CN113237566A - Array type temperature sensor and manufacturing method thereof - Google Patents
Array type temperature sensor and manufacturing method thereof Download PDFInfo
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- CN113237566A CN113237566A CN202110441417.1A CN202110441417A CN113237566A CN 113237566 A CN113237566 A CN 113237566A CN 202110441417 A CN202110441417 A CN 202110441417A CN 113237566 A CN113237566 A CN 113237566A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 96
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- 239000011810 insulating material Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 7
- 238000012544 monitoring process Methods 0.000 abstract description 4
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- 238000005259 measurement Methods 0.000 description 4
- 239000003575 carbonaceous material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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Abstract
The invention relates to an array type temperature sensor and a manufacturing method thereof, wherein the array type temperature sensor comprises a substrate, wherein a plurality of through holes are formed in the substrate, and temperature sensor units are arranged in the through holes; the temperature sensor unit comprises a conductive temperature-sensitive element, a first metal electrode and a second metal electrode; the first electrode is arranged at one end of the through hole, the second metal electrode is arranged at the other end of the through hole, and the through hole is sealed by the second metal electrode and the first metal electrode; the conductive temperature-sensitive element is arranged between the first metal electrode and the second metal electrode and is connected with the first metal electrode and the second metal electrode. The array type temperature sensor and the manufacturing method thereof realize the detection of the temperature distribution condition of each point of the object to be detected in a space range by arranging the plurality of temperature sensor units on the substrate, and can intuitively detect the temperature condition of each monitoring point on the surface of the object to be detected.
Description
Technical Field
The invention relates to the technical field of sensor equipment, in particular to an array type temperature sensor and a manufacturing method thereof.
Background
A temperature sensor (temperature transducer) refers to a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument and has a plurality of varieties. The sensing mechanism of the temperature sensor depends on the used temperature-sensitive material, and the temperature parameter can be obtained by measuring the current because the resistance of the temperature-sensitive material is linearly related to the temperature.
The temperature sensitive material can detect the temperature of an object, a space and the like, and can provide a material with electric signal change along with the temperature change. The contact mode with the measured object can be divided into a direct contact mode and a non-direct contact mode. The former was used earlier and still remains the subject of use to date. Among them are pyroelectric bodies (e.g., thermocouples), metal resistive bodies (e.g., pure metal wires or foils), and thermistors (e.g., sintered metal oxides such as Mn, Co, Ni, and Fe, and semiconductor ceramics in which Pb or Sr is added to barium titanate). Sensors are often made from these materials.
However, the conventional temperature sensor can only measure the temperature of one point or one surface of the detected object as a whole, and in some application scenarios requiring multipoint temperature measurement, a plurality of temperature sensors are required, but the volume of the temperature sensor is usually large, and accurate measurement is difficult to complete.
Disclosure of Invention
Based on the above, the invention provides an array type temperature sensor and a manufacturing method thereof, which can realize the detection of the temperature distribution condition of each point of the object to be detected in a space range by arranging a plurality of temperature sensor units on a substrate, and can intuitively detect the temperature condition of each monitoring point on the surface of the object to be detected.
In a first aspect, the invention provides an array type temperature sensor, which comprises a substrate, wherein a plurality of through holes are formed in the substrate, and temperature sensor units are arranged in the through holes; the temperature sensor unit comprises a conductive temperature-sensitive element, a first metal electrode and a second metal electrode; the first electrode is arranged at one end of the through hole, the second metal electrode is arranged at the other end of the through hole, and the second metal electrode and the first metal electrode close the through hole; the conductive temperature-sensitive element is arranged between the first metal electrode and the second metal electrode and is connected with the first metal electrode and the second metal electrode.
According to the array type temperature sensor provided by the embodiment of the invention, the substrate is provided with the plurality of through holes, and the temperature sensor unit is arranged in each through hole, so that the temperature conditions of different position points of a measured object can be detected simultaneously through the plurality of temperature sensor units, and the temperature conditions of all monitoring points on the surface of the measured object can be intuitively detected; meanwhile, each temperature sensor unit seals the conductive temperature-sensitive element in the through hole through the electrodes at the two ends of the through hole, so that the conductive temperature-sensitive element is protected, and the service life of the conductive temperature-sensitive element is prolonged.
Further, the surface of the substrate is provided with a lead, and each temperature sensor unit is connected with an external circuit through the lead.
Each group of temperature sensor units is individually connected with an external circuit, and when the temperature changes, the temperature distribution condition of each point in a space range is determined through current measurement.
Further, the conductive temperature-sensitive element is made of a material with a negative temperature coefficient, and the resistance of the conductive temperature-sensitive element is reduced along with the increase of the temperature.
When the temperature rises, the resistance of the conductive temperature-sensitive element is reduced, the temperature at each temperature sensor unit is different, the resistance of the conductive temperature-sensitive element at each point is different, the current of each temperature sensor unit is different, and the temperature value of each point is obtained by analyzing the current of each point.
Further, the first metal electrode and the second metal electrode are embedded in a solid body and in the through hole;
or the first metal electrode and the second metal electrode are formed by solidifying the conductive paste.
The first metal electrode and the second metal electrode are used for sealing two ends of the through hole, can be solid electrodes, are embedded into the through hole, and can be solidified and molded by conductive slurry as required.
Further, the first metal electrode and the second metal electrode are made of a heat conductive material.
The object to be measured is contacted with the metal electrode, and the temperature of the object to be measured is transmitted into the conductive temperature-sensitive element through the metal electrode, so that the resistance of the conductive temperature-sensitive element is changed.
Further, the through holes are arranged on the substrate in an array with equal intervals.
Each temperature sensor unit arranged in an array mode works independently, the temperature on one surface of a measured object can be measured simultaneously, the temperature change trend is obtained, and comparison is formed among all points.
Further, the distance of the through holes and the spatial resolution of the temperature sensor are in a negative correlation relationship.
The smaller the distance, the larger the spatial resolution, the denser the arrangement of the temperature sensor units, and the more accurate the measurement of the spatial distribution of the temperature of the object to be measured.
Further, the base is made of a flexible insulating material or a rigid insulating material.
The substrate is non-conductive material, avoids causing the influence to the temperature sensor unit, and the substrate can be flexible or rigid material, can set up the sensor on the curved surface as required, detects.
Further, the substrate is a flexible circuit board.
In one embodiment, a flexible circuit board is used as a substrate to avoid the influence of excessive wires.
In a second aspect, the present invention further provides a method for manufacturing an array type temperature sensor, including the following steps:
providing a substrate, and arranging a plurality of through holes on the substrate;
a conductive temperature-sensitive element is arranged in the through hole;
arranging a first metal electrode at one end of the through hole, connecting the first metal electrode with the conductive temperature-sensitive element, and sealing one end of the through hole;
and arranging a second metal electrode at the other end of the through hole, so that the second metal electrode is connected with the conductive temperature-sensitive element and seals the other end of the through hole.
For a better understanding and implementation, the technical solutions of the present invention are described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of an array of temperature sensors in accordance with one embodiment of the present invention;
FIG. 2 is a schematic view of an array type temperature sensor substrate according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of an array of temperature sensors according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of external circuit connections of the array temperature sensor according to one embodiment of the present invention;
FIG. 5 is a cross-sectional view of an external circuit connection of the array type temperature sensor according to an embodiment of the present invention;
fig. 6 is a schematic diagram of the working state of the array temperature sensor in an embodiment of the invention.
Reference numerals: 1-a substrate; 2-a through hole; 3-a temperature sensor unit; 301-a conductive temperature sensitive element; 302-a first metal electrode; 303-a second metal electrode; 4-the object to be measured.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims. In the description of the present application, it is to be understood that the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not necessarily used to describe a particular order or sequence, nor are they to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
In the following, several specific embodiments are given for describing the technical solution of the present application in detail. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Referring to fig. 1, 2 and 3, which are a cross-sectional view and a schematic diagram of an array temperature sensor structure according to an embodiment of the present invention, in the embodiment, the array temperature sensor includes a substrate 1 and a temperature sensor unit 3, the substrate 1 is a square plate-shaped structure, a plurality of circular through holes 2 are formed on the substrate 1, the through holes 2 are preferably arranged on the substrate 1 in an equally spaced array, and the temperature sensor unit 3 is disposed inside each through hole 2. In other examples, the substrate 1 may be provided in other shapes as needed, and the shape of the through-hole 2 may also be changed to match the shape of the temperature sensor unit 3.
The temperature sensor unit 3 comprises a conductive temperature-sensitive element 301, a first metal electrode 302 and a second metal electrode 303, wherein the first metal electrode 302 is arranged at the upper end of the through hole 2 and closes the top opening of the through hole 2, the second metal electrode 303 is arranged at the lower end of the through hole 2 and closes the bottom opening of the through hole 2, the conductive temperature-sensitive element 301 is arranged between the first metal electrode 302 and the second metal electrode 303, the first metal electrode 302 is connected with the top of the conductive temperature-sensitive element 301, and the second metal electrode 303 is connected with the lower end of the conductive temperature-sensitive element 301.
In the above embodiment, the conductive temperature-sensitive element 301 is an electronic component made of a conductive temperature-sensitive material whose resistance changes with temperature change, the conductive temperature-sensitive element 301 is used to directly convert the temperature change into resistance change, the first metal electrode 302 and the second metal electrode 303 are made of a heat conducting material, and the first metal electrode 302 and the second metal electrode 303 are used to conduct electric charge and simultaneously conduct heat to the conductive temperature-sensitive element 301, so as to cause the resistance change of the conductive temperature-sensitive element 301.
Referring to fig. 4 and 5, which are schematic diagrams illustrating a circuit connection of an array temperature sensor according to an embodiment of the present invention, in an embodiment, each group of temperature sensor units 3 is connected to an external circuit through a group of wires, specifically, a first metal electrode 302 is connected to an anode of a power VCC through a wire disposed on an upper surface of a substrate 1, a second metal electrode 303 is connected to a cathode of the power VCC through a wire disposed on a lower surface of the substrate 1, the first metal electrode 302 is connected to the second metal electrode 303 through a conductive temperature-sensitive element 301 disposed below the first metal electrode 302, the second metal electrode 303, the temperature-sensitive conductive element 301 and the power VCC form a complete power supply loop through wires, and meanwhile, a current detection element may be further disposed in the power supply loop, and when the conductive element 301 detects a temperature change, and thus a resistance changes, a current in the power supply loop also changes correspondingly, by detecting the current change in the supply loop, a temperature detection can be achieved.
In the above embodiment, the power source VCC is a dc power source. In other examples, the power may be supplied in a different form such as an ac power supply.
Referring to fig. 6, which is a schematic diagram illustrating an application scenario of an array type temperature sensor according to an embodiment of the present invention, in an embodiment, when a temperature of an object to be measured 4 needs to be measured, the object to be measured 4 is disposed on a substrate 1, at this time, a lower surface of the object to be measured 4 contacts with a plurality of sets of temperature sensor units 3 on the substrate 1, a first metal electrode 302 on a top of each temperature sensor unit 3 directly contacts with the object to be measured 4, and conducts heat of the object to be measured 4 to a conductive temperature-sensitive element 301, and due to the influence of the heat, a resistance of the conductive temperature-sensitive element 301 changes, and since each set of temperature sensor units 3 is connected to an independent power source VCC, when a resistance of the conductive temperature-sensitive element 301 in each temperature sensor unit 3 changes, a current detected in a circuit of each temperature sensor unit 3 also changes, at this time, by analyzing the magnitude of the current in the circuit of each set of temperature sensor units 3, the temperature difference and distribution state of each detection point in the space of the shape of the object 4 to be measured on the lower surface thereof can be obtained.
Preferably, when the distance between the through holes 2 arranged in the array is decreased and the number of the through holes 2 is further increased, the spatial resolution of the temperature sensor unit 3 is increased, and the spatial distribution state of the temperature measured by the object 4 to be measured in a certain space is more accurate.
In one embodiment, the conductive temperature-sensitive element 301 is made of a conductive temperature-sensitive material with a negative temperature coefficient, that is, the resistance of the conductive temperature-sensitive element 301 decreases as the detected temperature increases.
In one embodiment, the conductive temperature sensitive element 301 is made of a carbon-based material, and the carbon-based material includes at least any one of the following: carbon fibers, carbon paste, carbon particles, and the like. The carbon-based material has the characteristics of high conductivity, low cost, excellent stability and the like.
In an embodiment, the first metal electrode 302 and the second metal electrode 303 are solid structures, and the first metal electrode 302 and the second metal electrode 303 are respectively embedded in the upper opening and the lower opening of the through hole 2 and close the through hole 2. Preferably, the first metal electrode 302 and the second metal electrode 303 may also be formed by curing conductive paste.
In an embodiment, the substrate 1 is an insulating material, so as to avoid the influence of the substrate conductivity on the detection accuracy, preferably, the substrate 1 may be a rigid insulating material, the substrate 1 serves as a supporting portion to support each group of the temperature sensor units 3 for temperature detection, and the substrate 1 may also be made of a flexible insulating material, so that the substrate 1 may be disposed on a specific curved surface to ensure a good measurement effect on the non-planar object to be measured.
Preferably, the substrate 1 may be a flexible circuit board, and the wires connected to each set of the first metal electrode 302 and the second metal electrode 303 in fig. 4 and 5 may be wires disposed inside the substrate 1.
As shown in fig. 1, fig. 2 and fig. 3, in one embodiment, when manufacturing the array type temperature sensor in the present embodiment, an insulating flexible substrate 1 is first selected, a plurality of through holes 2 are formed on the substrate 1, and the through holes 2 are arranged on the substrate 1 at equal intervals to form an M by N array.
A conductive temperature sensitive member 301 made of a negative temperature coefficient material is provided in each through hole.
The conductive temperature-sensitive element 301 is arranged in the middle of the through hole 2, a solid first metal electrode 302 is embedded above the conductive temperature-sensitive element 301, the first metal electrode 302 is connected with the top of the conductive temperature-sensitive element 301 and seals an upper opening of the through hole 2, a solid second metal electrode 303 is embedded below the conductive temperature-sensitive element 301, and the second metal electrode 303 is connected with the bottom of the conductive temperature-sensitive element 301 and seals a lower opening of the through hole 2.
The upper surface of the substrate 1 is provided with a plurality of conducting wires, each conducting wire is connected with one first metal electrode 302, the lower surface of the substrate 1 is correspondingly provided with a plurality of conducting wires, each conducting wire is connected with one second metal electrode 303, the first metal electrode 302 of each group of temperature sensor units 3 is connected with the positive pole of one power supply VCC through the conducting wire, the second metal electrode 303 of each group of temperature sensor units 3 is connected with the negative pole of one power supply VCC through the conducting wire, and each group of temperature sensor units 3 forms an independent closed current loop.
Preferably, the lead wires connected to the temperature sensor unit 3 are made of carbon fiber material, and in other examples, the lead wires may also be made of metal material, such as copper wires, gold wires, etc., or conductive thin film formed by sputtering, etc.
The array type temperature sensor provided by the embodiment of the invention has the advantages that a plurality of through holes 2 which are arranged in an array at equal intervals are arranged on a substrate 1, a conductive temperature-sensitive element 301 is arranged in each through hole 2, a first metal electrode 302 and a second metal electrode 303 are respectively embedded at the upper end and the lower end of the conductive temperature-sensitive element 301, thereby forming a group of temperature sensing units 3, each temperature sensing unit 3 is connected with a power source VCC through a lead wire arranged on the substrate 1 and forms a complete current loop, the heat data of each point of the measured object in a space is converted into an electric signal through the characteristic that the resistance of the conductive temperature-sensitive element 301 in each group of temperature sensor units 3 is in negative correlation with the temperature, therefore, the temperature distribution conditions of all the points of the measured object 4 in a space range can be detected, and the temperature conditions of all the monitoring points on the surface of the measured object can be visually detected.
The invention also provides a manufacturing method of the array type temperature sensor, which comprises the following steps:
providing a substrate, and arranging a plurality of through holes on the substrate;
a conductive temperature-sensitive element is arranged in the through hole;
arranging a first metal electrode at one end of the through hole, connecting the first metal electrode with the conductive temperature-sensitive element, and sealing one end of the through hole;
and arranging a second metal electrode at the other end of the through hole, so that the second metal electrode is connected with the conductive temperature-sensitive element and seals the other end of the through hole.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. An array type temperature sensor is characterized in that;
the temperature sensor comprises a substrate, wherein a plurality of through holes are formed in the substrate, and temperature sensor units are arranged in the through holes;
the temperature sensor unit comprises a conductive temperature-sensitive element, a first metal electrode and a second metal electrode;
the first electrode is arranged at one end of the through hole, the second metal electrode is arranged at the other end of the through hole, and the second metal electrode and the first metal electrode close the through hole;
the conductive temperature-sensitive element is arranged between the first metal electrode and the second metal electrode and is connected with the first metal electrode and the second metal electrode.
2. The array temperature sensor of claim 1, wherein:
the surface of the substrate is provided with a lead, and each temperature sensor unit is connected with an external circuit through the lead.
3. An array temperature sensor according to claim 2, wherein:
the conductive temperature-sensitive element is made of a material with a negative temperature coefficient, and the resistance of the conductive temperature-sensitive element is reduced along with the increase of the temperature.
4. An array temperature sensor according to claim 3, wherein:
the first metal electrode and the second metal electrode are embedded in the through hole in a solid state;
or the first metal electrode and the second metal electrode are formed by solidifying the conductive paste.
5. The array temperature sensor of claim 4, wherein:
the first metal electrode and the second metal electrode are made of a thermally conductive material.
6. The array temperature sensor of claim 1, wherein:
the through holes are arranged on the substrate in an array with equal intervals.
7. The array temperature sensor of claim 6, wherein:
the distance of the through holes and the spatial resolution of the temperature sensor are in a negative correlation relationship.
8. The array temperature sensor of claim 7, wherein:
the base is made of a flexible insulating material or a rigid insulating material.
9. The array temperature sensor of claim 7, wherein:
the substrate is a flexible circuit board.
10. A manufacturing method of an array type temperature sensor is characterized by comprising the following steps:
providing a substrate, and arranging a plurality of through holes on the substrate;
a conductive temperature-sensitive element is arranged in the through hole;
arranging a first metal electrode at one end of the through hole, connecting the first metal electrode with the conductive temperature-sensitive element, and sealing one end of the through hole;
and arranging a second metal electrode at the other end of the through hole, so that the second metal electrode is connected with the conductive temperature-sensitive element and seals the other end of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110441417.1A CN113237566A (en) | 2021-04-23 | 2021-04-23 | Array type temperature sensor and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110441417.1A CN113237566A (en) | 2021-04-23 | 2021-04-23 | Array type temperature sensor and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113693410A (en) * | 2021-09-01 | 2021-11-26 | 安徽咏鹅家纺股份有限公司 | Quilt based on flexible array temperature sensor and control system thereof |
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| CN112393282A (en) * | 2019-08-12 | 2021-02-23 | 佛山市顺德区美的电热电器制造有限公司 | Cooking utensil |
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2021
- 2021-04-23 CN CN202110441417.1A patent/CN113237566A/en active Pending
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|---|---|---|---|---|
| JP2000252103A (en) * | 1999-03-02 | 2000-09-14 | Murata Mfg Co Ltd | Thermistor element |
| CN102322974A (en) * | 2011-06-03 | 2012-01-18 | 东南大学 | Array temperature touch sensing device |
| CN104185780A (en) * | 2012-01-30 | 2014-12-03 | Pst传感器(私人)有限公司 | Thermal imaging sensors |
| CN203083106U (en) * | 2012-11-21 | 2013-07-24 | 常州比太科技有限公司 | Novel electric heater |
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