CN106996944A - A kind of subsurface defect Shape Reconstruction method in thermal imaging detection - Google Patents
A kind of subsurface defect Shape Reconstruction method in thermal imaging detection Download PDFInfo
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Abstract
The invention discloses the subsurface defect Shape Reconstruction method in a kind of thermal imaging detection, it is divided into gatherer process, defective region and the area free from defect phase difference solution procedure of thermal response signal, and using envelope to the part of defect shape restructuring procedure three.Line scan is entered to test specimen using line heat source, then the data to the heating source position of collection carry out Fourier analysis, obtain corresponding phase difference at other positions and zero defect, the depth of defect is finally inversed by according to phase difference, then the result scanned according to each position line is that the depth tried to achieve does envelope, and the shape of defect is finally estimated according to envelope.The present invention can be estimated and be reconstructed to the shape of random defect, be conducive to carrying out quantitative evaluation to defect, quantitative analysis when solving the problems, such as to encourage using face to such defect.
Description
Technical field
The invention belongs to the technical field of nondestructive testing containing subsurface defect test specimen, more specifically, it is related to one kind
Subsurface defect Shape Reconstruction method in thermal imaging detection.
Background technology
With the continuous development of scientific technology, plant equipment or the quality safety of component turn into asking for people's growing interest
Topic.THERMAL IMAGING NONDESTRUCTIVE TESTING technology for equipment safe operation, control of product quality and ensure equipment in safety
Reliable behavior serves indispensable effect.THERMAL IMAGING NONDESTRUCTIVE TESTING technology relies on its unique advantage, as current
One emphatically development novel digital detection technique.Compared with traditional sensing techniques, it have applied widely, noncontact,
Speed is fast, can at the scene using, precision it is high, using it is safe and easy to operate, be easy to qualitative analysis the advantages of, and it is by thing
Body surface temperature distribution is shown in the form of thermal image, and visualization is high.THERMAL IMAGING NONDESTRUCTIVE TESTING skill in recent years
Art turns into new technology most promising in the field of non destructive testing of the aerospace weapon system such as guided missile, aircraft.
For THERMAL IMAGING NONDESTRUCTIVE TESTING technology, although grasped high levels in the world, but current reason
It is confined to by basis on detection and the image procossing of common material regular pattern composite defect, the correlation also lacked for complicated defect is ground
Study carefully, and to by faultiness design being flat hole more than the research of subsurface defect, carried out using high-energy flashlamp as thermal excitation source
Face is heated, and depth and size to defect are inquired into.And actually defect type, thickness, environment temperature with radiation and heat
As the factors such as instrument precision have a great impact to Detection results.For example when internal flaw and detection faces have certain inclination angle,
The above method of research using to(for) depth of defect, area and geometry will produce relatively large deviation.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, the subsurface defect shape in a kind of thermal imaging detection is proposed
Shape reconstructing method, to be conducive to carrying out quantitative evaluation to subsurface defect, determines subsurface defect when solving using face excitation
Measure problem analysis.
For achieving the above object, the subsurface defect Shape Reconstruction method in thermal imaging detection of the present invention, its feature
It is, comprises the following steps:
(1), the collection of thermal response signal
Excitation coil using line heat source at test specimen zero defect to heating, specified pixel in thermal image at record coil
The thermal response signal I of point0;
Then make the position of excitation coil and thermal infrared imager fixed, added successively since test specimen marginal position
At heat, record coil in thermal image, the thermal response signal I with the same location of pixels pixel of specified pixel pointk;
A few minutes are waited after heating every time, after treating that test specimen temperature tends to be uniform, use five phase step motor to set
Vertical direction of the step-length along the excitation coil of line heat source moves test specimen (line scanning), and starts to heat and record next time, so
Obtain one group of thermal response signal Ik, k=1,2 ..., K, K is heating record number of times;
(2), the solution of phase difference
Contain substantial amounts of harmonic component in the frequency domain information of the thermal response signal collected, it is every using Fourier transform pairs
One thermal response signal is transformed into frequency domain from time domain, is broken down into the superposition of unlimited different multifrequency sinusoid components;
Choose the thermal response signal I of the specified pixel point obtained at test specimen zero defect0The maximum frequency f of middle range value0, meter
Calculate the thermal response signal I of specified pixel point at other (heating source position) positionskIn frequency f0Phase difference △ Pk, each position
Phase difference △ PkArranged according to position, constitute phase difference Butut;
(3), the reconstruct of defect shape
For each heating source position, according to its phase difference △ PkThe depth of heating source position is finally inversed by, then with heating
Be the center of circle at source position, in the hope of corresponding depth do semicircle for radius, the envelope of all semicircles is composition Root cause analysis wheel
Exterior feature figure, defective depth information is included in Root cause analysis profile diagram, then in conjunction with phase difference Butut, defect is reconstructed
Shape.
The object of the present invention is achieved like this.
Subsurface defect Shape Reconstruction method in thermal imaging of the present invention detection, be divided into thermal response signal gatherer process,
Defective region and area free from defect phase difference solution procedure, and using envelope to the part of defect shape restructuring procedure three.
Line scan is entered to test specimen using line heat source, then the data to the heating source position of collection carry out Fourier analysis, obtain it
Corresponding phase difference at his position and zero defect, the depth of defect is finally inversed by according to phase difference, is then swept according to each position line
The result retouched i.e. depth, the depth tried to achieve does envelope, and the shape of defect is finally estimated according to envelope.The present invention can be to not
The shape of rule defect is estimated and reconstructed, and is conducive to carrying out quantitative evaluation to defect, solves when being encouraged using face to this
The quantitative analysis problem of class defect.
Brief description of the drawings
Fig. 1 is the structural representation of THERMAL IMAGING NONDESTRUCTIVE TESTING system;
Fig. 2 is a kind of shape and size schematic diagram of example of test specimen defect;
Fig. 3 is the flow chart of the reconstructing method of surface defect shape of the present invention;
Fig. 4 is test specimen scanning schematic diagram;
Fig. 5 is triangle defect phase difference Butut;
Fig. 6 is triangle defect reconstruct shape and true form comparison diagram;
Fig. 7 is rectangular channel defect phase difference Butut;
Fig. 8 is rectangular channel Root cause analysis shape and true form comparison diagram;
Fig. 9 is stairstepping defect phase difference Butut;
Figure 10 is stairstepping Root cause analysis shape and true form comparison diagram.
Embodiment
The embodiment to the present invention is described below in conjunction with the accompanying drawings, so as to those skilled in the art preferably
Understand the present invention.Requiring particular attention is that, in the following description, when known function and design detailed description perhaps
When can desalinate the main contents of the present invention, these descriptions will be ignored herein.
Fig. 1 is the structural representation of THERMAL IMAGING NONDESTRUCTIVE TESTING system.
In the present embodiment, as shown in figure 1, THERMAL IMAGING NONDESTRUCTIVE TESTING system is generally made up of four parts:(1) heat shock
Encourage part (sensing heating source and excitation coil);(2) thermal-induced imagery collecting part (thermal infrared imager);(3) control test specimen is moved
Dynamic part (stepper motor);(4) thermal-induced imagery processing and analysis part (computer);In addition, also including a pulse generation
Device exports synchronous triggering signal to thermal infrared imager and sensing heating source, makes to keep synchronous both it.
The effect of thermal excitation part is to provide thermal source for experiment, and test specimen is heated;Thermal-induced imagery collection portion
Point rely primarily on thermal infrared imager is acquired to the surface temperature of test specimen;Test specimen movable part is controlled mainly to use stepping
Motor control test specimen moves the distance of fixation every time;Thermal-induced imagery processing and analysis part mainly pass through computer pair
The data of collection are handled, and judge the relevant information of defect.
During detection, the distance between thermal infrared imager and test specimen are adjusted first, makes test specimen position in video window
Within mouthful, the focal length of thermal infrared imager is then adjusted, makes captured image clearly.Adjusting impulse generator, (function generator comes
Implement) pulsewidth of square wave is exported as the synchronous triggering signal control heat time.After preparation is completed, water is first opened
Pump, then opens sensing heating source again, can so ensure that sensing heating source will not be because temperature is too high and damages.Sent out by minor function
The square wave output button triggering heating source of raw device, with season thermal infrared imager record heating process.
In the present embodiment, thermal infrared imager frame frequency is 50Hz, and the heat time is to gather 600 frame thermal maps in 2.5s, experiment
As the data processing as the later stage.
Fig. 2 is the shape and parameter schematic diagram of a kind of example of test specimen defect.
In the present embodiment, as shown in Fig. 2 the test specimen used is aluminium flat test piece.The size of aluminium flat board is 220mm*
50mm, thickness is 5mm.Manual manufacture triangle, rectangular channel and stairstepping defect below test specimen.The hot physical property ginseng of test specimen to be measured
Number is consistent with the parameter in simulation process.During actually detected, because surface of test piece is bright, thermal emissivity is low and has
Stronger reflection action so that thermal infrared imager detects the temperature of falseness, influences the reliability of detection, therefore in the quilt of test specimen
Detection faces spray one layer of pitch-dark, accuracy for improving the thermal emissivity of surface of test piece and detecting.
Fig. 3 is the flow chart of the subsurface defect Shape Reconstruction method in thermal imaging detection of the present invention.
In the present embodiment, as shown in figure 3, the subsurface defect Shape Reconstruction method in thermal imaging of the present invention detection includes
The collection S1, defective region and area free from defect phase difference of thermal response signal solution S2, and defect shape reconstruct S3
Three parts.Each section is described in detail below.
1st, the collection of thermal response signal
Using the excitation coil of line heat source to test specimen zero defect at, heated at A as shown in Figure 4, record excitation line
The thermal response signal I of thermal image middle finger fixation vegetarian refreshments at circle0.In the present embodiment, thermal image has 600 frames, then specified pixel point
Thermal response signal I0The curve that the pixel value for being the pixel in 600 frame thermal maps is constituted.
As shown in figure 4, entering line scan directly over defect according to the direction of arrow shown in figure, while utilizing infrared heat
Picture instrument records surface of test piece Temperature Distribution, i.e.,:
Make the position of excitation coil and thermal infrared imager fixed, heated successively since test specimen marginal position,
Record at excitation coil in thermal image, the thermal response signal I with the same location of pixels pixel of specified pixel pointk。
A few minutes are waited after heating every time, after treating that test specimen temperature tends to be uniform, use five phase step motor to set
Vertical direction of the step-length along the excitation coil of line heat source moves test specimen (line scanning), and starts to heat and record next time, so
Obtain one group of thermal response signal Ik, k=1,2 ..., K, K is heating record number of times.In the present embodiment, step-length is 1.5mm, is
The more preferable checking present invention, in defect center, step-length is 1mm.
2nd, the solution of phase difference
Phase information is not influenceed by temperature rise is how many, only the temperature change relevant, small with the variation tendency of temperature
Larger phase difference can be caused, and interference of the non-uniform heat flux to testing result can be suppressed.
In the present invention, substantial amounts of harmonic component is contained in the frequency domain information of the thermal response signal collected, using Fu
In leaf transformation frequency domain is transformed into from time domain to each thermal response signal, and be broken down into unlimited different multifrequency sinusoid component
Superposition, its frequency domain is in theory (0, ∞), so as to obtain the phase information of specific frequency.Because sampling is obtained
Temperature change signal be usually low frequency signal, therefore generally using the phase difference of low-frequency range as subsequently asking for depth of defect
Carrier.
Choose the thermal response signal I of the specified pixel point obtained at test specimen zero defect0The maximum frequency f of middle range value0, meter
Calculate the thermal response signal I of specified pixel point at other (heating source position) positionskIn frequency f0Phase difference △ Pk, each position
Phase difference △ PkArranged according to position, constitute phase difference Butut.
3rd, the reconstruct of defect shape
Due to there is inevitable contact between the depth and frequency of defect, by extracting the phase information with frequency dependence
The depth information of defect can be estimated.
For each heating source position, according to its phase difference △ PkThe depth of heating source position is finally inversed by, then with heating
Be the center of circle at source position, in the hope of corresponding depth do semicircle for radius, the envelope of all semicircles is composition Root cause analysis wheel
Exterior feature figure, defective depth information is included in Root cause analysis profile diagram, then in conjunction with phase difference Butut, defect is reconstructed
Shape.
Why for defect shape estimation, combine phase difference Butut and Root cause analysis profile diagram, be due to phase
The form of defect can be reflected in potential difference distribution map, defective depth information is included in defect profile reconstruct image.
Reconstitution experiments
1st, triangle defect quantitative analysis
To triangle defect, the thermal response signal I of collection0And one group of thermal response signal IkMethod according to step (2) is entered
After row solution processing, obtained phase difference Butut is as shown in Figure 5.From figure 5 it can be seen that the tracing pattern that draws of experiment with
Situation when theoretical (emulation) is similar, only because in practical operation, being influenceed by various disturbing factors so that curve does not have
Emulate obtained curve smooth like that, slightly setback.Because triangle defect is smaller in edge reflecting surface, cause the depth
It is negative in frequency 0.385Hz, this is consistent with using the actual conditions of impulse phase method.In the apex of triangle defect, though
So it is closest with detection faces, but due to reflecting surface only one of which point so that phase difference is less than the phase of neighbor point herein
Difference.
During due to from fitting function, corresponding defect size is certain, and depth is continually changing, and sample point is in defect center
Place, therefore the phase difference drawn is not in the situation of negative value.So cause the Depth Inverse in triangle and stairstepping defect
Middle the big situation of depth ratio test specimen actual grade occur, its shape sketches the contours figure as indicated with 6.From fig. 6 it can be seen that on defect top
The form variations sketched the contours at angle are larger, because its effective area is small, the thermal Finite of reflection causes its phase difference and depth
Phase difference compared with depth but the larger defect of significant surface is similar, it is therefore seen that tip at occur in that be approximately straight line result.
2nd, rectangular channel quantitative analysis of pile defects
For rectangular channel defect, the thermal response signal I of collection0And one group of thermal response signal IkAccording to the method for step (2)
Carry out after solution processing, obtained phase difference Butut is as shown in Figure 7.From figure 7 it can be seen that having phase with theoretical (emulation) result
As tracing pattern.Phase difference is minimum at Defect Edge, as heating source is close to defect center, phase difference elder generation rapid growth
Then rate of rise slows down, and phase difference no longer changes substantially after volume-depth ratio reaches 9.It is finally inversed by pair according to phase difference
The depth of defect answered, the shape for sketching the contours of defect is as shown in Figure 8.It is approximately straight line in the envelope of near center location,
It is parallel with rectangular channel defect, it can be seen that after volume-depth ratio of defect reaches some value, can be more accurately to lacking
Shape is fallen into be estimated.
3rd, stairstepping quantitative analysis of pile defects
For stairstepping defect, the thermal response signal I of collection0And one group of thermal response signal IkAccording to the method for step (2)
Carry out after solution processing, obtained phase difference Butut is as shown in Figure 9.Point in step can be significantly observed from Fig. 9
The slope of phase difference-depth function is changed at rank.For the step that depth is 3mm, phase difference rate of rise is relatively delayed;When
Thermal source scanning to depth be 1mm step when, thermal source movement identical distance will produce larger phase difference, with thermal source to
Defect center is close, and phase difference rate of rise starts to slow down, because as volume-depth ratio increases, in same frequency
The increment of lower phase difference diminishes.
The defect shape that depth according to obtaining is sketched the contours of is as shown in Figure 10.As can be seen from Figure 10 it is 1mm in depth
At step preferable result can be obtained for estimation of Depth.For the step that depth is 3mm, on the one hand because depth is compared
Depth and transverse width is smaller so that its effective area is smaller, on the other hand because the step of 1mm depth can hinder heat during 1mm
Flowing, causes the estimated bias to depth larger, causes the estimation to its shape to there is larger deviation.
From the point of view of above-mentioned reconstitution experiments, the present invention can be estimated and be reconstructed to the shape of random defect, be conducive to
Quantitative evaluation is carried out to defect, quantitative analysis when solving the problems, such as to encourage using face to such defect.
Although illustrative embodiment of the invention is described above, in order to the technology of the art
Personnel understand the present invention, it should be apparent that the invention is not restricted to the scope of embodiment, to the common skill of the art
For art personnel, as long as various change is in the spirit and scope of the present invention that appended claim is limited and is determined, these
Change is it will be apparent that all utilize the innovation and creation of present inventive concept in the row of protection.
Claims (2)
1. a kind of subsurface defect Shape Reconstruction method in thermal imaging detection, it is characterised in that comprise the following steps:
(1), the collection of thermal response signal
Excitation coil using line heat source at test specimen zero defect to heating, thermal image middle finger fixation vegetarian refreshments at record coil
Thermal response signal I0;
Then make the position of excitation coil and thermal infrared imager fixed, heated successively since test specimen marginal position,
Record at coil in thermal image, the thermal response signal I with the same location of pixels pixel of specified pixel pointk;
A few minutes are waited after heating every time, after treating that test specimen temperature tends to be uniform, use five phase step motor to set step-length
Test specimen (line scanning) is moved along the vertical direction of the excitation coil of line heat source, and starts to heat and record next time, is so obtained
One group of thermal response signal Ik, k=1,2 ..., K, K is heating record number of times;
(2), the solution of phase difference
Contain substantial amounts of harmonic component in the frequency domain information of the thermal response signal collected, using each heat of Fourier transform pairs
Response signal is transformed into frequency domain from time domain, is broken down into the superposition of unlimited different multifrequency sinusoid components;
Choose the thermal response signal I of the specified pixel point obtained at test specimen zero defect0The maximum frequency f of middle range value0, calculate it
The thermal response signal I of specified pixel point at his (heating source position) positionkIn frequency f0Phase difference △ Pk, the phase of each position
Poor △ PkArranged according to position, constitute phase difference Butut;
(3), the reconstruct of defect shape
For each heating source position, according to its phase difference △ PkThe depth of heating source position is finally inversed by, then to heat source position
Locate as the center of circle, in the hope of corresponding depth do semicircle for radius, the envelope of all semicircles is to constitute Root cause analysis profile diagram,
Defective depth information is included in Root cause analysis profile diagram, then in conjunction with phase difference Butut, the shape of defect is reconstructed.
2. reconstructing method according to claim 1, it is characterised in that in step (1), the thermal image has 600 frames, then refers to
The thermal response signal I of fixation vegetarian refreshments0The curve that the pixel value for being the pixel in 600 frame thermal maps is constituted.
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1416269A1 (en) * | 2002-10-31 | 2004-05-06 | ALSTOM Technology Ltd | A non-destructive method of detecting defects in braze-repaired cracks |
US20120068716A1 (en) * | 2010-09-20 | 2012-03-22 | Reed C Christopher | System and method for detecting defects |
JP2012088226A (en) * | 2010-10-21 | 2012-05-10 | Jtekt Corp | Nondestructive inspection method and nondestructive inspection system |
CN103163211A (en) * | 2013-03-14 | 2013-06-19 | 天津大学 | Classification recognition method of defects at surface and sub-surface of metallic conductor |
CN203216857U (en) * | 2013-02-01 | 2013-09-25 | 王平 | Infrared detection device for metal defects |
CN104359944A (en) * | 2014-11-05 | 2015-02-18 | 中国人民解放军第二炮兵工程大学 | Non-destructive detection method of pulse-excited infrared thermal wave phase of fixed viewing field |
CN104535616A (en) * | 2015-01-25 | 2015-04-22 | 何赟泽 | Window-scanning thermal imaging defect detecting and tomography method and system |
CN104713906A (en) * | 2015-04-01 | 2015-06-17 | 何赟泽 | Microwave phase-locked thermal imaging system and method |
CN104764770A (en) * | 2015-03-30 | 2015-07-08 | 南京航空航天大学 | Pulsed eddy current infrared thermal imaging detection system and method for steel rail cracks |
CN105548349A (en) * | 2016-01-18 | 2016-05-04 | 江南大学 | Rectangular probe pulsed eddy current detecting method for realizing defect reconstruction technology |
-
2017
- 2017-05-25 CN CN201710388886.5A patent/CN106996944B/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1416269A1 (en) * | 2002-10-31 | 2004-05-06 | ALSTOM Technology Ltd | A non-destructive method of detecting defects in braze-repaired cracks |
US20120068716A1 (en) * | 2010-09-20 | 2012-03-22 | Reed C Christopher | System and method for detecting defects |
JP2012088226A (en) * | 2010-10-21 | 2012-05-10 | Jtekt Corp | Nondestructive inspection method and nondestructive inspection system |
CN203216857U (en) * | 2013-02-01 | 2013-09-25 | 王平 | Infrared detection device for metal defects |
CN103163211A (en) * | 2013-03-14 | 2013-06-19 | 天津大学 | Classification recognition method of defects at surface and sub-surface of metallic conductor |
CN104359944A (en) * | 2014-11-05 | 2015-02-18 | 中国人民解放军第二炮兵工程大学 | Non-destructive detection method of pulse-excited infrared thermal wave phase of fixed viewing field |
CN104535616A (en) * | 2015-01-25 | 2015-04-22 | 何赟泽 | Window-scanning thermal imaging defect detecting and tomography method and system |
CN104764770A (en) * | 2015-03-30 | 2015-07-08 | 南京航空航天大学 | Pulsed eddy current infrared thermal imaging detection system and method for steel rail cracks |
CN104713906A (en) * | 2015-04-01 | 2015-06-17 | 何赟泽 | Microwave phase-locked thermal imaging system and method |
CN105548349A (en) * | 2016-01-18 | 2016-05-04 | 江南大学 | Rectangular probe pulsed eddy current detecting method for realizing defect reconstruction technology |
Non-Patent Citations (4)
Title |
---|
X. MALDAGUE等: "Pulse phase infrared thermography", 《J. APPL. PHYS.》 * |
李艳红等: "红外热波脉冲位相法无损检测缺陷深度方法研究", 《北京理工大学学报》 * |
王鹏飞等: "红外热成像技术在亚平面缺陷检测中的应用", 《电子设计工程》 * |
田裕鹏等: "亚表面缺陷脉冲相位热成像检测技术", 《南京航空航天大学学报》 * |
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