CN113490344A - Flexible circuit board and preparation method thereof - Google Patents
Flexible circuit board and preparation method thereof Download PDFInfo
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- CN113490344A CN113490344A CN202110774820.6A CN202110774820A CN113490344A CN 113490344 A CN113490344 A CN 113490344A CN 202110774820 A CN202110774820 A CN 202110774820A CN 113490344 A CN113490344 A CN 113490344A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Abstract
The invention discloses a preparation method of a flexible circuit board, which comprises the following steps: (1) preparing a conductive copper layer on the surface of a carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer, the conductive copper layer is prepared on the surface of the stripping layer, and the conductive copper layer is etched to form a circuit layer; (2) the carrier layer and the circuit layer form a material supply roll; (3) respectively unreeling the two feeding rolls by means of the two unreeling devices, and respectively feeding the two feeding rolls between the two symmetrically arranged hot pressing devices; feeding the low dielectric material into a screw injection molding machine, feeding the processed molten material into the middle of the two circuit layers, and forming an insulating layer after hot pressing; and (4) preparing a thickened copper layer on the surface of the circuit layer after stripping the carrier layer. The process can obtain a thin copper layer, avoids the thin copper from being pulled to be easy to break, is beneficial to etching, and obtains a circuit board with small line width; the bonding force between the copper layer and the insulating layer can be improved, the copper-clad laminate is high-temperature resistant and heat resistant, the process is simple, the cost is low, and the production efficiency and the yield can be improved.
Description
Technical Field
The invention relates to the technical field of flexible circuit board preparation, in particular to a flexible circuit board and a preparation method thereof.
Background
In recent years, with the rapid development of the electronic industry, Printed Circuit boards (PCBs for short) play a key role in connecting and supporting electronic components. With the development of 5G communication, urgent needs are provided for a circuit board in terms of high frequency, low transmission loss, high density, high integration, and the like. The high-frequency flexible circuit board made of the low-dielectric material is mainly applied to an FPC (flexible printed circuit) antenna board for high-frequency signal transmission, and the terminal is applied to 5G mobile phones, Internet of things, smart homes, unmanned vehicles, VR (virtual reality) technologies and the like. Currently, for the preparation of circuit boards, polyimide films, polyester films and the like are generally used as substrates, then copper foils are laminated or a layer of copper foil is electroplated, a flexible copper-clad substrate is firstly prepared, and then a circuit is manufactured by etching through the traditional circuit manufacturing technology. However, the bonding force between the insulating substrate and the copper layer obtained by the manufacturing method is insufficient, so that the copper layer is easy to separate, the quality of the product is affected, and meanwhile, the high temperature resistance and the heat resistance are weak, and the manufacturing method is not suitable for the development of the 5G industry.
Therefore, it is necessary to provide a flexible circuit board and a method for manufacturing the same to solve the above drawbacks.
Disclosure of Invention
One of the objectives of the present invention is to provide a method for manufacturing a flexible printed circuit board, which can realize a thin copper layer, facilitate etching, improve the bonding force between the copper layer and the insulating layer, realize high temperature resistance and heat resistance, and has the advantages of simple process, low cost, and improved production efficiency and yield.
The second purpose of the present invention is to provide a flexible printed circuit board, which has good bonding force between the copper layer and the insulating layer, and good heat resistance.
In order to achieve the purpose, the invention discloses a preparation method of a flexible circuit board, which comprises the following steps:
(1) providing a carrier layer, preparing a conductive copper layer on the surface of the carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer prepared on the surface of the base material layer, preparing the conductive copper layer on the surface of the stripping layer, and etching the conductive copper layer to form a circuit layer;
(2) the carrier layer and the circuit layer form a rolled feeding roll;
(3) providing a hot pressing device, an unreeling device, a reeling device and a screw injection molding machine,
the two feeding rolls are respectively unreeled by means of the two unreeling devices, and are respectively sent between the two symmetrically arranged hot pressing devices, and the circuit layers of the two feeding rolls are far away from the hot pressing devices and are oppositely arranged;
the rolling device comprises a first rolling device for rolling the carrier layer and a second rolling device for rolling the product;
feeding a low dielectric material into the screw injection molding machine, feeding a molten material treated by the screw injection molding machine into the middle of the two circuit layers between the two hot pressing devices, and forming an insulating layer after hot pressing;
and after the carrier layer is stripped, preparing a thickened copper layer on the surface of the circuit layer with the insulating layer exposed.
Compared with the prior art, the preparation method of the flexible circuit board adopts the carrier layer as the carrier to carry out the preparation of the conductive copper layer, can prepare the thinner conductive copper layer, not only has convenient etching and lower cost, but also has accurate etching, and can improve the utilization rate of the circuit board and increase the data transmission effect. The base material layer is peeled by the aid of the peeling layer, the carrier layer is wound by the aid of the first winding device, the product is wound by the second winding device, a molten material processed by the screw injection molding machine is between the two circuit layers, the insulating layer is formed by hot-pressing and curing treatment of the hot-pressing device, the insulating layer and the circuit layers are embedded into each other, low dielectric materials are sprayed between the two circuit layers after being subjected to melting treatment by the aid of the screw injection molding machine, on one hand, binding force between the insulating layer and the circuit layers is improved, and on the other hand, high temperature resistance and heat resistance are effectively improved by the aid of the low dielectric materials. The process avoids the situation that the thin copper is easy to break due to tension, and realizes high yield and high yield of the flexible circuit board.
Preferably, the substrate layer is selected from a metal substrate or a non-metal substrate.
Preferably, the metal substrate is selected from copper, aluminum or stainless steel.
Preferably, the thickness of the conductive copper layer is 0.5 μm to 18 μm.
Preferably, the low dielectric material is at least one selected from the group consisting of Liquid Crystal Polymer (LCP), Modified Polyimide (MPI), polyphenylene sulfide (PPS), polytetrafluoroethylene resin (PTFE), polyether ether ketone resin (PEEK), polyether ketone resin (PEKK), thermosetting cyanate resin (CE), thermosetting polyphenylene ether resin (PPE), and polyimide resin (PI).
Preferably, the conductive copper layer is prepared on the surface of the stripping layer by means of vacuum magnetron sputtering, chemical plating, water electroplating or chemical copper deposition.
Preferably, a vacuum area is arranged between a nozzle of the screw injection molding machine and the two hot pressing devices.
Preferably, two symmetrically arranged hot press rollers are arranged between the hot press device and the winding device, and the two hot press rollers are used for hot pressing the two circuit layers and the molten material positioned between the two circuit layers again.
Preferably, a metal layer is prepared on the surface of the carrier layer through vacuum magnetron sputtering, a copper foil layer is prepared on the surface of the metal layer through electroplating or chemical copper deposition, and the conductive copper layer is formed on the metal layer and the copper foil layer.
Preferably, the metal layer is a Cu layer, a Ni layer, a Cu/Ni layer or an Ag layer.
On the other hand, the invention also provides a flexible circuit board which is prepared by the preparation method, and the copper layer and the insulating layer have good bonding force and good high-temperature resistance and heat resistance.
Drawings
FIG. 1: FIG. 1(a) shows a schematic structural view of a carrier layer for the present application for the preparation of a conductive copper layer; FIG. 1(b) is a schematic diagram showing the structure of the conductive copper layer etched into the wiring layer shown in FIG. 1(a), which is also a cross-sectional view of the supply roll.
FIG. 2: fig. 2(a) shows a schematic structural diagram of a carrier layer of the present application for preparing a metal layer and a copper foil layer; fig. 2(b) is a schematic structural view of the metal layer and the copper foil layer etched to form the circuit layer shown in fig. 2(a), and is a cross-sectional view of another embodiment of the supply roll.
Fig. 3 shows a schematic flow chart of the processing device of the flexible circuit board of the present application.
Fig. 4 shows an enlarged view at a in fig. 3.
FIG. 5: FIG. 5(a) is a schematic diagram of the structure of the product from the supply roll of FIG. 1 processed by the processing apparatus of FIG. 3, showing the circuit layer embedded in the insulating layer; FIG. 5(b) shows a schematic diagram of a thickened copper layer formed on the wiring layer shown in FIG. 5 (a).
FIG. 6: FIG. 6(a) is a schematic diagram of the structure of the product from the supply roll of FIG. 2 processed by the processing apparatus of FIG. 3, showing the circuit layer embedded in the insulating layer; FIG. 6(b) shows a schematic diagram of a thickened copper layer formed on the wiring layer shown in FIG. 6 (a).
Description of the symbols:
the device comprises a carrier layer 10, a base material layer 11, a stripping layer 13, a conductive copper layer 20, a metal layer 21, a copper foil layer 23, a circuit layer 30, an insulating layer 40, a thickened copper layer 50, a hot-pressing device 60, an unreeling device 70, a first reeling device 81, a second reeling device 83, a screw injection molding machine 90, a hopper 91, a charging barrel 93, a nozzle 95, a hot-pressing mechanism 100, a cutting device 110 and an auxiliary roller 120.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a preparation method of a flexible circuit board, which comprises the following steps:
(1) providing a carrier layer, preparing a conductive copper layer on the surface of the carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer prepared on the surface of the base material layer, preparing the conductive copper layer on the surface of the stripping layer, and etching the conductive copper layer to form a circuit layer;
(2) the carrier layer and the circuit layer form a rolled feeding roll;
(3) providing a hot pressing device, an unreeling device, a reeling device and a screw injection molding machine,
the two feeding rolls are respectively unreeled by means of the two unreeling devices and are respectively sent between the two symmetrically arranged hot pressing devices, and the circuit layers of the two feeding rolls are far away from the hot pressing devices and are oppositely arranged;
the winding device comprises a first winding device for winding the carrier layer and a second winding device for winding the product;
feeding the low dielectric material into a screw injection molding machine, feeding the molten material treated by the screw injection molding machine into the middle of two conductive copper layers between two hot pressing devices, and forming an insulating layer after hot pressing;
and after the carrier layer is stripped, preparing a thickened copper layer on the surface of the circuit layer with the insulating layer exposed.
The method of making the flexible wiring board of the present application is further illustrated below with the aid of fig. 1-6, as follows:
in the technical solution of the present invention, referring to fig. 1(a), the carrier layer 10 includes a substrate layer 11 and a peeling layer 13 prepared on a surface of the substrate layer 11, a conductive copper layer 20 is prepared on a surface of the peeling layer 13, and the peeling layer 13 is used for removing the carrier layer 10. The substrate layer 11 is selected from a metal substrate or a non-metal substrate, and the provision of the substrate layer 11 can provide support guarantee for the subsequent preparation of the conductive copper layer 20. The metal substrate may be, but is not limited to, copper, aluminum, or stainless steel; the non-metallic substrate may be, but is not limited to, PET, PEN, PP, PI, PC. Preferably, a non-metallic substrate is provided. In actual preparation, the surface of the substrate layer 11 is pretreated to obtain a suitable surface tension. Preferably, the method of pretreatment may be, but is not limited to, corona or chemical treatment, or the like. Wherein, in order to ensure a certain supporting force, the thickness of the substrate layer 11 is 25 μm-100 μm. For example, the thickness of the substrate layer 11 may be, but is not limited to, 25 μm, 35 μm, 45 μm, 55 μm, 65 μm, 75 μm, 85 μm, 95 μm, 100 μm.
In the technical solution of the present invention, please refer to fig. 1(a) continuously, the peeling layer 13 is prepared on the surface of the substrate layer 11, and the forming manner of the peeling layer 13 is not limited to bonding, printing, injection molding, pressing, etc. In this embodiment, a release layer 13 is bonded to the surface of the base layer 11. The peeling layer 13 can be peeled off from the conductive copper layer 20 (the circuit layer 30 after etching) so as to remove the substrate layer 11, the peeling layer 13 is separated from the substrate layer 11 by operation, the substrate layer 11 is separated from the circuit layer 30 by the peeling layer 13, therefore, the circuit layer 30 and the molten material are embedded into each other under the action of hot pressing, the circuit layer 30 is embedded into the insulating layer 40 after molding, and the bonding force between the circuit layer 30 and the insulating layer 40 is greatly improved. Further, the peeling layer 13 may be made of silicon, fluorine, non-silicon, or the like, or may be made of a release material.
In the technical solution of the present invention, please refer to fig. 1(a) continuously, after the peeling layer 13 is prepared, the conductive copper layer 20 is prepared on the surface of the peeling layer 13, and the conductive copper layer 20 may be formed by, but not limited to, vacuum magnetron sputtering, chemical plating, water electroplating, chemical copper deposition, and other technical means. By the above-described means, an extremely thin conductive copper layer 20 can be obtained on the surface of the peeling layer 13, facilitating etching. The thickness of the conductive copper layer 20 is 0.5 μm to 18 μm, for example, the thickness of the conductive copper layer 20 may be, but is not limited to, 0.5 μm, 1 μm, 3 μm, 5 μm, 7 μm, 9 μm, 11 μm, 13 μm, 15 μm, 17 μm, 18 μm. Preferably, the thickness of the conductive copper layer 20 is 2 μm to 9 μm.
In a preferred embodiment of the above technical solution, referring to fig. 2(a), the conductive copper layer 20 includes a metal layer 21 and a copper foil layer 23 located on a surface of the metal layer 21. Preparing a metal layer 21 on the surface of the stripping layer 13 by vacuum magnetron sputtering, preparing a copper foil layer 23 on the surface of the metal layer 21 by electroplating or chemical copper deposition, and forming a conductive copper layer 20 on the metal layer 21 and the copper foil layer 23. Firstly, a thin metal layer 21 is formed on the surface of the stripping layer 13 through vacuum magnetron sputtering, and then a copper foil layer 23 is formed on the surface of the metal layer 21 through electroplating or chemical copper deposition, so that the cost is reduced, and the yield and the productivity are improved. Further, the metal layer 21 is a Cu layer, a Ni layer, a Cu/Ni layer, or an Ag layer. Preferably, the metal layer 21 is a Cu/Ni layer, which is beneficial to improve the performance of the circuit board.
In the technical solution of the present invention, referring to fig. 1(b), after the conductive copper layer 20 is prepared, the conductive copper layer 20 is etched to form the circuit layer 30. Since the conductive copper layer 20 has a small thickness, the etching process is easy, a small line width can be obtained, for example, the line width is 2 μm, the line distance is 3 μm, the transmission speed is increased, the amount of the etching solution is small, and the method is environment-friendly and low in cost. Further, referring to fig. 2(b), the conductive copper layer 20 includes a metal layer 21 and a copper foil layer 23, and both the metal layer 21 and the copper foil layer 23 are etched to form a circuit layer 30. Among them, the etching process is a common manner in the art and will not be described herein.
In the technical scheme of the invention, after the conductive copper layer 20 is etched into the circuit layer 30, the carrier layer 10 and the circuit layer 30 form a rolled material supply roll, and the carrier layer 10 and the circuit layer 30 are prepared and then the material supply roll is obtained in a rolling mode for subsequent processes. Because the peeling layer 13 in the carrier layer 10 has a certain adhesion with the conductive copper layer 20, after the conductive copper layer 20 is etched into the circuit layer 30, the circuit layer 30 is not separated from the carrier layer 10 under the condition of no external force, and the circuit layer 30 and the carrier layer 10 are made into a supply roll for standby.
In the technical solution of the present invention, please refer to fig. 3, a hot pressing device 60, an unwinding device 70, a winding device, and a screw injection molding machine 90 are provided. The hot pressing device 60 is provided with at least 2 and is symmetrically arranged. The screw injection molding machine 90 includes a hopper 91, a cylinder 93, and a nozzle 95, and a low dielectric material is fed from the hopper 91, enters the cylinder 93, is heated and melted in the cylinder 93, and is ejected through the nozzle 95. Because this application flexible line way board is two-sided flexible line way board, consequently, need provide 2 material supply rolls up, is equipped with 2 unwinding device 70 simultaneously and rolls up 2 material supplies and unreel respectively. And 2 first winding devices 81 are provided for winding the carrier layer 10 removed from the corresponding supply roll, and a second winding device 83 is provided for winding the product (i.e. the semi-finished product or the finished product). In this embodiment, two hot pressing devices 60 are symmetrically disposed on two sides of the material spraying direction of the nozzle 95 of the screw injection molding machine 90, one unwinding device 70 and one first winding device 81 are disposed on one side of the hot pressing device 60, the other unwinding device 70 and the other first winding device 81 are disposed on one side of the hot pressing device 60, the unwinding devices 70 unwind the feeding rolls respectively, and the carrier layer 10 of the feeding rolls is wound by the first winding device 81 to drive the peeling layer 13 to be separated from the circuit layer 30 (see fig. 4), i.e., peel the carrier layer 10. The hot press device 60 provides hot pressing to the circuit layer 30 through the carrier layer 10, the gap between the two circuit layers 30 is filled with the molten material sprayed from the nozzle 95 of the screw injection molding machine 90, the two hot press devices 60 perform hot press solidification, the molten material forms the insulating layer 40, and the circuit layer 30 is embedded in the insulating layer 40. Further, a vacuum area is formed between the nozzle 95 of the screw injection molding machine 90 and the two hot pressing devices 60, that is, the material sprayed from the nozzle 95 of the screw injection molding machine 90 is sprayed between the two circuit layers 30 in a vacuum environment and is heated, pressurized and cured by the two hot pressing devices 60 to form the insulating layer 40, so that the performance of the flexible circuit board is improved.
In the technical solution of the present invention, referring to fig. 3, two hot pressing mechanisms 100 are symmetrically disposed between the hot pressing device 60 and the winding device, and the two hot pressing mechanisms 100 are used for hot pressing the two circuit layers 30 and the molten material located between the two circuit layers 30 again. Namely, after the first hot press curing by the two hot press devices 60, the second hot press curing is performed by the two hot press mechanisms 100, so as to improve the curing and adhesion performance. It should be noted that, in the technical solution, a plurality of auxiliary rollers 120 are further provided to ensure the smooth operation of the winding devices, in this embodiment, two auxiliary rollers 120 are respectively and correspondingly arranged in front of the two first winding devices 81. In order to meet different requirements, a cutting device 110 is arranged before the product is rolled, so that a laminated flexible circuit board can be obtained.
In the technical scheme of the invention, the insulating layer 40 is made of a low dielectric material, and is injected between the two circuit layers 30 by the screw injection molding machine 90 in an injection molding manner, so that the adhesive force between the insulating layer 40 and the circuit layers 30 can be effectively improved, and meanwhile, the low dielectric material can bring the advantages of high temperature resistance and heat resistance. The low dielectric material may be, but is not limited to, Liquid Crystal Polymer (LCP), Modified Polyimide (MPI), polyphenylene sulfide (PPS), polytetrafluoroethylene resin (PTFE), epoxy resin (EP), bismaleimide triazine resin (BT), thermosetting cyanate resin (CE), thermosetting polyphenylene ether resin (PPE), and polyimide resin (PI). Preferably, the low dielectric material employs Liquid Crystal Polymer (LCP) and Modified Polyimide (MPI). In the embodiment of the present application, a Liquid Crystal Polymer (LCP) is injected into the screw injection molding machine 9070, and is ejected to the middle of the two circuit layers 30 under the heating and melting effects of the screw injection molding machine 90.
In the present invention, referring to fig. 5(a), fig. 5(b), fig. 6(a) and fig. 6(b), after obtaining a product in which the circuit layer 30 is embedded in the insulating layer 40, a thickened copper layer 50 is prepared on the surface of the circuit layer 30 where the insulating layer 40 is exposed. Namely, a thicker thickened copper layer 50 is obtained on the surface of the circuit layer 30 to improve the conveying capacity of the flexible circuit board. It will be appreciated that the present application is a double-sided copper layer, and thus, both double-sided wiring layers 30 produce a thickened copper layer 50. In particular, the thickened copper layer 50 can be formed by electrolytic copper plating, electroless copper plating or electroless copper plating. In this embodiment, a layer of copper is plated on the surface of the circuit layer 30 by electroplating to increase the thickness of the circuit layer 30 in the insulating layer 40, and the specific thickness is obtained as required. Because the circuit layer 30 is embedded in the insulating layer 40, the adhesion, the stability and the service life between the circuit layer 30 and the insulating layer 40 are effectively guaranteed.
Compared with the prior art, the preparation method of the flexible circuit board adopts the carrier layer 10 as the carrier to carry out the preparation of the conductive copper layer 20, can prepare the thin conductive copper layer 20, has convenient etching and low cost, is accurate in etching, and can improve the utilization rate of the circuit board and increase the data transmission effect. The base material layer 11 is peeled by the aid of the peeling layer 13, the carrier layer 10 is wound by the aid of the first winding device 81, a product is wound by the aid of the second winding device 83, the carrier layer is peeled, molten materials processed by the screw injection molding machine 90 between the two circuit layers 30 are subjected to hot-pressing and curing treatment by the hot-pressing device 60 to form the insulating layer 40, the insulating layer 40 and the circuit layers 30 are embedded into each other, low-dielectric materials are subjected to melting treatment by the aid of the screw injection molding machine 90 and then are sprayed between the two circuit layers 30, and therefore on one hand, the bonding force between the insulating layer 40 and the circuit layers 30 is improved, and on the other hand, the high temperature resistance and the heat resistance are effectively improved due to the use of the low-dielectric materials. The process can obtain a thin copper layer, is beneficial to etching, avoids the situation that the thin copper is easy to break due to tension, and realizes high yield and high yield of the flexible circuit board.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A preparation method of a flexible circuit board is characterized by comprising the following steps:
(1) providing a carrier layer, preparing a conductive copper layer on the surface of the carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer prepared on the surface of the base material layer, preparing the conductive copper layer on the surface of the stripping layer, and etching the conductive copper layer to form a circuit layer;
(2) the carrier layer and the circuit layer form a rolled feeding roll;
(3) providing a hot pressing device, an unreeling device, a reeling device and a screw injection molding machine,
the two feeding rolls are respectively unreeled by means of the two unreeling devices, and are respectively sent between the two symmetrically arranged hot pressing devices, and the circuit layers of the two feeding rolls are far away from the hot pressing devices and are oppositely arranged;
the rolling device comprises a first rolling device for rolling the carrier layer and a second rolling device for rolling the product;
feeding a low dielectric material into the screw injection molding machine, feeding a molten material treated by the screw injection molding machine into the middle of the two circuit layers between the two hot pressing devices, and forming an insulating layer after hot pressing;
and after the carrier layer is stripped, preparing a thickened copper layer on the surface of the circuit layer with the insulating layer exposed.
2. The method of manufacturing a flexible wiring board according to claim 1, wherein the base material layer is selected from a metal base material and a non-metal base material.
3. The method of manufacturing a flexible wiring board according to claim 2, wherein the metal substrate is selected from copper, aluminum, and stainless steel.
4. The method of manufacturing a flexible wiring board according to claim 1, wherein the thickness of the conductive copper layer is 0.5 μm to 18 μm.
5. The method for producing a flexible wiring board according to claim 1, wherein the low dielectric material is at least one selected from the group consisting of liquid crystal high molecular polymers, modified polyimides, polyphenylene sulfides, polytetrafluoroethylene resins, polyether ether ketone resins, polyether ketone resins, thermosetting cyanate resins, thermosetting polyphenylene ether resins, and polyimide resins.
6. The method of claim 1, wherein the conductive copper layer is formed on the surface of the release layer by vacuum magnetron sputtering, electroless plating, water electroplating or electroless copper plating.
7. The method according to claim 1, wherein two symmetrically disposed hot press rollers are disposed between the hot press device and the take-up device, and the two hot press rollers are used for hot pressing the two circuit layers and the molten material located between the two circuit layers again.
8. The method of claim 1, wherein a metal layer is prepared on the surface of the carrier layer by vacuum magnetron sputtering and a copper foil layer is prepared on the surface of the metal layer by electroplating or electroless copper plating, and the metal layer and the copper foil layer form the conductive copper layer.
9. The method of manufacturing a flexible wiring board according to claim 8, wherein the metal layer is a Cu layer, a Ni layer, a Cu/Ni layer, or an Ag layer.
10. A flexible wiring board produced by the production method according to any one of claims 1 to 9.
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