CN112820764B - Display screen and preparation method thereof - Google Patents
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- CN112820764B CN112820764B CN202110052996.0A CN202110052996A CN112820764B CN 112820764 B CN112820764 B CN 112820764B CN 202110052996 A CN202110052996 A CN 202110052996A CN 112820764 B CN112820764 B CN 112820764B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Abstract
The embodiment of the application provides a display screen and a preparation method of the display screen, wherein an oxidized metal material layer is formed on a bonding area of a display panel, an anisotropic conductive adhesive film is formed on the oxidized metal material layer, and a conductive pin in a golden finger area of a flexible circuit board is bonded with the bonding pin in the bonding area after penetrating through the anisotropic conductive adhesive film and the oxidized metal material layer. So, carry out the enhancement protection in bonding area of display panel through using the metal oxide material layer, even there is the condition in clearance between the golden finger region of flexible circuit board and display panel, because the metal oxide material layer that bonding area comprises a plurality of fine and close rete structures carries out the isolated protection of water oxygen, can reduce the problem that black spot or pin wiring is bad or the machine of dying of walking appears in the bonding pin to improve the display screen because the bad problem of demonstration that water oxygen invasion leads to.
Description
Technical Field
The application relates to the technical field of display screens, in particular to a display screen and a preparation method of the display screen.
Background
A display screen (e.g., an OLED display screen) generally includes a display panel and a Flexible circuit board (e.g., COF) for bonding the display panel. The problem of water and oxygen invasion easily occurs in the bonding area of the display panel, so that black spots or poor wiring of pins can be caused to the bonding pins, and even downtime can be caused. Therefore, how to improve the problem of poor display caused by corrosion of the display screen due to the water and oxygen invasion problem is a technical problem to be solved urgently in the field.
Disclosure of Invention
Based on the not enough of current design, the application provides a preparation method of display screen and display screen, carry out the enhancement protection in display panel's bonding district through using the oxidation metallic material layer, even there is the condition in clearance between the golden finger region of flexible circuit board and display panel, because the bonding district carries out the isolated protection of water oxygen by the oxidation metallic material layer that a plurality of compact film layer structures are constituteed, can reduce the problem that black spot or pin wiring are bad or even the machine of dying appears in the bonding pin, thereby improve the bad problem of demonstration that the display screen leads to because the invasion of water oxygen.
According to a first aspect of the present application, there is provided a display screen comprising:
the display panel is provided with a bonding area, and the bonding area comprises a plurality of bonding pins distributed at intervals;
a flexible circuit board including a gold finger region including conductive pins for connection with the plurality of bonding pins;
the metal oxide material layer is positioned on the bonding area and consists of a plurality of compact film layer structures; and
and the conductive pins of the golden finger area penetrate through the anisotropic conductive adhesive film and the oxidized metal material layer and then are bonded and connected with the bonding pins in the bonding area.
In a possible implementation manner of the first aspect, a planarization protection layer is further disposed on the metal oxide material layer, and the planarization protection layer is in contact with the anisotropic conductive adhesive film.
In one possible implementation manner of the first aspect, the oxidized metal material layer is deposited on the bonding region by plasma enhanced chemical vapor deposition.
In one possible implementation of the first aspect, a gap region exists between the plurality of bonding pins, and the oxidized metal material layer on the plurality of bonding pins does not communicate through the gap region.
In one possible embodiment of the first aspect, the planarization protection layer is made of a yellow photoresist material.
In one possible embodiment of the first aspect, the layer of oxidized metal material is selected from at least one of the following materials: aluminum oxide, magnesium oxide, zinc oxide, nickel oxide, tin dioxide and lead oxide materials.
In a possible implementation manner of the first aspect, the flexible circuit board further includes a flexible packaging substrate, and the flexible packaging substrate is used for packaging the gold finger area.
According to a second aspect of the present application, there is provided a method of manufacturing a display screen, the method including:
providing a display panel, wherein the bonding area is provided with a bonding area comprising a plurality of bonding pins distributed at intervals;
forming a metal oxide material layer consisting of a plurality of compact film layer structures above the bonding area;
forming an anisotropic conductive adhesive film above the oxidized metal material layer;
and the conductive pins in the golden finger area of the flexible circuit board penetrate through the anisotropic conductive adhesive film and the oxidized metal material layer and then are bonded and connected with the bonding pins in the bonding area.
According to a third aspect of the present application, a display terminal is provided, which may include the display screen of the first aspect or any one of the possible implementations of the first aspect.
Based on above-mentioned arbitrary aspect, this application forms the oxidation metal material layer on display panel's nation decides district to form the anisotropic conductive adhesive film on the oxidation metal material layer, the conductive pin in the golden finger region of flexible circuit board runs through behind anisotropic conductive adhesive film and the oxidation metal material layer and is connected with the nation decides pin nation of nation district. So, carry out the enhancement protection in bonding area of display panel through using the metal oxide material layer, even there is the condition in clearance between the golden finger region of flexible circuit board and display panel, because the metal oxide material layer that bonding area comprises a plurality of fine and close rete structures carries out the isolated protection of water oxygen, can reduce the problem that black spot or pin wiring is bad or the machine of dying of walking appears in the bonding pin to improve the display screen and lead to because the invasion of water oxygen and show bad problem.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and it will be apparent to those skilled in the art that other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic view showing a structure of a display screen provided in the related art;
FIG. 2 is a schematic diagram of a display screen according to an embodiment of the present disclosure;
fig. 3 shows a second schematic structural diagram of a display screen provided in the embodiment of the present application;
fig. 4 is an enlarged structural view of a portion I shown in fig. 3;
fig. 5 is a third schematic structural diagram of a display screen provided in an embodiment of the present application;
fig. 6 is an enlarged schematic structural view of a portion II shown in fig. 5;
FIG. 7 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 8a is a schematic process diagram illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 8b is a second schematic process diagram illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure;
fig. 8c is a third schematic process diagram illustrating a manufacturing method of a display panel according to an embodiment of the present application;
FIG. 8d is a fourth schematic process diagram illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 8e is a fifth schematic process diagram illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 9 shows a second flowchart of a method for manufacturing a display panel according to an embodiment of the present application.
Detailed Description
In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it should be understood that the drawings in the present application are for illustrative and descriptive purposes only and are not used to limit the scope of protection of the present application. Further, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate operations implemented according to some of the embodiments of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The materials or starting materials used in the present application are commercially available from conventional sources and, unless otherwise specified, are used in the conventional manner in the art or in the product specification. In addition, any methods and materials similar or equivalent to those described herein can be used in the methods of the present application. The preferred methods and materials described in this application are exemplary only.
Referring to the technical problem of the prior art, please refer to fig. 1, which shows a schematic structural diagram of a display screen 100 provided in the related art. In the related art, the display screen 100 may include a support Film 150, a display panel 110, a Flexible Printed Circuit (FPC) 130, and an Anisotropic Conductive Film (ACF) 140.
Wherein, the display panel 110 is provided with a bonding area 120, and the bonding area 120 includes a plurality of bonding pins distributed at intervals. The flexible circuit board 130 includes a gold finger region 132 and a flexible package substrate 134 for packaging the gold finger region 132. Gold finger region 132 includes conductive pins for connection with a plurality of bond pins. The conductive pins of the gold finger region 132 may be bonded to the bonding pins of the bonding region 120 through an anisotropic conductive film 140.
After a large number of experimental tests, creative research by the inventor of the present application finds that, when the structure is designed, in the process of forming the anisotropic conductive film 140, the capability of blocking water and oxygen is limited, bubbles 145 often appear in the anisotropic conductive film 140, which still often causes the corrosion problem of bonding pins, and the problem needs to appear for a long time or in a severe environment, and thus is not easy to find, thereby greatly reducing the use experience of the display screen 100.
It should be noted that the above-mentioned drawbacks of the solutions in the related art are all the results of the inventor after practical and careful study, and therefore, the discovery process of the above-mentioned technical problems and the solutions proposed by the embodiments of the present application in the following description should be the contribution of the inventor to the present application in the process of invention creation, and should not be understood as the technical contents known to those skilled in the art.
Based on the above technical problems discovered by the inventor, the embodiment of the present application provides an improved display screen 100 to improve the above problems.
For example, in the display panel 100 provided in the embodiment of the present application, the metal oxide material layer 125 is formed on the bonding area 120 of the display panel 110, the anisotropic conductive film 140 is formed on the metal oxide material layer 125, and the conductive pins of the gold finger region 132 of the flexible circuit board 130 penetrate through the anisotropic conductive film 140 and the metal oxide material layer 125 and then are bonded and connected to the bonding pins of the bonding area 120. The layer of oxidized metal material 125 is comprised of a plurality of dense film layer structures.
Thus, by using the metal oxide material layer 125 to enhance the protection of the bonding area 120 of the display panel 110, even in the case of a gap between the golden finger area 132 of the flexible circuit board 130 and the display panel 110, since the metal oxide material layer 125 formed by a plurality of dense film layer structures in the bonding area 120 performs water and oxygen isolation protection, the problem that black spots or pins are poorly routed or even down can be reduced, thereby improving the problem of poor display of the display screen 100 due to water and oxygen intrusion.
Some exemplary implementations of the above-described display screen 100 will be described in detail below with reference to the drawings and specific alternative embodiments.
Referring to fig. 2, a schematic structural diagram of a display screen 100 according to an embodiment of the present disclosure is shown. As shown in fig. 2, the display screen 100 may include a display panel 110, a metal oxide material layer 125, a flexible circuit board 130, and an anisotropic conductive adhesive film 140.
Wherein, be provided with bonding area 120 on display panel 110, bonding area 120 includes a plurality of bonding pins of interval distribution. Flexible circuit board 130 includes a gold finger area 132, with gold finger area 132 including conductive pins for connection with a plurality of bonding pins.
In this embodiment, the anisotropic conductive film 140 mainly comprises two parts, i.e., conductive particles and an insulating adhesive material, and a protective film is disposed on each of the upper and lower parts to protect the main component. The upper film may be removed, the anisotropic conductive film 140 may be attached to the electrode, and the other bottom film may be removed. After accurate alignment, the upper object and the lower plate are pressed, and after heating and pressurizing for a period of time, the insulating glue material is solidified, and finally, a stable structure with vertical conduction and transverse insulation is formed. Therefore, the anisotropic conductive film 140 can connect the conductive pins and the bonding pins to form a conductive connection by using the conductive particles, and can prevent the conductive short circuit between two adjacent electrodes, thereby achieving the purpose of conducting only in the conductive direction. For example, after the anisotropic conductive film 140 is pressurized and heated, the conductive pins and the bonding pins simultaneously press the conductive particles between the contact surfaces of the conductive pins and the bonding pins, so that the conductive particles can complete vertical conduction between the conductive pins and the bonding pins. However, the inventor found in the research process that during the formation process, bubbles 145 may occur, resulting in a gap between the gold finger region 132 of the flexible circuit board 130 and the display panel 110, and further resulting in the technical problems described in the aforementioned background art.
Based on this, in the present embodiment, the metal oxide material layer 125 is located on the bonding region 120, and the metal oxide material layer 125 is composed of a plurality of dense film structures. The anisotropic conductive film 140 is disposed on the oxidized metal material layer 125, and the conductive pins of the gold finger region 132 may penetrate through the anisotropic conductive film 140 and the oxidized metal material layer 125 and then be bonded and connected to the bonding pins of the bonding region 120.
In this embodiment, the dense film structure may be composed of a dense film, and the dense film may be understood as a non-porous film, and may mainly be composed of a crystalline region and an amorphous region of a substance, on this basis, the metal oxide material layer 125 may be understood as being composed of a crystalline region and an amorphous region of a metal oxide material, and has a strong ability of isolating water and oxygen, and the structure of the metal oxide material layer 125 may cover a metal region on the binding pin, and may not adhere to prevent signal abnormality. Thus, by using the metal oxide material layer 125 to perform the enhanced protection of the bonding area 120 of the display panel 110, even in the case that a gap exists between the gold finger area 132 of the flexible circuit board 130 and the display panel 110, since the bonding area 120 is protected by water and oxygen isolation by the metal oxide material layer 125 composed of a plurality of dense film structures, the problem that black spots or pin traces are bad or even downtime occurs on the bonding pins can be reduced, thereby improving the bad display problem of the display screen 100 caused by water and oxygen intrusion.
In a possible implementation manner, please further refer to fig. 3 and fig. 4, in order to avoid signal interference, a gap area gap exists between the bonding pins, and the oxidized metal material layers 125 on the bonding pins are isolated by the gap area gap, that is, the oxidized metal material layers 125 covered on the bonding pins are not connected to each other, so that signal interference between different bonding pins can be avoided, and the display effect is not affected.
In a possible embodiment, the size of the gap between the gap regions gap between the metal oxide material layers 125 on two adjacent bonding pins may be the same or different, or the size of the gap between the metal oxide material layers 125 on two adjacent bonding pins in a part of the bonding region 120 is the same, and the size of the gap between the metal oxide material layers 125 on two adjacent bonding pins in a part of the bonding region 120 is different, which is not specifically limited herein.
In one possible embodiment, referring to fig. 5 and fig. 6, a planarization protection layer 126 may be further disposed on the metal oxide material layer 125, and the planarization protection layer 126 may be in contact with the anisotropic conductive film 140. Thus, by providing the planarization protection layer 126, the surface of the metal oxide material layer 125 is smooth, which is beneficial to the adhesion of the subsequent metal oxide material layer 125 and prevents the metal oxide material layer 125 from being detached.
In one possible embodiment, the planarization protection layer 126 may be made of a yellow photoresist material. For example, but not limited to, acrylic or Hexamethyldisilane (HMDS) materials may be employed.
In one possible embodiment, the metal oxide material layer 125 may be deposited on the bonding region 120 by Plasma Enhanced Chemical Vapor Deposition (PECVD).
In one possible embodiment, the oxidized metal material layer 125 may be selected from at least one of the following materials: aluminum oxide, magnesium oxide, zinc oxide, nickel oxide, tin dioxide and lead oxide.
For example, in some possible examples, the metal oxide material layer 125 may be selected from only aluminum oxide, magnesium oxide, zinc oxide, nickel oxide, tin dioxide, or lead oxide. For another example, in other possible examples, the metal oxide material layer 125 may be formed by combining two or more of aluminum oxide, magnesium oxide, zinc oxide, nickel oxide, tin dioxide, and lead oxide, such as, but not limited to, a combination of aluminum oxide and magnesium oxide, a combination of zinc oxide and nickel oxide, a combination of tin dioxide and lead oxide, and the like. It should be understood that the material selected for the metal oxide material layer 125 is only a partial example, and not a complete example, and other possible examples or equivalent examples can be easily conceived based on the teachings of the embodiments of the present application, and should be considered as the inventive concept of the embodiments of the present application.
In a possible implementation manner, in the present embodiment, the flexible circuit board 130 may be a flexible printed circuit board made of polyimide or polyester film as a base material, and the shape of the flexible circuit board 130 may be designed differently according to different design requirements, which is not limited herein. For example, the flexible circuit board 130 may further include a flexible packaging substrate 134, where the flexible packaging substrate 134 is used to package the gold finger regions 132, for example, in the formation process of the gold finger regions 132, the flexible packaging substrate 134 formed by compounding a flexible base material (e.g., a polyimide or polyester film) and a copper foil may be obtained first, then, a plurality of gold finger regions 132 may be etched by using a photolithography process (e.g., a yellow light process), then, the surface of each gold finger region 132 is plated with nickel and/or gold to obtain a final gold finger region 132, and the surface of each gold finger region 132 is plated with nickel and/or gold to prevent oxidation of copper.
In one possible embodiment, the flexible package substrate 134 may cover the body of the flexible circuit board 130 except for the gold finger region 132, and the flexible package substrate 134 may protect the circuit elements on the flexible circuit board 130.
In one possible embodiment, the display screen 100 may further include an insulating spacer disposed between two adjacent gold finger regions 132, and the insulating spacer may be formed by OLED inkjet printing. For example, an insulating spacer portion may be formed by inkjet printing and curing between adjacent gold finger regions 132 that are uniformly arranged in sequence through an OLED inkjet printer, and the height of the insulating spacer portion may be greater than the height of the gold finger regions 132, so that it may be avoided that conductive particles of the anisotropic conductive film 140 are laterally contacted and conducted when bonding, and thus a problem of a short circuit of a display line of the flexible circuit board 130 occurs.
In a possible embodiment, the display panel 110 may be a rigid display panel or a flexible display panel, for example, the display panel 110 may be any one of, but is not limited to, an LCD display panel, a PMOLED display panel, an OLED display panel, an AMOLED display panel, a Micro-LED display panel, and the like, and is not limited in this respect.
In one possible embodiment, referring to fig. 2-6, the display panel 100 may further include a support film 150, and the support film 150 may be used to support the display panel 110. The support film 150 is used to support and maintain the shape of the display panel 110 after bending. The support film 150 may be physically fixed to the surface of the display panel 110, or the support film 150 may be attached to the surface of the display panel 110 by using a glue.
In one possible embodiment, the support film 150 may include a multilayer film. The multi-layer film structure may make the support film 150 more stable. The multi-layer film structure can avoid the problem that the entire display panel 110 loses support when the single-layer film structure is damaged. The materials of at least two film layers of the multi-layer film may be different, for example, different film layer materials may be adopted according to the specific situation of the display panel 110, for example, when the display panel 110 is a flexible display panel 110, different film layer materials may be adopted according to the curvature and shape of the flexible display panel 110. Different film layers may have different structures to provide stable supporting force for the display panel 110, and the plurality of film layers may be bonded by a glue.
Based on the same inventive concept, please refer to fig. 7, which illustrates a flowchart of a manufacturing method of a display screen provided in an embodiment of the present application. It should be understood that, in other embodiments, the order of some steps in the display screen manufacturing method of this embodiment may be interchanged according to actual needs, or some steps may be omitted or deleted. The following steps of the method for manufacturing the display panel are described in detail with reference to fig. 7 and the accompanying drawings shown in fig. 8a to 8 d.
Step S110, as shown in fig. 8a, a display panel 110 is provided, where the bonding area 120 has a bonding area 120 including a plurality of bonding pins distributed at intervals.
In step S120, as shown in fig. 8b, a metal oxide material layer 125 composed of a plurality of dense film layer structures is formed over the bonding region 120.
In step S130, as shown in fig. 8c, an anisotropic conductive film 140 is formed on the metal oxide material layer 125.
In step S140, as shown in fig. 8d, the conductive pins in the gold finger region 132 of the flexible circuit board 130 are bonded to the bonding pins in the bonding region 120 after penetrating through the anisotropic conductive film 140 and the oxidized metal material layer 125.
In a possible implementation manner, referring to fig. 8e and fig. 9, before step S130, the method for manufacturing a display screen provided in the embodiment of the present application may further include step S125, which is described in detail below.
In step S125, a planarization protection layer 126 is formed on the metal oxide material layer 125, wherein the planarization protection layer 126 is in contact with the anisotropic conductive film 140.
In one possible embodiment, during the process of forming the metal oxide material layer 125 composed of a plurality of dense film layer structures over the bonding region 120, the metal oxide material layer 125 may be selected from at least one of the following materials: aluminum oxide, magnesium oxide, zinc oxide, nickel oxide, tin dioxide and lead oxide.
It should be noted that, for details of the above steps, reference may be made to the above description of the display screen 100, and details are not repeated here.
Based on the same inventive concept, the embodiment of the present application further provides a display terminal, which may include the display screen 100 described in any of the embodiments above. The display terminal may include, but is not limited to, any electronic device with a display function, such as a smart phone, a wearable display device, a Personal Digital Assistant (PDA), a wireless handheld device, a Tablet Computer (Tablet Computer), a paper book, an MP4 player, or a flat-panel television.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The embodiments described above are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the application, but is merely representative of selected embodiments of the application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims. Moreover, all other embodiments that can be made available by a person skilled in the art without making any inventive step based on the embodiments of the present application shall fall within the scope of protection of the present application.
Claims (8)
1. A display screen, wherein the display screen comprises:
the display panel is provided with a bonding area, and the bonding area comprises a plurality of bonding pins distributed at intervals;
a flexible circuit board including a gold finger region including conductive pins for connection with the plurality of bonding pins;
the metal oxide material layer is positioned on the bonding area and consists of a plurality of compact film layer structures; and
the conductive pins in the golden finger area penetrate through the anisotropic conductive adhesive film and the oxidized metal material layer and then are bonded and connected with the bonding pins in the bonding area;
and the metal oxide material layer is also provided with a planarization protective layer, and the planarization protective layer is in contact with the anisotropic conductive adhesive film.
2. The display screen of claim 1, wherein the planarization protection layer is made of a yellow glue material.
3. The display screen of claim 1, wherein the layer of oxidized metal material is deposited on the bonding area by plasma enhanced chemical vapor deposition.
4. The display screen of any one of claims 1-3, wherein gap regions exist between the plurality of bonding pins, and the oxidized metal material layers on the plurality of bonding pins do not communicate through the gap regions.
5. A display screen as recited in any one of claims 1-3, wherein the layer of oxidized metal material is selected from at least one of the following materials: aluminum oxide, magnesium oxide, zinc oxide, nickel oxide, tin dioxide and lead oxide.
6. The display screen according to any one of claims 1 to 3, wherein the flexible circuit board further comprises a flexible packaging substrate, and the flexible packaging substrate is used for packaging the golden finger area.
7. A method for manufacturing a display screen is characterized by comprising the following steps:
providing a display panel, wherein a bonding area is arranged on the display panel and comprises a plurality of bonding pins which are distributed at intervals;
forming a metal oxide material layer consisting of a plurality of compact film layer structures above the bonding area;
forming an anisotropic conductive adhesive film above the oxidized metal material layer;
penetrating a conductive pin in a golden finger area of a flexible circuit board through the anisotropic conductive adhesive film and the oxidized metal material layer and then bonding and connecting the conductive pin with a bonding pin in a bonding area;
wherein, before the step of forming an anisotropic conductive film over the metal oxide material layer, the method comprises:
and forming a planarization protection layer on the oxidized metal material layer, wherein the planarization protection layer is in contact with the anisotropic conductive adhesive film.
8. The method for manufacturing the display screen according to claim 7, wherein the metal oxide material layer is selected from at least one of the following materials: aluminum oxide, magnesium oxide, zinc oxide, nickel oxide, tin dioxide and lead oxide.
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| CN113743307B (en) * | 2021-09-06 | 2023-12-12 | 业泓科技(成都)有限公司 | Bonding module, fingerprint identification component and electronic equipment |
| CN114120837B (en) * | 2021-11-30 | 2024-01-30 | 昆山国显光电有限公司 | Display module and mobile terminal |
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| WO2019095214A1 (en) * | 2017-11-16 | 2019-05-23 | 深圳市柔宇科技有限公司 | Tft array structure and binding region thereof, and method for manufacturing binding region |
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| CN101355198A (en) * | 2008-06-02 | 2009-01-28 | 友达光电股份有限公司 | Method and apparatus for fixing use (by) colloid |
| CN101625978A (en) * | 2009-08-07 | 2010-01-13 | 广东中显科技有限公司 | Binding manufacture technology for electrical element of flat-panel display |
| CN103050463A (en) * | 2011-10-12 | 2013-04-17 | 联咏科技股份有限公司 | Ic chip package and chip-on-glass structure using the same |
| CN105870135A (en) * | 2016-05-19 | 2016-08-17 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, display panel and display device |
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