CN113261095A - 半导体装置、半导体装置的制造方法及电力转换装置 - Google Patents

半导体装置、半导体装置的制造方法及电力转换装置 Download PDF

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Publication number: CN113261095A
Authority: CN; China
Prior art keywords: lead frame; sealing member; semiconductor device; portions; bent portion
Prior art date: 2019-01-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201980088014.4A

Other languages

English (en)

Chinese (zh)

Inventor

坂本健

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Electric Corp

Original Assignee

Mitsubishi Electric Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-01-18

Filing date

2019-01-18

Publication date

2021-08-13

2019-01-18 Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp

2021-08-13 Publication of CN113261095A publication Critical patent/CN113261095A/zh

Status Pending legal-status Critical Current

Links

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238000012545 processing Methods 0.000 claims description 4
238000005452 bending Methods 0.000 claims 1
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Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

CN201980088014.4A 2019-01-18 2019-01-18 半导体装置、半导体装置的制造方法及电力转换装置 Pending CN113261095A (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/JP2019/001378 WO2020148879A1 (ja)	2019-01-18	2019-01-18	半導体装置、半導体装置の製造方法及び電力変換装置

Publications (1)

Publication Number	Publication Date
CN113261095A true CN113261095A (zh)	2021-08-13

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ID=71614151

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201980088014.4A Pending CN113261095A (zh)	2019-01-18	2019-01-18	半导体装置、半导体装置的制造方法及电力转换装置

Country Status (3)

Country	Link
JP (1)	JP7053897B2 (ja)
CN (1)	CN113261095A (ja)
WO (1)	WO2020148879A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7479771B2 (ja) *	2020-10-01	2024-05-09	三菱電機株式会社	半導体装置、半導体装置の製造方法及び電力変換装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005051109A (ja) *	2003-07-30	2005-02-24	Matsushita Electric Ind Co Ltd	パワー半導体モジュール
US20060056213A1 (en) *	2004-08-21	2006-03-16	Joosang Lee	Power module package having excellent heat sink emission capability and method for manufacturing the same
CN103972198A (zh) *	2013-01-25	2014-08-06	三菱电机株式会社	半导体装置及半导体装置的制造方法
WO2015173862A1 (ja) *	2014-05-12	2015-11-19	三菱電機株式会社	電力用半導体装置及びその製造方法
JP2017147332A (ja) *	2016-02-17	2017-08-24	株式会社三井ハイテック	リードフレーム及びその製造方法、並びに半導体パッケージ

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JPS63174453U (ja) *	1986-05-30	1988-11-11
JPH02232957A (ja) *	1989-03-06	1990-09-14	Yamada Seisakusho:Kk	樹脂封止型半導体装置用のリードフレーム
JPH03108744A (ja) *	1989-09-22	1991-05-08	Toshiba Corp	樹脂封止型半導体装置
JPH04286355A (ja) *	1991-03-15	1992-10-12	Matsushita Electron Corp	リードフレーム
JP3108744B2 (ja)	1994-04-28	2000-11-13	京セラ株式会社	ノイズ防止回路
JP4286355B2 (ja)	1998-12-16	2009-06-24	富士重工業株式会社	複合材の成形方法および成形治具
JP2010003947A (ja) *	2008-06-23	2010-01-07	Yamaha Corp	半導体装置の製造方法
JP6305176B2 (ja) *	2014-04-11	2018-04-04	三菱電機株式会社	半導体装置及び製造方法
JP6797285B2 (ja) *	2017-04-06	2020-12-09	三菱電機株式会社	半導体装置およびその製造方法、ならびに電力変換装置

2019
- 2019-01-18 JP JP2020566062A patent/JP7053897B2/ja active Active
- 2019-01-18 CN CN201980088014.4A patent/CN113261095A/zh active Pending
- 2019-01-18 WO PCT/JP2019/001378 patent/WO2020148879A1/ja active Application Filing

Patent Citations (5)

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Publication number	Priority date	Publication date	Assignee	Title
JP2005051109A (ja) *	2003-07-30	2005-02-24	Matsushita Electric Ind Co Ltd	パワー半導体モジュール
US20060056213A1 (en) *	2004-08-21	2006-03-16	Joosang Lee	Power module package having excellent heat sink emission capability and method for manufacturing the same
CN103972198A (zh) *	2013-01-25	2014-08-06	三菱电机株式会社	半导体装置及半导体装置的制造方法
WO2015173862A1 (ja) *	2014-05-12	2015-11-19	三菱電機株式会社	電力用半導体装置及びその製造方法
JP2017147332A (ja) *	2016-02-17	2017-08-24	株式会社三井ハイテック	リードフレーム及びその製造方法、並びに半導体パッケージ

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Publication number	Publication date
JPWO2020148879A1 (ja)	2021-09-27
WO2020148879A1 (ja)	2020-07-23
JP7053897B2 (ja)	2022-04-12

Legal Events

Date	Code	Title
2021-08-13	PB01	Publication
2021-08-13	PB01	Publication
2021-08-31	SE01	Entry into force of request for substantive examination
2021-08-31	SE01	Entry into force of request for substantive examination

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