CN113391101A - Shell-core microprobe and preparation method thereof - Google Patents
Shell-core microprobe and preparation method thereof Download PDFInfo
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- CN113391101A CN113391101A CN202110449645.3A CN202110449645A CN113391101A CN 113391101 A CN113391101 A CN 113391101A CN 202110449645 A CN202110449645 A CN 202110449645A CN 113391101 A CN113391101 A CN 113391101A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a shell-core microprobe and a preparation method thereof. The probe core mainly has the function of ensuring that mechanical properties such as strength, wear resistance and the like of the probe meet testing requirements, the probe shell mainly has the function of improving the conductivity of the probe and meeting the testing requirements of high conductivity, different materials are different in different parts, and the size of the probe can be made small by combining the advantages of the two materials.
Description
Technical Field
The invention belongs to the technical field of wafer test probes, and particularly relates to a shell-core microprobe and a preparation method thereof.
Background
With the rapid development of the semiconductor industry in recent years, the manufacturing precision of integrated circuits is higher and higher, the line width is smaller and smaller, and the size and the distance of corresponding test pads are smaller and smaller. For this reason, it is necessary to use an array of probes with higher precision and smaller size for testing, and the strength, resistance and current intensity capable of being carried of the probes are required to meet the corresponding requirements and the test is reliable. When the diameter of the test pads is smaller than 80 microns, the pad pitch is smaller than 30 microns, and the test pads are arranged in an array, the use of the conventional cantilever probe is limited due to the influence of the geometry. The traditional vertical probe is limited by a wire drawing manufacturing process, the size and the error are large, and the consistency of products is poor, so that a new probe is imperative to manufacture.
Disclosure of Invention
The invention provides a shell-core microprobe and a preparation method thereof, which can be applied to the condition of testing a welding pad in a small-size and small-distance array.
In order to achieve the purpose, the shell core microprobe comprises a probe core, wherein the probe core comprises an installation part, a main body and a needle point which are coaxially connected from top to bottom in sequence, the installation part and the main body are coated with a probe shell, and the probe shell has conductivity.
Furthermore, the probe core material is palladium-copper-silver alloy.
Further, the cross section of the main body is rectangular.
Further, the main body is provided with a protrusion extending outwards.
Further, the needle tip is wedge-shaped.
The preparation method of the shell-core microprobe comprises the following steps:
step 3, carrying out regional exposure on the photoresist by using parallel light through a mask;
step 4, developing and dissolving the exposed photoresist to expose part of the seed layer;
step 5, depositing palladium-copper-silver alloy on the upper surface of the exposed seed layer to form a probe core;
and 7, electroplating metal copper on the outer surface of the probe core to form a probe shell.
Further, in step 1, the thickness of the spin-on photoresist is greater than or equal to the thickness of the probe core.
Further, in the step 1, the speed of spin-coating the photoresist is 700r/min to 1000 r/min.
Further, in step 3, the photoresist is baked before and after exposure.
Compared with the prior art, the invention has at least the following beneficial technical effects:
the probe manufactured by the invention has a two-layer structure, the main function of the probe core is to ensure that the mechanical properties such as the strength, the wear resistance and the like of the probe meet the test requirements, the main function of the probe shell is to improve the conductivity of the probe and meet the test requirements of high conductivity, different materials are used in different parts, and the size of the probe can be made very small by combining the respective advantages of the two materials.
The probe manufactured by the invention is linear and is restrained by the upper guide plate and the lower guide plate during testing, compared with the traditional probe, the structure is more stable, and meanwhile, the sliding of the probe tip during testing can be reduced, more stable needle marks are generated, and the damage of the sliding of the probe tip to a welding pad is reduced.
Furthermore, the cross section of the main body is rectangular, so that the manufacturing is convenient.
Further, the main body is provided with protrusions extending outward to determine the position of the lower guide plate.
Furthermore, the needle point is wedge-shaped, and when the same acting force is applied, the wedge-shaped needle point can generate larger contact force and relatively small needle marks, so that the damage to the welding pad is reduced.
Compared with the traditional vertical probe wire drawing processing method, the method for preparing the shell-core structure microprobe with small size and high strength adopts the modes of photoetching, electroforming and electroplating, and the probes prepared based on the photoetching method have high precision and good consistency in batch production, and can meet the test requirements of small size, small space and array arrangement of test welding pads.
Furthermore, a pre-baking process is arranged before exposure so as to keep the surface of the substrate dry, and a post-baking process is arranged after exposure so as to improve the stability of patterns and improve the adhesion of the substrate in the subsequent deposition process.
Drawings
FIG. 1 is a schematic diagram of the structure of a probe according to the present invention;
FIG. 2 is a schematic diagram of a probe core structure;
FIG. 3 is a schematic view of a probe tip;
FIG. 4 is a schematic view showing the positional relationship between the probe and the guide plate;
FIG. 5 is a flow chart of a method for fabricating a probe.
In the drawings: 1. the probe comprises a probe core, 2, a probe shell, 3, a mounting part, 4, a main body, 5, a bulge, 6, a needle tip, 7, an upper guide plate, 8 and a lower guide plate.
Detailed Description
In order to make the objects and technical solutions of the present invention clearer and easier to understand. The present invention will be described in further detail with reference to the following drawings and examples, wherein the specific examples are provided for illustrative purposes only and are not intended to limit the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, a shell-core microprobe is in a straight shape and has a probe core 1 and a probe shell 2 with an inner and outer structure.
As shown in fig. 2, the probe core 1 is an integral structure, and includes a mounting portion 3, a main body 4 and a needle tip 6 which are coaxially connected from top to bottom in sequence, and is formed by electroforming in one step during manufacturing, and a protrusion 5 extending outwards is arranged at the lower part of the main body 4. The probe case 2 is covered outside the main body 4 and the mounting portion 3.
The probe core 1 is made of a material with hardness higher than beryllium copper and resistivity lower than that of metal tungsten, such as palladium-copper-silver alloy which has certain conductivity and mainly has the function of enabling the probe to have certain strength so as to puncture an oxide layer on the surface of a welding pad during testing and smoothly and effectively test.
The mounting part 3 is positioned at the upper end part of the probe, has a diameter slightly smaller than that of the main body 4 and is used for mounting the probe on a PCB (printed circuit board);
the main body 4 has limited depth which can be reached by the current photoetching process, the electroforming stacking direction can only be selected to be vertical to the long axis direction of the figure, and the section of the axis vertical to the long axis direction of the figure is rectangular; the mounting portion 3 has a rectangular cross section.
The projections 5 are located near the tip portion, and the projections 5 are on two opposite sides perpendicular to the electroforming stacking direction to determine the position of the lower guide plate 8.
As shown in fig. 3, the tip 6 is wedge-shaped, and the wedge-shaped tip can generate relatively larger contact force and relatively smaller pin mark on the basis of applying the same force, so that the damage to the bonding pad can be reduced. The surface of the needle tip is not electroplated with metallic copper.
The cross-section of the probe core 1 has a length and width in the range of 25 μm to 80 μm and a length of more than 2500 μm in this example, the dimensions of the probe core 1 are: width × thickness × length is 50 μm × 50 μm × 7000 μm.
The thickness of the probe shell is 5 μm to 15 μm, and in this example, the thickness of the probe shell is 7 μm.
The probe shell is made of pure copper material with the conductivity higher than that of the copper-palladium-silver alloy.
As shown in fig. 4, the probe test is limited by the upper guide plate 7 and the lower guide plate 8, and the test principle is a buckling column principle with two fixed ends.
In order to achieve the design purpose, referring to fig. 5, a method for manufacturing a shell-core microprobe includes the following steps:
step 3, spin-coating a negative photoresist (hereinafter referred to as PR photoresist) on the seed layer;
step 4, covering a mask plate above the PR glue coated in the last step;
step 5, carrying out regional exposure on the PR glue through a mask by using parallel light;
and 9, electroplating metal copper on the outer surface of the formed probe core 1 to form the probe shell 2.
In the step 1, the drawing of the mask and the parameter setting are determined according to the shape of the probe, and when the probe with different shapes is manufactured by the method of the present invention, the mask corresponding to each probe needs to be drawn.
In the step 2, the formation of the seed layer is also referred to as base metallization, the material of the seed layer may be metal such as Al, Cu or Cr, and the manner of forming the seed layer may be evaporation deposition, but is not limited to evaporation deposition, and may also be other manners such as sputtering.
In the step 3, a PR glue is thickly spin-coated, and the thickness of the PR glue is greater than or equal to that of the probe core 1. The size of the microstructure in the MEMS processing technology is generally dozens to hundreds of micrometers, which is far larger than the optical exposure thickness in the general IC technology, so that thick photoresist is selected for photoetching. The photoresist used for thick photoresist photoetching is greatly different from a thin photoresist in the aspects of concentration and functional index of a photosensitive compound, light absorption capacity and polymer content, and has higher viscosity, the uniform spin coating effect can be achieved only by carefully optimizing the rotation time and speed during spin coating, the spin coating speed is 700r/min to-1000 r/min, and the time is kept for 35 minutes.
In the step 5, the light source selected for exposure is common ultraviolet light, so that the requirement of the depth-to-width ratio can be met, a pre-baking process exists before exposure so as to keep the surface of the substrate dry, and a post-baking process exists after exposure so as to improve the stability of the graph and improve the adhesive force of the substrate in the subsequent deposition process.
In the step 7, the probe core 1 is formed by electrodeposition, the core part is a main body part of the probe, the material is palladium-copper-silver alloy, the main function is to ensure the mechanical performance of the probe in the test, and the probe core has certain conductivity, the size of the core part is determined according to a theoretical calculation structure and test requirements in the probe design process, and the size of the probe core 1 shown in fig. 2 is as follows: the length × width × height is 50 μm × 50 μm × 7000 μm, and the probe tip 6 is made of only a core material and has a wedge-shaped outer shape.
In step 9, the probe housing 2 is formed by electroplating, the shell portion mainly functions to reduce the test resistance of the probe and enhance the conductivity thereof, and the probe tip 6 is not electroplated.
As shown in fig. 4, the probe test is limited by the upper guide plate 7 and the lower guide plate 8, and the test principle is a buckling column principle with two fixed ends.
Example 1
A preparation method of a shell-core microprobe comprises the following steps:
step 3, performing first-step gluing on the seed layer at the speed of 800r/min for 15 seconds, increasing the rotating speed to 1000r/min, performing second-step gluing for 20 seconds, and spin-coating PR glue with the thickness of 50 microns;
step 4, covering a mask plate above the PR glue coated in the step 3;
step 5, carrying out regional exposure on the PR glue through a mask by using common ultraviolet light;
and 9, electroplating 7 mu m of metal copper on the outer surface of the formed probe core 1 to form a probe shell 2, wherein the shell part is mainly used for reducing the test resistance of the probe and enhancing the conductivity of the probe, and the probe tip 6 is not electroplated.
Example 2
A preparation method of a shell-core microprobe comprises the following steps:
step 3, performing first-step gluing on the seed layer at the speed of 750r/min for 15 seconds, performing second-step gluing at the speed of 950r/min for 20 seconds, wherein the thickness of the spin-coated PR glue is more than or equal to that of the probe;
step 4, covering a mask plate above the PR glue coated in the step 3;
step 5, carrying out regional exposure on the PR glue through a mask by using common ultraviolet light;
and 9, electroplating 15 mu m of metal copper on the outer surface of the formed probe core 1 to form a probe shell 2, wherein the shell part is mainly used for reducing the test resistance of the probe and enhancing the conductivity of the probe, and the probe tip 6 is not electroplated.
Example 3
A preparation method of a shell-core microprobe comprises the following steps:
step 3, performing first-step gluing on the seed layer at the speed of 700r/min for 10 seconds, performing second-step gluing at the speed of 1000r/min for 25 seconds, and spin-coating the PR glue to the thickness more than or equal to that of the probe;
step 4, covering a mask plate above the PR glue coated in the step 3;
step 5, carrying out regional exposure on the PR glue through a mask by using common ultraviolet light;
and 9, electroplating 5 mu m of metal copper on the outer surface of the formed probe core 1 to form a probe shell 2, wherein the shell part is mainly used for reducing the test resistance of the probe and enhancing the conductivity of the probe, and the probe tip 6 is not electroplated.
According to the present invention, it is possible to change the order of the non-essential processes without departing from the spirit of the invention, and it is within the scope of the appended claims to use the general technical knowledge and technology of this field.
Claims (9)
1. The utility model provides a shell core microprobe which characterized in that, includes probe core (1), probe core (1) includes from last installation department (3), main part (4) and the needle point (6) of extremely down coaxial coupling in proper order, the outer cladding of installation department (3) and main part (4) has probe shell (2), probe shell (2) have electric conductivity.
2. The shell-core microprobe according to claim 1, wherein the material of the probe core (1) is palladium-copper-silver alloy.
3. A shell core microprobe according to claim 1, wherein the cross-section of the body (4) is rectangular.
4. A shell core microprobe according to claim 1, wherein the main body (4) is provided with an outwardly extending protrusion (5).
5. The shell-core microprobe according to claim 1, wherein the tip (6) is wedge-shaped.
6. The method for preparing a shell-core microprobe of claim 1, comprising the steps of:
step 1, drawing a mask according to the shape of the probe core (1); depositing a seed layer on the upper end surface of the substrate; spin-coating photoresist on the seed layer;
step 2, covering the mask prepared in the step 1 above the photoresist;
step 3, carrying out regional exposure on the photoresist by using parallel light through a mask;
step 4, developing and dissolving the exposed photoresist to expose part of the seed layer;
step 5, depositing palladium-copper-silver alloy on the upper surface of the exposed seed layer to form a probe core (1);
step 6, removing the photoresist, the monocrystalline silicon wafer substrate and the seed layer thereon, and releasing the probe core (1);
and 7, electroplating metal copper on the outer surface of the probe core (1) to form a probe shell (2).
7. The method for preparing a shell-core microprobe according to claim 6, wherein in the step 1, the thickness of the spin-coating photoresist is greater than or equal to that of the microprobe core (1).
8. The method for preparing a shell-core microprobe according to claim 6, wherein in the step 1, the speed of spin-coating the photoresist is 700r/min to 1000 r/min.
9. The method for preparing a shell-core microprobe according to claim 6, wherein in the step 3, the photoresist is dried before and after exposure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110449645.3A CN113391101A (en) | 2021-04-25 | 2021-04-25 | Shell-core microprobe and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110449645.3A CN113391101A (en) | 2021-04-25 | 2021-04-25 | Shell-core microprobe and preparation method thereof |
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| CN113391101A true CN113391101A (en) | 2021-09-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024021198A1 (en) * | 2022-07-26 | 2024-02-01 | 上海泽丰半导体科技有限公司 | Probe treatment method and probe |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101614755A (en) * | 2008-06-24 | 2009-12-30 | 旺矽科技股份有限公司 | Integrally formed micro-stretching type spring needle |
| TW201005867A (en) * | 2008-07-24 | 2010-02-01 | Hermes Microvision Inc | Apparatus for increasing electric conductivity to a seniconductor wafer substrate when exposure to electron beam |
| JP2011180034A (en) * | 2010-03-02 | 2011-09-15 | Citizen Tohoku Kk | Plunger for contact probe |
| CN202133687U (en) * | 2011-03-25 | 2012-02-01 | 金准科技股份有限公司 | Test probe and probe mounting seat |
| CN102879617A (en) * | 2011-07-12 | 2013-01-16 | 旺矽科技股份有限公司 | Flat probe structure applied to point measurement device and manufacturing method thereof |
| CN105867071A (en) * | 2015-08-24 | 2016-08-17 | 北京中科紫鑫科技有限责任公司 | Thick photoresist lithography technology |
| CN106291006A (en) * | 2016-07-27 | 2017-01-04 | 京东方科技集团股份有限公司 | A kind of probe more changing device and replacing options thereof and test equipment |
| TWI606240B (en) * | 2017-03-14 | 2017-11-21 | MEMS probe and manufacturing method thereof, and probe head provided with the MEMS probe | |
| CN107431318A (en) * | 2015-03-31 | 2017-12-01 | 恩普乐股份有限公司 | Socket for electronic elements and its manufacture method |
| TW201825905A (en) * | 2016-11-21 | 2018-07-16 | 南韓商李諾工業股份有限公司 | Probe for testing device |
| TW201839411A (en) * | 2017-04-17 | 2018-11-01 | 旺矽科技股份有限公司 | Method for manufacturing probe and its structure and probe head using the same providing a probe with a stopper structure and capable of saving manufacturing time and reducing manufacturing costs |
| CN111089988A (en) * | 2019-12-27 | 2020-05-01 | 季华实验室 | High-uniformity magnetic probe and preparation method thereof |
| CN111812366A (en) * | 2020-08-05 | 2020-10-23 | 苏州韬盛电子科技有限公司 | Method for manufacturing wafer test micro probe based on micro electro mechanical system |
| CN112490115A (en) * | 2020-12-01 | 2021-03-12 | 苏州大学 | Transparent flexible monocrystalline silicon material and preparation method thereof |
-
2021
- 2021-04-25 CN CN202110449645.3A patent/CN113391101A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101614755A (en) * | 2008-06-24 | 2009-12-30 | 旺矽科技股份有限公司 | Integrally formed micro-stretching type spring needle |
| TW201005867A (en) * | 2008-07-24 | 2010-02-01 | Hermes Microvision Inc | Apparatus for increasing electric conductivity to a seniconductor wafer substrate when exposure to electron beam |
| JP2011180034A (en) * | 2010-03-02 | 2011-09-15 | Citizen Tohoku Kk | Plunger for contact probe |
| CN202133687U (en) * | 2011-03-25 | 2012-02-01 | 金准科技股份有限公司 | Test probe and probe mounting seat |
| CN102879617A (en) * | 2011-07-12 | 2013-01-16 | 旺矽科技股份有限公司 | Flat probe structure applied to point measurement device and manufacturing method thereof |
| CN107431318A (en) * | 2015-03-31 | 2017-12-01 | 恩普乐股份有限公司 | Socket for electronic elements and its manufacture method |
| CN105867071A (en) * | 2015-08-24 | 2016-08-17 | 北京中科紫鑫科技有限责任公司 | Thick photoresist lithography technology |
| CN106291006A (en) * | 2016-07-27 | 2017-01-04 | 京东方科技集团股份有限公司 | A kind of probe more changing device and replacing options thereof and test equipment |
| TW201825905A (en) * | 2016-11-21 | 2018-07-16 | 南韓商李諾工業股份有限公司 | Probe for testing device |
| TWI606240B (en) * | 2017-03-14 | 2017-11-21 | MEMS probe and manufacturing method thereof, and probe head provided with the MEMS probe | |
| TW201839411A (en) * | 2017-04-17 | 2018-11-01 | 旺矽科技股份有限公司 | Method for manufacturing probe and its structure and probe head using the same providing a probe with a stopper structure and capable of saving manufacturing time and reducing manufacturing costs |
| CN111089988A (en) * | 2019-12-27 | 2020-05-01 | 季华实验室 | High-uniformity magnetic probe and preparation method thereof |
| CN111812366A (en) * | 2020-08-05 | 2020-10-23 | 苏州韬盛电子科技有限公司 | Method for manufacturing wafer test micro probe based on micro electro mechanical system |
| CN112490115A (en) * | 2020-12-01 | 2021-03-12 | 苏州大学 | Transparent flexible monocrystalline silicon material and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024021198A1 (en) * | 2022-07-26 | 2024-02-01 | 上海泽丰半导体科技有限公司 | Probe treatment method and probe |
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