notch, an air pipe joint is arranged at the notch, a plurality of suction nozzles 62 are respectively communicated with the air pipe joint, the air pipe joint is externally connected with a negative pressure device, good arrangement of pipelines is ensured, and the structural design of the whole equipment is compact and attractive.
Embodiment two: as shown in fig. 5, the silicon wafer dicing system of this embodiment is characterized in that: the device comprises a laser scribing module 200, a silicon wafer transfer module 300, a silicon wafer feeding and conveying module 400 to be processed, a piece-by-piece silicon wafer discharging and conveying module 500 and a silicon wafer splitting device 100 in the embodiment I, which are respectively arranged on a workbench surface; the silicon wafer loading and transferring module 400 is disposed near the laser scribing module 200, and is configured to transfer the silicon wafer to be processed to the laser scribing module 200, and the silicon wafer transferring module 300 is configured to transfer the silicon wafer scribed by the laser scribing module 200 to the silicon wafer breaking device 100, and transfer a pair of broken fragments of the silicon wafer breaking device 100 to the broken fragment silicon wafer unloading and transferring module 500.
In the production process, the silicon wafer to be processed is conveyed to the laser scribing module 200 by the silicon wafer feeding conveying module 400, laser scribing operation is completed on the laser scribing module 200, the silicon wafer is conveyed to the silicon wafer splitting device 100 through the silicon wafer conveying module 300, breaking is completed on the silicon wafer, or breaking and splitting operations are completed, the silicon wafer to be processed is conveyed to the silicon wafer cutting conveying module 500 through the silicon wafer conveying module 300, and the silicon wafer to be processed is conveyed to the next process.
More specifically, the silicon wafer loading and conveying module 400 and the silicon wafer unloading and conveying module 500 to be processed may be conveying modules such as a belt conveying module, or may be other mechanisms or products with similar loading and unloading functions.
The laser scribing module 200 includes a rotary processing table 210 and a laser (the laser is disposed above the rotary processing table 210, not shown in the figure), where the rotary processing table 210 is a "cross" four-table-board table, and includes a "cross" table-board arm, a driving device is fixed at the lower end of the rotary processing table 210 (the driving device is fixed on the table-board, and the driving end thereof is upward), and the rotary processing table is driven by the driving device to rotate by 90 degrees step (to ensure that each table can be successively rotated below a scanning lens of the laser), and a sucker module is upward disposed at the free end of the "cross" table-board arm, for adsorbing a silicon wafer. When the cross-shaped workbench arm rotates, the free ends respectively and sequentially feed the material level (close to the discharge end of the silicon wafer feeding and conveying module 400 to be processed), the photographing position, the laser scribing position and the discharging position stay, and the silicon wafer feeding, photographing, laser scribing and silicon wafer scribing discharging are respectively completed.
As a preferred solution, the silicon wafer transfer module 300 includes a mechanical rotating arm in a cross shape and a rotation driving device, the mechanical rotating arm is horizontally disposed, a suction cup is disposed at an end of each rotating arm (the suction cup is disposed to have a downward suction surface for sucking and transferring a wafer to be polished or a wafer to be polished), the wafer polishing device 100 is disposed in two and is mounted on a working table surface on one side of the laser scribing module 200 at intervals, the rotation driving device is mounted between the two wafer polishing devices 100, a driving end of the rotation driving device is in transmission connection with a middle portion of the mechanical rotating arm, the suction cups at the ends of the two rotating arms on the same line of the mechanical rotating arm can be respectively rotated to a position above the two wafer polishing devices 100, a position above a feeding end of the wafer discharging and transferring module 500 and a position of the laser scribing module 200 are rotated by 90 degrees in a reciprocating manner, so that the polished wafer on the rotary processing table 210 can be transferred to the wafer polishing device 100; specifically, the two silicon wafer splitting devices 100 are distributed in parallel at intervals, and two suction cup modules at two ends of one of the two cross-shaped mechanical rotating arms can be simultaneously moved to the two silicon wafer splitting devices 100 respectively, and at the same time, two ends of the other rotating arm are simultaneously moved to the position above the feeding end of the silicon wafer conveying module 500 and the discharging position of the rotary processing workbench 210 of the laser scribing module 200 respectively. In this way, the two silicon wafer splitting devices 100 are arranged in a cross shape with the blanking position of the rotary processing workbench of the laser scribing module 200 and the starting end of the splitting silicon wafer blanking conveying module 500, the above positions are respectively located below the rotating arms, when the rotating arms rotate by 90 degrees in a reciprocating manner, the suckers (a group of suckers) at the end parts of two rotating arms on the same straight line can respectively finish transferring silicon wafers from the blanking position of the laser scribing module 200 to one silicon wafer splitting device 100, and transfer the silicon wafers after splitting from the silicon wafer splitting device 100 to the splitting silicon wafer blanking conveying module 500, meanwhile, the suckers (another group of suckers) at the end parts of the other two rotating arms on the same straight line finish transferring scribing silicon wafers from the blanking position of the laser scribing module 200 to the other silicon wafer splitting device 100, and the suction cups at the end parts of one group finish transferring silicon wafers from the blanking position of the laser scribing module 200 to the one silicon wafer splitting device 100, and the other group of suction cups finish transferring silicon wafers from the splitting device 100 to the two silicon wafer splitting device 100, and the two silicon wafer splitting device 100 are sequentially arranged, and the two splitting device 100 are sequentially arranged, so that the two silicon wafer splitting devices are sequentially arranged, and the two splitting device 100 are finished, and the processing efficiency is improved.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (7)
1. The utility model provides a silicon chip splitting device which characterized in that: comprises a base frame (1), a fixed split sucker (2), a rotary split sucker (3), a turnover mechanism (4), a driving mechanism (5) and a suction nozzle assembly (6);
the fixed split sucker (2) is horizontally arranged at one side of the upper end of the base frame (1);
the rotary split sucker (3) is arranged on the other side of the upper end of the base frame (1), and one side of the rotary split sucker, which is close to the fixed split sucker (2), is rotationally connected with the upper end of the base frame (1);
the turnover mechanism (4) is arranged on the base frame (1) and is in transmission connection with the lower part of the rotary lobe sucker (3), and the turnover mechanism (4) can drive the rotary lobe sucker (3) to turn upwards to be horizontal and flush with the upper part of the rotary lobe sucker (3) or to turn downwards and incline;
the fixed split sucker (2) is provided with a hole site penetrating through the fixed split sucker up and down, the suction nozzle assembly (6) is arranged at the hole site, the driving mechanism (5) is arranged on the base frame (1) and is in transmission connection with the suction nozzle assembly (6), the driving mechanism (5) can drive the suction nozzle assembly (6) to move upwards to extend above the hole site or move downwards to the upper end of the suction nozzle assembly (6) which is not higher than the upper end of the hole site, and can drive the suction nozzle assembly (6) to rotate horizontally;
the upper surfaces of the fixed split sucker (2) and the rotary split sucker (3) are adsorption surfaces;
the base frame (1) comprises a bottom plate (11) and two side plates (12), wherein the bottom plate (11) is horizontally arranged, the two side plates (12) are respectively and vertically arranged at two ends of the upper end of the bottom plate (11) and are parallel to each other, two ends of the fixed split sucker (2) are respectively connected and fixed with one side of the upper ends of the two side plates (12), the rotary split sucker (3) is arranged between the other sides of the upper ends of the two side plates (12), two ends of one side of the rotary split sucker (3) close to the fixed split sucker (2) are respectively and rotatably connected with the two side plates (12), and the turnover mechanism (4) and the driving mechanism (5) are respectively fixed on the bottom plate (11);
the turnover mechanism (4) is an air cylinder, a bracket is fixed on the base frame (1), the turnover mechanism (4) is rotatably mounted on the bracket, and a telescopic rod of the turnover mechanism is in transmission connection with the other side of the lower part of the rotary lobe sucker (3).
2. The wafer breaking device according to claim 1, wherein: the driving mechanism (5) comprises a jacking mechanism (51) and a rotating mechanism (52), the jacking mechanism (51) is installed on the base frame (1) and located below the fixed split sucker (2), the rotating mechanism (52) is installed at the driving end of the jacking mechanism (51), the suction nozzle assembly (6) is installed at the driving end of the rotating mechanism (52), the jacking mechanism (51) can drive the rotating mechanism (52) to drive the suction nozzle assembly (6) to move upwards to extend to the upper portion of the hole site or move downwards to the upper end of the suction nozzle assembly (6) to be not higher than the upper end of the hole site, and the rotating mechanism (52) can drive the suction nozzle assembly (6) to rotate.
3. A silicon wafer breaking device according to claim 2, wherein: the jacking mechanism (51) is a sliding table cylinder.
4. A silicon wafer breaking device according to claim 2, wherein: the rotating mechanism (52) is a swinging cylinder.
5. A silicon wafer breaking device according to claim 2, wherein: the suction nozzle assembly (6) comprises a suction nozzle fixing frame (61) and a plurality of suction nozzles (62), the suction nozzle fixing frame (61) is fixed at the driving end of the rotating mechanism (52), and the suction nozzles (62) are uniformly embedded at the upper end part of the suction nozzle fixing frame (61).
6. A silicon wafer scribing processing system is characterized in that: comprises a laser scribing module (200), a silicon wafer transferring module (300), a silicon wafer loading and conveying module (400), a sliced silicon wafer unloading and conveying module (500) and a silicon wafer splitting device (100) according to any one of claims 1 to 5, which are respectively arranged on a workbench surface; the silicon wafer feeding and conveying module (400) to be processed is arranged at a position close to the laser scribing module (200) and used for conveying the silicon wafer to be processed to the laser scribing module (200), the silicon wafer transferring module (300) is used for conveying the silicon wafer which is scribed by the laser scribing module (200) to the position of the silicon wafer splitting device (100) and transferring a pair of split pieces which are split by the silicon wafer splitting device (100) to the position of the split piece silicon wafer discharging and conveying module (500).
7. The wafer dicing system of claim 6, wherein: the silicon wafer transfer module (300) comprises a cross-shaped mechanical rotating arm and a rotary driving device, wherein the mechanical rotating arm is horizontally arranged, suction cups are arranged at the end parts of each rotating arm, two silicon wafer splitting devices (100) are arranged on a workbench surface on one side of the laser scribing module (200) at intervals, the rotary driving device is arranged between the two silicon wafer splitting devices (100), the driving end of the rotary driving device is connected with the middle part of the mechanical rotating arm in a transmission mode, and the suction cups at the end parts of the two rotating arms, which are positioned on the same straight line, of the mechanical rotating arm can be respectively rotated to the upper parts of the two silicon wafer splitting devices (100), the upper parts of feeding ends of the split silicon wafer blanking conveying modules (500) and the positions of the laser scribing module (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811222638.4A CN109333844B (en) | 2018-10-19 | 2018-10-19 | Silicon wafer splitting device and silicon wafer scribing processing system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN110091441B (en) * | 2019-04-29 | 2021-04-02 | 上海理工大学 | Lifting type semiconductor wafer cleavage device |
| CN112405878B (en) * | 2020-09-30 | 2022-09-09 | 青岛铭青机电有限公司 | Automatic board breaking device for ceramic chip products |
| CN114347280B (en) * | 2022-01-11 | 2024-05-14 | 武汉三工新能源科技有限公司 | Silicon wafer quarter-splitting equipment and process |
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