CN112981168A - Powder hot-forged copper-based pantograph slide plate material and preparation method thereof - Google Patents
Powder hot-forged copper-based pantograph slide plate material and preparation method thereof Download PDFInfo
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- CN112981168A CN112981168A CN202110158685.2A CN202110158685A CN112981168A CN 112981168 A CN112981168 A CN 112981168A CN 202110158685 A CN202110158685 A CN 202110158685A CN 112981168 A CN112981168 A CN 112981168A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1003—Use of special medium during sintering, e.g. sintering aid
- B22F3/1007—Atmosphere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/17—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by forging
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/17—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by forging
- B22F2003/175—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by forging by hot forging, below sintering temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/248—Thermal after-treatment
Abstract
The invention provides a powder hot-forged copper-based pantograph slide plate material and a preparation method thereof. The copper-based pantograph pan material is obtained by performing powder hot forging on the following raw material components: 5-6 wt% of iron-phosphorus alloy powder, wherein the particle size range is-80 to +300 meshes, and the phosphorus content in the iron-phosphorus alloy powder is 17-19 wt%; 6-7 wt% of iron-nickel pre-alloy powder; 6-9 wt% of chromium powder; 1-4 wt% of tin powder; 0.5-1 wt% of lead powder; 2-5 wt% of flake graphite powder and the balance of copper powder. The copper-based pantograph slide plate material provided by the invention has the advantages of uniform structure, high density, excellent mechanical property and electrical property, and strong mechanical wear resistance and electrical wear resistance.
Description
Technical Field
The invention relates to the technical field of powder metallurgy, in particular to a powder hot-forged copper-based pantograph slide plate material and a preparation method thereof.
Background
The pantograph slide plate is an important power transmission element of the electrified train, and the working principle of the pantograph slide plate is that the pantograph slide plate is in sliding contact with an overhead conductor or a third rail to transmit electric power to an electric locomotive so as to maintain the normal operation of the train. The pantograph slide plate is used as an important electric contact material and needs to have spark erosion resistance, high conductivity, high temperature resistance, wear resistance and high mechanical strength.
The high-addition component copper-based pantograph slide plate material is characterized in that high-content and various base body components are added into the copper-based pantograph slide plate material, so that the base body components can be basically dissolved in a copper base body after being processed by a series of processes. The wettability of copper and graphite is poor, the copper and the graphite are only combined in a mechanical interlocking mode, the wetting angle between copper and graphite is still up to 140 degrees even under the high-temperature environment of 1000 ℃, a graphite/copper-based sliding plate material prepared by adopting the traditional method such as casting and sintering alloy has loose structure, high porosity and low densification degree, a sample still has a plurality of pores after being pressed, volume expansion cannot be avoided after sintering, and the mechanical property, the electrical property, the mechanical abrasion resistance and the electrical abrasion resistance of the composite material are seriously influenced. No report on the preparation of the high-additive component fully-compact copper-based pantograph pan material by a powder hot forging method is found. At present, due to the fact that the density difference between the added component and the added base body is large, the component segregation phenomenon is prone to occurring in the material mixing process, meanwhile, the solid solution ratio of part of metal components and the copper base body is low, alloying is not easy to achieve, the sintering process is difficult to carry out fully, the use performance of the sliding plate is affected, and the development of copper-based pantograph sliding plate materials is limited. In addition, in the powder forming process, the mixed powder with high additive components has poor compressibility and is difficult to achieve high density, and the copper-based composite material with high density cannot be obtained due to expansion during sintering.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a powder hot-forged copper-based pantograph slide plate material and a preparation method thereof, a high-addition component copper-based pantograph slide plate material system is formed by adding high-content and various types of base body components, the infiltration difficulty of copper and graphite is effectively reduced, and the obtained copper-based pantograph slide plate material has the advantages of uniform structure, high density, excellent mechanical property and electrical property, and strong mechanical wear resistance and electrical wear resistance.
To achieve the above and other related objects, the present invention provides a powder hot-forged copper-based pantograph pan material obtained by powder hot-forging raw material components including: 5-6 wt% of iron-phosphorus alloy powder, wherein the particle size range is-80 to +300 meshes, and the phosphorus content in the iron-phosphorus alloy powder is 17-19 wt%; 6-7 wt% of iron-nickel pre-alloy powder; 6-9 wt% of chromium powder; 1-4 wt% of tin powder; 0.5-1 wt% of lead powder; 2-5 wt% of flake graphite powder and the balance of copper powder.
In some embodiments, the iron-nickel prealloy powder has a particle size in the range of-200 to +300 mesh and the nickel content in the iron-nickel prealloy powder is 16 to 18 wt%.
In some embodiments, the particle size of the raw material component of the copper-based pantograph pan material is 5-100 μm.
In some embodiments, the copper-based pantograph pan material has a density of 8.10-8.5 g/cm3And/or a resistivity of 0.190 to 0.220 [ mu ] omega-m.
The second aspect of the present invention also provides a method for preparing a powder hot-forged copper-based pantograph pan material as described above, the method comprising: mixing the raw material components, and performing cold pressing forming to obtain a pressed compact; sintering the green compact in a hydrogen-containing mixed atmosphere to obtain a sintered compact; and performing powder hot forging on the sintered blank, and then performing vacuum heat treatment to obtain the copper-based pantograph pan material.
In some embodiments, the temperature in the sintering process is 600-1000 ℃, the temperature is kept for 1-3 h, and the heating rate is 10-20 ℃/min.
In some embodiments, the initial temperature of the powder hot forging die is 200 to 300 ℃.
In some embodiments, the powder hot forging has a start forging temperature of 700-900 ℃, a temperature rise rate of 5-20 ℃/min, and a finish forging temperature of 300-550 ℃.
In some embodiments, the powder hot forging has a forging energy density of 1x103～3x103kJ/m2。
In some embodiments, the hot forging of the powder further comprises an air cooling process, and then the vacuum heat treatment is performed to obtain the copper-based pantograph pan material.
As described above, the present invention provides a powder hot-forged copper-based pantograph pan material and a method for manufacturing the same. The high-content and multi-type matrix components are added into the powder hot-forging copper-based pantograph slide plate material to form a high-additive-component copper-based pantograph slide plate material system, so that the infiltration difficulty of copper and graphite is effectively reduced, and the material properties of all components are integrated. In addition, the raw materials of the copper-based pantograph slide plate material provided by the invention can be prepared by a powder hot forging method, so that the overall densification degree of the material is high, the conductivity and the current-carrying wear resistance are good, the electric spark ablation is reduced, the material transfer phenomenon is inhibited, the service performance of the pantograph slide plate in the railway transportation process is improved, and the service life is prolonged. Meanwhile, the structure is uniform, and the high-content lubricant and the arc-resistant component in the material components reduce the mechanical abrasion and current-carrying abrasion of the wire, thereby effectively protecting the wire. In addition, the prepared pantograph pan has small resistivity, proper hardness, high impact toughness and good safety in the use process. The material obtained by the preparation method has the relative density close to 100 percent, has low requirements on raw materials and equipment, and has clear and controllable process flow, so the preparation method has the characteristic of low manufacturing cost. Meanwhile, the raw materials adopted by the invention are all general materials in the market, and the purchasing difficulty is low. High material utilization rate, high production efficiency, no pollution in the process and suitability for batch production.
Drawings
Fig. 1 shows a schematic flow chart of a method for preparing a copper-based pantograph pan material provided by the invention.
Fig. 2 shows a metallographic structure micrograph (magnification 100) of a copper-based pantograph pan material provided by the present invention.
Fig. 3 shows a metallographic structure micrograph (magnification 400) of a copper-based pantograph pan material provided by the present invention.
Fig. 4 shows a metallographic structure micrograph (magnification 100) of a copper-based pantograph pan material provided by the present invention after heat treatment.
Fig. 5 shows a metallographic structure micrograph (magnification 400) of a copper-based pantograph pan material provided by the present invention after heat treatment.
Fig. 6 shows a graph of the change of the friction coefficient of the copper-based pantograph slider material under the current of 15A with time.
FIG. 7 is a graph showing the change of the coefficient of friction at 15A current with time after the copper-based pantograph pan material provided by the present invention is heat-treated.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.
It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
As shown in fig. 1, the present invention provides a method for preparing a copper-based pantograph pan material, which forms a copper-based pantograph pan material system with high additive component by adding high-content and various base component types. The copper-based pantograph slide plate material is prepared by mixing the raw material components, performing cold pressing forming to obtain a pressed blank, then sintering in a hydrogen-containing mixed atmosphere, performing powder hot forging in a forging die, and finally performing vacuum heat treatment to obtain the multi-element fully-compact copper-based pantograph slide plate. The obtained copper-based pantograph slide plate material has the advantages of uniform structure, high density, excellent mechanical property and electrical property, and strong mechanical abrasion resistance and electrical abrasion resistance. The copper-based pantograph slide plate material has high density, the relative density is close to 100 percent and close to the theoretical density, the phenomenon of material transfer inhibition caused by electric spark ablation is reduced, the service performance of the pantograph slide plate in the railway transportation process is improved, and the service life is prolonged. The preparation method of the copper-based pantograph pan material comprises but is not limited to the steps of S1-S3:
s1, mixing the raw material components, and performing cold press forming to obtain a compact;
s2, sintering the pressed compact in a mixed atmosphere containing hydrogen to obtain a sintered compact;
and S3, performing powder hot forging on the sintered blank, and then performing vacuum heat treatment to obtain the copper-based pantograph pan material.
As shown in fig. 1, in step S1, the raw material components include 5 to 6 wt% of iron-phosphorus alloy powder; 6-7 wt% of iron-nickel pre-alloy powder; 6-9 wt% of chromium powder; 1-4 wt% of tin powder; 0.5-1 wt% of lead powder; 2-5 wt% of flake graphite powder and the balance of copper powder, wherein the particle size of the iron-phosphorus alloy powder is-80 to +300 meshes, such as-80 meshes, the content of phosphorus in the iron-phosphorus alloy powder is 17-19 wt%, such as 17 wt%, and the range is favorable for improving the bulk density of the copper-based pantograph slide plate material, so that the mechanical property, the electrical property and the like are promoted. Further, the particle size of the iron-nickel pre-alloy powder is-200 to +300 meshes, such as-200 meshes and 80 meshes, the content of nickel in the iron-nickel pre-alloy powder is 16 to 18 wt%, such as 16 wt%, compared with the iron-phosphorus alloy, the iron-nickel pre-alloy powder is used as a base component for forming the copper-based pantograph pan material, and the iron-nickel pre-alloy powder has a wider particle size range, so that the iron-nickel pre-alloy powder can be matched with the phosphorus powder, the bulk density of the copper-based pantograph pan material is improved, and the machinability of the copper-based pantograph pan material is improved. Because the alloying kinetic process of nickel in the powder metallurgy matrix is relatively weak, and the phosphorus element is easy to volatilize and react, the pre-alloyed powder of iron, phosphorus and iron-nickel is added in the invention, so that the composition segregation can be reduced, the stability and reliability of an alloy system can be ensured, and further, the chromium element can play a role in strengthening the matrix and resisting spark erosion (arc extinction) and improving the wear resistance of the material within the range of the components. The nickel element can improve the heat resistance and corrosion resistance of the sliding plate material, stabilize partial phase structure and does not form carbide with carbon element. A small amount of phosphorus can improve the wear resistance of the sliding plate and improve the machining performance of the pantograph sliding plate material; a small amount of lead element can improve the cutting performance and the self-lubricating performance of the sliding plate, a small amount of tin element can strengthen the copper alloy, improve the mechanical property of the material, strengthen the wear resistance of the material, improve the corrosion resistance of the sliding plate in plateau and coastal areas, reduce the plasticity of the material at the same time and be beneficial to a hot forging process. A large amount of scale graphite can enhance self-lubricity, improve the electrical conductivity of the composite material, reduce the frictional wear between the bow net and the net and reduce the wear of the two; the addition of Fe element can improve the wetting of Cr, Cu and graphite, and can also enhance the hardness and strength of copper and material, and improve the mechanical property of material. Because the sintering temperature and the hot forging temperature are less than 900 ℃, the obtained fully-compact material has no hard and brittle carbide phase, and the abrasion and the wear to the wire are prevented.
As shown in fig. 1, in step S1, further, from the viewpoint of ensuring the mixing effect and the subsequent molding work, the particle sizes of these raw material components are limited, for example, 80 to 300 mesh iron-phosphorus pre-alloy powder, 200 to 300 mesh iron-nickel pre-alloy powder, tin powder, 120 to 300 mesh chromium powder, lead powder, flake graphite powder, and 80 to 300 mesh electrolytic copper powder are weighed in proportion, and then may be placed in, for example, a V-type blender to be mixed uniformly, and the average particle size of these raw material components after mixing is 45 to 100 μm, for example, 65 μm.
As shown in fig. 1, in step S1, the mixed raw material components are cold-pressed, specifically, the mixed raw material powders are put into a steel mold, pre-pressed, and demolded to obtain a green compact, and the cold-pressing forming pressure is 500 to 800 MPa.
As shown in fig. 1, in step S2, the hydrogen-containing mixed atmosphere may be, for example, a mixed atmosphere of hydrogen and argon, or a mixed atmosphere of hydrogen and nitrogen, so that sintering may be performed in an oxygen-free environment, and oxidation reduction of the oxide on the surface of the green compact may be performed based on the reduction property of hydrogen. In the step S2, the green compact can be obtained by, for example, placing the green compact in a sintering furnace in which the sintering atmosphere is a hydrogen-containing mixed atmosphere at 600 to 1000 ℃ and sintering the green compact, and further 800 to 870 ℃, and the sintering process can be started from room temperature, for example, at a temperature increase rate of 10 to 20 ℃/min, for example, 10 ℃/min. And after the sintering temperature is reached, preserving the heat for 1-3 h, for example, 2h to obtain a corresponding sintered body.
As shown in fig. 1, in step S3, the sintered compact is subjected to powder hot forging, wherein the die initial temperature of the powder hot forging is 200 to 300 ℃, the temperature rise rate of the sintered green body is 10 to 20 ℃/min, for example, heating to 700-900 deg.C at 10 deg.C/min, for example 800 deg.C as the initial forging temperature for powder hot forging, the final forging temperature of the powder hot forging is 300-550 ℃, for example 500 ℃, when the hot forging temperature is lower than 700 ℃, plastic deformation can not be carried out, when the temperature is too high, the sintering blank expands by heating, the pore is expanded, a compact structure is difficult to form, even decomposition occurs, and the composition of the system is influenced. The powder blank is promoted to generate rapid change, the original boundary among powder particles is eliminated, and the blank with uniform tissue is obtained. The material components do not contain carbide hard phase particles, so that the abrasion and the wear to the wire are reduced, and the wire is effectively protected. Further, the energy density of the powder hot forging is 1x103～3x103kJ/m2So as to ensure the performance of the copper-based pantograph pan material.
As shown in fig. 1, in step S3, specifically, for example, the sintered body may be placed in a medium-high frequency induction heating furnace to be heated while a hot forging die is heated to a temperature initial temperature, then the obtained sintered body is moved into the hot forging die to be subjected to powder hot forging, and then the copper-based pantograph pan material is obtained by post-treatment, and further, the powder hot forging may be performed first by an air cooling process based on the copper-based pantograph pan material to obtain desired properties.
The sliding plate material prepared by the powder hot forging forming method has high densification degree, good conductivity and current-carrying wear resistance, reduces electric spark ablation, inhibits the material transfer phenomenon, improves the service performance of the pantograph sliding plate in the railway transportation process, and prolongs the service life. Meanwhile, the structure is uniform, hard phase particles are not contained in the material components, the mechanical abrasion and wear of the lead are reduced, and the lead is effectively protected. In addition, the prepared pantograph pan has small resistivity, proper hardness and high impact toughness.
As shown in fig. 1, in step S3, the heat treatment process is to heat treat the forged material in a vacuum furnace, and further, a copper-based pantograph pan material subjected to a hot forming process can be obtained by furnace cooling.
As mentioned above, the fully-compact high-additive-component copper-based pantograph slide plate material is prepared by carrying out unit processes of material mixing, pressing sintering, hot forging and heat treatment on the raw material components as described in detail above. The powder hot forging adopts a powder metallurgy method to prepare a blank, and combines the characteristics of high utilization rate of powder metallurgy materials and compact plastic deformation of precision forging: the material forming process is reduced, and the cost is reduced; the product has good performance and uniform tissue distribution. The powder hot forging is a hot forging process added on the basis of the traditional powder metallurgy, the automatic production is very easy to control, and the production efficiency is greatly improved. The copper-based pantograph pan material provided by the invention has a relative density close to 100%, for example, the density is 8.10-8.50 g/cm3g/cm3The resistivity is 0.190-0.220 mu omega.m, the hardness is 80-100 HB, and the impact toughness can reach 6.82-12.75J/cm2。
Hereinafter, the present invention will be more specifically explained by referring to examples, which should not be construed as limiting. Appropriate modifications may be made within the scope consistent with the gist of the above and below, and all of them fall within the technical scope of the present invention.
Example 1
Weighing 5 wt%, 6 wt%, 9 wt%, 1 wt%, 3 wt% of iron-phosphorus pre-alloy powder (containing 17 wt% of phosphorus), 16 t% of iron-nickel pre-alloy powder (containing nickel), 5 wt%, 6 wt%, 9 wt%, 1 wt% and 3 wt% of chromium powder, less than 1 wt% of unavoidable impurities and the balance of electrolytic copper powder, wherein the particle sizes are 100 meshes, and putting the powder into a V-shaped mixer for uniform mixing; loading the obtained mixed powder (with particle diameter of 15 μm) into steel mold, press-demolding to obtain powder compact, and pressingHeating the powder compact in a sintering furnace with a mixed gas of hydrogen and argon as a sintering atmosphere, and keeping the temperature at 870 ℃ for 2h to obtain a sintered body; alternatively, the forging die was heated to 300 ℃ and the sintered compact was heated to 800 ℃ and the sintered body was transferred to the forging die within 5 seconds at 1.8X103kJ/m2Hot forging densification is carried out under the energy density, wherein the initial forging temperature is 800 ℃, and the final forging temperature is 500 ℃ and then air cooling is carried out; and (4) carrying out heat treatment on the forged material in a vacuum furnace, and cooling along with the furnace.
The results of the performance test of the powdered hot forged copper-based pantograph pan material obtained in example 1 are shown in table 1.
As shown in fig. 2 to fig. 3, respectively show the micrographs of the metallographic structure of the slide plate material of the copper-based pantograph before vacuum heat treatment after hot forging of the powder provided by the invention, as shown in fig. 2, after hot forging, the slide plate has no obvious pores and no obvious component segregation, and the dark substance in the metallographic structure is crystalline flake graphite which is uniformly dispersed in the base material. As shown in fig. 3, after further enlargement, it can be seen that the matrix structure has no pores and the material has a high degree of densification.
As shown in fig. 4 to 5, the micrographs of the metallographic structures of the copper-based pantograph pan material after the powder is hot forged and subjected to vacuum heat treatment are respectively shown, as shown in fig. 4, the undissolved second phases in the crystal are reduced after solid solution, and a small amount of incompletely solid-dissolved gray structures are Fe phases, which indicates that the solid solution treatment can basically completely and solidly dissolve the alloy elements in the Cu matrix. As shown in fig. 5, which shows a metallographic structure micrograph after further enlargement, the system is homogeneous, free of pores and the material is dense.
As shown in fig. 6 to 7, the change of the friction coefficient of the copper-based pantograph slide plate material after the powder hot forging and after the heat treatment under the current of 15A is respectively shown as a graph, so that the friction coefficient of the copper-based pantograph slide plate material is slightly fluctuated from 0.24 up and down under the current-carrying condition without the heat treatment, and the friction coefficient of the copper-based pantograph slide plate material is slightly fluctuated from 0.18 up and down under the current-carrying condition after the heat treatment, thereby improving the friction performance of the copper-based pantograph slide plate material after the heat treatment.
Example 2
Weighing iron-phosphorus alloy powder (containing 18 wt% of phosphorus), iron-nickel pre-alloy powder (containing 17 wt% of nickel), chromium powder, tin powder, lead powder and flake graphite powder, wherein the weight percentages of the iron-phosphorus alloy powder, the iron-nickel pre-alloy powder, the chromium powder, the tin powder, the lead powder and the flake graphite powder are respectively 5 wt%, 6 wt%, 8 wt%, 1 wt% and 3 wt%, the weight percentages of inevitable impurities are less than 1 wt%, and the balance of electrolytic copper powder, wherein the particle sizes of the inevitable impurities and the balance of electrolytic; putting the mixed powder (with the particle size of 50 mu m) into a steel die, pressing and demoulding to obtain a powder pressed compact, heating the powder pressed compact in a sintering furnace in which the sintering atmosphere is a mixed gas of hydrogen and argon, wherein the heating rate is 10 ℃/min, and keeping the temperature at 870 ℃ for 2h to obtain a sintered body; heating the forging die to 300 deg.C, heating the sintered blank to 750 deg.C, transferring the sintered body into the forging die within 5 seconds at 1.8x103kJ/m2Hot forging densification is carried out under the energy density, wherein the initial forging temperature is 750 ℃, and the final forging temperature is 500 ℃ and then air cooling is carried out; and (4) carrying out heat treatment on the forged material in a vacuum furnace, and cooling along with the furnace.
The results of the performance tests on the powdered hot-forged copper-based pantograph pan material obtained in example 2 are shown in table 1.
Example 3
Weighing 5 wt%, 6 wt%, 7 wt%, 1 wt%, 3 wt% of chromium powder, tin powder, lead powder and scale graphite powder respectively, weighing unavoidable impurities with the particle size of less than 1 wt% and the balance of electrolytic copper powder, and putting the iron-phosphorus alloy powder (containing 19 wt% of phosphorus), the iron-nickel pre-alloy powder (containing 18 wt% of nickel) and the balance of electrolytic copper powder into a V-shaped mixer to be uniformly mixed, wherein the particle sizes of the inevitable impurities are 40 meshes; putting the mixed powder (with the particle size of 30 mu m) into a steel die, pressing and demoulding to obtain a powder compact, heating the powder compact in a sintering furnace in which the sintering atmosphere is a mixed gas of hydrogen and argon, wherein the heating rate is 10 ℃/min, and keeping the temperature at 870 ℃ for 2h to obtain a sintered body; the mold was heated to 300 ℃ and the sintered compact was heated to 700 ℃ and the sintered compact was transferred to a forging die at 1.8x10 in 5 seconds3kJ/m2Carrying out hot forging at the energy density, wherein the initial forging temperature is 700 ℃, and the final forging temperature is 450 ℃ and then air cooling is carried out; to pairAnd (4) carrying out heat treatment on the forged material in a vacuum furnace, and cooling along with the furnace.
The results of the performance tests on the powdered hot-forged copper-based pantograph pan material obtained in example 3 are also shown in table 1.
Example 4
Weighing iron-phosphorus alloy powder (containing 19 wt% of phosphorus), iron-nickel pre-alloy powder (containing 18 wt% of nickel), chromium powder, tin powder, lead powder and flake graphite powder, wherein the weight percentages of the iron-phosphorus alloy powder, the iron-nickel pre-alloy powder, the chromium powder, the tin powder, the lead powder and the flake graphite powder are respectively 5 wt%, 6 wt%, 1 wt%, 0.5 wt% and 4 wt%, the weight percentages of the inevitable impurities are less than 1 wt%, and the balance of electrolytic copper powder, wherein the particle sizes of the inevitable impurities and the balance of; putting the mixed powder (with the particle size of 8 mu m) into a steel die, pressing and demoulding to obtain a powder pressed blank, heating the powder pressed blank in a sintering furnace in which the sintering atmosphere is a mixed gas of hydrogen and argon, wherein the heating rate is 10 ℃/min, and keeping the temperature for 2h at the temperature of 870 ℃ to obtain a sintered body; the mold was then heated to 250 ℃ and the sintered compact was heated to 750 ℃ and the sintered compact was transferred to a forging die at 2.0x10 in 5 seconds3kJ/m2Hot forging densification is carried out under the energy density, wherein the initial forging temperature is 750 ℃, and the final forging temperature is 500 ℃ and then air cooling is carried out; and (4) carrying out heat treatment on the forged material in a vacuum furnace, and cooling along with the furnace.
The results of the performance tests on the powdered hot-forged copper-based pantograph pan material obtained in example 4 are also shown in table 1.
Example 5
Weighing iron-phosphorus alloy powder (containing 17 wt% of phosphorus), iron-nickel pre-alloy powder (containing 18 wt% of nickel), chromium powder, tin powder, lead powder and flake graphite powder, wherein the weight percentages of the iron-phosphorus alloy powder, the iron-nickel pre-alloy powder, the chromium powder, the tin powder, the lead powder and the flake graphite powder are respectively 5 wt%, 6 wt%, 1 wt% and 4 wt%, the weight percentages of inevitable impurities are lower than 1 wt%, and the balance of electrolytic copper powder, wherein the particle sizes of the inevitable impurities and the balance of electrolytic; putting the mixed powder (with the particle size of 11 mu m) into a steel die, pressing and demoulding to obtain a powder compact, heating the powder compact in a sintering furnace with the sintering atmosphere of mixed gas of hydrogen and argon, and preserving heat for 2 hours at the temperature of 870 ℃ to obtain a sintered body; the mold was then heated to 200 ℃ and the sintered compact was heated to 750 ℃ and the sintered compact was transferred to a forging die at 2.0x10 in 5 seconds3kJ/m2Hot forging densification is carried out under the energy density, wherein the initial forging temperature is 750 ℃, and the final forging temperature is 500 ℃ and then air cooling is carried out; and (4) carrying out heat treatment on the forged material in a vacuum furnace, and cooling along with the furnace.
The results of the performance tests on the hot forged copper-based pantograph pan material obtained in example 5 are also shown in table 1.
TABLE 1 Properties of Hot-forged copper-based pantograph pan material
As can be seen from table 1 above, examples 1 to 5 provided by the present invention show: 1) with the increase of the forging energy density and the forging temperature, all properties of the sliding plate material are increased, and the forging energy density and the forging temperature are not required to be too high. 2) At 1x103～3x103kJ/m2The forging energy density and the initial forging temperature are 700-900 ℃, the final forging temperature is 300-550 ℃, and particularly 2x103kJ/m2And the initial forging temperature is 750 ℃, and the final forging temperature is 500 ℃, so that the forged sliding plate material has better properties. 3) The preheating temperature of the die is suitable about 200-300 ℃, the preheating temperature of the die is too low, the blank is heated unevenly, and the performance of the material is influenced finally.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A powder hot-forged copper-based pantograph pan material, characterized in that it is obtained by powder hot-forging raw material components including:
5-6 wt% of iron-phosphorus alloy powder, wherein the particle size range is-80 to +300 meshes, and the phosphorus content in the iron-phosphorus alloy powder is 17-19 wt%;
6-7 wt% of iron-nickel pre-alloy powder;
6-9 wt% of chromium powder;
1-4 wt% of tin powder;
0.5-1 wt% of lead powder;
2-5 wt% of flake graphite powder,
the balance being copper powder.
2. The powder hot-forged copper-based pantograph pan material according to claim 1, wherein the iron-nickel pre-alloy powder has a particle size ranging from-200 to +300 mesh, and the content of nickel in the iron-nickel pre-alloy powder is 16 to 18 wt%.
3. The powder hot-forged copper-based pantograph pan material according to claim 1, wherein a particle size of a raw material component of the copper-based pantograph pan material is 5 to 100 μm.
4. The powder hot-forged copper-based pantograph pan material according to claim 1, wherein said copper-based pantograph pan material has a density of 8.10-8.50 g/cm3And/or a resistivity of 0.190 to 0.220 [ mu ] omega-m.
5. A method for preparing a powder hot-forged copper-based pantograph pan material according to any one of claims 1 to 4, comprising:
mixing the raw material components, and performing cold pressing forming to obtain a pressed compact;
sintering the green compact in a hydrogen-containing mixed atmosphere to obtain a sintered compact;
and performing powder hot forging on the sintered blank, and then performing vacuum heat treatment to obtain the copper-based pantograph pan material.
6. The method for preparing the powder hot-forged copper-based pantograph pan material according to claim 5, wherein the temperature in the sintering process is 600-1000 ℃, the temperature is kept for 1-3 h, and the temperature rise rate is 10-20 ℃/min.
7. The method for preparing a powder hot-forged copper-based pantograph pan material according to claim 5, wherein the die initial temperature of the powder hot forging is 200-300 ℃.
8. The method for preparing a powder hot-forged copper-based pantograph pan material according to claim 5 or 7, wherein the powder hot forging is performed at a start forging temperature of 700-900 ℃, a temperature rise rate of 5-20 ℃/min and a finish forging temperature of 300-550 ℃.
9. The method for preparing a powder hot-forged copper-based pantograph pan material according to claim 5, wherein said powder hot forging has a forging energy density of 1x103～3x103kJ/m2。
10. The method for preparing a powder hot-forged copper-based pantograph slider material according to claim 5, wherein the method further comprises an air cooling process after the powder hot forging, and then the step of performing vacuum heat treatment to obtain the copper-based pantograph slider material.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114632934A (en) * | 2022-02-17 | 2022-06-17 | 贵州新安航空机械有限责任公司 | Double-layer copper alloy powder metallurgy pantograph slide plate and manufacturing process thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005314806A (en) * | 2004-03-29 | 2005-11-10 | Nano Gijutsu Kenkyusho:Kk | Powder of nano crystalline copper metal and nano crystalline copper alloy having high hardness and high electric conductivity, bulk material of nano crystalline copper or copper alloy having high hardness, high strength, high electric conductivity and high toughness, and production method thereof |
| CN101233250A (en) * | 2005-07-28 | 2008-07-30 | 三越金属株式会社 | Copper alloy extruded material and method for producing same |
| CN101812609A (en) * | 2009-03-20 | 2010-08-25 | 河南科技大学 | Conductive wear resistant material and preparation method thereof |
| CN103469007A (en) * | 2013-09-27 | 2013-12-25 | 四川莱特新材料科技有限责任公司 | Copper alloy for advanced terminal connector and preparation method and application thereof |
| CN104988438A (en) * | 2015-07-24 | 2015-10-21 | 湖北工业大学 | High-strength and high-conductivity carbon nano tube strengthening copper-based composite material and preparing method thereof |
| CN106435250A (en) * | 2009-04-08 | 2017-02-22 | 瑞士金属-Ums瑞士金属加工有限公司 | Machinable copper base alloy and production method thereof |
| CN107617748A (en) * | 2017-08-30 | 2018-01-23 | 昆明理工大学 | A kind of preparation method of copper/graphite sliding material |
| CN109182833A (en) * | 2018-08-28 | 2019-01-11 | 合肥工业大学 | It is a kind of using spherical chromium powder as copper-base powder metallurgy Material for Pantograph Slide of hardening constituent and preparation method thereof |
-
2021
- 2021-02-04 CN CN202110158685.2A patent/CN112981168B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005314806A (en) * | 2004-03-29 | 2005-11-10 | Nano Gijutsu Kenkyusho:Kk | Powder of nano crystalline copper metal and nano crystalline copper alloy having high hardness and high electric conductivity, bulk material of nano crystalline copper or copper alloy having high hardness, high strength, high electric conductivity and high toughness, and production method thereof |
| CN101233250A (en) * | 2005-07-28 | 2008-07-30 | 三越金属株式会社 | Copper alloy extruded material and method for producing same |
| CN101812609A (en) * | 2009-03-20 | 2010-08-25 | 河南科技大学 | Conductive wear resistant material and preparation method thereof |
| CN106435250A (en) * | 2009-04-08 | 2017-02-22 | 瑞士金属-Ums瑞士金属加工有限公司 | Machinable copper base alloy and production method thereof |
| CN103469007A (en) * | 2013-09-27 | 2013-12-25 | 四川莱特新材料科技有限责任公司 | Copper alloy for advanced terminal connector and preparation method and application thereof |
| CN104988438A (en) * | 2015-07-24 | 2015-10-21 | 湖北工业大学 | High-strength and high-conductivity carbon nano tube strengthening copper-based composite material and preparing method thereof |
| CN107617748A (en) * | 2017-08-30 | 2018-01-23 | 昆明理工大学 | A kind of preparation method of copper/graphite sliding material |
| CN109182833A (en) * | 2018-08-28 | 2019-01-11 | 合肥工业大学 | It is a kind of using spherical chromium powder as copper-base powder metallurgy Material for Pantograph Slide of hardening constituent and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 曲选辉: "《粉末冶金原理与工艺》", 31 May 2013, 冶金工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114632934A (en) * | 2022-02-17 | 2022-06-17 | 贵州新安航空机械有限责任公司 | Double-layer copper alloy powder metallurgy pantograph slide plate and manufacturing process thereof |
| CN114632934B (en) * | 2022-02-17 | 2024-03-15 | 贵州新安航空机械有限责任公司 | Double-layer copper alloy powder metallurgy pantograph slide plate and manufacturing process thereof |
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