CN113260246A - Shielding mechanism with silver film structure, forming jig and forming method - Google Patents

Shielding mechanism with silver film structure, forming jig and forming method Download PDF

Info

Publication number
CN113260246A
CN113260246A CN202110754340.3A CN202110754340A CN113260246A CN 113260246 A CN113260246 A CN 113260246A CN 202110754340 A CN202110754340 A CN 202110754340A CN 113260246 A CN113260246 A CN 113260246A
Authority
CN
China
Prior art keywords
adhesive layer
conductive adhesive
layer
silver film
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110754340.3A
Other languages
Chinese (zh)
Inventor
皇甫铭
吴鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fulaiying Electronics Co ltd
Original Assignee
Fulaiying Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fulaiying Electronics Co ltd filed Critical Fulaiying Electronics Co ltd
Priority to CN202110754340.3A priority Critical patent/CN113260246A/en
Publication of CN113260246A publication Critical patent/CN113260246A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1412—Infrared [IR] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Abstract

The invention discloses a shielding mechanism with a silver film structure, a forming jig and a forming method, wherein the shielding mechanism comprises a shielding unit, a body unit and a drainage unit; the shielding unit comprises a silver film layer, a conductive adhesive layer and a release layer, and the first surface of the body unit is arranged towards the conductive adhesive layer so that the conductive adhesive layer can be bonded on the body unit; the drainage unit comprises a non-stick adhesive layer, and the non-stick adhesive layer is arranged between the body unit and the conductive adhesive layer and is positioned at least one corner of the conductive adhesive layer; or the release layer can form the drainage unit after the corresponding conductive adhesive layer is cut off; the release layer can be separated from the silver film layer after the airflow acts on the drainage unit. The invention at least comprises the following advantages: through the setting of drainage unit, can directly peel off the relative silver membranous layer of off-type layer effectively under the effect of air current.

Description

Shielding mechanism with silver film structure, forming jig and forming method
Technical Field
The invention relates to the technical field of electricity, in particular to a shielding mechanism with a silver film structure, a forming jig and a forming method.
Background
As the application of the shielding film is developed, more and more electronic products need to use the shielding film unit. At present, a commonly used shielding unit is shielded by a silver film, and in order to ensure that the silver film can be effectively connected with an external part and protect the structure of the silver film, an adhesive layer and a release layer are usually arranged on two surfaces of the silver film in the production and processing processes.
In the production and processing process, after the shielding unit is fixed with an external circuit board, the release layer needs to be peeled, and because the release layer and the silver film are arranged in a shape adaptive manner and need to stretch into an interlayer between the release layer and the silver film by virtue of external force to perform peeling action, the appearance of the silver film is damaged easily, and the peeling efficiency is influenced. Appearance defects may affect signal leakage and may cause co-adjacent frequency interference and other problems.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the invention provides a shielding mechanism with a silver film structure, a forming jig and a forming method.
The embodiment of the application discloses: a shielding mechanism with a silver film structure is characterized by comprising a shielding unit, a body unit and a drainage unit;
the shielding unit comprises a silver film layer, a conductive adhesive layer and a release layer, wherein the conductive adhesive layer and the release layer are stacked on two opposite surfaces of the silver film layer, the shapes of the silver film layer, the conductive adhesive layer and the release layer are all matched, and the silver film layer and the conductive adhesive layer are fixedly arranged;
the first surface of the body unit is arranged towards the conductive adhesive layer so that the conductive adhesive layer can be bonded on the body unit;
the drainage unit comprises a non-stick adhesive layer, and the non-stick adhesive layer is arranged between the body unit and the conductive adhesive layer and is positioned at least one corner of the conductive adhesive layer;
or the release layer can form the drainage unit after the corresponding conductive adhesive layer is cut off;
the release layer can be separated from the silver film layer after the airflow acts on the drainage unit.
Further, the thickness of the silver film layer and the thickness of the conductive adhesive layer are both between 8 and 12 micrometers, and the thickness of the release layer is between 48 and 52 micrometers.
Further, the non-stick glue layer is made of a PI material.
The embodiment of the application also discloses: a forming jig for a shielding mechanism comprises a positioning lower die, a positioning upper die, a heating device and a blowing unit;
the positioning lower die is used for bearing and positioning the body unit;
the heating device is arranged corresponding to the shielding unit and is used for melting the heat-conducting adhesive layer on the silver film layer;
the positioning upper die comprises an upper die body and a negative pressure adsorption unit, the negative pressure adsorption unit comprises a negative pressure generator, an adsorption hole is formed in the upper die body, and the negative pressure generator is communicated with the adsorption hole through a pipeline, so that the shielding unit can be transferred to the upper die body unit under the action of negative pressure;
the adhesive tape adhering device can pick up the position information of the conductive adhesive layer so as to adhere the non-stick adhesive layer to at least one corner of one surface, facing the body unit, of the conductive adhesive layer to form a drainage unit;
or the cutting device is arranged corresponding to the conductive adhesive layer, so that the cutting device can cut off the conductive adhesive layer to form a drainage unit;
the blowing unit can continuously output stable airflow to the drainage unit, so that the release layer is peeled from the silver film layer.
Furthermore, the heating device comprises a plurality of uniformly distributed heating resistance wires, and the plurality of heating resistance wires and the conductive adhesive layer are arranged in a non-contact heating mode.
Further, the cutter device comprises a disc-shaped cutter and a three-axis manipulator for fixing the disc-shaped cutter, wherein the disc-shaped cutter can move towards the side wall of the conductive adhesive layer and cut off the conductive adhesive layer at a preset position.
Furthermore, the number of the adsorption holes is provided with a plurality of the adsorption holes which are distributed in an array.
The embodiment also discloses: a forming method of a shielding mechanism with a silver film structure specifically comprises the following steps:
placing the body unit on the positioning lower die, and moving the body unit to a first preset position by using negative pressure;
attaching the non-stick adhesive layer to at least one corner of one side of the conductive adhesive layer, which is far away from the silver film layer, or discharging waste at least one corner of the conductive adhesive layer;
the body unit is moved to a second preset position by using negative pressure, so that the conductive adhesive layer can be tightly attached to the body unit;
carrying out non-contact heating on the conductive adhesive layer until the conductive adhesive layer is molten, and then carrying out pressing;
and continuously outputting airflow at the corners of the non-stick adhesive layer or the waste-discharged conductive adhesive layer, and peeling the release layer.
Further, in the step of heating the conductive adhesive layer in a non-contact manner until the conductive adhesive layer is molten, the temperature which the non-stick adhesive layer can bear is higher than the temperature of the conductive adhesive layer required to be molten.
Further, in the step of discharging waste at least one corner of the conductive adhesive layer, the corresponding conductive adhesive layer is cut off by using a cutter device and cut into the release layer.
By means of the technical scheme, the invention has the following beneficial effects:
1. the adhesive force between the silver film layer and the conductive adhesive layer is far larger than that between the release layer and the silver film layer. The fixed shielding unit and the fixed body unit are moved into a dust-free space, and the air flow acts on the drainage unit, so that the release layer can be well stripped relative to the silver film layer;
2. the structure of the drainage unit is avoided by utilizing the difference of adhesive force among the release layer, the silver film layer and the conductive adhesive layer, and the existing workpiece contact type stripping mode is replaced by combining the stripping means of an air flow mode, so that the stripping efficiency is effectively improved while the surface quality of the silver film layer is not damaged after stripping, and the probability of occurrence of waste materials is reduced.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of one mode of a shield mechanism in an embodiment of the present invention;
FIG. 2 is a schematic structural view of another mode of the shielding mechanism in the embodiment of the invention;
FIG. 3 is a schematic structural diagram of a molding jig according to an embodiment of the present invention;
fig. 4 is a flow chart of a molding method in an embodiment of the invention.
Reference numerals of the above figures: 1. a body unit; 2. a drainage unit; 3. a silver film layer; 4. a conductive adhesive layer; 5. a release layer; 6. positioning the lower die; 7. positioning the upper die; 8. and (4) adsorbing the pores.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, in the description of the present invention, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no precedence between the two is considered as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Example 1
Referring to fig. 1, the present embodiment provides a shielding mechanism having a silver film structure, which includes a shielding unit, a body unit 1, and a drainage unit 2.
The shielding unit includes silver rete 3, conductive adhesive layer 4 and leaves type layer 5, adopts the mode range upon range of setting of shape adaptation in the above-mentioned three production processes, specifically, conductive adhesive layer 4 is located the below of silver rete 3, leave type layer 5 and be located the top of silver rete 3. The silver film layer 3 can effectively play a role in shielding, and the surface quality of the silver film layer 3 also needs to be ensured in the subsequent stripping process of the release layer 5, so that the problem of same and adjacent frequency interference is avoided or reduced.
In this embodiment, the thickness of the silver film layer 3 is between 8 and 12 μm, the thickness of the conductive adhesive layer 4 is between 8 and 12 μm, and the thickness of the release layer 5 is between 48 and 52 μm. In one preferred embodiment, the thickness of the silver film layer 3 is 10 μm, the thickness of the conductive adhesive layer 4 is 10 μm, and the thickness of the release layer 5 is 50 μm.
In this embodiment, the drainage unit 2 includes a non-stick adhesive layer, and preferably, the non-stick adhesive layer is made of PI material. It is worth noting that the PI material also has the characteristic of high temperature resistance, wherein the PI material can still keep stable structure when the hot melt adhesive is in a molten state, and further match the effectiveness of a subsequent blowing process.
In the above manner, the non-stick adhesive layer is disposed on the conductive adhesive layer 4 facing the body unit 1, specifically, on one of the corners of the conductive adhesive layer 4, so that the conductive adhesive layer 4 has a portion at one corner for an operator to directly turn over after being fixedly bonded to the body unit 1.
In this embodiment, the main body unit 1 may be disposed below the shielding unit and directly opposite to the shielding unit, wherein the main body unit 1 may be disposed on an external supporting table. The body unit 1 is typically an FPC board (flexible circuit board), wherein the upper surface of the FPC board is disposed opposite to the conductive adhesive layer 4, so that the conductive adhesive layer 4 can be attached to the FPC board in a subsequent process. Specifically, the colloid on the conductive adhesive layer 4 can be selected as a hot melt adhesive, the hot melt adhesive can be in a molten state by heating, and then the FPC board can be fixedly connected with the shielding unit by adopting a pressing process.
The adhesive force between the silver film layer 3 and the conductive adhesive layer 4 is far larger than that between the release layer 5 and the silver film layer 3. The fixed shielding unit and the body unit 1 are moved into a dust-free space, and act on the drainage unit 2 through air flow, so that the release layer 5 can be better stripped relative to the silver film layer 3.
Example 2
The structure of the present embodiment is basically the same as that of embodiment 1, except that;
as shown in fig. 2, the right side corner of the conductive adhesive layer 4 and the corresponding silver film layer 3 can be partially cut off by a cutter device, so that an acting gap is formed between the release layer 5 and the FPC board to form the drainage unit 2. When the air flow acts on the gap, the release layer 5 can be well peeled off from the silver film layer 3.
Example 3
The invention also discloses a forming jig for the shielding mechanism, which comprises a lower positioning die 6, an upper positioning die 7, a heating device, an attaching device and a blowing device. The positioning lower die 6 is arranged opposite to the positioning upper die 7, and preferably the positioning lower die 6 and the positioning upper die 7 can act on the body unit 1 (FPC board) and the shielding unit in a horizontal plane.
In the above manner, the positioning lower die 6 can complete supporting and positioning of the FPC board in a horizontal plane; the positioning upper die 7 can complete grabbing and transferring of the shielding units and can move towards the FPC board, so that the conductive adhesive layers 4 of the shielding units can be attached to the FPC board, and attaching accuracy of the shielding units and the FPC board can be guaranteed.
In the above manner, the positioning upper die 7 includes an upper die body and a negative pressure adsorption unit. The negative pressure adsorption unit comprises a negative pressure generator (not shown), the upper die body is provided with an adsorption hole 8, and the negative pressure generator is communicated with the adsorption hole 8 through a pipeline. During operation, leave type layer 5 and can cover foretell absorption hole 8 to under the negative pressure adsorption effect, leave type layer 5 and can be adsorbed, and then make the shielding unit can effectively be shifted.
Wherein, in order to guarantee every shielding element adsorbs validity, the quantity of absorption hole 8 is provided with a plurality ofly, and is a plurality of absorption hole 8 is array distribution.
In the above manner, the heating device (not shown) is located on the side of the positioning lower die 6 and is movable toward the positioning lower die 6. In one mode, the heating device comprises a plurality of heating resistance wires which are uniformly distributed. When heating is needed, the heating device moves to a position corresponding to the conductive adhesive layer 4, a high-temperature pressing process is carried out in a non-contact heating mode, and in the process, the colloid in the conductive adhesive layer 4 can be in a molten state, so that the shielding unit can be bonded on the FPC board.
In the above manner, the blowing assembly may be a blower, the blower can continuously deliver air flow to the drainage unit 2 formed by the non-stick adhesive layer, at this time, because the adhesive force between the silver film layer 3 and the conductive adhesive layer 4 is much greater than the adhesive force between the release layer 5 and the silver film layer 3, the release layer 5 corresponding thereto can be bent outward relative to the silver film layer 3, the bent angle is gradually greater than 90 °, the release layer 5 and the silver film layer 3 are separated, and the release layer 5 can be gradually peeled from the silver film layer 3 by using the instant force of the air flow until the release layer 5 is completely peeled.
Foretell mode of setting up utilizes the difference of adhesion between type layer, silver rete 3 and the 4 three of conductive adhesive layer, combines drainage unit 2's structure to dodge, combines the means of peeling off of air current mode at last, replaces the mode that current work piece contact was peeled off, is guaranteeing to peel off the back silver rete 3 surface quality is not destroyed simultaneously, has effectively improved and has peeled off efficiency to reduce the probability that the waste material appears.
Example 4
The structure of the present embodiment is basically the same as that of embodiment 3, except that;
the forming jig further comprises a cutter device, wherein the cutter device is located on one side of the positioning upper die 7 and can move towards the shielding unit to cut off the part of the conductive adhesive layer 4 and the silver film layer 3, and further the drainage unit 2 is formed between the release layer 5 and the FBC plate.
In the above aspect, the cutter device includes a disk-shaped cutter and a three-axis manipulator for fixing the disk-shaped cutter. Wherein the triaxial manipulator can drive discoid cutter removes in the space to can with make conducting resin layer 4 and silver rete 3 cut out preset shape together and cut off and carry out the wasting discharge, make have the clearance that the air current introduced between release layer 5 and the FBC board, drainage unit 2 promptly.
Similarly, the hair-dryer can be continuously to carrying the air current in foretell clearance, at this moment, because adhesive force between silver membranous layer 3 and the conducting resin layer 4 is far more than from the adhesive force between type layer 5 and the silver membranous layer 3, can make here correspond from type layer 5 relative silver membranous layer 3 outwards buckles, and its angle of buckling is greater than 90 gradually, makes appear separating between type layer 5 and the silver membranous layer 3, and then utilize the instantaneous dynamics of air current can progressively with from type layer 5 is relative silver membranous layer 3 peels off, until from type layer 5 peels off completely.
Example 5
The embodiment also discloses: a forming method of a shielding mechanism with a silver film structure specifically comprises the following steps:
the body unit 1 is placed on the positioning lower die 6, and the FPC board can be fixed and positioned in the process by using a mechanical limiting mode, such as a mode of a profiling platform or a positioning column;
moving the body unit 1 to a first preset position, which may be defined as a machining position, using negative pressure;
attaching the non-adhesive layer to at least one corner of one side of the conductive adhesive layer 4, which is far away from the silver film layer 3, or discharging waste at least one corner of the conductive adhesive layer 4, wherein in the step, a cutter device is utilized to cut off the corresponding conductive adhesive layer 4 and the silver film layer 3 and cut into the release layer 5, and at the moment, external force can be better utilized to act on the conductive adhesive layer 4 to discharge waste together with the cut conductive adhesive layer 4 and the cut silver film layer 3;
the body unit 1 is moved to a second preset position by using negative pressure, so that the conductive adhesive layer 4 can be tightly attached to the body unit 1;
the non-contact heating is carried out on the conductive adhesive layer 4 until the conductive adhesive layer is molten, and then pressing is carried out, wherein the temperature which can be borne by the non-stick adhesive layer in the step is higher than the temperature of the conductive adhesive layer 4 which needs to be molten;
the method comprises the following steps of continuously outputting airflow at the corners of a non-stick adhesive layer or a waste-discharged conductive adhesive layer 4 to peel off a release layer 5, wherein in the step, the blower can continuously convey airflow to a drainage unit 2 formed by the non-stick adhesive layer, at the moment, because the adhesive force between a silver film layer 3 and the conductive adhesive layer 4 is far greater than the adhesive force between the release layer 5 and the silver film layer 3, the release layer 5 corresponding to the position is bent outwards relative to the silver film layer 3, the bent angle is gradually greater than 90 degrees, separation occurs between the release layer 5 and the silver film layer 3, and the release layer 5 can be gradually peeled off relative to the silver film layer 3 by using the instant force of the airflow until the release layer 5 is completely peeled off.
According to the forming method provided by the invention, the existing workpiece contact type stripping mode is replaced by utilizing the difference of the adhesive force among the release layer, the silver film layer 3 and the conductive adhesive layer 4 in the shielding mechanism in combination with the structure avoidance of the drainage unit 2 and finally in combination with the stripping means in the air flow mode, so that the stripping efficiency is effectively improved and the probability of occurrence of waste materials is reduced while the surface quality of the silver film layer 3 is not damaged after stripping.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (10)

1. A shielding mechanism with a silver film structure is characterized by comprising a shielding unit, a body unit and a drainage unit;
the shielding unit comprises a silver film layer, a conductive adhesive layer and a release layer, wherein the conductive adhesive layer and the release layer are stacked on two opposite surfaces of the silver film layer, the shapes of the silver film layer, the conductive adhesive layer and the release layer are all matched, and the silver film layer and the conductive adhesive layer are fixedly arranged;
the first surface of the body unit is arranged towards the conductive adhesive layer so that the conductive adhesive layer can be bonded on the body unit;
the drainage unit comprises a non-stick adhesive layer, and the non-stick adhesive layer is arranged between the body unit and the conductive adhesive layer and is positioned at least one corner of the conductive adhesive layer;
or the release layer can form the drainage unit after the corresponding conductive adhesive layer is cut off;
the release layer can be separated from the silver film layer after the airflow acts on the drainage unit.
2. The shielding mechanism with silver film structure as claimed in claim 1, wherein the thickness of the silver film layer and the thickness of the conductive adhesive layer are both between 8-12 μm, and the thickness of the release layer is between 48-52 μm.
3. The shielding mechanism with silver film structure as claimed in claim 1, wherein said non-stick adhesive layer is made of PI material.
4. A forming jig for a shielding mechanism comprises the shielding mechanism of any one of claims 1 to 3, and is characterized by comprising a positioning lower die, a positioning upper die, a heating device and a blowing unit;
the positioning lower die is used for bearing and positioning the body unit;
the heating device is arranged corresponding to the shielding unit and is used for melting the heat-conducting adhesive layer on the silver film layer;
the positioning upper die comprises an upper die body and a negative pressure adsorption unit, the negative pressure adsorption unit comprises a negative pressure generator, an adsorption hole is formed in the upper die body, and the negative pressure generator is communicated with the adsorption hole through a pipeline, so that the shielding unit can be transferred to the upper die body unit under the action of negative pressure;
the adhesive tape adhering device can pick up the position information of the conductive adhesive layer so as to adhere the non-stick adhesive layer to at least one corner of one surface, facing the body unit, of the conductive adhesive layer to form a drainage unit;
or the cutting device is arranged corresponding to the conductive adhesive layer, so that the cutting device can cut off the conductive adhesive layer to form a drainage unit;
the blowing unit can continuously output stable airflow to the drainage unit, so that the release layer is peeled from the silver film layer.
5. The forming jig for the shielding mechanism according to claim 4, wherein the heating device comprises a plurality of uniformly distributed heating resistance wires, and the plurality of heating resistance wires and the conductive adhesive layer are arranged by non-contact heating.
6. The forming jig for a shielding mechanism according to claim 4, wherein the cutter device comprises a disk-shaped cutter, a three-axis robot for fixing the disk-shaped cutter, and the disk-shaped cutter is capable of moving toward the sidewall of the conductive adhesive layer and cutting off the conductive adhesive layer at a predetermined position.
7. The forming jig for the shielding mechanism according to claim 4, wherein a plurality of the suction holes are provided, and the plurality of suction holes are distributed in an array.
8. A molding method of a shielding mechanism with a silver film structure, comprising the molding jig of any one of claims 4 to 7, and is characterized by comprising the following steps:
placing the body unit on the positioning lower die, and moving the body unit to a first preset position by using negative pressure;
attaching the non-stick adhesive layer to at least one corner of one side of the conductive adhesive layer, which is far away from the silver film layer, or discharging waste at least one corner of the conductive adhesive layer;
the body unit is moved to a second preset position by using negative pressure, so that the conductive adhesive layer can be tightly attached to the body unit;
carrying out non-contact heating on the conductive adhesive layer until the conductive adhesive layer is molten, and then carrying out pressing;
and continuously outputting airflow at the corners of the non-stick adhesive layer or the waste-discharged conductive adhesive layer, and peeling the release layer.
9. The method for forming a shielding mechanism with a silver film structure according to claim 8, wherein in the step of heating the conductive adhesive layer to be molten in a non-contact manner, the non-stick adhesive layer can withstand a temperature higher than a temperature required for the conductive adhesive layer to be molten.
10. The method for forming a shielding mechanism with a silver film structure according to claim 8, wherein in the step of "discharging waste at least one corner of the conductive adhesive layer", a cutter device is used to cut the corresponding conductive adhesive layer and cut into the release layer.
CN202110754340.3A 2021-07-05 2021-07-05 Shielding mechanism with silver film structure, forming jig and forming method Pending CN113260246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110754340.3A CN113260246A (en) 2021-07-05 2021-07-05 Shielding mechanism with silver film structure, forming jig and forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110754340.3A CN113260246A (en) 2021-07-05 2021-07-05 Shielding mechanism with silver film structure, forming jig and forming method

Publications (1)

Publication Number Publication Date
CN113260246A true CN113260246A (en) 2021-08-13

Family

ID=77190621

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110754340.3A Pending CN113260246A (en) 2021-07-05 2021-07-05 Shielding mechanism with silver film structure, forming jig and forming method

Country Status (1)

Country Link
CN (1) CN113260246A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090159328A1 (en) * 2007-12-21 2009-06-25 Tsinghua University Electromagnetic shielding layer and method for making the same
CN109291616A (en) * 2018-10-22 2019-02-01 上达电子（深圳）股份有限公司 A kind of patch shielding coat peeling unit and dyestripping method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090159328A1 (en) * 2007-12-21 2009-06-25 Tsinghua University Electromagnetic shielding layer and method for making the same
CN109291616A (en) * 2018-10-22 2019-02-01 上达电子（深圳）股份有限公司 A kind of patch shielding coat peeling unit and dyestripping method

Similar Documents

Publication Publication Date Title
KR101959576B1 (en) Metal foil pattern laminate, method for punching metal foil, circuit board, method for producing same, and solar cell module
CN101117397B (en) Adsorption film and manufacturing method and adsorption film with separative film and manufacturing method thereof
CN103430328A (en) Process for forming flexible substrates using punch press type techniques
CN109867159B (en) Release film peeling method and release film peeling apparatus
CN101335191A (en) Manufacturing method for semiconductor integrated device
CN101529577A (en) Fixed jig, chip pickup method and chip pickup apparatus
WO2018101090A1 (en) Double-sided adhesive sheet and production method for semiconductor device
JP2008300521A (en) Semiconductor wafer and its processing method
JPH06170822A (en) Sheet proceed product and production thereof
CN101365297A (en) Circuit board cutting method
CN113260246A (en) Shielding mechanism with silver film structure, forming jig and forming method
JPH1070210A (en) Apparatus and method for forming a recess in a semiconductor substrate
CN109041447B (en) Film coating method and rigid-flex printed circuit board
JP4201882B2 (en) Laminate production method
CN103929885B (en) The processing method for protecting PCB stepped plate step surface line patterns
JPH06124709A (en) Manufacture of negative electrode current collector for lithium battery
JP4916057B2 (en) Protective film for FPC, resin conductor foil laminate with protective film for FPC, and method for producing flexible printed wiring board using the same
JP3567802B2 (en) Manufacturing method of multilayer ceramic electronic component
CN215096235U (en) Cutting mechanism, film stripping device and battery piece pressing equipment
USRE35353E (en) Process for manufacturing a multi-layer lead frame
TWI738545B (en) Processing technology to improve the convenience of emi removal film
TW202318517A (en) Processing method capable of performing desired processing on a wiring board without contaminating the wiring board and element chips
JP6613677B2 (en) Method and apparatus for dividing brittle substrate
TW202338950A (en) Adherend treatment method and adherend treatment apparatus capable of preventing a predetermined treatment from reaching a non-treatment area of an adherend as much as possible
JPS6181693A (en) Manufacture of ceramic substrate and green sheet used therefor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20210813

RJ01 Rejection of invention patent application after publication