CN113050236A

CN113050236A - Optical transceiver module

Info

Publication number: CN113050236A
Application number: CN201911382110.8A
Authority: CN
Inventors: 黄杰
Original assignee: Shunsin Technology Zhongshan Ltd
Current assignee: Xunyun Electronic Technology Zhongshan Co ltd
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2021-06-29

Abstract

An optical transceiver module comprising: a base with a bearing surface; the light division multiplexing element is positioned above the bearing surface and is provided with an upper surface and a lower surface facing the bearing surface; the optical signal emitter is fixed on the bearing surface and positioned between the bearing surface and the lower surface; and the optical signal receiver is positioned above the bearing surface, and the upper surface faces the optical signal receiver.

Description

Optical transceiver module

Technical Field

The present invention relates to an optical transceiver module, and more particularly, to an optical transceiver module for an optical communication module.

Background

Optical fiber communication networks have the characteristics of low transmission loss, high data security, excellent anti-interference performance, and very large bandwidth, and are the main information communication methods in the modern, wherein an optical communication module for receiving optical signals from the optical fiber network and converting the optical signals into electrical signals for transmission, and/or converting the electrical signals into optical signals for transmission outside through the optical fiber network is one of the most important basic components in the optical fiber communication technology.

In order TO provide the optical communication module with bidirectional transmission function, a transmitting die (TO-CAN) and a receiving die (RO-CAN) CAN be assembled into an optical transceiver assembly (BOSA) via a bonding mechanism in the prior art. Then the optical transceiver module is assembled with optical adapter and optical fiber to form the optical communication module.

However, the assembling steps of the optical communication module are complicated, and the manufacturing time of the optical communication module is further increased. The volume of the optical transceiver module after being assembled is larger and is difficult to meet the miniaturization requirement of the existing optical transceiver module, and the number of parts of the optical transceiver module is more, so that the manufacturing cost of the optical transceiver module is increased.

Disclosure of Invention

In view of the above, in the present invention, the optical transceiver module itself has a bidirectional transmission function, so that the assembling steps of the optical transceiver module can be simplified and the size of the optical transceiver module can be reduced. In addition, the optical transceiver module does not need the conventional coupling mechanism, thereby reducing the manufacturing cost of the optical transceiver module.

An embodiment of the present invention discloses an optical transceiver module, including: a base with a bearing surface; the light division multiplexing element is positioned above the bearing surface and is provided with an upper surface and a lower surface facing the bearing surface; the optical signal emitter is fixed on the bearing surface and positioned between the bearing surface and the lower surface; and the optical signal receiver is positioned above the bearing surface, and the upper surface faces the optical signal receiver.

According to an embodiment of the present invention, a first optical axis is perpendicular or substantially perpendicular to the carrying surface and passes through the optical signal transmitter and the optical demultiplexing device, and a second optical axis is perpendicular or substantially perpendicular to the first optical axis and passes through the optical demultiplexing device and the optical signal receiver.

According to an embodiment of the present invention, the optical transceiver module further includes a supporting frame fixed on the carrying surface and connected to the optical multiplexing element, wherein the supporting frame has an accommodating groove, and the optical signal transmitter is located in the accommodating groove.

According to an embodiment of the present invention, the optical transceiver module further includes a circuit board extending perpendicular or substantially perpendicular to the carrying surface, and the optical signal receiver is disposed on the circuit board.

According to an embodiment of the present invention, no lens is disposed between the optical multiplexing device and the optical signal transmitter, and no lens is disposed between the optical multiplexing device and the optical signal receiver.

According to an embodiment of the present invention, the optical transceiver module further includes an optical detection chip disposed on the carrying surface. According to an embodiment of the present invention, the optical transceiver further includes a transimpedance amplifier disposed on the carrying surface.

According to an embodiment of the present invention, the optical transceiver further includes a plurality of terminals passing through the base and exposed out of the carrying surface. The optical signal transmitter and the optical signal receiver are electrically connected to the terminals respectively. According to an embodiment of the present invention, the optical multiplexing device has a plate-like structure. The extension of the upper surface and the lower surface is inclined relative to the bearing surface.

According to an embodiment of the present invention, the optical transceiver module further includes: a packaging shell arranged on the base and provided with an opening; and a lens, which is arranged in the opening and corresponds to the optical multiplexing element. Wherein a sealed space is formed between the package housing, the lens and the base, and the optical multiplexing element, the optical signal transmitter and the optical signal receiver are located in the sealed space.

Drawings

Fig. 1 is a schematic diagram of an optical communication module according to an embodiment of the invention.

Fig. 2 is a perspective view of an optical transceiver module according to an embodiment of the invention.

Description of the main elements

Base 10

Bearing surface 11

Package casing 20

Opening 21

Lens 30

Optical multiplexing element 40

Upper surface 41

Lower surface 42

Optical signal transmitter 50

Optical signal receiver 60

Circuit board 70

Chip 80

Light detection chip 81

Transimpedance amplifier 82

Optical communication module A1

Optical transceiver module A10

Optical fiber A20

First optical axis AX1

Second optical axis AX2

Support B1

Accommodating groove B11

Terminal B2

Direction of transport D1

Output light beam L1

Input light beam L2

Closed space S1

Wire W1

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

To facilitate an understanding and appreciation of the invention by those skilled in the art, the following detailed description of the invention in connection with the accompanying drawings and examples should be understood as providing many applicable inventive concepts which can be embodied in a wide variety of specific forms. The specific embodiments illustrated and discussed herein are merely illustrative of specific ways to make and use the invention, and do not delimit the scope of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Moreover, repeated reference numerals or designations may be used in various embodiments. These iterations are merely for simplicity and clarity of describing the present invention, and are not intended to represent any relationship between the various embodiments and/or structures discussed. It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Fig. 1 is a schematic diagram of an optical communication module a1 according to an embodiment of the invention. Fig. 2 is a perspective view of an optical transceiver module a10 according to an embodiment of the invention, wherein the package housing 20 and the lens 30 are omitted from fig. 2 for clarity. The optical communication module a1 can be installed in an electronic device (not shown) to enable the electronic device to send and/or receive optical signals. The electronic device may be a personal computer, a server (server), or a router (router), but is not limited thereto. The optical communication module a1 may be an optical transceiver module, which is used to receive electrical signals from an electronic device, convert the electrical signals into optical signals, and transmit the optical signals to a remote end via an external optical fiber. In addition, the optical transceiver module can be used for receiving optical signals through an external optical fiber, and converting the optical signals into electrical signals to be transmitted to the electronic device.

In this embodiment, the Optical communication module a1 may include a Bi-directional Optical sub-assembly (BOSA) a10 and an Optical fiber a 20. The optical transceiver module a10 can emit an output light beam L1 with optical signals into the optical fiber a 20. The optical fiber a20 may be further coupled to an external optical fiber via an optical adapter (Receptacle) or the like, and output the output light beam L1 into the external optical fiber. In addition, the optical fiber a20 may receive the input light beam L2 with the optical signal via an external optical fiber and emit the input light beam L2 to the optical transceiver module a 10.

The optical transceiver component a10 may include a base 10, a package 20, a lens 30, an optical multiplexing element 40, an optical signal transmitter 50, an optical signal receiver 60, a circuit board 70, and a plurality of chips 80. The base 10 may be a plate-like structure extending perpendicularly or substantially perpendicularly to a transport direction D1. In the present disclosure, "substantially vertical" includes "vertical" embodiments. Further, the range of "substantially vertical" includes a direction within 10 degrees from the vertical direction. In the present embodiment, the base 10 may be circular, but not limited thereto. For example, the base 10 may be polygonal.

The package housing 20 is disposed on the base 10. In some embodiments, the package housing 20 may be fixed on the carrying surface 11 of the base 10 by an adhesive or the like, thereby reducing the volume of the optical transceiver component a 10. In some embodiments, the carrying surface 11 may be a plane. The top of the package housing 20 may have an opening 21. The lens 30 is disposed in the opening 21 and corresponds to the optical fiber a20 and the optical multiplexing element 40. The output beam L1 emitted by the optical signal emitter 50 can be focused on the optical fiber a20 via the lens 30.

In the present embodiment, a closed space S1 is formed between the base 10, the package housing 20, and the lens 30. The optical multiplexing element 40, the optical signal transmitter 50, the optical signal receiver 60, and the chip 80 are located in the enclosed space S1. By the design of the package housing 20, moisture or dust outside the optical transceiver module a10 can be prevented from entering the enclosed space S1, and the service life and signal reliability of the optical transceiver module a10 can be further improved.

In some embodiments, the base 10 and/or the package housing 20 may be made of a metal material. The base 10 and/or the package housing 20 may be used to shield electromagnetic waves outside the optical transceiver module a10 from entering the enclosed space S1, so as to provide electromagnetic protection for the components such as the optical signal transmitter 50, the optical signal receiver 60, and the chip 80 in the enclosed space S1.

The optical Multiplexing (WDM) element 40 is located in the enclosed space S1. In addition, the optical multiplexing device 40 can be located above the carrying surface 11 of the base 10 and can be located below the lens 30. In the present embodiment, the optical multiplexing component 40 can be an optical multiplexing filter (WDM filter). In the present embodiment, the wavelength of the output light beam L1 may be different from the wavelength of the input light beam L2. In some embodiments, the difference between the wavelength of the output light beam L1 and the wavelength of the input light beam L2 may be in a range of about 20 μm to about 100 μm.

Since the wavelength of the output light beam L1 is different from the wavelength of the input light beam L2, the optical multiplexing component 40 can allow more than 50% of the output light beam L1 emitted by the optical signal emitter 50 to pass through the optical multiplexing component 40. In addition, the optical multiplexing element 40 can reflect more than 50% of the input light beam L2 emitted from the optical fiber a20 to the optical signal receiver 60. In the present disclosure, the optical transceiver a10 can reduce the loss of the output light beam L1 and the input light beam L2 transmitted in the optical transceiver a10 by the optical multiplexing device 40.

The optical multiplexing device 40 may be a plate-like structure, and the extension of the optical multiplexing device 40 may be inclined with respect to the base 10. The optical multiplexing element 40 has an upper surface 41 and a lower surface 42. In the embodiment, the extension of the upper surface 41 and the lower surface 42 may be inclined with respect to the carrying surface 11, and the upper surface 41 may be parallel to the lower surface 42. In some embodiments, the angle between the extension of the upper surface 41 and/or the lower surface 42 and the carrying surface 11 may be in a range of 40 degrees to 50 degrees. The upper surface 41 may face the optical signal receiver 60, and the lower surface 42 may face the carrying surface 11 and the optical signal emitter 50. In some embodiments, the shape of the optical multiplexing element 40 may be a triangular prism, but not limited thereto.

The optical multiplexing element 40 can be separated from the base 10. The optical multiplexing device 40 can be fixed to the base 10 via a supporting frame B1. The supporting frame B1 can be fixed on the supporting surface 11 by means of adhesive or the like. The supporting frame B1 is connected to the optical multiplexing component 40, so as to fix the tilt angle of the optical multiplexing component 40 and the relative position between the optical multiplexing component 40 and the optical signal emitter 50. In the present embodiment, the positions of the optical multiplexing element 40, the optical signal transmitter 50 and the optical signal receiver 60 can be adjusted by changing the size or shape of the supporting frame B1, so as to reduce the difficulty of assembling the optical transceiver module a 10. In addition, the supporting frame B1 has a receiving slot B11, and the optical signal emitter 50 can be located in the receiving slot B11.

The optical signal emitter 50 is located in the enclosed space S1 and can be disposed on the base 10. In the present embodiment, the optical signal emitter 50 may be fixed on the carrying surface 11 of the base 10 and located between the carrying surface 11 and the lower surface 42. In some embodiments, the optical signal emitter 50 may be fixed on the carrying surface 11 of the susceptor 10 by an adhesive or the like, and the optical signal emitter 50 may be insulated from the susceptor 10. The optical signal transmitter 50 can be electrically connected to the base 10 and/or the terminal B2 via a wire W1.

The optical signal transmitter 50 is configured to transmit an output beam L1 to the optical multiplexing component 40 according to the electrical signal. The optical signal transmitter 50 may be a Laser transmitter, such as a Vertical-Cavity Surface-Emitting Laser (Vertical-Cavity Surface-Emitting Laser), but is not limited thereto. The output beam L1 may be a single wavelength beam, such as a laser. In some embodiments, the optical signal emitter 50 may be a Light Emitting Diode (LED).

Since the optical signal transmitter 50 generates a large amount of heat when emitting the output light beam L1, the optical signal transmitter 50 is fixed on the carrying surface 11 of the susceptor 10 in the present disclosure, so that the heat generated by the optical signal transmitter 50 can be directly conducted to the susceptor 10, thereby improving the heat dissipation efficiency of the optical signal transmitter 50. In addition, in the present disclosure, the base 10 may be made of a heat conductive material such as ceramic or metal, which can further increase the heat dissipation efficiency of the optical signal transmitter 50.

In the embodiment, a first optical axis AX1 is perpendicular or substantially perpendicular to the carrying surface 11 and can be parallel to the transmission direction D1. The first optical axis AX1 may pass through the optical signal transmitter 50, the optical multiplexing element 40, the lens 30, and the optical fiber a20 in sequence. In some embodiments, the first optical axis AX1 can pass through the optical signal emitter 50, the center of the lower surface 42 of the optical multiplexing element 40, the center of the lens 30, and the center of the optical fiber a20 sequentially.

The optical signal receiver 60 is located in the enclosed space S1, and may be located at one side of the optical multiplexing element 40. In the present embodiment, the optical signal receiver 60 may be located above the supporting surface 11 and may be separated from the supporting surface 11. In some embodiments, the optical signal receiver 60 may be fixed on the supporting surface 11 of the base 10 by an adhesive or the like. The optical signal receiver 60 may generate an electrical signal according to the input light beam L2 impinging thereon. In the embodiment, the optical signal receiver 60 may be a photodiode (PIN diode), but is not limited thereto.

In the embodiment, a second optical axis AX2 is perpendicular or substantially perpendicular to the first optical axis AX 1. The second optical axis AX2 can pass through the optical multiplexing component 40, the optical signal receiver 60, and the circuit board 70 in sequence. In some embodiments, the second optical axis AX2 may pass through the center of the upper surface 41, the center of the optical signal receiver 60, and the circuit board 70 in sequence.

The circuit board 70 is located in the closed space S1 and can be fixed on the base 10. The circuit board 70 may extend perpendicularly or substantially perpendicularly to the carrying surface 11. The circuit board 70 may be electrically connected to the base 10 and/or the terminal B2 through a wire. The optical signal receiver 60 is disposed on the circuit board 70 and can be electrically connected to the circuit board 70. In the present embodiment, by designing the circuit board 70 perpendicular to the base 10, the position of the optical signal receiver 60 can be easily made to correspond to the optical multiplexing element 40, and the light receiving surface of the optical signal receiver 60 can be made perpendicular to the traveling direction of the input light beam L2, so as to obtain a better optical signal.

By the design of the optical transceiver module a10, the lens 30 may not be disposed between the optical multiplexing device 40 and the optical signal transmitter 50, and/or the lens 30 may not be disposed between the optical multiplexing device 40 and the optical signal receiver 60, so as to reduce the manufacturing cost of the optical transceiver module a 10.

In the present embodiment, the wavelength of the output light beam L1 may be different from the wavelength of the input light beam L2. The optical signal transmitter 50 may emit an output light beam L1 to the optical multiplexing element 40 along the first optical axis AX1, and the output light beam L1 passing through the optical multiplexing element 40 may be irradiated to the lens 30 along the first optical axis AX 1. Lens 30 may focus output beam L1 to fiber A20. Further, the optical fiber a20 may emit the input light beam L2 to the optical multiplexing element 40 along the first optical axis AX 1. After the optical multiplexing element 40 reflects the input light beam L2, the input light beam L2 is irradiated to the optical signal receiver 60 along the second optical axis AX 2.

The chip 80 is located in the closed space S1 and is disposed on the base 10. For simplicity, only 2 chips 80 are shown in fig. 1 and 2, but the optical transceiver component a10 may have more than 3 different kinds of chips. In the present embodiment, the chip 80 can be fixed on the base 10 by means of adhesive or the like, and can be insulated from the base 10. The chip 80 can be electrically connected to the base 10 and/or the terminal B2 via a wire W1. The chip 80 may include a photodetector (MPD) chip 81 and/or a Transimpedance amplifier (TIA) 82, but not limited thereto.

The light detecting chip 81 is disposed on the carrying surface 11 and may be adjacent to the light signal emitter 50. The photo detector chip 81 may be electrically connected to the optical signal transmitter 50, and may be used to detect parameters such as power of the light beam generated by the optical signal transmitter 50. The transimpedance amplifier 82 is disposed on the carrying surface 11 and may be adjacent to the circuit board 70 and the optical signal receiver 60. In addition, the optical signal emitter 50 may be located between the light detection chip 81 and the transimpedance amplifier 82. The transimpedance amplifier 82 is electrically connected to the circuit board 70 for converting the electrical current signal transmitted by the optical signal receiver 60 into an electrical voltage signal and adjusting the gain of the electrical signal.

The optical transceiver component a10 may further include a plurality of terminals B2 passing through the base 10 and exposed out of the carrying surface 11. The optical signal transmitter 50, the optical signal receiver 60, and/or the chip 80 may be electrically connected to different terminals B2, respectively. When the base 10 is made of a conductive material such as metal, the terminal B2 can be insulated from the base 10.

In the present embodiment, the electronic device can transmit the electrical signal to the chip 80 or the optical signal emitter 50 through the terminal B2. The optical signal transmitter 50 generates an output beam L1 with an optical signal based on an electrical signal generated by an electronic device. Further, the input light beam L2 irradiated thereon by the optical signal receiver 60 generates an electric signal. The transimpedance amplifier 82 converts the electrical current signal generated by the optical signal receiver 60 into an electrical voltage signal. The electrical signal converted and gained by the transimpedance amplifier 82 can then be transmitted to the electronic device via the terminal B2.

In summary, in the optical transceiver module of the present invention, the optical signal transmitter and the optical signal receiver are disposed on the same base, so that the optical transceiver module itself has a bidirectional transmission function, thereby simplifying the assembly process of the optical transceiver module and reducing the volume of the optical transceiver module. In addition, the optical signal transmitter of this disclosure directly sets up on the base can make optical signal transmitter directly utilize the base to dispel the heat, and then has increased optical signal transmitter's radiating efficiency. Moreover, the optical signal transmitter and the optical signal receiver are adjacent to the optical multiplexing element, so that the optical transceiving component does not need to be arranged between the optical signal transmitter and the optical multiplexing element lens and between the optical signal receiver and the optical multiplexing element lens, and the manufacturing cost of the optical transceiving component is further reduced.

It will be apparent to those skilled in the art that other changes and modifications can be made in the invention according to the actual needs created by the creative schemes and the creative concepts of the invention, and the changes and modifications are all within the protection scope of the claims of the invention.

Claims

1. An optical transceiver module, comprising:

a base with a bearing surface;

the light division multiplexing element is positioned above the bearing surface and is provided with an upper surface and a lower surface facing the bearing surface;

the optical signal emitter is fixed on the bearing surface and positioned between the bearing surface and the lower surface; and

the optical signal receiver is positioned above the bearing surface, and the upper surface faces the optical signal receiver.

2. The optical transceiver module as claimed in claim 1, wherein a first optical axis is perpendicular or substantially perpendicular to the carrying surface and passes through the optical signal transmitter and the optical signal receiver, and a second optical axis is perpendicular or substantially perpendicular to the first optical axis and passes through the optical signal transmitter and the optical signal receiver.

3. The optical transceiver module as claimed in claim 1, further comprising a supporting frame fixed on the carrying surface and connected to the optical multiplexing device, wherein the supporting frame has a receiving cavity, and the optical signal transmitter is located in the receiving cavity.

4. The optical transceiver module as claimed in claim 1, further comprising a circuit board extending perpendicular or substantially perpendicular to the carrying surface, wherein the optical signal receiver is disposed on the circuit board.

5. The optical transceiver module as claimed in claim 1, wherein no lens is disposed between the optical multiplexing device and the optical signal transmitter, and no lens is disposed between the optical multiplexing device and the optical signal receiver.

6. The optical transceiver module as claimed in claim 1, further comprising an optical detection chip disposed on the carrying surface.

7. The optical transceiver module as claimed in claim 1, further comprising a transimpedance amplifier disposed on the support surface.

8. The optical transceiver module as claimed in claim 1, further comprising a plurality of terminals passing through the base and exposed on the carrying surface, wherein the optical signal transmitter and the optical signal receiver are electrically connected to the terminals respectively.

9. The optical transceiver module as claimed in claim 1, wherein the optical multiplexing element has a plate-like structure, and the extension of the upper surface and the lower surface is inclined with respect to the carrying surface.

10. The optical transceiver module of claim 1, further comprising:

a packaging shell arranged on the base and provided with an opening; and

a lens disposed in the opening and corresponding to the optical multiplexing element,

wherein a sealed space is formed among the package housing, the lens and the base, and the optical multiplexing element, the optical signal transmitter and the optical signal receiver are located in the sealed space.