CN112838899A - Light receiving module and optical module - Google Patents
Light receiving module and optical module Download PDFInfo
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- CN112838899A CN112838899A CN202110037506.XA CN202110037506A CN112838899A CN 112838899 A CN112838899 A CN 112838899A CN 202110037506 A CN202110037506 A CN 202110037506A CN 112838899 A CN112838899 A CN 112838899A
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- amplifier
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- semiconductor optical
- light receiving
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- 230000003287 optical effect Effects 0.000 title claims abstract description 120
- 239000004065 semiconductor Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims description 11
- 239000013307 optical fiber Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 abstract description 25
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 230000002238 attenuated effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005070 sampling Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
- H04B10/66—Non-coherent receivers, e.g. using direct detection
- H04B10/67—Optical arrangements in the receiver
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to an optical receiving assembly and an optical module, wherein the optical receiving assembly comprises a photodiode, a transimpedance amplifier and a semiconductor optical amplifier, the photodiode is used for amplifying a received optical signal, the photodiode is used for converting the optical signal amplified by the semiconductor optical amplifier into an electric signal, and the transimpedance amplifier amplifies the electric signal again. The semiconductor optical amplifier can amplify the optical signal after the long-distance transmission attenuation again, then receive the optical signal by the PIN photodiode after being adjusted by the optical component, and then send the optical signal to the receiving end processing circuit of the module after being amplified by the trans-impedance amplifier. In the scheme of the invention, the semiconductor optical amplifier is integrated in the optical receiving assembly, so that the attenuated optical signal after long-distance transmission is effectively amplified, the transmission distance of the optical module is prolonged, and effective hardware technical support is provided for the transmission network expansion transmission distance and the intermediate transmission network part in the ongoing 5G network deployment.
Description
Technical Field
The present invention relates to the field of optical communication technologies, and in particular, to an optical receiving module and an optical module.
Background
An optical module is a device that can convert an optical signal into an electrical signal and convert the electrical signal into an optical signal, and a ROSA (receiver optical subassembly) is an essential component in most optical modules and is used for receiving the optical signal. With the popularization of 5G and the promotion of large-scale data center construction, meanwhile, various applications need a high-speed and long-distance optical network for support, and as a key core device of the optical network, an optical receiving component plays an irreplaceable role. Therefore, how to extend the transmission distance of the optical module is a technical problem to be solved urgently at present.
Disclosure of Invention
The invention aims to provide a light receiving module and an optical module which can prolong the light transmission distance.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
in one aspect, an embodiment of the present invention provides an optical receiving component, which includes a photodiode, a transimpedance amplifier, and a semiconductor optical amplifier, and is configured to amplify a received optical signal, where the photodiode is configured to convert the optical signal amplified by the semiconductor optical amplifier into an electrical signal, and the transimpedance amplifier amplifies the electrical signal again.
In the above scheme, by integrating the semiconductor optical amplifier into the optical receiving component, the optical signal after long-distance transmission attenuation can be amplified again, adjusted by the optical component and received by the PIN photodiode again, and then amplified by the transimpedance amplifier and sent to the receiving end processing circuit of the module, so that the attenuated optical signal after long-distance transmission is effectively amplified, the transmission distance of the optical module is prolonged, and effective hardware technical support is provided for the transmission network expansion transmission distance and the intermediate transmission network part in the ongoing 5G network deployment.
Further optimally, the semiconductor refrigerator and the thermistor are further included, and the semiconductor refrigerator controls the working temperature of the internal devices of the receiving device according to the sampling value of the thermistor.
According to the scheme, the thermistor is used for sensing the temperature in real time, and then the semiconductor refrigerator is used for refrigerating and radiating, so that constant temperature control can be realized, the semiconductor optical amplifier can work at the optimal temperature, the performance of the semiconductor optical amplifier is improved, and the service life of the semiconductor optical amplifier is prolonged.
The optical fiber is provided with a first condensing lens, a second condensing lens and a third condensing lens, wherein the first condensing lens is arranged in front of the optical path of the semiconductor optical amplifier and is used for condensing the light from the optical fiber into the waveguide of the semiconductor optical amplifier.
Preferably, the optical module further comprises a first condensing lens arranged behind the optical path of the semiconductor optical amplifier and used for condensing the light amplified by the semiconductor optical amplifier to the photodiode.
In the scheme, the light is converged by arranging the condensing lens, so that the light loss is reduced, and the coupling efficiency is effectively improved.
The transresistance amplifier is arranged on the tube seat, and the tube seat is respectively connected with the semiconductor refrigerator, the transresistance amplifier and the semiconductor optical amplifier through corresponding pins.
The high-speed 8-pin TO packaging tube seat (without GND pin) is adopted in the scheme, so that not only is enough connecting pin provided, but also technical guarantee is provided for high-speed signal transmission.
Further, the semiconductor optical amplifier further comprises a substrate, and the semiconductor optical amplifier is mounted on the substrate.
In the scheme, the semiconductor optical amplifier is fixedly installed through the substrate, the stability of the semiconductor optical amplifier is enhanced, the height of the semiconductor optical amplifier can be adjusted, and the concentricity of optical paths is guaranteed.
Further optimally, the device also comprises a support, and the semiconductor optical amplifier, the trans-impedance amplifier, the second condenser lens and the thermistor are fixedly installed through the support.
Among the above-mentioned scheme, provide and set up the support, not only can ensure the installation of each components and parts fixed, but also can realize the overall arrangement transform between each components and parts to change light receiving assembly's whole size.
Furthermore, the device also comprises a shell, and the photodiode, the transimpedance amplifier and the semiconductor optical amplifier are all packaged in the shell.
On the other hand, the embodiment of the invention also provides an optical module and a light emitting assembly, and further comprises the light receiving assembly in any embodiment of the invention.
Compared with the prior art, the invention has the beneficial effects that: a TEC temperature control component, a PIN photodiode, a transimpedance Amplifier, a Semiconductor Optical Amplifier (SOA) and a related Optical component are integrated on a cap of a TO-CAN (in this example, TO-60 is taken as an example for explanation), wherein the Semiconductor Optical Amplifier CAN amplify an Optical signal after long-distance transmission attenuation again, then receive the Optical signal after being adjusted by the Optical component again by the PIN photodiode, and then send the Optical signal after being amplified by the transimpedance Amplifier TO a receiving end processing circuit of a module. In the scheme of the invention, the semiconductor optical amplifier is integrated in the optical receiving assembly, so that the attenuated optical signal after long-distance transmission is effectively amplified, the transmission distance of the optical module is prolonged, and effective hardware technical support is provided for the transmission network expansion transmission distance and the intermediate transmission network part in the ongoing 5G network deployment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a light receiving module according to an embodiment of the present invention.
Fig. 2 is an exploded view of the light receiving module according to the embodiment of the present invention.
Fig. 3 is a schematic diagram of pin connection in the light receiving module shown in fig. 1.
Fig. 4 is a diagram of the verification result under the open system.
11-tube seat; 12-a semiconductor refrigerator; 13-a first condenser lens; 14-transimpedance amplifier (TIA); 15-a photodiode; 16-Semiconductor Optical Amplifier (SOA); 17-substrate (Submount); 18-a thermistor; 19-a scaffold; 20-second condenser lens.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the light receiving module provided in this embodiment includes a tube seat 11 with 8 pins (excluding a GND pin), a Semiconductor cooler 12 (TEC) is disposed on the tube seat 11 for cooling and dissipating heat, and is matched with a thermistor 18, the thermistor 18 samples a current temperature of the temperature, and the Semiconductor cooler 12 cools and dissipates the heat based on a set temperature threshold and a current temperature sampling value to form a closed-loop temperature control system, so that a Semiconductor Optical Amplifier 16 (SOA) works at an optimal temperature (e.g., a temperature range) to ensure performance of the Optical Semiconductor Amplifier. A transimpedance amplifier 14 (TIA) is provided above the semiconductor refrigerator 12 to amplify an output current of the photodiode 15. The transimpedance amplifier 14 is connected to a photodiode 15, and the photodiode 15 converts an optical signal into a current signal and outputs the current signal to the transimpedance amplifier 14. A first condensing lens 13 is disposed above the photodiode 15, and is configured to condense the optical signal amplified by the semiconductor optical amplifier 16. A semiconductor optical amplifier 16 is disposed above the first condenser lens 13 to amplify an optical signal output from the second condenser lens 20. A second condenser lens 20 is disposed above the semiconductor optical amplifier 16 to condense light from the optical fiber into the waveguide of the semiconductor optical amplifier 16.
The descriptions of orientations of the upper and lower portions herein are based on the layout shown in the drawings, and are relative concepts rather than absolute concepts.
As shown in fig. 3, the 8 pins (excluding the GND pin) in the stem 11 include a TEC-pin and a TEC + pin connected to the TEC, an Rth pin connected to the thermistor 18, a VCC pin connected to the power supply, an Rx + pin and an Rx-pin connected to the transimpedance amplifier 14, an SOA pin connected to the semiconductor optical amplifier 16, and an RSSI pin connected to the signal terminal.
In a specific implementation, the photoresistor 18 and the semiconductor optical amplifier 16 may be disposed on a substrate 17, and the substrate 17 may not only perform a fixing function, but also adjust and compensate the height of the semiconductor optical amplifier 16, so that the whole optical path is concentric. In addition, the transimpedance amplifier 14, the substrate 17, the first condenser lens 13, and the second condenser lens 20 may be mounted on a support 19 to ensure stability of the respective components.
The semiconductor optical amplifier 16 may amplify the optical signal after the long-distance transmission attenuation again, receive the optical signal again by the PIN photodiode 15 after the optical component adjustment, and then send the optical signal after the amplification by the transimpedance amplifier 14 to the receiving end processing circuit of the module. In the scheme of the invention, the semiconductor optical amplifier 16 is integrated in the optical receiving assembly, so that the attenuated optical signal after long-distance transmission is effectively amplified, the transmission distance of the optical module is prolonged, and effective hardware technical support is provided for the transmission network extension transmission distance and a relay network part in ongoing 5G network deployment. As shown in fig. 4, the verification result of the open system built by the discrete components: after being transmitted by 80KMG.652 single-mode optical fiber, the sensitivity is about-28.8 dbm @ 5E-5.
As shown in fig. 1, in one embodiment, the bracket 19 has an L-shaped structure, and the transimpedance amplifier 14, the photodiode 15, and the condenser lens are mounted on the lateral mounting surface of the L-shaped structure, and in this case, the semiconductor refrigerator 12 is mounted below the lateral mounting surface of the bracket 19. The substrate 17 is mounted on the longitudinal mounting surface of the L-shaped structure, and in this case, the thermistor 18 may be disposed on the substrate or may be disposed on the longitudinal mounting surface of the L-shaped structure.
In the structure shown in fig. 1, the optical path is in a linear structure, that is, the devices on the optical path are arranged in sequence, which has the advantage of simple structure, but has the disadvantage that the longitudinal optical path is longer, which is not favorable for reducing the total length of the light receiving device. It will be readily appreciated that other arrangements of the components in the optical path are possible, such as the addition of one or more mirrors to reflect the received optical signal to alter the optical path, then to amplify it by a semiconductor optical amplifier, and to convert it by optical components, which advantageously reduces the overall length of the optical receiving component.
Of course, in practical products, the light receiving module further includes a housing, and the components are enclosed in the housing, which is not shown in the drawings.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (9)
1. The light receiving component comprises a photodiode and a transimpedance amplifier, and is characterized by further comprising a semiconductor optical amplifier and used for amplifying a received optical signal, wherein the photodiode is used for converting the optical signal amplified by the semiconductor optical amplifier into an electric signal, and the transimpedance amplifier is used for amplifying the electric signal again.
2. The light receiving module as claimed in claim 1, further comprising a semiconductor refrigerator and a thermistor, wherein the semiconductor refrigerator controls an ambient temperature based on a sampled value of the thermistor.
3. A light receiving module as claimed in claim 1, further comprising a second condenser lens disposed in optical path front of the semiconductor optical amplifier for condensing light from the optical fiber into the waveguide of the semiconductor optical amplifier.
4. A light receiving module as claimed in claim 3, further comprising a first condenser lens disposed behind the optical path of the semiconductor optical amplifier for condensing the light amplified by the semiconductor optical amplifier to the photodiode.
5. The light receiving module of claim 2, further comprising a socket, wherein the transimpedance amplifier is disposed on the socket, and the socket is connected to the semiconductor cooler, the transimpedance amplifier, and the semiconductor optical amplifier via corresponding pins, respectively.
6. The light receiving module of claim 1, further comprising a substrate, the semiconductor optical amplifier being mounted to the substrate.
7. The light receiving module of claim 3, further comprising a bracket, wherein the semiconductor optical amplifier, the transimpedance amplifier, the second condenser lens, and the thermistor are fixedly mounted by the bracket.
8. The light receiving module of claim 1, further comprising a housing, wherein the photodiode, the transimpedance amplifier, and the semiconductor optical amplifier are all enclosed within the housing.
9. A light module comprising a light emitting module and further comprising a light receiving module according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110037506.XA CN112838899A (en) | 2021-01-12 | 2021-01-12 | Light receiving module and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110037506.XA CN112838899A (en) | 2021-01-12 | 2021-01-12 | Light receiving module and optical module |
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| Publication Number | Publication Date |
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| CN112838899A true CN112838899A (en) | 2021-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110037506.XA Pending CN112838899A (en) | 2021-01-12 | 2021-01-12 | Light receiving module and optical module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725391A (en) * | 2017-10-27 | 2019-05-07 | 住友电工光电子器件创新株式会社 | Receiver optical module and its assemble method |
| CN113805288A (en) * | 2021-09-10 | 2021-12-17 | 成都光创联科技有限公司 | Light receiving TO with light amplification function |
| CN113809062A (en) * | 2021-09-10 | 2021-12-17 | 成都光创联科技有限公司 | Light receiving device with light amplification function |
| CN114204408A (en) * | 2021-12-16 | 2022-03-18 | 武汉光迅科技股份有限公司 | Integrated SOA and PIN TO with refrigeration and manufacturing method thereof |
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| US20150124313A1 (en) * | 2013-11-05 | 2015-05-07 | Fujitsu Optical Components Limited | Optical communication apparatus and control method of optical communication apparatus |
| CN105871471A (en) * | 2016-03-28 | 2016-08-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN207460192U (en) * | 2017-11-20 | 2018-06-05 | 江苏亨通光网科技有限公司 | A kind of highly integrated multichannel optical transceiver module of silicon photon chip and active optical cable |
| CN111106526A (en) * | 2018-10-26 | 2020-05-05 | 海思光电子有限公司 | Semiconductor optical amplifier chip, optical receiving subassembly and optical module |
| CN111999823A (en) * | 2020-08-06 | 2020-11-27 | 武汉电信器件有限公司 | Light receiving device and method for manufacturing the same |
-
2021
- 2021-01-12 CN CN202110037506.XA patent/CN112838899A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150124313A1 (en) * | 2013-11-05 | 2015-05-07 | Fujitsu Optical Components Limited | Optical communication apparatus and control method of optical communication apparatus |
| CN105871471A (en) * | 2016-03-28 | 2016-08-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN207460192U (en) * | 2017-11-20 | 2018-06-05 | 江苏亨通光网科技有限公司 | A kind of highly integrated multichannel optical transceiver module of silicon photon chip and active optical cable |
| CN111106526A (en) * | 2018-10-26 | 2020-05-05 | 海思光电子有限公司 | Semiconductor optical amplifier chip, optical receiving subassembly and optical module |
| CN111999823A (en) * | 2020-08-06 | 2020-11-27 | 武汉电信器件有限公司 | Light receiving device and method for manufacturing the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725391A (en) * | 2017-10-27 | 2019-05-07 | 住友电工光电子器件创新株式会社 | Receiver optical module and its assemble method |
| CN113805288A (en) * | 2021-09-10 | 2021-12-17 | 成都光创联科技有限公司 | Light receiving TO with light amplification function |
| CN113809062A (en) * | 2021-09-10 | 2021-12-17 | 成都光创联科技有限公司 | Light receiving device with light amplification function |
| CN114204408A (en) * | 2021-12-16 | 2022-03-18 | 武汉光迅科技股份有限公司 | Integrated SOA and PIN TO with refrigeration and manufacturing method thereof |
| CN114204408B (en) * | 2021-12-16 | 2023-12-29 | 武汉光迅科技股份有限公司 | Refrigerating TO with integrated SOA and PIN and manufacturing method thereof |
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Application publication date: 20210525 |