CN113500297A - Laser polishing method and laser polishing equipment - Google Patents
Laser polishing method and laser polishing equipment Download PDFInfo
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- CN113500297A CN113500297A CN202110686942.XA CN202110686942A CN113500297A CN 113500297 A CN113500297 A CN 113500297A CN 202110686942 A CN202110686942 A CN 202110686942A CN 113500297 A CN113500297 A CN 113500297A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a laser polishing method and a laser polishing device. The method comprises the steps of controlling a carbon dioxide continuous laser to emit laser beams, enabling the laser beams to be focused and refracted to the surface of a ceramic product through a three-dimensional laser galvanometer to melt materials on the surface, then controlling one group of lenses in the three-dimensional laser galvanometer to move relative to the other group of lenses to adjust the focal position of the laser beams, controlling a rotating mechanism to drive an objective table to rotate around a first rotating shaft perpendicular to one surface of the objective table for bearing the ceramic product and a second rotating shaft perpendicular to the first rotating shaft to enable the surface of the ceramic product to fall into the irradiation range of the laser beams, wherein the embodiment belongs to thermal polishing, the surface of the ceramic product is directly heated to be below an evaporation temperature above a melting point temperature, the surface is smoothed through melting and resolidification of materials, and no materials are removed in the whole process. Can not cause surface damage and cracking of ceramic products, and can be adapted to ceramic products with various shapes.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser polishing method and laser polishing equipment.
Background
The traditional ceramic polishing processes such as grinding, polishing, milling and the like have high labor intensity, and in order to solve the technical problem, a method for polishing a ceramic product by adopting laser appears on the market, and the ceramic product is polished by ultrashort pulse laser, so that the automation degree is improved, and the labor force is released.
However, the ultrashort pulse laser polishing ceramic product mainly removes materials by destroying chemical bonds, is material reduction processing, does not solve the defect that the surface of the ceramic product is easily damaged by the traditional ceramic polishing processes such as grinding, milling and the like, and even can cause the breakage of a thinner ceramic product.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a laser polishing method and a laser polishing apparatus, so as to solve the problem that in the prior art, ultrashort pulse laser polishing ceramic products are subjected to material reduction processing, which is easy to damage the surface of the ceramic products, and even can cause breakage of thin ceramic products.
In a first aspect, an embodiment of the present invention provides a laser polishing method applied to a laser polishing device to polish a ceramic product, where the laser polishing device includes a frame, and an object stage, a rotating mechanism, a carbon dioxide continuous laser and a three-dimensional laser galvanometer mounted on the frame, the rotating mechanism is connected to the object stage, the three-dimensional laser galvanometer includes a plurality of groups of lenses, where one group of lenses can move relative to the other groups of lenses, the laser polishing method includes: controlling the carbon dioxide continuous laser to emit a laser beam, wherein the laser beam is focused and refracted to the surface of the ceramic product through the three-dimensional laser galvanometer so as to melt the material on the surface; and controlling one group of the lenses in the three-dimensional laser galvanometer to move relative to the other groups of the lenses so as to adjust the focal position of the laser beam, and controlling the rotating mechanism to drive the objective table to rotate around a first rotating shaft which is vertical to one surface of the ceramic product borne by the objective table and rotate around a second rotating shaft which is vertical to the first rotating shaft, so that the surface of the ceramic product falls into the irradiation range of the laser beam.
Further, before the controlling the carbon dioxide continuous laser to emit the laser beam, the method further includes: setting control parameters of laser polishing equipment; wherein the control parameters include polishing area and laser speed.
Further, the polishing area is more than or equal to 100mm2。
Further, the laser polishing device further comprises a water cooling mechanism connected with the carbon dioxide continuous laser and the three-dimensional laser galvanometer, and before setting control parameters of the laser polishing device, the laser polishing device further comprises: and starting a water cooling mechanism to cool the three-dimensional laser galvanometer and the carbon dioxide continuous laser.
Further, the laser polishing apparatus further includes a hermetic chamber installed on the frame, the stage and the rotating mechanism are installed in the hermetic chamber, and before controlling the carbon dioxide continuous laser to emit the laser beam, the apparatus further includes: and introducing inert gas into the sealed cabin provided with the object stage.
Further, the laser polishing apparatus further includes a beam expander installed on a light path between the carbon dioxide continuous laser and the three-dimensional laser galvanometer, wherein the controlling of the carbon dioxide continuous laser to emit a laser beam is performed by focusing and refracting the laser beam to the surface of the ceramic product through the three-dimensional laser galvanometer, so as to melt the material on the surface specifically includes: and after the beam diameter and the divergence angle of the laser beam are adjusted by adopting a beam expander, the laser beam is focused and refracted to the surface of the ceramic product through a three-dimensional laser vibrating mirror.
In a second aspect, an embodiment of the present invention further provides a laser polishing apparatus, including a frame; the object stage is arranged on the rack and used for bearing the ceramic product; the rotating mechanism comprises a first driving piece and a second driving piece which are connected with the objective table, the first driving piece is used for driving the objective table to rotate around a first rotating shaft which is vertical to the objective table, and the second driving piece is used for driving the objective table to rotate around a second rotating shaft which is vertical to the first rotating shaft; the carbon dioxide continuous laser is arranged on the frame and used for generating the laser beam; the three-dimensional laser galvanometer is arranged on the rack, a laser beam generated by the carbon dioxide continuous laser is focused and refracted to the surface of the ceramic product through the three-dimensional laser galvanometer, the three-dimensional laser galvanometer comprises a galvanometer driving piece and a plurality of groups of lenses, the plurality of groups of lenses are used for focusing and refracting the laser beam, and one group of lenses is driven by the galvanometer driving piece to move relative to the other groups of lenses so as to adjust the focal position of the laser beam; wherein the laser polishing apparatus polishes a ceramic product using the laser polishing method according to any one of the first aspect.
Further, the device also comprises a water cooling mechanism which is connected with the three-dimensional laser galvanometer and the carbon dioxide continuous laser.
Furthermore, the device also comprises a sealed cabin which is arranged on the rack, and the objective table and the rotating mechanism are arranged in the sealed cabin.
Further, the device also comprises a beam expander, wherein the beam expander is arranged on a light path between the carbon dioxide continuous laser and the three-dimensional laser galvanometer.
The embodiment of the invention has the beneficial effects that: the carbon dioxide continuous laser is controlled to emit laser beams, the laser beams are focused and refracted to the surface of the ceramic product through the three-dimensional laser galvanometer to melt materials on the surface, then one group of lenses in the three-dimensional laser galvanometer is controlled to move relative to the other groups of lenses to adjust the focal position of the laser beams, and the rotating mechanism is controlled to drive the objective table to rotate around a first rotating shaft perpendicular to one surface of the ceramic product carried by the objective table and rotate around a second rotating shaft perpendicular to the first rotating shaft, so that the surface of the ceramic product falls into the irradiation range of the laser beams. The embodiment belongs to thermal polishing, the surface of a ceramic product is directly heated to be higher than the melting point temperature and lower than the evaporation temperature, the surface is smoothed through melting and resolidification of materials, no material is removed in the whole process, and the method is a material-waiting processing mode. The method not only solves the defect that the surface of a ceramic product is easily damaged by the traditional ceramic polishing processes such as grinding, polishing, milling and the like, but also cannot cause the breakage of a thinner ceramic product, the surface of the ceramic product becomes smoother, the surface quality is obviously improved, and the microstructure of the material is more uniform. During polishing, the object stage rotates around the first rotating shaft to polish the peripheral surface of a ceramic product, the three-dimensional laser galvanometer is matched to polish the ceramic product with a curved surface, and the object stage is driven to rotate around the second rotating shaft perpendicular to the first rotating shaft, so that the surface of the ceramic product perpendicular to or close to the object stage can fall into the laser beam irradiation range, and therefore the laser polishing method of the embodiment can be adapted to the ceramic products in various shapes.
Drawings
The following detailed description of embodiments of the invention will be made with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic view of the overall structure of a laser polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a rotary mechanism and stage carrying a ceramic product in accordance with an embodiment of the present invention;
FIG. 3 is a partial schematic structural view of a laser polishing apparatus according to an embodiment of the present invention;
FIG. 4 is another partial schematic structural view of a laser polishing apparatus according to an embodiment of the present invention;
FIG. 5 is a flow chart of a laser polishing method of an embodiment of the present invention;
FIG. 6 is a detailed flow chart of a laser polishing method according to an embodiment of the present invention;
FIG. 7 is a detailed flow chart of a laser polishing method according to an embodiment of the present invention;
the figures are numbered:
1. laser polishing equipment; 11. a frame; 12. an object stage; 13. a rotation mechanism; 131. a first driving member; 132. a second driving member; 14. a carbon dioxide continuous laser; 15. a three-dimensional laser galvanometer; 16. a control computer; 17. a water cooling mechanism; 18. sealing the cabin; 19. an inert gas bottle; 10. a beam expander; 2. a laser polishing device; 21. a laser control module; 22. a load bearing control module; 23. a galvanometer control module; 24. a parameter setting module; 200. a ceramic product.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
An embodiment of the present invention provides a laser polishing apparatus 1, and as shown in fig. 1 to 4, the laser polishing apparatus 1 includes a frame 11, an object stage 12, a rotation mechanism 13, a carbon dioxide continuous laser 14, and a three-dimensional laser galvanometer 15. The stage 12 is mounted on the frame 11 for carrying the ceramic product 200. The rotating mechanism 13 includes a first driving element 131 and a second driving element 132 connected to the object stage 12, the first driving element 131 is used for driving the object stage 12 to rotate around a first rotation axis (Z axis) perpendicular to the object stage 12, and the second driving element 132 is used for driving the object stage 12 to rotate around a second rotation axis (Y axis) perpendicular to the first rotation axis. A carbon dioxide gas continuous laser 14 is mounted on the frame 11 for generating a laser beam (not shown). The three-dimensional laser galvanometer 15 is arranged on the frame 11, a laser beam generated by the carbon dioxide continuous laser 14 is focused and refracted to the surface of the ceramic product 200 through the three-dimensional laser galvanometer 15, the three-dimensional laser galvanometer 15 comprises a galvanometer driving part (not shown in the figure) and a plurality of groups of lenses (not shown in the figure), the plurality of groups of lenses are used for focusing and refracting the laser beam, and one group of lenses is driven by the galvanometer driving part to move relative to the other groups of lenses so as to adjust the focal position of the laser beam.
By implementing the embodiment, the carbon dioxide continuous laser 14 is used for generating laser beams to polish the ceramic product 200, which is different from the ultrashort pulse laser polishing ceramic product, the ultrashort pulse laser polishing ceramic product belongs to cold polishing, mainly removes materials by destroying chemical bonds, is a material reduction processing mode, the embodiment belongs to hot polishing, directly heats the surface of the ceramic product 200 to be below the evaporation temperature above the melting point temperature, smoothes the surface by melting and resolidifying the materials, and does not remove the materials in the whole process, so that the ceramic product is a material waiting processing mode. The defect that the surface of the ceramic product 200 is easily damaged by the traditional ceramic polishing processes such as grinding, polishing and milling is overcome, the thinner ceramic product 200 cannot be broken, the surface of the ceramic product 200 becomes smoother, the surface quality is obviously improved, and the microstructure of the material is more uniform.
During polishing, the first driving element 131 drives the object stage 12 to rotate around the first rotating shaft, so as to polish the peripheral surface of the ceramic product 200, and by matching with the three-dimensional laser galvanometer 15, the laser polishing device 1 can polish the ceramic product 200 with a curved surface, and the embodiment is further provided with the second driving element 132, wherein the second driving element 132 is used for driving the object stage 12 to rotate around the second rotating shaft (Y axis) perpendicular to the first rotating shaft, so that the surface of the ceramic product 200 perpendicular to or close to the object stage 12 can fall into the laser beam irradiation range, and therefore, the laser polishing device 1 of the embodiment can be adapted to the ceramic products 200 with various shapes.
In an exemplary embodiment, as shown in FIGS. 1-4, the laser polishing apparatus 1 further includes a control computer 16 coupled to the carbon dioxide continuous laser 14.
Specifically, the processing parameters such as polishing area, laser speed, etc. can be set by the control computer 16. Wherein the polishing area is preferably 100mm or more2Since the polishing area is too small, heat accumulation occurs, resulting in more molten material. The laser speed can be changed to change the laser energy densityThe slower the speed, the higher the laser energy and vice versa, which can be adjusted by the person skilled in the art depending on the actual situation.
In the embodiment, as shown in fig. 1-4, the laser polishing apparatus 1 further includes a water cooling mechanism 17, and the water cooling mechanism 17 is connected to the three-dimensional laser galvanometer 15 and the carbon dioxide continuous laser 14.
Specifically, when the laser polishing apparatus 1 operates, the three-dimensional laser galvanometer 15 and the carbon dioxide continuous laser 14 generate a large amount of heat, and in this embodiment, the water cooling mechanism 17 is adopted to cool the three-dimensional laser galvanometer 15 and the carbon dioxide continuous laser 14, so as to ensure that the three-dimensional laser galvanometer 15 and the carbon dioxide continuous laser 14 can operate for a long time and are not damaged by high temperature.
In a particular embodiment, the laser polishing apparatus 1 further comprises a sealed cabin 18. The hermetic chamber 18 is installed in the frame 11, the stage 12 is installed in the hermetic chamber 18, and an inert gas can be filled into the hermetic chamber 18 using an inert gas bottle 19 during processing.
Specifically, the inert gas is not necessarily used when polishing the ceramic product 200, and it depends on the material, if it is Al2O3Etc. which do not readily react with oxygen at high temperatures, do not require inert gas filling, but are Si3N4And inert gas is required to be introduced into the ceramic material which is easy to react with oxygen at high temperature so as to ensure the surface quality of the polished material.
In an embodiment, as shown in fig. 1 to 4, the laser polishing apparatus 1 further includes a beam expander 10, and the beam expander 10 is disposed on an optical path between the carbon dioxide continuous laser 14 and the three-dimensional laser galvanometer 15.
Specifically, the laser beam passes through the beam expander and is then refracted by the three-dimensional laser galvanometer 15 to the ceramic surface. Since the beam expander 10 can adjust the beam diameter and the divergence angle to reduce the focused spot, a smaller spot can achieve a higher energy density in laser polishing.
The embodiment of the present invention further provides a laser polishing method, which is applied to the above laser polishing apparatus 1 to polish the ceramic product 200, as shown in fig. 1 to 5, the laser polishing method includes:
step S110: controlling the carbon dioxide continuous laser 14 to emit a laser beam, and focusing and refracting the laser beam to the surface of the ceramic product 200 through the three-dimensional laser galvanometer 15 to melt the material on the surface;
step S120: one group of lenses in the three-dimensional laser galvanometer 15 is controlled to move relative to the other groups of lenses so as to adjust the focal position of the laser beam, and the rotating mechanism 13 is controlled to drive the object stage 12, so that the object stage 12 rotates around a first rotating shaft perpendicular to one surface of the object stage 12, which bears the ceramic product 200, and rotates around a second rotating shaft perpendicular to the first rotating shaft, so that the surface of the ceramic product 200 falls into the irradiation range of the laser beam.
By implementing the embodiment, the carbon dioxide continuous laser 14 is used for generating laser beams to polish the ceramic product 200, which is different from the ultrashort pulse laser polishing ceramic product, the ultrashort pulse laser polishing ceramic product belongs to cold polishing, mainly removes materials by destroying chemical bonds, is a material reduction processing mode, the embodiment belongs to hot polishing, directly heats the surface of the ceramic product 200 to be below the evaporation temperature above the melting point temperature, smoothes the surface by melting and resolidifying the materials, and does not remove the materials in the whole process, so that the ceramic product is a material waiting processing mode. The defect that the surface of the ceramic product 200 is easily damaged by the traditional ceramic polishing processes such as grinding, polishing and milling is overcome, the thinner ceramic product 200 cannot be broken, the surface of the ceramic product 200 becomes smoother, the surface quality is obviously improved, and the microstructure of the material is more uniform.
During polishing, the object stage 12 rotates around the first rotating shaft to polish the peripheral surface of the ceramic product 200, and the three-dimensional laser galvanometer 15 is matched to polish the ceramic product 200 with a curved surface, and in addition, the object stage 12 is driven to rotate around the second rotating shaft perpendicular to the first rotating shaft, so that the surface, perpendicular to or close to the object stage 12, of the ceramic product 200 can fall into the laser beam irradiation range, and therefore the laser polishing method of the embodiment can be adapted to the ceramic products 200 in various shapes.
In a specific embodiment, as shown in fig. 1 to 6, before step S110, step S1101 is further included: the control parameters of the laser polishing apparatus 1 are set. Wherein the control parameters include polishing area and laser speed.
Specifically, the polishing area is preferably 100mm or more2Since the polishing area is too small, heat accumulation occurs, resulting in more molten material. The laser speed can change the laser energy density, the slower the speed, the higher the laser energy, and vice versa, and the person skilled in the art can adjust the laser energy density according to the actual situation.
In a specific embodiment, as shown in fig. 1 to 6, before step S1101, step S1102 is further included: and starting the water cooling mechanism 17 to cool the three-dimensional laser galvanometer 15 and the carbon dioxide continuous laser 14.
Specifically, when the laser polishing apparatus 1 operates, the three-dimensional laser galvanometer 15 and the carbon dioxide continuous laser 14 generate a large amount of heat, and in this embodiment, the water cooling mechanism 17 is adopted to cool the three-dimensional laser galvanometer 15 and the carbon dioxide continuous laser 14 in advance, so as to ensure that the three-dimensional laser galvanometer 15 and the carbon dioxide continuous laser 14 can operate for a long time and are not damaged by high temperature.
In a specific embodiment, before step S1101, step S1103 is further included: an inert gas is introduced into a sealed chamber 18 in which the stage 12 is mounted.
Specifically, the inert gas is not necessarily used when polishing the ceramic product 200, and it depends on the material, if it is Al2O3Etc. which do not readily react with oxygen at high temperatures, do not require inert gas filling, but are Si3N4And inert gas is required to be introduced into the ceramic material which is easy to react with oxygen at high temperature so as to ensure the surface quality of the polished material.
In a specific embodiment, as shown in fig. 1 to 7, step S120 specifically includes: after the beam diameter and the divergence angle of the laser beam are adjusted by the beam expander 10, the laser beam is focused and refracted to the surface of the ceramic product by the three-dimensional laser vibrating mirror.
Specifically, the laser beam passes through the beam expander 10 and is then refracted to the ceramic surface by the three-dimensional laser galvanometer 15. Since the beam expander 10 can adjust the beam diameter and the divergence angle to reduce the focused spot, a smaller spot can achieve a higher energy density in laser polishing.
This embodiment shows a laser polishing method, as shown in fig. 1-5, by controlling a carbon dioxide continuous laser 14 to emit a laser beam, which is focused and refracted by a three-dimensional laser galvanometer 15 onto the surface of a ceramic product 200 to melt the material on the surface, then controlling one set of lenses of the three-dimensional laser galvanometer 15 to move relative to the other set of lenses to adjust the focal position of the laser beam, and controlling a rotating mechanism 13 to drive a stage 12 to rotate the stage 12 around a first rotating shaft perpendicular to the surface of the stage 12 carrying the ceramic product 200 and a second rotating shaft perpendicular to the first rotating shaft to make the surface of the ceramic product 200 fall within the irradiation range of the laser beam in this embodiment, which belongs to thermal polishing, directly heating the surface of the ceramic product 200 to a temperature above the melting point temperature and below the evaporation temperature, and smoothing the surface by melting and resolidification of the material, no material is removed in the whole process, and the method is a constant material processing mode. The defect that the surface of the ceramic product 200 is easily damaged by the traditional ceramic polishing processes such as grinding, polishing and milling is overcome, the thinner ceramic product 200 cannot be broken, the surface of the ceramic product 200 becomes smoother, the surface quality is obviously improved, and the microstructure of the material is more uniform. During polishing, the object stage 12 rotates around the first rotating shaft to polish the peripheral surface of the ceramic product 200, and the three-dimensional laser galvanometer 15 is matched to polish the ceramic product 200 with a curved surface, and in addition, the object stage 12 is driven to rotate around the second rotating shaft perpendicular to the first rotating shaft, so that the surface, perpendicular to or close to the object stage 12, of the ceramic product 200 can fall into the laser beam irradiation range, and therefore the laser polishing method of the embodiment can be adapted to the ceramic products 200 in various shapes.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations should fall within the scope of the appended claims.
Claims (10)
1. A laser polishing method is applied to laser polishing equipment to polish ceramic products, the laser polishing equipment comprises a rack, an object stage, a rotating mechanism, a carbon dioxide continuous laser and a three-dimensional laser galvanometer, wherein the object stage, the rotating mechanism, the carbon dioxide continuous laser and the three-dimensional laser galvanometer are arranged on the rack, the rotating mechanism is connected with the object stage, the three-dimensional laser galvanometer comprises a plurality of groups of lenses, one group of lenses can move relative to the other groups of lenses, and the laser polishing method is characterized by comprising the following steps:
controlling the carbon dioxide continuous laser to emit a laser beam, wherein the laser beam is focused and refracted to the surface of the ceramic product through the three-dimensional laser galvanometer so as to melt the material on the surface;
and controlling one group of the lenses in the three-dimensional laser galvanometer to move relative to the other groups of the lenses so as to adjust the focal position of the laser beam, and controlling the rotating mechanism to drive the objective table to rotate around a first rotating shaft which is vertical to one surface of the ceramic product borne by the objective table and rotate around a second rotating shaft which is vertical to the first rotating shaft, so that the surface of the ceramic product falls into the irradiation range of the laser beam.
2. The laser polishing method according to claim 1, further comprising, before said controlling said carbon dioxide continuous laser to emit a laser beam:
setting control parameters of laser polishing equipment;
wherein the control parameters include polishing area and laser speed.
3. The laser polishing method according to claim 2, characterized in that: the polishing area is more than or equal to 100mm2。
4. The laser polishing method according to claim 3, wherein the laser polishing apparatus further comprises a water cooling mechanism connected to the carbon dioxide continuous laser and the three-dimensional laser galvanometer, and before setting the control parameters of the laser polishing apparatus, the method further comprises:
and starting a water cooling mechanism to cool the three-dimensional laser galvanometer and the carbon dioxide continuous laser.
5. The laser polishing method according to claim 3, wherein the laser polishing apparatus further comprises a hermetic chamber installed on the machine frame, the stage and the rotating mechanism are installed in the hermetic chamber, and before controlling the carbon dioxide continuous laser to emit the laser beam, the laser polishing apparatus further comprises:
and introducing inert gas into the sealed cabin provided with the object stage.
6. The laser polishing method according to claim 2, wherein the laser polishing apparatus further comprises a beam expander disposed on an optical path between the carbon dioxide continuous laser and the three-dimensional laser galvanometer, and the controlling the carbon dioxide continuous laser to emit a laser beam, the laser beam being focused and refracted by the three-dimensional laser galvanometer to the surface of the ceramic product to melt the material of the surface specifically comprises:
and after the beam diameter and the divergence angle of the laser beam are adjusted by adopting a beam expander, the laser beam is focused and refracted to the surface of the ceramic product through a three-dimensional laser vibrating mirror.
7. A laser polishing apparatus for polishing a ceramic product by the laser polishing method according to any one of claims 1 to 6, comprising:
a frame;
the object stage is arranged on the rack and used for bearing the ceramic product;
the rotating mechanism comprises a first driving piece and a second driving piece which are connected with the objective table, the first driving piece is used for driving the objective table to rotate around a first rotating shaft which is vertical to the objective table, and the second driving piece is used for driving the objective table to rotate around a second rotating shaft which is vertical to the first rotating shaft;
the carbon dioxide continuous laser is arranged on the frame and used for generating the laser beam;
the three-dimensional laser galvanometer is arranged on the rack, a laser beam generated by the carbon dioxide continuous laser is focused and refracted to the surface of the ceramic product through the three-dimensional laser galvanometer, the three-dimensional laser galvanometer comprises a galvanometer driving piece and a plurality of groups of lenses, the plurality of groups of lenses are used for focusing and refracting the laser beam, and one group of lenses is driven by the galvanometer driving piece to move relative to the other groups of lenses so as to adjust the focal position of the laser beam.
8. The laser polishing apparatus according to claim 7, wherein: the device also comprises a water cooling mechanism which is connected with the three-dimensional laser galvanometer and the carbon dioxide continuous laser.
9. The laser polishing apparatus according to claim 7, wherein: the device also comprises a sealed cabin which is arranged on the rack, and the objective table and the rotating mechanism are arranged in the sealed cabin.
10. The laser polishing apparatus according to claim 7, wherein: the device also comprises a beam expander, wherein the beam expander is arranged on a light path between the carbon dioxide continuous laser and the three-dimensional laser galvanometer.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114178702A (en) * | 2021-11-30 | 2022-03-15 | 深圳信息职业技术学院 | Laser polishing device and polishing method |
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