CN113059247B - Welding observation simulation device and method with X-ray imager and welding device - Google Patents
Welding observation simulation device and method with X-ray imager and welding device Download PDFInfo
- Publication number
- CN113059247B CN113059247B CN202110444136.1A CN202110444136A CN113059247B CN 113059247 B CN113059247 B CN 113059247B CN 202110444136 A CN202110444136 A CN 202110444136A CN 113059247 B CN113059247 B CN 113059247B
- Authority
- CN
- China
- Prior art keywords
- welding
- circuit board
- electronic circuit
- target electronic
- board card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003466 welding Methods 0.000 title claims abstract description 336
- 238000004088 simulation Methods 0.000 title claims abstract description 151
- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000001514 detection method Methods 0.000 claims abstract description 32
- 238000005476 soldering Methods 0.000 claims description 30
- 238000005259 measurement Methods 0.000 claims description 25
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 230000000007 visual effect Effects 0.000 claims description 11
- 238000010992 reflux Methods 0.000 claims description 10
- 238000012544 monitoring process Methods 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 5
- 238000004364 calculation method Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000004154 testing of material Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013070 change management Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The welding observation simulation device with the X-ray imager comprises a main controller, a temperature detection device, a temperature control device and the X-ray imager; the temperature field information acquired by the temperature detection device comprises temperature information of each welding point and each component of the target electronic circuit board card; the main controller receives the temperature control instruction and enables the temperature control device to adjust the temperature in the welding observation simulation device according to the temperature control instruction; and the X-ray imager acquires an internal image of the target electronic circuit board card in the welding observation simulation device in the welding process. And adjusting a temperature field change curve in the welding observation simulation device according to information displayed by the internal image, so that the temperature field change curve is adjusted to a state suitable for welding. The efficiency of the new electronic circuit board card of trial production is greatly improved, and the method is particularly suitable for the welding of small-batch customized electronic circuit board cards.
Description
Technical Field
The invention relates to the field of electronic circuit board card welding equipment, in particular to a welding observation simulation device with an X-ray imager and an SMT reflow welding device with the welding observation simulation device.
Background
SMT (surface mount technology) is a modern process technology widely used in microelectronic and semiconductor packaging, and circuit boards are soldered to pads of circuit boards by solder paste printing, surface mount and hot air reflow soldering, or other oven heating.
SMT reflow soldering apparatuses in the prior art generally focus mainly on controlling the temperature of each zone. Because the bonding pad and each component are heated by hot air in the reflow process, the temperature rising process is influenced by a plurality of factors such as reflow soldering performance, the size of each component, the materials of the bonding pad and the circuit board, and the like, a first-line process engineer can only set the temperatures of each upper and lower temperature areas of reflow soldering according to the requirements of the temperature reflow curve of the solder paste, and determine the specific temperature reflow curve of a certain circuit board for the solder paste through technical means such as multiple test boards, functional tests of the circuit board, and the like, and the actual temperature change curve corresponding to the specific welding spots on each circuit board and each component in the reflow process is always a black box in the SMT process, which is the blind spot of the first-line engineer in the SMT industry. Particularly, the SMT technology of circuit boards cannot be efficiently used for small-batch and multi-variety circuit boards in the 5G and AI ages.
Therefore, it is particularly important to accurately measure the temperature change of the solder joints and each component on the circuit board in the reflow process, and in the patent application with the application number CN2O12748975.9 and the application name of reflow soldering machine and temperature measuring system thereof, a test method for the actual temperature of the reflow element is provided, but the temperature change of each component on the circuit board is simply recorded, and the simulation function corresponding to the industrial reflow soldering process is not provided.
Aiming at the pain point of the SMT industry, the application discloses an observation simulation device and an SMT reflow soldering simulation method for the SMT reflow process, and provides an innovative method and tool for the precision and the high efficiency of the SMT industry in China. The application provides a welding observation simulation device, which firstly provides a prior simulation for the SMT reflow soldering process so as to try to obtain an optimal reflow soldering temperature curve suitable for a target electronic circuit board card; and acquiring state information of the target electronic circuit board card by means of various equipment, and integrating the state information and the temperature information to output a proper reflow soldering temperature curve.
In the prior art, some SMT welding devices are also provided with some observation devices, such as a high-speed camera device, to acquire images during welding; but these images are of insufficient quality for monitoring dimensional changes of the target electronic circuit board, especially local solder joints and state changes of the individual components.
In the prior art, for example, a high-speed camera device acquires an image in a welding process, and the state change of an electronic circuit board in the welding process can be known only by manual intervention observation and analysis usually in the welding process or after the welding is completed. The temperature regulation and control inside the welding observation simulation device cannot be carried out in real time through the image data; therefore, when a new electronic circuit board card is soldered, the soldering observation process is often repeated for a plurality of times to obtain the ideal temperature control curve of the soldering observation simulation device. The welding observation process is suitable for the welding process time of a new electronic circuit board card, and the production efficiency is lower. For the production of large-volume electronic circuit board cards, such adjustments are time and cost tolerant prior to mass production. However, the production efficiency and cost of the prior art clearly do not meet the manufacturing requirements of personalized small-lot, high-quality, low-cost customized electronic circuit board cards.
In the prior art, not only can the fine measurement of the external state of the welding spot be not performed, but also the change process in the welding spot can not be known. In practical applications, it is necessary to know the state change process inside the solder joint during the soldering process, whether the solder joint is to be tested in a simulation or in a solder performance test.
Disclosure of Invention
The technical problem to be solved by the invention is to avoid the defect that the internal state of a welding spot in welding cannot be obtained in the prior art scheme, and provide a welding observation simulation device capable of carrying out X-ray imaging on the welding spot and the inside of a component, wherein an internal image of a target electronic circuit board in the welding process can be obtained by an X-ray imager in the welding process; the internal image of the target electronic circuit board card comprises internal images of all welding spots and all components on the target electronic circuit board card; detailed internal state influence information is provided for welding process monitoring. And the information can be comprehensively analyzed and utilized, the welding temperature closed-loop adjustment process is directly completed, the production efficiency of electronic circuit board card welding trial-production and welding material testing is greatly improved, and the cost of the electronic circuit board card welding trial-production and welding material testing is saved.
The technical scheme for solving the technical problems is that the welding observation simulation device with the X-ray imager comprises a main controller, a temperature detection device, a temperature control device and the X-ray imager; the temperature detection device, the temperature control device and the X-ray imager are respectively connected with the main controller through electrical signals and controlled by the main controller; the temperature detection device is used for acquiring temperature field information in the welding observation simulation device, wherein the temperature field information comprises temperature information of each welding point and each component of the target electronic circuit board card; the temperature control device is used for controlling the temperature in the welding observation simulation device; the main controller receives the temperature control instruction and enables the temperature control device to adjust the temperature in the welding observation simulation device according to the temperature control instruction; the X-ray imager is used for acquiring an internal image of the target electronic circuit board card in the welding process; the internal image of the target electronic circuit board card comprises the internal images of all welding spots and all components on the target electronic circuit board card.
The X-ray imaging device can acquire image information of each welding point and each component of the target electronic circuit board card, and can very accurately position whether the size change of each welding point and each component on the target electronic circuit board card generates bubbles inside or only changes the external size by combining the image characteristics of each welding point and each component outside the target electronic circuit board card. This can also be used to evaluate the performance of the welding material during the welding process.
A removable board card moving platform is arranged in the welding observation simulation device; after the target electronic circuit board card is arranged on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively; and enabling a target welding spot on the target electronic circuit board card to enter an observation region of the X-ray imager.
An X-ray imager continuously or periodically acquires the internal images of each welding point and each component on the target electronic circuit board card in the welding process; the main controller obtains internal size change information and internal bubble state change information of each welding spot and each component of the target electronic circuit board card according to the internal images of each welding spot and each component of the target electronic circuit board card; the main controller performs matching operation of internal images and temperature field information of the target electronic circuit board card according to the internal size change information and internal bubble state change information of each welding point and each component of the target electronic circuit board card and the temperature field information in the welding observation simulation device; when the internal size change and/or internal bubble change of each welding spot and each component of the target electronic circuit board card are/is larger than the set change threshold, the main controller calculates and obtains the target regulation and control temperature of the temperature field, and outputs a temperature regulation and control instruction to the temperature control device, so that the temperature in the welding observation simulation device is regulated by the temperature control device to reach the target regulation and control temperature of the temperature field.
The X-ray imager comprises an X-ray emitter and an X-ray receiver; the X-ray emitter and the X-ray receiver are arranged in opposite directions, so that the target electronic circuit board card is positioned between the X-ray emitter and the X-ray receiver; x-rays emitted by the X-ray emitter can penetrate through the target electronic circuit board card to reach the X-ray receiver.
The welding observation simulation device with the X-ray imager further comprises a box body; the main controller is arranged outside the box body; the temperature sensors in the temperature detection device are distributed in the box body, or the temperature sensors in the temperature detection device are arranged at the top of the box body; the X-ray emitter is arranged below the board card moving platform, the X-ray receiver is arranged at the bottom of the top surface of the box body, X-rays emitted by the X-ray emitter sequentially penetrate through the board card moving platform and the target electronic circuit board card and enter the X-ray receiver, the X-ray receiver transmits the obtained X-ray feedback signals to the main controller, and the X-ray images of the target electronic circuit board card, namely the internal images of the target electronic circuit board card, are obtained through calculation; when the X-ray imager is used, the target electronic circuit board can move on the board moving platform so as to obtain an internal image aiming at a single welding spot or a single component.
The temperature field information is combined with the size change information, the main controller can perform temperature adjustment in a real-time closed loop manner, and the real-time temperature adjustment enables the size change management to be performed in time; the efficiency of the welding observation simulation device in the trial production process can be greatly improved. The method does not need to manually intervene and identify the state change information of the target electronic circuit board card at different temperatures like the prior art, and does not need to manually set the target regulation and control temperature like the prior art. In the application, the welding observation simulation apparatus can automatically adjust the temperature through the existing welding model. Or establishing a welding model related to the dimensional change and the temperature field information through record matching of the dimensional change and the temperature field information in the temperature adjustment process, and managing the temperature and the dimensional change by using the welding model related to the dimensional change and the temperature field information in the subsequent welding process.
The welding observation simulation device with the X-ray imager further comprises a 3D vision measuring instrument, wherein the 3D vision measuring instrument is used for continuously or periodically acquiring 3D measurement images of a target electronic circuit board card in the welding observation simulation device in the welding process.
The main controller obtains 3D measurement images of the target electronic circuit board card at a plurality of moments according to the 3D vision measuring instrument; calculating the dimensional change information of the target electronic circuit board; and outputting the dimensional change information of the target electronic circuit board; the dimension change information of the target electronic circuit board comprises dimension change information of each welding point and each component on the target electronic circuit board; the 3D measurement image of the target electronic circuit board card obtained by the 3D vision measuring instrument comprises size information of the target electronic circuit board card in three axial directions of space; the dimensional change information of the target electronic circuit board comprises dimensional change information of three axial directions of space; the accuracy range of the size in the 3D measurement image obtained by the 3D vision measuring instrument is 1-20 micrometers.
The 3D measuring image of the target electronic circuit board card is acquired by the 3D camera, so that the state information of the target electronic circuit board card is more accurate, and the state change of each welding spot and each component in the welding process can be observed in detail; the information of the same temperature field can be comprehensively obtained, and the temperature of each welding spot and the position of each component is finely reached; the acquisition of the image information and the temperature information provides a basis for accurately positioning the relationship between the state and the temperature of each welding spot and each component.
Continuously or periodically acquired 3D measurement images of the target electronic circuit board card provide 3D measurement images at different time points. The state change of each welding spot and each component on the target electronic circuit board card after a period of time can be obtained through 3D measurement image information at different time points. Some of these variations are not only visible to the naked eye, but provide material for human participation in the analysis. Some changes can also be calculated digitally through a master controller or other computers to obtain more accurate size change information data. The size change information data comprises volume change information and area change information of welding spots or position state information of components; the information data corresponds to specific state changes of the welding spot and the component during welding and melting, and the state changes are usually caused by temperature effects. Therefore, when abnormality occurs in the dimensional change information data, such as a change in a certain dimensional data exceeding a threshold value within a set time, abnormality in temperature management in the welding device is often associated. These data provide accurate data bases for subsequent temperature adjustments. The dimensional information in the three-axis direction of the space can more comprehensively acquire the state information of welding spots and components on the target electronic circuit board card in each space dimension; the accuracy of the dimensions in the 3D measurement image ranges from 1 micron to 20 microns, meaning that micron-scale viewing and fine adjustment can be performed.
The welding observation simulation device with the X-ray imager further comprises a high-speed camera device, wherein the high-speed camera device is used for acquiring external visual images of the target electronic circuit board card in the welding observation simulation device in the welding process; the external visual image information of the target electronic circuit board comprises images of all welding spots and all components on the target electronic circuit board; the high-speed camera device is used for continuously acquiring external visual images of the target electronic circuit board card in the welding process; the main controller obtains external visual images of all welding spots and all components of the target electronic circuit board card at a plurality of moments according to the high-speed camera device; and calculating the size change and the area change of each welding spot of the target electronic circuit board card, and calculating the size change and the state change of each component of the target electronic circuit board card.
The image data acquired by the high-speed camera and the 3D measurement image data acquired by the 3D camera are mutually complemented. The 3D measurement image data, namely the three-dimensional image data and the two-dimensional image data are mutually complemented, so that more accurate and complete state information of the target electronic circuit board, such as the molten state of welding spots, whether each component has tilting, standing and the deformation condition of the whole or part of the board card, can be obtained. In the same system, the image data have definite time corresponding relation, and other image data at the current moment can be called and analyzed at any time to mutually verify the state when necessary, so that the judgment accuracy is ensured. When necessary, this data can be stored in a database for use in subsequent modeling of the soldering process of the target electronic circuit board.
The temperature control device comprises a temperature-adjustable hot air generator, a hot air channel and a hot air reflux channel; the temperature-adjustable hot air generator is connected with the main controller by an electric signal and is controlled by the main controller; one end of the hot air channel is communicated with the internal space of the welding observation simulation device, and the other end of the hot air channel is communicated with the temperature-adjustable hot air generator; the hot air generator can output hot air with adjustable temperature, the hot air enters the welding observation simulation device through the hot air channel, and the hot air flows out of the welding observation simulation device and enters the hot air generator through the hot air return channel; the temperature-adjustable hot air generator adopts nitrogen or air as an air source; and a micro oxygen analyzer is arranged on the hot air channel and/or the hot air reflux channel and is used for monitoring the oxygen content of the gas in the hot air channel and/or the hot air reflux channel. The welding observation simulation device with the X-ray imager is a vacuum welding observation simulation device; the vacuum welding observation simulation device further comprises a vacuumizing channel and a vacuum pump; the vacuum pump is used for pumping the internal space of the welding observation simulation device into a negative pressure vacuum state; one end of the vacuumizing channel is communicated with the internal space of the welding observation simulation device, and the other end of the vacuumizing channel is communicated with the air extraction end of the vacuum pump.
The temperature measuring range of the temperature detecting device is 25-350 ℃; the accuracy range of the temperature measurement is plus or minus 2 degrees celsius. The temperature measurement range and the measurement precision can be adjusted according to different welding forms and the welding requirements of the target circuit board, and the description is omitted again.
The temperature-adjustable hot air generator adopts nitrogen or air as an air source; and a micro oxygen analyzer is arranged on the hot air channel and/or the hot air reflux channel and is used for monitoring the oxygen content of the gas in the hot air channel and/or the hot air reflux channel. The detection of the oxygen content can better know the influence degree of the oxygen concentration in the welding environment on welding in the welding process, so that the oxygen content can be adjusted in real time, and the welding can reach a desired state. Of course, pure nitrogen or vacuum can be adopted as a welding background in ideal conditions, so that oxygen content detection is not needed; however, in the case of using air as a welding background, the detection of the oxygen concentration is of practical significance, and the efficiency of the welding process can be improved.
The welding observation simulation device with the X-ray imager is a laser welding observation simulation device; a removable board card moving platform is arranged in the internal space of the welding observation simulation device and is used for moving the position of the target electronic circuit board in the welding process; after the target electronic circuit board card is mounted on the board moving platform, the target electronic circuit board card can move along two or three mutually perpendicular directions along the board moving platform respectively; exposing the welding spots on the target electronic circuit board card in a welding interval range of a laser welding effect; the dimensions of the target electronic circuit board card that can follow the board card moving platform along three mutually perpendicular directions are 200 mm, 200 mm and 150 mm, respectively.
The welding observation simulation device with the X-ray imager is further provided with a display and a database; the database is connected with the main controller through electric signals and is used for storing the received internal image data and temperature field information data of the target electronic circuit board card; the display is electrically connected with the main controller and used for displaying the internal image data and the temperature field information data.
The technical scheme for solving the technical problems can also be a welding device which is an SMT reflow soldering device and comprises the welding observation simulation device with the X-ray imaging device.
The technical scheme for solving the technical problems can also be a welding observation simulation method based on the welding observation simulation device with the X-ray imager; the method comprises the following steps: step 1: in the welding process of the target electronic circuit board card, acquiring temperature field information in a welding observation simulation device, and acquiring temperature information of each welding point and each component of the target electronic circuit board card; step 2: continuously or periodically acquiring internal images of a target electronic circuit board card in a welding observation simulation device in a welding process by using an X-ray imager; step 3: the main controller calculates the size change information of the target electronic circuit board card in the welding process according to the internal images of the target electronic circuit board card at a plurality of moments acquired by the X-ray imager; the dimension change information of the target electronic circuit board comprises dimension change information of each welding point and each component on the target electronic circuit board; step 4: the main controller judges whether the size change of any appointed welding point and/or each component on the target electronic circuit board exceeds a set threshold value, if the size change of any appointed welding point and/or each component on the target electronic circuit board exceeds the set threshold value, a temperature adjusting control instruction is output, the temperature controlling device executes the temperature adjusting control instruction, and the temperature in the welding observation simulation device is adjusted until the size change of any appointed welding point and each component on the target electronic circuit board is within the set threshold value range, and the temperature at the moment is recorded as the target temperature.
The welding observation simulation method further comprises the following step 5: and (3) recording the target temperature data obtained in the step (4) and outputting a reflow soldering target temperature curve.
Compared with the prior art, the application has the beneficial effects that: by introducing an X-ray imager, a temperature detection device and a temperature control device, the change information of the internal state of the electronic circuit board card in the welding process and the change information of the temperature field of each welding spot and each component can be completely acquired; and the temperature field in the welding observation simulation device can be adjusted according to the detail of the dimensional change of the electronic circuit board card, so that the temperature field is adjusted to a state suitable for welding. The size change detection process and the temperature field regulation process of the electronic circuit board card are automated, so that the efficiency of the new electronic circuit board card is greatly improved, and the method is particularly suitable for testing the welding and welding materials of the electronic circuit board card customized in small batches.
Drawings
FIG. 1 is a schematic block diagram of a first preferred embodiment of a welding observation simulation apparatus with an X-ray imager;
FIG. 2 is a schematic block diagram of a second preferred embodiment of a welding observation simulation apparatus with an X-ray imager;
FIG. 3 is a schematic block diagram of a third preferred embodiment of a welding observation simulation apparatus with an X-ray imager;
Fig. 4 is a schematic block diagram of a top surface of a case of a welding observation simulation apparatus with an X-ray imager in a plan view.
Detailed Description
The present application is described in further detail below with reference to the accompanying drawings.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 and 2, the controller is the main controller. Letter a in fig. 1 indicates a side high-speed camera provided on a side wall 121 of the case 100; letter F indicates a vertical high-speed camera, which is disposed on an inner wall of the top surface 110 of the case 100, and the top surface 110 may be made of a transparent material such as glass, or may be made of a non-transparent material. The black dots near the letters in the figure indicate that such devices are generally mounted at corresponding positions in the case of the welding observation simulation device so as to be able to conveniently acquire various kinds of observation information in the case.
In the welding observation simulation apparatus embodiment shown in fig. 1 and 2, the letter D denotes a 3D scanner, and the 3D scanner in the 3D vision measuring instrument is disposed on the top surface 110 of the case 100; the 3D scanner may be embedded in the top surface 110, or may be disposed above the top surface 110. And 3D scanning signals obtained by a 3D scanner in the 3D vision measuring instrument are transmitted to a main controller in a computer, and 3D measurement image information is displayed through a display. The 3D scanning signal obtained by the 3D vision measuring instrument is a 3D measurement image signal of a target electronic circuit board card in the welding observation simulation device in the welding process.
The welding observation simulation device with the X-ray imager shown in fig. 1 and 2 comprises a main controller, a temperature detection device, a temperature control device and the X-ray imager; the temperature detection device, the temperature control device and the X-ray imager are respectively connected with the main controller through electrical signals and controlled by the main controller; the temperature detection device is used for acquiring temperature field information in the welding observation simulation device, wherein the temperature field information comprises temperature information of each welding point and each component of the target electronic circuit board card; the temperature control device is used for controlling the temperature in the welding observation simulation device; the main controller receives the temperature control instruction and enables the temperature control device to adjust the temperature in the welding observation simulation device according to the temperature control instruction; the X-ray imager is used for acquiring an internal image of the target electronic circuit board card in the welding process; the internal image of the target electronic circuit board card comprises the internal images of all welding spots and all components on the target electronic circuit board card.
The welding observation simulation device with the X-ray imager is shown in fig. 1 and 2, and a removable board card moving platform is arranged in the welding observation simulation device; after the target electronic circuit board card is arranged on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively; and enabling a target welding spot on the target electronic circuit board card to enter an observation region of the X-ray imager.
The welding observation simulation device with the X-ray imager shown in fig. 1 and 2 is characterized in that the X-ray imager continuously or periodically acquires the internal images of each welding spot and each component on the target electronic circuit board card in the welding process; the main controller obtains internal size change information and internal bubble state change information of each welding spot and each component of the target electronic circuit board card according to the internal images of each welding spot and each component of the target electronic circuit board card; the main controller performs matching operation of internal images and temperature field information of the target electronic circuit board card according to the internal size change information and internal bubble state change information of each welding point and each component of the target electronic circuit board card and the temperature field information in the welding observation simulation device; when the internal size change and/or internal bubble change of each welding spot and each component of the target electronic circuit board card are/is larger than the set change threshold, the main controller calculates and obtains the target regulation and control temperature of the temperature field, and outputs a temperature regulation and control instruction to the temperature control device, so that the temperature in the welding observation simulation device is regulated by the temperature control device to reach the target regulation and control temperature of the temperature field.
The welding observation simulation apparatus with an X-ray imager including an X-ray emitter and an X-ray receiver as shown in fig. 1 to 4; the X-ray emitter and the X-ray receiver are arranged in opposite directions, so that the target electronic circuit board card is positioned between the X-ray emitter and the X-ray receiver; x-rays emitted by the X-ray emitter can penetrate through the target electronic circuit board card to reach the X-ray receiver. The X-ray imager includes an X-ray emitter 280 and an X-ray receiver; as shown in fig. 1 to 4, reference symbol K indicates an X-ray receiver, an X-ray emitter 280 is disposed below the board moving platform 210, and the X-rays emitted by the X-ray emitter 280 sequentially pass through the board moving platform 210 and the target electronic circuit board 230 and enter the X-ray receiver, and the X-ray receiver transmits the obtained X-ray feedback signal to the main controller to perform calculation to obtain an X-ray image of the target electronic circuit board 230, that is, an internal image of the target electronic circuit board. The X-ray receiver K is arranged at the bottom of the top surface of the box body. When the X-ray imager is used, the internal image may be acquired for a single solder joint, and the target electronic circuit board 230 may be moved on the board moving platform 210.
The welding observation simulation apparatus with the X-ray imager as shown in fig. 1 and 2 further comprises a box body; the main controller is arranged outside the box body; the temperature sensors in the temperature detection device are distributed in the box body, or the temperature sensors in the temperature detection device are arranged at the top of the box body; the X-ray emitter is arranged below the board card moving platform, the X-ray receiver is arranged at the bottom of the top surface of the box body, X-rays emitted by the X-ray emitter sequentially penetrate through the board card moving platform and the target electronic circuit board card and enter the X-ray receiver, the X-ray receiver transmits the obtained X-ray feedback signals to the main controller, and the X-ray images of the target electronic circuit board card, namely the internal images of the target electronic circuit board card, are obtained through calculation; when the X-ray imager is used, the target electronic circuit board can move on the board moving platform so as to obtain an internal image aiming at a single welding spot or a single component.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 and 2, the 3D vision measuring instrument continuously or periodically detects and acquires the 3D measurement image of the target electronic circuit board card in the welding process; the main controller obtains 3D measurement images of the target electronic circuit board card at a plurality of moments according to the 3D vision measuring instrument; calculating the dimensional change information of the target electronic circuit board; and outputting the dimensional change information of the target electronic circuit board; the dimension change information of the target electronic circuit board comprises dimension change information of each welding spot and each component on the target electronic circuit board. The 3D measurement image of the target electronic circuit board card obtained by the 3D vision measuring instrument comprises the dimension of the target electronic circuit board card in the three-axis direction of the space; the dimensional change information comprises dimensional change information in three spatial axis directions; the accuracy range of the size in the 3D measurement image obtained by the 3D vision measuring instrument is 1-20 micrometers.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 and 2, the temperature detection apparatus includes a thermometer, and the temperature measurement range is 25 degrees celsius to 350 degrees celsius; the accuracy range of the temperature measurement is plus or minus 2 degrees celsius. In fig. 1, the letter B denotes a hot air temperature control sensor for acquiring the temperature in the box near the hot air outlet. The letter J indicates a plurality of temperature sensors arranged in the case for acquiring temperature information of a plurality of points of the case. Letter E indicates a temperature detector including a thermal infrared imager for acquiring temperature field information of the target electronic circuit board card 230. The sensor or probe of the infrared thermal imager can be arranged inside the box body of the simulation device, and other types of thermal imagers can be arranged outside the box body of the simulation device. When the infrared thermal imaging instrument is arranged outside the box body of the simulation device, the top surface or the top wall of the box body is transparent.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 and 2, the temperature control apparatus includes a temperature-adjustable hot air generator, a hot air passage, and a hot air return passage; one end of the hot air channel is communicated with the internal space of the welding observation simulation device, and the other end of the hot air channel is communicated with the temperature-adjustable hot air generator; the temperature-adjustable hot air generator outputs temperature-adjustable hot air, the hot air enters the welding observation simulation device through the hot air channel, and the hot air enters the temperature-adjustable hot air generator through the hot air return channel after coming out of the welding observation simulation device; the temperature-adjustable hot air generator is connected with the main controller by an electric signal and is controlled by the main controller. The temperature-adjustable hot air generator adopts nitrogen or air as an air source; and a micro oxygen analyzer is arranged on the hot air channel and/or the hot air reflux channel and is used for monitoring the oxygen content of the gas in the hot air channel and/or the hot air reflux channel.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 and 2, two high-speed image pickup apparatuses are further included. Letter a in fig. 1 indicates a side high-speed camera provided on a side wall 121 of the case 100; letter F denotes a vertical high-speed camera, which is disposed on the inner wall of the top surface 110 of the case 100; the welding observation simulation device is used for acquiring external visual images of the target electronic circuit board card in the welding observation simulation device in the welding process; the image information of the target electronic circuit board card comprises images of all welding spots and all components on the target electronic circuit board card; the high-speed camera device is used for continuously acquiring external visual images of the target electronic circuit board card in the welding process; the main controller obtains external visual images of all welding spots and all components of the target electronic circuit board card at a plurality of moments according to the high-speed camera device; and calculating the size change and the area change of each welding spot of the target electronic circuit board card, and calculating the size change and the state change of each component of the target electronic circuit board card.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 and 2, a temperature detection device, a temperature control device, a 3D vision measuring instrument and a high-speed camera device are respectively connected with a main controller through electrical signals and controlled by the main controller; the temperature detection device is used for acquiring temperature field information in the welding observation simulation device, wherein the temperature field information comprises temperature information of each welding point and each component of the target electronic circuit board card; the temperature control device is used for controlling the temperature in the welding observation simulation device; the main controller receives the temperature control instruction, controls the temperature control device according to the temperature control instruction, and adjusts the temperature in the welding observation simulation device.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 and fig. 2, the main controller performs a matching operation of the 3D measurement image of the target electronic circuit board card and the temperature field information according to the received 3D measurement image of the target electronic circuit board card or the size change information and the temperature field information of the target electronic circuit board card; when the size change of the target electronic circuit board card is larger than a set threshold value, the main controller calculates and acquires the target regulation temperature of the temperature field, and outputs a temperature regulation instruction to the temperature control device, and the temperature control device regulates the temperature in the welding observation simulation device to reach the target regulation temperature of the temperature field.
In the embodiment of the welding observation simulation apparatus shown in fig. 2, in some high-end welding scenarios, the temperature-adjustable hot air generator uses nitrogen or air as an air source, and simultaneously, formic acid can be added into the air source to perform auxiliary welding.
In the embodiment of the welding observation simulation apparatus shown in fig. 2, the welding observation simulation apparatus with the 3D vision measuring instrument is a vacuum welding observation simulation apparatus; letter H in the figure is a schematic diagram of the connection point of the vacuumized vacuum channel and the box body; the vacuum welding observation simulation device further comprises a vacuumizing channel and a vacuum pump; the vacuum pump is used for pumping the internal space of the welding observation simulation device into a negative pressure vacuum state; one end of the vacuumizing channel is communicated with the internal space of the welding observation simulation device, and the other end of the vacuumizing channel is communicated with the outside.
In the embodiment of the welding observation simulation device shown in fig. 2, heating modes of several SMT reflow soldering devices are included, including a flat plate electrothermal platform heating soldering mode, a gas reflow heating mode, a vacuum soldering mode and a laser soldering mode; if necessary, any one or more welding modes can be selected and combined to form a welding observation simulation device with various welding scene observation and simulation capabilities. In fig. 2, if a flat-panel electrothermal platform heating welding mode is adopted, reference numeral 200 in the drawing is a common reflow soldering platform, reference numeral 210 is a circuit board bearing platform, and reference numeral 220 is a heating flat panel. The heating plate 220 generates heat for soldering the target electronic circuit board card 230.
In the embodiment of the welding observation simulation apparatus shown in fig. 3 and 4, the welding observation simulation apparatus with the 3D vision measuring instrument is a laser welding observation simulation apparatus; the letter G in the figure is a laser emission gun for laser welding; a removable board card moving platform 210 is arranged in a welding space for a target electronic circuit board in the welding observation simulation device; after the target electronic circuit board 230 is mounted on the board moving platform 210, the target electronic circuit board can move along two mutually perpendicular directions along the board moving platform, so that each welding spot to be welded can be exposed in the action range of the laser welding spot of the laser emission gun to finish laser welding. After the target electronic circuit board card is mounted on the board card moving platform, the target electronic circuit board card can move along two or three mutually perpendicular directions along the board card moving platform respectively; exposing the welding spots on the target electronic circuit board card in a welding interval range of a laser welding effect; the dimensions of the target electronic circuit board card that can follow the board card moving platform along three mutually perpendicular directions are 200mm, 200mm and 150 mm, respectively. The movable range of the removable board card movable platform can be set corresponding to the laser welding, or a welding gun for the laser welding is set at a proper position; the welding gun for laser welding and the X-ray emitter 280 and the X-ray receiver in the X-ray imager can not generate position interference, so that the welding observation simulation device can be used for laser welding and has an X-ray imaging function.
In the embodiment of the welding observation simulation apparatus shown in fig. 1 to 2, the welding observation simulation apparatus further includes a case 100; the main controller is arranged outside the box body; the temperature sensors in the temperature detection device are distributed in the box body, or the temperature detection device is arranged at the top of the box body; one end of the temperature control device is connected with the main control, the other end of the temperature control device is communicated with the inside of the box body, and the temperature control device sends air flow into the box body to control the temperature in the box body; the 3D vision measuring instrument and the high-speed camera device are arranged on the inner wall of the box body facing the target electronic circuit board card.
In embodiments not shown in some of the figures, a display and database are also provided; the database is in electrical signal connection with the main controller and is used for storing the received 3D measurement image data of the target electronic circuit board card, the size data of the target electronic circuit board card and the temperature data; the display is used for displaying the image and the temperature field information. In the application, the main controller is provided with a database interface, so that a database of abundant welding process parameters can be established, and the data in the database can be subjected to deep mining application to establish a welding model. The soldering simulation process and/or the soldering process efficiency can be improved when the same kind of soldering elements, such as the same kind of board cards, or the same kind of components can have a relatively proper reflow soldering temperature curve at the beginning.
In some embodiments of the welding observation simulation method not shown in the drawings, the welding observation simulation apparatus with an X-ray imager is based on the above; the method comprises the following steps: step 1: in the welding process of the target electronic circuit board card, acquiring temperature field information in a welding observation simulation device, and acquiring temperature information of each welding point and each component of the target electronic circuit board card; step 2: continuously or periodically acquiring internal images of a target electronic circuit board card in a welding observation simulation device in a welding process by using an X-ray imager; step 3: the main controller calculates the size change information of the target electronic circuit board card in the welding process according to the internal images of the target electronic circuit board card at a plurality of moments acquired by the X-ray imager; the dimension change information of the target electronic circuit board comprises dimension change information of each welding point and each component on the target electronic circuit board; step 4: the main controller judges whether the size change of any appointed welding point and/or each component on the target electronic circuit board exceeds a set threshold value, if the size change of any appointed welding point and/or each component on the target electronic circuit board exceeds the set threshold value, a temperature adjusting control instruction is output, a temperature control device executes the temperature adjusting control instruction, and the temperature in the welding observation simulation device is adjusted until the size change of any appointed welding point and each component on the target electronic circuit board is within the set threshold value range, and the temperature at the moment is recorded as the target temperature; step 5: and (3) recording the target temperature data obtained in the step (4) and outputting a reflow soldering target temperature curve.
In some embodiments of the SMT reflow soldering apparatus, not shown in the figures, a soldering view simulator as described above with an X-ray imager is included.
The welding observation simulation device with the X-ray imager comprises a main controller, a temperature detection device, a temperature control device and the X-ray imager; the temperature detection device, the temperature control device and the X-ray imager are respectively connected with the main controller through electrical signals and controlled by the main controller; the temperature detection device is used for acquiring temperature field information in the welding observation simulation device, wherein the temperature field information comprises temperature information of each welding point and each component of the target electronic circuit board card; the temperature control device is used for controlling the temperature in the welding observation simulation device; the main controller receives the temperature control instruction and controls the temperature control device to adjust the temperature in the welding observation simulation device according to the temperature control instruction; the X-ray imager is used for acquiring an internal image of the target electronic circuit board card in the welding process; the internal image of the target electronic circuit board card comprises internal images of all welding spots and all components on the target electronic circuit board card; a removable board card moving platform is arranged in a welding space where the target electronic circuit board card is positioned; after the target electronic circuit board card is arranged on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively; the target electronic circuit board card can move the target electronic circuit board card, so that a target welding spot on the target electronic circuit board card enters an observation region of the X-ray imager.
Further, in order to more comprehensively monitor the state of the electronic circuit board card in the welding process, the internal state of the welding point can be monitored. The internal state monitoring process can find the change process of the internal state when the solder and the welding point are actually electrically connected, and can be used for monitoring the actual welding and simulating the welding process. The monitoring of the internal state can be used for simulating and testing the welding plate card, exploring the influences of welding materials and other key factors related to welding in the welding process. In the application, a welding observation simulation device with an X-ray imager comprises a main controller, a temperature detection device, a temperature control device and the X-ray imager; the temperature field information acquired by the temperature detection device comprises temperature information of each welding point and each component of the target electronic circuit board card; the main controller receives the temperature control instruction and enables the temperature control device to adjust the temperature in the welding observation simulation device according to the temperature control instruction; and the X-ray imager acquires an internal image of the target electronic circuit board card in the welding observation simulation device in the welding process. And adjusting a temperature field change curve in the welding observation simulation device according to information displayed by the internal image, so that the temperature field change curve is adjusted to a state suitable for welding. The efficiency of the new electronic circuit board card of trial production is greatly improved, and the method is particularly suitable for the welding of small-batch customized electronic circuit board cards.
The foregoing is only illustrative of the present invention and is not to be construed as limiting the scope of the invention, and all equivalent structures or equivalent flow modifications which may be made by the teachings of the invention and the accompanying drawings or which may be directly or indirectly employed in other related art are within the scope of the invention.
Claims (10)
1. A welding observation simulation device with an X-ray imager is characterized in that,
Comprises a main controller, a temperature detection device, a temperature control device and an X-ray imager;
The temperature detection device, the temperature control device and the X-ray imager are respectively connected with the main controller through electrical signals and controlled by the main controller;
the temperature detection device is used for acquiring temperature field information in the welding observation simulation device, wherein the temperature field information comprises temperature information of each welding point and each component of the target electronic circuit board card;
the temperature control device is used for controlling the temperature in the welding observation simulation device;
the main controller receives the temperature control instruction and enables the temperature control device to adjust the temperature in the welding observation simulation device according to the temperature control instruction;
The X-ray imager is used for acquiring an internal image of the target electronic circuit board card in the welding process; the internal image of the target electronic circuit board card comprises internal images of all welding spots and all components on the target electronic circuit board card;
an X-ray imager continuously or periodically acquires the internal images of each welding point and each component on the target electronic circuit board card in the welding process;
the main controller obtains internal size change information and internal bubble state change information of each welding spot and each component of the target electronic circuit board card according to the internal images of each welding spot and each component of the target electronic circuit board card;
The main controller performs matching operation of internal images and temperature field information of the target electronic circuit board card according to the internal size change information and internal bubble state change information of each welding point and each component of the target electronic circuit board card and the temperature field information in the welding observation simulation device;
When the internal size change and/or internal bubble change of each welding spot and each component of the target electronic circuit board card are/is larger than a set change threshold value, the main controller calculates and obtains the target regulation and control temperature of the temperature field, and outputs a temperature regulation and control instruction to the temperature control device, so that the temperature control device regulates the temperature in the welding observation simulation device to reach the target regulation and control temperature of the temperature field;
the device also comprises a 3D vision measuring instrument, wherein the 3D vision measuring instrument is used for continuously or periodically acquiring 3D measurement images of the target electronic circuit board card in the welding observation simulation device in the welding process;
the main controller obtains 3D measurement images of the target electronic circuit board card at a plurality of moments according to the 3D vision measuring instrument; calculating the dimensional change information of the target electronic circuit board; and outputting the dimensional change information of the target electronic circuit board; the dimension change information of the target electronic circuit board comprises dimension change information of each welding point and each component on the target electronic circuit board;
the 3D measurement image of the target electronic circuit board card obtained by the 3D vision measuring instrument comprises size information of the target electronic circuit board card in three axial directions of space; the dimensional change information of the target electronic circuit board comprises dimensional change information of three axial directions of space;
The accuracy range of the size in the 3D measurement image obtained by the 3D vision measuring instrument is 1-20 micrometers;
The high-speed camera device is used for acquiring external visual images of the target electronic circuit board card in the welding observation simulation device in the welding process; the external visual image information of the target electronic circuit board comprises images of all welding spots and all components on the target electronic circuit board;
The high-speed camera device is used for continuously acquiring external visual images of the target electronic circuit board card in the welding process; the main controller obtains external visual images of all welding spots and all components of the target electronic circuit board card at a plurality of moments according to the high-speed camera device; calculating the size change and the area change of each welding spot of the target electronic circuit board card, and calculating the size change and the state change of each component of the target electronic circuit board card;
the temperature control device comprises a temperature-adjustable hot air generator, a hot air channel and a hot air reflux channel; the temperature-adjustable hot air generator is connected with the main controller by an electric signal and is controlled by the main controller;
One end of the hot air channel is communicated with the internal space of the welding observation simulation device, and the other end of the hot air channel is communicated with the temperature-adjustable hot air generator; the hot air generator can output hot air with adjustable temperature, the hot air enters the welding observation simulation device through the hot air channel, and the hot air flows out of the welding observation simulation device and enters the hot air generator through the hot air return channel;
The temperature-adjustable hot air generator adopts nitrogen or air as an air source; and a micro oxygen analyzer is arranged on the hot air channel and/or the hot air reflux channel and is used for monitoring the oxygen content of the gas in the hot air channel and/or the hot air reflux channel.
2. The welding observation simulation apparatus with an X-ray imager according to claim 1, wherein,
A removable board card moving platform is arranged in the welding observation simulation device; after the target electronic circuit board card is arranged on the board card moving platform, the target electronic circuit board card can move along two mutually perpendicular directions along the board card moving platform respectively; and enabling a target welding spot on the target electronic circuit board card to enter an observation region of the X-ray imager.
3. A welding observation simulation apparatus with an X-ray imager according to claim 2, wherein,
The X-ray imager comprises an X-ray emitter and an X-ray receiver;
the X-ray emitter and the X-ray receiver are arranged in opposite directions, so that the target electronic circuit board card is positioned between the X-ray emitter and the X-ray receiver; x-rays emitted by the X-ray emitter can penetrate through the target electronic circuit board card to reach the X-ray receiver.
4. A welding observation simulation apparatus with an X-ray imager according to claim 3,
The box body is also included; the main controller is arranged outside the box body;
The temperature sensors in the temperature detection device are distributed in the box body, or the temperature sensors in the temperature detection device are arranged at the top of the box body;
The X-ray emitter is arranged below the board card moving platform, the X-ray receiver is arranged at the bottom of the top surface of the box body, X-rays emitted by the X-ray emitter sequentially penetrate through the board card moving platform and the target electronic circuit board card and enter the X-ray receiver, the X-ray receiver transmits the obtained X-ray feedback signals to the main controller, and the X-ray images of the target electronic circuit board card, namely the internal images of the target electronic circuit board card, are obtained through calculation;
When the X-ray imager is used, the target electronic circuit board can move on the board moving platform so as to obtain an internal image aiming at a single welding spot or a single component.
5. The welding observation simulation apparatus with an X-ray imager according to claim 1, wherein,
The welding observation simulation device with the X-ray imager is a vacuum welding observation simulation device;
the vacuum welding observation simulation device further comprises a vacuumizing channel and a vacuum pump;
the vacuum pump is used for pumping the internal space of the welding observation simulation device into a negative pressure vacuum state;
one end of the vacuumizing channel is communicated with the internal space of the welding observation simulation device, and the other end of the vacuumizing channel is communicated with the air extraction end of the vacuum pump.
6. The welding observation simulation apparatus with an X-ray imager according to claim 1, wherein,
The welding observation simulation device with the X-ray imager is a laser welding observation simulation device;
A removable board card moving platform is arranged in the internal space of the welding observation simulation device and is used for moving the position of the target electronic circuit board in the welding process;
after the target electronic circuit board card is mounted on the board card moving platform, the target electronic circuit board card can move along two or three mutually perpendicular directions along the board card moving platform respectively; exposing the welding spots on the target electronic circuit board card in a welding interval range of a laser welding effect;
The dimensions of the target electronic circuit board card that can follow the board card moving platform along three mutually perpendicular directions are 200mm, 200mm and 150 mm, respectively.
7. The welding observation simulation apparatus with an X-ray imager according to claim 1, wherein,
A display and a database are also arranged;
The database is connected with the main controller through electric signals and is used for storing the received internal image data and temperature field information data of the target electronic circuit board card;
The display is electrically connected with the main controller and used for displaying the internal image data and the temperature field information data.
8. A welding device is an SMT reflow welding device, which is characterized in that,
A welding observation simulation apparatus including the X-ray imager of any one of claims 1 to 7.
9. A welding observation simulation method is characterized in that,
A welding observation simulation apparatus based on the X-ray imager of any one of claims 1 to 7;
The method comprises the following steps:
step 1: in the welding process of the target electronic circuit board card, acquiring temperature field information in a welding observation simulation device, and acquiring temperature information of each welding point and each component of the target electronic circuit board card;
step 2: continuously or periodically acquiring internal images of a target electronic circuit board card in a welding observation simulation device in a welding process by using an X-ray imager;
Step 3: the main controller obtains the internal images of the target electronic circuit board card at a plurality of moments according to the X-ray imaging instrument,
Calculating the size change information of the target electronic circuit board card in the welding process; target electronic circuit board card dimension change information package
The method comprises the steps of including size change information of each welding spot and each component on a target electronic circuit board card;
Step 4: the main controller judges whether the size change of any appointed welding spot and/or each component on the target electronic circuit board exceeds a set threshold value, if the size change of any appointed welding spot and/or each component on the target electronic circuit board exceeds the set threshold value, a temperature adjusting control instruction is output, and the temperature controlling device executes the temperature adjusting control instruction to adjust the welding observation die
And (3) simulating the temperature in the device until the size change of any appointed welding spot and each component on the target electronic circuit board card is within a set threshold range, and recording the temperature at the moment as the target temperature.
10. The welding observation simulation method of claim 9, wherein,
Further comprising the step 5: and (3) recording the target temperature data obtained in the step (4) and outputting a reflow soldering target temperature curve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110444136.1A CN113059247B (en) | 2021-04-23 | 2021-04-23 | Welding observation simulation device and method with X-ray imager and welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110444136.1A CN113059247B (en) | 2021-04-23 | 2021-04-23 | Welding observation simulation device and method with X-ray imager and welding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113059247A CN113059247A (en) | 2021-07-02 |
| CN113059247B true CN113059247B (en) | 2024-07-12 |
Family
ID=76567500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110444136.1A Active CN113059247B (en) | 2021-04-23 | 2021-04-23 | Welding observation simulation device and method with X-ray imager and welding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113059247B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN215316173U (en) * | 2021-04-23 | 2021-12-28 | 深圳市华瑞自动化***有限公司 | Welding observation simulation device with X-ray imager and welding device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003275868A (en) * | 2002-01-15 | 2003-09-30 | Okuhara Electric Inc | Temperature data collecting program in reflow soldering apparatus and reflow soldering apparatus |
| CN103116374A (en) * | 2011-11-16 | 2013-05-22 | 西安中科麦特电子技术设备有限公司 | Temperature control system of reflow soldering machine |
| CN105583546A (en) * | 2016-03-16 | 2016-05-18 | 哈尔滨工业大学（威海） | Real-time monitoring device and method for simulated underwater welding droplet transfer |
| CN111438419A (en) * | 2020-04-16 | 2020-07-24 | 南京精益通信息技术有限公司 | Temperature control system and control method for electronic reflow soldering |
-
2021
- 2021-04-23 CN CN202110444136.1A patent/CN113059247B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN215316173U (en) * | 2021-04-23 | 2021-12-28 | 深圳市华瑞自动化***有限公司 | Welding observation simulation device with X-ray imager and welding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113059247A (en) | 2021-07-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5208528A (en) | Method for inspecting a populated printed circuit board, particularly for inspecting solder joints on the board and a system for working this method | |
| CN105547342B (en) | Industrial lens test device and method based on liquid crystal panel | |
| US11481887B2 (en) | Apparatuses and methods for warpage measurement | |
| JPH09166422A (en) | Device and method for inspecting bump junction | |
| JP2016036040A (en) | Probe device | |
| CN110211893A (en) | A kind of wafer test system and crystal round test approach | |
| JP2013164381A (en) | Alignment method of substrate inspection device, and substrate inspection device | |
| JP5138968B2 (en) | Pass / fail judgment device | |
| CN204287496U (en) | α, β surface contamination detection instrument automatic Verification/calibration/pick-up unit | |
| CN215316173U (en) | Welding observation simulation device with X-ray imager and welding device | |
| KR20010040998A (en) | Automatic inspection system with stereovision | |
| CN105424721B (en) | A kind of metal strain meter defect automatic checkout system | |
| CN215316174U (en) | Take welding of 3D vision measuring apparatu to observe analogue means and welding set | |
| CN114353676B (en) | Automatic measurement device for height of mounted chip and test method thereof | |
| US8836354B2 (en) | Apparatus for thermal testing of a printed circuit board | |
| US9743527B2 (en) | Stencil programming and inspection using solder paste inspection system | |
| JP2015148509A (en) | Quality control system and internal inspection device | |
| CN113059247B (en) | Welding observation simulation device and method with X-ray imager and welding device | |
| CN113059248B (en) | Welding observation simulation device and method with 3D vision measuring instrument and welding device | |
| CN114147239A (en) | SLM forming process parameter monitoring system | |
| KR20130094205A (en) | Method for manufacturing semiconductor device | |
| JP5825569B2 (en) | Alignment support apparatus and alignment support method for probe apparatus | |
| CN117665546A (en) | Automatic test method and system for PCBA (printed circuit board assembly) | |
| CN209057315U (en) | A kind of depth camera test device | |
| CN112393744A (en) | MEMS gyroscope online laser trimming system and method with frequency measurement function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |