CN106996944A - A kind of subsurface defect Shape Reconstruction method in thermal imaging detection - Google Patents

A kind of subsurface defect Shape Reconstruction method in thermal imaging detection Download PDF

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CN106996944A
CN106996944A CN201710388886.5A CN201710388886A CN106996944A CN 106996944 A CN106996944 A CN 106996944A CN 201710388886 A CN201710388886 A CN 201710388886A CN 106996944 A CN106996944 A CN 106996944A
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defect
thermal
phase difference
response signal
test specimen
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CN106996944B (en
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白利兵
朱晨晨
程玉华
陈雪
张�杰
殷春
甘文东
何棱云
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University of Electronic Science and Technology of China
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    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/72Investigating presence of flaws

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Abstract

The invention discloses the subsurface defect Shape Reconstruction method in a kind of thermal imaging detection, it is divided into gatherer process, defective region and the area free from defect phase difference solution procedure of thermal response signal, and using envelope to the part of defect shape restructuring procedure three.Line scan is entered to test specimen using line heat source, then the data to the heating source position of collection carry out Fourier analysis, obtain corresponding phase difference at other positions and zero defect, the depth of defect is finally inversed by according to phase difference, then the result scanned according to each position line is that the depth tried to achieve does envelope, and the shape of defect is finally estimated according to envelope.The present invention can be estimated and be reconstructed to the shape of random defect, be conducive to carrying out quantitative evaluation to defect, quantitative analysis when solving the problems, such as to encourage using face to such defect.

Description

A kind of subsurface defect Shape Reconstruction method in thermal imaging detection
Technical field
The invention belongs to the technical field of nondestructive testing containing subsurface defect test specimen, more specifically, it is related to one kind Subsurface defect Shape Reconstruction method in thermal imaging detection.
Background technology
With the continuous development of scientific technology, plant equipment or the quality safety of component turn into asking for people's growing interest Topic.THERMAL IMAGING NONDESTRUCTIVE TESTING technology for equipment safe operation, control of product quality and ensure equipment in safety Reliable behavior serves indispensable effect.THERMAL IMAGING NONDESTRUCTIVE TESTING technology relies on its unique advantage, as current One emphatically development novel digital detection technique.Compared with traditional sensing techniques, it have applied widely, noncontact, Speed is fast, can at the scene using, precision it is high, using it is safe and easy to operate, be easy to qualitative analysis the advantages of, and it is by thing Body surface temperature distribution is shown in the form of thermal image, and visualization is high.THERMAL IMAGING NONDESTRUCTIVE TESTING skill in recent years Art turns into new technology most promising in the field of non destructive testing of the aerospace weapon system such as guided missile, aircraft.
For THERMAL IMAGING NONDESTRUCTIVE TESTING technology, although grasped high levels in the world, but current reason It is confined to by basis on detection and the image procossing of common material regular pattern composite defect, the correlation also lacked for complicated defect is ground Study carefully, and to by faultiness design being flat hole more than the research of subsurface defect, carried out using high-energy flashlamp as thermal excitation source Face is heated, and depth and size to defect are inquired into.And actually defect type, thickness, environment temperature with radiation and heat As the factors such as instrument precision have a great impact to Detection results.For example when internal flaw and detection faces have certain inclination angle, The above method of research using to(for) depth of defect, area and geometry will produce relatively large deviation.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, the subsurface defect shape in a kind of thermal imaging detection is proposed Shape reconstructing method, to be conducive to carrying out quantitative evaluation to subsurface defect, determines subsurface defect when solving using face excitation Measure problem analysis.
For achieving the above object, the subsurface defect Shape Reconstruction method in thermal imaging detection of the present invention, its feature It is, comprises the following steps:
(1), the collection of thermal response signal
Excitation coil using line heat source at test specimen zero defect to heating, specified pixel in thermal image at record coil The thermal response signal I of point0
Then make the position of excitation coil and thermal infrared imager fixed, added successively since test specimen marginal position At heat, record coil in thermal image, the thermal response signal I with the same location of pixels pixel of specified pixel pointk
A few minutes are waited after heating every time, after treating that test specimen temperature tends to be uniform, use five phase step motor to set Vertical direction of the step-length along the excitation coil of line heat source moves test specimen (line scanning), and starts to heat and record next time, so Obtain one group of thermal response signal Ik, k=1,2 ..., K, K is heating record number of times;
(2), the solution of phase difference
Contain substantial amounts of harmonic component in the frequency domain information of the thermal response signal collected, it is every using Fourier transform pairs One thermal response signal is transformed into frequency domain from time domain, is broken down into the superposition of unlimited different multifrequency sinusoid components;
Choose the thermal response signal I of the specified pixel point obtained at test specimen zero defect0The maximum frequency f of middle range value0, meter Calculate the thermal response signal I of specified pixel point at other (heating source position) positionskIn frequency f0Phase difference △ Pk, each position Phase difference △ PkArranged according to position, constitute phase difference Butut;
(3), the reconstruct of defect shape
For each heating source position, according to its phase difference △ PkThe depth of heating source position is finally inversed by, then with heating Be the center of circle at source position, in the hope of corresponding depth do semicircle for radius, the envelope of all semicircles is composition Root cause analysis wheel Exterior feature figure, defective depth information is included in Root cause analysis profile diagram, then in conjunction with phase difference Butut, defect is reconstructed Shape.
The object of the present invention is achieved like this.
Subsurface defect Shape Reconstruction method in thermal imaging of the present invention detection, be divided into thermal response signal gatherer process, Defective region and area free from defect phase difference solution procedure, and using envelope to the part of defect shape restructuring procedure three. Line scan is entered to test specimen using line heat source, then the data to the heating source position of collection carry out Fourier analysis, obtain it Corresponding phase difference at his position and zero defect, the depth of defect is finally inversed by according to phase difference, is then swept according to each position line The result retouched i.e. depth, the depth tried to achieve does envelope, and the shape of defect is finally estimated according to envelope.The present invention can be to not The shape of rule defect is estimated and reconstructed, and is conducive to carrying out quantitative evaluation to defect, solves when being encouraged using face to this The quantitative analysis problem of class defect.
Brief description of the drawings
Fig. 1 is the structural representation of THERMAL IMAGING NONDESTRUCTIVE TESTING system;
Fig. 2 is a kind of shape and size schematic diagram of example of test specimen defect;
Fig. 3 is the flow chart of the reconstructing method of surface defect shape of the present invention;
Fig. 4 is test specimen scanning schematic diagram;
Fig. 5 is triangle defect phase difference Butut;
Fig. 6 is triangle defect reconstruct shape and true form comparison diagram;
Fig. 7 is rectangular channel defect phase difference Butut;
Fig. 8 is rectangular channel Root cause analysis shape and true form comparison diagram;
Fig. 9 is stairstepping defect phase difference Butut;
Figure 10 is stairstepping Root cause analysis shape and true form comparison diagram.
Embodiment
The embodiment to the present invention is described below in conjunction with the accompanying drawings, so as to those skilled in the art preferably Understand the present invention.Requiring particular attention is that, in the following description, when known function and design detailed description perhaps When can desalinate the main contents of the present invention, these descriptions will be ignored herein.
Fig. 1 is the structural representation of THERMAL IMAGING NONDESTRUCTIVE TESTING system.
In the present embodiment, as shown in figure 1, THERMAL IMAGING NONDESTRUCTIVE TESTING system is generally made up of four parts:(1) heat shock Encourage part (sensing heating source and excitation coil);(2) thermal-induced imagery collecting part (thermal infrared imager);(3) control test specimen is moved Dynamic part (stepper motor);(4) thermal-induced imagery processing and analysis part (computer);In addition, also including a pulse generation Device exports synchronous triggering signal to thermal infrared imager and sensing heating source, makes to keep synchronous both it.
The effect of thermal excitation part is to provide thermal source for experiment, and test specimen is heated;Thermal-induced imagery collection portion Point rely primarily on thermal infrared imager is acquired to the surface temperature of test specimen;Test specimen movable part is controlled mainly to use stepping Motor control test specimen moves the distance of fixation every time;Thermal-induced imagery processing and analysis part mainly pass through computer pair The data of collection are handled, and judge the relevant information of defect.
During detection, the distance between thermal infrared imager and test specimen are adjusted first, makes test specimen position in video window Within mouthful, the focal length of thermal infrared imager is then adjusted, makes captured image clearly.Adjusting impulse generator, (function generator comes Implement) pulsewidth of square wave is exported as the synchronous triggering signal control heat time.After preparation is completed, water is first opened Pump, then opens sensing heating source again, can so ensure that sensing heating source will not be because temperature is too high and damages.Sent out by minor function The square wave output button triggering heating source of raw device, with season thermal infrared imager record heating process.
In the present embodiment, thermal infrared imager frame frequency is 50Hz, and the heat time is to gather 600 frame thermal maps in 2.5s, experiment As the data processing as the later stage.
Fig. 2 is the shape and parameter schematic diagram of a kind of example of test specimen defect.
In the present embodiment, as shown in Fig. 2 the test specimen used is aluminium flat test piece.The size of aluminium flat board is 220mm* 50mm, thickness is 5mm.Manual manufacture triangle, rectangular channel and stairstepping defect below test specimen.The hot physical property ginseng of test specimen to be measured Number is consistent with the parameter in simulation process.During actually detected, because surface of test piece is bright, thermal emissivity is low and has Stronger reflection action so that thermal infrared imager detects the temperature of falseness, influences the reliability of detection, therefore in the quilt of test specimen Detection faces spray one layer of pitch-dark, accuracy for improving the thermal emissivity of surface of test piece and detecting.
Fig. 3 is the flow chart of the subsurface defect Shape Reconstruction method in thermal imaging detection of the present invention.
In the present embodiment, as shown in figure 3, the subsurface defect Shape Reconstruction method in thermal imaging of the present invention detection includes The collection S1, defective region and area free from defect phase difference of thermal response signal solution S2, and defect shape reconstruct S3 Three parts.Each section is described in detail below.
1st, the collection of thermal response signal
Using the excitation coil of line heat source to test specimen zero defect at, heated at A as shown in Figure 4, record excitation line The thermal response signal I of thermal image middle finger fixation vegetarian refreshments at circle0.In the present embodiment, thermal image has 600 frames, then specified pixel point Thermal response signal I0The curve that the pixel value for being the pixel in 600 frame thermal maps is constituted.
As shown in figure 4, entering line scan directly over defect according to the direction of arrow shown in figure, while utilizing infrared heat Picture instrument records surface of test piece Temperature Distribution, i.e.,:
Make the position of excitation coil and thermal infrared imager fixed, heated successively since test specimen marginal position, Record at excitation coil in thermal image, the thermal response signal I with the same location of pixels pixel of specified pixel pointk
A few minutes are waited after heating every time, after treating that test specimen temperature tends to be uniform, use five phase step motor to set Vertical direction of the step-length along the excitation coil of line heat source moves test specimen (line scanning), and starts to heat and record next time, so Obtain one group of thermal response signal Ik, k=1,2 ..., K, K is heating record number of times.In the present embodiment, step-length is 1.5mm, is The more preferable checking present invention, in defect center, step-length is 1mm.
2nd, the solution of phase difference
Phase information is not influenceed by temperature rise is how many, only the temperature change relevant, small with the variation tendency of temperature Larger phase difference can be caused, and interference of the non-uniform heat flux to testing result can be suppressed.
In the present invention, substantial amounts of harmonic component is contained in the frequency domain information of the thermal response signal collected, using Fu In leaf transformation frequency domain is transformed into from time domain to each thermal response signal, and be broken down into unlimited different multifrequency sinusoid component Superposition, its frequency domain is in theory (0, ∞), so as to obtain the phase information of specific frequency.Because sampling is obtained Temperature change signal be usually low frequency signal, therefore generally using the phase difference of low-frequency range as subsequently asking for depth of defect Carrier.
Choose the thermal response signal I of the specified pixel point obtained at test specimen zero defect0The maximum frequency f of middle range value0, meter Calculate the thermal response signal I of specified pixel point at other (heating source position) positionskIn frequency f0Phase difference △ Pk, each position Phase difference △ PkArranged according to position, constitute phase difference Butut.
3rd, the reconstruct of defect shape
Due to there is inevitable contact between the depth and frequency of defect, by extracting the phase information with frequency dependence The depth information of defect can be estimated.
For each heating source position, according to its phase difference △ PkThe depth of heating source position is finally inversed by, then with heating Be the center of circle at source position, in the hope of corresponding depth do semicircle for radius, the envelope of all semicircles is composition Root cause analysis wheel Exterior feature figure, defective depth information is included in Root cause analysis profile diagram, then in conjunction with phase difference Butut, defect is reconstructed Shape.
Why for defect shape estimation, combine phase difference Butut and Root cause analysis profile diagram, be due to phase The form of defect can be reflected in potential difference distribution map, defective depth information is included in defect profile reconstruct image.
Reconstitution experiments
1st, triangle defect quantitative analysis
To triangle defect, the thermal response signal I of collection0And one group of thermal response signal IkMethod according to step (2) is entered After row solution processing, obtained phase difference Butut is as shown in Figure 5.From figure 5 it can be seen that the tracing pattern that draws of experiment with Situation when theoretical (emulation) is similar, only because in practical operation, being influenceed by various disturbing factors so that curve does not have Emulate obtained curve smooth like that, slightly setback.Because triangle defect is smaller in edge reflecting surface, cause the depth It is negative in frequency 0.385Hz, this is consistent with using the actual conditions of impulse phase method.In the apex of triangle defect, though So it is closest with detection faces, but due to reflecting surface only one of which point so that phase difference is less than the phase of neighbor point herein Difference.
During due to from fitting function, corresponding defect size is certain, and depth is continually changing, and sample point is in defect center Place, therefore the phase difference drawn is not in the situation of negative value.So cause the Depth Inverse in triangle and stairstepping defect Middle the big situation of depth ratio test specimen actual grade occur, its shape sketches the contours figure as indicated with 6.From fig. 6 it can be seen that on defect top The form variations sketched the contours at angle are larger, because its effective area is small, the thermal Finite of reflection causes its phase difference and depth Phase difference compared with depth but the larger defect of significant surface is similar, it is therefore seen that tip at occur in that be approximately straight line result.
2nd, rectangular channel quantitative analysis of pile defects
For rectangular channel defect, the thermal response signal I of collection0And one group of thermal response signal IkAccording to the method for step (2) Carry out after solution processing, obtained phase difference Butut is as shown in Figure 7.From figure 7 it can be seen that having phase with theoretical (emulation) result As tracing pattern.Phase difference is minimum at Defect Edge, as heating source is close to defect center, phase difference elder generation rapid growth Then rate of rise slows down, and phase difference no longer changes substantially after volume-depth ratio reaches 9.It is finally inversed by pair according to phase difference The depth of defect answered, the shape for sketching the contours of defect is as shown in Figure 8.It is approximately straight line in the envelope of near center location, It is parallel with rectangular channel defect, it can be seen that after volume-depth ratio of defect reaches some value, can be more accurately to lacking Shape is fallen into be estimated.
3rd, stairstepping quantitative analysis of pile defects
For stairstepping defect, the thermal response signal I of collection0And one group of thermal response signal IkAccording to the method for step (2) Carry out after solution processing, obtained phase difference Butut is as shown in Figure 9.Point in step can be significantly observed from Fig. 9 The slope of phase difference-depth function is changed at rank.For the step that depth is 3mm, phase difference rate of rise is relatively delayed;When Thermal source scanning to depth be 1mm step when, thermal source movement identical distance will produce larger phase difference, with thermal source to Defect center is close, and phase difference rate of rise starts to slow down, because as volume-depth ratio increases, in same frequency The increment of lower phase difference diminishes.
The defect shape that depth according to obtaining is sketched the contours of is as shown in Figure 10.As can be seen from Figure 10 it is 1mm in depth At step preferable result can be obtained for estimation of Depth.For the step that depth is 3mm, on the one hand because depth is compared Depth and transverse width is smaller so that its effective area is smaller, on the other hand because the step of 1mm depth can hinder heat during 1mm Flowing, causes the estimated bias to depth larger, causes the estimation to its shape to there is larger deviation.
From the point of view of above-mentioned reconstitution experiments, the present invention can be estimated and be reconstructed to the shape of random defect, be conducive to Quantitative evaluation is carried out to defect, quantitative analysis when solving the problems, such as to encourage using face to such defect.
Although illustrative embodiment of the invention is described above, in order to the technology of the art Personnel understand the present invention, it should be apparent that the invention is not restricted to the scope of embodiment, to the common skill of the art For art personnel, as long as various change is in the spirit and scope of the present invention that appended claim is limited and is determined, these Change is it will be apparent that all utilize the innovation and creation of present inventive concept in the row of protection.

Claims (2)

1. a kind of subsurface defect Shape Reconstruction method in thermal imaging detection, it is characterised in that comprise the following steps:
(1), the collection of thermal response signal
Excitation coil using line heat source at test specimen zero defect to heating, thermal image middle finger fixation vegetarian refreshments at record coil Thermal response signal I0
Then make the position of excitation coil and thermal infrared imager fixed, heated successively since test specimen marginal position, Record at coil in thermal image, the thermal response signal I with the same location of pixels pixel of specified pixel pointk
A few minutes are waited after heating every time, after treating that test specimen temperature tends to be uniform, use five phase step motor to set step-length Test specimen (line scanning) is moved along the vertical direction of the excitation coil of line heat source, and starts to heat and record next time, is so obtained One group of thermal response signal Ik, k=1,2 ..., K, K is heating record number of times;
(2), the solution of phase difference
Contain substantial amounts of harmonic component in the frequency domain information of the thermal response signal collected, using each heat of Fourier transform pairs Response signal is transformed into frequency domain from time domain, is broken down into the superposition of unlimited different multifrequency sinusoid components;
Choose the thermal response signal I of the specified pixel point obtained at test specimen zero defect0The maximum frequency f of middle range value0, calculate it The thermal response signal I of specified pixel point at his (heating source position) positionkIn frequency f0Phase difference △ Pk, the phase of each position Poor △ PkArranged according to position, constitute phase difference Butut;
(3), the reconstruct of defect shape
For each heating source position, according to its phase difference △ PkThe depth of heating source position is finally inversed by, then to heat source position Locate as the center of circle, in the hope of corresponding depth do semicircle for radius, the envelope of all semicircles is to constitute Root cause analysis profile diagram, Defective depth information is included in Root cause analysis profile diagram, then in conjunction with phase difference Butut, the shape of defect is reconstructed.
2. reconstructing method according to claim 1, it is characterised in that in step (1), the thermal image has 600 frames, then refers to The thermal response signal I of fixation vegetarian refreshments0The curve that the pixel value for being the pixel in 600 frame thermal maps is constituted.
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CN109581200A (en) * 2018-11-30 2019-04-05 北京卫星制造厂有限公司 The method for determining rosin joint solder joint feature band based on thermal infrared imager test data
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CN107490599B (en) * 2017-09-29 2019-08-20 电子科技大学 A kind of leaded steel multilayer material debonding defect recurrent pulse thermal imaging testing method
CN107490599A (en) * 2017-09-29 2017-12-19 电子科技大学 A kind of leaded steel multilayer material debonding defect recurrent pulse thermal imaging testing method
CN108665442A (en) * 2018-04-03 2018-10-16 中国空气动力研究与发展中心超高速空气动力研究所 The thermal image defect characteristic of Infrared Non-destructive Testing enhances processing method
CN109211976A (en) * 2018-08-07 2019-01-15 哈尔滨商业大学 Semi-conductor silicon chip surface/sub-surface micro-cracks damage chirp beam splitting laser excitation infrared thermal wave detection device and method
CN109285118A (en) * 2018-09-26 2019-01-29 电子科技大学 A kind of thermal-induced imagery joining method adding attachment layer
CN109285118B (en) * 2018-09-26 2023-03-07 电子科技大学 Infrared thermal image splicing method with additional accessory layer
CN109581200A (en) * 2018-11-30 2019-04-05 北京卫星制造厂有限公司 The method for determining rosin joint solder joint feature band based on thermal infrared imager test data
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