CN113059248B - Welding observation simulation device and method with 3D vision measuring instrument and welding device - Google Patents
Welding observation simulation device and method with 3D vision measuring instrument and welding device Download PDFInfo
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- CN113059248B CN113059248B CN202110444140.8A CN202110444140A CN113059248B CN 113059248 B CN113059248 B CN 113059248B CN 202110444140 A CN202110444140 A CN 202110444140A CN 113059248 B CN113059248 B CN 113059248B
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- 238000003466 welding Methods 0.000 title claims abstract description 293
- 238000004088 simulation Methods 0.000 title claims abstract description 141
- 238000000034 method Methods 0.000 title claims abstract description 83
- 238000005259 measurement Methods 0.000 claims abstract description 58
- 238000001514 detection method Methods 0.000 claims abstract description 24
- 238000005476 soldering Methods 0.000 claims description 31
- 238000003384 imaging method Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 230000000007 visual effect Effects 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 11
- 239000001301 oxygen Substances 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000010992 reflux Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000013070 change management Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The welding observation simulation device with the 3D vision measuring instrument comprises a main controller, a temperature detection device, a temperature control device and the 3D vision measuring instrument; the temperature field information acquired by the temperature detection device comprises temperature information of each welding point and each component of the target electronic circuit board card; the main controller receives a temperature control instruction and controls the temperature control device to adjust the temperature in the welding observation simulation device; and the 3D vision measuring instrument acquires a 3D measurement image of the target electronic circuit board card in the welding observation simulation device in the welding process. Acquiring size change information of the electronic circuit board card in the welding process according to the 3D measurement image; and the temperature field change curve in the welding observation simulation device is adjusted according to the size change, so that the temperature field change curve is adjusted to a state suitable for welding. The welding efficiency and quality of the new trial-manufacture electronic circuit board card are greatly improved, and the welding method is particularly suitable for welding small-scale customized electronic circuit board cards.
Description
Technical Field
The invention relates to the field of electronic circuit board card welding equipment, in particular to a welding observation simulation device and method and an SMT reflow welding device provided with the welding observation simulation device.
Background
SMT (surface mount technology) is a modern process technology widely used in microelectronic and semiconductor packaging, where circuit boards are printed with solder paste, surface mounted and hot air reflow soldered to circuit boards, or other oven heated to solder components to pads on the circuit boards.
SMT reflow soldering apparatuses in the prior art generally focus mainly on controlling the temperature of each zone. Because the bonding pad and the components are heated by hot air in the reflow process, the temperature rising process is influenced by a plurality of factors such as reflow soldering performance, component size, bonding pad and circuit board materials, so that a first-line process engineer can only set the temperatures of upper and lower temperature areas of reflow soldering according to the requirements of the temperature reflow curve of the solder paste, determine the specific temperature reflow curve of a certain circuit board for the solder paste through the technical means such as multiple test boards, functional test of the circuit board and the like, and correspond to the actual temperature change curve of specific welding spots and components on each circuit board in the reflow process, namely a black box in the SMT process, and the black box is the blind spot of the first-line engineer in the SMT industry. Particularly, the SMT technology of circuit boards cannot be efficiently used for small-batch and multi-variety circuit boards in the 5G and AI ages.
Therefore, it is particularly important to accurately measure the temperature change of the solder joint and the component on the circuit board in the reflow process, and in the patent application with the application number CN2O12748975.9 and the application name of reflow soldering machine and temperature measuring system thereof, a method for testing the actual temperature of the reflow element is provided, but the temperature change of the component on the circuit board is simply recorded, and the simulation function corresponding to the industrial reflow soldering process is not provided.
Aiming at the pain point of the SMT industry, the application discloses an observation simulation device and an SMT reflow soldering simulation method for the SMT reflow process, and provides an innovative method and tool for the precision and the high efficiency of the SMT industry in China. The application provides a welding observation simulation device, which firstly provides a prior simulation for the SMT reflow soldering process so as to try to obtain an optimal reflow soldering temperature curve suitable for a target electronic circuit board card; and acquiring state information of the target electronic circuit board card by means of various equipment, and integrating the state information and the temperature information to output a proper reflow soldering temperature curve.
In the prior art, some SMT welding devices are also provided with some observation devices, such as a high-speed camera device, to acquire images during welding; but these images are of insufficient quality for monitoring dimensional changes of the target electronic circuit board, especially local solder joints and state changes of components.
In the prior art, for example, a high-speed camera device acquires an image in a welding process, and the state change of an electronic circuit board in the welding process can be known only by manual intervention observation and analysis usually in the welding process or after the welding is completed. The temperature regulation and control inside the welding observation simulation device cannot be carried out in real time through the image data; therefore, when a new electronic circuit board card is soldered, the soldering observation process is often repeated for a plurality of times to obtain the ideal temperature control curve of the soldering observation simulation device. The welding observation process has longer process time and lower production efficiency in the welding trial production of the new electronic circuit board card. For the production of large-volume electronic circuit board cards, such adjustments are time and cost tolerant prior to mass production. However, the production efficiency and cost of the prior art clearly do not meet the manufacturing requirements of personalized small-lot, high-quality, low-cost customized electronic circuit board cards.
Disclosure of Invention
The invention aims to solve the technical problems of avoiding the defects of the prior art in personalized small-batch high-quality low-cost customized electronic circuit board card manufacturing, and provides a welding observation simulation device, a welding observation simulation method and an SMT reflow soldering device which can monitor the welding state, comprehensively grasp temperature field information and size information in the welding process, comprehensively analyze and utilize the information, directly complete the welding temperature closed-loop adjustment process, greatly improve the production efficiency of the electronic circuit board card and save the cost of the electronic circuit board card trial manufacturing.
The technical scheme for solving the technical problems is that the welding observation simulation device comprises a main controller, a temperature detection device, a temperature control device and a 3D vision measuring instrument; the temperature detection device, the temperature control device, the 3D vision measuring instrument and the high-speed camera device are respectively connected with the main controller through electrical signals and controlled by the main controller; the temperature detection device is used for acquiring temperature field information in the welding observation simulation device, wherein the temperature field information comprises temperature information of each welding point and each component of the target electronic circuit board card; the temperature control device is used for controlling the temperature in the welding observation simulation device; the main controller receives the temperature control instruction and controls the temperature control device to adjust the temperature in the welding observation simulation device according to the temperature control instruction; the 3D vision measuring instrument is used for acquiring a 3D measurement image of the target electronic circuit board card in the welding observation simulation device in the welding process.
The 3D vision measuring instrument acquires a 3D measurement image of the target electronic circuit board card, so that the state information of the target electronic circuit board card is more accurate, and the state change of each welding spot and each component in the welding process can be observed in detail; the information of the same temperature field can be comprehensively obtained, and the temperature of each welding spot and the position of each component is finely reached; the acquisition of the image information and the temperature information provides a basis for accurately positioning the relationship between the state and the temperature of each welding spot and each component.
The 3D vision measuring instrument continuously or periodically detects and acquires 3D measuring images of the target electronic circuit board card in the welding process; the main controller obtains 3D measurement images of the target electronic circuit board card at a plurality of moments according to the 3D vision measuring instrument; calculating the dimensional change information of the target electronic circuit board; and outputting the dimensional change information of the target electronic circuit board; the dimension change information of the target electronic circuit board comprises dimension change information of each welding spot and each component on the target electronic circuit board.
Continuously or periodically acquired 3D measurement images of the target electronic circuit board card provide 3D measurement images at different time points. The state change of each welding spot and each component on the target electronic circuit board card after a period of time can be obtained through 3D measurement image information at different time points. Some of these variations are not only visible to the naked eye, but provide material for human participation in the analysis. Some changes can also be calculated digitally through a master controller or other computers to obtain more accurate size change information data. The size change information data comprises volume change information and area change information of welding spots or position state information of components; the information data corresponds to specific state changes of the welding spot and the component during welding and melting, and the state changes are usually caused by temperature effects. Therefore, when abnormality occurs in the dimensional change information data, such as a change in a certain dimensional data exceeding a threshold value within a set time, abnormality in temperature management in the welding device is often associated. These data provide accurate data bases for subsequent temperature adjustments.
The 3D measurement image of the target electronic circuit board card obtained by the 3D vision measuring instrument comprises size information of the target electronic circuit board card in three axial directions of space; the dimensional change information of the target electronic circuit board comprises dimensional change information of three axial directions of space; the accuracy range of the size in the 3D measurement image obtained by the 3D vision measuring instrument is 1-20 micrometers.
The dimensional information in the three-axis direction of the space can more comprehensively acquire the state information of welding spots and components on the target electronic circuit board card in each space dimension; the accuracy of the dimensions in the 3D measurement image ranges from 1 micron to 20 microns, meaning that micron-scale viewing and fine adjustment can be performed.
The 3D measurement image acquired by the 3D vision measurement instrument has 3D feature data, so that a subsequent master controller or other electronic computing device can acquire feature changes on the target electronic circuit board by using the 3D vision measurement feature data. These feature variations include variations in the overall three-dimensional dimensions of the target electronic circuit board card; the three-dimensional size of each component on the target electronic circuit board changes; the size of each solder joint on the target electronic circuit board varies. The overall three-dimensional size of the target electronic circuit board card is changed; the three-dimensional size change of each component on the target electronic circuit board card can acquire the influence of the welding temperature on the board card and each component; the change in the size of each solder joint can be known as a change in the solder during the soldering process, including the molten state of the solder.
Three-dimensional change information can be accurate to dimensional measurements in various dimensions. Accordingly, dimensional change control and temperature change control can be performed in different spatial dimensions. The dimensional change can be managed more stereoscopically by temperature management.
The main controller performs matching operation of the 3D measurement image of the target electronic circuit board card and the temperature field information according to the received 3D measurement image of the target electronic circuit board card or the dimensional change information of the target electronic circuit board card and the temperature field information in the welding observation simulation device; when the size change of the target electronic circuit board card is larger than the set welding size change threshold, the main controller calculates and obtains the target regulation and control temperature of the temperature field, and outputs a temperature regulation control instruction to the temperature control device, and the temperature control device regulates the temperature in the welding observation simulation device to reach the target regulation and control temperature of the temperature field.
The temperature field information is combined with the size change information, the main controller can perform temperature adjustment in a real-time closed loop manner, and the real-time temperature adjustment enables the size change management to be performed in time; the efficiency of the welding observation simulation device in the trial production process can be greatly improved. The method does not need to manually intervene and identify the state change information of the target electronic circuit board card at different temperatures like the prior art, and does not need to manually set the target regulation and control temperature like the prior art. In the application, the welding observation simulation apparatus can automatically adjust the temperature through the existing welding model. Or establishing a welding model related to the dimensional change and the temperature field information through record matching of the dimensional change and the temperature field information in the temperature adjustment process, and managing the temperature and the dimensional change by using the welding model related to the dimensional change and the temperature field information in the subsequent welding process.
The welding observation simulation device further comprises a high-speed camera device, wherein the high-speed camera device is used for acquiring external visual images of the target electronic circuit board card in the welding observation simulation device in the welding process; the external visual image information of the target electronic circuit board comprises images of all welding spots and all components on the target electronic circuit board; the high-speed camera device is used for continuously acquiring external visual images of the target electronic circuit board card in the welding process; the main controller obtains external visual images of all welding spots and all components of the target electronic circuit board card at a plurality of moments according to the high-speed camera device; the 3D vision measuring instrument measures and calculates the size change and the area change of each welding spot of the target electronic circuit board card, and calculates the size change and the state change of each component of the target electronic circuit board card.
The external visual image data acquired by the high-speed camera and the 3D measurement image data acquired by the 3D visual measuring instrument are mutually complemented. The 3D measurement image data, namely the three-dimensional image data and the two-dimensional image data are mutually complemented, so that more accurate and complete state information of the target electronic circuit board, such as the molten state of welding spots, whether each component has tilting, standing and the deformation condition of the whole or part of the board card, can be obtained. In the same system, the image data have definite time corresponding relation, and other image data at the current moment can be called and analyzed at any time to mutually verify the state when necessary, so that the judgment accuracy is ensured. When necessary, this data can be stored in a database for use in subsequent modeling of the soldering process of the target electronic circuit board.
The temperature measuring range of the temperature detecting device is 25-350 ℃; the accuracy range of the temperature measurement is plus or minus 2 degrees celsius. The temperature measurement range and the measurement accuracy can be adjusted according to different welding forms and the welding requirements of the target circuit board, and the description is omitted here.
The temperature control device comprises a temperature-adjustable hot air generator, a hot air channel and a hot air reflux channel; the temperature-adjustable hot air generator is connected with the main controller by an electric signal and is controlled by the main controller; one end of the hot air channel is communicated with the internal space of the welding observation simulation device, and the other end of the hot air channel is communicated with the temperature-adjustable hot air generator; the temperature-adjustable hot air generator outputs temperature-adjustable hot air, the hot air enters the welding observation simulation device through the hot air channel, and the hot air flows out of the welding observation simulation device and enters the temperature-adjustable hot air generator through the hot air return channel.
The temperature-adjustable hot air generator adopts nitrogen or air as an air source; and a micro oxygen analyzer is arranged on the hot air channel and/or the hot air reflux channel and is used for monitoring the oxygen content of the gas in the hot air channel and/or the hot air reflux channel. The detection of the oxygen content can better know the influence degree of the oxygen concentration in the welding environment on welding in the welding process, so that the oxygen content can be adjusted in real time, and the welding can reach a desired state. Of course, pure nitrogen or vacuum can be adopted as a welding background in ideal conditions, so that oxygen content detection is not needed; however, in the case of using air as a welding background, the detection of the oxygen concentration is of practical significance, and the efficiency of the welding process can be improved.
The welding observation simulation device with the 3D vision measuring instrument is a vacuum welding observation simulation device; the vacuum welding observation simulation device further comprises a vacuumizing channel and a vacuum pump; the vacuum pump is used for pumping the internal space of the welding observation simulation device into a negative pressure vacuum state; one end of the vacuumizing channel is communicated with the internal space of the welding observation simulation device, and the other end of the vacuumizing channel is communicated with the air extraction end of the vacuum pump.
The welding observation simulation device with the 3D vision measuring instrument is a laser welding observation simulation device; a removable board card moving platform is arranged in the internal space of the welding observation simulation device and is used for moving the position of the target electronic circuit board in the welding process; after the target electronic circuit board card is installed on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively. The target electronic circuit board can follow the size range (200 mm, 200 mm and 150 mm respectively) of the board moving platform along three mutually perpendicular directions.
The welding observation simulation device with the 3D vision measuring instrument further comprises an X-ray imaging device; the X-ray imaging device is in electrical signal connection with the main controller and is controlled by the main controller; the X-ray imaging device is used for acquiring an internal image of the target electronic circuit board card in the welding process; the internal image of the target electronic circuit board card comprises internal images of all welding spots and all components on the target electronic circuit board card; a removable board card moving platform is arranged in a welding space where the target electronic circuit board card is positioned; after the target electronic circuit board card is arranged on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively; the target electronic circuit board card can move the target electronic circuit board card, so that a target welding spot on the target electronic circuit board card enters an observation area of the X-ray imaging device.
The X-ray imaging device is used for continuously or periodically acquiring internal images of all welding spots and all components on the target electronic circuit board card in the welding process; and the main controller acquires bubble state information of each welding point and each component of the target electronic circuit board card according to the internal image of each welding point and each component of the target electronic circuit board card and/or the size change information of each welding point and each component of the target electronic circuit board card. The X-ray imaging device can acquire image information of each welding point and each component of the target electronic circuit board card, and can very accurately position whether the size change of each welding point and each component on the target electronic circuit board card generates bubbles inside or only changes the external size by combining the image characteristics of each welding point and each component outside the target electronic circuit board card. This can also be used to evaluate the performance of the welding material during the welding process.
The welding observation simulation device with the 3D vision measuring instrument is further provided with a display and a database; the database is in electrical signal connection with the main controller and is used for storing the received 3D measurement image data of the target electronic circuit board card, the size data of the target electronic circuit board card and the temperature field information data; the display is used for displaying the 3D measurement image data and the temperature field information data.
The welding observation simulation device with the 3D vision measuring instrument further comprises a box body; the main controller is arranged outside the box body; the temperature sensors in the temperature detection device are distributed in the box body, or the temperature sensors in the temperature detection device are arranged at the top of the box body; the 3D vision measuring instrument and the high-speed camera device are arranged on the inner wall of the box body facing the target electronic circuit board card.
The technical scheme for solving the technical problems can also be a welding observation simulation method, which is based on the welding observation simulation device and comprises the following steps: step 1: in the welding process of the target electronic circuit board card, acquiring temperature field information in a welding observation simulation device, and acquiring temperature information of each welding point and each component of the target electronic circuit board card; step 2: continuously or periodically acquiring 3D measurement images of a target electronic circuit board card in a welding observation simulation device in a welding process by using a 3D vision measuring instrument; step 3: the main controller calculates the size change information of the target electronic circuit board card in the welding process according to the 3D measurement images of the target electronic circuit board card at a plurality of moments acquired by the 3D vision measuring instrument; the dimension change information of the target electronic circuit board comprises dimension change information of each welding point and each component on the target electronic circuit board; step 4: the main controller judges whether the size change of any appointed welding point and/or each component on the target electronic circuit board exceeds a set threshold value, if the size change of any appointed welding point and/or each component on the target electronic circuit board exceeds the set threshold value, a temperature adjusting control instruction is output, the temperature control device executes the temperature adjusting control instruction, and the temperature in the welding observation simulation device is adjusted until the size change of any appointed welding point and each component on the target electronic circuit board is within the set threshold value range, and the temperature at the moment is the target temperature.
The welding observation simulation method further comprises the following step 5: and (3) recording the target temperature data obtained in the step (4) and outputting a reflow soldering target temperature curve.
The technical scheme for solving the technical problems can also be a welding device which is an SMT reflow soldering device and comprises the soldering observation simulation device.
Compared with the prior art, the application has the beneficial effects that: by introducing the 3D vision measuring instrument, the temperature detection device and the temperature control device, the size change information of the electronic circuit board card and the temperature field change information of each welding spot and each component in detail in the welding process can be completely acquired; and the temperature field in the welding observation simulation device can be adjusted according to the detail of the dimensional change of the electronic circuit board card, so that the temperature field is adjusted to a state suitable for welding. The size change detection process and the temperature field regulation process of the electronic circuit board card are automated, so that the efficiency of trial-manufacturing a new electronic circuit board card is greatly improved, and the method is particularly suitable for welding small-batch customized electronic circuit board cards.
Drawings
FIG. 1 is a schematic block diagram of a first preferred embodiment of a welding observation simulation apparatus with a 3D vision meter;
FIG. 2 is a schematic block diagram of a second preferred embodiment of a welding observation simulation apparatus with a 3D vision meter;
FIG. 3 is a schematic block diagram of a third preferred embodiment of a welding observation simulation apparatus with a 3D vision meter;
fig. 4 is a schematic block diagram of a top surface of a case of the welding observation simulator.
Detailed Description
The present application is described in further detail below with reference to the accompanying drawings.
In the embodiment of the welding observation simulation apparatus shown in fig. 1, the controller is the main controller. Letter a in fig. 1 indicates a side high-speed camera provided on a side wall 121 of the case 100; letter F indicates a vertical high-speed camera, which is disposed on an inner wall of the top surface 110 of the case 100, and the top surface 110 may be made of a transparent material such as glass, or may be made of a non-transparent material. The black dots near the letters in the figure indicate that such devices are generally mounted at corresponding positions in the case of the welding observation simulation device so as to be able to conveniently acquire various kinds of observation information in the case.
In the welding observation simulation apparatus embodiment shown in fig. 1, the letter D denotes a 3D vision measurement scanner, i.e., a 3D vision measurement instrument, provided on the top surface 110 of the case 100; the 3D vision measurement scanner may be embedded in the top surface 110 or may be disposed above the top surface 110. And 3D vision measurement scanning signals obtained by the 3D vision measurement scanner are transmitted to a main controller in a computer, and 3D measurement image information is displayed through a display. The 3D vision measurement scanning signal obtained by the 3D vision measuring instrument is a 3D measurement image signal of a target electronic circuit board card in a welding observation simulation device in the welding process.
In the embodiment of the welding observation simulation apparatus shown in fig. 1, a 3D vision measuring instrument continuously or periodically detects and acquires 3D measurement images of a target electronic circuit board card in the welding process; the main controller obtains 3D measurement images of the target electronic circuit board card at a plurality of moments according to the 3D vision measuring instrument; calculating the dimensional change information of the target electronic circuit board; and outputting the dimensional change information of the target electronic circuit board; the dimension change information of the target electronic circuit board comprises dimension change information of each welding spot and each component on the target electronic circuit board. The 3D measurement image of the target electronic circuit board card obtained by the 3D vision measuring instrument comprises the dimension of the target electronic circuit board card in the three-axis direction of the space; the dimensional change information comprises dimensional change information in three spatial axis directions; the accuracy range of the size in the 3D measurement image obtained by the 3D vision measuring instrument is 1-20 micrometers.
In the embodiment of the welding observation simulation apparatus shown in fig. 1, the temperature detection apparatus includes a thermometer, and the temperature measurement range is 25 degrees celsius to 350 degrees celsius; the accuracy range of the temperature measurement is plus or minus 2 degrees celsius. In fig. 1, the letter B denotes a hot air temperature control sensor for acquiring the temperature in the box near the hot air outlet. The letter J indicates a plurality of temperature sensors arranged in the case for acquiring temperature information of a plurality of points of the case. Letter E indicates a temperature detector including a thermal infrared imager for acquiring temperature field information of the target electronic circuit board card 230. The sensor or the probe of the thermal imaging instrument can be arranged in the box body of the simulation device or outside the box body of the simulation device; when the simulation device is arranged outside the box body of the simulation device, the top surface or the top wall of the box body is transparent.
In the embodiment shown in fig. 4, a schematic top view of the top surface of the case is shown, and letter E indicates a thermo-detector including a thermal infrared imager; the letter D indicates a 3D vision measurement scanner, i.e. a 3D vision measurement instrument; letter F indicates a quick camera provided at the upper part of the case for capturing images in the vertical direction; the letter G is a laser welding gun for laser welding.
In the embodiment of the welding observation simulation apparatus shown in fig. 1, the temperature control apparatus includes a temperature-adjustable hot air generator, a hot air passage, and a hot air return passage; one end of the hot air channel is communicated with the internal space of the welding observation simulation device, and the other end of the hot air channel is communicated with the temperature-adjustable hot air generator; the temperature-adjustable hot air generator outputs temperature-adjustable hot air, the hot air enters the welding observation simulation device through the hot air channel, and the hot air enters the temperature-adjustable hot air generator through the hot air return channel after coming out of the welding observation simulation device; the temperature-adjustable hot air generator is connected with the main controller by an electric signal and is controlled by the main controller.
In the embodiment of the welding observation simulation apparatus shown in fig. 1, two high-speed image pickup apparatuses are further included. Letter a in fig. 1 indicates a side high-speed camera provided on a side wall 121 of the case 100; letter F denotes a vertical high-speed camera, which is disposed on the inner wall of the top surface 110 of the case 100; the welding observation simulation device is used for acquiring external visual images of the target electronic circuit board card in the welding observation simulation device in the welding process; the image information of the target electronic circuit board card comprises images of all welding spots and all components on the target electronic circuit board card; the high-speed camera device is used for continuously acquiring external visual images of the target electronic circuit board card in the welding process; the main controller obtains external visual images of all welding spots and all components of the target electronic circuit board card at a plurality of moments according to the high-speed camera device; and calculating the size change and the area change of each welding spot of the target electronic circuit board card, and calculating the size change and the state change of each component of the target electronic circuit board card.
In the embodiment of the welding observation simulation device shown in fig. 1, a temperature detection device, a temperature control device, a 3D vision measuring instrument and a high-speed camera device are respectively connected with a main controller through electrical signals and controlled by the main controller; the temperature detection device is used for acquiring temperature field information in the welding observation simulation device, wherein the temperature field information comprises temperature information of each welding point and each component of the target electronic circuit board card; the temperature control device is used for controlling the temperature in the welding observation simulation device; the main controller receives the temperature control instruction, controls the temperature control device according to the temperature control instruction, and adjusts the temperature in the welding observation simulation device.
In the embodiment of the welding observation simulation apparatus shown in fig. 1, the main controller performs a matching operation of the 3D measurement image of the target electronic circuit board card and the temperature field information according to the received 3D measurement image of the target electronic circuit board card or the size change information and the temperature field information of the target electronic circuit board card; when the size change of the target electronic circuit board card is larger than a set threshold value, the main controller calculates and acquires the target regulation and control temperature of the temperature field, and outputs a temperature regulation control instruction to the temperature control device, and the temperature control device regulates the temperature in the welding observation simulation device to reach the target regulation and control temperature of the temperature field.
In the embodiment of the welding observation simulation apparatus shown in fig. 1, the temperature-adjustable hot air generator adopts nitrogen or air as a gas source; and a micro oxygen analyzer is arranged on the hot air channel and/or the hot air reflux channel and is used for monitoring the oxygen content of the gas in the hot air channel and/or the hot air reflux channel.
In the embodiment of the welding observation simulation apparatus shown in fig. 2, in some high-end welding scenarios, the temperature-adjustable hot air generator uses nitrogen or air as an air source, and simultaneously, formic acid can be added into the air source to perform auxiliary welding.
In the embodiment of the welding observation simulation apparatus shown in fig. 2, the welding observation simulation apparatus with the 3D vision measuring instrument is a vacuum welding observation simulation apparatus; letter H in the figure is a schematic diagram of the connection point of the vacuumized vacuum channel and the box body; the vacuum welding observation simulation device further comprises a vacuumizing channel and a vacuum pump; the vacuum pump is used for pumping the internal space of the welding observation simulation device into a negative pressure vacuum state; one end of the vacuumizing channel is communicated with the internal space of the welding observation simulation device, and the other end of the vacuumizing channel is communicated with the outside.
In the embodiment of the welding observation simulation device shown in fig. 2, heating modes of several SMT reflow soldering devices are included, including a flat plate electrothermal platform heating soldering mode, a gas reflow heating mode, a vacuum soldering mode and a laser soldering mode; if necessary, any one or more welding modes can be selected and combined to form a welding observation simulation device with various welding scene observation and simulation capabilities. In fig. 2, if a flat-panel electrothermal platform heating welding mode is adopted, reference numeral 200 in the drawing is a common reflow soldering platform, reference numeral 210 is a circuit board bearing platform, and reference numeral 220 is a heating flat panel. The heating plate 220 generates heat for soldering the target electronic circuit board card 230.
In the embodiment of the welding observation simulation apparatus shown in fig. 2, the welding observation simulation apparatus with the 3D vision measuring instrument is a laser welding observation simulation apparatus; the letter G in the figure is a laser emission gun for laser welding; a removable board card moving platform 210 is arranged in a welding space for a target electronic circuit board in the welding observation simulation device; after the target electronic circuit board 230 is mounted on the board moving platform 210, the target electronic circuit board can move along two mutually perpendicular directions along the board moving platform, so that each welding spot to be welded can be exposed in the action range of the laser welding spot of the laser emission gun to finish laser welding. The dimensions of the target electronic circuit board card that can follow the board card moving platform along three mutually perpendicular directions are 200 mm, 200 mm and 150 mm, respectively.
In the embodiment of the welding observation simulation apparatus shown in fig. 3, an X-ray imaging apparatus is further included; the X-ray imaging device includes an X-ray emitter 280 and an X-ray receiver; in fig. 3, reference symbol K indicates an X-ray receiver, and an X-ray emitter 280 is disposed below the board moving platform 210, and an X-ray emitted by the X-ray emitter 280 sequentially passes through the board moving platform 210 and the target electronic circuit board 230 and enters the X-ray receiver, and the X-ray receiver transmits an obtained X-ray feedback signal to the main controller, so as to perform calculation to obtain an X-ray image of the target electronic circuit board 230, that is, an internal image of the target electronic circuit board. The X-ray receiver K is arranged at the bottom of the top surface of the box body. When the X-ray imaging device is used, the internal image can be acquired for a single solder joint, and the target electronic circuit board 230 can move on the board moving platform 210.
In the embodiment of the welding observation simulation apparatus shown in fig. 3, the X-ray imaging apparatus is electrically connected to the main controller and controlled by the main controller; the X-ray imaging device is used for acquiring an internal image of the target electronic circuit board card in the welding process; the internal image of the target electronic circuit board card comprises internal images of all welding spots and all components on the target electronic circuit board card; a removable board card moving platform is arranged in a welding space where the target electronic circuit board card is positioned; after the target electronic circuit board card is arranged on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively; the target electronic circuit board card can move the target electronic circuit board card, so that a target welding spot on the target electronic circuit board card enters an observation area of the X-ray imaging device.
In the embodiment of the welding observation simulation apparatus shown in fig. 3, an X-ray imaging apparatus continuously or periodically acquires internal images of each solder joint and each component on a target electronic circuit board card during the welding process; and the main controller acquires bubble state information of each welding point and each component of the target electronic circuit board card according to the internal image of each welding point and each component of the target electronic circuit board card and/or the size change information of each welding point and each component of the target electronic circuit board card.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 to 3, a case 100 is further included; the main controller is arranged outside the box body; the temperature sensors in the temperature detection device are distributed in the box body, or the temperature detection device is arranged at the top of the box body; one end of the temperature control device is connected with the main control, the other end of the temperature control device is communicated with the inside of the box body, and the temperature control device sends air flow into the box body to control the temperature in the box body; the 3D vision measuring instrument and the high-speed camera device are arranged on the inner wall of the box body facing the target electronic circuit board card.
In embodiments not shown in some of the figures, a display and database are also provided; the database is in electrical signal connection with the main controller and is used for storing the received 3D measurement image data of the target electronic circuit board card, the size data of the target electronic circuit board card and the temperature data; the display is used for displaying the image and the temperature field information. In the application, the main controller is provided with a database interface, so that a database of abundant welding process parameters can be established, and the data in the database can be subjected to deep mining application to establish a welding model. The soldering simulation process and/or the soldering process efficiency can be improved when the same kind of soldering elements, such as the same kind of board cards, or the same kind of components can have a relatively proper reflow soldering temperature curve at the beginning.
In some embodiments of the welding observation simulation method not shown in the drawings, the welding observation simulation apparatus according to any one of the above description is used; the method comprises the following steps: step 1: in the welding process of the target electronic circuit board card, acquiring temperature field information in a welding observation simulation device, and acquiring temperature information of each welding point and each component of the target electronic circuit board card; step 2: continuously or periodically acquiring 3D measurement images of a target electronic circuit board card in a welding observation simulation device in a welding process by using a 3D vision measuring instrument; step 3: the main controller calculates the size change information of the target electronic circuit board card in the welding process according to the 3D measurement images of the target electronic circuit board card at a plurality of moments acquired by the 3D vision measuring instrument; the dimension change information of the target electronic circuit board comprises dimension change information of each welding point and each component on the target electronic circuit board; step 4: the main controller judges whether the size change of any appointed welding spot and each component on the target electronic circuit board exceeds a set threshold value, if the size change of any appointed welding spot and each component on the target electronic circuit board exceeds the set threshold value, a temperature adjusting control instruction is output, the temperature control device executes the temperature adjusting control instruction, and the temperature in the welding observation simulation device is adjusted until the size change of any appointed welding spot and each component on the target electronic circuit board is within the set threshold value range, and the temperature at the moment is the target temperature. Further comprising the step 5: and (3) recording the target temperature data obtained in the step (4) and outputting a reflow soldering target temperature curve.
In some embodiments of the SMT reflow soldering apparatus, not shown in the drawings, the soldering observation simulation apparatus described above is included.
The application discloses a welding observation simulation device with a 3D vision measuring instrument, which comprises a main controller, a temperature detection device, a temperature control device and the 3D vision measuring instrument; the temperature field information acquired by the temperature detection device comprises temperature information of each welding point and each component of the target electronic circuit board card; the main controller receives a temperature control instruction and controls the temperature control device to adjust the temperature in the welding observation simulation device; and the 3D vision measuring instrument acquires a 3D measurement image of the target electronic circuit board card in the welding observation simulation device in the welding process. Acquiring size change information of the electronic circuit board card in the welding process according to the 3D measurement image; and the temperature field change curve in the welding observation simulation device is adjusted according to the size change, so that the temperature field change curve is adjusted to a state suitable for welding. The welding efficiency and quality of the new trial-manufacture electronic circuit board card are greatly improved, and the welding method is particularly suitable for welding small-scale customized electronic circuit board cards.
The foregoing is only illustrative of the present invention and is not to be construed as limiting the scope of the invention, and all equivalent structures or equivalent flow modifications which may be made by the teachings of the invention and the accompanying drawings or which may be directly or indirectly employed in other related art are within the scope of the invention.
Claims (13)
1. A welding observation simulation device with a 3D vision measuring instrument is characterized in that,
The device comprises a main controller, a temperature detection device, a temperature control device and a 3D vision measuring instrument;
The temperature detection device, the temperature control device and the 3D vision measuring instrument are respectively connected with the main controller through electrical signals and controlled by the main controller;
the temperature detection device is used for acquiring temperature field information in the welding observation simulation device, wherein the temperature field information comprises temperature information of each welding point and each component of the target electronic circuit board card;
the temperature control device is used for controlling the temperature in the welding observation simulation device;
the main controller receives the temperature control instruction and enables the temperature control device to adjust the temperature in the welding observation simulation device according to the temperature control instruction;
In the welding process, a 3D vision measuring instrument is used for acquiring a 3D measurement image of a target electronic circuit board card in a welding observation simulation device;
the 3D vision measuring instrument continuously or periodically detects and acquires 3D measuring images of the target electronic circuit board card in the welding process;
the main controller calculates the dimensional change information of the target electronic circuit board according to the 3D measurement images of the target electronic circuit board at a plurality of moments acquired by the 3D vision measuring instrument, and outputs the dimensional change information of the target electronic circuit board outwards; the dimension change information of the target electronic circuit board comprises dimension change information of each welding point and each component on the target electronic circuit board;
the high-speed camera device is used for acquiring external visual images of the target electronic circuit board card in the welding observation simulation device in the welding process; the external visual image information of the target electronic circuit board comprises visual measurement images of all welding spots and all components on the target electronic circuit board;
the high-speed camera device is used for continuously acquiring external vision measurement images of the target electronic circuit board card in the welding process; the main controller obtains external vision measurement images of all welding spots and all components of the target electronic circuit board card at a plurality of moments according to the high-speed camera device; calculating size change information and area change information of each welding spot of the target electronic circuit board card, and calculating size change information and state change information of each component of the target electronic circuit board card;
the temperature control device comprises a temperature-adjustable hot air generator, a hot air channel and a hot air reflux channel; the temperature-adjustable hot air generator is connected with the main controller by an electric signal and is controlled by the main controller;
One end of the hot air channel is communicated with the internal space of the welding observation simulation device, and the other end of the hot air channel is communicated with the temperature-adjustable hot air generator; the hot air generator can output hot air with adjustable temperature, the hot air enters the welding observation simulation device through the hot air channel, and the hot air flows out of the welding observation simulation device and enters the hot air generator through the hot air return channel;
The temperature-adjustable hot air generator adopts nitrogen or air as an air source; and a micro oxygen analyzer is arranged on the hot air channel and/or the hot air reflux channel and is used for monitoring the oxygen content of the gas in the hot air channel and/or the hot air reflux channel.
2. The welding observation simulation apparatus with a 3D vision measuring instrument of claim 1,
The 3D measurement image of the target electronic circuit board card obtained by the 3D vision measuring instrument comprises the size information of the target electronic circuit board card in the three-axis direction of the space; the dimensional change information of the target electronic circuit board comprises dimensional change information of three axial directions of space;
The accuracy range of the size in the 3D measurement image obtained by the 3D vision measuring instrument is 1-20 micrometers.
3. The welding observation simulation apparatus with a 3D vision measuring instrument of claim 1,
The main controller performs matching operation of the 3D measurement image of the target electronic circuit board card and the temperature field information according to the received 3D measurement image of the target electronic circuit board card or the dimensional change information of the target electronic circuit board card and the temperature field information in the welding observation simulation device;
when the size change of the target electronic circuit board card is larger than the set welding size change threshold, the main controller calculates and obtains the target regulation and control temperature of the temperature field, and outputs a temperature regulation control instruction to the temperature control device, and the temperature control device regulates the temperature in the welding observation simulation device to reach the target regulation and control temperature of the temperature field.
4. The welding observation simulation apparatus with a 3D vision measuring instrument of claim 1,
The welding observation simulation device with the 3D vision measuring instrument is a vacuum welding observation simulation device;
the vacuum welding observation simulation device further comprises a vacuumizing channel and a vacuum pump;
the vacuum pump is used for pumping the internal space of the welding observation simulation device into a negative pressure vacuum state;
one end of the vacuumizing channel is communicated with the internal space of the welding observation simulation device, and the other end of the vacuumizing channel is communicated with the air extraction end of the vacuum pump.
5. The welding observation simulation apparatus with a 3D vision measuring instrument of claim 1,
The welding observation simulation device with the 3D vision measuring instrument is a laser welding observation simulation device;
A removable board card moving platform is arranged in the internal space of the welding observation simulation device and is used for moving the position of the target electronic circuit board in the welding process;
After the target electronic circuit board card is arranged on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively; the solder joints on the target electronic circuit board card are exposed in the welding interval range of the laser welding effect.
6. The welding observation simulation apparatus with a 3D vision meter of claim 5,
The dimensions of the target electronic circuit board card that can follow the board card moving platform along three mutually perpendicular directions are 200mm, 200mm and 150 mm, respectively.
7. The welding observation simulation apparatus with a 3D vision measuring instrument of claim 1,
Also comprises an X-ray imaging device;
The X-ray imaging device is in electrical signal connection with the main controller and is controlled by the main controller;
The X-ray imaging device is used for acquiring an internal image of the target electronic circuit board card in the welding process; the internal image of the target electronic circuit board card comprises internal images of all welding spots and all components on the target electronic circuit board card;
A removable board card moving platform is arranged in a welding space where the target electronic circuit board card is positioned; after the target electronic circuit board card is arranged on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively;
The target electronic circuit board card can move the target electronic circuit board card, so that a target welding spot on the target electronic circuit board card enters an observation area of the X-ray imaging device.
8. The welding observation simulation apparatus with a 3D vision meter of claim 7,
The X-ray imaging device is used for continuously or periodically acquiring internal images of all welding spots and all components on the target electronic circuit board card in the welding process;
And the main controller acquires bubble state information of each welding point and each component of the target electronic circuit board card according to the internal image of each welding point and each component of the target electronic circuit board card and/or the size change information of each welding point and each component of the target electronic circuit board card.
9. A welding observation simulation apparatus with a 3D vision meter according to claim 3,
A display and a database are also arranged;
The database is in electrical signal connection with the main controller and is used for storing the received 3D measurement image data of the target electronic circuit board card, the size data of the target electronic circuit board card and the temperature field information data;
The display is used for displaying the 3D measurement image data and the temperature field information data.
10. The welding observation simulation apparatus with a 3D vision measuring instrument of claim 1,
The box body is also included; the main controller is arranged outside the box body;
The temperature sensors in the temperature detection device are distributed in the box body, or the temperature sensors in the temperature detection device are arranged at the top of the box body;
The 3D vision measuring instrument and the high-speed camera device are arranged on the inner wall of the box body facing the target electronic circuit board card.
11. A welding device is an SMT reflow welding device, which is characterized in that,
A welding observation simulation apparatus including the 3D vision meter of any one of claims 1 to 10.
12. A welding observation simulation method is characterized in that,
A welding observation simulation apparatus with a 3D vision meter according to any one of claims 1 to 10;
The method comprises the following steps:
step 1: in the welding process of the target electronic circuit board card, acquiring temperature field information in a welding observation simulation device, and acquiring temperature information of each welding point and each component of the target electronic circuit board card;
step 2: continuously or periodically acquiring 3D measurement images of the target electronic circuit board card in the welding observation simulation device in the welding process by using a 3D vision measuring instrument;
Step 3: the main controller calculates the size change information of the target electronic circuit board card in the welding process according to the 3D measurement images of the target electronic circuit board card at a plurality of moments acquired by the 3D vision measuring instrument; the dimension change information of the target electronic circuit board comprises dimension change information of each welding point and each component on the target electronic circuit board;
step 4: the main controller judges whether the size change of any appointed welding point and/or each component on the target electronic circuit board exceeds a set threshold value, if the size change of any appointed welding point and/or each component on the target electronic circuit board exceeds the set threshold value, a temperature adjusting control instruction is output, the temperature control device executes the temperature adjusting control instruction, and the temperature in the welding observation simulation device is adjusted until the size change of any appointed welding point and each component on the target electronic circuit board is within the set threshold value range, and the temperature at the moment is the target temperature.
13. The welding observation simulation method of claim 12 wherein,
Further comprising the step 5: and (3) recording the target temperature data obtained in the step (4) and outputting a reflow soldering target temperature curve.
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| CN201455487U (en) * | 2009-03-26 | 2010-05-12 | 赵永先 | Precision desktop reflow soldering machine with temperature testing and analyzing system |
| CN103116374A (en) * | 2011-11-16 | 2013-05-22 | 西安中科麦特电子技术设备有限公司 | Temperature control system of reflow soldering machine |
| CN112261866A (en) * | 2020-09-28 | 2021-01-22 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | SMT technology prediction tool for intelligently deciding PCB quality |
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