CN113085107A - Film-coated packaging mold for thin array chip - Google Patents
Film-coated packaging mold for thin array chip Download PDFInfo
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- CN113085107A CN113085107A CN202110546927.5A CN202110546927A CN113085107A CN 113085107 A CN113085107 A CN 113085107A CN 202110546927 A CN202110546927 A CN 202110546927A CN 113085107 A CN113085107 A CN 113085107A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 238000001746 injection moulding Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 210000002489 tectorial membrane Anatomy 0.000 abstract description 9
- 239000012528 membrane Substances 0.000 abstract description 3
- 238000007666 vacuum forming Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 30
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000084 colloidal system Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 239000007888 film coating Substances 0.000 description 5
- 238000009501 film coating Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000009461 vacuum packaging Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2608—Mould seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention is used for the thin type array chip to cover the membrane type packaging mould to install on semiconductor packaging equipment, it includes: go up mould and bed die, it has the tectorial membrane to pull between last mould and bed die, goes up the mould and includes: the vacuum mould comprises an upper vacuum coaming, an upper mould frame, an upper padding plate, an upper supporting column, an upper mould cavity vacuum tube and an upper mould frame vacuum tube, wherein the upper mould cavity vacuum tube is introduced into the upper mould cavity; the lower die includes: the vacuum forming device comprises a lower die cavity, a machine tool ejector rod, a lower base plate, a lower vacuum surrounding plate, an ejector pin push plate, an ejector pin plate, a lower die frame, a lower die cavity vacuum tube, a lower forming insert and vacuum air guide needles, wherein the lower die cavity vacuum tube is introduced into the lower die cavity, a plurality of lower vacuum holes are formed in the upper end of the lower die cavity, the lower forming insert is arranged in the lower die cavity, the lower forming insert is fixed with a plurality of vacuum air guide needles, and the vacuum air guide needles are inserted into the plurality of lower vacuum holes.
Description
Technical Field
The invention relates to QFN and DFN packaging dies, in particular to a film-coated packaging die for a thin array chip.
Background
At present, QFN and DFN molds are widely applied to various large semiconductor packaging manufacturers, and products with the thickness of conventional QFN and DFN are mature and applied to semiconductor product packaging processes.
QFN packages (quad flat non-leaded packages), which are one of surface mount packages, currently belong to the packaging technology of medium and high grade products, and are applied to most electronic components. DFN packages are a latest electronic packaging technology, which uses advanced double-sided or square flat lead-free packages, are mainly applied to Printed Circuit Board (PCB) mounting pad, solder mask and stencil pattern design and assembly processes, and have better heat dissipation performance.
QFN and DFN products are the core of a plurality of industrial complete equipment and are generally applied to the core fields of computers, communication, consumer electronics, automobiles, industry/medical treatment, military affairs/government and the like. At present, semiconductors are mainly composed of four components: integrated circuits (about 81%), opto-electronic devices (about 10%), discrete devices (about 6%), sensors (about 3%). Among them, QFN and DFN series products have strong packaging applicability and the proportion is increased year by year. With the effective control of the domestic epidemic situation, the rework and production rate of semiconductor manufacturers is gradually improved, the state also issues related policies to support the development of the semiconductor industry, the domestic chip and related component manufacturers meet the verification window, and the domestic replacement process is expected to enter the acceleration period. In the long term, the Chinese semiconductor industry is expected to lead the world at an increasing speed all the year round.
The thickness of QFN and DFN with the conventional thickness is more than 0.5mm, such as QFN0.55, DFN0.55, QFN0.75, DFN0.75, QFN0.85, QFN0.9, QFN1.0 and the like, and the products with the conventional thickness can meet the requirements of a plurality of manufacturers on the market at present, but for products with the thickness of less than 0.5mm in QFN and DFN series, such as QFN0.45, QFN0.4, QFN0.37 and the like, few manufacturers can meet the requirements, and the thinner the colloid thickness is, the higher the requirement on molding parameters is. Because the thickness of the colloid is too thin, the product quality is not easy to guarantee, and the phenomena of underfilling, too high punching and bending of gold wires, product warping and deformation, glue overflow, product wire collapse and the like generally occur.
Disclosure of Invention
The invention aims to overcome the defects of the existing mold, and provides the film-coated type packaging mold for the thin array chip. Can be suitable for QFN and DFN series high-end products with the thickness of less than 0.5 mm. The demolding is smooth, the product is free from defects such as product defect, vacuum packaging, insufficient filling, wire punching and wire collapse of the product, and the quality of the product is improved.
In order to achieve the above purpose of the present application, the present application adopts the following technical solutions:
the invention relates to a film-coated packaging mold for a thin array chip, which is arranged on a semiconductor packaging device and comprises: go up mould and bed die, it has the tectorial membrane to pull between last mould and bed die, goes up the mould and includes: the upper die frame is arranged at the upper end of semiconductor packaging equipment, the upper vacuum surrounding plates are arranged on the periphery of the upper die frame, an upper backing plate, an upper support column and an upper die cavity are arranged in a space defined by the upper die frame and the upper vacuum surrounding plates, the upper backing plate is fixed on the upper die frame, and the upper end of the upper die cavity is fixed on the upper backing plate through a plurality of upper support columns; the lower die includes: the lower die cavity, a machine tool ejector rod, a lower backing plate, a lower vacuum coaming, an ejector pin push plate, an ejector pin plate and a lower die frame, wherein the lower die frame is arranged at the lower end of the semiconductor packaging equipment corresponding to the upper die frame, the lower vacuum coaming is arranged around the lower die frame, the lower die cavity, the lower backing plate, the ejector pin push plate and the ejector pin plate are arranged in a space enclosed by the lower die frame and the lower vacuum coaming, the lower backing plate is fixed on the lower die frame, the ejector pin plate and the ejector pin push plate are sequentially arranged on the lower backing plate from top to bottom through a plurality of second guide posts, the upper end of each second guide post is propped against the bottom of the lower die cavity, a plurality of ejector pins are arranged on the ejector pin plate, the upper ends of the ejector pins extend into the lower die cavity and are propped against the lower die cavity, the ejector pin plate and the ejector pin push plate are fixed together through a plurality of first guide posts, the injection molding hole is connected with the glue injection cylinder through a pipeline, wherein: the upper die further comprises: the vacuum tube of the upper die cavity is introduced into the upper die cavity, a plurality of upper vacuum holes are formed in the periphery of the lower end of the upper die cavity, the upper die vacuum tube vacuumizes the upper die cavity, so that the film is adsorbed on the upper die cavity, and the vacuum tube of the upper die frame is introduced into a space surrounded by the upper die frame and the upper vacuum enclosing plate so as to avoid bubbles generated by injection molding; the lower die further comprises: the vacuum tube of the lower die cavity is introduced into the lower die cavity, a plurality of lower vacuum holes are formed in the upper end of the lower die cavity, the lower forming insert is arranged in the lower die cavity, a plurality of vacuum gas guide needles are fixed on the lower forming insert and inserted into the lower vacuum holes, and the vacuum tube of the lower die cavity vacuumizes the lower die cavity so that the thin array chip is adsorbed on the lower die cavity.
The invention discloses a film-coated packaging mold for a thin array chip, wherein: the injection molding hole is formed in the center of the lower mold cavity, the two thin array chips are respectively placed on two sides of the injection molding hole, and a plurality of lower vacuum holes are respectively formed in the lower mold cavity where each thin array chip is placed.
The invention discloses a film-coated packaging mold for a thin array chip, wherein: two circles of vacuum holes are arranged on the periphery of the lower end of the upper die cavity, and two upper die cavity vacuum tubes are led into the upper die cavity.
The invention discloses a film-coated packaging mold for a thin array chip, wherein: the upper vacuum coaming is fixed on the upper die frame through a plurality of upper connecting pins.
The invention discloses a film-coated packaging mold for a thin array chip, wherein: the lower vacuum coaming is fixed on the lower die carrier through a plurality of lower connecting pins.
The invention discloses a film-coated packaging mold for a thin array chip, wherein: the lower end of the upper die cavity is provided with a convex upper positioning block, the upper end of the lower die shell is provided with a concave lower positioning block, and the upper positioning block is inserted into the lower positioning block during die assembly.
Compared with the existing mold, the film-coated packaging mold for the thin array chip has the following advantages:
1. the lower die is provided with a vacuum loop, the die surface of the lower die is provided with vacuum negative pressure adsorption holes, one vacuum loop is arranged below each lead frame and is independently controlled, and 2 pipe connection vacuum loops are arranged on 2 dies.
2. Go up the mould die face and set up vacuum circuit, guarantee that the tectorial membrane adsorbs at last mould die face all the time, and the membrane passes through the traction of rolling up membrane mechanism on the packaging system, and including the absorption of mould face vacuum negative pressure, the tectorial membrane can be guaranteed to level and smooth not have the fold at last mould face, guarantees that the product is pleasing to the eye. Because the die cavity is , the upper die cavity is not provided with a demoulding thimble, and the phenomena of thimble top cracking and defect of the product can not be generated.
3. The upper die cavity is arranged on the upper die frame, the lower die cavity is arranged on the lower die frame, and the central positions of the upper die cavity and the lower die cavity are ensured to be uniform through the fine positioning blocks on the die when the upper die cavity and the lower die cavity are closed. The outer sides of the formworks of the upper die frame and the lower die frame are provided with vacuum coamings, the upper die frame and the lower die frame are ensured to be in a closed environment when being closed by a high-temperature-resistant sealing ring arranged on the coamings, the upper die frame is externally connected with a vacuum pipeline, and the dies can be subjected to vacuum packaging during production. The phenomena of insufficient product injection and air hole and air bubble are reduced, and the product quality is improved.
4. The upper die is simple in structure and convenient to install, the die is different from QFN and DFN products with conventional thicknesses, the upper die can be used for cleaning stains on the surface of the die without using adhesive tapes, and production cost can be greatly reduced.
5. The invention adopts the upper die non-forming thimble to carry out film coating packaging, the film coating is arranged on the film coating mechanism of the system, each roll of film coating can be produced for dozens of times, and the film coating can be quickly replaced, and the production efficiency is high.
6. The multi-channel vacuum circuit is attached to the die, the lower die vacuum circuit can effectively adsorb the lead frame to ensure that the lead frame is smooth, the upper die vacuum circuit can effectively adsorb the coating film to ensure the appearance of the sealed product and the die opening separation of the product. The vacuum loop of the die carrier cavity can ensure that a product is injected in a vacuum environment, a chip has no wire collapse, no injection deficiency, no air hole and no bubble defect, and the quality of the product is improved.
Drawings
FIG. 1 is a semiconductor packaging apparatus equipped with a film covered packaging mold for thin array chips of the present invention;
fig. 2 is a schematic front cross-sectional view of a film-coated package mold for a thin array chip of the present invention in an open state, which shows features of the present invention as much as possible in the drawing for convenience, and thus its cross section is not cut from the center;
FIG. 3 is a bottom view of the upper mold cavity of FIG. 2 of the present invention;
FIG. 4 is a top view of the lower mold cavity of FIG. 2 of the present invention.
In fig. 1 to 4, reference numeral 1 denotes a coating film; the reference number 2 is an upper vacuum coaming; reference numeral 3 is an upper die carrier; reference numeral 4 is an upper backing plate; support columns are numbered 5; reference numeral 6 is an upper cavity; reference numeral 7 is an upper mold cavity vacuum tube; reference numeral 8 is an upper connecting pin; reference numeral 9 is an upper mold frame vacuum tube; reference numeral 10 is a lower mold cavity; reference numeral 11 is a first guide post; reference numeral 12 is a second guide post; reference numeral 13 is a vacuum gas guide needle; reference numeral 14 is a lower vacuum hole; reference numeral 15 denotes a thimble; reference numeral 16 is a vacuum tube of the lower die cavity; reference numeral 17 is a lower vacuum coaming; reference numeral 18 is a lower connecting pin; reference numeral 19 is an ejector plate; reference numeral 20 is a lower pad plate; the reference numeral 21 is a thimble push plate; reference numeral 22 is a machine tool ejector rod; reference numeral 23 is a lower mold frame; reference numeral 24 is an upper vacuum hole; reference numeral 25 is a thin array chip; reference numeral 26 is a lower mold insert; reference numeral 27 is an upper mold; reference numeral 28 is a lower mold; reference numeral 29 is an injection molding hole; reference numeral 30 is an upper positioning block; reference numeral 31 denotes a lower positioning block.
Detailed Description
As shown in fig. 1, the film-coated packaging mold for thin array chips of the present invention is mounted on a semiconductor packaging apparatus, and comprises: an upper die 27 and a lower die 28, and the coating film 1 is drawn between the upper die 27 and the lower die 28.
As shown in fig. 2 and 3, the upper mold 27 includes: an upper vacuum coaming plate 2, an upper die frame 3, an upper padding plate 4, upper supporting columns 5, an upper die cavity 6, upper die cavity vacuum tubes 7 and upper die frame vacuum tubes 9, wherein the upper die frame 3 is arranged at the upper end of the semiconductor packaging equipment, the upper vacuum coaming plate 2 is arranged around the upper die frame 3, the upper vacuum coaming plate 2 is fixed on the upper die frame 3 through a plurality of upper connecting pins 8, the upper padding plate 4, the upper supporting columns 5 and the upper die cavity 6 are arranged in a space enclosed by the upper die frame 3 and the upper vacuum coaming plate 2, the upper padding plate 4 is fixed on the upper die frame 3, the upper end of the upper die cavity 6 is fixed on the upper padding plate 4 through a plurality of upper supporting columns 5, the upper die cavity vacuum tubes 7 are led into the upper die cavity 6, two circles of vacuum holes 24 are arranged around the lower end of the upper die cavity 6, the two upper die cavity vacuum tubes 7 are led into the, the upper die frame vacuum tube 9 is introduced into a space enclosed by the upper die frame 3 and the upper vacuum coaming 2 so as to avoid bubbles generated by injection molding.
As shown in fig. 2 and 4, the lower mold 28 includes: a lower die cavity 10, a machine tool ejector rod 22, a lower cushion plate 20, a lower vacuum coaming 17, an ejector pin push plate 21, an ejector pin plate 19, a lower die carrier 23, a lower die cavity vacuum tube 16, a lower forming insert 26 and a vacuum air guide pin 13, wherein the lower die carrier 23 is arranged at the lower end of the semiconductor packaging equipment corresponding to the upper die carrier 4, the lower vacuum coaming 17 is arranged at the periphery of the lower die carrier 23, the lower vacuum coaming 17 is fixed on the lower die carrier 23 through a plurality of lower connecting pins 18, a lower die cavity 10, a lower cushion plate 20, an ejector pin push plate 21 and an ejector pin plate 19 are arranged in a space enclosed by the lower die carrier 23 and the lower vacuum coaming 17, the lower die cavity 20 is fixed on the lower die carrier 23, the ejector pin plate 19 and the ejector pin push plate 21 sequentially pass through a plurality of second guide posts 12 from top to bottom and are arranged on the lower cushion plate 20, the upper ends of the second guide posts 12 are pushed at the bottom of the lower die cavity 10, the lower die cavity 10 is propped against the lower die cavity 10, the ejector plate 19 and the ejector push plate 21 are fixed together through a plurality of first guide posts 11, a machine tool ejector rod 22 sequentially penetrates through a lower die frame 23 and a lower backing plate 20 and is propped against the ejector push plate 21, a plurality of injection molding holes 29 are formed in the upper end of the lower die cavity 10, the injection molding holes 29 are formed in the center of the lower die cavity 10, the injection molding holes 29 are connected with a glue injection cylinder (not shown in the drawing) through pipelines, a lower die cavity vacuum tube 16 is led into the lower die cavity 10, two thin array chips 25 are respectively placed on two sides of the injection molding holes 29, a plurality of lower vacuum holes 14 are respectively formed in the lower die cavity 10 where each thin array chip 25 is placed, a lower molding insert 26 is arranged in the lower die cavity 10, a plurality of vacuum air guide pins 13 are fixed on the lower molding insert 26, the vacuum guide pins 13 are inserted into the plurality of lower vacuum holes 14, the lower die cavity vacuum tube 16 vacuumizes the lower die, the vacuum gas sucks the thin array chip 25 through the annular gap between the lower vacuum hole 14 and the vacuum gas guide pin 13, so that the thin array chip 25 is sucked on the lower cavity 10.
As shown in fig. 2, a protruding upper positioning block 30 is provided at the lower end of the upper cavity 6, and a recessed lower positioning block 31 is provided at the upper end of the lower mold shell 10, so that the upper positioning block 30 is inserted into the lower positioning block 31 during mold closing.
The specific action flow is as follows: the unpackaged lead frames are loaded onto the mold surface of the lower mold cavity 10 by a robot, 2 lead frames are loaded at the same time, and the thin array chips 25 are placed on the lead frames. The lead frame is guided by the positioning pins of the die surface of the lower die cavity 10 and falls into the corresponding position of the die surface. And starting a vacuum pump, ventilating a vacuum pipeline of the lower die cavity 10 to generate negative pressure, so that the lead frame can be tightly adsorbed on the die surface of the lower die cavity 10, the lead frame cannot be warped during packaging, and the phenomena of wire punching and wire collapsing are avoided. And meanwhile, the vacuum pipeline of the die surface of the upper die cavity 6 is ventilated, so that the film 1 is tightly adsorbed on the die surface of the upper die cavity 6. And then the automatic packaging system puts the resin cake into a glue injection cylinder of the lower die, the system is actuated by a servo motor, a lower platen of a press rises, the upper die and the lower die are assembled, and the center is ensured to be uniform by vertically guiding and positioning through a positioning block in the die. Before the upper die and the lower die are in matched die contact, vacuum coamings of the die carrier are contacted first, when the pressure of a press reaches 3 tons, a vacuum tube 9 of a cavity of the upper die carrier works, the whole upper die and the lower die are guaranteed to finish colloid injection molding under a vacuum environment, and therefore the phenomena of insufficient injection, air holes and air bubbles of a product are avoided. When the lower table surface of the press continues to rise and the mold closing pressure reaches a system set value, the system servo drives the injection mechanism of the mold to complete resin injection molding, and the resin is in a molten state during resin injection molding because the mold is used in an environment of about 180 ℃. The molten resin is pushed by the injection mechanism, the resin flows into the cavity of the upper die, and the coating film 1 is deformed by the resin injection pressure to form the product appearance state. And (3) maintaining the pressure of the resin in the injection state for about 100 seconds, and curing and molding the epoxy resin to finish the encapsulation protection of the chip on the lead frame. After the molding and curing time is up, the table surface of the press can descend, and the mold is opened. Because the last mould colloid is thinner, the tectorial membrane produces pulling force colloid separation because the traction of the tectorial membrane mechanism of system, and after the die sinking, the colloid of encapsulating can stop on the die surface of lower mould chamber 10, then packaging system can take away through the manipulator, goes the cull and feeds. Seal the product of completion and take away the back away, the system can clean the die face, and tectorial membrane mechanism can pull tectorial membrane 1 and move a diaphragm capsule length forward again, uses the tectorial membrane of deformation can pull the collection, and the mechanism carries out next round of encapsulation once more and prepares, and so circulation is reciprocal, equipment program control automatic production, and production efficiency is high.
The upper and lower dies move up and down through the lower platen of the press, so as to ensure the die closing and opening actions of the dies. A layer of high-temperature resistant coating is arranged between the upper die box and the lower die box, and the coating is drawn by a coating rolling mechanism of the packaging system and continuously moves from the back of the system to the front of the operation. The film covering is mainly drawn by a film rolling mechanism of the packaging system and absorbed by the vacuum negative pressure of the upper die cavity, so that the film is always attached to the die surface of the upper die cavity 6 with the cavity depth. And when the die is opened and closed once, the film covering 1 moves forwards for a die shell length, and the process is circulated and is continuously produced. During production, the lead frame is placed on the die surface of the lower die cavity 10, and the locating pins on the die surface and the locating holes on the lead frame guarantee the placing position. The upper die cavity 6 is a cavity with a groove and is the appearance of a product after a frame is encapsulated, the depth of the cavity is shallow, the depth does not exceed 0.4mm, the depth of individual varieties is only about 0.2mm, a demoulding thimble is not arranged in the cavity, and the product is easy to crack, delaminate and the like to be scrapped. Unlike traditional QFN and DFN products, the glue is thick and has reliable strength, and the ejector pins can be arranged in the cavity to ensure smooth demoulding of the product during mould opening.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (6)
1. A film-coated packaging mold for a thin array chip, which is mounted on a semiconductor packaging device, comprises: an upper die (27) and a lower die (28), a coating film (1) being drawn between the upper die (27) and the lower die (28), the upper die (27) including: the upper die frame (3) is arranged at the upper end of semiconductor packaging equipment, the upper vacuum surrounding plate (2) is arranged around the upper die frame (3), the upper backing plate (4), the upper support column (5) and the upper die cavity (6) are arranged in a space surrounded by the upper die frame (3) and the upper vacuum surrounding plate (2), the upper backing plate (4), the upper support column (5) and the upper die cavity (6) are arranged in the space, the upper backing plate (4) is fixed on the upper die frame (3), and the upper end of the upper die cavity (6) is fixed on the upper backing plate (4) through a plurality of upper support columns (5); the lower mold (28) includes: the lower die cavity (10), a machine tool ejector rod (22), a lower backing plate (20), a lower vacuum coaming (17), an ejector pin push plate (21), an ejector pin plate (19) and a lower die frame (23), wherein the lower die frame (23) is arranged at the lower end of the semiconductor packaging equipment corresponding to the upper die frame (4), the lower vacuum coaming (17) is arranged around the lower die frame (23), a lower die cavity (10), the lower backing plate (20), the ejector pin push plate (21) and the ejector pin plate (19) are arranged in a space enclosed by the lower die frame (23) and the lower vacuum coaming (17), the lower backing plate (20) is fixed on the lower die frame (23), the ejector pin plate (19) and the ejector pin push plate (21) sequentially pass through a plurality of second guide pillars (12) from top to bottom and are arranged on the lower backing plate (20), the upper ends of the second guide pillars (12) are ejected at the bottom of the lower die cavity (10), a plurality of ejector pins (15) are arranged on the ejector pin plate (19), and the upper ends, the top is on die cavity (10) down, is in the same place through the first guide pillar of a plurality of (11) is fixed between die cavity (10) down, thimble board (19) and thimble push pedal (21), and die carrier (23) and lower bolster (20) are passed in proper order in lathe knock-out lever (22), and the top is on thimble push pedal (21), and it has a plurality of injection molding hole (29) to mould plastics hole (29) and links to each other its characterized in that through the pipeline to open in the upper end of die cavity (10) down: the upper mold (27) further comprises: the upper mold cavity vacuum pipe (7) is communicated with the upper mold cavity (6), a plurality of upper vacuum holes (24) are formed in the periphery of the lower end of the upper mold cavity (6), the upper mold cavity vacuum pipe (7) vacuumizes the upper mold cavity (6) to enable the coating film (1) to be adsorbed on the upper mold cavity (6), and the upper mold cavity vacuum pipe (9) is communicated with a space defined by the upper mold frame (3) and the upper vacuum enclosing plate (2) to avoid bubbles generated by injection molding; the lower mold (28) further comprises: the die comprises a lower die cavity vacuum tube (16), a lower forming insert (26) and vacuum air guide needles (13), wherein the lower die cavity vacuum tube (16) is introduced into the lower die cavity (10), a plurality of lower vacuum holes (14) are formed in the upper end of the lower die cavity (10), the lower forming insert (26) is arranged in the lower die cavity (10), the lower forming insert (26) is fixedly provided with the vacuum air guide needles (13), the vacuum air guide needles (13) are inserted into the lower vacuum holes (14), and the lower die cavity vacuum tube (16) vacuumizes the lower die cavity (10) so that the thin array chip (25) is adsorbed on the lower die cavity (10).
2. The film covered packaging mold for thin array chips of claim 1, wherein: the injection molding hole (29) is formed in the center of the lower mold cavity (10), the two thin array chips (25) are respectively placed on two sides of the injection molding hole (29), and a plurality of lower vacuum holes (14) are respectively formed in the lower mold cavity (10) where each thin array chip (25) is placed.
3. The film covered packaging mold for thin array chips of claim 2, wherein: two circles of vacuum holes (24) are arranged on the periphery of the lower end of the upper die cavity (6), and two upper die cavity vacuum tubes (7) are introduced into the upper die cavity (6).
4. A film covered packaging mold for thin array chips as claimed in claim 3, wherein: the upper vacuum coaming (2) is fixed on the upper die frame (3) through a plurality of upper connecting pins (8).
5. A film covered packaging mold for thin array chips as claimed in claim 3, wherein: the lower vacuum coaming (17) is fixed on the lower die carrier (23) through a plurality of lower connecting pins (18).
6. A film covered packaging mold for thin array chips according to claim 4 or 5, wherein: a convex upper positioning block (30) is arranged at the lower end of the upper die cavity (6), a concave lower positioning block (31) is arranged at the upper end of the lower die shell (10), and the upper positioning block (30) is inserted into the lower positioning block (31) during die assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110546927.5A CN113085107A (en) | 2021-05-19 | 2021-05-19 | Film-coated packaging mold for thin array chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110546927.5A CN113085107A (en) | 2021-05-19 | 2021-05-19 | Film-coated packaging mold for thin array chip |
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| Publication Number | Publication Date |
|---|---|
| CN113085107A true CN113085107A (en) | 2021-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110546927.5A Pending CN113085107A (en) | 2021-05-19 | 2021-05-19 | Film-coated packaging mold for thin array chip |
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| CN114851447A (en) * | 2022-05-11 | 2022-08-05 | 安徽耐科装备科技股份有限公司 | Encapsulation laminating equipment |
| CN115332095A (en) * | 2022-10-12 | 2022-11-11 | 安徽大华半导体科技有限公司 | QFN large substrate packaging mold and method |
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