CN113169093A - 用于在基板上烧结电子器件的烧结压机 - Google Patents
用于在基板上烧结电子器件的烧结压机 Download PDFInfo
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Abstract
一种用于在基板(12)上烧结电子器件(10)的烧结压机(1),该烧结压机(1)包括:加压单元,包括多个压杆(112),该压杆(112)可被控制以将烧结压力施加到待烧结的电子器件(10);多个反作用元件(40),每个反作用元件(40)形成未用于相应的基板(12)的支撑平面;元件板(70),适于可滑动地支撑反作用元件(40);以及加热电路(72),其包括嵌入在加热体(76)中的加热元件,该加热体(76)围绕元件板(70)放置,以使元件板(70)达到烧结温度。热扩散板(80)被放置成与加热体(76)接触并且在反作用元件(40)之间、在元件板(70)上延伸,热扩散板(80)由导热性高于元件板(70)(例如,钢)的导热性的材料(例如,铜(Cu))制成。热扩散板(80)可以包括:至少两个端集热器(82),彼此相对且固定,每个端集热器(82)跨越加热体(76)和元件板(70);以及中央栅格(84),与元件板(70)接触地围绕反作用元件(40)延伸。加压单元还可以包括加压加热板(110),该加压加热板(110)可滑动地支撑压杆(112),加压加热板(110)包括:内板(114),适于可滑动地支撑压杆(112);以及加压加热体(116),围绕内板(114)放置并且设置有适于加热内板(114)并且由此加热压杆(112)的加热装置(118),其中,加压单元还可以包括第二扩散板(120),该第二扩散板(120)被放置成与加压加热体(116)接触并且在压杆(112)之间、在内板(114)上延伸,该第二扩散板(120)由导热性高于内板(114)(例如,钢)的导热性的材料(例如,铜(Cu))制成。可以在热扩散板(80)和/或第二扩散板(120)中制作补偿孔(88、124),以确保所有反作用元件(40)和/或所有压杆(112)的均匀加热。烧结压机(1)还可以包括多个负荷传感器(50),每个负荷传感器(50)可操作地连接到反作用元件(40),使得所述负荷传感器(50)通过反作用元件(40)来检测由一个或多个压杆(112)施加的力,该负荷传感器(50)容纳在可操作地连接到冷却电路(54)的传感器保持板(52)中。每个反作用元件(40)可以具有:加热部(40a),穿过元件板(70)并且该加热部(40a)适于通过传导将元件板(70)的热传递到基板(12);以及冷却部(40b),成形以便耗散从元件板(70)传递到加热部(40a)的热。冷却部(40b)可以包括轴向连续的耗散盘(44),该耗散盘(44)与反作用元件(40)的轴线同轴地延伸。冷却部(40b)可以配备有面向负荷传感器(50)的红外屏(46)。
Description
本发明涉及一种用于在基板上烧结电子器件的烧结压机。
众所周知,在一些电子应用中,通过***烧结膏将集成电子器件(例如,二极管、绝缘栅双极型晶体管(IGBT)、热敏电阻和金属-氧化物半导体场效应晶体管(MOSFET))固定到基板上。为了正确烧结每个器件,必须在该器件处于烧结温度(例如,大于200℃)的同时将该器件加压在基板上。
烧结压机通常包括基部,该基部形成加压平面,一个或多个基板定位在该加压平面上。压机配备有加压单元,该加压单元针对每个基板设置有一个或多个加压构件,该加压构件例如由液压电路来控制,以对待烧结的电子器件施加预定压力。
在压机的一些实施例中,基部还配备有一个或多个负荷传感器,该负荷传感器适于检测由加压构件施加在每个基板的电子器件上的力的总和,以便监测压机的正确操作。负荷传感器是必须在比烧结温度低得多的温度下操作的电子器件。
因此,困扰上述类型的烧结压机的其中一个问题是如何使基板达到适于烧结的温度,而不会使压机的必须保持在低得多的温度下的其它器件(例如负荷传感器)过热,并且在任何情况下都不降低压机的机械性能。
本发明的目的是提出一种能够解决这种问题的压机。
所述目的通过根据权利要求1所述的压机实现。从属权利要求描述了本发明的优选实施例。
根据本发明的烧结压机的特征和优点将从以下对本发明的优选实施例的描述中变得明显,参照附图,优选实施例通过指示性和非限制性的示例提供,其中:
-图1是根据本发明的压机的轴向截面图;
-图2是从压机的器件保持板的顶部看到的平面图,该压机安装有热扩散板;
-图3是从器件保持板的顶部看到的透视图;
-图4示出与器件保持板相关联的单独的热扩散板的透视图;
-图5是从安装有热扩散板的加压保持板的顶部看到的平面图;以及
-图6是从加压保持板的顶部看到的透视图。
在所述附图中,根据本发明的烧结压机统一以1表示。
该压机适于在基板12上烧结电子器件10。
在一个实施例中,压机1被设计成在多个基板12上同时执行电子器件的烧结。
基板12保持放置在一层烧结膏上的待烧结的电子器件10(例如,绝缘栅双极型晶体管(IGBT)、二极管、热敏电阻和金属-氧化物半导体场效应晶体管(MOSFET))。器件10必须以预定表面压力(例如30Mpa)在预定温度(例如260℃)下处理180秒至300秒。
考虑到器件的厚度因族而变化,因此必须以与其突起表面成正比例的力加压电子器件10。
烧结压机1包括框架8,该框架8竖直延伸并且在顶部支撑加压单元14且在底部支撑用于至少一个基板12(优选地,多个基板)的支撑底座60。
加压单元和底座中的一者或两者可相对于另一者沿压机轴线X移动,以使待烧结的电子器件10基本上与加压单元14接触,以便然后进行加压。
在一个实施例中,针对每个基板,加压单元14包括一个或多个加压构件,该一个或多个加压构件适于在电子器件上施加必要的烧结压力。
在一个实施例中,加压单元14包括多杆缸20,该多杆缸20配备有平行且独立的压杆28。每个压杆28与相应的待烧结的电子器件10同轴,并且每个压杆28的重心在相应的待烧结的电子器件10上,并且该每个压杆28具有与要施加在相应的电子器件10上的力成比例的推力部,每个待烧结的电子器件的面积已知。术语“重心”意味着每个压杆28具有与相应的电子器件10的重心一致的杆轴线。
在一个实施例中,压杆28由加压控制流体驱动。例如,压杆28与压缩室30连通,其中,引入控制流体,并且其中,容纳相配的控制器件以将由控制流体施加的压力传递到压杆。例如,该控制器件是膜32的形式。当压缩室30加压到烧结压力时,膜32通过压靠压杆28的后端28’而变形,以将烧结压力传递到每个压杆28。
在一个实施例中,加压单元还包括加压加热板110,该加压加热板110可滑动地支撑加压构件112,每个加压构件112可由相应的压杆28操作以作用于相应的待烧结的电子器件10上。
在一个实施例中,加压加热板110包括:内板114,适于可滑动地支撑加压构件112;以及加压加热体116,围绕内板114放置并配备有加热内板114并由此加热加压构件112的加热装置118(例如电阻器)。
当然,也可以使用其它压杆致动***。
根据本发明的一个方面,压机1包括多个反作用元件40,每个反作用元件40沿着与压机轴线X平行的元件轴线在第一元件端40’与第二元件端40”之间延伸。第一元件端40’形成为用于相应的基板12的支撑平面。
在一个实施例中,负荷传感器50可操作地连接到第二元件端40”。负荷传感器50适于通过反作用元件40检测由加压单元14的一个或多个压杆28施加在位于基板12上的待烧结的电子器件10上的力。
应注意的是,可以根据具体要求简单地使用负荷传感器50以检测已施加到各自的基板12上的压力,从而处于开/关操作模式,或者例如检测通过反馈压力控制施加的压力的值。
在一个实施例中,负荷传感器50容纳在传感器保持板52中,该传感器保持板52可操作地连接到冷却电路54。
反作用元件40由元件板70可滑动地支撑。反作用元件40以矩阵排列在元件板70中。每个反作用元件40的第一端40’从元件板70突出。
术语“可滑动地支撑”并不意味着反作用元件40必须在元件板70中滑动,而是意味着该器件***到形成在元件板70中的相应的引导座中而不被约束于此。实际上,如将在下面描述的,元件板70必须确保热从该元件板70传递到反作用元件40,且保持该反作用元件40处于与压机轴线X平行的正确位置,但同时不影响由相应的负荷传感器50检测的力。
应该注意的是,在一个优选实施例中,反作用元件40的第二端40”总是与负荷传感器50接触,由此,在加压步骤期间,反作用元件40经历基本上为零或可忽略的轴向位移。在该情况下,反作用元件40提供与由加压构件施加的力的真实对比,而后该对比由待烧结的电子器件10完全吸收。
元件板70必须以这样的方式加热,即,通过热传导使反作用元件达到烧结所需的温度,例如在240℃至290℃之间。
在一个实施例中,每个反作用元件40具有加热部40a,该加热部40a穿过元件板70并且适于通过传导将元件板70的热传递到相应的基板12。
在一个实施例中,反作用元件40还具有冷却部40b,该冷却部40b以第二端40”结束并且以耗散从元件板70传递到加热部40a的热的方式成形。
例如,加热部40a和冷却部40b连续地布置。
在一个实施例中,加热部40a具有基本上等于或略大于元件板70的厚度的轴向延伸部。例如,加热部40a以从元件板70轴向突出的反作用元件的第一端40’结束。
针对加热元件板70,压机包括加热电路72,该加热电路72包括嵌入在加热体76中的加热元件,该加热体76围绕元件板70放置。
例如,加热电路72包括由电阻温度计控制的电阻器。
根据本发明的一个方面,压机1还包括热扩散板80,该热扩散板80放置成与加热体76接触并且在反作用元件40当中在元件板70上延伸。
扩散板80由导热性高于元件板70的导热性的材料制成。
实际上,对于元件板70,使用例如钢的材料,该材料有利于机械性能(特别是强度),而不是导热性。
例如,扩散板80由铜制成,而元件板70由钢制成。
与制成元件板70的钢的60相比,铜具有390的导热系数λ(W·m-1·K-1)。
在一个实施例中,扩散板80包括至少两个端集热器82,该至少两个端集热器82彼此相对且固定,每个端集热器横跨加热体76和元件板70。
在一个实施例中,扩散板80例如还包括直接连接到两个端集热器82的中心栅格84,该中心栅格84与围绕反作用元件40的第一端40’的元件板70接触地延伸。
在一个实施例中,扩散板80以可拆卸的方式,(即,以可滑动的方式)带有游隙地例如通过与扩散板80中的槽孔86接合的螺栓固定到加热体76和元件板70,以便促进元件板和加热体的不同热膨胀。
在一个实施例中,扩散板80还具有补偿孔88,该补偿孔88以确保所有反作用元件40的均匀加热的方式成形和/或定位。
在一个实施例中,元件板70与加热体76可分离。以这样的方式,根据待烧结的基板12的数量和形状,元件板可以用另一个替换。
在一个实施例中,元件板70和传感器保持板52通过适于耗散反作用元件的热的分离流体(例如空气)彼此轴向地分离。
例如,冷却部40b具有基本上等于元件板70与传感器保持板52之间的距离的延伸部。
在一个实施例中,加热部40a为棱柱形。例如,加热部40a具有大于基板的支撑平面的直径的轴向延伸部。
在一个实施例中,冷却部40b包括轴向连续的耗散盘44,该耗散盘44与元件轴线同轴地延伸。
在一个实施例中,反作用元件40的第二端40b配备有面向负荷传感器50的红外屏46。
在一个实施例中,冷却电路54适于使传感器保持板保持在约25℃的温度。
例如,冷却***基于由冷却器调节的冷却剂的循环。
因此,与可加热的元件板70和可冷却的传感器保持板结合的反作用元件40允许:
-通过传递从元件板传导到反作用元件的加热部的热来提供对烧结的基板的加热;
-抵消由上加压构件施加的烧结压力;
-将反作用力传递到负荷传感器;
-减少到负荷传感器的热传递。
因此,冷却电路可以将负荷传感器保持在可接受的工作温度(例如60℃),而没有过多的能量消耗。
在一个实施例中,第二扩散板120被放置成与加压加热体116接触并且在加压构件112之间通过内板114延伸。换言之,第二扩散板120具有多个开口122,加压构件112的上端穿过开口122突出,以与压杆28接合。
第二扩散板120也由导热性高于内板114的材料制成,例如由钢制成。
例如,第二扩散板120也由铜制成。
在一个实施例中,第二扩散板120以可拆卸的方式(即,以可滑动的方式)带有游隙地例如通过与第二扩散板120的槽孔接合的螺栓固定到加压加热体116和内板112,以促进内板和加压加热体的不同热膨胀。
在一个实施例中,在第二扩散板120中,补偿孔124以确保所有加压构件112的均匀加热的方式制作、成形和/或定位。
对于根据本发明的烧结压机的实施例,本领域的技术人员为了满足可能的需要,在不脱离所附权利要求的范围的情况下,可以对功能上等同的器件进行修改、改变和替换。描述为属于一个可能的实施例的每个特征可以独立于其他描述的实施例实现。
Claims (12)
1.一种用于在基板上烧结电子器件的烧结压机,包括:
-加压单元,包括用于将烧结压力施加到待烧结的所述电子器件的多个可控制的加压构件;
-多个反作用元件,每个反作用元件主要沿着与所述压机的加压轴线平行的元件轴线在第一元件端与第二元件端之间延伸,其中,所述第一元件端形成为用于相应的基板的支撑平面;
-元件板,适于可滑动地支撑所述反作用元件,所述反作用元件以矩阵排列在所述元件板中并且具有从所述元件板突出的第一端;
-加热电路,包括嵌入在加热体中的加热元件,所述加热体围绕所述元件板放置,以使所述元件板达到烧结温度;以及
-热扩散板,被放置成与所述加热体接触并且在所述反作用元件之间、在所述元件板上延伸,所述扩散板由导热性高于所述元件板的导热性的材料制成。
2.根据权利要求1所述的压机,其中,所述扩散板包括:至少两个端集热器,彼此相对且固定,每个端集热器跨越所述加热体和所述元件板;以及中央栅格,与所述元件板接触地围绕所述反作用元件的所述第一端延伸。
3.根据权利要求1或2所述的压机,其中,所述加压单元还包括加压加热板,所述加压加热板可滑动地支撑所述加压构件,每个加压构件能够由对应的压杆操作以作用于相应的待烧结的所述电子器件上,所述加压加热板包括:内板,适于可滑动地支撑所述加压构件;以及加压加热体,围绕所述内板放置并且设置有适于加热所述内板并且由此加热所述加压构件的加热装置。
4.根据权利要求3所述的压机,其中,所述加压单元包括第二扩散板,所述第二扩散板被放置成与所述加压加热体接触并且在所述加压构件之间、在所述内板上延伸,所述第二扩散板由导热性高于所述内板的导热性的材料制成。
5.根据前述权利要求中的任一项所述的压机,其中,所述扩散板由铜制成。
6.根据前述权利要求中的任一项所述的压机,其中,所述扩散板以可移除的方式并带有游隙地固定到相应的所述加热体和相应的板上。
7.根据前述权利要求中的任一项所述的压机,其中,在所述扩散板中制有气流孔,所述气流孔以确保所有所述反作用元件和/或所有所述加压构件的均匀加热的方式成形和/或定位。
8.根据前述权利要求中的任一项所述的压机,其中,所述元件板与所述加热体能够分离。
9.根据前述权利要求中的任一项所述的压机,包括多个负荷传感器,每个负荷传感器可操作地连接到所述第二元件端,使得所述负荷传感器通过所述反作用元件来检测由一个或多个所述加压构件施加的力,所述负荷传感器容纳在可操作地连接到冷却电路的传感器保持板中。
10.根据前述权利要求所述的压机,其中,每个所述反作用元件具有:加热部,穿过所述元件板并且所述加热部适于通过传导将所述元件板的热传递到所述基板;以及冷却部,以第二端结束并且成形为以便耗散从所述元件板传递到所述加热部的热。
11.根据权利要求10所述的压机,其中,所述冷却部包括轴向连续的耗散盘,所述耗散盘与所述元件轴线同轴地延伸。
12.根据前述权利要求中的任一项所述的压机,其中,所述反作用元件的第二端配备有面向负荷传感器的红外屏。
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Also Published As
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MA54532A (fr) | 2022-03-30 |
KR20210107649A (ko) | 2021-09-01 |
US20220001637A1 (en) | 2022-01-06 |
IT201800020275A1 (it) | 2020-06-20 |
WO2020128832A1 (en) | 2020-06-25 |
JP7444479B2 (ja) | 2024-03-06 |
EP3900024A1 (en) | 2021-10-27 |
US11820095B2 (en) | 2023-11-21 |
JP2022510801A (ja) | 2022-01-28 |
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