CN108925028B - Flexible circuit board, array substrate, display panel and display device - Google Patents
Flexible circuit board, array substrate, display panel and display device Download PDFInfo
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- CN108925028B CN108925028B CN201810832773.4A CN201810832773A CN108925028B CN 108925028 B CN108925028 B CN 108925028B CN 201810832773 A CN201810832773 A CN 201810832773A CN 108925028 B CN108925028 B CN 108925028B
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- layer
- circuit board
- flexible circuit
- vibration
- circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
Abstract
The invention discloses a flexible circuit board, an array substrate, a display panel and a display device, wherein the flexible circuit board is arranged in a single-double layer alternating structure on a film layer where circuit wiring is arranged in a signal transmission direction, when the flexible circuit board vibrates due to capacitance reaction vibration of a device area of the flexible circuit board in the prior art, the vibration is switched from one amplitude to the other amplitude in the transmission process of the flexible circuit board due to the fact that the vibration passes through the single-double layer alternating structure, namely the thickness of a medium for vibration transmission is different, the vibration energy is weakened gradually in the transmission process of the flexible circuit board with the single-double layer alternating structure, namely the amplitude of the vibration in transmission media with different thicknesses is different, namely the amplitude of the vibration is different in the single-layer flexible circuit board and the double-layer flexible circuit board, and therefore, the energy of the vibration is weakened gradually in the transmission process of the single-double-layer alternating flexible circuit board, so that the vibration is not transmitted to the display screen to cause the user to hear the howling sound during use.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a flexible circuit board, an array substrate, a display panel and a display device.
Background
A Flexible Printed Circuit (FPC) is a Flexible Printed Circuit board which is made of a polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the advantages of high wiring density, light weight, thin thickness and good bending property.
Disclosure of Invention
The invention provides a flexible circuit board, an array substrate, a display panel and a display device, which are used for solving the problem that the existing flexible circuit board is easy to generate vibration which is transmitted to a display screen through the flexible circuit board, so that a user can hear a howling sound in the using process.
The embodiment of the invention provides a flexible circuit board which comprises a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are positioned on two opposite surfaces of a substrate layer. Therefore, in the present application, the conductive area includes the circuit trace, the hollow area of the first conductive layer does not include the circuit trace, and the circuit trace of the second conductive layer along the signal transmission direction is a whole-layer structure, so that the film layer where the first circuit trace of the conductive area of the first conductive layer is located and the film layer where the second circuit trace of the second conductive layer corresponding thereto is located are combined to be a double-layer structure, and the hollow area of the first conductive layer and the film layer where the second circuit trace of the second conductive layer corresponding thereto is combined to be a single-layer structure, so that the film layer where the circuit traces on both sides of the base layer of the flexible circuit board provided by the present application are a single-double-layer alternating structure, when the flexible circuit board vibrates due to the counter vibration of the capacitance of the device area of the flexible circuit board in the prior art, the vibration is transmitted through the flexible circuit board, since the vibration passes through the single-double layer alternating structure, namely the thickness of the medium for transmitting the vibration is different, and the energy of the vibration is gradually weakened due to the fact that the amplitude of the vibration in the transmission medium with different thickness is different, namely the amplitude of the vibration transmitted in the single-layer flexible circuit board and the amplitude of the vibration transmitted in the double-layer flexible circuit board are different, and the vibration is switched from one amplitude to the other amplitude, the energy of the vibration is gradually weakened during the transmission process of the vibration in the single-double layer alternating flexible circuit board provided by the application, so that the vibration is not transmitted to the display screen, and a user can hear a howling sound during the use process.
In the flexible circuit board provided by the embodiment of the invention, along the signal transmission direction, the first conductive layer includes at least one conductive area and one hollow area which are alternately arranged, the conductive area includes a first circuit trace, the second conductive layer includes a second circuit trace, the first circuit trace is electrically connected with the chip through the second circuit trace, and the first circuit trace is electrically connected with the second circuit trace through a via hole penetrating through the substrate layer.
Optionally, in the flexible circuit board provided in the embodiment of the present invention, the first circuit traces of any two of the conductive areas are insulated from each other.
Optionally, in the flexible circuit board provided in the embodiment of the present invention, the first conductive layer includes a plurality of conductive regions, and the first circuit trace having two conductive regions is electrically connected to the second circuit trace.
Optionally, in the flexible circuit board provided in the embodiment of the present invention, the first circuit traces of every two adjacent conductive regions are electrically connected through the second circuit trace.
Optionally, in the flexible circuit board provided in the embodiment of the present invention, the number of the hollow areas is multiple, and the widths of the hollow areas are the same along the signal transmission direction.
Optionally, in the flexible circuit board provided by the embodiment of the present invention, the width of the hollow-out region is 15 mm to 25 mm.
Optionally, in the flexible circuit board provided in the embodiment of the present invention, the conductive region further includes a protection layer located on a side of the film layer where the first circuit trace is located, the side being away from the base layer, and an electromagnetic shielding layer located on a side of the protection layer, the side being away from the base layer.
Correspondingly, the embodiment of the invention also provides an array substrate which comprises the flexible circuit board provided by the embodiment of the invention.
Correspondingly, the embodiment of the invention also provides a display panel which comprises the array substrate provided by the embodiment of the invention.
Correspondingly, the embodiment of the invention also provides a display device which comprises the display panel provided by the embodiment of the invention.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a flexible circuit board according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
In-cell In the prior art refers to a method of embedding touch panel functionality into liquid crystal pixels. The common Touch control and Display Driver Integration (TDDI) of Display and Touch control, Display and Touch control time division multiplexing TDDI, carry on Touch scanning In the blank area of the Display, share VCOM electrode, there are problems that VCOM signal is boosted from VCOM signal used for Display to VREF signal used for Touch, there is the inevitable voltage sudden change situation peculiar to In-cell screen, because transmit various signals to the Display screen through the flexible circuit board, the flexible circuit board generally includes device area and appearance area, the device area includes the electric capacity used for filtering action In the signal transmission process, the material of the internal electrolyte of the common electric capacity is piezoelectric crystal, therefore when the voltage sudden change of VCOM signal of common electrode between Display and Touch In-cell screen, namely the power voltage fluctuates, cause the electric capacity on the flexible circuit board to produce mechanical vibration under the piezoelectric action, produce the sound, the vibration is transmitted to the display screen through the flexible circuit board so that the user can hear a howling sound during use.
In view of the above, in order to solve the above problem, an embodiment of the present invention provides a flexible circuit board, as shown in fig. 1, including: a substrate layer 1, a first conductive layer 2 and a second conductive layer 3 located on two opposite surfaces of the substrate layer 1, and a chip (not shown in the figure) located in a device region on either surface of the substrate layer 1 and used for transmitting signals; along signal transmission direction, first conducting layer 2 is including at least one electrically conductive region 21 and a fretwork region 22 of setting up in turn, and electrically conductive region 21 includes that first circuit walks line 01, and second conducting layer 3 includes that second circuit walks line 02, and first circuit walks line 01 and is connected with the chip electricity through second circuit walks line 02, and first circuit walks line 01 and is connected with second circuit through the via hole 001 that runs through stratum basale 1 and walks line 02 electricity.
The embodiment of the invention provides a flexible circuit board which comprises a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are positioned on two opposite surfaces of a substrate layer. Therefore, in the present application, the conductive area includes the circuit trace, the hollow area of the first conductive layer does not include the circuit trace, and the circuit trace of the second conductive layer along the signal transmission direction is a whole-layer structure, so that the film layer where the first circuit trace of the conductive area of the first conductive layer is located and the film layer where the second circuit trace of the second conductive layer corresponding thereto is located are combined to be a double-layer structure, and the hollow area of the first conductive layer and the film layer where the second circuit trace of the second conductive layer corresponding thereto is combined to be a single-layer structure, so that the film layer where the circuit traces on both sides of the base layer of the flexible circuit board provided by the present application are a single-double-layer alternating structure, when the flexible circuit board vibrates due to the counter vibration of the capacitance of the device area of the flexible circuit board in the prior art, the vibration is transmitted through the flexible circuit board, since the vibration passes through the single-double layer alternating structure, namely the thickness of the medium for transmitting the vibration is different, and the energy of the vibration is gradually weakened due to the fact that the amplitude of the vibration in the transmission medium with different thickness is different, namely the amplitude of the vibration transmitted in the single-layer flexible circuit board and the amplitude of the vibration transmitted in the double-layer flexible circuit board are different, and the vibration is switched from one amplitude to the other amplitude, the energy of the vibration is gradually weakened during the transmission process of the vibration in the single-double layer alternating flexible circuit board provided by the application, so that the vibration is not transmitted to the display screen, and a user can hear a howling sound during the use process.
In a specific implementation manner, in the flexible circuit board provided in the embodiment of the present invention, the substrate layer may be a flexible resin layer, such as polyimide, polyethylene terephthalate, polyethylene naphthalate, or the like.
In a specific implementation, in the flexible circuit board provided in the embodiment of the present invention, the conductive layer is made of a copper foil.
Optionally, in specific implementation, in the flexible circuit board provided in the embodiment of the present invention, as shown in fig. 1, the first circuit traces 01 of any two conductive areas 21 are insulated from each other. That is, the first circuit traces 01 of any two conductive regions 21 are not the same signal line, and thus the first circuit trace 01 of each conductive region 21 is electrically connected to the chip only through the second circuit trace 02, that is, the first circuit trace 01 of each conductive region 21 is connected to the second circuit trace 02 through the via 001 penetrating through the substrate layer 1, and the second circuit trace 02 is directly electrically connected to the chip, and does not need to be connected to the first circuit trace 01 through the via 001 penetrating through the substrate layer 1 again, that is, the first circuit trace 01 in this embodiment is directly electrically connected to the chip after being connected to the second circuit trace 02 through the via 001 penetrating through the substrate layer 1. Therefore, the film layer where the first circuit wire 01 of the conductive area 21 is located and the film layer where the second circuit wire 02 of the second conductive layer 3 corresponding to the first circuit wire are located are combined to form a double-layer structure, and the hollow area 22 of the first conductive layer 2 and the film layer where the second circuit wire 02 of the second conductive layer 3 corresponding to the first conductive layer are combined to form a single-layer structure, so that the film layer where the circuit wires on two sides of the base layer of the flexible circuit board are located in the signal transmission direction is a single-layer and double-layer alternating structure.
Optionally, in specific implementation, as shown in fig. 1, in the flexible circuit board provided in the embodiment of the present invention, the first conductive layer 2 includes a plurality of conductive regions 21, and the first circuit traces 01 having two conductive regions 21 are electrically connected through the second circuit traces 02, that is, the first circuit traces 01 having two conductive regions 21 are the same signal line, and the first circuit traces 01 that are the same signal line are electrically connected through the second circuit traces 02 and then connected to the chip.
Further, in practical implementation, in order to better dissipate vibration energy of the capacitor in the device region of the flexible circuit board, in the flexible circuit board provided in the embodiment of the present invention, as shown in fig. 1, the first circuit traces 01 of every two adjacent conductive regions 21 are electrically connected through the second circuit traces 02. Therefore, the flexible circuit board is of a structure with a plurality of single-layer and double-layer alternating structures, so that vibration energy can be weakened gradually, and the effect is better.
Further, in a specific implementation, in the flexible circuit board provided in the embodiment of the present invention, as shown in fig. 1, the number of the hollow areas 22 is multiple, and the width of each hollow area 22 is the same along the signal transmission direction, so that a plurality of hollow areas can be manufactured through one-step composition process, and the manufacturing processes are uniform. Of course, in specific implementation, the widths of the hollow areas may be the same or different, and the technical problem of the present invention can be solved as long as the hollow areas provided by the embodiments of the present invention exist.
Further, in a specific implementation, in order not to affect signal transmission of the signal line, in the flexible circuit board provided in the embodiment of the present invention, as shown in fig. 1, the width of the hollow area 22 may be 15 mm to 25 mm, which is not limited herein.
Further, in specific implementation, as shown in fig. 2, in the flexible circuit board provided in the embodiment of the present invention, since the conductive layer is made of copper foil, in order to protect the copper foil from being exposed to air, avoid oxidation of the copper foil, cover a region that does not need gold plating for subsequent surface treatment, such as a region that does not need gold plating, with a protective layer, and perform a solder mask function in a subsequent surface mounting technology, the conductive region 21 further includes a protective layer 4 located on a side of the film layer where the first circuit trace 01 is located, the side being away from the base layer 1; in order to prevent the signals transmitted in the signal lines from radiating noise to the outside and to shield the interference of the outside world on the transmitted signals, so as to improve the interference resistance, the conductive region 21 further comprises an electromagnetic shielding layer 5 on the side of the protective layer 4 facing away from the substrate layer 1.
In the specific implementation, the protective layer is also called a cover film and is generally made of polyimide.
In a specific implementation, the flexible printed circuit board provided in the embodiment of the present invention further includes other film layers such as an adhesive layer, a reinforcing layer, and the like, which are the same as those in the prior art and will not be described in detail herein.
Based on the same inventive concept, the embodiment of the invention further provides an array substrate, which comprises any one of the flexible circuit boards provided by the embodiment of the invention. The principle of the array substrate for solving the problems is similar to that of the flexible circuit board, so the implementation of the array substrate can refer to the implementation of the flexible circuit board, and repeated details are not repeated herein.
Based on the same inventive concept, the embodiment of the invention further provides a display panel, which comprises the array substrate provided by the embodiment of the invention. The principle of the display panel to solve the problem is similar to the array substrate, so the implementation of the display panel can be referred to the implementation of the array substrate, and repeated details are not repeated herein.
Based on the same inventive concept, the embodiment of the invention further provides a display device, which comprises the display panel provided by the embodiment of the invention. The principle of the display device to solve the problem is similar to the display panel, so the implementation of the display device can be referred to the implementation of the display panel, and repeated details are not repeated herein.
In specific implementation, the display device provided in the embodiment of the present invention may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the invention. The display device can be implemented by referring to the above embodiments of the display panel, and repeated descriptions are omitted.
The embodiment of the invention provides a flexible circuit board, an array substrate, a display panel and a display device, wherein the flexible circuit board comprises a first conductive layer and a second conductive layer which are positioned on two opposite surfaces of a substrate layer. Therefore, in the present application, the conductive area includes the circuit trace, the hollow area of the first conductive layer does not include the circuit trace, and the circuit trace of the second conductive layer along the signal transmission direction is a whole-layer structure, so that the film layer where the first circuit trace of the conductive area of the first conductive layer is located and the film layer where the second circuit trace of the second conductive layer corresponding thereto is located are combined to be a double-layer structure, and the hollow area of the first conductive layer and the film layer where the second circuit trace of the second conductive layer corresponding thereto is combined to be a single-layer structure, so that the film layer where the circuit traces on both sides of the base layer of the flexible circuit board provided by the present application are a single-double-layer alternating structure, when the flexible circuit board vibrates due to the counter vibration of the capacitance of the device area of the flexible circuit board in the prior art, the vibration is transmitted through the flexible circuit board, since the vibration passes through the single-double layer alternating structure, namely the thickness of the medium for transmitting the vibration is different, and the energy of the vibration is gradually weakened due to the fact that the amplitude of the vibration in the transmission medium with different thickness is different, namely the amplitude of the vibration transmitted in the single-layer flexible circuit board and the amplitude of the vibration transmitted in the double-layer flexible circuit board are different, and the vibration is switched from one amplitude to the other amplitude, the energy of the vibration is gradually weakened during the transmission process of the vibration in the single-double layer alternating flexible circuit board provided by the application, so that the vibration is not transmitted to the display screen, and a user can hear a howling sound during the use process.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A flexible circuit board comprising: the chip comprises a substrate layer, a first conducting layer, a second conducting layer and a chip, wherein the first conducting layer and the second conducting layer are positioned on two opposite surfaces of the substrate layer; the chip is characterized in that the first conducting layer comprises at least one conducting area and a hollow area which are alternately arranged along the signal transmission direction, the conducting area comprises a first circuit wire, the second conducting layer comprises a second circuit wire, the first circuit wire is electrically connected with the chip through the second circuit wire, and the first circuit wire is electrically connected with the second circuit wire through a through hole which penetrates through the substrate layer; wherein the content of the first and second substances,
in the signal transmission direction, the film layer where the first circuit trace is located and the film layer where the second circuit trace corresponding to the first circuit trace is located are of a double-layer structure, and the film layer where the hollowed-out area and the second circuit trace corresponding to the hollowed-out area are of a single-layer structure.
2. The flexible circuit board of claim 1, wherein the first circuit traces of any two of the conductive areas are insulated from each other.
3. The flexible circuit board of claim 1, wherein the first conductive layer includes a plurality of the conductive regions, and wherein a first circuit trace having two of the conductive regions is electrically connected by the second circuit trace.
4. The flexible circuit board of claim 3, wherein the first circuit traces of each adjacent two of the conductive areas are electrically connected by the second circuit traces.
5. The flexible circuit board of claim 1, wherein the number of the hollow areas is multiple, and the width of each hollow area is the same along the signal transmission direction.
6. The flexible circuit board of claim 5, wherein the width of the hollow-out region is 15 mm to 25 mm.
7. The flexible circuit board of claim 1, wherein the conductive area further comprises a protective layer on a side of the film layer where the first circuit trace is located facing away from the base layer, and an electromagnetic shielding layer on a side of the protective layer facing away from the base layer.
8. An array substrate comprising the flexible circuit board according to any one of claims 1 to 7.
9. A display panel comprising the array substrate according to claim 8.
10. A display device characterized by comprising the display panel according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810832773.4A CN108925028B (en) | 2018-07-26 | 2018-07-26 | Flexible circuit board, array substrate, display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810832773.4A CN108925028B (en) | 2018-07-26 | 2018-07-26 | Flexible circuit board, array substrate, display panel and display device |
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| Publication Number | Publication Date |
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| CN108925028A CN108925028A (en) | 2018-11-30 |
| CN108925028B true CN108925028B (en) | 2020-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810832773.4A Active CN108925028B (en) | 2018-07-26 | 2018-07-26 | Flexible circuit board, array substrate, display panel and display device |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114002873B (en) * | 2020-07-27 | 2024-01-23 | 北京小米移动软件有限公司 | Electronic device, control method thereof, and computer-readable storage medium |
| CN112882272B (en) * | 2021-03-01 | 2022-04-12 | 武汉华星光电技术有限公司 | Liquid crystal display device having a plurality of pixel electrodes |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203523143U (en) * | 2013-09-18 | 2014-04-02 | 意力(广州)电子科技有限公司 | Flexible circuit board |
| CN204191016U (en) * | 2014-08-25 | 2015-03-04 | 苏州恒美电子科技有限公司 | A kind of double-sided PCB |
| CN106773415A (en) * | 2017-01-16 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of array base palte, display panel and display device |
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2018
- 2018-07-26 CN CN201810832773.4A patent/CN108925028B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203523143U (en) * | 2013-09-18 | 2014-04-02 | 意力(广州)电子科技有限公司 | Flexible circuit board |
| CN204191016U (en) * | 2014-08-25 | 2015-03-04 | 苏州恒美电子科技有限公司 | A kind of double-sided PCB |
| CN106773415A (en) * | 2017-01-16 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of array base palte, display panel and display device |
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