CN112834906A - Test method for automatic matching - Google Patents
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- 238000010998 test method Methods 0.000 title claims abstract description 21
- 238000012360 testing method Methods 0.000 claims abstract description 133
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000012545 processing Methods 0.000 claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims abstract description 15
- 230000010354 integration Effects 0.000 claims description 48
- 230000002159 abnormal effect Effects 0.000 claims description 11
- 230000003247 decreasing effect Effects 0.000 claims description 6
- 238000005070 sampling Methods 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims description 4
- 238000012935 Averaging Methods 0.000 claims description 3
- 238000004458 analytical method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000012827 research and development Methods 0.000 abstract description 2
- WWYNJERNGUHSAO-XUDSTZEESA-N (+)-Norgestrel Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](CC)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 WWYNJERNGUHSAO-XUDSTZEESA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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Abstract
The invention provides a test method for automatic matching, which comprises the following steps: s1, acquiring information of all wafers to be tested and a first test plan; s2, selecting a preset number of wafers to test, and acquiring first test data; s3, reading the first test data, a reference file of the product and a template test specification file of the product as input of automatic matching processing, and performing automatic matching processing to generate a second test plan; and S4, selecting all wafers to be tested for testing to obtain second test data. The method realizes the compensation of the test data of the test equipment, enables the customer to automatically match when using the test equipment of different manufacturers, realizes the processing and analysis of the data, is convenient for the product use of the customer, and is beneficial to reducing the production and research and development costs of the customer.
Description
Technical Field
The invention belongs to the technical field of semiconductor device testing, and particularly relates to a testing method for automatic matching.
Background
The integrated circuit testing link is an important method capable of ensuring that the integrated circuit meets the parameter requirements such as required performance and quality, is an indispensable component in the aspects of design, production, manufacture and application of the whole integrated circuit product, and becomes one of the key technologies for ensuring the high reliability of the integrated circuit product.
At present, the integrated circuit industry test equipment has no related national standard, national standard and industrial standard, and test equipment manufacturers adopt own standards to calibrate and test the equipment, so that certain deviation exists in tested data when different test equipment is used by production and design manufacturers, a user only can process and analyze the test data of the same equipment in the use process, and the data processing and analysis can not be carried out on the test data of different test equipment. In order to facilitate the use of the test equipment by the customer, a method is needed to be found for compensating the data tested by the equipment, so that the test data is consistent with the test data of the existing test equipment of the customer, the test utilization rate of the equipment is improved, and the operation experience of the user is optimized.
Disclosure of Invention
The present invention is made in view of the above problems of the prior art, and an object of the present invention is to provide a test method for performing automatic matching, which compensates data tested by a device and keeps the test data consistent with the test data of the existing test device of a client.
The invention provides a test method for automatic matching, which comprises the following steps: s1, obtaining information of all wafers to be tested and a first test plan for testing; s2, selecting a preset number of wafers to test, and acquiring first test data; s3, reading the first test data, a reference file of the product and a template test specification file of the product as input of automatic matching processing, and performing automatic matching processing to generate a second test plan; and S4, selecting the wafer to be tested to test according to the second test plan to obtain second test data.
In one possible embodiment, the reference file includes the test items, and the mean and standard deviation of the test items, and is used for comparison judgment in the automatic matching process of the first test data.
In a specific embodiment, the process of performing the automatic matching process in step S3 includes: first, reading first test data, and deleting abnormal points according to preset requirements. The abnormal points refer to unimportant abnormal points in the testing process, and are deleted to prevent the analysis result from being influenced. And then, extracting according to the name characteristics of the output items, classifying the first test data according to the data types, respectively processing the first test data to obtain the optimal conditions of various data types, and substituting the optimal conditions into a template test rule file of the product. The data type is divided into small current data and capacitance data. The optimal conditions include an optimal integration time, an optimal stability factor, and an offset value.
The processing process of the low-current data comprises the following steps: averaging the small current data to the test items under different stability coefficients, and judging whether the average value is smaller than a set value or not; fitting the small current data of the test item with short integration time in a stability coefficient range to obtain a change rate, fitting the data according to the change rate, and obtaining an optimal stability coefficient and an offset value; and calculating standard deviations under different integration time conditions by using the optimal stability coefficient, and judging whether the ratio of the standard deviation of the test data to the standard deviation of the reference file is less than a set value or not so as to judge the optimal integration time.
In a specific preferred embodiment, in the fitting process of the small current data, the method for calculating the optimal condition includes: when all the deviation value change rates are smaller than the set value, all the points are subjected to straight line fitting so as to obtain the optimal integration time and deviation values; when all the deviation value change rates are not smaller than the set value, if the absolute value of the slope of the fitted function is a decreasing function, calculating to obtain the fitted value of the stable point so as to obtain the optimal integration time and the deviation value; if the absolute value of the slope of the fitted function is not the decreasing function, a preset value a is set in the low-current data, the data after a are directly used for straight line fitting, and the optimal integration time and the offset value are obtained through calculation. The value of the preset value a is set correspondingly according to different process conditions and application scenes.
In addition, in a preferred embodiment, the method for determining the appropriate stability factor by using the ratio of the standard deviation of the low-current data to the standard deviation of the reference file during the processing of the low-current data includes: when the ratio of the standard deviation of the small current data to the standard deviation of the reference file is smaller than a set value, directly selecting the current integration time as the optimal integration time; when the ratio of the standard deviation of the small current data to the standard deviation of the reference file is not smaller than a set value, if the function of the standard deviation of the small current data and the integration time has monotonicity, determining a proper stability coefficient according to the monotonicity, namely selecting the next point closest to the set value as the optimal integration time; if the function of the standard deviation and the integration time of the small current data does not have monotonicity, if the curve of the standard deviation and the integration time of the test data has a stable state, the minimum value in the stable state is taken as the optimal integration time, and if the curve does not have the stable state, the maximum value of the integration time is taken as the optimal integration time.
The processing process of the capacitance data comprises the following steps: calculating the mean value and the standard deviation of the capacitance data for each test item under the condition of different stability coefficients; and determining the optimal stability coefficient according to the monotonicity of the stability coefficient and the standard deviation function, and simultaneously determining the offset value under the optimal stability coefficient, namely solving the offset value under the condition of the optimal stability coefficient.
In a preferred embodiment, the method for determining the offset value under the optimal stability factor comprises determining a value for the stability factor value based on monotonicity, and if the value is not found, taking the maximum value of all stability factor values.
In another preferred embodiment, when the offset value under the optimal stability factor is determined to be 0, the stability factor is filled in the template test specification file of the product to obtain the second test plan.
In yet another possible embodiment, the offset value of the capacitance data under stable conditions is written into the second test plan after being compensated for the error.
In an advantageous embodiment, the method for deleting outliers according to the preset requirement uses a 3 σ principle, which specifically includes: calculating a standard deviation; and if the value of a sampling point is larger than the sum of the mean value (mean value) and 3 times of standard deviation (std value) or smaller than the difference of the mean value (mean value) minus 3 times of standard deviation (std value), deleting the value of the sampling point as an abnormal point.
In another advantageous embodiment, when more than two test items are contained, more than two first test data are generated in said step S2; in step S3, the first test data of different test items are individually subjected to automatic matching data processing to obtain more than two optimal conditions, and the maximum value of all the optimal conditions is substituted into the template test rule file of the product to generate the second test plan.
The invention has the following beneficial effects: according to the test method for automatic matching, the second test plan is generated through automatic matching processing, the second test data is obtained, compensation of the test data of the test equipment is achieved, processing and analysis of the data can be achieved when a customer uses test equipment of different manufacturers, product use of the customer is facilitated, and production, research and development costs of the customer are reduced.
Drawings
Fig. 1 is a schematic step diagram of a testing method for performing automatic matching according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a small current data and capacitance data processing process in an embodiment of the invention.
Detailed Description
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings. The operations of the embodiments are described in the following embodiments in a specific order, which is described in order to better understand the details of the embodiments so as to fully understand the present invention, but the description of the order is not necessarily one-to-one corresponding to a test method for performing automatic matching according to the present invention, and the scope of the present invention is not limited thereby.
It is to be noted that the flow charts and block diagrams in the figures illustrate the operational procedures possible to implement the methods according to the embodiments of the present invention. It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the alternative, depending upon the functionality involved.
As shown in fig. 1, the test method for performing automatic matching according to the embodiment of the present invention includes step s1, obtaining information of all wafers to be tested, and performing a first test plan of a test. S2, selecting a preset number of wafers to test, and obtaining first test data. And S3, reading the first test data, the reference file of the product and the template test specification file of the product as input of automatic matching processing, and performing automatic matching processing to generate a second test plan, namely automatically producing the test plan which is required by the second test and is subjected to automatic matching after the automatic matching processing is finished. S4, selecting all wafers to be tested to test according to the second test plan to obtain second test data, namely selecting all wafers to be tested in the step S1 to test; after the test is finished, final test data is generated.
In the description of the present embodiment, the first test plan is test plan a, the second test plan is test plan B, and the second test data is final test data. The specific steps of the automatic matching processing of the first test data are as follows.
And reading the first test data, and deleting abnormal points according to the requirements of customers, wherein the abnormal points are unimportant abnormal points in the test process and need to be deleted to prevent the analysis result from being influenced.
The method for eliminating the abnormal points comprises the following steps: firstly, calculating a standard deviation; and secondly, if the value of one sampling point is larger than the mean value (mean value) +3 times of standard deviation (std value) or smaller than the mean value (mean value) -3 times of standard deviation (std value), rejecting the sampling point.
In this embodiment, the test data of the low current and the capacitor are mainly processed by automatic matching, the first test data is divided into a low current data portion and a capacitor data portion according to the output item name feature extraction, and the low current data portion and the capacitor data portion are processed respectively.
As shown in fig. 2, the processing of the small current data portion in the present embodiment includes: averaging the small current data on the test items at different stability coefficients, and judging whether the average value is smaller than a set value, wherein the two conditions are as follows: and when the mean value of the test data is not less than the set value, repeating the steps from S1 to S3, retesting the wafer, and automatically matching the low-current data again until the optimal integration time, the optimal offset value and the optimal stability coefficient are determined.
And when the mean value of the small current data is smaller than a set value, fitting the small current data of the test item with short integration time in a stability coefficient range to obtain a change rate, and obtaining an optimal stability coefficient and an offset value, wherein the calculation method of the optimal stability coefficient and the offset value mainly comprises two steps.
The first step comprises two conditions, wherein in one condition, when all the deviation value change rates are smaller than a set value, all the points are subjected to straight line fitting so as to obtain the optimal integration time and the deviation value; in another case, when all the change rates of the offset values are not smaller than the set value, if the absolute value of the slope of the fitted function is a decreasing function, the fitted value of the stable point is calculated to obtain the optimal integration time and the offset value; presetting a value a in the test data, and if the absolute value of the slope of the fitted function is not a decreasing function, directly using the data after a for straight line fitting, and calculating to obtain the optimal integration time and the offset value; and the preset value a is different in value according to different process conditions and application scenes.
Second, it is determined whether the ratio of the standard deviation of the small current data to the standard deviation of the reference file is smaller than a predetermined value, so as to determine the optimal stability factor.
In the first case, when the ratio of the standard deviation of the low-current data to the standard deviation of the reference file is smaller than a set value, the current integration time is directly selected as the optimal integration time. In the second case, when the ratio of the standard deviation of the low-current data to the standard deviation of the reference file is not less than the set value, if the function of the standard deviation of the test data and the integration time has monotonicity, determining a proper stability coefficient according to the monotonicity, namely selecting the next point closest to the set value as the optimal integration time; if the function of the standard deviation and the integration time of the small current data does not have monotonicity, if the curve of the standard deviation and the integration time of the test data has a stable state, the minimum value in the stable state is taken as the optimal integration time, and if the curve does not have the stable state, the maximum value of the integration time is taken as the optimal integration time.
As shown in fig. 2, the processing of the capacitance data part in the present embodiment includes: calculating the mean value and the standard deviation of the capacitance data pair test items under different stability coefficients, determining the optimal stability coefficient according to the monotonicity of the stability coefficient and the standard deviation function, and simultaneously determining the offset value under the optimal stability coefficient; if no monotonicity exists, just taking the maximum value of the stability coefficient as the optimal stability coefficient; and (3) calculating an offset value under the condition of the stability coefficient, and when the offset value is 0, only filling the stability coefficient into a template test specification file of a product to obtain the optimal condition which can be obtained by substituting the capacitance data part in the test plan B.
In this embodiment, before step S4, the optimal condition obtained from the small current data part is substituted into a template test rule file of a product, and the optimal condition obtained from the capacitance data part is substituted into a test rule file of a product after error compensation, so as to generate a new test plan B; in step S4, all wafers to be tested are selected to be tested according to the test plan B, and the final test data is obtained.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention. It should be understood that the details of these implementations should not be used to limit the invention. In addition, for simplicity of illustration, some structures and components are shown in the drawings in a simplified schematic manner, which is merely schematic and does not limit the design possibilities.
In addition, the descriptions related to the first, the second, etc. in the present invention are only used for description purposes, do not particularly refer to an order or sequence, and do not limit the present invention, but only distinguish components or operations described in the same technical terms, and are not understood to indicate or imply relative importance or implicitly indicate the number of indicated technical features.
Technical solutions between various embodiments may be combined with each other, but must be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Claims (13)
1. A test method for automatic matching is characterized in that: the method comprises the following steps:
s1, obtaining information of all wafers to be tested and a first test plan for testing;
s2, selecting a preset number of wafers to test, and acquiring first test data;
s3, reading the first test data, a reference file of the product and a template test specification file of the product as input of automatic matching processing, and performing automatic matching processing to generate a second test plan;
and S4, selecting the wafer to be tested to test according to the second test plan to obtain second test data.
2. The test method for automatic matching according to claim 1, wherein: the reference file of the product comprises test items, and the mean value and the standard deviation of the test items are used for comparing and judging the first test data in the automatic matching processing process.
3. A test method for automatic matching according to claim 2, characterized in that: the process of performing the automatic matching processing in step S3 includes:
reading first test data, and deleting abnormal points according to a preset requirement;
and secondly, extracting according to the name characteristics of the output items, classifying the first test data according to the data types, respectively processing the first test data to obtain the optimal conditions of each type of data, and substituting the optimal conditions into a template test rule file of the product.
4. A test method for automatic matching according to claim 3, characterized in that: the process of performing the automatic matching processing in step S3 includes: the first test data is divided into small current data and capacitance data according to data types; the optimal conditions include an optimal integration time, an optimal stability factor, and an offset value.
5. The test method for automatic matching according to claim 4, wherein: the processing process of the low-current data comprises the following steps:
the method comprises the steps of firstly, averaging small current data to test items under different stability coefficient conditions, and judging whether the average value is smaller than a set value or not;
secondly, fitting the small current data of the test item with short integration time in a stability coefficient range to obtain a change rate, fitting the data according to the change rate, and obtaining an optimal stability coefficient and an offset value;
and thirdly, calculating standard deviations under different integration time conditions according to the optimal stability coefficient, and judging whether the ratio of the calculated standard deviation of the small current data to the standard deviation of the reference file is smaller than a set value or not so as to judge the optimal integration time.
6. The test method for automatic matching according to claim 4, wherein: the processing process of the capacitance data comprises the following steps:
firstly, solving the mean value and the standard deviation of capacitance data for each test item under the condition of different stability coefficients;
and secondly, determining the optimal stability coefficient according to the monotonicity of the stability coefficient and the standard deviation function, and simultaneously determining the offset value under the optimal stability coefficient.
7. The test method for automatic matching according to claim 5, wherein: in the fitting process of the small current data, the calculation method of the optimal condition comprises the following steps:
when all the deviation value change rates are smaller than the set value, all the points are subjected to straight line fitting so as to obtain the optimal integration time and deviation values;
when all the deviation value change rates are not smaller than the set value, if the absolute value of the slope of the fitted function is a decreasing function, calculating to obtain the fitted value of the stable point so as to obtain the optimal integration time and the deviation value; if the absolute value of the slope of the fitted function is not the decreasing function, a preset value a is set in the low-current data, the data after a are directly used for straight line fitting, and the optimal integration time and the offset value are obtained through calculation.
8. The test method for automatic matching according to claim 5, wherein: when the small current data are processed, the method for judging the optimal integration time by the ratio of the standard deviation of the small current data to the standard deviation of the reference file comprises the following steps:
when the ratio of the standard deviation of the small current data to the standard deviation of the reference file is smaller than a set value, directly selecting the current integration time as the optimal integration time;
when the ratio of the standard deviation of the small current data to the standard deviation of the reference file is not smaller than a set value, if the function of the standard deviation of the small current data and the integration time has monotonicity, determining the optimal integration time according to the monotonicity, namely selecting the next point closest to the set value as the optimal integration time;
if the function of the standard deviation and the integration time of the small current data does not have monotonicity, if the curve of the standard deviation and the integration time of the small current data has a stable state, the minimum value in the stable state is taken as the optimal integration time, and if the curve does not have the stable state, the maximum value of the integration time is taken as the optimal integration time.
9. The test method for automatic matching according to claim 5, wherein: the method for determining the offset value under the optimal stability factor comprises the steps that the stability factor value determines a value according to monotonicity, and if the value cannot be found, the maximum value of all stability factor values is taken.
10. The test method for automatic matching according to claim 5, wherein: and when the deviant value under the optimal stability coefficient is determined to be 0, filling the stability coefficient into the template test specification file of the product to obtain the second test plan.
11. The test method for automatic matching according to claim 6, wherein: and writing the offset value under the stable condition in the capacitance data into the second test plan after compensating the error.
12. A test method for automatic matching according to any of claims 3-11, characterized in that: the method for deleting the abnormal points according to the preset requirement adopts a 3 sigma principle, and specifically comprises the following steps:
firstly, calculating a standard deviation;
and secondly, if the value of a sampling point is larger than the sum of the mean value plus 3 times of standard deviation or smaller than the difference of the mean value minus 3 times of standard deviation, deleting the value of the sampling point as an abnormal point.
13. A test method for automatic matching according to any of claims 2-11, characterized in that: when two or more test items are contained, generating two or more first test data in step S2 in claim 1;
the method of claim 1, wherein the number of the optimal conditions obtained by individually performing the automatic matching data processing on the first test data of different test items in step S3 is two or more, and the maximum value of all the optimal conditions is substituted into the template test rule file of the product.
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