CN113365810B

CN113365810B - Laminate body

Info

Publication number: CN113365810B
Application number: CN201980090792.7A
Authority: CN
Inventors: 越智元气; 仲野武史
Original assignee: Nitto Denko Corp
Current assignee: Nitto Denko Corp
Priority date: 2019-01-29
Filing date: 2019-12-03
Publication date: 2023-08-15
Anticipated expiration: 2039-12-03
Also published as: JP7249160B2; TWI826611B; KR20210121042A; TW202037486A; CN113365810A; WO2020158176A1; JP2020121424A

Abstract

The present invention provides a laminate comprising a carrier sheet and a surface protective film and a reinforcing film laminated on the carrier sheet, wherein the surface protective film and the reinforcing film are less likely to float from an adhesive layer provided on the carrier sheet when the laminate is continuously attached to a member by roll-to-roll. The laminate of the present invention is a laminate comprising 5 or more layers of a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2) and a resin film (3) in this order, wherein when the adhesive layer (1) is directly laminated with the resin film (2), the resin film (2) is directly laminated with the adhesive layer (2), the laminated portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through holes having a width of 0.5mm to 10mm in a direction substantially orthogonal to the longitudinal direction, the length in the longitudinal direction of the laminated portion of the adhesive layer (1) and the resin film (2) divided by the through holes is 1mm to 2000mm, and when the laminated portion of the adhesive layer (1) and the resin film (2) which are divided by the through holes is wound on a roll having a diameter of 6 inches so that the resin film (1) is outside, the maximum amount of the laminated portion of the adhesive layer (1) and the resin film (2) which floats from the adhesive layer (2) is 5mm in the width of the through holes, and the length of the laminated portion of the adhesive layer (1) which is 50mm in the longitudinal direction of the resin film (2).

Description

Laminate body

Technical Field

The present invention relates to a laminate. Preferably, the present invention relates to a laminate which can be suitably used in a process for producing an optical member or an electronic member.

Background

In the manufacturing process of the optical member and the electronic member, the following may be used: a surface protective film (SPV) is attached to prevent damage to the surface of a member during processing, assembly, inspection, transportation, etc., or a Reinforcing Film (RF) is attached to reinforce a thin and fragile member (for example, patent document 1, etc.).

In order to improve the efficiency in the attaching step, a continuous step using a Roll-to-Roll (Roll-to-Roll) method is more effective than a step of attaching the surface protective film and the reinforcing film one by one.

When a laminate is produced by attaching the base material surface of the surface protection film or the reinforcing film to the light release adhesive layer of the carrier sheet having the base material and the light release adhesive layer, the surface protection film or the reinforcing film can be continuously attached to a member by roll-to-roll. In this case, the carrier sheet is peeled off after attachment.

However, when the lamination process is continuously performed on the member using the laminate as described above, the following phenomenon may be observed: the surface protective film and the base material surface (particularly, the end portion) of the reinforcing film float from the light release adhesive layer of the carrier sheet. Such a phenomenon is often observed particularly when the laminate is rolled out, passed through a roll, or peeled off from a separator of a surface protective film or a reinforcing film.

If such a phenomenon occurs, there is a problem that the alignment accuracy of the attachment position of the surface protective film or the reinforcing film to the member is lowered and misalignment occurs. In addition, if the phenomenon described above occurs, the following problem occurs: the surface protective film and the reinforcing film are peeled from the light release adhesive layer of the carrier sheet before being attached to the member, starting from the floating portion.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open publication 2016-17109

Disclosure of Invention

Problems to be solved by the invention

The present invention aims to provide a laminate comprising a carrier sheet and a surface protective film and a reinforcing film laminated on the carrier sheet, wherein the surface protective film and the reinforcing film are less likely to float from an adhesive layer provided on the carrier sheet when the laminate is continuously attached to a member by roll-to-roll.

Solution for solving the problem

The laminate of the present invention is a laminate comprising 5 or more layers of a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order,

the adhesive layer (1) is directly laminated with the resin film (2),

The resin film (2) is directly laminated with the adhesive layer (2),

the laminated portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through holes having a width of 0.5mm to 10mm in a direction substantially orthogonal to the longitudinal direction,

the length of the laminated part of the plurality of adhesive layers (1) and the resin film (2) divided by the through holes in the length direction is 1 mm-2000 mm,

when the resin film (1) is wound around a roll having a diameter of 6 inches so as to be outside, the maximum amount of the lamination portion of the plurality of adhesive layers (1) and the resin film (2) divided by the through-holes floating from the adhesive layer (2) is 0.2mm or less when the width of the through-holes is 5mm and the length of the lamination portion of the plurality of adhesive layers (1) and the resin film (2) divided by the through-holes in the longitudinal direction is 50 mm.

In one embodiment, the total area of the resin film (2) on the plane direction side is smaller than the total area of the adhesive layer (2) on the plane direction side.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, there can be provided a laminate comprising a carrier sheet and a surface protective film and a reinforcing film laminated on the carrier sheet, wherein when the laminate is continuously attached to a member by roll-to-roll, the surface protective film and the reinforcing film are less likely to float from the adhesive layer of the carrier sheet on the substrate surface.

Drawings

Fig. 1 is a schematic cross-sectional view of one embodiment of a laminate of the present invention.

Detailed Description

In the present specification, the expression "weight" is used interchangeably with "mass" which is often used as SI-based unit to indicate weight.

In the present specification, the expression "acrylic acid" refers to "acrylic acid and/or methacrylic acid", the expression "acrylic acid ester and/or methacrylic acid ester", the expression "allyl (meth) group" refers to "allyl group and/or methallyl group", and the expression "acrolein and/or methacrolein" refers to "acrolein and/or methacrolein".

Laminate of 1

The laminate of the present invention is a laminate comprising 5 or more layers of a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order, wherein the adhesive layer (1) is directly laminated with the resin film (2), and the resin film (2) is directly laminated with the adhesive layer (2).

The laminate of the present invention may have any other suitable layer within a range that does not impair the effects of the present invention, as long as the laminate has, in order, a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3), and the adhesive layer (1) is directly laminated with the resin film (2), and the resin film (2) is directly laminated with the adhesive layer (2).

The number of layers of the laminate of the present invention is preferably 5 to 10 layers, more preferably 5 to 8 layers, further preferably 5 to 7 layers, particularly preferably 5 to 6 layers, and most preferably 5 layers, based on the number of other layers.

In the laminate of the present invention, the lamination portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through holes having a width of 0.5mm to 10mm in a direction substantially orthogonal to the longitudinal direction. The width of such a through hole is preferably 0.6 to 8mm, more preferably 0.7 to 6mm, even more preferably 0.8 to 5mm, particularly preferably 0.9 to 4mm, and most preferably 1 to 3mm. Such a through hole is preferably substantially rectangular parallelepiped.

The laminate of the present invention is a laminate in which the lamination portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through holes having a predetermined length in a direction substantially orthogonal to the longitudinal direction, and thus the substrate surface of the surface protective film and the reinforcing film is less likely to float from the adhesive layer of the carrier sheet when the laminate is continuously attached to a member by roll-to-roll.

In the laminate of the present invention, the laminated portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of parts by the through-holes. The length of the laminated portion of the plurality of adhesive layers (1) and the resin film (2) divided by the through holes in the longitudinal direction is 1mm to 2000mm, preferably 1mm to 1000mm, more preferably 1mm to 500mm, still more preferably 2mm to 500mm, particularly preferably 2mm to 400mm, and most preferably 2mm to 300mm. By setting the length in the longitudinal direction of the laminated portion of the resin film (2) and the plurality of pressure-sensitive adhesive layers (1) divided by the through-holes to a predetermined range, the laminate of the present invention can be a laminate in which the base material surfaces of the surface protective film and the reinforcing film are less likely to float from the pressure-sensitive adhesive layer of the carrier sheet when continuously attached to the member from roll to roll.

In the laminate of the present invention, the total area on the plane direction side of the resin film (2) is preferably smaller than the total area on the plane direction side of the adhesive layer (2). The ratio of the total area of the resin film (2) on the plane direction side to the total area of the adhesive layer (2) on the plane direction side is preferably 20 to 99.9%, more preferably 50 to 99%, still more preferably 60 to 98%, particularly preferably 70 to 97%, and most preferably 80 to 96%. By making the total area of the resin film (2) on the plane direction side smaller than the total area of the adhesive layer (2) on the plane direction side, the laminate of the present invention can be a laminate in which the base material surface of the surface protective film or the reinforcing film is less likely to float from the adhesive layer of the carrier sheet when continuously attached to the member by roll-to-roll.

When the laminate of the present invention is wound around a roll having a diameter of 6 inches so that the resin film (1) is outside, the maximum amount of floating of the adhesive layer (2) at the laminated portion of the plurality of divided adhesive layers (1) and the resin film (2) is 0.5mm or less, preferably 0.3mm or less, more preferably 0.2mm or less, still more preferably 0.1mm or less, particularly preferably 0.08mm or less, and most preferably 0mm, when the width of the through hole is 5mm and the length in the longitudinal direction of the laminated portion of the plurality of divided adhesive layers (1) and the resin film (2) is 50 mm. The method for measuring the floating is described below.

When the laminate of the present invention is wound around a roll having a diameter of 6 inches so that the resin film (1) is outside, the maximum amount of floating of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) is preferably 0.7mm or less, more preferably 0.5mm or less, still more preferably 0.3mm or less, particularly preferably 0.2mm or less, and most preferably 0mm, when the width of the through hole is 3mm and the length in the longitudinal direction of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) is 50 mm. The method for measuring the floating is described below.

When the laminate of the present invention is wound around a roll having a diameter of 6 inches so that the resin film (1) is outside, the maximum amount of floating of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) is preferably 1.2mm or less, more preferably 1.0mm or less, still more preferably 0.5mm or less, particularly preferably 0.2mm or less, and most preferably 0.1mm or less when the width of the through hole is 1mm and the length in the longitudinal direction of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) is 50 mm. The method for measuring the floating is described below.

As shown in fig. 1, in one embodiment of the laminate of the present invention, a laminate 100 of the present invention is formed by directly laminating a resin film (1) 10, an adhesive layer (1) 20, a resin film (2) 30, an adhesive layer (2) 40, and a resin film (3) 50 in this order. In fig. 1, the laminated portion of the adhesive layer (1) 20 and the resin film (2) 30 is divided into a plurality of pieces by the through-holes 60 having a predetermined length in a direction substantially orthogonal to the longitudinal direction, and the divided laminated portion of the plurality of adhesive layers (1) and the resin film (2) is constituted.

In one embodiment of the laminate of the present invention shown in fig. 1, the laminate portion of the resin film (1), the adhesive layer (1), and the resin film (2) may be a surface protective film or a reinforcing film. In this case, the resin film (1) may become a separator.

In one embodiment of the laminate of the present invention shown in fig. 1, the laminate portion of the adhesive layer (2) and the resin film (3) may be a carrier sheet. The carrier sheet may also be treated as a surface protective film.

The adhesive force of the laminate of the present invention when the adhesive layer (2) is peeled from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 30 mm/min under an atmosphere having a temperature of 23 ℃ and a humidity of 50% RH is preferably 1gf/25mm or more, more preferably 1gf/25mm to 10gf/25mm, still more preferably 1.2gf/25mm to 8gf/25mm, still more preferably 1.4gf/25mm to 7gf/25mm, particularly preferably 1.6gf/25mm to 5gf/25mm, and most preferably 1.8gf/25mm to 3gf/25mm. When the adhesive force is within the above range, the laminate of the present invention can further suppress the resin film (2) from floating up from the adhesive layer (2) when the laminate is continuously attached to a member by roll-to-roll. The method for measuring the above adhesive force is described below.

The adhesive force of the laminate of the present invention when the adhesive layer (2) is peeled from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 300 mm/min under an atmosphere having a temperature of 23 ℃ and a humidity of 50% RH is preferably 2gf/25mm or more, more preferably 2gf/25 to 20gf/25mm, still more preferably 2.5gf/25 to 10gf/25mm, still more preferably 3gf/25 to 9gf/25mm, particularly preferably 3gf/25 to 8gf/25mm, and most preferably 3.5gf/25 to 7gf/25mm. When the adhesive force is within the above range, the laminate of the present invention can further suppress the resin film (2) from floating up from the adhesive layer (2) when the laminate is continuously attached to a member by roll-to-roll. The method for measuring the above adhesive force is described below.

The adhesive force of the laminate of the present invention when the adhesive layer (2) is peeled from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 2400 mm/min under an atmosphere having a temperature of 23 ℃ and a humidity of 50% RH is preferably 5gf/25mm or more, more preferably 5gf/25 to 100gf/25mm, still more preferably 7gf/25 to 60gf/25mm, still more preferably 8gf/25 to 40gf/25mm, particularly preferably 9gf/25 to 30gf/25mm, and most preferably 10gf/25 to 25gf/25mm. When the adhesive force is within the above range, the laminate of the present invention can further suppress the resin film (2) from floating up from the adhesive layer (2) when the laminate is continuously attached to a member by roll-to-roll. The method for measuring the above adhesive force is described below.

The laminate of the present invention is preferably: the adhesive force (1) when the adhesive layer (1) is peeled from the glass at a peeling angle of 180 DEG and a peeling speed of 300 mm/min in an atmosphere of 50% RH at a temperature of 23 ℃ and the adhesive force (2) when the adhesive layer (2) is peeled from the glass at a peeling angle of 180 DEG and a peeling speed of 300 mm/min in an atmosphere of 50% RH at a temperature of 23 ℃ are satisfied that the adhesive force (1) > the adhesive force (2). The effect of the present invention can be further exhibited by making the adhesive force (1) > the adhesive force (2). The method for measuring the above adhesive force is described below.

The total light transmittance of the laminate of the present invention is preferably 60% or more, more preferably 70% to 100%, further preferably 80% to 100%, particularly preferably 83% to 100%, and most preferably 85% to 100%. The method for measuring the total light transmittance is described below.

The haze of the laminate of the present invention is preferably 15% or less, more preferably 0% to 10%, even more preferably 0% to 8%, particularly preferably 0% to 7%, and most preferably 0% to 6%. The above-mentioned haze measurement method is described below.

1-1 resin film (1)

The thickness of the resin film (1) is preferably 1 to 300. Mu.m, more preferably 10 to 200. Mu.m, still more preferably 30 to 150. Mu.m, particularly preferably 40 to 100. Mu.m, and most preferably 50 to 80. Mu.m, from the viewpoint of further exhibiting the effects of the present invention.

The resin film (1) comprises a resin base film (1 a).

Examples of the resin base film (1 a) include: plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); plastic films comprising an olefin resin containing an α -olefin as a monomer component, such as Polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), an ethylene-propylene copolymer, and an ethylene-vinyl acetate copolymer (EVA); plastic films composed of polyvinyl chloride (PVC); a plastic film made of a vinyl acetate resin; a plastic film composed of Polycarbonate (PC); plastic films composed of polyphenylene sulfide (PPS); a plastic film made of an amide resin such as polyamide (nylon) and wholly aromatic polyamide (aramid); a plastic film made of polyimide resin; a plastic film composed of Polyetheretherketone (PEEK); plastic films made of olefin resins such as Polyethylene (PE) and polypropylene (PP); plastic films comprising fluorine-based resins such as polytetrafluoroethylene, chlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer; etc.

The resin base film (1 a) may have only 1 layer or 2 or more layers. The resin base film (1 a) may be stretched.

The resin base film (1 a) may be subjected to surface treatment. Examples of the surface treatment include: corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, coating treatment with a primer, and the like.

The resin base film (1 a) may contain any suitable additive within a range that does not impair the effects of the present invention.

In order to improve the peelability of the self-adhesive layer (1), the resin film (1) may also have a release layer (1 b). When the resin film (1) has a release layer (1 b), the release layer (1 b) side is directly laminated on the pressure-sensitive adhesive layer (1).

Any suitable forming material may be used for the forming material of the release layer (1 b) within a range that does not impair the effects of the present invention. Examples of such a forming material include: silicone release agents, fluorine release agents, long-chain alkyl release agents, fatty acid amide release agents, and the like. Among these, silicone-based release agents are preferable. The release layer (1 b) may be formed as a coating layer.

The thickness of the release layer (1 b) may be any suitable thickness as long as the effect of the present invention is not impaired. The thickness is preferably 10nm to 2000nm, more preferably 10nm to 1500nm, still more preferably 10nm to 1000nm, particularly preferably 10nm to 500nm.

The release layer (1 b) may be 1 layer or 2 layers or more.

Examples of the silicone release layer include addition-reaction silicone resins. Specific examples of the addition-reaction type silicone resin include: KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-847T, manufactured by the Xinyue chemical industry; TPR-6700, TPR-6710, TPR-6721 manufactured by Toshiba Silicone; dow Corning Toray SD7220, SD7226, etc. The coating amount (after drying) of the silicone release layer is preferably 0.01g/m ² ～2g/m ² More preferably 0.01g/m ² ～1g/m ² Further preferably 0.01g/m ² ～0.5g/m ² 。

The release layer (1 b) can be formed, for example, as follows: the above-mentioned forming material is applied to any appropriate layer by a conventionally known coating method such as reverse gravure coating, bar coating, die coating, etc., and then heat-treated at a temperature of usually about 120 to 200 ℃ to thereby cure the material. If necessary, active energy ray irradiation such as heat treatment and ultraviolet ray irradiation may be used in combination.

The resin film (1) may also have an antistatic layer (1 c).

As for the thickness of the antistatic layer (1 c), any suitable thickness may be used within a range that does not impair the effect of the present invention. The thickness is preferably 1nm to 1000nm, more preferably 5nm to 900nm, still more preferably 7.5nm to 800nm, particularly preferably 10nm to 700nm.

The antistatic layer (1 c) may be 1 layer or 2 layers or more.

As the antistatic layer (1 c), any suitable antistatic layer may be used as long as it is a layer capable of exhibiting an antistatic effect, within a range that does not impair the effect of the present invention. As such an antistatic layer, an antistatic layer formed by applying a conductive coating liquid containing a conductive polymer onto any appropriate base layer is preferable. Specifically, for example, an antistatic layer is formed by coating a conductive coating liquid containing a conductive polymer on a resin base film (1 a). Specific coating methods include: roll coating, bar coating, gravure coating, and the like.

As the conductive polymer, any suitable conductive polymer may be used within a range that does not impair the effects of the present invention. Examples of such conductive polymers include: a conductive polymer doped with a polyanion in the pi-conjugated conductive polymer, and the like. Examples of the pi-conjugated conductive polymer include: chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. As the polyanion, there may be mentioned: polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallylsulfonic acid, polyethylene sulfonate, polymethacrylate carboxylic acid, and the like. The number of the conductive polymers may be 1 or 2 or more.

One embodiment of the resin film (1) comprises a resin base film (1 a), an antistatic layer (1 c), and a release layer (1 b) in this order. Typically, this embodiment is composed of a resin base film (1 a), an antistatic layer (1 c), and a release layer (1 b).

Another embodiment of the resin film (1) includes an antistatic layer (1 c), a resin base film (1 a), an antistatic layer (1 c), and a release layer (1 b) in this order. Typically, this embodiment is composed of an antistatic layer (1 c), a resin base film (1 a), an antistatic layer (1 c), and a release layer (1 b).

1-2 adhesive layer (1)

The adhesive layer (1) may be any suitable adhesive layer within a range that does not impair the effects of the present invention. The pressure-sensitive adhesive layer (1) may be 1 layer or 2 or more layers.

The thickness of the pressure-sensitive adhesive layer (1) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, still more preferably 3 μm to 80 μm, particularly preferably 5 μm to 50 μm, and most preferably 5 μm to 30 μm, from the viewpoint of further exhibiting the effect of the present invention.

As described above, the laminated portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through holes having a predetermined length in a direction substantially orthogonal to the longitudinal direction.

The adhesive layer (1) is preferably composed of at least 1 selected from the group consisting of an acrylic adhesive, a urethane adhesive, a rubber adhesive, and a silicone adhesive.

The adhesive layer (1) may be formed by any suitable method. Examples of such methods include the following: an adhesive composition (at least 1 selected from the group consisting of an acrylic adhesive composition, a urethane adhesive composition, a rubber adhesive composition, and a silicone adhesive composition) is applied to any suitable substrate (for example, a resin film (2)), and the substrate is heated and dried as necessary, and cured as necessary, thereby forming an adhesive layer on the substrate. Examples of such a coating method include: gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, air knife coater, spray coater, comma coater, direct coater, roll brush coater, and the like.

The adhesive layer (1) may also contain a conductive component. The number of conductive components may be 1 or 2 or more.

1-2-1 acrylic Adhesives

The acrylic adhesive is formed from an acrylic adhesive composition.

From the aspect that the effect of the present invention can be further exhibited, the acrylic adhesive composition preferably contains an acrylic polymer and a crosslinking agent.

Acrylic polymers may be referred to in the art of acrylic adhesives as so-called base polymers. The number of acrylic polymers may be 1 or 2 or more.

The content of the acrylic polymer in the acrylic pressure-sensitive adhesive composition is preferably 60 to 99.9% by weight, more preferably 65 to 99.9% by weight, still more preferably 70 to 99.9% by weight, particularly preferably 75 to 99.9% by weight, and most preferably 80 to 99.9% by weight, in terms of solid content.

Any suitable acrylic polymer may be used as the acrylic polymer within a range that does not impair the effects of the present invention.

The weight average molecular weight of the acrylic polymer is preferably 30 to 250 tens of thousands, more preferably 35 to 200 tens of thousands, still more preferably 40 to 180 tens of thousands, particularly preferably 50 to 150 tens of thousands, from the viewpoint of further exhibiting the effect of the present invention.

The acrylic polymer is preferably an acrylic polymer formed by polymerizing a composition (a) containing at least 1 selected from the group consisting of (meth) acrylic acid esters having an OH group and (meth) acrylic acid, wherein the alkyl group of the (a) alkyl ester moiety has 4 to 12 carbon atoms, and the (b) component.

The acrylic polymer is preferably an acrylic polymer formed by polymerization from a composition (a) containing, as component (a), an alkyl (meth) acrylate having 4 to 12 carbon atoms in the alkyl group of the alkyl ester moiety and containing, as component (b), not a (meth) acrylate having an OH group; more preferably, the acrylic polymer is formed by polymerization of a composition (a) containing an alkyl (meth) acrylate having 4 to 8 carbon atoms in the alkyl group of the alkyl ester moiety as component (a) and containing not a (meth) acrylate having an OH group but an acrylic acid as component (b).

The number of components (a) and (b) may be 1 or 2 or more, respectively.

The alkyl (meth) acrylate (component a) in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms includes, for example: n-butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, and the like. Among these, n-butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate are preferable, and n-butyl acrylate and 2-ethylhexyl acrylate are more preferable, from the viewpoint of further exhibiting the effects of the present invention.

Examples of at least 1 (component b) selected from the group consisting of (meth) acrylic acid esters having OH groups and (meth) acrylic acid include: hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate and other (meth) acrylates having OH groups, (meth) acrylic acid and the like. Among these, from the viewpoint of further exhibiting the effects of the present invention, hydroxyethyl (meth) acrylate and (meth) acrylic acid are preferable, and hydroxyethyl acrylate and acrylic acid are more preferable.

The composition (a) may contain a copolymerizable monomer other than the component (a) and the component (b). The number of copolymerizable monomers may be 1 or 2 or more. Examples of such copolymerizable monomers include: carboxylic group-containing monomers (excluding (meth) acrylic acid) such as itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and anhydrides of these (for example, anhydride group-containing monomers such as maleic anhydride and itaconic anhydride); amide group-containing monomers such as (meth) acrylamide, N-dimethyl (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, and N-hydroxyethyl (meth) acrylamide; amino group-containing monomers such as aminoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate; epoxy group-containing monomers such as glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; heterocyclic vinyl monomers such as N-vinyl-2-pyrrolidone, (meth) acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, and vinyloxazole; sulfonic acid group-containing monomers such as sodium vinylsulfonate; phosphate group-containing monomers such as 2-hydroxyethyl acrylate; imide group-containing monomers such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomers such as 2-methacryloxyethyl isocyanate; (meth) acrylic esters having an alicyclic hydrocarbon group such as cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, and isobornyl (meth) acrylate; (meth) acrylic esters having an aromatic hydrocarbon group such as phenyl (meth) acrylate, phenoxyethyl (meth) acrylate, benzyl (meth) acrylate, and the like; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyl toluene; olefins such as ethylene, butadiene, isoprene and isobutylene, and dienes; vinyl ethers such as vinyl alkyl ether; vinyl chloride, and the like.

As the copolymerizable monomer, a polyfunctional monomer may be used. The polyfunctional monomer means a monomer having 2 or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any suitable ethylenically unsaturated group may be employed within a range that does not impair the effects of the present invention. Examples of such an ethylenically unsaturated group include: radical polymerizable functional groups such as vinyl, propenyl, isopropenyl, vinyl ether (ethyleneoxy), and allyl ether (allyloxy). Examples of the polyfunctional monomer include: hexanediol di (meth) acrylate, butanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tri (meth) acrylate, allyl (meth) acrylate, vinyl (meth) acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, and the like. Such a polyfunctional monomer may be 1 or 2 or more.

As the copolymerizable monomer, alkoxyalkyl (meth) acrylates may also be used. Examples of the alkoxyalkyl (meth) acrylate include: 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, methoxytriethylene glycol (meth) acrylate, 3-methoxypropyl (meth) acrylate, 3-ethoxypropyl (meth) acrylate, 4-methoxybutyl (meth) acrylate, 4-ethoxybutyl (meth) acrylate, and the like. The number of alkoxyalkyl (meth) acrylates may be 1 or 2 or more.

The content of the alkyl (meth) acrylate (component a) having 4 to 12 carbon atoms in the alkyl ester moiety is preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, still more preferably 40% by weight to 98% by weight, and particularly preferably 50% by weight to 95% by weight, relative to the total amount of the monomer components (100% by weight) constituting the acrylic polymer, in order to further exhibit the effect of the present invention.

The content of at least 1 (component b) selected from the group consisting of (meth) acrylic acid esters having OH groups and (meth) acrylic acid is preferably 1% by weight or more, more preferably 1% by weight to 30% by weight, still more preferably 2% by weight to 20% by weight, and particularly preferably 3% by weight to 10% by weight, relative to the total amount of monomer components (100% by weight) constituting the acrylic polymer, in order to further exhibit the effects of the present invention.

The composition (a) may contain any suitable other component within a range that does not impair the effects of the present invention. Examples of such other components include: polymerization initiator, chain transfer agent, solvent, etc. The content of these other components may be any suitable content within a range that does not impair the effects of the present invention.

The polymerization initiator may employ a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like depending on the kind of polymerization reaction. The polymerization initiator may be 1 or 2 or more.

The thermal polymerization initiator may be preferably employed in obtaining the acrylic polymer by solution polymerization. Examples of such a thermal polymerization initiator include: azo-based polymerization initiators, peroxide-based polymerization initiators (e.g., dibenzoyl peroxide, t-butyl peroxymaleate, etc.), redox-based polymerization initiators, and the like. Among these thermal polymerization initiators, azo-based initiators disclosed in JP-A2002-69411 are particularly preferable. Such an azo-based polymerization initiator is preferable in that a decomposition product of the polymerization initiator is less likely to remain in the acrylic polymer as a part that causes generation of a heating generation gas (outgas). Examples of azo polymerization initiators include: 2,2 '-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2' -azobis-2-methylbutyronitrile (hereinafter sometimes referred to as AMBN), dimethyl 2,2 '-azobis (2-methylpropionate), 4' -azobis-4-cyanovaleric acid, and the like.

The photopolymerization initiator may be preferably used when the acrylic polymer is obtained by active energy ray polymerization. Examples of the photopolymerization initiator include: benzoin ether photopolymerization initiator, acetophenone photopolymerization initiator, α -ketol photopolymerization initiator, aromatic sulfonyl chloride photopolymerization initiator, photoactive oxime photopolymerization initiator, benzoin photopolymerization initiator, benzil photopolymerization initiator, benzophenone photopolymerization initiator, ketal photopolymerization initiator, thioxanthone photopolymerization initiator, and the like.

Examples of the benzoin ether photopolymerization initiator include: benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-dimethoxy-1, 2-diphenylethane-1-one, methylanisole, and the like. Examples of the acetophenone photopolymerization initiator include: 2, 2-diethoxyacetophenone, 2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 4-phenoxydichloroacetophenone, 4- (tert-butyl) dichloroacetophenone, and the like. Examples of the α -ketol photopolymerization initiator include: 2-methyl-2-hydroxy propiophenone, 1- [4- (2-hydroxyethyl) phenyl ] -2-methylpropan-1-one, and the like. Examples of the aromatic sulfonyl chloride photopolymerization initiator include: 2-naphthalenesulfonyl chloride, and the like. Examples of the photoactive oxime-based photopolymerization initiator include: 1-phenyl-1, 1-propanedione-2- (O-ethoxycarbonyl) oxime and the like. Examples of the benzoin photopolymerization initiator include: benzoin, and the like. Examples of the benzil photopolymerization initiator include: benzil, etc. Examples of the benzophenone-based photopolymerization initiator include: benzophenone, benzoyl benzoic acid, 3' -dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, α -hydroxycyclohexyl phenyl ketone, and the like. Examples of the ketal photopolymerization initiator include: benzil dimethyl ketal, and the like. Examples of the thioxanthone photopolymerization initiator include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2, 4-dimethylthioxanthone, isopropylthioxanthone, 2, 4-diisopropylthioxanthone, dodecylthioxanthone, and the like.

The acrylic adhesive composition may also contain a crosslinking agent. The effect of the present invention can be further exhibited by improving the cohesive force of the acrylic adhesive by using the crosslinking agent. The number of the crosslinking agents may be 1 or 2 or more.

Examples of the crosslinking agent include: polyfunctional isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents, and the like. Among these, at least one (component c) selected from the group consisting of a polyfunctional isocyanate-based crosslinking agent and an epoxy-based crosslinking agent is preferable from the viewpoint of further exhibiting the effects of the present invention.

Examples of the polyfunctional isocyanate-based crosslinking agent include: lower aliphatic polyisocyanates such as 1, 2-ethylene diisocyanate, 1, 4-butylene diisocyanate, and 1, 6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, and hydrogenated xylylene diisocyanate; aromatic polyisocyanates such as 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, 4' -diphenylmethane diisocyanate, and xylylene diisocyanate. Examples of the polyfunctional isocyanate-based crosslinking agent include: commercial products such as trimethylolpropane/toluene diisocyanate adduct (trade name "Coronate L" manufactured by Japanese polyurethane Co., ltd.), trimethylolpropane/hexamethylene diisocyanate adduct (trade name "Coronate HL" manufactured by Japanese polyurethane Co., ltd.), trade name "Coronate HX" (Japanese polyurethane Co., ltd.), and trimethylolpropane/xylylene diisocyanate adduct (trade name "Takenate 110N" manufactured by Mitsui chemical Co., ltd.).

Examples of the epoxy-based crosslinking agent (polyfunctional epoxy compound) include: n, N, N ', N' -tetraglycidyl m-xylylenediamine, diglycidyl aniline, 1, 3-bis (N, N-diglycidyl aminomethyl) cyclohexane, 1, 6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, sorbitol polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, triglycidyl tris (2-hydroxyethyl) isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, epoxy resins having 2 or more epoxy groups in the molecule, and the like. The epoxy-based crosslinking agent may be: commercially available products such as "tetra C" (Mitsubishi gas chemical Co., ltd.).

As for the content of the crosslinking agent in the acrylic adhesive composition, any suitable content may be employed within a range that does not impair the effects of the present invention. The content is, for example, preferably 0.05 to 20 parts by weight, more preferably 0.1 to 18 parts by weight, still more preferably 0.5 to 15 parts by weight, and particularly preferably 0.5 to 10 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer, from the viewpoint of further exhibiting the effect of the present invention.

The acrylic adhesive composition may contain any suitable other components within a range that does not impair the effects of the present invention. Examples of such other components include: polymer components other than the acrylic polymer, a crosslinking accelerator, a crosslinking catalyst, a silane coupling agent, a tackifying resin (rosin derivative, polyterpene resin, petroleum resin, oil-soluble phenol, etc.), an anti-aging agent, an inorganic filler, an organic filler, a metal powder, a colorant (pigment, dye, etc.), a foil, an ultraviolet absorber, an antioxidant, a light stabilizer, a chain transfer agent, a plasticizer, a softener, a surfactant, an antistatic agent, a conductive agent, a stabilizer, a surface lubricant, a leveling agent, an anticorrosive agent, a heat stabilizer, a polymerization inhibitor, a lubricant, a solvent, a catalyst, etc.

1-2-2 urethane adhesive

Any suitable urethane-based adhesive such as the known urethane-based adhesive described in, for example, japanese patent application laid-open publication No. 2017-039859 can be used as the urethane-based adhesive within a range that does not impair the effects of the present invention. As such a urethane-based adhesive, for example, a urethane-based adhesive formed from a urethane-based adhesive composition containing at least 1 selected from the group consisting of urethane prepolymers and polyols and a crosslinking agent is used. The urethane-based binder may be 1 or 2 or more. The urethane-based adhesive may contain any suitable component within a range that does not impair the effects of the present invention.

1-2-3 rubber adhesive

As the rubber-based adhesive, any suitable rubber-based adhesive such as a known rubber-based adhesive described in japanese patent application laid-open No. 2015-074771 or the like can be used within a range that does not impair the effects of the present invention. These may be 1 kind or 2 or more kinds. The rubber-based adhesive may contain any suitable component within a range that does not impair the effects of the present invention.

1-2-4 organosilicon adhesive

Any suitable silicone adhesive such as a known silicone adhesive described in, for example, japanese patent application laid-open publication No. 2014-047280 can be used as the silicone adhesive within a range that does not impair the effects of the present invention. These may be 1 kind or 2 or more kinds. The silicone-based adhesive may contain any suitable component within a range that does not impair the effects of the present invention.

1-2-5. Conductive component ]

The adhesive layer (1) may also contain a conductive component. Typically, the adhesive composition (at least 1 selected from the group consisting of an acrylic adhesive composition, a urethane adhesive composition, a rubber adhesive composition, and a silicone adhesive composition) that is a material of the adhesive layer (1) may contain a conductive component.

As the conductive component, any suitable conductive component may be used within a range that does not impair the effects of the present invention. Such a conductive component is preferably at least 1 compound selected from ionic liquids, ion conductive polymers, ion conductive fillers, and conductive polymers.

When the adhesive composition contains a conductive component, the ratio of the base polymer (for example, acrylic polymer, polyol, urethane prepolymer, rubber polymer, silicone polymer) to the conductive component is preferably 0.01 to 10 parts by weight, more preferably 0.05 to 9.0 parts by weight, still more preferably 0.075 to 8.0 parts by weight, and particularly preferably 0.1 to 7.0 parts by weight, based on 100 parts by weight of the base polymer.

As the ionic liquid, any suitable ionic liquid may be used within a range that does not impair the effects of the present invention. Here, the ionic liquid is a molten salt (ionic compound) which is in a liquid state at 25 ℃. The ionic liquid may be 1 or 2 or more.

As such an ionic liquid, an ionic liquid composed of a fluoroorganic anion and an onium cation is preferable.

As the onium cation capable of constituting the ionic liquid, any suitable onium cation can be used within a range that does not impair the effects of the present invention. Such onium cations are preferably at least 1 selected from nitrogen-containing onium cations, sulfur-containing onium cations and phosphonium-containing onium cations.

The onium cations capable of constituting the ionic liquid are preferably at least 1 kind selected from cations having structures represented by general formulae (1) to (5) in view of further exhibiting the effects of the present invention.

In the general formula (1), ra represents a hydrocarbon group having 4 to 20 carbon atoms, which may contain a hetero atom, rb and Rc are the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, which may contain a hetero atom. Wherein Rc is absent when the nitrogen atom contains a double bond.

In the general formula (2), rd represents a hydrocarbon group having 2 to 20 carbon atoms, which may contain a hetero atom, and Re, rf and Rg are the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, which may contain a hetero atom.

In the general formula (3), rh represents a hydrocarbon group having 2 to 20 carbon atoms, which may contain hetero atoms, and Ri, rj and Rk are the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, which may contain hetero atoms.

In the general formula (4), Z represents a nitrogen atom, a sulfur atom or a phosphorus atom, and Rl, rm, rn and Ro are the same or different and represent a hydrocarbon group having 1 to 20 carbon atoms, and may contain a hetero atom. Wherein when Z is a sulfur atom, ro is not present.

In the general formula (5), X represents a Li atom, a Na atom, or a K atom.

Examples of the cation represented by the general formula (1) include: pyridinium cations, pyrrolidinium cations, piperidinium cations, cations having a pyrroline skeleton, cations having a pyrrole skeleton, and the like.

Specific examples of the cation represented by the general formula (1) include: pyridinium cations such as 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, and 1-octyl-4-methylpyridinium cation; pyrrolidinium cations such as 1-ethyl-1-methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation; piperidinium cations such as 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, and 1-propyl-1-butylpiperidinium cation; more preferred are 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-propylpiperidinium cation.

Examples of the cation represented by the general formula (2) include: imidazolium cations, tetrahydropyrimidinium cations, dihydropyrimidinium cations, and the like.

Specific examples of the cation represented by the general formula (2) include imidazolium cations such as 1, 3-dimethylimidazolium cation, 1, 3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation, and 1-tetradecyl-3-methylimidazolium cation, and more preferably 1-ethyl-3-methylimidazolium cation and 1-hexyl-3-methylimidazolium cation.

Examples of the cation represented by the general formula (3) include: pyrazolium cations, pyrazolinium cations, and the like.

Specific examples of the cation represented by the general formula (3) include: pyrazolium cations such as 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methylpyrazolinium cation, 1-ethyl-2, 3, 5-trimethylpyrazolium cation, 1-propyl-2, 3, 5-trimethylpyrazolium cation, and 1-butyl-2, 3, 5-trimethylpyrazolium cation; pyrazolinium cations such as 1-ethyl-2, 3, 5-trimethylpyrazolinium cation, 1-propyl-2, 3, 5-trimethylpyrazolinium cation, and 1-butyl-2, 3, 5-trimethylpyrazolinium cation.

Examples of the cation represented by the general formula (4) include: and tetraalkylammonium cations, trialkylsulfonium cations, tetraalkylphosphonium cations, and ions obtained by substituting a part of the above alkyl groups with alkenyl groups, alkoxy groups, and further epoxy groups.

Specific examples of the cation represented by the general formula (4) include: asymmetric tetraalkylammonium cations such as triethylmethylammonium cation, tributylethylammonium cation, trimethyldecyl ammonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecylphosphonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation, trimethyldecylphosphonium cation, trialkylsulfonium cation, tetraalkylphosphonium cation, N-diethyl-N-methyl-N- (2-methoxyethyl) ammonium cation, glycidyl trimethylammonium cation, diallyl dimethylammonium cation, N, N-dimethyl-N-ethyl-N-propylammonium cation, N-dimethyl-N-ethyl-N-butylammonium cation, N-dimethyl-N-ethyl-N-pentylammonium cation, N-dimethyl-N-ethyl-N-hexylammonium cation, N-dimethyl-N-ethyl-N-heptylammonium cation, N, N-dimethyl-N-ethyl-N-nonylammonium cation, N-dimethyl-N, N-dipropylammonium cation, N-diethyl-N-propyl-N-butylammonium cation, N-dimethyl-N-propyl-N-pentylammonium cation, N-dimethyl-N-propyl-N-hexylammonium cation, N, N-dimethyl-N-propyl-N-heptylammonium cation, N-dimethyl-N-butyl-N-hexylammonium cation, N-diethyl-N-butyl-N-heptylammonium cation, N-dimethyl-N-pentyl-N-hexylammonium cation, N-dimethyl-N, N-dihexylammonium cation, trimethylheptylammonium cation, N-diethyl-N-methyl-N-propylammonium cation, N-diethyl-N-methyl-N-pentylammonium cation, N-diethyl-N-methyl-N-heptylammonium cation, N, N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation, triethylpentylammonium cation, triethylheptylammonium cation, N-dipropyl-N-methyl-N-ethylammonium cation, N-dipropyl-N-methyl-N-pentylammonium cation, N, N-dipropyl-N-butyl-N-hexylammonium cation, N-dipropyl-N, N-dihexylammonium cation, N-dibutyl-N-methyl-N-pentylammonium cation, N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N-ethyl-N-propyl-N-pentylammonium cations and the like, and more preferably trimethylpropylammonium cations.

As for the fluoroorganic anion which can constitute the ionic liquid, any suitable fluoroorganic anion can be used within a range not impairing the effect of the present invention. Such fluoroorganic anions may be fully fluorinated (perfluorinated) or may be partially fluorinated.

Examples of such fluorine organic anions include: perfluoroalkyl sulfonates, bis (fluorosulfonyl) imides, bis (perfluoroalkanesulfonyl) imides, more specifically, for example: triflate, pentafluoroethanesulfonate, heptafluoropropanesulfonate, nonafluorobutanesulfonate, bis (fluorosulfonyl) imide, bis (trifluoromethanesulfonyl) imide.

Specific examples of the ionic liquid may be appropriately selected from combinations of the above cationic component and the above anionic component. Specific examples of such ionic liquids include: 1-hexylpyridinium bis (fluorosulfonyl) imide, 1-ethyl-3-methylpyridinium triflate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropane sulfonate, 1-ethyl-3-methylpyridinium nonafluorobutylsulfonate, 1-butyl-3-methylpyridinium triflate, 1-butyl-3-methylpyridinium bis (trifluoromethylsulfonyl) imide, 1-octyl-4-methylpyridinium bis (fluorosulfonyl) imide, 1-methyl-1-propylpyrrolidinium bis (trifluoromethylsulfonyl) imide 1-methyl-1-propylpyrrolidinium bis (fluorosulfonyl) imide, 1-methyl-1-propylpiperidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-propylpiperidinium bis (fluorosulfonyl) imide, 1-ethyl-3-methylimidazolium triflate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide, 1-ethyl-3-methylimidazolium bis (fluorosulfonyl) imide, 1-hexyl-3-methylimidazolium bis (fluorosulfonyl) imide, trimethyl propyl ammonium bis (trifluoromethanesulfonyl) imide, lithium bis (trifluoromethanesulfonyl) imide, and lithium bis (fluorosulfonyl) imide.

The ionic liquid may be commercially available or synthesized as follows. The method for synthesizing the ionic liquid is not particularly limited as long as the target ionic liquid can be obtained, and generally, a halide method, a hydroxide method, an acid ester method, a complex formation method, a neutralization method, and the like described in the literature "ionic liquid-the forefront of development and the future" (CMC published).

Hereinafter, the synthesis method of the halide method, hydroxide method, acid ester method, complex formation method and neutralization method will be described by taking a nitrogen-containing onium salt as an example, and other ionic liquids such as other sulfur-containing onium salts and phosphonium-containing salts can be obtained by the same method.

The halide method is a method performed by using reactions represented by the reaction formulae (1) to (3). First, a tertiary amine is reacted with a halogenated alkane to obtain a halide (formula (1), and chlorine, bromine, and iodine are used as the halogen.

The obtained halide is reacted with an anionic structure (A) having a target ionic liquid ^- ) The acid (HA) or salt (MA, M is the cation of ammonium, lithium, sodium, potassium, etc. forming a salt with the target anion) to obtain the target ionic liquid (R) ₄ NA)。

(1)R ₃ N+RX→R ₄ NX(X：Cl，Br，I)

(2)R ₄ NX+HA→R ₄ NA+HX

(3)R ₄ NX+MA→R ₄ NA+MX(M：NH ₄ Li, na, K, ag, etc

The hydroxide method is a method performed by using reactions represented by the reaction formulae (4) to (8). First, the electrolyte (equation (4)), the OH-type ion exchange resin method (equation (5)) or the silver oxide (Ag) is used ₂ The reaction of O) (equation (6)) is carried out from a halide (R) ₄ NX) to give hydroxide (R) ₄ NOH) (as halogen, chlorine, bromine, iodine are used).

The obtained hydroxide was reacted in the same manner as in the halogenation method described above by using the reactions of the reaction formulae (7) to (8) to obtain the target ionic liquid (R) ₄ NA)。

(4)R ₄ NX+H ₂ O→R ₄ NOH+1/2H ₂ +1/2X ₂ (X：Cl，Br，1)

(5)R ₄ NX+P-OH→R ₄ NOH+P-X (P-OH: OH type ion exchange resin)

(6)R ₄ NX+1/2Ag ₂ O+1/2H ₂ O→R ₄ NOH+AgX

(7)R ₄ NOH+HA→R ₄ NA+H ₂ O

(8)R ₄ NOH+MA→R ₄ NA+MOH(M：NH ₄ Li, na, K, ag, etc

The acid ester method is a method performed by using reactions represented by the reaction formulae (9) to (11). First, tertiary amine (R) ₃ N) and an acid ester to obtain an acid ester (reaction formula (9), and as the acid ester, esters of inorganic acids such as sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, and carbonic acid, and esters of organic acids such as methanesulfonic acid, methylphosphonic acid, and formic acid are used.

The obtained acid ester compound was reacted in the same manner as in the halogenation method described above by using the reaction formulae (10) to (11) to obtain the target ionic liquid (R) ₄ NA). In addition, by using methyl triflate, methyl trifluoroacetate, or the like as the acid ester, the ionic property can also be obtained directlyA liquid.

(9)R ₃ N+ROY→R ₄ NOY

(10)R ₄ NOY+HA→R ₄ NA+HOY

(11)R ₄ NOY+MA→R ₄ NA+MOY(M：NH ₄ Li, na, K, ag, etc

The neutralization method is a method performed by using a reaction represented by the reaction formula (12). By reacting tertiary amines with CF ₃ COOH、CF ₃ SO ₃ H、(CF ₃ SO ₂ ) ₂ NH、(CF ₃ SO ₂ ) ₃ CH、(C ₂ F ₅ SO ₂ ) ₂ Organic acids such as NH.

(12)R ₃ N+HZ→R ₃ HN ⁺ Z ^-

[Hz：CF ₃ COOH，CF ₃ SO ₃ H，(CF ₃ SO ₂ ) ₂ NH，(CF ₃ SO ₂ ) ₃ CH，(C ₂ F ₆ SO ₂ ) ₂ Organic acids such as NH

R in the above-mentioned reaction formulae (1) to (12) represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms, and may contain a heteroatom.

As for the ion conductive polymer, any suitable ion conductive polymer may be employed within a range that does not impair the effects of the present invention. Examples of such ion-conducting polymers include: an ion-conductive complex obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium salt group; conductive polymers such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine polymers. The ion conductive polymer may be 1 or 2 or more.

As for the ion conductive filler, any suitable ion conductive filler may be employed within a range that does not impair the effects of the present invention. Examples of such ion-conductive fillers include: tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, iron, cobalt, copper iodides, ITO (indium oxide/tin oxide), ATO (antimony oxide/tin oxide), and the like. The ion conductive filler may be 1 or 2 or more.

As the conductive polymer, any suitable conductive polymer may be used within a range that does not impair the effects of the present invention. Examples of such conductive polymers include: (3, 4-ethylenedioxythiophene) -poly (styrenesulfonic acid), and the like.

<1-2-6. Other Components >

The adhesive composition (at least 1 selected from the group consisting of an acrylic adhesive composition, a urethane adhesive composition, a rubber adhesive composition, and a silicone adhesive composition) which is a material of the adhesive layer (1) may contain any suitable other component within a range that does not impair the effects of the present invention. Examples of such other components include: other polymer components, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), aging inhibitors, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foils, ultraviolet absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

1-3 resin film (2)

The thickness of the resin film (2) may be any suitable thickness as long as the effect of the present invention is not impaired. Such a thickness is preferably 25 μm to 500. Mu.m, more preferably 25 μm to 400. Mu.m, still more preferably 25 μm to 300. Mu.m, particularly preferably 25 μm to 200. Mu.m, and most preferably 25 μm to 150. Mu.m, from the viewpoint of further exhibiting the effects of the present invention.

As described above, the laminated portion of the resin film (2) and the adhesive layer (1) is divided into a plurality of through holes having a predetermined length in a direction substantially orthogonal to the longitudinal direction.

The resin film (2) comprises a resin base film (2 a).

Examples of the resin base film (2 a) include: plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); plastic films comprising an olefin resin containing an α -olefin as a monomer component, such as Polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), an ethylene-propylene copolymer, and an ethylene-vinyl acetate copolymer (EVA); plastic films composed of polyvinyl chloride (PVC); a plastic film made of a vinyl acetate resin; a plastic film composed of Polycarbonate (PC); plastic films composed of polyphenylene sulfide (PPS); a plastic film made of an amide resin such as polyamide (nylon) and wholly aromatic polyamide (aramid); a plastic film made of polyimide resin; a plastic film composed of Polyetheretherketone (PEEK); plastic films made of olefin resins such as Polyethylene (PE) and polypropylene (PP); plastic films comprising fluorine-based resins such as polytetrafluoroethylene, chlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer; etc.

The resin base film (2 a) may have only 1 layer or 2 or more layers. The resin base film (2 a) may be stretched.

The resin base film (2 a) may be subjected to a surface treatment. Examples of the surface treatment include: corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, coating treatment with a primer, and the like.

The resin base film (2 a) may contain any suitable additive according to the purpose within a range that does not impair the effect of the present invention.

The resin film (2) may also have a conductive layer (2 b). The conductive layer (2 b) may be disposed between the adhesive layer (1) and the resin base film (2 a).

The conductive layer (2 b) may be 1 layer or 2 or more layers.

The conductive layer (2 b) may be provided by being formed on any suitable substrate. As such a substrate, a resin substrate film (2 a) is preferable.

The conductive layer (2 b) is formed into a conductive film on any suitable substrate (preferably, the resin substrate film (2 a)) by any suitable film forming method such as vacuum deposition, sputtering, ion plating, spray pyrolysis, electroless plating, electric plating, or a combination of these methods. Among these thin film forming methods, the vacuum vapor deposition method and the sputtering method are preferable from the viewpoints of the rate of forming the conductive film, the formability of the large-area film, the productivity, and the like.

As a material for forming the conductive film, for example, use is made of: a metal material including gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, an alloy of these, and the like; a metal oxide material including indium oxide, tin oxide, titanium oxide, cadmium oxide, a mixture of these, and the like; other metal compounds including copper iodides and the like; etc.

The thickness of the conductive layer (2 b) may be any suitable thickness as long as the effect of the present invention is not impaired. Such a thickness is preferable, for example, when formed of a metal materialWhen formed of a metal oxide material, it is preferably +.>

The surface resistance of the conductive layer (2 b) is preferably 1.0X10 ¹⁰ Omega/≡or less, more preferably 1.0X10 ⁹ Omega/≡or less, more preferably 1.0X10 ⁸ Omega/≡or less, particularly preferably 1.0X10 ⁷ Ω/≡or less.

When the conductive film is formed on any suitable substrate (preferably, the resin substrate film (2 a)), the surface of the substrate (preferably, the resin substrate film (2 a)) may be subjected to any suitable pretreatment such as corona discharge treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, and priming treatment, so as to improve the adhesion between the conductive film and the substrate (preferably, the resin substrate film (2 a)).

The resin film (2) may also have an antistatic layer (2 c). The antistatic layer (2 c) may be disposed between the adhesive layer (1) and the resin base film (2 a) and/or between the resin base film (2 a) and the adhesive layer (2).

The antistatic layer (2 c) may be 1 layer or 2 layers or more.

The thickness of the antistatic layer (2 c) may be any suitable thickness as long as the effect of the present invention is not impaired. The thickness is preferably 1nm to 1000nm, more preferably 5nm to 900nm, still more preferably 7.5nm to 800nm, particularly preferably 10nm to 700nm.

The surface resistance value of the antistatic layer (2 c) is preferably 1.0X10 ¹⁰ Omega/≡or less, more preferably 8.0X10 ⁹ Omega/≡or less, more preferably 5.0X10 ⁹ Omega/≡or less, particularly preferably 1.0X10 ⁹ Ω/≡or less.

The antistatic layer (2 c) may be any suitable antistatic layer as long as it is a layer capable of exhibiting an antistatic effect, within a range that does not impair the effect of the present invention. As such an antistatic layer, an antistatic layer formed by applying a conductive coating liquid containing a conductive polymer onto any appropriate base layer is preferable. Specifically, for example, an antistatic layer is formed by coating a conductive coating liquid containing a conductive polymer on a resin base film (2 a). After the application, drying is performed as needed, and curing treatment (heat treatment, ultraviolet treatment, etc.) is performed as needed. Specific coating methods include: roll coating, bar coating, gravure coating, and the like.

As for the conductive coating liquid containing the conductive polymer, any suitable conductive coating liquid may be used within a range that does not impair the effects of the present invention. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent, and a solvent. The solvent is volatilized and evaporated by heating or the like during the formation of the antistatic layer (2 c), and thus substantially disappears, and therefore, the antistatic layer (2 c) preferably contains a conductive polymer, a binder and a crosslinking agent.

Examples of the solvent include: an organic solvent, water, or a mixed solvent of these. Examples of the organic solvent include: esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as Tetrahydrofuran (THF) and dioxane; aliphatic or alicyclic hydrocarbons such as n-hexane and cyclohexane; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; glycol ethers such as alkylene glycol monoalkyl ethers (e.g., ethylene glycol monomethyl ether, ethylene glycol monoethyl ether), and dialkylene glycol monoalkyl ethers. The solvent is preferably water or a mixed solvent containing water as a main component (for example, a mixed solvent of water and ethanol).

The content ratio of the conductive polymer in the antistatic layer (2 c) is preferably 3 to 80 wt%, more preferably 5 to 60 wt%.

As the conductive polymer, any suitable conductive polymer may be used within a range that does not impair the effects of the present invention. Examples of such conductive polymers include: a conductive polymer doped with a polyanion in the pi-conjugated conductive polymer, and the like. Examples of the pi-conjugated conductive polymer include: chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. As the polyanion, there may be mentioned: polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallylsulfonic acid, polyethylene sulfonate, polymethacrylate carboxylic acid, and the like.

The number of the conductive polymers may be 1 or 2 or more.

The content ratio of the binder in the antistatic layer (2 c) is preferably 50 to 95% by weight, more preferably 60 to 90% by weight.

As the binder that can be contained in the conductive coating liquid, any suitable binder can be used within a range that does not impair the effects of the present invention. The number of the binders may be 1 or 2 or more. As such a binder, a resin is preferable, and a polyester resin is more preferable. The proportion of the polyester resin in the binder is preferably 90 to 100% by weight, more preferably 98 to 100% by weight.

The polyester resin preferably contains polyester as a main component (component in a proportion of preferably more than 50 wt%, more preferably 75 wt% or more, still more preferably 90 wt% or more, particularly preferably substantially 100 wt%).

As the polyester, any suitable polyester may be used within a range that does not impair the effects of the present invention. Such a polyester preferably has the following structure: it is preferable that the structure is formed by condensing 1 or 2 or more compounds (polycarboxylic acid component) selected from polycarboxylic acids (for example, dicarboxylic acid compounds) having 2 or more carboxyl groups in one molecule and derivatives thereof (for example, anhydrides, esters, halides, etc. of polycarboxylic acids) with 1 or 2 or more compounds (polyol component) selected from polyols (for example, diols) having 2 or more hydroxyl groups in one molecule.

Any suitable polycarboxylic acid may be used as the polycarboxylic acid component within a range that does not impair the effects of the present invention. Examples of such polycarboxylic acid components include: aliphatic dicarboxylic acids such as oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acids, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acids, (±) -malic acid, meso-tartaric acid, itaconic acid, maleic acid, methyl maleic acid, fumaric acid, methyl fumaric acid, acetylene dicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methyl glutaric acid, pentenedioic acid, adipic acid, dithioadipic acid, methyl adipic acid, dimethyl adipic acid, tetramethyl adipic acid, methylene adipic acid, muconic acid, galactose diacid, pimelic acid, suberic acid, perfluorosuberic acid, 3, 6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, tridecanedioic acid, dodecanedicarboxylic acid, tridecanedioic acid, tetradecyldicarboxylic acid; alicyclic dicarboxylic acids such as cycloalkyl dicarboxylic acid (e.g., 1, 4-cyclohexane dicarboxylic acid, 1, 2-cyclohexane dicarboxylic acid), 1,4- (2-norbornene) dicarboxylic acid, 5-norbornene-2, 3-dicarboxylic acid (HIMIC acid), adamantane dicarboxylic acid, and spiroheptane dicarboxylic acid; aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, dithioisophthalic acid, methyl isophthalic acid, dimethyl isophthalic acid, chloroisophthalic acid, dichloro isophthalic acid, terephthalic acid, methyl terephthalic acid, dimethyl terephthalic acid, chloro terephthalic acid, bromo terephthalic acid, naphthalene dicarboxylic acid, dibenzoyl dibenzoic acid, anthracene dicarboxylic acid, biphenyl dicarboxylic acid, biphenylene dicarboxylic acid, dimethylbenzenedicarboxylic acid, 4 "-terphenyl dicarboxylic acid, 4" -p-tetrabenzenedicarboxylic acid, dibenzyl dicarboxylic acid, azobenzene dicarboxylic acid, homophthalic acid, phenylene diacetic acid, phenylene dipropionic acid, naphthalene dicarboxylic acid, naphthalene dipropionic acid, biphenyl diacetic acid, biphenyl dipropionic acid, 3' - [4,4' - (methylenedi-p-biphenylene) ] dipropionic acid, 4' -dibenzyl diacetic acid, 3' - [ (4, 4' -dibenzyl) ] dipropionic acid, oxydi-p-phenylene diacetic acid; anhydrides of any of the above polycarboxylic acids; esters of any of the above polycarboxylic acids (e.g., alkyl esters, monoesters, diesters, etc.); acyl halides (e.g., diformyl chloride) corresponding to any of the polycarboxylic acids described above; etc.

The polycarboxylic acid component may preferably be exemplified by: aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid and naphthalene dicarboxylic acid, and anhydrides thereof; aliphatic dicarboxylic acids such as adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, 5-norbornene-2, 3-dicarboxylic acid, and 1, 4-cyclohexanedicarboxylic acid, and anhydrides thereof; lower alkyl esters of these dicarboxylic acids (for example, esters with monohydric alcohols having 1 to 3 carbon atoms) and the like.

As the polyol component, any suitable polyol may be used within a range that does not impair the effects of the present invention. Examples of such a polyol component include: diols such as ethylene glycol, propylene glycol, 1, 2-propylene glycol, 1, 3-butanediol, 1, 4-butanediol, neopentyl glycol, 1, 5-pentanediol, 1, 6-hexanediol, 3-methylpentanediol, diethylene glycol, 1, 4-cyclohexanedimethanol, 3-methyl-1, 5-pentanediol, 2-methyl-1, 3-propanediol, 2-diethyl-1, 3-propanediol, 2-butyl-2-ethyl-1, 3-propanediol, xylylene glycol, hydrogenated bisphenol A, bisphenol A; alkylene oxide adducts of these diols (for example, ethylene oxide adducts, propylene oxide adducts, etc.), and the like.

The molecular weight of the polyester resin is preferably 5×10 in terms of weight average molecular weight (Mw) in terms of standard polystyrene as measured by Gel Permeation Chromatography (GPC) ³ ～1.5×10 ⁵ More preferably 1X 10 ⁴ ～6×10 ⁴ 。

The glass transition temperature (Tg) of the polyester resin is preferably from 0℃to 120℃and more preferably from 10℃to 80 ℃.

As the polyester resin, for example, a commercially available product "VYLONAL" manufactured by Toyobo Co., ltd, or the like can be used.

The conductive coating liquid may further contain a resin other than the polyester resin (for example, at least one resin selected from the group consisting of acrylic resins, acrylic urethane resins, acrylic styrene resins, acrylic silicone resins, polysilazane resins, polyurethane resins, fluorine resins, and polyolefin resins) as a binder within a range that does not impair the effects of the present invention.

As the crosslinking agent that may be contained in the conductive coating liquid, any suitable crosslinking agent may be used within a range that does not impair the effects of the present invention. The number of the crosslinking agents may be 1 or 2 or more. As such a crosslinking agent, there may be preferably mentioned: isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents, and the like. Among them, melamine-based crosslinking agents are preferable.

The content ratio of the crosslinking agent in the antistatic layer (2 c) is preferably 1 to 30% by weight, more preferably 2 to 20% by weight.

The antistatic layer (2 c) may contain any suitable other component within a range that does not impair the effects of the present invention.

1-4 adhesive layer (2)

The adhesive layer (2) may be any suitable adhesive layer within a range that does not impair the effects of the present invention. The pressure-sensitive adhesive layer (2) may be 1 layer or 2 or more layers.

The thickness of the pressure-sensitive adhesive layer (2) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, still more preferably 2 μm to 80 μm, particularly preferably 3 μm to 50 μm, and most preferably 5 μm to 30 μm, from the viewpoint of further exhibiting the effect of the present invention.

The adhesive layer (2) may be formed by any suitable method. Examples of such methods include the following: an adhesive composition for forming an adhesive constituting the adhesive layer (2) is applied to any suitable substrate (e.g., a resin film (3)), and heated and dried as necessary, and cured as necessary, thereby forming an adhesive layer on the substrate. Examples of such a coating method include: gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, air knife coater, spray coater, comma coater, direct coater, roll brush coater, and the like.

1-4-1 acrylic Adhesives

The adhesive layer (2) is preferably composed of an acrylic adhesive.

The acrylic adhesive is formed from an acrylic adhesive composition.

Acrylic polymers are known in the art of acrylic adhesives as so-called base polymers. The number of acrylic polymers may be 1 or 2 or more.

The acrylic polymer is preferably an acrylic polymer formed by polymerizing a composition (B) containing at least 1 selected from the group consisting of (meth) acrylic acid esters having an OH group and (meth) acrylic acid, wherein the alkyl group of the (a) alkyl ester moiety has 4 to 12 carbon atoms. The number of components (a) and (b) may be 1 or 2 or more, respectively.

The composition (B) may contain a copolymerizable monomer other than the component (a) and the component (B). The number of copolymerizable monomers may be 1 or 2 or more. Examples of such copolymerizable monomers include: carboxylic group-containing monomers (excluding (meth) acrylic acid) such as itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and anhydrides of these (for example, anhydride group-containing monomers such as maleic anhydride and itaconic anhydride); amide group-containing monomers such as (meth) acrylamide, N-dimethyl (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, and N-hydroxyethyl (meth) acrylamide; amino group-containing monomers such as aminoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate; epoxy group-containing monomers such as glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; heterocyclic vinyl monomers such as N-vinyl-2-pyrrolidone, (meth) acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, and vinyloxazole; sulfonic acid group-containing monomers such as sodium vinylsulfonate; phosphate group-containing monomers such as 2-hydroxyethyl acrylate; imide group-containing monomers such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomers such as 2-methacryloxyethyl isocyanate; (meth) acrylic esters having an alicyclic hydrocarbon group such as cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, and isobornyl (meth) acrylate; (meth) acrylic esters having an aromatic hydrocarbon group such as phenyl (meth) acrylate, phenoxyethyl (meth) acrylate, benzyl (meth) acrylate, and the like; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyl toluene; olefins such as ethylene, butadiene, isoprene and isobutylene, and dienes; vinyl ethers such as vinyl alkyl ether; vinyl chloride, and the like.

As the copolymerizable monomer, a polyfunctional monomer may be used. The polyfunctional monomer is a monomer having 2 or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any suitable ethylenically unsaturated group may be employed within a range that does not impair the effects of the present invention. Examples of such an ethylenically unsaturated group include: radical polymerizable functional groups such as vinyl, propenyl, isopropenyl, vinyl ether (ethyleneoxy), and allyl ether (allyloxy). Examples of the polyfunctional monomer include: hexanediol di (meth) acrylate, butanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tri (meth) acrylate, allyl (meth) acrylate, vinyl (meth) acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, and the like. Such a polyfunctional monomer may be 1 or 2 or more.

The composition (B) may contain any suitable other component within a range that does not impair the effects of the present invention. Examples of such other components include: polymerization initiator, chain transfer agent, solvent, etc. The content of these other components may be any suitable content within a range that does not impair the effects of the present invention.

The thermal polymerization initiator may be preferably used in obtaining the acrylic polymer by solution polymerization. Examples of such a thermal polymerization initiator include: azo-based polymerization initiators, peroxide-based polymerization initiators (e.g., dibenzoyl peroxide, t-butyl peroxymaleate, etc.), redox-based polymerization initiators, and the like. Among these thermal polymerization initiators, azo-based initiators disclosed in JP-A2002-69411 are particularly preferred. Such an azo-based polymerization initiator is preferable in that the decomposition product of the polymerization initiator is less likely to remain in the acrylic polymer as a part that causes generation of a heating generation gas (outgas). Examples of azo polymerization initiators include: 2,2 '-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2' -azobis-2-methylbutyronitrile (hereinafter sometimes referred to as AMBN), dimethyl 2,2 '-azobis (2-methylpropionate), 4' -azobis-4-cyanovaleric acid, and the like.

Examples of the crosslinking agent include: polyfunctional isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents, and the like. Among these, at least 1 (component c) selected from the group consisting of a polyfunctional isocyanate-based crosslinking agent and an epoxy-based crosslinking agent is preferable from the viewpoint of further exhibiting the effects of the present invention.

1-4-2. Conductive component ]

The adhesive layer (2) may also contain a conductive component. As the conductive component, the description in the item < 1-2-5. Conductive component > can be directly cited.

< 1-4-3. Other Components >

The adhesive composition (preferably, an acrylic adhesive composition) to be the material of the adhesive layer (2) may contain any suitable other component within a range that does not impair the effect of the present invention. Examples of such other components include: other polymer components, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), aging inhibitors, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foils, ultraviolet absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

1-5 resin film (3)

The thickness of the resin film (3) is preferably 4 to 450. Mu.m, more preferably 8 to 350. Mu.m, still more preferably 12 to 250. Mu.m, particularly preferably 16 to 150. Mu.m, and most preferably 20 to 100. Mu.m, from the viewpoint of further exhibiting the effect of the present invention.

The resin film (3) comprises a resin base film (3 a).

Examples of the resin base film (3 a) include: plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); plastic films comprising an olefin resin containing an α -olefin as a monomer component, such as Polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), an ethylene-propylene copolymer, and an ethylene-vinyl acetate copolymer (EVA); plastic films composed of polyvinyl chloride (PVC); a plastic film made of a vinyl acetate resin; a plastic film composed of Polycarbonate (PC); plastic films composed of polyphenylene sulfide (PPS); a plastic film made of an amide resin such as polyamide (nylon) and wholly aromatic polyamide (aramid); a plastic film made of polyimide resin; a plastic film composed of Polyetheretherketone (PEEK); plastic films made of olefin resins such as Polyethylene (PE) and polypropylene (PP); plastic films comprising fluorine-based resins such as polytetrafluoroethylene, chlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer; etc.

The resin base film (3 a) may have only 1 layer or 2 or more layers. The resin base film (3 a) may be stretched.

The resin base film (3 a) may be subjected to surface treatment. Examples of the surface treatment include: corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, coating treatment with a primer, and the like.

For example, a fatty acid amide, a polyethyleneimine, a long-chain alkyl-based additive, or the like may be added to the resin film (3) to release the film from the surface of the resin film (3) on which the adhesive layer (2) is not provided, or a coating layer containing any suitable release agent such as a silicone-based, long-chain alkyl-based, or fluorine-based agent may be provided, in order to form a wound body or the like that is easily unwound.

The resin film (3) may contain any suitable additive according to the purpose within a range that does not impair the effect of the present invention.

The resin film (3) may also have a conductive layer (3 b). The conductive layer (3 b) may be disposed between the adhesive layer (2) and the resin base film (3 a).

The conductive layer (3 b) may be 1 layer or 2 or more layers.

The conductive layer (3 b) may be provided by being formed on any suitable substrate. As such a substrate, a resin substrate film (3 a) is preferable.

The conductive layer (3 b) is formed into a conductive film on any suitable substrate (preferably, the resin substrate film (3 a)) by any suitable film forming method such as vacuum deposition, sputtering, ion plating, spray pyrolysis, electroless plating, electric plating, or a combination of these methods. Among these thin film forming methods, the vacuum deposition method and the sputtering method are preferable in terms of the rate of forming the conductive film, the formability of the large-area film, the productivity, and the like.

As a material for forming the conductive film, for example, use is made of: a metal material including gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, an alloy of these, and the like; a metal oxide material including indium oxide, tin oxide, titanium oxide, cadmium oxide, a mixture of these, and the like; other metal compounds including copper iodides and the like.

The thickness of the conductive layer (3 b) may be any suitable thickness as long as the effect of the present invention is not impaired. Such a thickness is preferable, for example, when formed of a metal materialWhen formed of a metal oxide material, it is preferably +.>

The surface resistance value of the conductive layer (3 b) is preferably 1.0X10 ¹⁰ Omega/≡or less, more preferably 1.0X10 ⁹ Omega/≡or less, more preferably 1.0X10 ⁸ Omega/≡or less, particularly preferably 1.0X10 ⁷ Ω/≡or less.

When the conductive film is formed on any suitable substrate (preferably, the resin substrate film (3 a)), the surface of the substrate (preferably, the resin substrate film (3 a)) may be subjected to any suitable pretreatment such as corona discharge treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, or priming treatment, to thereby improve the adhesion between the conductive film and the substrate (preferably, the resin substrate film (3 a)).

The resin film (3) may also have an antistatic layer (3 c). The antistatic layer (3 c) may be disposed between the adhesive layer (2) and the resin base film (3 a) and/or on the opposite side of the adhesive layer (2) from the resin base film (3 a).

The antistatic layer (3 c) may be 1 layer or 2 layers or more.

The thickness of the antistatic layer (3 c) may be any suitable thickness as long as the effect of the present invention is not impaired. The thickness is preferably 1nm to 1000nm, more preferably 5nm to 900nm, still more preferably 7.5nm to 800nm, particularly preferably 10nm to 700nm.

The surface resistance value of the antistatic layer (3 c) is preferably 1.0X10 ¹⁰ Omega/≡or less, more preferably 8.0X10 ⁹ Omega/≡or less, more preferably 5.0X10 ⁹ Omega/≡or less, particularly preferably 1.0X10 ⁹ Ω/≡or less.

The antistatic layer (3 c) may be any suitable antistatic layer as long as it is a layer capable of exhibiting an antistatic effect, within a range that does not impair the effect of the present invention. As such an antistatic layer, an antistatic layer formed by applying a conductive coating liquid containing a conductive polymer onto any appropriate base layer is preferable. Specifically, for example, an antistatic layer is formed by coating a conductive coating liquid containing a conductive polymer on the resin base film (3 a). After the application, drying is performed as needed, and curing treatment (heat treatment, ultraviolet treatment, etc.) is performed as needed. Specific coating methods include: roll coating, bar coating, gravure coating, and the like.

As for the conductive coating liquid containing the conductive polymer, any suitable conductive coating liquid may be used within a range that does not impair the effects of the present invention. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent, and a solvent. The solvent is volatilized and evaporated by heating or the like during the formation of the antistatic layer (3 c), and thus substantially disappears, and therefore, the antistatic layer (3 c) preferably contains a conductive polymer, a binder and a crosslinking agent.

The content ratio of the conductive polymer in the antistatic layer (3 c) is preferably 3 to 80 wt%, more preferably 5 to 60 wt%.

The number of the conductive polymers may be 1 or 2 or more.

The content ratio of the binder in the antistatic layer (3 c) is preferably 50 to 95% by weight, more preferably 60 to 90% by weight.

The content ratio of the crosslinking agent in the antistatic layer (3 c) is preferably 1 to 30% by weight, more preferably 2 to 20% by weight.

The antistatic layer (3 c) may contain any suitable other component within a range that does not impair the effects of the present invention.

Method for producing laminate

The laminate of the present invention can be produced by any suitable method within a range that does not impair the effects of the present invention.

As a typical example of the method for producing a laminate of the present invention, a case will be described in which the laminate of the present invention is a laminate comprising, in order, a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3).

In one embodiment of the method for producing a laminate of the present invention, a laminate (I) comprising a resin film (1), an adhesive layer (1), and a resin film (2) in this order and a laminate (II) comprising an adhesive layer (2) and a resin film (3) in this order and comprising these components are produced, respectively, and then the surface of the resin film (2) of the laminate (I) and the surface of the adhesive layer (2) of the laminate (II) are attached.

For example, an adhesive composition (at least 1 selected from the group consisting of an acrylic adhesive composition, a urethane adhesive composition, a rubber adhesive composition, and a silicone adhesive composition) for forming an adhesive constituting the adhesive layer (1) is applied to the resin film (2), and the laminate (I) is heated and dried as needed, and then cured as needed, thereby forming the adhesive layer (1) on the resin film (2), and thereafter, the resin film (1) is attached to the surface of the adhesive layer (1) on the opposite side of the resin film (2) (the release layer (1 b) side when the release layer (1 b) is provided). Thereafter, CO is utilized ₂ Laser light or the like, and a plurality of portions are half-cut from the resin film (2) side to the surface of the resin film (1) (that is, the resin film (1) is not cut) so that the width of the portion to be cut becomes a predetermined width and the width of the portion not cut becomes a predetermined width, and the half-cut portion is removed by any suitable method.

For the laminate (II), for example, an adhesive composition (preferably an acrylic adhesive composition) for forming an adhesive constituting the adhesive layer (2) is applied onto the resin film (3), heated and dried as necessary, and then cured as necessary, thereby forming the adhesive layer (2) on the resin film (3). In the period until the laminate (I) and the laminate (II) are attached, any suitable separator (for example, a film similar to the resin film (1)) may be attached in order to protect the exposed surface of the adhesive layer (2).

Examples

The present invention will be specifically described below by way of examples, but the present invention is not limited to these examples. The test and evaluation methods in examples and the like are as follows. Note that "part" refers to "part by weight" unless otherwise specified, and "percent by weight" refers to "percent by weight" unless otherwise specified.

< determination of weight average molecular weight >

The weight average molecular weight is determined by Gel Permeation Chromatography (GPC). Specifically, trade name "HLC-8120GPC" (manufactured by Tosoh Co., ltd.) was used as a GPC measurement device, and measurement was performed under the following conditions, and the measurement was calculated from standard polystyrene conversion values.

(conditions for molecular weight measurement)

Sample concentration: 0.2 wt% (tetrahydrofuran solution)

Sample injection amount: 10 mu L

Column: trade name "TSKguardcolumn SuperHZ-H (1 root) +TSKgel SuperHZM-H (2 root)" (manufactured by Tosoh Co., ltd.)

Reference column: trade name "TSKgel SuperH-RC (1 root)" (manufactured by Tosoh Co., ltd.)

Eluent: tetrahydrofuran (THF)

Flow rate: 0.6mL/min

Detector: differential Refractometer (RI)

Column temperature (measurement temperature): 40 DEG C

< measurement of adhesive force when the adhesive layer (2) is peeled off from the resin film (2) at a peeling angle of 180 DEG and a peeling speed of 30 mm/min >

The separator of the laminate (I) of 10 cm. Times.10 cm was peeled off, and the surface of the adhesive layer of the sample for evaluation was adhered to a 10 cm. Times.10 cm glass plate (trade name: MICRO SLIDE GLASS S, manufactured by Song Nitro Co., ltd.) by means of a hand press roll under an atmosphere of a temperature of 23℃and a humidity of 50% RH, followed by pressure bonding at a pressure of 0.25 MPa. The surface protective film with separator (also referred to as carrier sheet) from which static electricity was removed in advance was cut into pieces of 25mm in width and 150mm in length, and the pieces of film were attached to the resin film side of the laminate (I) fixed to glass by one round trip by a 2.0kg roller under an atmosphere of a temperature of 23 ℃ and a humidity of 50% rh, and thereafter, pressure-bonded at a pressure of 0.25 MPa. After curing at a temperature of 23℃and a humidity of 50% RH for 30 minutes, the adhesive layer (2) was peeled off from the resin film (2) at a peeling angle of 180℃and a peeling speed of 30 mm/min by using a universal tensile tester (product name: TCM-1kNB, manufactured by Minebea Corp.) to measure the adhesive force.

< measurement of adhesive force when the adhesive layer (2) was peeled off from the resin film (2) at a peeling angle of 180 degrees at a peeling speed of 300 mm/min >

The separator of the laminate (I) of 10 cm. Times.10 cm was peeled off, and the surface of the adhesive layer of the sample for evaluation was adhered to a 10 cm. Times.10 cm glass plate (trade name: MICRO SLIDE GLASS S, manufactured by Song Nitro Co., ltd.) by means of a hand press roll under an atmosphere of a temperature of 23℃and a humidity of 50% RH, followed by pressure bonding at a pressure of 0.25 MPa. The surface protective film with separator (also referred to as carrier sheet) from which static electricity was removed in advance was cut into pieces of 25mm in width and 150mm in length, and the pieces of film were attached to the resin film side of the laminate (I) fixed to glass by one round trip by a 2.0kg roller under an atmosphere of a temperature of 23 ℃ and a humidity of 50% rh, and thereafter, pressure-bonded at a pressure of 0.25 MPa. After curing at a temperature of 23℃and a humidity of 50% RH for 30 minutes, the adhesive layer (2) was peeled off from the resin film (2) at a peeling angle of 180℃and a peeling speed of 300 mm/min by using a universal tensile tester (product name: TCM-1kNB, manufactured by Minebea Corp.) to measure the adhesive force.

< measurement of adhesive force when the adhesive layer (2) is peeled from the resin film (2) at 180 degree peel angle and 2400 mm/min peel speed >

The separator of the laminate (I) of 10 cm. Times.10 cm was peeled off, and the surface of the adhesive layer of the sample for evaluation was adhered to a 10 cm. Times.10 cm glass plate (trade name: MICRO SLIDE GLASS S, manufactured by Song Nitro Co., ltd.) by means of a hand press roll under an atmosphere of a temperature of 23℃and a humidity of 50% RH, followed by pressure bonding at a pressure of 0.25 MPa. The surface protective film with separator (also referred to as carrier sheet) from which static electricity was removed in advance was cut into pieces of 25mm in width and 150mm in length, and the pieces of film were attached to the resin film side of the laminate (I) fixed to glass by one round trip by a 2.0kg roller under an atmosphere of a temperature of 23 ℃ and a humidity of 50% rh, and thereafter, pressure-bonded at a pressure of 0.25 MPa. After curing at a temperature of 23℃and a humidity of 50% RH for 30 minutes, the adhesive layer (2) was peeled off from the resin film (2) at a peeling angle of 180℃and a peeling speed of 2400 mm/min by using a universal tensile tester (product name: TCM-1kNB, manufactured by Minebea Corp.) to measure the adhesive force.

< measurement of adhesive force (1) >)

An evaluation sample was prepared by cutting a laminate (I) comprising the resin film (1)/the adhesive layer (1)/the resin film (2) to a width of 25mm and a length of 150 mm. The resin film (1) was peeled off from the produced sample for evaluation at a temperature of 23℃and a humidity of 50% RH, and was attached to a glass plate (trade name: MICRO SLIDE GLASS S, manufactured by Song Nitro Co., ltd.) by one round trip with a 2.0kg roller. After curing at a temperature of 23℃and a humidity of 50% RH for 30 minutes, the film was peeled off at a peeling angle of 180℃and a peeling speed of 300 mm/min by a universal tensile tester, and the adhesive force (1) was measured.

< measurement of adhesive force (2) >)

The laminate (II) with separator comprising separator/adhesive layer (2)/resin film (3) was cut into a width of 25mm and a length of 150mm to prepare a sample for evaluation. An adherend described in the item < measurement of the adhesive force (1) > was prepared in advance, and the resin film (1) was peeled off from the laminate (I) and then attached to a glass plate, and the separator was peeled off from the sample for evaluation under an atmosphere of 50% rh at a temperature of 23 ℃, and was attached to the adherend once by a 2.0kg roller. After curing at a temperature of 23℃and a humidity of 50% RH for 30 minutes, the film was peeled off at a peeling angle of 180℃and a peeling speed of 300 mm/min by using a universal tensile tester, and the adhesive force (2) was measured.

< determination of Total light transmittance, haze >

The total light transmittance was measured under JIS-K-7361 using HM-150N from the Country color institute, and the haze was measured under JIS-K-7136. At this time, the 5-layer laminate is provided so that the resin film (3) faces the light source side.

< measurement of float >)

Cutting the laminate (I) into pieces of 50mm in width and 300mm in length, and using CO ₂ The laser is used for half-cutting from the side of the resin film (2) to the surface of the resin film (1) (i.e., the resin film (1) is not cut) at 5 positions at equal intervals with a width of 1mm, or at 5 positions at equal intervals with a width of 3mm, or at 5 positions at equal intervals with a width of 5mm, and the half-cut portions are manually removed. At this time perform The sample was prepared so that the distance between the half-cut and removed portions became 50 mm. Thereafter, the surface of the adhesive layer (2) of the laminate (II) cut into a width of 60mm and a length of 400mm was attached to the surface of the resin film (2) of the laminate (I) to prepare a measurement sample.

The measurement sample was wound around a 6-inch diameter reel so that the resin film (1) was positioned outside, the maximum amount of floating of the adhesive layer (2) was measured at the laminated portion of the plurality of divided adhesive layers (1) and the resin film (2) under a magnifying glass, and the average value of the measurements at any 5 positions was taken as the floating amount.

Production example 1 production of adhesive composition (1)

To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet pipe, and a condenser, 95 parts of butyl acrylate (manufactured by Nippon catalyst Co., ltd.), 5 parts of acrylic acid (manufactured by Toyama Synthesis Co., ltd.), 0.2 parts of 2,2' -azobisisobutyronitrile (manufactured by Wako pure chemical industries, ltd.) as a polymerization initiator, and 156 parts by weight of ethyl acetate were added, and the mixture was slowly stirred while introducing nitrogen, and the polymerization was carried out while maintaining the liquid temperature in the flask at about 63℃for 10 hours, to prepare a (meth) acrylic polymer (1) solution (40 wt%) having a weight average molecular weight of 70 ten thousand. To the (meth) acrylic polymer (1) solution, 6 parts by weight of tetra d-C (manufactured by mitsubishi gas chemical company) as a crosslinking agent in terms of solid content was added to 100 parts by weight of the solid content of the (meth) acrylic polymer (1) solution, and the mixture was diluted with ethyl acetate so that the total solid content became 20% by weight, and stirred with a disperser to obtain an adhesive composition (1) containing an acrylic resin.

Production example 2 production of adhesive composition (2)

100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon catalyst Co., ltd.), 4 parts by weight of 2-hydroxyethyl acrylate (manufactured by Toyama Synthesis Co., ltd.), 0.2 parts by weight of 2,2' -azobisisobutyronitrile (manufactured by Wako pure chemical industries, ltd.) as a polymerization initiator, and 156 parts by weight of ethyl acetate were added to a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet pipe, and a condenser, and the mixture was slowly stirred while maintaining the temperature of the liquid in the flask at about 65℃for 8 hours to perform polymerization, thereby preparing a (meth) acrylic polymer (2) solution (40% by weight) having a weight average molecular weight of 55 ten thousand. To the (meth) acrylic polymer (2) solution, corona HX (manufactured by Tosoh corporation) was added as a crosslinking agent in an amount of 4 parts by weight in terms of solid content, and an emilizer OL-1 (Tokyo Fine Chemical co., ltd.) in an amount of 0.01 parts by weight in terms of solid content was added as a crosslinking catalyst in an amount of 100 parts by weight in terms of solid content, based on the solid content of the (meth) acrylic polymer (2) solution, and the mixture was diluted with ethyl acetate so that the total solid content became 25% by weight, and stirred by a disperser to obtain an adhesive composition (2) containing an acrylic resin.

Production example 3 production of adhesive composition (3)

An adhesive composition (3) containing an acrylic resin was obtained in the same manner as in production example 2 except that the amount of the crosslinking catalyst used was changed to 0.05 parts by weight in terms of solid content.

Production example 4 production of adhesive composition (4)

100 parts by weight of 2-ethylhexyl acrylate (manufactured by Japanese catalyst Co., ltd.), 80 parts by weight of vinyl acetate monomer (manufactured by Showa electric Co., ltd.), 5 parts by weight of acrylic acid (manufactured by Toyama Synthesis Co., ltd.) and 45 parts by weight of toluene were added to a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet pipe and a condenser, and 0.2 part by weight of Nyper BW (manufactured by Nippon oil Co., ltd.) was introduced as a polymerization initiator while being slowly stirred, and a polymerization reaction was carried out while maintaining the liquid temperature in the flask at about 40℃for 3 hours to prepare a (meth) acrylic polymer (4) solution (35% by weight) having a weight average molecular weight of 70 ten thousand. To the (meth) acrylic polymer (4) solution, tetra d-C (manufactured by mitsubishi gas chemical company) was added as a crosslinking agent in an amount of 10 parts by weight in terms of solid content based on 100 parts by weight of the solid content of the (meth) acrylic polymer (4) solution, and the mixture was diluted with methyl ethyl ketone so that the total solid content became 20% by weight, and stirred by a disperser to obtain an adhesive composition (4) containing an acrylic resin.

Production example 5 production of adhesive composition (5)

PREMINOL S3011 (manufactured by Asahi Kabushiki Kaisha, mn=10000) as a polyfunctional polyol, coronate HX (manufactured by Japanese polyurethane Co., ltd.) as a crosslinking agent in an amount of 18 parts by weight in terms of solid content, and 0.04 parts by weight in terms of solid content were addedIron (manufactured by japan chemical industries) as a crosslinking catalyst and Irganox1010 (manufactured by BASF) as a deterioration inhibitor in an amount of 0.5 parts by weight in terms of solid content were diluted with ethyl acetate so that the total solid content became 35% by weight, and stirred with a disperser to obtain an adhesive composition (5) containing a urethane resin.

Production example 6 production of adhesive composition (6)

An adhesive composition (6) containing an acrylic resin was obtained in the same manner as in production example 1, except that the amount of tetra d-C (manufactured by mitsubishi gas chemical company) used as the crosslinking agent was 0.07 parts by weight in terms of solid content.

Production example 7 production of laminate (A)

The adhesive composition (6) obtained in production example 6 was applied to a base material "Lumirror S10" (thickness 75 μm, manufactured by tolay corporation) made of a polyester resin by a Fountain roll (Fountain roll) so that the thickness after drying became 15 μm, and cured and dried at a drying temperature of 130 ℃ for 2 minutes. Thus, an adhesive layer was formed on the substrate. Next, a silicone-treated surface of a base material made of a polyester resin "Lumirror S10" (75 μm thick, manufactured by tolay corporation) having a silicone-treated surface of 75 μm thickness was bonded to the surface of the pressure-sensitive adhesive layer, to obtain a laminate (a) of a resin film (silicone-treated surface)/a pressure-sensitive adhesive layer/a resin film.

Production example 8 production of laminate (B1)

The adhesive composition (1) obtained in production example 1 was applied onto a base material "Lumirror S10" (thickness 38 μm, manufactured by tolay corporation) formed of a polyester resin by a fountain roll so that the thickness after drying became 5 μm, and cured and dried at a drying temperature of 130 ℃ for 30 seconds. Thus, an adhesive layer was formed on the substrate. Next, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, on one surface of which silicone treatment was performed, was bonded to the surface of the pressure-sensitive adhesive layer, to obtain a laminate (B1) composed of a separator, a pressure-sensitive adhesive layer, and a resin film.

Production example 9 production of laminate (B2)

A laminate (B2) of a separator/adhesive layer/resin film structure was obtained in the same manner as in production example 8, except that the substrate "Lumirror S10" (thickness 38 μm, manufactured by tolay corporation) formed of a polyester resin was changed to "Lumirror S10" (thickness 50 μm, manufactured by tolay corporation).

Production example 10 production of laminate (B3)

A laminate (B3) of a separator/adhesive layer/resin film was obtained in the same manner as in production example 8, except that the substrate "Lumirror S10" (thickness 38 μm, manufactured by tolay corporation) formed of a polyester resin was changed to the substrate "Lumirror S10" (thickness 75 μm, manufactured by tolay corporation) and the thickness of the adhesive layer was changed to 15 μm.

Production example 11 production of laminate (B4)

The adhesive composition (2) obtained in production example 2 was applied onto a base material "Lumirror S10" (thickness 38 μm, manufactured by tolay corporation) made of a polyester resin by a fountain roll so that the thickness after drying became 20 μm, and cured and dried at a drying temperature of 130 ℃ for 30 seconds. Thus, an adhesive layer was formed on the substrate. Next, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, on one surface of which silicone treatment was performed, was bonded to the surface of the pressure-sensitive adhesive layer, to obtain a laminate (B4) composed of a separator, a pressure-sensitive adhesive layer, and a resin film.

Production example 12 production of laminate (B5)

The adhesive composition (3) obtained in production example 3 was applied onto a base material "Lumirror S10" (thickness 38 μm, manufactured by tolay corporation) formed of a polyester resin by a fountain roll so that the thickness after drying became 20 μm, and cured and dried at a drying temperature of 130 ℃ for 30 seconds. Thus, an adhesive layer was formed on the substrate. Next, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, on one surface of which silicone treatment was performed, was bonded to the surface of the pressure-sensitive adhesive layer, and a laminate (B5) of a separator/pressure-sensitive adhesive layer/resin film structure was obtained.

Production example 13 production of laminate (B6)

The adhesive composition (4) obtained in production example 4 was applied onto a base material "Lumirror S10" (thickness 38 μm, manufactured by tolay corporation) formed of a polyester resin by a fountain roll so that the thickness after drying became 20 μm, and cured and dried at a drying temperature of 130 ℃ for 30 seconds. Thus, an adhesive layer was formed on the substrate. Next, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, on one surface of which silicone treatment was performed, was bonded to the surface of the pressure-sensitive adhesive layer, to obtain a laminate (B6) composed of a separator, a pressure-sensitive adhesive layer, and a resin film.

Production example 14 production of laminate (B7)

The adhesive composition (5) obtained in production example 5 was applied onto a base material "Lumirror S10" (thickness 38 μm, manufactured by tolay corporation) formed of a polyester resin by a fountain roll so that the thickness after drying became 12 μm, and cured and dried at a drying temperature of 130 ℃ for 30 seconds. Thus, an adhesive layer was formed on the substrate. Next, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, on one surface of which silicone treatment was performed, was bonded to the surface of the pressure-sensitive adhesive layer, and a laminate (B7) of a separator/pressure-sensitive adhesive layer/resin film was obtained.

[ example 1 ]

The separator was peeled off from the laminate (B1) obtained in production example 8, and the resin film (resin film not subjected to silicone treatment) side of the laminate (a) obtained in production example 7 was attached to the exposed adhesive layer, thereby obtaining a laminate (1). The results are shown in Table 1.

[ example 2 ]

The separator was peeled off from the laminate (B2) obtained in production example 9, and the resin film (resin film not subjected to silicone treatment) side of the laminate (a) obtained in production example 7 was attached to the exposed adhesive layer, thereby obtaining a laminate (2). The results are shown in Table 1.

[ example 3 ]

The separator was peeled off from the laminate (B3) obtained in production example 10, and the resin film (resin film not subjected to silicone treatment) side of the laminate (a) obtained in production example 7 was attached to the exposed adhesive layer, thereby obtaining a laminate (3). The results are shown in Table 1.

[ example 4 ]

The separator was peeled off from the laminate (B4) obtained in production example 11, and the resin film (resin film not subjected to silicone treatment) side of the laminate (a) obtained in production example 7 was attached to the exposed adhesive layer, thereby obtaining a laminate (4). The results are shown in Table 1.

[ example 5 ]

The separator was peeled off from the laminate (B5) obtained in production example 12, and the resin film (resin film not subjected to silicone treatment) side of the laminate (a) obtained in production example 7 was attached to the exposed adhesive layer, thereby obtaining a laminate (5). The results are shown in Table 1.

[ example 6 ]

The separator was peeled off from the laminate (B6) obtained in production example 13, and the resin film (resin film not subjected to silicone treatment) side of the laminate (a) obtained in production example 7 was attached to the exposed adhesive layer to obtain a laminate (6). The results are shown in Table 1.

Comparative example 1

The separator was peeled off from the laminate (B7) obtained in production example 14, and the resin film (resin film not subjected to silicone treatment) side of the laminate (a) obtained in production example 7 was attached to the exposed adhesive layer, thereby obtaining a laminate (C1). The results are shown in Table 1.

TABLE 1

Industrial applicability

The laminate of the present invention can be suitably used in a process for producing an optical member, an electronic member, or the like.

Description of the reference numerals

Resin film (1) 10

Adhesive layer (1) 20

Resin film (2) 30

Adhesive layer (2) 40

Resin film (3) 50

Through hole 60

Laminate 100

Claims

1. A laminate comprising 5 or more layers of a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order,

the adhesive layer (1) is directly laminated with the resin film (2),

the resin film (2) is directly laminated with the adhesive layer (2),

The laminated part of the adhesive layer (1) and the resin film (2) is divided into a plurality of through holes with the width of 0.5-10 mm in the direction orthogonal to the length direction, the through holes are rectangular parallelepiped,

2. The laminate according to claim 1, wherein a total area of the resin film (2) on the plane direction side is smaller than a total area of the adhesive layer (2) on the plane direction side.