CN112986328A - Detection method for air gap cracks or micro-debonding of hard epoxy composite insulator - Google Patents
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Abstract
The invention relates to a method for detecting air gap cracks or micro-debonding of a hard epoxy composite insulator, which comprises the following steps: heating the hard epoxy composite insulator through a thermal excitation source, and acquiring temperature data of the surface of the hard epoxy composite insulator at different moments through a thermal infrared imager; performing anti-aliasing filtering and A/D sampling on the acquired temperature data to obtain discrete temperature data; performing Fourier transform on the discrete temperature data; filtering the temperature data after Fourier transform; adjusting the precision multiple of the temperature data, and resampling the filtered temperature data; carrying out frequency shift transformation on the resampled temperature data; adjusting the frequency and the phase of the temperature data after the frequency shift conversion; and judging whether the hard epoxy composite insulator has the defect of air gap crack or micro-debonding, and if so, calculating the defect depth. The method has the advantages of no excessive iterative calculation, high calculation efficiency, elimination of most noise and improvement of data accuracy.
Description
Technical Field
The application relates to the technical field of nondestructive testing of power equipment, in particular to a method for detecting air gap cracks or micro-debonding of a hard epoxy composite insulator.
Background
Since the beginning of the 20 th century and 70 th century in China, the composite insulator is more and more widely applied due to the advantages of small volume, light weight, high mechanical strength, strong anti-pollution flashover capability, excellent hydrophobicity and hydrophobic migration performance and the like. However, when the composite insulator has defects such as debonding between the sheath and the core rod, and air holes or faults inside the sheath due to manufacturing processes, aging in field operation, and the like, the composite insulator has problems such as interface breakdown, flashover, aging of silicone rubber, reduction of mechanical strength, brittle failure of the core rod, and the like, and these hidden defects can pose a great threat to the safe operation of the power grid. The structure of the composite insulator has particularity, and an interface positioned in the insulator is arranged between two layers of insulating materials. In the production process or long-term operation, the insulation performance of each part of an internal interface is difficult to ensure to be completely excellent, internal defects are gradually enlarged from nothing to further under the action of water vapor, an electric field and leakage current, defects such as air hole gaps or internal discharge ablation channels are gradually caused, and the defects are further developed and even serious consequences such as insulator breakdown or breakage and string dropping can occur.
For the detection of the interface performance of the composite insulator, the most common method at present is a boiling method, for example, a method for evaluating the interface performance of the composite insulator based on the change rate of leakage current disclosed in chinese patent CN109581105A, which mainly includes the steps of sampling, direct current leakage current test before boiling, leakage current test after boiling, analysis of the change rate of leakage current, evaluation of the interface performance, and the like. However, the composite insulator may be damaged by the boiling process, which requires water to intrude into the gaps at the interface of the composite insulator, and the process takes a long time.
Aiming at the problems of certain destructiveness and long period existing in the process of detecting the interface performance of the hard epoxy composite insulator by a boiling method, Chinese patent CN108693453A discloses an active infrared thermal image detection device and method for internal defects of the composite insulator, wherein the device comprises a modulated light radiation thermal excitation loading device, an infrared thermal image acquisition device and a control and data processing analysis device; during detection, the optical radiation-modulatable thermal excitation loading device is controlled to apply controllable thermal excitation to the composite insulator, so that dynamic temperature field data are formed on the surface of the composite insulator; controlling an infrared thermal image acquisition device to acquire dynamic temperature field data; and identifying and analyzing the dynamic temperature field data by using a control and data processing and analyzing device to obtain the specific condition of the internal defects of the composite insulator.
The infrared thermal image detection method is adopted to realize nondestructive detection, but the acquired temperature data is large in noise and data; the temperature data is noisy, so that errors generated when the defect depth and the defect position are finally calculated are large, and the calculation speed is slow due to the large data.
Disclosure of Invention
The invention provides a detection method for air gap cracks or micro-debonding of a hard epoxy composite insulator, and aims to solve the problems of low calculation speed and large error in calculating defect positions and depths caused by huge acquired temperature data and large noise in the existing infrared thermography detection method.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
the invention relates to a method for detecting air gap cracks or micro-debonding of a hard epoxy composite insulator, which comprises the following steps:
1) heating the hard epoxy composite insulator through a thermal excitation source, and acquiring temperature data of the surface of the hard epoxy composite insulator at different moments through a thermal infrared imager;
2) performing anti-aliasing filtering and A/D sampling on the acquired temperature data to obtain discrete temperature data;
3) performing Fourier transform on the discrete temperature data;
4) filtering the temperature data after Fourier transform;
5) adjusting the precision multiple of the temperature data, and resampling the filtered temperature data;
6) carrying out frequency shift transformation on the resampled temperature data;
7) adjusting the frequency and the phase of the temperature data after the frequency shift conversion;
8) and (3) judging whether the hard epoxy composite insulator has the defect of air gap crack or micro-debonding based on the temperature data after the frequency and the phase are adjusted, if the defect does not exist, rotating the hard epoxy composite insulator, and repeating the steps 1) -8) until the hard epoxy composite insulator rotates for 360 degrees or the defect is found, if the defect is not found after rotating for 360 degrees, indicating that the hard epoxy composite insulator is intact, and if the defect is found, calculating the defect depth.
Preferably, the fourier transform of the discrete temperature data in step 3) is to adjust the starting point of the sampling frequency band by using the frequency shift property of the discrete fourier transform, so that the starting point of the frequency band falls on the starting point of the frequency domain coordinate, that is, the center frequency is shifted to the frequency zero, and the formula after the fourier transform is as follows:
X(n)＝X0(n)e-j2πf1/f2＝X0cos(2πnf1/f2)-jX0sin(2πnf1/f2)(n＝0,1,2…N-1)(1)
in the formula, X (N) is temperature data after fourier transform, X0(N) is discrete temperature data, f1 is center frequency, f2 is sampling frequency, j is complex sign, e is natural constant, and N is sampling point number.
Preferably, in the step 4), the temperature data after fourier transform is filtered, and a calculation formula of the temperature data after filtering is:
Y(n)＝X(n)H(n)＝X0(n+f1/f2)H(n)(n＝0,1,2…N-1) (2)
in the formula, y (n) represents temperature data after filtering, and h (n) represents a frequency response function of an ideal filter.
Preferably, the precision multiple of the temperature data is adjusted in step 5), and the formula for resampling the filtered temperature data is as follows:
Z(n)＝X(En/D)(n＝0,1,2…N-1) (3)
where D is the precision multiple before adjustment, E is the precision multiple after adjustment, and z (n) is the signal after resampling.
Preferably, the formula for performing frequency shift transformation on the resampled temperature data in the step 6) is as follows:
in the formula, g (n) represents data obtained by frequency shift conversion, and t ═ f1/f2 represents the center shift of the frequency.
Preferably, the formula for adjusting the frequency and the phase of the temperature data after frequency shift conversion in step 7) is as follows:
wherein X (k) is the adjusted temperature data.
Preferably, the basis for judging whether the hard epoxy composite insulator has the air gap crack or the micro-debonding defect in the step 8) is to observe whether the surface temperatures of different regions have a temperature difference, if so, it indicates that the defect exists, and if not, it indicates that the defect does not exist.
Preferably, the calculation formula for calculating the defect depth h in the step 8) is as follows:
wherein Δ Tmax represents the maximum surface temperature difference, q0The initial energy of the thermal wave pulse is rho, density, c specific heat capacity and e, and is a natural constant.
Preferably, in the step 1), when the hard epoxy composite insulator is heated by the thermal excitation source, the upper and lower sections of the hard epoxy composite insulator are heated by the two thermal excitation sources respectively.
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
according to the invention, the acquired temperature data is subjected to anti-aliasing filtering, A/D sampling, Fourier transformation, filtering processing, resampling, frequency shift transformation, frequency and phase adjustment and the like, and finally the depth of the defect is calculated according to the processed temperature data, so that the whole process has no excessive iterative calculation, and the calculation efficiency is high; most of noise is eliminated by the processed temperature data, the accuracy of the data is improved, and the real situation of the defects can be reflected better after calculation.
Drawings
FIG. 1 is a flow chart of the method for detecting air gap cracks or micro-debonding of a hard epoxy composite insulator according to the present invention;
FIG. 2 is a block diagram of an infrared thermographic inspection system according to the present invention;
FIG. 3 is a flow chart of data processing according to the present invention.
Detailed Description
For further understanding of the present invention, the present invention will be described in detail with reference to examples, which are provided for illustration of the present invention but are not intended to limit the scope of the present invention.
Referring to the attached drawing 1, the method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator, which is disclosed by the invention, comprises the following steps of:
1) referring to the attached figure 2, the hard epoxy composite insulator is heated by a thermal excitation source, and temperature data of the surface of the hard epoxy composite insulator at different moments are collected by a thermal infrared imager, and the method specifically comprises the following steps:
1.1) selection of thermal excitation source: aiming at different detection materials, the selection of thermal excitation sources is different, the invention detects the air gap defect inside the hardware fitting, so that a pulse flash lamp is adopted as the thermal excitation source;
1.2) setting of thermal excitation source: the method comprises the following steps that the position relation between defects and a thermal excitation source influences temperature distribution data detected by an infrared thermal imager, when the thermal excitation source adopts multiple light sources, the focusing position and the focusing area of the thermal excitation source influence the thermal excitation and detection effects of a sample, the focusing position of the thermal excitation source can be obtained through calculation of the light path of the thermal excitation source and has a direct relation with the set height and the irradiation angle of the thermal excitation source, and meanwhile, the focusing position can be directly observed from the infrared thermal imager, when a designed detection area appears in the center of a temperature rise area and is about 2/3 of the temperature rise area, the surface of the sample can be considered to be uniformly thermally excited, the two thermal excitation sources respectively heat the upper section and the lower section of a hard epoxy composite insulator, so that the uniformity of the thermal excitation is ensured, and finally the construction of a detection platform is realized;
1.3) setting of excitation time: the method comprises the steps of exciting time, wherein the exciting time of a sample can influence the detection effect, the thermal exciting time is too short, the defect information left by removing a background is not prominent enough, the existence of the defect can not be observed from an image, the thermal exciting time is too long, the temperature difference of each part on the surface of the sample is too large, the defect information is submerged, and finally the defect information can not be obtained, and for the method, when a pulse flash lamp is adopted as a thermal exciting source, the general exciting time can be set to be 30-60 s;
1.4) starting a thermal excitation source, thermally exciting the hard epoxy composite insulator sample by the thermal excitation source according to set time, and directly opening the thermal infrared imager to collect temperature data when excitation is finished so as to avoid missing information.
After the temperature data is acquired, the data is processed and analyzed, and the specific steps are as shown in fig. 3:
2) and performing anti-aliasing filtering and A/D sampling on the acquired temperature data to obtain discrete temperature data.
3) Performing Fourier transform on discrete temperature data, adjusting the starting point of a sampling frequency band by using the frequency shift property of the discrete Fourier transform, and enabling the starting point of the frequency band to fall on the starting point of a frequency domain coordinate, namely, enabling the center frequency to move to a frequency zero point, wherein the formula after the Fourier transform is as follows:
X(n)＝X0(n)e-j2πf1/f2＝X0cos(2πnf1/f2)-jX0sin(2πnf1/f2)(n＝0,1,2…N-1)(1)
in the formula, X (N) is temperature data after fourier transform, X0(N) is discrete temperature data, f1 is center frequency, f2 is sampling frequency, j is complex sign, e is natural constant, and N is sampling point number.
4) Filtering the temperature data after Fourier transform, wherein a calculation formula of the temperature data after filtering is as follows:
Y(n)＝X(n)H(n)＝X0(n+f1/f2)H(n)(n＝0,1,2…N-1) (2)
in the formula, y (n) represents temperature data after filtering, and h (n) represents a frequency response function of an ideal filter.
5) Adjusting the precision multiple of the temperature data, and resampling the filtered temperature data, wherein the formula is as follows:
Z(n)＝X(En/D)(n＝0,1,2…N-1) (3)
where D is the precision multiple before adjustment, E is the precision multiple after adjustment, and z (n) is the signal after resampling.
6) Carrying out frequency shift conversion on the resampled temperature data, wherein the formula for carrying out frequency shift conversion on the resampled temperature data is as follows:
in the formula, g (n) represents data obtained by frequency shift conversion, and t ═ f1/f2 represents the center shift of the frequency.
7) Adjusting the frequency and the phase of the temperature data after frequency shift conversion, wherein the formula is as follows:
wherein X (k) is the adjusted temperature data.
8) Referring to fig. 1, judging whether the noise of the adjusted temperature data is too large and whether the thermal imaging image is clear, if the image is fuzzy or the data noise is too large, adjusting the parameters (including time) of thermal excitation, re-acquiring data, and returning to the step 2) for data processing; if the thermal imaging image is clear and the noise of the temperature data is low, judging whether the hard epoxy composite insulator has the defect of air gap crack or micro-debonding based on the temperature data after the frequency and the phase are adjusted, wherein the basis for judging whether the defect exists is as follows: observing whether the surface temperatures of different areas have temperature differences, if so, indicating that defects exist, and if not, indicating that no defects exist; if no defect exists, after the hard epoxy composite insulator is rotated, repeating the steps 1) to 8) until the hard epoxy composite insulator is rotated by 360 degrees or a defect is found, if no defect is found after the hard epoxy composite insulator is rotated by 360 degrees, the hard epoxy composite insulator is in good condition, if a defect is found, the defect depth is calculated, and the calculation formula for calculating the defect depth h is as follows:
wherein Δ Tmax represents the maximum surface temperature difference, q0The initial energy of the thermal wave pulse is rho, density, c specific heat capacity and e, and is a natural constant.
The present invention has been described in detail with reference to the embodiments, but the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (9)
1. A detection method for air gap cracks or micro-debonding of a hard epoxy composite insulator is characterized by comprising the following steps: which comprises the following steps:
1) heating the hard epoxy composite insulator through a thermal excitation source, and acquiring temperature data of the surface of the hard epoxy composite insulator at different moments through a thermal infrared imager;
2) performing anti-aliasing filtering and A/D sampling on the acquired temperature data to obtain discrete temperature data;
3) performing Fourier transform on the discrete temperature data;
4) filtering the temperature data after Fourier transform;
5) adjusting the precision multiple of the temperature data, and resampling the filtered temperature data;
6) carrying out frequency shift transformation on the resampled temperature data;
7) adjusting the frequency and the phase of the temperature data after the frequency shift conversion;
8) and (3) judging whether the hard epoxy composite insulator has the defect of air gap crack or micro-debonding based on the temperature data after the frequency and the phase are adjusted, if the defect does not exist, rotating the hard epoxy composite insulator, and repeating the steps 1) -8) until the hard epoxy composite insulator rotates for 360 degrees or the defect is found, if the defect is not found after rotating for 360 degrees, indicating that the hard epoxy composite insulator is intact, and if the defect is found, calculating the defect depth.
2. The method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator according to claim 1, wherein: the step 3) of performing fourier transform on the discrete temperature data is to adjust a starting point of a sampling frequency band by using a frequency shift property of the discrete fourier transform, so that the starting point of the frequency band falls on a starting point of a frequency domain coordinate, that is, the center frequency is moved to a frequency zero point, and a formula after the fourier transform is as follows:
X(n)＝X0(n)e-j2πf1/f2＝X0cos(2πnf1/f2)-jX0sin(2πnf1/f2)(n＝0,1,2…N-1)(1)
in the formula, X (N) is temperature data after fourier transform, X0(N) is discrete temperature data, f1 is center frequency, f2 is sampling frequency, j is complex sign, e is natural constant, and N is sampling point number.
3. The method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator according to claim 2, wherein: in the step 4), filtering processing is performed on the temperature data after fourier transform, and a calculation formula of the temperature data after filtering processing is as follows:
Y(n)＝X(n)H(n)＝X0(n+f1/f2)H(n)(n＝0,1,2…N-1) (2)
in the formula, y (n) represents temperature data after filtering, and h (n) represents a frequency response function of an ideal filter.
4. The method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator according to claim 3, wherein: the precision multiple of the temperature data is adjusted in the step 5), and the formula for resampling the filtered temperature data is as follows:
Z(n)＝X(En/D)(n＝0,1,2…N-1) (3)
where D is the precision multiple before adjustment, E is the precision multiple after adjustment, and z (n) is the signal after resampling.
5. The method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator according to claim 4, wherein: the formula for performing frequency shift transformation on the resampled temperature data in the step 6) is as follows:
in the formula, g (n) represents data obtained by frequency shift conversion, and t ═ f1/f2 represents the center shift of the frequency.
6. The method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator according to claim 5, wherein: the formula for adjusting the frequency and the phase of the temperature data after frequency shift conversion in the step 7) is as follows:
wherein X (k) is the adjusted temperature data.
7. The method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator according to claim 1, wherein: and 8) judging whether the hard epoxy composite insulator has the defect of air gap cracks or micro-debonding according to observing whether the surface temperature of different areas has temperature difference, if so, indicating that the defect exists, and if not, indicating that the defect does not exist.
8. The method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator according to claim 7, wherein: the calculation formula for calculating the defect depth h in the step 8) is as follows:
in the formula, Delta TmaxDenotes the maximum surface temperature difference, q0The initial energy of the thermal wave pulse is rho, density, c specific heat capacity and e, and is a natural constant.
9. The method for detecting air gap cracks or micro-debonding of the hard epoxy composite insulator according to claim 1, wherein: and in the step 1), when the hard epoxy composite insulator is heated by the thermal excitation source, the upper section and the lower section of the hard epoxy composite insulator are respectively heated by the two thermal excitation sources.
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