CN113386417A - Copper-clad plate and preparation method thereof - Google Patents
Copper-clad plate and preparation method thereof Download PDFInfo
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- CN113386417A CN113386417A CN202110775297.9A CN202110775297A CN113386417A CN 113386417 A CN113386417 A CN 113386417A CN 202110775297 A CN202110775297 A CN 202110775297A CN 113386417 A CN113386417 A CN 113386417A
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- Engineering & Computer Science (AREA)
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Abstract
The invention discloses a copper-clad plate and a preparation method thereof, wherein the preparation method comprises the following steps: (1) preparing a conductive copper layer on the surface of a carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer, and the conductive copper layer is prepared on the surface of the stripping layer; (2) the carrier layer and the conductive copper layer form a rolled feeding roll; (3) the hot pressing device, the unreeling device, the reeling device and the screw injection molding machine are provided, the two material supply rolls are respectively unreeled by means of the two unreeling devices and are respectively sent between the two hot pressing devices which are symmetrically arranged, and the conductive copper layers of the two material supply rolls are far away from the hot pressing devices and are oppositely arranged; the winding device comprises a first winding device and a second winding device; and (3) feeding the low dielectric material into a screw injection molding machine, feeding the molten material treated by the screw injection molding machine into the middle of two conductive copper layers between two hot pressing devices, and forming an insulating layer after hot pressing to obtain the copper-clad plate. The process avoids the situation that the thin copper is easy to break due to tension, realizes that the copper foil in the copper-clad plate is thinner, and can improve the production efficiency and yield.
Description
Technical Field
The invention relates to the technical field of preparation of copper-clad plates, in particular to a copper-clad plate and a preparation method thereof.
Background
In recent years, with the rapid development of the electronic industry, Printed Circuit boards (PCBs for short) play a key role in connecting and supporting electronic components, and Copper Clad Laminates (CCLs) are basic materials of Circuit boards, so that the Printed Circuit boards are widely applied to numerous electronic products.
According to the difference of base materials in the copper clad laminate, the copper clad laminate can be generally divided into a rigid copper clad laminate which is not easy to bend and a bendable flexible copper clad laminate, wherein the bendable flexible copper clad laminate has the outstanding advantage of reducing the volume and the weight of equipment.
Wearable and portable intelligent equipment becomes indispensable necessities in daily life of people, such as smart phones, watches, tablet computers and the like, and the equipment is increasingly pursued to be short, light, thin, multifunctional and high-speed in signal transmission, so that the demand on a flexible copper-clad plate is increased under the condition that the application is rapidly developed.
Polyimide (PI), Polyester (PET), Polynaphthalene Ester (PEN) and the like are mainly used in flexible radio frequency antenna circuit board materials in the market at present, the PET and the PEN are poor in heat resistance and high in PI water absorption rate, the defects can cause curling of a substrate film and reduction of peeling strength of a copper foil, and simultaneously, dielectric properties can be reduced, and transmission of electric signals is influenced finally.
The Liquid Crystal Polymer (LCP) material is used as a thermoplastic resin, has good mechanical properties and heat resistance, high dimensional stability, low thermal expansion coefficient, low dielectric constant, low loss, and other properties, can completely avoid the above disadvantages, and is especially applicable to fifth-generation communication devices.
For the thermoplastic liquid crystal polymer flexible copper clad laminate, as shown in fig. 1, in the prior art, LCP is firstly made into a film, then a Roll structure of the LCP film is obtained, and then the LCP film is composited with a copper foil, namely, a Roll-to-Roll (Roll) high-temperature Roll is mainly adopted for hot pressing, and the copper foil and the LCP film are directly fed into the high-temperature Roll for hot pressing in a one-step hot pressing forming mode. Wherein, in fig. 1, each symbol is represented as: LCP unwinding device 1, LCP film 2, heating device 3, copper foil unwinding device 4 and 5, copper foil 6, hot press unit 7, goods coiling mechanism 8. In the preparation process, the copper foil cannot be thinner, otherwise the copper foil is easy to break, and the production efficiency is low. With the development of miniaturization of electronic products, the circuit board is required to have higher wiring density, and the copper foil of the copper-clad plate is required to be further reduced in thickness and developed to 18 microns or even thinner.
Therefore, it is necessary to provide a copper-clad plate and a method for preparing the same to solve the above drawbacks.
Disclosure of Invention
The invention aims to provide a preparation method of a copper-clad plate, which realizes that a copper foil in the copper-clad plate is thinner and can improve the production efficiency and yield.
The invention also aims to provide a copper-clad plate which has good high-temperature resistance and heat resistance.
In order to realize the purpose, the invention discloses a preparation method of a copper-clad plate, which comprises the following steps:
(1) providing a carrier layer, preparing a conductive copper layer on the surface of the carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer prepared on the surface of the base material layer, and the conductive copper layer is prepared on the surface of the stripping layer;
(2) the carrier layer and the conductive copper layer form a rolled feeding roll;
(3) providing a hot pressing device, an unreeling device, a reeling device and a screw injection molding machine,
respectively unreeling the two feeding rolls by means of the two unreeling devices, respectively sending the two feeding rolls between the two symmetrically arranged hot pressing devices, and oppositely arranging the conductive copper layers of the two feeding rolls away from the hot pressing devices;
the rolling device comprises a first rolling device for rolling the carrier layer and a second rolling device for rolling the product;
and feeding the low dielectric material into the screw injection molding machine, feeding the molten material processed by the screw injection molding machine into the middle of the two conductive copper layers between the two hot pressing devices, and forming an insulating layer after hot pressing to obtain the copper-clad plate.
Compared with the prior art, the preparation method of the copper-clad plate adopts the carrier layer as the bearing to prepare the conductive copper layer, and can prepare the thinner conductive copper layer. The base material layer is peeled by the aid of the peeling layer, the carrier layer is wound by the aid of the first winding device, the product is wound by the second winding device, a molten material processed by the screw injection molding machine is between the two conductive copper layers, the insulating layer is formed by hot-pressing and curing treatment of the hot-pressing device, and low dielectric materials are subjected to melting treatment by the screw injection molding machine, so that the binding force between the insulating layer and the conductive copper layers is improved, and high temperature resistance and heat resistance are effectively improved by using the low dielectric materials. The process avoids the situation that the thin copper is easy to break due to tension, realizes that the copper foil (namely the conductive copper layer) in the copper-clad plate is thinner, and can improve the production efficiency and the yield.
Preferably, the substrate layer is selected from a metal substrate or a non-metal substrate.
Preferably, the metal substrate is selected from copper, aluminum or stainless steel.
Preferably, the thickness of the conductive copper layer is 0.5 μm to 18 μm.
Preferably, the low dielectric material is at least one selected from the group consisting of Liquid Crystal Polymer (LCP), Modified Polyimide (MPI), polyphenylene sulfide (PPS), polytetrafluoroethylene resin (PTFE), polyether ether ketone resin (PEEK), polyether ketone resin (PEKK), thermosetting cyanate resin (CE), thermosetting polyphenylene ether resin (PPE), and polyimide resin (PI).
Preferably, a vacuum area is arranged between a nozzle of the screw injection molding machine and the two hot pressing devices.
Preferably, two hot press rollers are symmetrically arranged between the hot press device and the winding device, and the two hot press rollers are used for hot pressing the two conductive copper layers and the molten material positioned between the two conductive copper layers again.
Preferably, a metal layer is prepared on the surface of the carrier layer through vacuum magnetron sputtering, a copper foil layer is prepared on the surface of the metal layer through electroplating or chemical copper deposition, and the conductive copper layer is formed on the metal layer and the copper foil layer.
Preferably, the metal layer is a Cu layer, a Ni layer, a Cu/Ni layer or an Ag layer.
On the other hand, the invention also provides a copper-clad plate which is prepared by the preparation method and has good high-temperature resistance and heat resistance.
Drawings
Fig. 1 shows a schematic flow diagram of a processing device for a copper-clad plate in the prior art.
Fig. 2 shows a cross-sectional view of the supply roll in the present application.
Fig. 3 shows a cross-sectional view of another embodiment of the supply roll shown in fig. 2.
Fig. 4 shows a schematic flow diagram of a processing device for a copper-clad plate according to the present application.
Description of the symbols:
the device comprises a carrier layer 10, a substrate layer 11, a stripping layer 13, a cutting device 20, a conductive copper layer 30, a metal layer 31, a copper foil layer 33, a hot pressing device 40, an unwinding device 50, a first winding device 61, a second winding device 63, a screw injection molding machine 70, a hopper 71, a charging barrel 73, a nozzle 75, an auxiliary roller 90 and an insulating layer 200.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a preparation method of a copper-clad plate, which comprises the following steps:
(1) providing a carrier layer, preparing a conductive copper layer on the surface of the carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer prepared on the surface of the base material layer, and preparing the conductive copper layer on the surface of the stripping layer;
(2) the carrier layer and the conductive copper layer form a rolled feeding roll;
(3) providing a hot pressing device, an unreeling device, a reeling device and a screw injection molding machine,
the two feeding rolls are respectively unreeled by means of the two unreeling devices and are respectively sent between the two symmetrically arranged hot pressing devices, and the conductive copper layers of the two feeding rolls are far away from the hot pressing devices and are oppositely arranged;
the winding device comprises a first winding device for winding the carrier layer and a second winding device for winding the product;
and (3) feeding the low dielectric material into a screw injection molding machine, feeding the molten material treated by the screw injection molding machine into the middle of two conductive copper layers between two hot pressing devices, and forming an insulating layer after hot pressing to obtain the copper-clad plate.
The preparation method of the copper-clad plate of the present application is further illustrated below with reference to fig. 1 to 4, as follows:
in the technical solution of the present invention, referring to fig. 2, the carrier layer 10 includes a substrate layer 11 and a peeling layer 13 prepared on a surface of the substrate layer 11, a conductive copper layer 30 is prepared on a surface of the peeling layer 13, and the peeling layer 13 is used for removing the carrier layer 10. The substrate layer 11 is selected from a metal substrate or a non-metal substrate, and the provision of the substrate layer 11 can provide support guarantee for a subsequent process. The metal substrate may be, but is not limited to, copper, aluminum, or stainless steel; the non-metallic substrate may be, but is not limited to, PET, PEN, PP, PI, PC. Preferably, a non-metallic substrate is provided. In actual preparation, the surface of the substrate layer 11 is pretreated to obtain a suitable surface tension. Preferably, the method of pretreatment may be, but is not limited to, corona or chemical treatment, or the like. Wherein, in order to ensure a certain supporting force, the thickness of the substrate layer 11 is 25 μm-100 μm. For example, the thickness of the substrate layer 11 may be, but is not limited to, 25 μm, 35 μm, 45 μm, 55 μm, 65 μm, 75 μm, 85 μm, 95 μm, 100 μm.
In the technical solution of the present invention, please refer to fig. 2 again, the peeling layer 13 is prepared on the surface of the substrate layer 11, and the forming manner of the peeling layer 13 is not limited to bonding, printing, injection molding, pressing, etc. In this embodiment, a release layer 13 is bonded to the surface of the base layer 11. The peeling layer 13 can be peeled off with the conductive copper layer 30 so as to remove the substrate layer 11, the peeling layer 13 is operated to separate the substrate layer 11 so as to remove the substrate layer 11, the substrate layer 11 is separated from the conductive copper layer 30 by means of the peeling layer 13, therefore, the ultrathin copper foil can adapt to the process, the situation of fracture can not occur, the copper-clad plate made of thin copper can be realized, and the production yield can be improved. Further, the peeling layer 13 may be made of silicon, fluorine, non-silicon, or the like, or may be made of a release material.
In the technical solution of the present invention, please refer to fig. 2 again, after the peeling layer 13 is prepared, the conductive copper layer 30 is prepared on the surface of the peeling layer 13, and the forming manner of the conductive copper layer 30 may be, but not limited to, vacuum magnetron sputtering, chemical plating, water electroplating, chemical copper deposition, and other technical means. By the above-described means, an extremely thin conductive copper layer 30 can be obtained on the surface of the peeling layer 13. The thickness of the conductive copper layer 30 is 0.5 μm to 18 μm, for example, the thickness of the conductive copper layer 30 may be, but is not limited to, 0.5 μm, 1 μm, 3 μm, 5 μm, 7 μm, 9 μm, 11 μm, 13 μm, 15 μm, 17 μm, 18 μm. Preferably, the thickness of the conductive copper layer 30 is 2 μm to 9 μm.
In a preferred embodiment of the above technical solution, referring to fig. 3, the conductive copper layer 30 includes a metal layer 31 and a copper foil layer 33 located on a surface of the metal layer 31. Preparing a metal layer 31 on the surface of the stripping layer 13 by vacuum magnetron sputtering, preparing a copper foil layer 33 on the surface of the metal layer 31 by electroplating or chemical copper deposition, and forming a conductive copper layer 30 on the metal layer 31 and the copper foil layer 33. First, a thin metal layer 31 is formed on the surface of the peeling layer 13 by vacuum magnetron sputtering, and then a copper foil layer 33 is formed on the surface of the metal layer 31 by electroplating or chemical copper deposition, thereby reducing the cost and improving the yield and the productivity. Further, the metal layer 31 is a Cu layer, a Ni layer, a Cu/Ni layer, or an Ag layer. Preferably, the metal layer 31 is a Cu/Ni layer, and after the copper-clad plate is prepared into the circuit board, the Cu/Ni layer is beneficial to improving the performance of the circuit board.
In the technical scheme of the invention, the carrier layer 10 and the conductive copper layer 30 form a roll-shaped feeding roll, and the feeding roll can be obtained in a rolling mode after the carrier layer 10 and the conductive copper layer 30 are produced so as to be used in the subsequent process.
In the technical solution of the present invention, please refer to fig. 4, a hot press device 40, an unwinding device 50, a winding device, and a screw injection molding machine 70 are provided. The number of the hot-pressing devices 40 is at least 2, and the hot-pressing devices are symmetrically arranged. The screw injection molding machine 70 includes a hopper 71, a cylinder 73, and a nozzle 75, and a low dielectric material is fed from the hopper 71, enters the cylinder 73, is heated and melted in the cylinder 73, and is ejected through the nozzle 75. Because this application copper-clad plate is two-sided copper-clad plate, consequently, need provide 2 feed rolls of material, be equipped with 2 unwinding device 50 simultaneously and unreel respectively to 2 feed rolls. And 2 first winding devices 61 are provided for winding the carrier layer 10 removed from the corresponding supply roll, and a second winding device 63 is provided for winding the product (i.e., a semi-finished product or a finished product). In this embodiment, two hot pressing devices 40 are symmetrically disposed on two sides of the material spraying direction of the nozzle 75 of the screw injection molding machine 70, the unwinding device 50 and the first winding device 61 are disposed on one side of the hot pressing device 40, the other unwinding device 50 and the other first winding device 61 are disposed on one side of the hot pressing device 40, the unwinding devices 50 unwind the feeding roll respectively, the carrier layer 10 of the feeding roll is wound by the first winding device 61 to drive the peeling layer 13 to be separated from the conductive copper layer 30, the two conductive copper layers 30 move by the winding tension of the second winding device 63, the gap between the two conductive copper layers 30 is filled with the molten material sprayed by the nozzle 75 of the screw injection molding machine 70, and hot pressing and curing are performed by the two hot pressing devices 40. Further, a vacuum area is formed between the nozzle 75 of the screw injection molding machine 70 and the two hot pressing devices 40, that is, the material sprayed from the nozzle 75 of the screw injection molding machine 70 is sprayed between the two conductive copper layers 30 in a vacuum environment and is heated, pressurized and cured by the two hot pressing devices 40 to form the insulating layer 200, so that the performance of the copper clad laminate is improved.
In the technical solution of the present invention, referring to fig. 4, two hot pressing rollers (not shown) are symmetrically disposed between the hot pressing device 40 and the winding device, and the two hot pressing rollers 80 are used for hot pressing the two conductive copper layers 30 and the molten material located between the two conductive copper layers 30 again. Namely, after the first hot press curing by the two hot press devices 40, the second hot press curing is performed by the two hot press rollers, so as to improve the curing and adhesion properties. It should be noted that, in the technical solution, a plurality of auxiliary rollers 90 are further provided to ensure the smooth operation of the winding devices, in this embodiment, two auxiliary rollers 90 are respectively and correspondingly arranged in front of the two first winding devices 61. In order to meet different requirements, a cutting device 20 is arranged before the product is rolled, so that the layered copper-clad plate can be obtained.
In the technical scheme of the invention, the insulating layer 200 is made of a low dielectric material, and is injected between the two conductive copper layers 30 by the screw injection molding machine 70 in an injection molding manner, so that the adhesive force between the insulating layer 200 and the conductive copper layers 30 can be effectively improved, and meanwhile, the low dielectric material can bring the advantages of high temperature resistance and heat resistance. The low dielectric material may be, but is not limited to, Liquid Crystal Polymer (LCP), Modified Polyimide (MPI), polyphenylene sulfide (PPS), polytetrafluoroethylene resin (PTFE), epoxy resin (EP), bismaleimide triazine resin (BT), thermosetting cyanate resin (CE), thermosetting polyphenylene ether resin (PPE), and polyimide resin (PI). Preferably, the low dielectric material employs Liquid Crystal Polymer (LCP) and Modified Polyimide (MPI). In the embodiment of the present application, a Liquid Crystal Polymer (LCP) is injected into the screw injection molding machine 70, and is injected between the two conductive copper layers 30 under the heating and melting effects of the screw injection molding machine 70.
Compared with the prior art, the preparation method of the copper-clad plate adopts the carrier layer 10 as the carrier to prepare the conductive copper layer 30, and can prepare the thinner conductive copper layer 30. The base material layer 11 is peeled by the peeling layer 13, the carrier layer 10 is wound by the first winding device 61, the product is wound by the second winding device 63, the melting material between the two conductive copper layers 30 from the screw injection molding machine 70 is subjected to hot pressing and curing by the hot pressing device 40 to form the insulating layer, and the low dielectric material is subjected to melting treatment by the screw injection molding machine 70, so that the bonding force between the insulating layer 200 and the conductive copper layers 30 is improved, and the high temperature resistance and the heat resistance are effectively improved by using the low dielectric material. The process avoids the situation that the thin copper (namely the conductive copper layer 30) is easy to break due to tension, realizes the thin copper foil and can improve the production efficiency and yield.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A preparation method of a copper-clad plate is characterized by comprising the following steps:
(1) providing a carrier layer, preparing a conductive copper layer on the surface of the carrier layer, wherein the carrier layer comprises a base material layer and a stripping layer prepared on the surface of the base material layer, and the conductive copper layer is prepared on the surface of the stripping layer;
(2) the carrier layer and the conductive copper layer form a rolled feeding roll;
(3) providing a hot pressing device, an unreeling device, a reeling device and a screw injection molding machine,
respectively unreeling the two feeding rolls by means of the two unreeling devices, respectively sending the two feeding rolls between the two symmetrically arranged hot pressing devices, and oppositely arranging the conductive copper layers of the two feeding rolls away from the hot pressing devices;
the rolling device comprises a first rolling device for rolling the carrier layer and a second rolling device for rolling the product;
and feeding the low dielectric material into the screw injection molding machine, feeding the molten material processed by the screw injection molding machine into the middle of the two conductive copper layers between the two hot pressing devices, and forming an insulating layer after hot pressing to obtain the copper-clad plate.
2. The method for preparing the copper-clad plate according to claim 1, wherein the substrate layer is selected from a metal substrate or a non-metal substrate.
3. The method for preparing the copper-clad plate according to claim 2, wherein the metal substrate is selected from copper, aluminum or stainless steel.
4. The method for preparing the copper-clad plate according to claim 1, wherein the thickness of the conductive copper layer is 0.5 μm to 18 μm.
5. The method for preparing the copper-clad plate according to claim 1, wherein the low dielectric material is at least one selected from the group consisting of liquid crystal high molecular polymer, modified polyimide, polyphenylene sulfide, polytetrafluoroethylene resin, polyether ether ketone resin, polyether ketone resin, thermosetting cyanate resin, thermosetting polyphenylene ether resin and polyimide resin.
6. The method for preparing the copper-clad plate according to claim 1, wherein a vacuum area is arranged between a nozzle of the screw injection molding machine and the two hot pressing devices.
7. The method for preparing the copper-clad plate according to claim 1, wherein two symmetrically arranged hot press rollers are arranged between the hot press device and the winding device, and the two hot press rollers are used for hot pressing the two conductive copper layers and the molten material positioned between the two conductive copper layers again.
8. The method for preparing the copper-clad plate according to claim 1, wherein a metal layer is prepared on the surface of the carrier layer by vacuum magnetron sputtering, a copper foil layer is prepared on the surface of the metal layer by electroplating or chemical copper deposition, and the metal layer and the copper foil layer form the conductive copper layer.
9. The method for preparing the copper-clad plate according to claim 8, wherein the metal layer is a Cu layer, a Ni layer, a Cu/Ni layer or an Ag layer.
10. A copper-clad plate, characterized in that the copper-clad plate is prepared by the preparation method of any one of claims 1 to 9.
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