CN113099367A

CN113099367A - Loudspeaker, loudspeaker module and electronic equipment

Info

Publication number: CN113099367A
Application number: CN202010019342.3A
Authority: CN
Inventors: 于利刚; 朱统; 李英明; 苏杰; 常晶; 吴桂敏
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-01-08
Filing date: 2020-01-08
Publication date: 2021-07-09
Also published as: WO2021139632A1; EP4068804A1; EP4068804A4

Abstract

The embodiment of the application discloses a loudspeaker, a loudspeaker module and electronic equipment. The loudspeaker comprises a support, a first diaphragm, a first piezoelectric plate and a moving-coil loudspeaker inner core. The periphery of the first vibrating diaphragm is fixed on the support, and the first piezoelectric plate is fixed in the middle of the first vibrating diaphragm. The moving-coil loudspeaker kernel is fixed in the support and is arranged at an interval with the first vibrating diaphragm, the moving-coil loudspeaker kernel comprises a second vibrating diaphragm, the second vibrating diaphragm is arranged towards the first vibrating diaphragm, the second vibrating diaphragm, the support and the first vibrating diaphragm jointly surround to form a front cavity, the support is provided with a sound outlet, and the sound outlet is communicated with the front cavity and the external space of the loudspeaker. The first vibrating diaphragm and the second vibrating diaphragm of the loudspeaker are oppositely arranged and share the front cavity, so that medium-high frequency response of the loudspeaker is complemented, and the overall loudness of the loudspeaker is improved.

Description

Loudspeaker, loudspeaker module and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of audio frequency, in particular to a loudspeaker, a loudspeaker module and electronic equipment.

Background

The moving-coil speaker is a speaker widely used nowadays, and is generally applied to speaker modules and earphone modules of electronic devices such as mobile phones and flat panels. However, the moving coil speaker is insufficient in loudness due to its small size; moreover, the dome of the moving-coil speaker is thin and the material strength is not sufficient, so that the high frequency response is insufficient.

Disclosure of Invention

An object of the application is to provide a speaker, a speaker module and an electronic device. The loudspeaker integrates the piezoelectric loudspeaker inner core and the moving-coil loudspeaker inner core, and the vibrating diaphragms of the piezoelectric loudspeaker inner core and the moving-coil loudspeaker inner core are oppositely arranged and share the front cavity, so that medium-high frequency response of the loudspeaker is complemented, and the overall loudness of the loudspeaker is improved.

In a first aspect, the present application provides a loudspeaker including a frame, a first diaphragm, a first piezoelectric plate, and a moving-coil loudspeaker core. The periphery of the first vibrating diaphragm is fixed on the support, and the first piezoelectric plate is fixed in the middle of the first vibrating diaphragm. The moving-coil loudspeaker kernel is fixed in the support and is arranged at an interval with the first vibrating diaphragm, the moving-coil loudspeaker kernel comprises a second vibrating diaphragm, the second vibrating diaphragm is arranged towards the first vibrating diaphragm, the second vibrating diaphragm, the support and the first vibrating diaphragm jointly surround to form a front cavity, the support is provided with a sound outlet, and the sound outlet is communicated with the front cavity and the external space of the loudspeaker.

In this application, a loudspeaker includes a piezoelectric loudspeaker core having a first diaphragm and a first piezoelectric patch. Because the speaker has fused piezoelectric speaker kernel and moving coil speaker kernel, the first vibrating diaphragm of piezoelectric speaker kernel and the second vibrating diaphragm of moving coil speaker kernel can promote the air in antechamber simultaneously and take place the vibration, in order to realize the sound production, consequently compare in traditional moving coil speaker, the whole loudness of the speaker of this application obviously promotes. Compare in traditional moving coil loudspeaker, the speaker of this application can complement medium-high frequency response through the piezoelectric loudspeaker kernel for the medium-high frequency sound pressure level of speaker obtains showing and promotes.

In addition, because the thickness of piezoelectricity speaker kernel is thinner, can utilize the headspace of the second vibrating diaphragm of moving coil speaker kernel to arrange, first vibrating diaphragm sets up, shares the front chamber with the second vibrating diaphragm relatively, therefore the speaker can save the space when realizing two vibrating diaphragm structures, not obviously increase whole volume, the speaker still can have less thickness, whole volume is less.

In one possible implementation, the first diaphragm may be a metal thin plate, an organic thin plate, or others. The thickness of the first diaphragm may be in the range of 50 μm to 0.3 mm. The first diaphragm may be rectangular, circular or other shape. In a possible implementation, the first piezoelectric plate is located on a side of the first diaphragm facing away from the support or on a side of the first diaphragm facing toward the support. The first piezoelectric patch may be rectangular, circular, or other shape. In a possible implementation manner, the shape of the first piezoelectric sheet is the same as the shape of the first diaphragm, and the size of the first piezoelectric sheet is smaller than that of the first diaphragm.

In a possible implementation manner, the support includes a first supporting portion and a second supporting portion that are disposed opposite to each other, two sides of a periphery of the first diaphragm are fixed to the first supporting portion and the second supporting portion respectively, and the sound outlet hole is formed in the first supporting portion. The second vibrating diaphragm comprises a vibrating part and a ball top part, and the ball top part is fixed in the middle of the vibrating part. In the direction from the second supporting part to the first supporting part, the distance between the first vibrating diaphragm and the top of the ball increases progressively.

In this implementation, first vibrating diaphragm inclines for the second vibrating diaphragm, and both are the loudspeaker form roughly, and the opening direction of loudspeaker is towards going out the sound hole, are favorable to loudspeaker and external acoustic impedance to match, promote sound production efficiency, reduce the risk that produces the air current noise.

In one possible implementation, the area of the first diaphragm is greater than or equal to the area of the second diaphragm. In a conventional moving-coil speaker, since the overall size of the module is greatly limited, the diaphragm area is difficult to be increased. In this implementation manner, the loudspeaker is provided with the first diaphragm having a large area under the condition that the area of the second diaphragm is limited, so as to raise the sound pressure level. In addition, along with the increase of the area of the first diaphragm, the loudspeaker can obtain larger front cavity space, so that noise of the loudspeaker is less, and the sound quality is better.

In a possible implementation manner, the bracket further includes an installation portion, the installation portion is connected between the first supporting portion and the second supporting portion, the installation portion is provided with an installation hole, the moving-coil speaker core is fixed to the installation portion, and part or all of the moving-coil speaker core is accommodated in the installation hole.

In this implementation manner, the first supporting portion and the second supporting portion of the bracket are respectively located at two sides of the mounting portion, two sides of the periphery of the first vibrating diaphragm are fixed to the first supporting portion and the second supporting portion, and the second vibrating diaphragm is mounted in the mounting portion, so that the area of the first vibrating diaphragm can be larger than that of the second vibrating diaphragm.

In one possible implementation, the shape of the mounting hole is adapted to the outer shape of the moving coil loudspeaker core. The mounting holes may be generally rectangular, circular, or other shapes.

In a possible implementation manner, the support further includes a third supporting portion and a fourth supporting portion that are disposed oppositely, the third supporting portion and the fourth supporting portion are connected between the first supporting portion and the second supporting portion, and the other two sides of the periphery of the first diaphragm are fixed to the third supporting portion and the fourth supporting portion respectively. The mounting part is also connected between the third supporting part and the fourth supporting part.

In one possible implementation manner, the first supporting portion includes a first sub-supporting portion and a second sub-supporting portion, the second sub-supporting portion is connected to the mounting portion, the first sub-supporting portion is connected to the second sub-supporting portion and the first diaphragm, and the first sub-supporting portion protrudes in a direction away from the second supporting portion relative to the second sub-supporting portion.

In this implementation, because the first sub-support portion of the speaker protrudes toward the direction away from the second support portion relative to the second sub-support portion, when the bottom structure and the size of the bracket do not significantly change, the first sub-support portion used for fixing the first diaphragm through the first support portion protrudes toward the direction away from the second support portion, so that the speaker can be provided with a larger-area first diaphragm, thereby improving the sound pressure level.

In a possible implementation manner, the support further includes a third supporting portion and a fourth supporting portion that are disposed oppositely, the third supporting portion and the fourth supporting portion are connected between the first supporting portion and the second supporting portion, and the other two sides of the periphery of the first diaphragm are fixed to the third supporting portion and the fourth supporting portion respectively. In other words, the first support portion, the third support portion, the second support portion, and the fourth support portion may be connected in sequence to form a mounting frame portion, and the periphery of the first diaphragm is continuously fixed to the mounting frame portion.

The support further comprises a first frame portion and a second frame portion, the first frame portion is located on one side, far away from the fourth supporting portion, of the third supporting portion, two ends of the first frame portion are connected with one end of the first supporting portion and one end of the second supporting portion respectively, a first communicating space is formed between the first frame portion and the third supporting portion, the second frame portion is located on one side, far away from the third supporting portion, of the fourth supporting portion, two ends of the second frame portion are connected with the other end of the first supporting portion and the other end of the second supporting portion respectively, and a second communicating space is formed between the second frame portion and the fourth supporting portion. The surfaces of the first frame portion, the first supporting portion, the second supporting portion and the second frame portion, which are far away from the first vibrating diaphragm, are arranged in a coplanar manner.

In this implementation, the surfaces of the first frame portion, the first supporting portion, the second supporting portion, and the second frame portion, which are far away from the first diaphragm, are jointly spliced to form the bottom surface of the support, and when the speaker is mounted on other components, the speaker can be fixed with other components through the bottom surface of the support. In this case, the space below the mounting portion forms a part of the back chamber of the speaker, and the first communication space between the first frame portion and the third support portion and the second communication space between the second frame portion and the fourth support portion also form a part of the back chamber of the speaker. Therefore, the design of the first frame part and the second frame part is beneficial to increasing the back cavity space of the loudspeaker and improving the low-frequency sound pressure level of the loudspeaker. In addition, the piezoelectric loudspeaker inner core can share the back cavity with the moving-coil loudspeaker inner core through the first communicating space and the second communicating space, so that the sum of the back cavity space of the loudspeaker is smaller, and the miniaturization of the loudspeaker is facilitated.

In one possible implementation, the loudspeaker further comprises a second piezoelectric patch. The second piezoelectric sheet and the first piezoelectric sheet are respectively fixed on the two side surfaces of the first diaphragm. The second piezoelectric patch is part of a piezoelectric speaker core. The piezoelectric loudspeaker core comprises a first piezoelectric sheet and a second piezoelectric sheet, and the first piezoelectric sheet and the second piezoelectric sheet can drive the first diaphragm simultaneously so as to improve the sensitivity of the piezoelectric loudspeaker core.

In a second aspect, the present application further provides an electronic device, which includes a housing and the speaker, wherein the speaker is accommodated in the housing, the bracket is fixedly connected to the housing, and the housing is provided with a communication hole that communicates with the sound outlet hole and an external space of the electronic device.

In the application, because the overall loudness of the loudspeaker is higher, and the sound pressure level of the medium-high frequency is higher, the volume of playing sound of the electronic equipment applying the loudspeaker is higher, and the sound quality is better.

In a possible implementation manner, the casing includes a middle frame and a first cover plate, the first cover plate is fixed to one side of the middle frame, and the communication hole is formed in the frame portion of the middle frame and/or the first cover plate. The loudspeaker can be used as an external loudspeaker of the electronic equipment, and the communication hole is formed in the frame portion of the middle frame. Alternatively, the speaker may be a non-external speaker of the electronic device, and the communication hole may be provided in the frame portion of the middle frame, or in the first cover plate, or partially in the frame portion of the middle frame, or partially in the first cover plate.

In an alternative implementation, the electronic device further includes a seal. The sealing element is arranged between the shell and the bracket and arranged around the sound outlet hole and the communication hole. In this implementation, the seal can separate the front and back cavities of the speaker, thereby reducing the leakage of sound in the interior space of the electronic device. In addition, the front cavity and the back cavity of the piezoelectric loudspeaker core are completely separated, so that the problem of acoustic short circuit can be effectively avoided, the sound production efficiency of the piezoelectric loudspeaker core can be ensured, and the whole sound production efficiency of the loudspeaker is higher.

In a possible implementation manner, the casing further includes a second cover plate, and the second cover plate is fixed to one side of the middle frame, which is far away from the first cover plate. The support is fixed in the center, and first vibrating diaphragm sets up towards first apron, and the moving-coil loudspeaker kernel is located between first vibrating diaphragm and the second apron. A first back cavity is formed between the first vibrating diaphragm and the first cover plate, and a second back cavity is formed between the second vibrating diaphragm and the second cover plate. The first back cavity and the second back cavity are both part of the back cavity of the speaker.

In this implementation, the speaker can utilize the empty space inside the electronic device as the back cavity, so that the volume of the speaker can be reduced, the speaker is light and thin, the space of the back cavity of the speaker is large, and the low-frequency sound pressure level of the speaker can be effectively improved.

In one possible implementation, the second back cavity and the first back cavity are isolated from each other or are communicated with each other. When the second back cavity is communicated with the first back cavity, the total requirement of the loudspeaker on the back cavity space can be properly reduced when the low-frequency sound pressure level requirement of the loudspeaker is basically guaranteed, so that the miniaturization of the electronic equipment is facilitated. When the second back cavity and the first back cavity are isolated from each other, the mutual interference between the vibration of the first vibrating diaphragm of the piezoelectric loudspeaker core and the vibration of the second vibrating diaphragm of the moving-coil loudspeaker core is small, and the tone quality of the loudspeaker is improved.

In a possible implementation manner, the electronic device further includes a first device, and the first device is partially or completely located between the first diaphragm and the second cover plate. In this implementation manner, the first diaphragm and the first device are partially overlapped in the thickness direction of the electronic device, so that the thickness space of the electronic device is fully utilized, and the miniaturization of the electronic device is facilitated. Meanwhile, the loudspeaker fully utilizes the vacant space in the whole machine, the area of the first vibrating diaphragm is enlarged, and the sound pressure level of the loudspeaker is improved.

In one possible implementation, the first device may be an electrical connector, a circuit board, a microphone, or the like.

In a third aspect, the present application further provides a speaker module, which includes a module upper cover, a module lower cover and the speaker. The module upper cover is fixed in one side that the first vibrating diaphragm was installed to the support, and the module upper cover is fixed in the opposite side of support. In this application, because the whole loudness of speaker is higher, and the sound pressure level of well high-frequency is higher, consequently the volume of the broadcast sound of the speaker module of using this speaker is higher, tone quality is preferred.

In one possible implementation manner, a first back cavity is formed between the module upper cover and the first diaphragm, and a second back cavity is formed between the module lower cover and the second diaphragm. The first back cavity and the second back cavity are both part of the back cavity of the loudspeaker module. The second back cavity is isolated from or communicated with the first back cavity. When the second back cavity and the first back cavity are communicated with each other, the loudspeaker module can properly reduce the total requirement of the back cavity space when the requirement of the low-frequency sound pressure level of the loudspeaker module is basically guaranteed, so that the miniaturization of the loudspeaker module is facilitated. The second back cavity and the first back cavity can be communicated with each other through a first communication space and a second communication space, and the first communication space and the second communication space are also part of the back cavity of the loudspeaker. When the second back cavity and the first back cavity are mutually isolated, the mutual interference between the vibration of the first vibrating diaphragm of the piezoelectric loudspeaker core and the vibration of the second vibrating diaphragm of the moving-coil loudspeaker core is small, and the tone quality of the loudspeaker module is favorably improved.

In a fourth aspect, the present application further provides an electronic device, including a housing and the aforementioned speaker module, the speaker module is accommodated in the housing, the module upper cover and/or the module upper cover are/is fixedly connected to the housing, the housing is provided with a communication hole, and the communication hole is communicated with the sound outlet hole and an external space of the electronic device. In this application, because the whole loudness of the speaker of speaker module is higher, and the sound pressure level of well high-frequency is higher, consequently the volume of the broadcast sound of the electronic equipment of using this speaker module is higher, tone quality is preferred.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 2 is a partially exploded schematic view of the electronic device of FIG. 1 in some embodiments;

fig. 3 is a schematic structural diagram of a speaker provided in an embodiment of the present application in some embodiments;

FIG. 4 is an exploded schematic view of the speaker of FIG. 3;

FIG. 5 is an exploded schematic view of the moving coil speaker core of FIG. 4;

FIG. 6 is a schematic view of the loudspeaker of FIG. 3 taken along line A-A;

FIG. 7 is a schematic view of the loudspeaker of FIG. 3 taken along line B-B;

FIG. 8 is a schematic diagram of sound pressure levels of the speaker of FIG. 3 in one possible implementation;

fig. 9 is a first schematic structural diagram of the loudspeaker shown in fig. 3 as an external loudspeaker applied to the electronic device shown in fig. 2;

fig. 10 is a second schematic structural diagram of the speaker shown in fig. 3 as an external speaker applied to the electronic device shown in fig. 2;

fig. 11 is a schematic structural diagram of a speaker according to an embodiment of the present application in other embodiments;

fig. 12 is a schematic view of the loudspeaker of fig. 11 taken along line C-C;

fig. 13 is a schematic structural view of the speaker shown in fig. 11 applied to the electronic apparatus shown in fig. 2 as a loud speaker;

fig. 14 is a schematic structural diagram of a speaker module according to an embodiment of the present disclosure;

fig. 15 is a partially exploded schematic view of the speaker module of fig. 14;

fig. 16 is a schematic view of the speaker module shown in fig. 14 taken along D-D;

fig. 17 is a schematic structural view of the speaker module shown in fig. 14 taken along the line E-E;

fig. 18 is a schematic structural diagram of the speaker module shown in fig. 14 as an external speaker applied to the electronic device shown in fig. 2.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

The embodiment of the application provides a loudspeaker, a loudspeaker module and electronic equipment. The speaker is used for converting the electric signal into a sound signal. The loudspeaker forms a double-diaphragm structure by coupling the piezoelectric loudspeaker kernel and the moving-coil loudspeaker kernel, and the diaphragms of the piezoelectric loudspeaker kernel and the diaphragms of the moving-coil loudspeaker kernel are arranged oppositely to share the front cavity, so that medium-high frequency response of the loudspeaker is complemented, and the overall loudness of the loudspeaker is improved.

The loudspeaker can be independently installed on the electronic equipment, and also can be used as the inner core of the loudspeaker module and integrally installed on the electronic equipment along with the loudspeaker module. The electronic device can be an electronic product with a sound playing function, such as a mobile phone, a tablet computer, a notebook computer, a wearable device and the like. The wearable device can be an intelligent bracelet, an intelligent watch, an intelligent head display, intelligent glasses and the like.

Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure, and fig. 2 is a partially exploded schematic diagram of the electronic device 100 shown in fig. 1 in some embodiments. In fig. 1, an example in which the electronic apparatus 100 is a mobile phone is described.

The electronic apparatus 100 includes a housing 10, and a circuit board 20, a battery 30, a camera module 40, a loud speaker 50, and a non-loud speaker 60 housed in the housing 10. For convenience of description, the following description will be given of the structure of the electronic device 100, taking the orientation of the electronic device 100 in fig. 1 as an example, defining the width direction of the electronic device 100 as the X direction, the length direction of the electronic device 100 as the Y direction, the thickness direction of the electronic device 100 as the Z direction, and the width direction X of the electronic device 100, the length direction Y of the electronic device 100, and the thickness direction Z of the electronic device 100 are perpendicular to each other in pairs.

The housing 10 includes a middle frame 101, and a first cover plate 102 and a second cover plate 103 fixed to both sides of the middle frame 101, respectively. In some embodiments, the first cover plate 102 may be a front cover plate of the electronic device 100, and the second cover plate 103 may be a rear cover plate of the electronic device 100. The first cover 102 includes a protective cover and a display panel stacked on each other, and the display panel is fixed to a side of the protective cover facing the second cover 103. The display panel is used for displaying images, and can be integrated with a touch function. The middle frame 101 includes a frame portion 1011 and a fixing portion 1012 located inside the frame portion 1011, two sides of the frame portion 1011 of the middle frame 101 are fixedly connected to a periphery of the first cover plate 102 and a periphery of the second cover plate 103, respectively, and the fixing portion 1012 of the middle frame 101 is located between the first cover plate 102 and the second cover plate 103, and is used for fixing one or more components of the electronic device 100, which are housed in the housing 10. Fig. 2 only illustrates a part of the structure of the fixing portion 1012 of the middle frame 101, and fig. 2 does not illustrate another part of the structure of the fixing portion 1012 of the middle frame 101. The frame portion 1011 and the fixing portion 1012 of the middle frame 101 may be integrally formed, or may be integrally formed by assembling, which is not strictly limited in the present application. The frame portion 1011 of the middle frame 101 and the second cover plate 103 may be integrally formed, or may be formed into an integral structure by an assembling method, which is not strictly limited in this application.

Illustratively, the circuit board 20, the battery 30 and the camera module 40 are all fixedly connected to the middle frame 101. A plurality of devices 201 may be secured to the circuit board 20. The plurality of devices 201 includes, but is not limited to, a processor, a memory, and the like, the memory coupled to the processor. Among them, the number of the circuit boards 20 may be one or more. The battery 30 is used to power the electronic device 100. The camera module 40 is used for collecting light to shoot. Illustratively, the camera module 40 is used for rear shooting of the electronic device 100, the second cover plate 103 is provided with a shooting through hole 1031, and the camera module 40 collects light through the shooting through hole 1031. The camera module 40 may include one or more cameras. In some other embodiments, the electronic device 100 may further include a camera module for front-end shooting, and may also include a camera module for acquiring a face image and/or a pupil image, where the specific number, type, and the like of the camera modules are not strictly limited in this application. In the embodiment of the application, "a and/or B" includes "a", "B", and "a and B".

Illustratively, the loud speaker 50 and the non-loud speaker 60 are both fixedly connected to the middle frame 101 of the housing 10. The non-loud speaker 60 may also be referred to as an earpiece, and may be used to transmit the voice of the other party to the user when the user is engaged in a non-hands-free call; the loud speaker 50 may also be a speaker, and may be used to amplify and play the voice of the other party to the user during the speakerphone, or may be used in situations where it is necessary to play the voice or audio signal such as playing music, navigation voice, and radio.

Illustratively, the casing 10 is provided with a communication hole that communicates an inner space of the casing 10 with an outer space of the casing 10, that is, communicates an inner space of the electronic apparatus 100 with an outer space of the electronic apparatus 100. The number and position of the communication holes of the casing 10 can be designed according to the sound emission type, arrangement position, sound emission position, and the like of the loud speakers 50 and the non-loud speakers 60 of the electronic device 100.

In some embodiments, the loud speaker 50 generates sound by vibrating air with a diaphragm. The loud speaker 50 is fixed to the fixing portion 1012 of the center frame 101. The casing 10 includes a communication hole 104 serving as a sound emitting hole, the communication hole 104 may be provided at a rim portion 1011 of the middle frame 101, and the loud speaker 50 may transmit sound to an external space of the electronic device 100 through the communication hole 104 to realize sound reproduction. The number of the communication holes 104 in this portion may be one or more. The number and shape of the communication holes 104 may be designed to match so that the total cross-sectional area of the communication holes 104 meets the sound production requirements. The electronic device 100 may further include a sealing member 70, among other things. The seal 70 may be substantially frame shaped. The sealing member 70 may be installed between the frame portion 1011 of the middle frame 101 and the loud speaker 50 and arranged around the communication hole 104 to reduce the leakage of sound in the inner space of the electronic apparatus 100. Illustratively, the sealing member 70 may be double-sided tape or foam, etc.

In some embodiments, the non-loud speaker 60 generates sound by vibrating air with a diaphragm. The casing 10 includes a communication hole 105 serving as a speaker hole, the communication hole 105 may be provided in the first cover 102, and the non-loud speaker 60 may transmit sound to an external space of the electronic apparatus 100 through the communication hole 105 to realize sound reproduction. In other embodiments, the communication hole 105 may also be disposed on the frame portion 1011 of the middle frame 101. In still other embodiments, the communication hole 105 may also be partially formed in the first cover plate 102 and partially formed in the border 1011 of the middle frame 101, and the two parts are joined together. In other embodiments, the non-loud speaker 60 may also emit sound by means of a screen sound, and in this case, the housing 10 may omit the communication hole 105 serving as a speaker hole.

It is understood that the above description illustrates some embodiments of the loud speaker 50 and the non-loud speaker 60 of the electronic device 100, and that other embodiments of the loud speaker 50 and the non-loud speaker 60 are also possible, and the application is not limited thereto.

A speaker provided in an embodiment of the present application will be described below with reference to the drawings, and the speaker may be used as a loud speaker 50 and/or a non-loud speaker 60 of an electronic device 100.

Referring to fig. 3 and 4 together, fig. 3 is a schematic structural diagram of a speaker 1 according to an embodiment of the present disclosure in some embodiments, and fig. 4 is an exploded schematic diagram of the speaker 1 shown in fig. 3.

In some embodiments, the loudspeaker 1 comprises a support 11, a piezoelectric loudspeaker core 12 and a moving coil loudspeaker core 13. The piezoelectric speaker core 12 and the moving-coil speaker core 13 are both mounted on the support 11.

In some embodiments, the piezoelectric speaker core 12 includes a first diaphragm 121, a first piezoelectric patch 122, and a second piezoelectric patch 123. The first diaphragm 121 includes a central portion and a periphery disposed around the central portion. The periphery of the first diaphragm 121 is fixed to the support 11. The first piezoelectric sheet 122 and the second piezoelectric sheet 123 are fixed to the middle of the first diaphragm 121, and are respectively fixed to two side surfaces of the first diaphragm 121. Illustratively, the first piezoelectric sheet 122 is located on a side of the first diaphragm 121 facing away from the frame 11, and the second piezoelectric sheet 123 is located on a side of the first diaphragm 121 facing toward the frame 11. In other embodiments, the positions of the first piezoelectric sheet 122 and the second piezoelectric sheet 123 may be interchanged.

When the first piezoelectric patch 122 and the second piezoelectric patch 123 are powered on, the first piezoelectric patch 122 and the second piezoelectric patch 123 deform to drive the first diaphragm 121 to vibrate, and the piezoelectric speaker core 12 generates sound. In other embodiments, the piezoelectric speaker core 12 may also include a first piezoelectric patch 122, and omit a second piezoelectric patch 123, where the first piezoelectric patch 122 is located on a side of the first diaphragm 121 facing away from the support 11 or a side of the first diaphragm 121 facing toward the support 11, and the piezoelectric speaker core 12 drives the first diaphragm 121 to vibrate through the first piezoelectric patch 122.

The first diaphragm 121 may have a rectangular shape. In some embodiments, the first diaphragm 121 may be a metal thin plate, an organic thin plate, or others. In some embodiments, the thickness of the first diaphragm 121 may be in a range from 50 μm to 0.3mm, and when the area of the first diaphragm 121 is large, a large thickness may be selected.

The first piezoelectric patch 122 and the second piezoelectric patch 123 may be rectangular. In other embodiments, the first diaphragm 121 may have other shapes such as a circular shape. In other embodiments, the first piezoelectric sheet 122 and/or the second piezoelectric sheet 123 may have other shapes such as a circle. For example, the shapes of the first piezoelectric sheet 122 and the second piezoelectric sheet 123 may be the same as the shape of the first diaphragm 121, and the sizes of the first piezoelectric sheet 122 and the second piezoelectric sheet 123 are smaller than the size of the first diaphragm 121.

In some embodiments, the bracket 11 includes a first supporting portion 111 and a second supporting portion 112 disposed opposite to each other, and a third supporting portion 113 and a fourth supporting portion 114 disposed opposite to each other, and the third supporting portion 113 and the fourth supporting portion 114 are connected between the first supporting portion 111 and the second supporting portion 112. For example, the first support portion 111, the third support portion 113, the second support portion 112, and the fourth support portion 114 may be sequentially connected to form the mounting frame portion 110, and the periphery of the first diaphragm 121 is continuously fixed to the mounting frame portion 110. The support 11 has a sound outlet 115, and the sound outlet 115 is disposed on the first support 111. The sound outlet hole 115 penetrates the first supporting portion 111 to communicate with spaces at both sides of the first supporting portion 111.

In some embodiments, the bracket 11 further includes a mounting portion 116. The mounting portion 116 is connected between the first supporting portion 111 and the second supporting portion 112. The mounting portion 116 is also connected between the third supporting portion 113 and the fourth supporting portion 114. The mounting portion 116 is provided with a mounting hole 1161. The mounting hole 1161 communicates the top-side space and the bottom-side space of the mounting portion 116. Illustratively, the mounting hole 1161 may be substantially rectangular. In other embodiments, the mounting hole 1161 may have other shapes, such as a circle, and the shape of the mounting hole 1161 is adapted to the shape of the moving-coil speaker core 13. It should be understood that the terms "top" and "bottom" used in the embodiments of the present application are mainly used for describing the orientation of the related structures in the drawings, and do not form a limitation on the orientation of the related structures in practical application scenarios.

In some embodiments, the bracket 11 may further include a first frame portion 117 and a second frame portion 118. The first frame portion 117 and the second frame portion 118 are fixed to both sides of the mounting frame portion 110, respectively. The first frame portion 117 is located on a side of the third support portion 113 away from the fourth support portion 114, two ends of the first frame portion 117 are respectively connected to one end of the first support portion 111 and one end of the second support portion 112, and a first communication space 1171 is formed between the first frame portion 117 and the third support portion 113. The second frame portion 118 is located on a side of the fourth supporting portion 114 away from the third supporting portion 113, two ends of the second frame portion 118 are respectively connected to the other end of the first supporting portion 111 and the other end of the second supporting portion 112, and a second communicating space 1181 is formed between the second frame portion 118 and the fourth supporting portion 114.

Referring to fig. 4 and 5 together, fig. 5 is an exploded view of the moving coil speaker core 13 shown in fig. 4.

In some embodiments, the moving coil speaker core 13 includes a frame 131, a vibration component 13a, and a magnetic circuit component 13 b. The vibration unit 13a and the magnetic circuit unit 13b are attached to the frame 131. The vibration assembly 13a includes a second diaphragm 132 and a voice coil 133. The periphery of the second diaphragm 132 is fixed to one side of the frame 131, and the voice coil 133 is fixed to one side of the second diaphragm 132 facing the frame 131. The magnetic circuit assembly 13b includes a lower pole piece 134, a center magnet 135, a plurality of side magnets 136, a center pole piece 137, and a side pole piece 138. The lower pole piece 134 is fixed in the opposite side of basin frame 131, and central magnet 135 and a plurality of limit magnet 136 are all fixed in the one side of lower pole piece 134 towards basin frame 131, and a plurality of limit magnet 136 are arranged in the periphery of central magnet 135 dispersedly, and central pole piece 137 is fixed in the one side that lower pole piece 134 was kept away from to central magnet 135, and limit pole piece 138 is fixed in basin frame 131, is located the one side that lower pole piece 134 was kept away from to a plurality of limit magnet 136 and sets up around central pole piece 137. A first gap is formed between the plurality of side magnets 136 and the central magnet 135, a second gap is formed between the side pole piece 138 and the central pole piece 137, and the second gap is communicated with the first gap to be merged into a magnetic gap. The end of the voice coil 133 remote from the second diaphragm 132 is inserted into the magnetic gap of the magnetic circuit assembly 13 b. The magnetic circuit assembly 13b provides a magnetic field for driving the voice coil 133 to vibrate, when the voice coil 133 is powered on, the voice coil 133 drives the second diaphragm 132 to vibrate, and the moving-coil speaker core 13 generates sound.

In some embodiments, the second diaphragm 132 may include a vibration portion 1321 and a dome portion 1322, the periphery of the vibration portion 1321 is fixed to the frame 131, and the dome portion 1322 is fixed to the middle of the vibration portion 1321. The ball top 1322 may be fixed to a side of the vibration portion 1321 facing the frame 131 or a side away from the frame 131. The ball top 1322 has a substantially flat plate shape, and the vibrating portion 1321 has a substantially corrugated ring shape.

Referring to fig. 6 and 7 together, fig. 6 is a schematic structural view of the speaker 1 shown in fig. 3 taken along a-a, and fig. 7 is a schematic structural view of the speaker 1 shown in fig. 3 taken along B-B.

The periphery of the first diaphragm 121 of the piezoelectric speaker core 12 is fixed to the frame 11. Two sides of the periphery of the first diaphragm 121 are respectively fixed to the first supporting portion 111 and the second supporting portion 112, and the other two sides of the periphery of the first diaphragm 121 are respectively fixed to the third supporting portion 113 and the fourth supporting portion 114. The first piezoelectric sheet 122 and the second piezoelectric sheet 123 are respectively fixed to both side surfaces of the first diaphragm 121.

The moving-coil speaker core 13 is fixed to the support 11 and spaced apart from the first diaphragm 121. Illustratively, the moving-coil speaker core 13 is fixed to the mounting portion 116, and the moving-coil speaker core 13 is partially or entirely accommodated in the mounting hole 1161 of the mounting portion 116. At this time, the moving-coil speaker core 13 is located substantially below the piezoelectric speaker core 12.

The second diaphragm 132 of the moving-coil speaker core 13 is disposed facing the first diaphragm 121, and the second diaphragm 132, the support 11 and the first diaphragm 121 together surround to form the front cavity 1 a. Illustratively, the second diaphragm 132, the mounting portion 116, the mounting frame portion 110, and the first diaphragm 121 collectively form a front cavity 1 a. The sound outlet hole 115 of the holder 11 communicates the front chamber 1a to the external space of the speaker 1. When the speaker 1 is powered on to operate, the first diaphragm 121 and the second diaphragm 132 push the air in the front chamber 1a to vibrate, and the speaker 1 emits sound to the external space through the sound outlet hole 115.

In this embodiment, since the speaker 1 has fused the piezoelectric speaker core 12 and the moving-coil speaker core 13, the first diaphragm 121 of the piezoelectric speaker core 12 and the second diaphragm 132 of the moving-coil speaker core 13 can simultaneously push the air in the front cavity 1a to vibrate so as to realize sound production, and therefore, compared with a conventional moving-coil speaker, the overall loudness of the speaker 1 in the embodiment of the present application is significantly improved. Compared with the traditional moving-coil loudspeaker, the loudspeaker 1 of the embodiment of the application can complement medium-high frequency response through the piezoelectric loudspeaker inner core 12, so that the medium-high frequency sound pressure level of the loudspeaker 1 is obviously improved.

In addition, because the thickness of the piezoelectric speaker core 12 is thin, the top space of the second diaphragm 132 of the moving-coil speaker core 13 can be used for arrangement, and the first diaphragm 121 and the second diaphragm 132 are arranged relatively and share the front cavity, so that the speaker 1 can save space and does not increase the whole volume obviously when a dual-diaphragm structure is realized, and the speaker 1 can still have small thickness and small whole volume.

The applicant verifies the loudspeaker 1 of the embodiment of the present application through simulation, experiment and other manners, and for a medium-high frequency band, compared with a traditional moving coil loudspeaker, the loudspeaker 1 of the embodiment of the present application can enhance the sound pressure level in the frequency band of 1Hz to 10kHz, and expand the frequency response width and enhance the sound pressure level in the frequency band of 10kHz to 20 kHz.

Referring to fig. 8, fig. 8 is a schematic diagram of sound pressure level of the loudspeaker 1 shown in fig. 3 in a possible implementation manner. As shown in fig. 8, the total sound pressure level of the speaker 1 of the present embodiment is superior to that of the conventional piezoelectric speaker and the conventional moving coil speaker, and the middle-high frequency sound pressure level of the speaker 1 of the present embodiment is significantly improved compared to that of the conventional moving coil speaker.

It is understood that, referring to fig. 6 again, the loudspeaker 1 of the embodiment of the present application may adjust the vibration direction and amplitude of the first diaphragm 121 and the second diaphragm 132 by controlling the amplitude and phase of the driving voltage of the piezoelectric speaker core 12 and the moving-coil speaker core 13, so as to achieve vibration reduction. In some embodiments, the piezoelectric speaker core 12 may control the vibration direction and amplitude of the first diaphragm 121 according to the ratio of the vibration mass of the second diaphragm 132 to the vibration mass of the first diaphragm 121, and the vibration direction and amplitude of the second diaphragm 132, so that the driving voltage of the second diaphragm 132 is matched with an appropriate amplitude and phase, so that the momentum change of the first diaphragm 121 is equal to or close to the momentum change of the second diaphragm 132, thereby performing the vibration damping function. In other embodiments, the moving-coil speaker core 13 may control the vibration direction and amplitude of the second diaphragm 132 according to the ratio of the vibration masses of the first diaphragm 121 and the second diaphragm 132, and the vibration direction and amplitude of the first diaphragm 121, so that the driving voltage is matched with an appropriate amplitude and phase, and the momentum change of the second diaphragm 132 is equal to or similar to the momentum change of the first diaphragm 121, thereby performing the vibration damping function. The method does not strictly limit the adjusting modes of the driving voltage and the phase of the piezoelectric loudspeaker core 12 and the moving-coil loudspeaker core 13, and the piezoelectric loudspeaker core and the moving-coil loudspeaker core are matched with each other finally.

Wherein, the momentum change of the first diaphragm 121 and the momentum change of the second diaphragm 132 are equal to satisfy: m₁V₁＝M₂V₂。M₁Is the mass, V, of the first diaphragm 121₁Is the vibration velocity, M, of the first diaphragm 121₂Is the mass, V, of the second diaphragm 132₂Is the vibration velocity of the second diaphragm 132.

When the piezoelectric speaker core 12 and the moving-coil speaker core 13 are fixed to the support 11, a correct electrode connection mode needs to be selected, so that the driving voltages of the two can correctly drive the diaphragm to vibrate, and the vibration requirement is met. For example, when the second diaphragm 132 vibrates in a direction approaching the first diaphragm 121, the first diaphragm 121 vibrates in a direction approaching the second diaphragm 132, that is, both vibrate in a direction approaching each other, and the air in the front chamber 1a is pressed by the first diaphragm 121 and the second diaphragm 132, and is discharged to the external space of the speaker 1 through the sound outlet hole 115; when the second diaphragm 132 vibrates in a direction away from the first diaphragm 121, the first diaphragm 121 vibrates in a direction away from the second diaphragm 132, that is, in a direction away from each other, and air in the external space of the speaker 1 is sucked into the front chamber 1a through the sound outlet hole 115.

In the embodiment of the present application, the speaker 1 can drive the piezoelectric patches (122, 123) of the piezoelectric speaker core 12 and the voice coil 133 of the moving-coil speaker core 13 through two Power Amplifiers (PA), respectively, so as to better meet the driving voltage requirements of the two speaker 1 cores. For example, the driving voltage of the piezoelectric speaker core 12 may be about 30V, and the driving voltage of the moving-coil speaker core 13 may be about 12V. Of course, in other embodiments, the driving may be performed by the same power amplifier.

As shown in fig. 6, in some embodiments, the distance between the top portions 1322 of the first and

second diaphragms

121 and 132 increases in a direction from the second support portion 112 to the first support portion 111. In this embodiment, the first diaphragm 121 is inclined relative to the second diaphragm 132, and both are substantially horn-shaped, and the opening direction of the horn faces the sound outlet hole 115, so that acoustic impedance matching between the speaker 1 and the outside is facilitated, sound production efficiency is improved, and risk of producing air flow noise is reduced.

When the first diaphragm 121 is inclined at a certain angle relative to the second diaphragm 132, the noise of the air flow of the speaker 1 can be reduced to a small value, and the sound quality of the speaker 1 is better. The inclination degree of the first diaphragm 121 with respect to the second diaphragm 132 affects the overall thickness of the speaker 1, which makes it difficult to adapt the speaker 1 to the electronic device 100 with a tight internal space. Therefore, the loudspeaker 1 can balance the requirement of reducing the airflow noise and the requirement of the installation space, and the inclination degree of the first diaphragm 121 relative to the second diaphragm 132 is reasonably designed. In other embodiments, the spherical tops 1322 of the first diaphragm 121 and the second diaphragm 132 may be parallel to each other.

Illustratively, the minimum distance between the first diaphragm 121 and the second diaphragm 132 is required to satisfy the vibration space requirements of both, so that the larger the distance between the two is, the better the whole volume of the loudspeaker 1 can be controlled within a reasonable range. In some embodiments, the minimum separation between the first diaphragm 121 and the second diaphragm 132 may be 0.7 mm.

As shown in fig. 6 and 7, in some embodiments, the area of the first diaphragm 121 is greater than or equal to the area of the second diaphragm 132. In a conventional moving-coil speaker, since the overall size of the module is greatly limited, the diaphragm area is difficult to be increased. In this embodiment, in the case where the area of the second diaphragm 132 is limited, the loudspeaker 1 is provided with the first diaphragm 121 having a large area to raise the sound pressure level. In addition, as the area of the first diaphragm 121 increases, the loudspeaker 1 can obtain a larger front cavity 1a space, so that the loudspeaker 1 has less noise and better sound quality.

In the present embodiment, the mounting frame portion 110 of the bracket 11 is disposed around the peripheral side of the mounting portion 116, the peripheral edge of the first diaphragm 121 is fixed to the mounting frame portion 110, and the second diaphragm 132 is mounted to the mounting portion 116, so that the area of the first diaphragm 121 can be made larger than that of the second diaphragm 132. In other embodiments, the support 11 may have other structures to meet the installation space requirement of the first diaphragm 121 and the second diaphragm 132, for example, the installation frame portion 110 and the installation portion 116 are stacked up and down, the installation frame portion 110 is in a horn shape in a direction away from the installation portion 116, and one end of the installation frame portion 110 away from the installation portion 116 has a larger opening area to meet the installation space requirement of the first diaphragm 121.

In other embodiments, the area of the first diaphragm 121 may also be equal to or smaller than the area of the second diaphragm 132, which is not strictly limited in this application.

In some embodiments, as shown in fig. 6 and 7, the surfaces of the first frame portion 117, the first supporting portion 111, the second supporting portion 112, and the second frame portion 118 of the support 11, which are away from the first diaphragm 121, are disposed in a coplanar manner. In this embodiment, the bottom surface of the first frame 117, the bottom surface of the first support section 111, the bottom surface of the second support section 112, and the bottom surface of the second frame 118 are jointly spliced to form the bottom surface of the bracket 11, and when the speaker 1 is mounted on another component, the speaker can be fixed to the other component by the bottom surface of the bracket 11. At this time, the space below the mounting portion 116 forms a part of the back cavity of the speaker 1, and the first communication space 1171 between the first frame portion 117 and the third support portion 113 and the second communication space 1181 between the second frame portion 118 and the fourth support portion 114 also form a part of the back cavity of the speaker 1. Therefore, the design of the first frame portion 117 and the second frame portion 118 is beneficial to increase the back cavity space of the loudspeaker 1, and the low frequency sound pressure level of the loudspeaker 1 is improved. In addition, the piezoelectric speaker core 12 can share a back cavity with the moving-coil speaker core 13 through the first communicating space 1171 and the second communicating space 1181, so that the sum of the back cavity spaces of the speaker 1 is small, which is beneficial to the miniaturization of the speaker 1.

In other embodiments, the speaker 1 is fixed to other components by the bottom surface of its mounting frame 110, and the space below the mounting portion 116 forms a part of the back cavity space of the speaker 1. When the back cavity space of the speaker 1 is sufficient, the first frame portion 117 and the second frame portion 118 may be omitted from the bracket 11 to reduce the volume of the speaker 1.

Referring to fig. 9 and 10 together, fig. 9 is a first schematic structural diagram of the speaker 1 shown in fig. 3 as the loud speaker 50 applied to the electronic device 100 shown in fig. 2, and fig. 10 is a second schematic structural diagram of the speaker 1 shown in fig. 3 as the loud speaker 50 applied to the electronic device 100 shown in fig. 2.

The speaker 1 is housed in a casing 10 of the electronic apparatus 100, and a bracket 11 of the speaker 1 is fixed to the casing 10. In some embodiments, the bracket 11 is fixed to the middle frame 101, for example, the bracket 11 may be fixed to the fixing portion 1012 of the middle frame 101. The bracket 11 may be fixed to the fixing portion 1012 of the middle frame 101 by an adhesive method, or may be fixed to the fixing portion 1012 of the middle frame 101 by another method such as clamping, welding, or the like, which is not limited in this application. The first diaphragm 121 is disposed facing the first cover plate 102, and the moving-coil speaker core 13 is located between the first diaphragm 121 and the second cover plate 103. The front chamber 1a of the loudspeaker 1 is located between the first diaphragm 121 and the second diaphragm 132. A first back cavity 106 is formed between the first diaphragm 121 and the first cover plate 102, a second back cavity 107 is formed between the second diaphragm 132 and the second cover plate 103, and the second back cavity 107 is communicated with the first back cavity 106. Illustratively, the second back cavity 107 is communicated with the first back cavity 106 through the first communicating space 1171 and the second communicating space 1181. The first back cavity 106, the second back cavity 107, the first communicating space 1171 and the second communicating space 1181 are all part of the back cavity 1b of the speaker 1.

The housing 10 is provided with a communication hole 104. Illustratively, the communication hole 104 is provided in the frame portion 1011 of the middle frame 101. The communication hole 104 communicates the sound outlet hole 115 to the external space of the electronic apparatus 100. At this time, the front chamber 1a of the speaker 1, the sound outlet hole 115 of the speaker 1, the communication hole 104 of the casing 10, and the external space of the electronic apparatus 100 communicate with each other, and the sound of the speaker 1 can be smoothly propagated to the outside of the electronic apparatus 100.

In the present embodiment, since the overall loudness of the speaker 1 is high and the sound pressure level of the medium-high frequency is high, the volume of the sound played by the electronic device 100 to which the speaker 1 is applied is high and the sound quality is good. In addition, the speaker 1 can use the empty space inside the electronic device 100 as the back cavity 1b, so that the volume of the speaker 1 can be reduced, the speaker 1 is light and thin, the space of the back cavity 1b of the speaker 1 is large, and the low-frequency sound pressure level of the speaker 1 can be effectively improved. In addition, since the second back cavity 107 and the first back cavity 106 of the speaker 1 are communicated with each other, when the low-frequency sound pressure level requirement of the speaker 1 is basically guaranteed, the total requirement for the space of the back cavity 1b of the speaker 1 can be properly reduced, thereby being beneficial to the miniaturization of the electronic device 100.

In other embodiments, the speaker 1 may partition the second back cavity 107 and the first back cavity 106 by changing the structure of the bracket 11 of the speaker 1, or changing the structure of the fixing part 1012 of the middle frame 101, or changing the matching structure between the bracket 11 and the fixing part 1012 of the middle frame 101, or the like. At this time, the mutual interference between the vibration of the first diaphragm 121 of the piezoelectric speaker core 12 and the vibration of the second diaphragm 132 of the moving-coil speaker core 13 is small, which is beneficial to improving the sound quality of the speaker 1.

In some embodiments, as shown in fig. 9, the sealing member 70 of the electronic device 100 is installed between the frame 1011 of the middle frame 101 and the support 11, and the sealing member 70 is disposed around the sound outlet hole 115 and the communication hole 104 to separate the front cavity 1a and the back cavity 1b of the speaker 1, so as to reduce the sound leakage in the internal space of the electronic device 100. In addition, the front cavity and the back cavity of the piezoelectric loudspeaker core 12 are completely separated, so that the problem of acoustic short circuit can be effectively avoided, the sound production efficiency of the piezoelectric loudspeaker core 12 is ensured, and the whole sound production efficiency of the loudspeaker 1 is higher.

In the embodiment of the present application, the loudspeaker 1 may be configured to mount the first diaphragm 121 with a larger area by changing a partial structure of the support 11, so as to increase the sound pressure level. For example, the loudspeaker 1 may be configured such that, with the basic frame of the bracket 11 being held, the top of the first support part 111 for fixing the first diaphragm 121 is protruded away from the second support part 112, such that the distance between the protruded top of the first support part 111 and the second support part 112 is larger to fix the first diaphragm 121 with a larger area, and the relative positional relationship between the bottom of the first support part 111 and the other parts of the bracket 11 is unchanged or not significantly changed, such that the loudspeaker 1 is less difficult to mount through the bottom of the bracket 11. The following examples are illustrative.

Referring to fig. 11 and 12 together, fig. 11 is a schematic structural diagram of a speaker 1 according to an embodiment of the present application in other embodiments, and fig. 12 is a schematic structural diagram of the speaker 1 shown in fig. 11 taken along a line C-C. The speaker 1 of the present embodiment may include some or all of the features of the speaker 1 of the foregoing embodiment, and differences of the speaker 1 of the present embodiment will be mainly described hereinafter.

Illustratively, the first support part 111 includes a first sub-support part 111a and a second sub-support part 111 b. The second sub-supporting portion 111b is connected to the mounting portion 116, and the first sub-supporting portion 111a is connected to the second sub-supporting portion 111b and the first diaphragm 121. The first sub-support 111a protrudes in a direction away from the second support 112 with respect to the second sub-support 111 b.

In the present embodiment, since the first sub-support 111a of the loudspeaker 1 protrudes relative to the second sub-support 111b in a direction away from the second support 112, when the bottom structure and size of the bracket 11 do not change significantly, the loudspeaker 1 can protrude in a direction away from the second support 112 through the first sub-support 111a of the first support 111 for fixing the first diaphragm 121, so that the loudspeaker 1 can be provided with a larger area of the first diaphragm 121, thereby increasing the sound pressure level.

In some embodiments, as shown in fig. 12, the first sub-supporting portion 111a is fixed to a side of the second sub-supporting portion 111b away from the second supporting portion 112. The surface 111c of the second sub-support 111b facing the first diaphragm 121 may be obliquely disposed, one end of the surface 111c close to the first sub-support 111a is close to the first diaphragm 121, so that the connection area between the first sub-support 111a and the second sub-support 111b is large, the connection reliability between the first sub-support and the second sub-support is high, and one end of the surface 111c close to the mounting portion 116 is far away from the first diaphragm 121, so as to increase the space of the front cavity 1a of the speaker 1 and provide a sufficient vibration space for the first diaphragm 121. In other embodiments, the first sub-support portion 111a may also be fixed to a side of the second sub-support portion 111b facing the first diaphragm 121, and an end of the first sub-support portion 111a away from the second sub-support portion 111b is inclined in a direction away from the second support portion 112.

Referring to fig. 13, fig. 13 is a schematic structural diagram of the speaker 1 shown in fig. 11 as an external speaker 50 applied to the electronic device 100 shown in fig. 2. Illustratively, the second sub-support 111b and the second support 112 of the first support 111 of the bracket 11 of the speaker 1 are fixed to the fixing portion 1012 of the middle frame 101. The electronic device 100 further comprises a first component 80, the first component 80 being located partly or entirely between the first diaphragm 121 and the second cover plate 103. Illustratively, the first device 80 may be an electrical connector, a circuit board, a microphone, or the like. At this time, the first diaphragm 121, the first sub-support portion 111a, and the first device 80 are partially overlapped in the thickness direction Z of the electronic apparatus 100, so that the thickness space of the electronic apparatus 100 is fully utilized, which is advantageous for miniaturization of the electronic apparatus 100. Meanwhile, the loudspeaker 1 fully utilizes the vacant space in the whole machine, so that the area of the first vibrating diaphragm 121 is enlarged, and the sound pressure level of the loudspeaker 1 is improved.

In other embodiments, when the empty space inside the electronic device 100 is located at other positions around the speaker 1, the structure of the support 11 of the speaker 1 may also be adaptively adjusted, so that the first diaphragm 121 can fully utilize the empty space to increase the area. For example, in an embodiment where the bracket 11 is not provided with the first frame portion 117 and the second frame portion 118, the top portion of the third support portion 113 may be protruded in a direction away from the fourth support portion 114 with respect to the bottom portion of the third support portion 113, so as to increase the area of the first diaphragm 121 by using an empty space outside the third support portion 113; the top of the fourth supporting portion 114 may be protruded in a direction away from the third supporting portion 113 with respect to the bottom of the fourth supporting portion 114, so as to increase the area of the first diaphragm 121 by using an empty space outside the fourth supporting portion 114.

It should be noted that, in some other embodiments, the support 11 may be designed to have a structure different from the foregoing embodiments while meeting the requirements of the support of the piezoelectric speaker core 12 and the moving-coil speaker core 13, the space requirements of the front cavity 1a and the sound outlet hole 115, and the like, which is not strictly limited in this application.

It should be noted that, the foregoing mainly describes the embodiment in which the speaker 1 shown in fig. 3 and the speaker 1 shown in fig. 11 are applied to the electronic device 100 as the loud speaker 50, but the speaker 1 shown in fig. 3 and the speaker 1 shown in fig. 11 can also be applied to the electronic device 100 as the non-loud speaker 60 (see fig. 2), and the front cavity 1a of the speaker 1 is communicated with the communication hole 105, which is not described in detail in this application.

Referring to fig. 14 and fig. 15 together, fig. 14 is a schematic structural diagram of a speaker module 2 according to an embodiment of the present application, and fig. 15 is a schematic partial exploded view of the speaker module 2 shown in fig. 14.

The speaker module 2 includes a module upper cover 21, a module lower cover 22, and the speaker 1 described above. The module upper cover 21 is fixed to one side of the bracket 11 where the first diaphragm 121 is mounted, and the module upper cover 21 is fixed to the other side of the bracket 11, that is, the module upper cover 21 and the module lower cover 22 are respectively fixed to both sides of the bracket 11. The module upper cover 21 and the module lower cover 22 may be fixed to the bracket 11 by bonding or the like. In this embodiment, since the overall loudness of the speaker 1 is high and the sound pressure level of the medium-high frequency is high, the volume of the sound played by the speaker module 2 using the speaker 1 is high and the sound quality is good.

The module upper cover 21 is provided with a first leakage hole 211, and the first leakage hole 211 communicates with spaces on two sides of the module upper cover 21. The module lower cover 22 is provided with a second leakage hole 221, and the second leakage hole 221 communicates spaces on both sides of the module lower cover 22.

Referring to fig. 16 and 17, fig. 16 is a schematic structural view of the speaker module 2 shown in fig. 14 taken along D-D, and fig. 17 is a schematic structural view of the speaker module 2 shown in fig. 14 taken along E-E.

A first back cavity 212 is formed between the module upper cover 21 and the first diaphragm 121, a second back cavity 222 is formed between the module lower cover 22 and the second diaphragm 132, and the second back cavity 222 is communicated with the first back cavity 212. The second back cavity 222 and the first back cavity 212 are communicated with each other through a first communicating space 1171 and a second communicating space 1181. The first back cavity 212, the second back cavity 222, the first communicating space 1171 and the second communicating space 1181 are all part of the back cavity of the speaker module 2. In this embodiment, since the second back cavity 222 and the first back cavity 212 are communicated with each other, the first diaphragm 121 and the second diaphragm 132 share the back cavity, so as to reduce the requirement of the total space size of the back cavity of the speaker module 2, which is beneficial to the miniaturization of the speaker module 2.

The first leakage hole 211 communicates with the first back cavity 212, and the second leakage hole 221 communicates with the second back cavity 222. In some other embodiments, the speaker module 2 may omit one of the first leakage hole 211 or the second leakage hole 221.

In other embodiments, the second back cavity 222 and the first back cavity 212 may be isolated from each other. For example, the first frame portion 117 and the second frame portion 118 of the bracket 11 may be omitted, and the module upper cover 21 and the module lower cover 22 may be connected to the mounting frame portion 110 of the bracket 11.

Referring to fig. 18, fig. 18 is a schematic structural diagram of the speaker module 2 shown in fig. 14 as an external speaker 50 applied to the electronic device 100 shown in fig. 2. The electronic device 100 of the present embodiment may include some or all of the features of the electronic device 100 of the previous embodiment, and hereinafter, differences of the electronic device 100 of the present embodiment are mainly described.

The speaker module 2 is housed in the housing 10, and the module lower cover 22 is fixed to the housing 10. For example, the module lower cover 22 is fixed to the fixing portion 1012 of the middle frame 101 of the housing 10. The case 10 is provided with a communication hole 104, and the communication hole 104 communicates the sound emitting hole 115 to the external space of the electronic apparatus 100. In the present embodiment, since the overall loudness of the speaker 1 of the speaker module 2 is high, and the sound pressure level of the medium-high frequency is high, the volume of the played sound of the electronic device 100 using the speaker module 2 is high, and the sound quality is good.

In other embodiments, the speaker module 2 may also be fixed to the housing 10 through the module upper cover 21, or both the module upper cover 21 and the module lower cover 22 are fixed to the housing 10, and the application does not strictly limit the fixing manner of the speaker module 2 in the electronic device 100.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A loudspeaker is characterized by comprising a bracket, a first diaphragm, a first piezoelectric plate and a moving-coil loudspeaker inner core;

the periphery of the first vibrating diaphragm is fixed on the support, and the first piezoelectric sheet is fixed in the middle of the first vibrating diaphragm;

the moving-coil loudspeaker inner core is fixed on the support and is arranged at an interval with the first vibrating diaphragm, the moving-coil loudspeaker inner core comprises a second vibrating diaphragm, the second vibrating diaphragm is arranged facing the first vibrating diaphragm, the second vibrating diaphragm, the support and the first vibrating diaphragm jointly surround to form a front cavity, the support is provided with a sound outlet hole, and the sound outlet hole is communicated with the front cavity and the external space of the loudspeaker.

2. The loudspeaker of claim 1, wherein the support comprises a first support part and a second support part which are oppositely arranged, two sides of the periphery of the first diaphragm are respectively fixed on the first support part and the second support part, and the sound outlet is arranged on the first support part;

the second vibrating diaphragm comprises a vibrating part and a ball top part, and the ball top part is fixed in the middle of the vibrating part;

in the direction from the second supporting part to the first supporting part, the distance between the first diaphragm and the top of the ball increases progressively.

3. The loudspeaker of claim 2, wherein the area of the first diaphragm is greater than or equal to the area of the second diaphragm.

4. The loudspeaker of claim 3, wherein the bracket further comprises an installation portion, the installation portion is connected between the first supporting portion and the second supporting portion, the installation portion is provided with an installation hole, the moving-coil loudspeaker core is fixed to the installation portion, and the moving-coil loudspeaker core is partially or completely accommodated in the installation hole.

5. The speaker of claim 4, wherein the first supporting portion comprises a first sub-supporting portion and a second sub-supporting portion, the second sub-supporting portion is connected to the mounting portion, the first sub-supporting portion is connected to the second sub-supporting portion and the first diaphragm, and the first sub-supporting portion protrudes in a direction away from the second supporting portion relative to the second sub-supporting portion.

6. The loudspeaker according to any one of claims 2 to 5, wherein the bracket further comprises a third supporting portion and a fourth supporting portion which are oppositely arranged, the third supporting portion and the fourth supporting portion are connected between the first supporting portion and the second supporting portion, and the other two sides of the periphery of the first diaphragm are respectively fixed to the third supporting portion and the fourth supporting portion;

the support further comprises a first frame portion and a second frame portion, the first frame portion is located on one side, away from the fourth support portion, of the third support portion, two ends of the first frame portion are respectively connected with one end of the first support portion and one end of the second support portion, a first communication space is formed between the first frame portion and the third support portion, the second frame portion is located on one side, away from the third support portion, of the fourth support portion, two ends of the second frame portion are respectively connected with the other end of the first support portion and the other end of the second support portion, and a second communication space is formed between the second frame portion and the fourth support portion;

the surfaces of the first frame portion, the first supporting portion, the second supporting portion and the second frame portion, which are far away from the first diaphragm, are arranged in a coplanar manner.

7. The speaker according to any one of claims 1 to 5, further comprising a second piezoelectric sheet fixed to both side surfaces of the first diaphragm, respectively.

8. An electronic device comprising a housing and the speaker according to any one of claims 1 to 7, wherein the speaker is housed in the housing, and the bracket is fixedly attached to the housing, and the housing is provided with a communication hole that communicates the sound output hole with an external space of the electronic device.

9. The electronic device according to claim 8, wherein the housing includes a middle frame and a first cover fixed to one side of the middle frame, and the communication hole is provided in a rim portion of the middle frame and/or the first cover.

10. The electronic device of claim 9, wherein the housing further comprises a second cover plate fixed to a side of the middle frame away from the first cover plate;

the bracket is fixed on the middle frame, the first diaphragm is arranged facing the first cover plate, and the moving-coil loudspeaker inner core is positioned between the first diaphragm and the second cover plate;

a first back cavity is formed between the first diaphragm and the first cover plate, a second back cavity is formed between the second diaphragm and the second cover plate, and the second back cavity and the first back cavity are isolated from each other or communicated with each other.

11. The electronic device of claim 10, further comprising a first component partially or entirely located between the first diaphragm and the second cover plate.

12. A loudspeaker module, comprising a module upper cover, a module lower cover and a loudspeaker according to any one of claims 1 to 7, wherein the module upper cover is fixed to one side of the bracket on which the first diaphragm is mounted, and the module upper cover is fixed to the other side of the bracket;

a first back cavity is formed between the module upper cover and the first vibrating diaphragm, a second back cavity is formed between the module lower cover and the second vibrating diaphragm, and the second back cavity and the first back cavity are mutually isolated or mutually communicated.

13. An electronic device, comprising a housing and the speaker module of claim 12, wherein the speaker module is housed in the housing, the module upper cover and/or the module upper cover is fixedly connected to the housing, and the housing is provided with a communication hole which communicates the sound outlet hole with an external space of the electronic device.