CN113056093A - TFT circuit substrate production process - Google Patents
TFT circuit substrate production process Download PDFInfo
- Publication number
- CN113056093A CN113056093A CN202110256108.7A CN202110256108A CN113056093A CN 113056093 A CN113056093 A CN 113056093A CN 202110256108 A CN202110256108 A CN 202110256108A CN 113056093 A CN113056093 A CN 113056093A
- Authority
- CN
- China
- Prior art keywords
- base material
- transition metal
- thin layer
- metal thin
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Abstract
The invention relates to the technical field of circuit substrate production, and discloses a TFT circuit substrate production process, which comprises the following steps: selecting a substrate, wherein the substrate is made of glass or ceramic; carrying out surface treatment on the base material, and sputtering a transition metal thin layer on the surface of the base material by a vacuum sputtering method; pasting a high-resolution exposure dry film on the surface of the transition metal thin layer, and exposing a negative line pattern on the base material through an exposure machine; plating a circuit pattern on the base material through pulse plating, removing the exposure dry film, removing the transition metal thin layer formed by vacuum sputtering, and performing gold deposition or other protection treatment on the circuit surface on the base material; cutting the base material into a required size by laser to obtain a finished product; the substrate made of glass or ceramic material with good dimensional stability is selected, the circuit pattern is manufactured by adopting a vacuum sputtering method, the pattern precision is high, the glass or ceramic is used as the substrate, the heat generated by long-term work of the product can be effectively dissipated, and the service life of the product is prolonged.
Description
Technical Field
The invention relates to the technical field of circuit substrate production, in particular to a TFT circuit substrate production process.
Background
At present, with the refinement development of electronic products, the volume of the electronic products is required to be smaller and smaller, and in recent years, the Micro LED technology is developed, so that the LED backlight source is subjected to thinning, microminiaturization and arraying, 50-100 micrometers of LED units are required, and each pixel can be individually customized and individually driven to emit light like an OLED. The LED lamp not only inherits the characteristics of high efficiency, high brightness, high reliability, quick response time and the like of an inorganic LED, but also has the characteristics of self luminescence without a backlight source, small volume, light weight and thinness, and can easily realize the effect of energy conservation. Therefore, the precision requirement on the TFT plate is greatly improved, and 300-500 (even more) LED tiny crystal grains need to be welded on the TFT circuit substrate with the size of the nail cover.
For such a fine TFT substrate, if it is produced by using conventional FR-4, aluminum substrate, etc., firstly, the thermal expansion coefficient of the base material is relatively large, and the dimensional stability is not good, and on the other hand, it is difficult to manufacture such a fine circuit by using the conventional subtractive process.
Disclosure of Invention
The invention aims to provide a TFT circuit substrate production process, and aims to solve the problem that a TFT circuit substrate produced in the prior art is low in precision.
The invention is realized in this way, a TFT circuit substrate production process, including the following steps:
selecting a base material, wherein the base material is made of glass or ceramic;
carrying out surface treatment on the base material, and sputtering a transition metal thin layer on the surface of the base material by a vacuum sputtering method;
pasting a high-resolution exposure dry film on the surface of the transition metal thin layer, and exposing a negative line pattern on the base material through an exposure machine;
plating a circuit pattern on the base material through pulse plating, removing the exposure dry film, removing the transition metal thin layer formed by vacuum sputtering, and performing gold deposition or other protection treatment on the circuit surface on the base material;
and cutting the base material into required size by laser to obtain the finished product.
Compared with the prior art, the TFT circuit substrate production process provided by the invention selects the base material made of glass or ceramic material with good dimensional stability, and simultaneously adopts the vacuum sputtering method to produce the circuit pattern, so that the pattern precision is high, and the glass or ceramic is used as the base material, so that the heat generated by long-term work of the product can be effectively dissipated, and the service life of the product is prolonged.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
A TFT circuit substrate production process comprises the following steps:
selecting a base material, wherein the base material is made of glass or ceramic;
carrying out surface treatment on the base material, and sputtering a transition metal thin layer on the surface of the base material by a vacuum sputtering method;
pasting a high-resolution exposure dry film on the surface of the transition metal thin layer, and exposing a negative line pattern on the base material through an exposure machine;
plating a circuit pattern on the base material through pulse plating, removing the exposure dry film, removing the transition metal thin layer formed by vacuum sputtering, and performing gold deposition or other protection treatment on the circuit surface on the base material;
and cutting the base material into required size by laser to obtain the finished product.
According to the TFT circuit substrate production process, the substrate made of glass or ceramic materials with good dimensional stability is selected, the circuit pattern is manufactured by adopting a vacuum sputtering method, the pattern precision is high, the glass or ceramic is used as the substrate, heat generated by long-term work of a product can be effectively dissipated, and the service life of the product is prolonged.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (1)
1. A TFT circuit substrate production process is characterized by comprising the following steps:
selecting a base material, wherein the base material is made of glass or ceramic;
carrying out surface treatment on the base material, and sputtering a transition metal thin layer on the surface of the base material by a vacuum sputtering method;
pasting a high-resolution exposure dry film on the surface of the transition metal thin layer, and exposing a negative line pattern on the base material through an exposure machine;
plating a circuit pattern on the base material through pulse plating, removing the exposure dry film, removing the transition metal thin layer formed by vacuum sputtering, and performing gold deposition or other protection treatment on the circuit surface on the base material;
and cutting the base material into required size by laser to obtain the finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110256108.7A CN113056093A (en) | 2021-03-09 | 2021-03-09 | TFT circuit substrate production process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110256108.7A CN113056093A (en) | 2021-03-09 | 2021-03-09 | TFT circuit substrate production process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113056093A true CN113056093A (en) | 2021-06-29 |
Family
ID=76510671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110256108.7A Pending CN113056093A (en) | 2021-03-09 | 2021-03-09 | TFT circuit substrate production process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113056093A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677101A (en) * | 2021-08-23 | 2021-11-19 | 拓米(成都)应用技术研究院有限公司 | Manufacturing method of PCB (printed circuit board) with ultrathin glass substrate and manufacturing method of multilayer PCB |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335743A (en) * | 2000-07-26 | 2002-02-13 | 赵远涛 | Technological process of making printed circuit board |
| US20180124923A1 (en) * | 2016-05-13 | 2018-05-03 | Suzhou Weipeng Electrical Technology Co.,Ltd. | Method for manufacturing an ultra-thin metal layer printed circuit board |
| CN109041425A (en) * | 2018-07-06 | 2018-12-18 | 盐城维信电子有限公司 | A kind of production method and products thereof of COF double-faced flexible substrate fine-line |
| CN109561585A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | Ceramic base circuit board preparation process |
| CN110352483A (en) * | 2018-02-02 | 2019-10-18 | 金柏科技有限公司 | The method for manufacturing fine spacing cabling using the modified fully-additive process of ultra-fine PAA |
| CN111200903A (en) * | 2020-03-02 | 2020-05-26 | 厦门弘信电子科技集团股份有限公司 | Method for manufacturing double-sided board of fine circuit |
| CN112119499A (en) * | 2018-04-05 | 2020-12-22 | 康宁公司 | System and method for reducing substrate surface damage during via formation |
-
2021
- 2021-03-09 CN CN202110256108.7A patent/CN113056093A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335743A (en) * | 2000-07-26 | 2002-02-13 | 赵远涛 | Technological process of making printed circuit board |
| US20180124923A1 (en) * | 2016-05-13 | 2018-05-03 | Suzhou Weipeng Electrical Technology Co.,Ltd. | Method for manufacturing an ultra-thin metal layer printed circuit board |
| CN109561585A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | Ceramic base circuit board preparation process |
| CN110352483A (en) * | 2018-02-02 | 2019-10-18 | 金柏科技有限公司 | The method for manufacturing fine spacing cabling using the modified fully-additive process of ultra-fine PAA |
| CN112119499A (en) * | 2018-04-05 | 2020-12-22 | 康宁公司 | System and method for reducing substrate surface damage during via formation |
| CN109041425A (en) * | 2018-07-06 | 2018-12-18 | 盐城维信电子有限公司 | A kind of production method and products thereof of COF double-faced flexible substrate fine-line |
| CN111200903A (en) * | 2020-03-02 | 2020-05-26 | 厦门弘信电子科技集团股份有限公司 | Method for manufacturing double-sided board of fine circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677101A (en) * | 2021-08-23 | 2021-11-19 | 拓米(成都)应用技术研究院有限公司 | Manufacturing method of PCB (printed circuit board) with ultrathin glass substrate and manufacturing method of multilayer PCB |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210629 |
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| RJ01 | Rejection of invention patent application after publication |