CN109561585A - Ceramic base circuit board preparation process - Google Patents
Ceramic base circuit board preparation process Download PDFInfo
- Publication number
- CN109561585A CN109561585A CN201710892011.9A CN201710892011A CN109561585A CN 109561585 A CN109561585 A CN 109561585A CN 201710892011 A CN201710892011 A CN 201710892011A CN 109561585 A CN109561585 A CN 109561585A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- copper
- ceramic
- layer
- ceramic base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to a kind of ceramic base circuit board preparation processes, including the following steps: S1, production ceramic substrate；S2, it drills, is formed for copper electroplating layer with the hole of turning circuit plate on ceramic substrate；S3, in ceramic base plate surface one layer of titanium layer of formation, copper heavy in order to subsequent S4 step, layers of copper can preferably be attached to the surface of the ceramic substrate；S4, copper-coating is carried out to ceramic substrate, in ceramic base plate surface and the heavy upper thin copper of a stratification of hole wall, ceramic substrate is made to have electric conductivity；S5, development and etching are exposed to the ceramic substrate, are removed layers of copper extra on ceramic substrate and titanium layer using etching solution, the ceramic substrate is ALN ceramic substrate or AL2O3Ceramic substrate.
Description
Technical field
The present invention relates to wiring board arts, and in particular to a kind of ceramics base circuit board preparation process.
Background technique
With development in science and technology advance by leaps and bounds and pursuit of the mankind to higher quality of life, so for many electronic products
Application characteristic tend to extremely strict requirements, nowadays people use the time of electronic product increasingly longer daily, electronic product
Heating problem be always with for insoluble problem, and electronic product is when overlong time using can make product temperature excessively high,
Excessively high temperature can make wiring board and internal element in product be affected, can not normal use；It has now been found that ceramic base
Plate wiring board have high temperature resistant, electrical insulating property are high, dielectric constant and dielectric loss are low, thermal conductivity is big, chemical stability is good, with member
The major advantages such as the similar thermal expansion coefficient of part are adapted to the hot environment generated when product uses for a long time.
Summary of the invention
Based on this, it is necessary in view of the above problems, providing a kind of ceramic base circuit board preparation process, including the following steps:
S1, production ceramic substrate；
S2, it drills, is formed for copper electroplating layer with the hole of turning circuit plate on ceramic substrate；
S3, in ceramic base plate surface one layer of titanium layer of formation, copper heavy in order to subsequent S4 step, layers of copper can be preferably attached to
The surface of the ceramic substrate；
S4, copper-coating is carried out to ceramic substrate, in ceramic base plate surface and the heavy upper thin copper of a stratification of hole wall, makes ceramic base
Plate has electric conductivity；
S5, development and etching are exposed to the ceramic substrate, using etching solution by layers of copper and titanium extra on ceramic substrate
Layer removal.
Wherein, when heavy copper, it is difficult to directly sink copper in the surface chemistry of ceramic substrate to form chemical layers of copper, therefore in heavy copper
Preceding one layer of titanium layer of surface sputter needed in ceramic substrate, so that copper can pass through ceramic base plate surface in heavy copper step
Titanium layer electroless copper plating forms conductive layer to the surface of ceramic substrate.
The exposure development and the method for etching are to form photoetching on the surface far from the ceramic substrate of the layers of copper
Glue-line forms a patterned mask layer on the surface far from the layers of copper of the photoresist layer, leads to after exposed machine exposure
Developing solution development is crossed, the developing section is etched to form patterned mask layer by etching solution, mask layer can be protected
The layers of copper that is entirely covered is protected from the etching of etching solution, Na is preferably used in the developing solution2CO3Solution.
Preferably, the ceramic substrate is ALN ceramic substrate or AL2O3Ceramic substrate.
ALN ceramic substrate, thermal conductivity is high, and the coefficient of expansion is low, and intensity is high, and high temperature resistant is resistant to chemical etching, and resistivity is high, is situated between
Electrical loss is small, has excellent heat resistance and thermal diffusivity using the ceramic base circuit board that ALN ceramic substrate is made；AL2O3Pottery
Ceramic chip hardness is big, wearability is fabulous, light-weight, uses AL2O3The ceramic base circuit board wearability that ceramic substrate is made
It is good, light-weight, so as to mitigate product weight, convenient for carrying and using for electronic product.The present invention can also be using addition
The ceramic substrate of other packing materials.
Preferably, it is bored on PCB ceramic substrate when step S2 drills using the laser of short pulse and high-peak power
Hole.
Ceramic substrate hardness is big, carries out drilling processing drilling machine easy to damage, and ceramic substrate toughness using common drilling machine
It is low, when machine drilling ceramic substrate easy to damage, and the laser of short pulse and high-peak power can achieve high density high-energy
Purpose irradiates ceramic substrate using the laser beam of high density high-energy, ceramic substrate can be made to be heated to vapourizing temperature quickly,
Evaporation forms hole, is suitble to carry out drilling processing on the surface of high hardness material.
Preferably, step S3 uses the method for sputter in one layer of titanium layer of ceramic base plate surface sputter under vacuum conditions.
Under vacuum conditions, inert gas appropriate is passed through as medium, is leaned on inert gas accelerating impact ceramic substrate, is made
The atom of ceramic base plate surface is knocked out, and forms plated film on surface, then titanium is plated on to the surface of ceramic substrate；
For vacuum splashing and plating film forming thickness between 0.04-0.18 microns, sputtered layer adhesive force is strong, not easily to fall off, and film layer compactness is high, is not easy
It is corroded.
Preferably, the etching process is first to remove heavy layers of copper, then removes titanium layer again, wherein the etching solution of removal titanium layer
For hydrofluoric acid-nitric acid mixed solution or hydrofluoric acid-hydrogen peroxide solution.
Hydrofluoric acid-nitric acid mixed solution or hydrofluoric acid-hydrogen peroxide solution can be etched titanium, and etch
Speed is fast, meanwhile, hydrofluoric acid-nitric acid mixed solution or hydrofluoric acid-hydrogen peroxide solution stable structure are not easily decomposed, can be with
Carry out etching process steadily.
Preferably, further include the steps that cleaning the ceramic substrate with cleaning solution after step S1.
To obtain the etched figure of good quality, need ceramic base plate surface non-oxidation layer, greasy dirt, dust, finger mark and
Other dirts.Therefore it needs to clean ceramic substrate.
Further, the cleaning solution is acid-base solution or deionized water.
Acid-base solution or deionized water can remove the oxide layer of ceramic base plate surface
The principle of the present invention, effect are further illustrated below with reference to above-mentioned technical proposal:
1. being drilled on PCB ceramic substrate when drilling using the laser of short pulse and high-peak power.Ceramic substrate hardness
Greatly, drilling processing drilling machine easy to damage is carried out using common drilling machine, and ceramic substrate toughness is low, when machine drilling pottery easy to damage
Porcelain substrate, and the laser of short pulse and high-peak power can achieve the purpose of high density high-energy, utilize high density high-energy
Laser beam irradiate ceramic substrate, ceramic substrate can be made to be heated to vapourizing temperature quickly, evaporation forms hole, is suitble in height
The surface of hardened material carries out drilling processing.
2. further including the steps that cleaning the ceramic substrate with cleaning solution.To obtain the etch figures(s) of good quality
Shape needs ceramic base plate surface non-oxidation layer, greasy dirt, dust, finger mark and other dirts.Therefore need to ceramic substrate into
Row cleaning.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, below in conjunction with embodiment, the invention will be described in further detail:
Embodiment 1
A kind of ceramics base circuit board preparation process, including the following steps:
S1, production ceramic substrate；
S2, ceramic substrate is cleaned using acid-base solution or deionized water；
S3, it is drilled on PCB ceramic substrate on ceramic substrate using the laser of short pulse and high-peak power, is formed and used
In copper electroplating layer with the hole of turning circuit plate；
S4, under vacuum conditions, using the method for sputter in one layer of titanium layer of ceramic base plate surface sputter, in order to subsequent S4 step
Layers of copper can preferably be attached to the surface of the ceramic substrate when rapid heavy copper；
S5, copper-coating is carried out to ceramic substrate, in ceramic base plate surface and the heavy upper thin copper of a stratification of hole wall, makes ceramic base
Plate has electric conductivity；
S6, development and etching are exposed to the ceramic substrate, then remove extra layers of copper and titanium layer, wherein titanium layer uses
Hydrofluoric acid-nitric acid mixed solution or hydrofluoric acid-hydrogen peroxide solution removal.
Embodiment 2
S1, production ceramic substrate；
S2, it is drilled on PCB ceramic substrate on ceramic substrate using the laser of short pulse and high-peak power, is formed and used
In copper electroplating layer with the hole of turning circuit plate；
S3, under vacuum conditions, using the method for sputter in one layer of titanium layer of ceramic base plate surface sputter, in order to subsequent S4 step
Layers of copper can preferably be attached to the surface of the ceramic substrate when rapid heavy copper；
S4, copper-coating is carried out to ceramic substrate, in ceramic base plate surface and the heavy upper thin copper of a stratification of hole wall, makes ceramic base
Plate has electric conductivity；
S5, development and etching are exposed to the ceramic substrate, then remove extra layers of copper and titanium layer, wherein titanium layer uses
Hydrofluoric acid-nitric acid mixed solution or hydrofluoric acid-hydrogen peroxide solution removal.
Embodiment 3
S1, production ceramic substrate；
S2, it drills, is formed for copper electroplating layer with the hole of turning circuit plate on ceramic substrate；
S3, under vacuum conditions, using the method for sputter in one layer of titanium layer of ceramic base plate surface sputter, in order to subsequent S4 step
Layers of copper can preferably be attached to the surface of the ceramic substrate when rapid heavy copper；
S4, copper-coating is carried out to ceramic substrate, in ceramic base plate surface and the heavy upper thin copper of a stratification of hole wall, makes ceramic base
Plate has electric conductivity；
S5, development and etching are exposed to the ceramic substrate, then remove extra layers of copper and titanium layer, wherein titanium layer uses
Hydrofluoric acid-nitric acid mixed solution or hydrofluoric acid-hydrogen peroxide solution removal.
Embodiment 4
S1, production ceramic substrate；
S2, it drills, is formed for copper electroplating layer with the hole of turning circuit plate on ceramic substrate；
S3, in ceramic base plate surface one layer of titanium layer of formation, copper heavy in order to subsequent S4 step, layers of copper can be preferably attached to
The surface of the ceramic substrate；
S4, copper-coating is carried out to ceramic substrate, in ceramic base plate surface and the heavy upper thin copper of a stratification of hole wall, makes ceramic base
Plate has electric conductivity；
S5, development and etching are exposed to the ceramic substrate, then remove extra layers of copper and titanium layer, wherein titanium layer uses
Hydrofluoric acid-nitric acid mixed solution or hydrofluoric acid-hydrogen peroxide solution removal.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (7)
1. a kind of ceramics base circuit board preparation process, characterized in that it comprises the following steps:
S1, production ceramic substrate；
S2, it drills, is formed for copper electroplating layer with the hole of turning circuit plate on ceramic substrate；
S3, in ceramic base plate surface one layer of titanium layer of formation, copper heavy in order to subsequent S4 step, layers of copper can be preferably attached to
The surface of the ceramic substrate；
S4, copper-coating is carried out to ceramic substrate, in ceramic base plate surface and the heavy upper thin copper of a stratification of hole wall, makes ceramic base
Plate has electric conductivity；
S5, development and etching are exposed to the ceramic substrate, using etching solution by layers of copper and titanium extra on ceramic substrate
Layer removal.
2. a kind of ceramic base circuit board preparation process according to claim 1, which is characterized in that told ceramic substrate is
ALN ceramic substrate or AL2O3Ceramic substrate.
3. a kind of ceramic base circuit board preparation process according to claim 1, which is characterized in that step S2 is utilized when drilling
The laser of short pulse and high-peak power drills on PCB ceramic substrate.
4. a kind of ceramic base circuit board preparation process according to claim 1, which is characterized in that step S3 is in vacuum environment
The lower method using sputter is in one layer of titanium layer of ceramic base plate surface sputter.
5. a kind of ceramic base circuit board preparation process according to claim 1, which is characterized in that the etching process is first
Heavy layers of copper is removed, then removes titanium layer again, wherein the etching solution of removal titanium layer is hydrofluoric acid-nitric acid mixed solution or hydrofluoric acid-
Hydrogen peroxide solution.
6. a kind of ceramic base circuit board preparation process according to claim 1, which is characterized in that further include after step S1
The step of ceramic substrate is cleaned with cleaning solution.
7. a kind of ceramic base circuit board preparation process according to claim 6, which is characterized in that the cleaning solution is soda acid
Solution or deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892011.9A CN109561585A (en) | 2017-09-27 | 2017-09-27 | Ceramic base circuit board preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892011.9A CN109561585A (en) | 2017-09-27 | 2017-09-27 | Ceramic base circuit board preparation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109561585A true CN109561585A (en) | 2019-04-02 |
Family
ID=65863811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710892011.9A Pending CN109561585A (en) | 2017-09-27 | 2017-09-27 | Ceramic base circuit board preparation process |
Country Status (1)
| Country | Link |
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| CN (1) | CN109561585A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056093A (en) * | 2021-03-09 | 2021-06-29 | 深圳市昱安旭瓷电子科技有限公司 | TFT circuit substrate production process |
| CN113225941A (en) * | 2021-05-12 | 2021-08-06 | 四川锐宏电子科技有限公司 | Preparation process of blind hole multilayer high-density circuit board |
| CN113789513A (en) * | 2021-08-19 | 2021-12-14 | 上海富乐华半导体科技有限公司 | Ceramic substrate surface copper plating method based on positive and negative pulses |
| CN114096056A (en) * | 2021-12-06 | 2022-02-25 | 福莱盈电子股份有限公司 | Method for manufacturing PCB (printed Circuit Board) by using glass plate |
| CN115279042A (en) * | 2022-07-26 | 2022-11-01 | 江苏富乐华半导体科技股份有限公司 | Preparation method of chemically nickel-plated gold DPC ceramic substrate |
| CN116477963A (en) * | 2023-04-18 | 2023-07-25 | 福建华清电子材料科技有限公司 | Method for producing ceramic copper-clad substrate with pins by using porous ceramic |
| CN117488242A (en) * | 2023-11-10 | 2024-02-02 | 江苏富乐华功率半导体研究院有限公司 | Method for realizing through hole metallization of ceramic substrate by magnetron sputtering |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056093A (en) * | 2021-03-09 | 2021-06-29 | 深圳市昱安旭瓷电子科技有限公司 | TFT circuit substrate production process |
| CN113225941A (en) * | 2021-05-12 | 2021-08-06 | 四川锐宏电子科技有限公司 | Preparation process of blind hole multilayer high-density circuit board |
| CN113789513A (en) * | 2021-08-19 | 2021-12-14 | 上海富乐华半导体科技有限公司 | Ceramic substrate surface copper plating method based on positive and negative pulses |
| CN114096056A (en) * | 2021-12-06 | 2022-02-25 | 福莱盈电子股份有限公司 | Method for manufacturing PCB (printed Circuit Board) by using glass plate |
| CN114096056B (en) * | 2021-12-06 | 2022-10-14 | 福莱盈电子股份有限公司 | Method for manufacturing PCB (printed Circuit Board) by using glass plate |
| CN115279042A (en) * | 2022-07-26 | 2022-11-01 | 江苏富乐华半导体科技股份有限公司 | Preparation method of chemically nickel-plated gold DPC ceramic substrate |
| CN116477963A (en) * | 2023-04-18 | 2023-07-25 | 福建华清电子材料科技有限公司 | Method for producing ceramic copper-clad substrate with pins by using porous ceramic |
| CN116477963B (en) * | 2023-04-18 | 2023-12-26 | 福建华清电子材料科技有限公司 | Method for producing ceramic copper-clad substrate with pins by using porous ceramic |
| CN117488242A (en) * | 2023-11-10 | 2024-02-02 | 江苏富乐华功率半导体研究院有限公司 | Method for realizing through hole metallization of ceramic substrate by magnetron sputtering |
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Application publication date: 20190402 |
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