CN112867565A - 试样容器 - Google Patents
试样容器 Download PDFInfo
- Publication number
- CN112867565A CN112867565A CN201980068472.1A CN201980068472A CN112867565A CN 112867565 A CN112867565 A CN 112867565A CN 201980068472 A CN201980068472 A CN 201980068472A CN 112867565 A CN112867565 A CN 112867565A
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- Prior art keywords
- layer
- sealing
- temperature
- height compensation
- sample container
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Abstract
本发明涉及一种试样容器(6),其具有试样载体(2)和封护薄膜(1),封护薄膜用于试样载体(2)的微流体的空穴(4)的热封护。封护薄膜(1)具有用于构造与试样载体(2)的粘附连接的封护层(16),其中,封护层(16)具有软化温度,软化温度在封护温度或封护温度以下的范围内,封护层(16)在合规的封护步骤期间被加热到封护温度。此外,封护薄膜(1)包括外层(8),外层具有大于合规的封护加热温度的使用温度,封护加热温度大于或等于封护温度。封护薄膜(1)此外包括高度补偿层(10),其具有在封护加热温度以下的软化温度,从而在高度补偿层(10)中存在小于或等于封护加热温度并且大于或等于封护温度的层温度时,形成了高度补偿层(10)的材料以能与温度相关地延性变形的状态存在。此外,封护薄膜(1)包括隔离层(12),在隔离层(12)中存在小于或等于封护加热温度并且大于或等于封护温度的层温度时,隔离层相对于高度补偿层(10)和封护层(16)具有提高多倍的刚性。高度补偿层(10)在此布置在外层(8)与隔离层(12)之间,并且封护层(16)相对于隔离层(12)靠外侧地布置。
Description
技术领域
本发明涉及一种试样容器,其具有试样载体和封护薄膜,封护薄膜尤其用于试样载体的空穴的热封护。
背景技术
为了诊断目的,已经使用所谓的微流体的试样载体,其通过基底形成,一定数目的通道结构和/或腔(随后共同地被称为“空穴”)引入基底中。在这些空穴中,例如可以分离液体的组成部分,和/或将其导引至(另外的)测试腔。为了构造封闭的通道***,利用封护薄膜覆盖这些空穴,封护薄膜通常与基底连接。在此重要的是,预设的通道横截面也在利用封护薄膜覆盖之后得到保持,以便针对在各个空穴中引导的流体保持预设的流动阻力。
为了可以经济地制造这样的试样载体,试样载体大多构造为注塑构件、热压印构件或热成形的塑料薄膜(因此由塑料构成)。由此,借助封护薄膜提供通道结构的热封护。为此,封护薄膜和必要时还有基底被加热,并且相互挤压。封护薄膜和基底在此通常形成材料锁合的(stoffschlüssig)连接。然而,由于加热也提高以下危险,即,由于空穴的宽度通常在小于一毫米的范围内,空穴通过基底本身的变形或由被加热到所谓的玻璃化转变温度以上的封护薄膜大部分或完全地封闭。
由于该原因,从食物包装的领域已知的封护薄膜是不利的,这些封护薄膜为了补偿基底的表面不精确性具有比较厚的由可易于熔化的材料(例如热封护漆)构成的层。因为在所施加的热温度下熔化的并且在所施加的封护压力下延展的(“压扁的”)材料将导致仅能难以控制地封闭微流体的试样载体的在几微米到大约2000微米的范围内的尺寸(尤其是宽度)的空穴。
因此有时尝试,禁止封护薄膜的软化的部分到空穴中的超过预设公差的流入,从而考虑使用比较硬的、与基底相同的材料作为封护薄膜,例如环烯烃共聚物(“COC”)。然而在此,经常出现以下问题,即,之前提到的表面不精确性基于封护薄膜的比较高的刚性不能够被补偿,并且因此不能够确保密封地封闭通道结构。
发明内容
本发明的任务是改进试样载体的空穴的封护。
根据本发明,该任务通过具有权利要求1的特征的试样容器解决。本发明的另外的有利的以及有创造性的实施方式和改进方案在从属权利要求和随后的描述中被说明。
根据本发明,(也形成独立的发明的)封护薄膜用于热封护根据本发明的试样载体的微流体的空穴。为此,封护薄膜具有用于构造与试样载体的粘附连接的封护层。封护层(特别是其材料)在此具有软化温度,软化温度在封护温度或封护温度以下的范围内,封护层在封护过程的合规的封护步骤期间被加热到封护温度。优选地,封护层的材料相对于形成试样载体的材料选择成粘着性的。此外,封护薄膜具有外层,外层(特别是其材料)又具有使用温度,使用温度对于至少短期的温度负载来说大于合规的封护加热温度,封护加热温度大于或等于封护温度。此外,封护薄膜具有高度补偿层,高度补偿层(尤其高度补偿层的材料)的软化温度在封护加热温度以下,从而在优选在封护过程、尤其合规的封护步骤期间、在高度补偿层中存在小于或等于封护加热温度或大于或等于封护温度的层温度时,形成了高度补偿层的材料以与温度相关地延性的状态存在。优选地,高度补偿层在该步骤温度中以熔融状态存在。在最后一种情况下,高度补偿层、特别是其材料在此优选在软化温度以上具有低的粘度。此外,封护薄膜具有隔离层。在优选在封护过程、尤其合规的封护步骤期间、在隔离层中存在小于或等于封护加热温度或大于或等于封护温度的层温度时,隔离层(其材料)在此相对于高度补偿层和封护层具有提高多倍的刚性。此外,高度补偿层布置在外层与隔离层之间。封护层相对于隔离层在外侧,并且因此布置在封护薄膜的背对外层的(下)侧面上。
在上下文中,术语“封护温度”尤其理解为一种温度、具体是封护层在封护过程期间被加热到的温度值,以便在封护过程的实际的封护步骤中形成与试样载体的粘附连接。封护温度因此尤其是一种封护层在封护过程中被加热到的目标温度。
在上下文中,术语“封护加热温度”尤其理解为一种温度、具体是施加到封护薄膜上的温度值,目的是将封护层加热到前述的封护温度。例如,在封护过程中、尤其在封护步骤中贴靠在外层上的封护工具(随后也被称为“封护板”或“冲头”)、在该情况下尤其是一种加热板、具有封护加热温度。备选地,将热辐射器、加热风扇灯用作加热工具,借助加热工具,将封护加热温度尤其无接触地施加到封护薄膜上、尤其外层上。
优选地,在合规的封护过程中,相对于封护温度更高的温度值被考虑为封护加热温度,并且借助封护板或其他的加热工具施加到封护薄膜的外层。封护加热温度和过程步骤持续时间在此通常被选择为,使得在过程步骤持续时间内,由于通过外层、高度补偿层和隔离层的热传导而形成温度梯度,在该温度梯度中,将封护层加热到封护温度。由此可以总体上节省处理时间。在此在各个层、尤其高度补偿层和隔离层中存在的温度值在上下文中被称为“层温度”,并且因此处在封护加热温度与封护温度之间。备选地,在“静态的”变型方案中,封护加热温度也可以选择为与封护温度相等。在该情况下要等待至整个封护薄膜并且进而是所有层加热到封护温度。
“与相关温度地延性的状态”在上下文中尤其理解为,高度补偿层的材料在封护温度以上、尤其在相应的层温度(与室温不同)中具有尽可能小的变形阻力,并且因此在相应的层温度中可以比较简单地(尤其基于在合规的封护过程中通常借助封护工具施加的过程力、尤其“封护压力”)塑性地变形。
优选地,在“封护时间点”、即在封护步骤期间、尤其当封护层加热到封护温度并且优选利用封护工具挤压到试样载体上时,封护层具有高的粘度、优选相对于高度补偿层更高的粘度(因此更小的与温度相关地延性的可变形性),高度补偿层因此在该时间点被加热到其层温度。
优选地,尤其在隔离层的层温度中并且因此必要时还在封护温度以上,隔离层(具体地其材料)也具有尤其与高度补偿层和封护层相比更小的塑性可变形性,因此具有比较高的强度。
特别优选地,高度补偿层的材料的粘度至少在如下时间点小于封护层的粘度,即,在该时间点,封护层被加热到封护温度或封护温度以上,并且因此高度补偿层的层温度等于或大于封护温度。
术语“使用温度”、尤其“短期的使用温度”在上下文中尤其理解为以下温度,即,没有超过预设极限的变形的材料可以在尤其没有熔化的塑料的情况下至少短暂地、即尤其在几秒至几十秒内暴露于该温度下。在塑料情况下,使用温度通常形成所谓的耐热性的极限。
术语“软化温度”在上下文中尤其理解为如下温度(具体是温度值),从该温度开始,尤其是(尤其是无定形的)塑料过渡到橡胶弹性的区域,并且因此其形状改变能力(特别是其延性)增大。进入熔融状态的过渡从软化温度开始平稳地进行。软化温度尤其在无定形的塑料(优选无定形的热塑性塑料)中也被称为“玻璃化转变温度”。优选与部分结晶的塑料相关联地,软化温度在上下文中尤其也与熔化温度相等,从该熔化温度开始,塑料的结晶相过渡到熔融状态。该熔化温度在此通常高于部分结晶的塑料的无定形的相的玻璃化转变温度。
在隔离层的合规的层温度中,即当封护层加热到封护温度时,相对于高度补偿层和封护层提高多倍的刚性在上下文中尤其理解为,隔离层在该层温度下具有高的变形阻力(因此很小的“延性”或“塑性”),相反地,在高度补偿层中并且优选也在封护层中的同类的参数也与温度相关地尤其是可忽略不计地小,或不能确定(尤其与温度相关地不再能确定)。
优选地,合规的封护温度和封护层的材料彼此相关联地选择,从而封护层的软化温度位于封护温度或封护温度以下的范围内。封护层的材料优选被选择为,使得其软化温度例如在大约50和140℃之间,尤其在70至110℃之间。随后,在封护过程中考虑到的封护加热温度和必要时过程步骤持续时间通常被选择为,使得合规的封护温度在封护层的材料的软化温度中或封护层的材料的软化温度以上。例如,封护温度在该情况下通常在80与140摄氏度(℃)之间的范围内。例如借助前述的封护板施加的封护加热温度在该情况下例如尤其在尽可能短的过程步骤持续时间的情况下是大约130至200℃、尤其是大约170℃。
基于封护薄膜的前述的多层的结构,有利地可以阻止的是,封护薄膜在试样载体的空穴的热封护的情况下强烈变形以至于空穴在横截面方面减小到超过与应用相关地预设的极限。这尤其以如下方式实现,即高度补偿层在封护过程中、即尤其在相应的层温度中、优选在封护温度以上,在以仅是很小的力作用进行的可塑性变形的状态下,尤其是以熔融的状态存在,并且由此在外层与隔离层之间形成可比较简单地变形的“垫子”。相反地,基于隔离层的比较高的刚性阻止的是,在通过安置到外层上的封护工具、尤其封护板施加的封护压力的作用下,高度补偿层的熔融的材料会过度地流入试样载体的(具体地微流体的)空穴中。隔离层因此对(优选熔化的)高度补偿层产生阻尼作用。尤其针对以下情况,即在加热到封护温度的状态中,封护层的材料虽然加热到其软化温度以上,但基于其比较高的、优选相对于高度补偿层提高的粘度而具有沿封护薄膜的面方向的比较小的流动趋势,此外与隔离层共同作用地阻止的是,封护层的材料流入空穴中。高度补偿层相反地尤其以可变形的垫子的形式用于补偿在试样载体的接触面上的尤其比较大(例如最大50微米、尤其大于10和/或最大30微米)的不平坦性(即尤其是高度差异,其例如作为取决于制造的凹陷部等在试样载体上出现)。借助封护工具施加的封护压力因此可以比较均匀地传输到随后的层上,并且因此也传输到试样载体的(至少近似)整个接触面上。此外,封护层由此又可以具有前述的高的(尤其相对于高度补偿层提高的)粘度,这是因为其不必补偿或仅在很小的(剩余)份额中补偿上述那么大的不平坦性。因此有利地又可以减小封护层的在封护过程期间流入要封护的空穴中的趋势。此外,通过外层的相对于封护加热温度提高的使用温度能够实现,外层的材料没有粘附在封护工具上,并且尤其保持其空间稳定性。外层因此用作在封护过程中熔融的高度补偿层的相对于封护工具的保护层。
在优选的实施方案中,外层优选在加热到封护加热温度或所产生的层温度的状态下至少相对于高度补偿层和/或封护层,可选地也相对于隔离层(尤其在其相应的产生的层温度中在封护步骤期间)具有提高的刚性、尤其是提高的变形阻力。基于提高的刚性,有利地阻止的是,整个封护薄膜“挂入”要封护的空穴中,即拱入空穴中。也就是说,外层的所选择的刚性有助于整个封护薄膜在(相应的)空穴的区域中的稳定。此外,由此也能够实现的是,外层形成几乎平面的表面(即没有凹陷部),该表面例如可以在实验室运行中特别有效地接至热传输面。
在另外的优选的实施方案中,外层的材料具有依赖于温度的至少沿封护薄膜的面方向的收缩倾向。在此优选地,外层的材料(可选地还有隔离层的材料)和/或尤其工艺流程在封护时被选择为,使得材料具有由温度引起的收缩。例如,外层的材料(可选地还有隔离层的材料)是拉伸的塑料材料(例如经拉伸的薄膜),其在加热和分子链的随之发生移动时尤其基于分子链的松弛(分子链在此尤其“扭在一起”)而收缩。附加地或备选地,封护薄膜与试样载体有区别地加热,例如封护薄膜首先(例如借助加热辐射器或加热风扇)被加热,并且随后放置到尤其冷的(即没有被加热的)或较底地被加热的试样载体上。由此,基于温度差异,在冷却到室温时产生不同的收缩(可选地仅封护薄膜的收缩)。可选地,在使用前述的加热板时,不等待对试样载体的加热,从而由此产生不同的加热。外层在封护时的收缩为此是有利的,即,以该方式可以避免形成波纹,并且进而可以避免封护薄膜的不平坦的表面。外层的膨胀相反地将促进凹陷部,并且进而促进外层或整个封护薄膜在相应的空穴的区域中的下垂。
在另外的适宜的实施方案中,根据至少一个尺寸、优选是要封护的空穴的宽度(即尤其是空穴的沿试样载体的面方向的最小的延伸)选择隔离层的厚度。适宜地,优选鉴于比较平坦的(“浅的”)通道选择厚度,通道的深度优选小于500μm。在此优选地,根据要封护的空穴的宽度和尤其是封护薄膜到空穴的预设的允许的下沉来选择隔离层的厚度。尤其当下沉深度应该减小,和/或宽的(和尤其平坦的)空穴(宽度优选小于1.5毫米)应该由封护薄膜跨越时,选择隔离层的更大的厚度。由此,隔离层和进而封护薄膜总体上变得更坚硬,并且减小了到空穴中的下沉或在空穴上方的封护薄膜的下垂。然而优选地,隔离层的厚度是至少15微米、尤其大于20微米并且特别优选大约30微米。在此,30微米的厚度对于在具有多个不一样宽的空穴的试样载体上的应用来说证实为是有利的,从而平均而言在空穴的不同的宽度上能够实现封护薄膜(具体地,高度补偿层和隔离层以及封护层)到各个空穴中的足够小的下沉。
在优选的实施方案中,外层由塑料、具体是由热塑性的塑料形成。
在适宜的改进方案中,外层在此由双轴拉伸的聚对苯二甲酸乙二醇酯(简称为BOPET)、环烯烃共聚物(“COC”、尤其具有相应高的玻璃化转变温度)、聚三氟氯乙烯(简称为PCTFE)、聚丙烯(PP)、环烯烃聚合物(COP)、聚酰亚胺(PI)、聚醚醚酮(PEEK)或聚酰胺(PA)形成。前述的塑料在此具有以下优点,即这些塑料具有比较高的短暂的工作温度(即前述的使用温度),并且因此在封护加热温度中有效地避免损坏、熔化等。
在优选的实施方案中,高度补偿层由尤其与外层相比低熔点的(即具有低的熔化温度的)热塑性的塑料构造。通过对塑料的选择,特别是其延性的可变形性和/或在密封加热温度作用下提高的流动能力,可以影响试样载体上的不平坦性的高度补偿的适用性。在封护温度(其尤其在封护层与试样载体之间的封护面上存在)小于90℃的情况下,线性的低密度的聚乙烯(也被称为“PE-LLD”)是合适的,而对于更高的封护温度(例如大于100℃),也可以使用低密度的聚乙烯、尤其支化的聚乙烯(也被称为“PE-LD”),或者在进一步提高封护温度的情况下,也可以使用高密度的聚乙烯(“PE-HD”)或具有合适的(即尤其低的)熔化温度的热塑性的弹性体(TPE)。同样也可以使用具有相应低的熔点的乙烯醋酸乙烯酯(EVA)。高度补偿层的设计、尤其材料选择优选在考虑到隔离层的情况下进行。在此考虑到的是,在高度补偿层的流动能力升高时,高度补偿层的侧向的塑性的可变形性增大,并且因此也可以补偿试样载体的比较大的表面不平坦性,和/或可以发生到空穴中的更大的下沉。在此,到相应的(具有小的尺寸的)空穴中的局部的下沉优选与根据高度补偿层的流动能力坚硬地选择的隔离层相反地作用。
在优选的实施方案中,在给外层以合规的方式加载以封护加热温度时,隔离层、特别是其材料具有大于由封护工具施加的封护加热温度、至少大于在隔离层中出现的层温度的软化温度。因此有利地能够实现的是,隔离层也在封护过程中保持其形状稳定性(即特别是其刚性还是足够高的),并且因此减小或甚至禁止通过在封护压力下朝试样载体的凹形的表面结构的方向流动的高度补偿层对要封护的空穴的填充。
可选地,在前述的实施方案中,隔离层由铝、尤其铝薄膜形成。此外可选地,隔离层由塑料、优选COC(尤其具有高的玻璃化转变温度)、聚碳酸酯(PC)、聚甲基丙烯酸甲酯(简称PMMA)、聚苯乙烯(PS)形成,或通过其他的设置用于外层的塑料形成。
在适宜的实施方案中,封护层通过单独的聚合物层形成。在该情况下,封护层尤其是通过共挤或层压(Kaschieren)而施加到隔离层或必要时存在的中间层上的薄膜状的层。
在备选的实施方式中,封护层通过隔离层的近表面层形成,该近表面层通过对该(在该实施方案中由塑料形成的)隔离层的表面处理被改性。例如,为此借助溶剂近表面地溶解隔离层,和/或通过辐射、等离子体处理或臭氧处理近表面地以如下方式改性隔离层,即,近表面的聚合物链能在比未受影响的“散装材料”更小的层温度中被热封护。隔离层的近表面层随后具有与剩余的未被改性的隔离层不同的热特性和特别是流变特性。
在另外的适宜的实施方案中,封护层的材料是COC,其优选与形成外层和/或隔离层的COC类型不同。例如,封护层通过具有大约79℃的玻璃化转变温度的COC类型形成。在该情况下,隔离层例如通过具有在大约135摄氏度的范围内的玻璃化转变温度的COC类型形成。备选地,封护层通过对隔离层的COC类型的前述的表面处理构造。
在另外的备选的变型方案中,封护层通过热熔粘合材料(也被称为“Hotmelt(热熔胶)”)形成。在此可选地,热熔粘合材料是纯热塑性的热熔粘合材料。备选地,其是反应性的热熔粘合材料、例如基于聚氨酯的反应性的热熔粘合材料,或是UV预交联的和/或UV交联的(热熔)粘合剂。
在优选的实施方案中,封护层的厚度是大约5至30微米之间,优选是大约20微米。在该厚度中,有利地,封护层的通过软化温度被加热的材料在封护过程中到空穴中的下沉或渗入是足够小的,但仍然能够补偿试样载体的表面上的比较尖棱的和/或比较小的(“平坦的”)不平坦性(数量级最高为10或15微米),不平坦性例如由铣削轨迹或制造工具中的刮刀而导致。
在可选的实施方案中,封护薄膜具有至少一个、可选地多个附加的、尤其在前述的层之间的层。这些层例如用于使前述的层、即外层、高度补偿层、隔离层和封护层相互更好地粘附。
根据本发明的试样容器具有前述的试样载体。如前述的那样,试样载体具有一定数目的微流体的空穴(尤其通道结构和/或腔),用于容纳流体。此外,试样容器具有前述的封护薄膜。一定数目的微流体的空穴可以借助封护薄膜被封护,或者在合规的封护状态中已经被封护。
在上下文中,“微流体的空穴”尤其理解为具有几十到几百微米(必要时个位数毫米)的宽度的通道或腔。通道或腔的长度在此在大约相同的数量级上延伸,或甚至延伸最大几十毫米。
前述的封护薄膜因此优选用于封护试样载体的一定数目的空穴。
根据本发明的试样容器因此同样具有之前结合封护薄膜描述的特征和优点。
优选地,封护层和/或试样载体的材料被选择为,使得它们彼此兼容,尤其在彼此间的粘附能力方面彼此兼容,因此,两种材料可以相互粘合(尤其没有单独的附加材料)。例如,两种材料都是极性的或非极性的。
例如,试样载体的材料通过COC或其他的与封护层兼容的具有在60至150℃之间、优选在100至140℃之间的玻璃化转变温度的塑料形成。在大于135℃的玻璃化转变温度中,优选提高封护温度,从而在封护层与试样载体之间的粘附连接的构造被简化(基于尤其依赖于温度的扩散效应等)。在合规的封护步骤中,在此减小封护压力,以便避免高度补偿层的材料的太强的侧向的流动。
试样载体在此可选地形成为注塑构件、热压印构件或热成形的塑料薄膜。
在上下文中,连词“和/或”尤其理解为,借助该连词结合的特征可以不仅共同地构成,而且相互备选地构成。
附图说明
随后,本发明的实施例借助附图详细示出。在其中:
图1以示意性的和区段式的截面图示出了封护薄膜;
图2以根据图1的视图示出了试样容器,其具有带空穴的试样载体,空穴通过根据图1的封护薄膜封护,并且
图3以根据图2的视图示出了试样容器,其具有三个大小不一样的共同借助封护薄膜封护的空穴。
彼此相应的部分在所有附图中始终设有相同的附图标记。
具体实施方式
图1示意性地以横截面图示出了封护薄膜1。封护薄膜1由多个由不同的塑料形成的层制成。封护层1具体地用于封护图2所示的试样载体2,具体地用于封护成形到试样载体2中的空穴4。试样载体2是由具有大约110℃的玻璃化转变温度的COC形成的基底,一定数目的所谓的微流体的通道和腔、即具有几十至几百微米(必要时也是个位数毫米)的宽度的通道或腔引入基底中。通道或腔的长度在此在大约相同的数量级上延伸,或甚至延伸至几十毫米。这些通道或腔分别构造出空穴4。封护薄膜1和试样载体2一起形成试样容器6(参见图2)。
封护薄膜1的层结构包括外层8,外层在所示的实施例中通过双轴拉伸的聚对苯二甲酸乙二醇酯(BOPET)的12.5微米厚的层形成。外层8与高度补偿层10相邻,该高度补偿层由具有30微米的厚度的低密度聚乙烯形成。高度补偿层10与隔离层12相邻,隔离层由具有大约135℃的玻璃化转变温度的COC的30微米厚的层形成。在封护薄膜1的与外层8相对置的下侧14,封护薄膜的层结构具有封护层16,封护层由具有大约79℃的玻璃化转变温度的COC形成。
为了封护试样载体2的空穴4,封护薄膜1借助未详细示出的封护工具、具体是“封护板”被挤压到试样载体2上。封护工具在此贴靠在外层8上,并且加热到封护加热温度,封护加热温度明显位于封护层16的软化温度或玻璃化转变温度以上。具体地,封护加热温度在描述的实施例中是170℃,以便能够实现将封护薄膜1并且进而将封护层16尽可能快速地加热到封护温度,封护温度同样位于封护层16的玻璃化转变温度以上。在比较短的几秒(例如最大5、10秒或最大20秒)的加热时间中,封护温度基于构造在封护薄膜1中的温度梯度在当前的实施例中是大约100℃至110℃。在此,通过封护工具加热封护薄膜1和试样载体2的近表面层。在封护温度中,封护层16软化,从而可以利用试样载体2的材料进行扩散过程,并且因此封护薄膜1熔融并且粘附在试样载体2上。
封护加热温度位于外层8的材料的软化温度以下。隔离层12的基于温度梯度形成的层温度同样位于隔离层12的材料的软化温度以下。相反地,封护加热温度和高度补偿层10的形成的层温度位于软化温度以上,具体地位于高度补偿层10的材料的熔化温度以上。因此,在封护过程中加热封护薄膜1时,高度补偿层10的材料过渡到可容易塑性变形的、具体地熔融的状态。因为高度补偿层10的低密度的聚乙烯在熔融状态下具有比较低的粘度,所以高度补偿层10的熔体可以在由封护工具施加的封护压力的作用下沿封护薄膜1的面方向18被挤压,并且因此沿面方向18流动。
由于高度补偿层10的材料的侧向流动,试样载体2的基底中的凹陷部20可以通过高度补偿层10的材料的堆积来填充,其方法是,使隔离层12和封护层16沿凹陷部20的方向偏转。相应相反地,在试样载体2上的***部22可以通过变薄,具体地沿面方向18侧向挤压高度补偿层10的材料同样被补偿。
因为隔离层12在其层温度中还没有被加热到其软化温度上,所以隔离层同样具有高的刚性,从而阻止隔离层12和连接至隔离层的封护层16过度地(即超过特定于应用设置的极限地)下沉到空穴4中。在此,在空穴4的小于500微米、尤其小于100微米的宽度的情况下,封护薄膜1仅稍微下沉到空穴4中。
封护层16的粘度即使在封护温度下也相对于高度补偿层10的粘度明显提高,从而禁止封护层16、具体地封护层16的材料沿面方向18的流动,或该流动仅在可忽略的程度中是可能的。
外层8形成相对于封护工具温度稳定的保护层,保护层阻止封护薄膜1的材料保持粘附在加热到封护加热温度的封护工具上。此外,材料、尤其外层8的BOPET即使在封护加热温度下也具有高的刚性,从而有效地禁止外层8到相应的空穴4中的挂入(或下垂)。因此,外层8也在空穴4封护之后形成至少近似平面的外表面,在合规的实验室运行中,热传输面(例如加热或冷却面)可以连接至外表面。如果在空穴4的大小足够的情况下,外层8仍然稍微拱入空穴4中,那么外层可以通过在合规的实验室运行中通常存在于空穴4中的流体压力再次朝外侧拱回。
图3示例性地示出了具有多个不一样大的空穴4的试样载体2。在其上可以清楚地描述根据本发明的封护薄膜1的效果。在图3中,在最下方示出的空穴4设有最小的横截面。相应地,基于在封护过程中液化的高度补偿层10,封护薄膜1的拱入也很小。在其上方(在中间)示出的增大的空穴4中,封护薄膜1的拱入相对于下方的空穴4稍微变大,然而按百分比来看与在下方的空穴4中相比甚至更小。因此,基于对试样载体2的表面不平坦性的上述的匹配,封护薄膜1可以借助高度补偿层10全面连接至试样载体2的表面。但仍然也可以避免太强地封闭相应的空穴4。
如借助在图3中上方示出的空穴4(其宽度在大约2毫米的范围内)可看到的那样,在该情况下,封护薄膜1没有完全如在图3的下方区域中的更小的空穴4中那样拱入,而是仅在空穴4的边缘附近的区域24中进行拱入。在此,从试验结果证实的是,在封护薄膜1的材料和层厚的前述的选择中,在边缘区域24中的封护薄膜1的拱入大约在500微米的范围内朝空穴4的中心的方向延伸。
本发明的主题并不局限于前述的实施例。相反地,本发明的另外的实施方式可以由本领域技术人员从之前的描述推导出。
附图标记列表
1 封护薄膜
2 试样载体
4 空穴
6 试样容器
8 外层
10 高度补偿层
12 隔离层
14 下侧
16 封护层
18 面方向
20 凹陷部
22 ***部
24 边缘区域
Claims (11)
1.试样容器(6),
所述试样容器具有试样载体(2)和封护薄膜(1),所述试样载体具有一定数目的微流体的空穴(4)用以容纳流体,借助所述封护薄膜能封护所述一定数目的空穴(4),或者在合规的封护状态中封护所述一定数目的空穴,其中,所述封护薄膜(1)具有:
-用于构造与试样载体(2)的粘附连接的封护层(16),其中,所述封护层(16)具有在封护温度或封护温度以下的范围内的软化温度,所述封护层(16)在合规的封护步骤期间被加热到所述封护温度,
-外层(8),所述外层具有大于合规的封护加热温度的使用温度,所述封护加热温度大于或等于封护温度,
-高度补偿层(10),所述高度补偿层具有在封护加热温度以下的软化温度,从而在高度补偿层(10)中存在小于或等于封护加热温度并且大于或等于封护温度的层温度时,形成了高度补偿层(10)的材料以能与温度相关地延性变形的状态存在,和
-隔离层(12),在隔离层(12)中存在小于或等于封护加热温度并且大于或等于封护温度的层温度时,所述隔离层相对于高度补偿层(10)和封护层(16)具有提高多倍的刚性,
其中,所述高度补偿层(10)布置在外层(8)与隔离层(12)之间,并且所述封护层(16)相对于隔离层(12)靠外侧地布置。
2.根据权利要求1所述的试样容器(6),
其中,所述封护薄膜(1)的外层(8)至少相对于高度补偿层(10)和/或封护层(16)具有提高的刚性。
3.根据权利要求1或2所述的试样容器(6),
其中,所述外层(8)具有依赖于温度的至少沿面方向(18)的收缩倾向。
4.根据权利要求1至3中任一项所述的试样容器(6),
其中,依赖于要封护的空穴(4)的尺寸地有区别地选择隔离层(12)的厚度。
5.根据权利要求1至4中任一项所述的试样容器(6),
其中,所述外层(8)由BOPET、COC、PCTFE、PP、COP、PI、PEEK或PA形成。
6.根据权利要求1至5中任一项所述的试样容器(6),
其中,所述高度补偿层(10)由PE-LD、PE-LLD、PE-HD、EVA或TPE形成。
7.根据权利要求1至6中任一项所述的试样容器(6),
其中,所述隔离层(12)具有大于在合规的封护过程中存在于隔离层(12)中的层温度的软化温度,并且/或者,其中,所述隔离层(12)由铝、COC、PC、PMMA、COP、PI、PA、PEEK或PS形成。
8.根据权利要求1至7中任一项所述的试样容器(6),
其中,所述封护层(16)通过单独的聚合物层形成。
9.根据权利要求1至7中任一项所述的试样容器(6),
其中,所述封护层(16)通过隔离层(12)的经由表面处理改性的近表面层形成。
10.根据权利要求1至9中任一项所述的试样容器(6),
其中,所述封护层(16)由COC或热熔粘合材料形成。
11.根据权利要求1至10中任一项所述的试样容器(6),
其中,所述封护层(16)的厚度在5至30微米之间,优选是大约20微米。
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PCT/EP2019/076870 WO2020078736A1 (de) | 2018-10-19 | 2019-10-04 | Probenbehälter |
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JP2022512257A (ja) | 2022-02-02 |
CA3153549A1 (en) | 2020-04-23 |
US11654432B2 (en) | 2023-05-23 |
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