CN112820443B

CN112820443B - Conductive film and device comprising same

Info

Publication number: CN112820443B
Application number: CN202011597517.5A
Authority: CN
Inventors: 顾辛艳; 艾文玲
Original assignee: Najing Technology Corp Ltd
Current assignee: Najing Technology Corp Ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2022-04-19
Anticipated expiration: 2040-12-29
Also published as: CN112820443A

Abstract

The invention provides a conductive film and a device containing the same, wherein the conductive film comprises a first conductive material and a second conductive material, the first conductive material comprises a first conductor and a first ligand coated on the surface of the first conductor, the second conductive material comprises a second conductor and a second ligand coated on the surface of the second conductor, and the first ligand and the second ligand are in repulsion. The conductive material of the conductive film is uniformly distributed, and the light transmittance of the conductive film is improved.

Description

Conductive film and device comprising same

Technical Field

The invention relates to the technical field of photoelectricity, in particular to a conductive film and a device comprising the same.

Background

The silver nanowires are one-dimensional silver metal materials with the length of micrometer scale and the diameter of nanometer scale, are considered to be materials which are most likely to replace traditional ITO transparent electrodes, and the prepared film layer has high conductivity and transparency and can be widely used in the fields of touch control, display, illumination, photovoltaic and the like.

Because of the excellent conductivity of silver, the nano silver wire film layer manufactured by the existing method can reach smaller resistance, and can meet the requirements of various products on the conductivity, but the transmittance of the film layer has a great promotion space. The transmittance of the conductive film depends on the distribution density, distribution uniformity, diameter and length of the silver nanowires, and when the silver nanowires are made of the same material (i.e., the same diameter and length), how to control the distribution density and uniformity of the silver nanowires becomes a key for influencing the transmittance.

At present, two methods are mainly used for improving the transmittance, one is to control the volatility of a silver wire suspension liquid solvent in the manufacturing process of the conductive film so that the silver wire can be dried and separated out at a relatively stable speed; the other method is to dilute the silver wire solution to relatively low solid content and then manufacture the conductive film, and the requirement of relatively low sheet resistance is met by utilizing a mode of repeating the manufacturing process for many times. However, the two methods have very limited improvement on the transmittance of the conductive film, and the situation of excessive aggregation of the silver wires in local areas is still very serious.

Disclosure of Invention

The present disclosure provides a conductive film including a first conductive material and a second conductive material, wherein the first conductive material includes a first conductor and a first ligand coated on a surface of the first conductor, the second conductive material includes a second conductor and a second ligand coated on a surface of the second conductor, and the first ligand and the second ligand are repulsive to each other.

Further, the first conductor and the second conductor are metal nanowires, preferably silver nanowires.

Further, the weight ratio of the first conductive material to the second conductive material is 1:10 to 10:1, preferably 1:3 to 3: 1.

Further, the mass of the first ligand is 0.1% to 10%, preferably 0.5% to 5%, of the total mass of the first conductive material; the mass of the second ligand is 0.1 to 10%, preferably 0.5 to 5%, of the total mass of the second conductive material.

Further, the diameter of the silver nanowire is 10-100 nm, and the length of the silver nanowire is 10-100 μm; preferably, the silver nanowires have a diameter of 10 to 40nm and a length of 20 to 40 μm.

Further, the first ligand and the second ligand are each independently selected from any one or more of a nanoparticle ligand, an organic small molecule ligand, and a polymer ligand.

Further, the nanoparticle ligand is an inorganic nanoparticle ligand or an organic nanoparticle ligand, and the inorganic nanoparticle ligand is selected from inorganic salts, metal oxide particles, metal particles and SiO₂At least one of nano microspheres, wherein the organic nanoparticle ligand is selected from at least one of micelle microspheres and polymer microspheres.

Further, the structural expression of the organic small molecule ligand is X-Y, where X is used for coordinating with the surface of the first conductor or the second conductor, and the structure of Y includes a hydrophilic group or a hydrophobic group, the hydrophilic group is at least one selected from a hydroxyl group, a carboxyl group, an aldehyde group, an amino group, an amine group, a sulfonic group and a sulfite group, and the hydrophobic group is at least one selected from a saturated aliphatic hydrocarbon group, an unsaturated aliphatic hydrocarbon group, a halogen, an aromatic hydrocarbon group, an ester group and a nitro group; preferably, X is selected from the group consisting of a mercapto group, an amino group, a carboxyl group, a sulfonic acid group and a phosphoric acid group.

Further, the macromolecular ligand is selected from one or more of PVP, PEO, PEG, PIB, PVK, PVB, PSS, cyclic olefin copolymer and fluorine-containing resin.

Further, the sheet resistance of the conductive film is less than or equal to 500 Ω/□, preferably less than or equal to 100 Ω/□.

Further, the conductive film has a transmittance of 70% or more in the visible light range, preferably 85% or more in the visible light range.

The present application also provides a device comprising any of the conductive films described above.

Further, the organic light emitting device includes a first electrode, a functional layer, and a second electrode stacked in this order, and the first electrode and/or the second electrode include the conductive film.

Further, the functional layer has a first partial functional layer adjacent to the first electrode and a second partial functional layer adjacent to the second electrode, and the device has at least one of the following features a and B: a, the conductive film of the first electrode and the first partial functional layer are embedded in each other; and B, the conductive film of the second electrode and the second partial functional layer are embedded in each other.

Further, the conductive film of the first electrode and/or the second electrode is provided adjacent to the functional layer.

Further, the first electrode is formed by combining the conductive film and a bottom electrode material, and the second electrode is preferably formed by combining the conductive film and a top electrode material.

The material of part of the carrier transmission layer is embedded in the conductive film, and part of the surface of the conductive film is covered by the carrier transmission layer.

By applying the technical scheme of the application, in the process of preparing the conductive film, as the surfaces of the first conductive material and the second conductive material are provided with the ligands with mutual repulsion, the area with the higher density of the first conductive material can generate more repulsion to the second conductive material introduced later, and the second conductive material is favorably deposited on the area with the lower density of the original first conductive material or the area which is not covered with the substrate, so that the conductive film with uniformly distributed conductive materials is formed, and the light transmittance of the conductive film is improved.

Drawings

FIGS. 1, 3 and 5 are sequentially a microscope 500 times magnification effect diagram of the electroluminescent devices of examples 10, 11 and 12 of the present application;

fig. 2, 4 and 6 are microscope 500 times magnification effect graphs of the electroluminescent devices of comparative examples 4, 5 and 6 of the present application in sequence.

Detailed Description

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The term "ligand" in the present application refers to a substance that can be coated on the surface of an electrical conductor in some form, and is not limited to atoms, molecules, and ions that can bond to a central atom (metal or metalloid) as generally understood by those of ordinary skill in the art. The term "lipophobic repulsion" may refer to an HLB value equal to 10 as the dividing line, and the lipophobicity of ligands located on either side of the dividing line is considered to be repulsive. Hydrophobic (or lipophilic) properties are generally exhibited when the HLB value is less than 10, hydrophilic properties are generally exhibited when the HLB value is greater than 10, and the hydrophilic properties are stronger as the HLB value is larger. Of course, the evaluation criteria for the repellency can also refer to other indicators understood by those skilled in the art that can be used to evaluate the repellency of a substance, and are not limited to the above HLB value.

As described in the background art, the conductive material of the conductive film in the prior art has a non-uniform distribution, resulting in low transmittance. In order to solve the above technical problem, in one aspect of the present application, a conductive film is provided, which includes a first conductive material and a second conductive material, where the first conductive material includes a first conductive body and a first ligand coated on a surface of the first conductive body, the second conductive material includes a second conductive body and a second ligand coated on a surface of the second conductive body, and the first ligand and the second ligand are in repulsion.

In the process of preparing the conductive film, as the surfaces of the first conductive material and the second conductive material are provided with the ligands with mutual repulsion, the area with higher density of the first conductive material can generate more repulsion to the second conductive material introduced later, and the second conductive material is favorably deposited on the area with lower density of the original first conductive material or the area which is not covered with the substrate, so that the conductive film with uniformly distributed conductive materials is formed, and the light transmittance of the conductive film is improved.

In some embodiments, the first and second electrical conductors are metal nanowires. In a preferred embodiment, the first and second electrical conductors are silver nanowires.

In some embodiments, the weight ratio of the first conductive material to the second conductive material in the conductive film is 1:10 to 10: 1. In some embodiments, the weight ratio of the first conductive material to the second conductive material is 1:3 to 3: 1. The concentrations of the first conductive material and the second conductive material are appropriately close, which is beneficial to the distribution uniformity of the conductive materials.

In order to improve the distribution uniformity of the conductive material and simultaneously take the conductivity of the conductive film into consideration, in some embodiments, the mass of the first ligand accounts for 0.1-10% of the total mass of the first conductive material, and the mass of the second ligand accounts for 0.1-10% of the total mass of the second conductive material. In some embodiments, the mass of the first ligand is 0.5% to 5% of the total mass of the first conductive material, and the mass of the second ligand is 0.5% to 5% of the total mass of the second conductive material.

In some embodiments, the silver nanowires have a diameter of 10 to 100nm and a length of 10 to 100 μm. In some embodiments, the silver nanowires have a diameter of 10 to 40nm and a length of 20 to 40 μm. The parameters such as the usage amount, the conductivity and the transmittance of the silver nanowires in the conductive film are comprehensively considered, the silver nanowires need to meet a certain length-diameter ratio, and the length-diameter ratio of the silver nanowires is preferably 100-10000. It should be noted that the lengths, diameters, and the like of the silver nanowires are statistical values, which do not mean that each silver nanowire satisfies the above specification, and a size error within ± 10% exists between different silver nanowires.

In some embodiments, the first ligand and the second ligand are each independently selected from any one or more of a nanoparticle ligand, an organic small molecule ligand, a polymeric ligand.

In some embodiments, the nanoparticle ligand is an inorganic nanoparticle ligand or an organic nanoparticle ligand, and the inorganic nanoparticle ligand may be selected from the group consisting of inorganic salts, metal oxide particles, metal particles, and SiO₂The organic nanoparticle ligand is selected from at least one of micelle microspheres and polymer microspheres. Preferably, the size of the organic nanoparticle ligands is nanoscale.

The inorganic nanoparticle ligands are typically bound to the surface of the electrical conductor by adsorption. The inorganic nano particle ligand can play a role in regulating and controlling the characteristics of the conductive material such as transmittance, sheet resistance, weather resistance and the like, and can enable the conductive film to have higher transmittance and lower sheet resistance, thereby meeting the more severe application requirements. In some embodiments, the inorganic nanoparticle ligand is a non-insulating nanoparticle. An example of non-insulating nanoparticles may be SnO₂Nanoparticles, Al₂O₃Nanoparticles, gold nanoparticles, and the like. However, when the material of the inorganic nanoparticle ligands is metal oxide particles and/or metal particles, and the proportion of the metal oxide particles and/or metal particles in the ligands on the surface of the conductive body is 100%, the conductive body may be precipitated in the ink due to insufficient buoyancy. In some embodiments, the inorganic nanoparticle ligand comprises an inorganic nanoparticle bulk and a modifying agent modified on the surface of the inorganic nanoparticle bulk, the affinity of the inorganic nanoparticle ligand being determined primarily by the affinity of the modifying agent. The modifier can increase the dispersibility of the inorganic nanoparticle ligand in a solvent.In some embodiments, the inorganic salt can be a nucleophilic oxygen-chalcogen metal complex, such as Sn-containing₂S₆ ^4-、In₂Se₄ ^2-Complexes of such radicals, in particular (N)₂H₅)₄Sn₂S₆And the like.

In some embodiments, the micellar microspheres may be small molecule micelles or high molecule micelles. The small molecule micelle mainly comprises a micelle with a body type structure formed by self-assembly of a small molecule surfactant when the concentration reaches the critical micelle concentration CMC. The molecular structure of the surfactant has an amphoteric nature: one end is a hydrophilic group, and the other end is a hydrophobic group; the hydrophilic group can be carboxylic acid, sulfonic acid, sulfuric acid, amino or amino group and its salt, hydroxyl group, amide group, etc., and the hydrophobic group can be alkane, cyclic hydrocarbon, aromatic hydrocarbon, straight-chain ester, or their combination. When the hydrophobic tail end of the surfactant molecule is gathered in the micelle and the hydrophilic head end is exposed outside, the small molecule micelle is a hydrophilic ligand; when the hydrophilic tail end of the surfactant molecule is gathered in the micelle and the hydrophobic head end is exposed outside, the small molecule micelle is the hydrophobic ligand. The polymer micelle is a core-shell structure formed by utilizing the interaction of hydrophilic chain segments and hydrophobic chain segments of an amphiphilic polymer material, and the affinity of the shell layer of the core-shell structure determines the affinity presented by the polymer micelle. The segment with specific hydrophobicity can be controlled to be positioned at the outer layer of the high molecular micelle through a process so as to form the high molecular micelle with corresponding hydrophobicity. The hydrophilic segment of the polymer micelle can be obtained by polymerizing the following functional group monomers, and specifically can be selected from any one or more of acrylic monomers (such as methacrylic acid, acrylic acid and the like), acrylate monomers (such as dimethylaminoethyl methacrylate, hydroxyethyl methacrylate and the like) and acrylamide monomers (such as N-isopropylacrylamide, acrylamide and the like); the hydrophobic segment can be obtained by polymerizing the following functional group monomers, and can be specifically selected from aliphatic hydrocarbons containing double bonds, aromatic hydrocarbons containing double bonds, esters containing double bonds and any combination of the above. The amphiphilic polymer forming the polymer micelle may be a random copolymer, a block copolymer, a graft copolymer, a branched copolymer, or the like, as long as it has both hydrophobic and hydrophilic segments and is copolymerized at a certain ratio. In some embodiments, a group having an immobilization function, such as a double bond, may be introduced into the polymer micelle, and the shape of the micelle microsphere is slightly immobilized by a UV curing reaction. According to different double bond densities, the shapes of the micelle microspheres can be fixed to different degrees. Generally speaking, the double bonds in the polymer micelle have high density, which is more favorable for keeping the original shape of the micelle.

It should be noted that, the micelle microsphere type ligand, the organic small molecule ligand and the polymer ligand have some coincidence in material (chemical composition) selection, but the existing morphology and the coating mode of the ligand on the surface of the electric conductor are different, the micelle microsphere is mainly adsorbed on the surface of the electric conductor in a body-type structure (such as a spherical shape, an ellipsoid shape and the like), the organic small molecule ligand is bonded between a single molecule and the electric conductor, and the polymer ligand is coated on the surface of the electric conductor in a molecular chain winding manner.

In some embodiments, the polymeric microspheres may be PS (polystyrene) microspheres, PMMA (polymethylmethacrylate) microspheres, silicone microspheres, combinations thereof, or the like. The polymer microspheres are adsorbed on the surface of the electric conductor in a three-dimensional structure (such as a sphere, an ellipsoid and the like). The diameter of the polymeric microspheres preferably does not exceed 1/3 the diameter of the corresponding electrical conductor. The polymer microsphere is not conductive, and can play a certain space blocking role between the electric conductors, thereby avoiding unnecessary winding between the electric conductors and being beneficial to the uniform distribution of the conductive materials when being coated into a film. In addition, when the conductive material is combined with a carrier transport layer material or an electrode material to be applied to a device (such as being combined with ZnO nanocrystals, being combined with ITO electrodes and the like), the refractive indexes of different materials are different, and the polymer microspheres can also have a certain light extraction effect. However, when the ratio of the polymer microsphere type ligand to the surface ligand of the conductive body is 100%, the conductive body may be precipitated in the ink due to insufficient buoyancy. The polymer microsphere is preferably matched with at least one of organic micromolecule ligand, macromolecular ligand and micelle microsphere for use.

In some embodiments, the molecular weight of the organic small molecule ligand is no more than 500, and the molecular weight of the polymeric ligand is 5000-500000, preferably 20000-200000. The solubility of the polymeric ligand may be deteriorated if the molecular weight of the polymeric ligand is too large.

In some embodiments, the organic small molecule ligand has a structural expression of X-Y, where X is used to coordinate with the surface of the first or second electrical conductor, and Y includes a hydrophilic group or a hydrophobic group in its structure, the hydrophilic group is selected from at least one of a hydroxyl group, a carboxyl group, an aldehyde group, an amino group, an amine group, a sulfonic acid group, and a sulfite group, and the hydrophobic group is selected from at least one of a saturated aliphatic hydrocarbon group, an unsaturated aliphatic hydrocarbon group, a halogen, an aromatic hydrocarbon group, an ester group, and a nitro group; preferably, X is selected from a mercapto group, an amino group, a carboxyl group, a sulfonic acid group or a phosphoric acid group. The structure of Y also comprises a connecting group for connecting X and the hydrophilic group/hydrophobic group, and in some embodiments, the number of carbon atoms of the connecting group is 2-18. The above-mentioned X is used for coordinating with the electric conductor, and there is no requirement for the affinity and hydrophobicity of X. The structure of Y may include at least one hydrophilic group and/or at least one hydrophobic group, as long as the overall affinity of the small organic molecule is ensured to meet the requirements of the present application. Examples of the hydrophilic organic small molecule ligand may be thioglycolic acid, thiol amine, etc., and examples of the hydrophobic organic small molecule ligand may be alkyl phosphorus (e.g., trioctylphosphine oxide, etc.), long-chain alkylamine (e.g., hexylamine, octylamine, etc.), alkyl mercaptan (e.g., dodecyl mercaptan, 2-ethylhexyl mercaptan, 1-hexadecyl mercaptan, etc.).

In some embodiments, the polymeric ligand is selected from one or more of PVP (polyvinylpyrrolidone), PEO (polyethylene oxide), PEG (polyethylene glycol), PIB (polyisobutylene), PVK (polyvinylcarbazole), PVB (polyvinylbutyral), PSS (polystyrene sulfonic acid or sodium polystyrene sulfonate), cyclic olefin copolymer (olefin polymer), and fluorine-containing resin, but is not limited thereto. Wherein PVP, PEO, PEG, PVB and PSS belong to hydrophilic type, and PIB, PVK, cyclic olefin copolymer and fluorine-containing resin belong to hydrophobic type.

The application provides a method for distinguishing the affinity and the phobicity of organic small molecule ligands or high molecule ligands, which can be used as reference: hydrophilic and hydrophobic ligands are distinguished by the HLB value of the ligand molecule, which is generally hydrophobic (or lipophilic) when the HLB value is less than 10, hydrophilic when the HLB value is greater than 10, and more hydrophilic when the HLB value is greater. With an HLB value equal to 10 as a dividing line, the ligands located on both sides of the dividing line repel each other.

Specifically, when the same ligand molecule includes at least one hydrophilic group and/or at least one hydrophobic group, the HLB value thereof can be calculated according to the following formula, HLB being 20 (M)_{Parent (R)}/M_{General assembly}) Wherein: for macromolecular ligands, M_{Parent (R)}Denotes the sum of the molecular weights of the hydrophilic groups in the molecule of the ligand, M_{General assembly}Refers to the total molecular weight of the ligand itself. For organic small molecule ligands, M_{Parent (R)}The sum of the molecular weights of the remaining hydrophilic groups in the ligand molecule excluding the bonding groups; m_{General assembly}Refers to the total molecular weight of the remaining groups in the ligand molecule, excluding the bonding groups; the bonding group refers to a group in the ligand molecule, which is connected to the surface of the first conductor or the second conductor, i.e., the group X. Since the factors influencing the affinity and the phobicity of the compounds are not single, the above formula is only an empirical formula, and the judgment result that the affinity and the phobicity actually expressed by the individual compounds do not conform to the above calculation formula is not excluded, so the method for distinguishing the affinity and the phobicity of the ligands cannot be used as an improper limitation to the protection scope of the technical scheme of the present application.

In some embodiments, the first ligand and/or the second ligand is a mixed ligand, the HLB value of each ligand is measured or calculated, multiplied by the respective mass fraction of each ligand to obtain respective products, and the respective products are summed to obtain the HLB value of the mixed ligand. For example, the first ligand includes three ligands a, b and c, the ligand a accounts for x% of the total mass of the first ligand, the ligand b accounts for y% of the total mass of the first ligand, the ligand c accounts for z% of the total mass of the first ligand, the second ligand includes two ligands d and e, the ligand d accounts for m% of the total mass of the second ligand, the ligand e accounts for n% of the total mass of the second ligand, and the HLB of the first ligand is then determined by the mass ratio of the first ligand to the second ligand₁＝HLB_a*x％+HLB_b*y％+HLB_c*z％，HLB₂＝HLB_d*m％+HLB_eN% to ensure final HLB₁And HLB₂One of them is larger than 10, and the other is smaller than 10. It is to be noted that, since the affinity influence of the inorganic nanoparticle ligand of the metal oxide particle or metal particle type and the organic nanoparticle ligand of the polymer microsphere type on the mixed ligand is small, the above three types of ligands can be omitted in the calculation of the HLB value of the mixed ligand, and the total mass of the above first ligand (or second ligand) in the calculation should be the mass of the first ligand (or second ligand) after the masses of the above three types of ligands are removed.

In some embodiments, the sheet resistance of the conductive film is ≦ 500 Ω/□. In some embodiments, the sheet resistance of the conductive film is less than or equal to 100 Ω/□. The sheet resistance test has high requirements on the environment, and needs to be carried out under a relatively constant environment, so that the data deviation caused by temperature and humidity deviation and other uncertain operations is reduced. The standard environmental temperature and humidity of the sheet resistance test are as follows: 22 + -2C, 55% + -5%.

In some embodiments, the conductive film has a transmittance in the visible range of 70% or more; in some embodiments, the conductive film has a transmittance in the visible range of 85% or more. The transmittance of the conductive film is determined by the distribution density and the distribution uniformity of the conductive material in the conductive film, so that the high light transmittance of the conductive film indicates that the distribution density and the distribution uniformity of the conductive material in the conductive film are good.

In some embodiments, the conductive film has a thickness of 20 to 500 nm. The conductive film may be a mesh-like film layer formed by overlapping conductive materials, and the thickness of the conductive film is measured by SEM through the cross section of the film layer.

In another aspect of the present application, an ink formulation is provided, where the ink formulation includes a first ink and a second ink, the first ink includes a first conductive material and a first solvent, the second ink includes a second conductive material and a second solvent, the first conductive material includes a first conductive body and a first ligand coated on a surface of the first conductive body, the second conductive material includes a second conductive body and a second ligand coated on a surface of the second conductive body, and the first ligand and the second ligand have affinity and hydrophobicity.

Because the surfaces of the first conductive material and the second conductive material are provided with the ligands with mutual repulsion, when the conductive film is prepared by using the first ink and the second ink, the area with higher density of the first conductive material can generate more repulsion to the second conductive material, and the second conductive material is favorably deposited on the area with lower density of the original first conductive material or the area which is not covered with the substrate, so that the conductive film with uniformly distributed conductive material is formed, and the light transmittance of the conductive film is improved.

In some embodiments, the solids content of the conductive material of the first ink and the second ink is independently 0.01 wt% to 10 wt%. The solid content is beneficial to ensuring that the conductive materials can contact with each other to form a conductive network structure, and the local accumulation concentration is not too high to reduce the light transmittance of the conductive film during single coating.

In some embodiments, the weight ratio of the first conductive material to the second conductive material is 1:10 to 10: 1. In some embodiments, the weight ratio of the first conductive material to the second conductive material is 1:3 to 3: 1. The concentrations of the first conductive material and the second conductive material are appropriately close, which is beneficial to the distribution uniformity of the conductive materials.

In some embodiments, the surface tension of the first ink is 30 to 70mN/m, and the surface tension of the second ink is 20 to 40 mN/m. After the first ink with the surface tension in the range is formed into a film, the first ink can ensure good hydrophilicity when the second ink is arranged on the pre-conductive layer subsequently, so that the method is favorable for better playing the hydrophobic and hydrophilic repulsion action of the first ligand and the second ligand to realize the area selective deposition of the second conductive material. In a specific embodiment, the first ligand is a hydrophilic ligand, the second ligand is a hydrophobic ligand, the first solvent is a polar solvent, and the second solvent is a non-polar solvent. The first solvent and/or the second solvent may be a mixed solvent. Examples of the polar first solvent may be one or more of water, monohydric alcohol, polyhydric alcohol, alcohol ether, DMF, DMSO, and the like, and examples of the non-polar second solvent may be one or more of aromatic hydrocarbon, alkane, ester, carbon tetrachloride, and the like. In another specific embodiment, the first ligand is a hydrophobic ligand, the second ligand is a hydrophilic ligand, the first solvent is a non-polar solvent, the second solvent is a polar solvent, and the surface tension of the first ink is greater than the surface tension of the second ink. The first solvent and/or the second solvent may be a mixed solvent. Examples of the non-polar first solvent may be one or more of aromatic hydrocarbons, esters, and the like, and examples of the polar second solvent may be one or more of monohydric alcohols, alcohol ethers, and the like.

In some embodiments, the nanoparticle ligand is an inorganic nanoparticle ligand selected from the group consisting of an inorganic salt, a metal oxide particle, a metal particle, and SiO, or an organic nanoparticle ligand₂The organic nanoparticle ligand is selected from at least one of micelle microspheres and polymer microspheres. Preferably, the size of the organic nanoparticle ligands is nanoscale.

The inorganic nanoparticle ligands are typically bound to the surface of the electrical conductor by adsorption. The inorganic nano particle ligand can play a role in regulating and controlling the characteristics of the conductive material such as transmittance, sheet resistance, weather resistance and the like, and can enable the conductive film to have higher transmittance and lower sheet resistance, thereby meeting the more severe application requirements. In some embodiments, the inorganic nanoparticle ligand is a non-insulating nanoparticle. An example of non-insulating nanoparticles may be SnO₂Nano-particlesGrains of Al₂O₃Nanoparticles, gold nanoparticles, and the like. However, when the material of the inorganic nanoparticle ligands is metal oxide particles and/or metal particles, and the proportion of the metal oxide particles and/or metal particles in the ligands on the surface of the conductive body is 100%, the conductive body may be precipitated in the ink due to insufficient buoyancy. In some embodiments, the inorganic nanoparticle ligand comprises an inorganic nanoparticle bulk and a modifying agent modified on the surface of the inorganic nanoparticle bulk, the affinity of the inorganic nanoparticle ligand being determined primarily by the affinity of the modifying agent. The modifier can increase the dispersibility of the inorganic nanoparticle ligand in a solvent. In some embodiments, the inorganic salt can be a nucleophilic oxygen-chalcogen metal complex, such as Sn-containing₂S₆ ^4-、In₂Se₄ ^2-Complexes of such radicals, in particular (N)₂H₅)₄Sn₂S₆And the like.

In some embodiments, the micellar microspheres may be small molecule micelles or high molecule micelles. The small molecule micelle mainly comprises a micelle with a body type structure formed by self-assembly of a small molecule surfactant when the concentration reaches the critical micelle concentration CMC. The molecular structure of the surfactant has an amphoteric nature: one end is a hydrophilic group, and the other end is a hydrophobic group; the hydrophilic group can be carboxylic acid, sulfonic acid, sulfuric acid, amino or amino group and its salt, hydroxyl group, amide group, etc., and the hydrophobic group can be alkane, cyclic hydrocarbon, aromatic hydrocarbon, straight-chain ester, or their combination. When the hydrophobic tail end of the surfactant molecule is gathered in the micelle and the hydrophilic head end is exposed outside, the small molecule micelle is a hydrophilic ligand; when the hydrophilic tail end of the surfactant molecule is gathered in the micelle and the hydrophobic head end is exposed outside, the small molecule micelle is the hydrophobic ligand. The macromolecular micelle is a core-shell structure formed by utilizing the interaction of hydrophilic chain segments and hydrophobic chain segments of an amphiphilic macromolecular material, and the hydrophilicity and the hydrophobicity of a shell layer determine the hydrophilicity and the hydrophobicity shown by the macromolecular micelle. The segment with specific hydrophobicity can be controlled to be positioned at the outer layer of the high molecular micelle through a process so as to form the high molecular micelle with corresponding hydrophobicity. The hydrophilic segment of the polymer micelle can be obtained by polymerizing the following functional group monomers, and specifically can be selected from any one or more of acrylic monomers (such as methacrylic acid, acrylic acid and the like), acrylate monomers (such as dimethylaminoethyl methacrylate, hydroxyethyl methacrylate and the like) and acrylamide monomers (such as N-isopropylacrylamide, acrylamide and the like); the hydrophobic segment can be obtained by polymerizing the following functional group monomers, and can be specifically selected from aliphatic hydrocarbons containing double bonds, aromatic hydrocarbons containing double bonds, esters containing double bonds and any combination of the above. The amphiphilic polymer forming the polymer micelle may be a random copolymer, a block copolymer, a graft copolymer, a branched copolymer, or the like, as long as it has both hydrophobic and hydrophilic segments and is copolymerized at a certain ratio. In some embodiments, a group having an immobilization function, such as a double bond, may be introduced into the polymer micelle, and the shape of the micelle microsphere is slightly immobilized by a UV curing reaction. According to different double bond densities, the shapes of the micelle microspheres can be fixed to different degrees. Generally speaking, the double bonds in the polymer micelle have high density, which is more favorable for keeping the original shape of the micelle.

In some embodiments, the polymeric microspheres may be PS microspheres, PMMA microspheres, silicone microspheres, combinations thereof, or the like. The polymer microspheres are adsorbed on the surface of the electric conductor in a three-dimensional structure (such as a sphere, an ellipsoid and the like). The diameter of the polymeric microspheres preferably does not exceed 1/3 the diameter of the corresponding electrical conductor. The polymer microsphere is not conductive, and can play a certain space blocking role between the electric conductors, thereby avoiding unnecessary winding between the electric conductors and being beneficial to the uniform distribution of the conductive materials when being coated into a film. In addition, when the conductive material is combined with a carrier transport layer material or an electrode material to be applied to a device (such as being combined with ZnO nanocrystals, being combined with ITO electrodes and the like), the refractive indexes of different materials are different, and the polymer microspheres can also have a certain light extraction effect. However, when the ratio of the polymer microsphere type ligand to the surface ligand of the conductive body is 100%, the conductive body may be precipitated in the ink due to insufficient buoyancy. The polymer microsphere is preferably matched with at least one of organic micromolecule ligand, macromolecular ligand and micelle microsphere for use.

In some embodiments, the first ligand and/or the second ligand is a mixed ligand, and the HLB value of each ligand is measured or calculated separately, multiplied by the respective mass fraction of each ligand, and summed to obtain the HLB value of the mixed ligand. With an HLB value equal to 10 as a dividing line, the ligands located on both sides of the dividing line repel each other.

In some embodiments, the first ink and the second ink further comprise an additive comprising at least one of a viscosity modifier and a surface tension modifier. In the above embodiment, the mass fractions of the additives in the first ink and the second ink are each independently preferably 0.01 wt% to 5 wt%. The viscosity modifier may have a function of adjusting the viscosity of the ink, such as PEO, PVA, PIB, PMMA, and the like; surface tension modifiers are used to further adjust the ink surface tension, such as Triton-100, Tween-20, fluorinated polyacrylates, silane coupling agents, and the like.

In still another aspect of the present application, there is provided a method for manufacturing a conductive film, including the steps of: s1, providing a substrate; s2, arranging the first ink on the substrate, and drying to form a pre-conductive layer; s3, arranging second ink on the pre-conductive layer, and drying; the first ink comprises a first conductive material and a first solvent, the second ink comprises a second conductive material and a second solvent, the first conductive material comprises a first conductor and a first ligand coated on the surface of the first conductor, the second conductive material comprises a second conductor and a second ligand coated on the surface of the second conductor, and the first ligand and the second ligand are in repulsion.

According to the technical scheme, the first ink containing the first conductive material is arranged on the substrate to form the pre-conductive layer, the second ink containing the second conductive material is arranged on the pre-conductive layer, and the first conductive material and the second conductive material have the affinity and hydrophobicity repulsive ligands on the surfaces, so that more repulsion is generated on the second conductive material in the second ink in the area with the higher density of the first conductive material in the pre-conductive layer, the second conductive material is favorably deposited on the area with the lower density of the first conductive material in the pre-conductive layer or the area not covering the substrate, a conductive film with the uniformly distributed conductive material is formed, the light transmittance of the conductive film is improved, and the product quality of the light-emitting device is improved.

The ink may have conductivity or may not have conductivity, and mainly depends on the concentration of the conductive material in the ink, and when the concentration of the conductive material in the ink is small, the conductive materials in the ink may not contact each other, and the ink does not conduct electricity; when the concentration of the conductive material in the ink is large and the conductive materials in the ink are in contact with each other, the ink has conductivity.

In some embodiments, the first ink may be disposed in step S2 by spin coating, spray coating, slit coating, or inkjet printing, and the second ink may be disposed in step S3 by spin coating, spray coating, slit coating, or inkjet printing.

In some embodiments, the drying process in step S2 may be natural drying, hot plate baking, or radiation baking. In a preferred embodiment, the drying step S2 may not be complete, as long as the first conductive material in the pre-conductive layer is ensured to lose its mobility, i.e. the position between the first conductive materials is fixed and is not affected by the solvent.

In some embodiments, the drying process in step S3 may be natural drying, hot plate baking, or radiation baking.

In some embodiments, the operations of steps S2 and S3 are repeated at least once each after step S3.

In some embodiments, the first ligand and/or the second ligand is a mixed ligand, the HLB value of each ligand is measured or calculated, multiplied by the respective mass fraction of each ligand to obtain respective products, and the products are summed to obtain the HLB value of the mixed ligand. With an HLB value equal to 10 as a dividing line, the ligands located on both sides of the dividing line repel each other.

In some embodiments, the conductive film has a transmittance in the visible range of 70% or more; in some embodiments, the conductive film has a transmittance in the visible range of 85% or more. The transmittance of the conductive film is determined by the distribution density and the distribution uniformity of the conductive material in the conductive film, and therefore, a high transmittance of the conductive film indicates that the distribution density and the distribution uniformity of the conductive material in the conductive film are good.

In another aspect of the present application, a device comprising the conductive film or the conductive film prepared by the above preparation method is provided. The device can be a light emitting device (an electroluminescent LED, an electroluminescent LED with a light conversion function), a touch device, a sensing device, a solar cell and the like. The conductive film has good conductivity, so that the product quality of the device is improved.

In some embodiments, the device is an OLED device, a QLED device, a mini-LED device, or a micro-LED device.

In some embodiments, the device comprises a first electrode, a functional layer and a second electrode stacked in this order, the first electrode and/or the second electrode comprising a conductive film.

In some embodiments, one of the first electrode and the second electrode does not include a conductive film, and the electrode not including a conductive film may be a transparent electrode (e.g., ITO, AZO, etc.) or a reflective electrode (e.g., Ag, Al, or an alloy thereof, etc.). The functional layer may include multiple layers of an electron injection layer, an electron transport layer, an electron blocking layer, a light emitting layer, a hole blocking layer, a hole injection layer, and a hole transport layer, and the light emitting layer may be made of a material selected from small molecules of an OLED, a polymer light emitting material, or a quantum dot nanocrystal. The device may further include a substrate, such as a rigid substrate like glass or silicon wafer, or a flexible substrate like PI, PEN, PET.

In some embodiments, the first electrode and/or the second electrode may comprise only the conductive film, excluding other conductive materials.

In some embodiments, the functional layer of the device has a first portion of the functional layer adjacent to the first electrode and a second portion of the functional layer adjacent to the second electrode, the device having at least one of the following characteristics a and B: a, the conductive film of the first electrode and the first partial functional layer are embedded with each other; and B, the conductive film of the second electrode and the second partial functional layer are embedded with each other. By "embedded within" is meant that a portion of the conductive material of the conductive film of the first electrode enters the first portion of the functional layer and a portion of the material of the first portion of the functional layer enters the conductive film of the first electrode.

The device in the above embodiment can be prepared by the following method: providing a substrate, manufacturing a conductive film on the substrate, and arranging a material of a functional layer on the conductive film, wherein at least part of the material of the functional layer can fill and level up the holes of the conductive film due to the fact that the conductive film has a net structure, so that the conductive film and the first part of the functional layer are embedded into each other; or, providing a substrate, arranging a functional layer on the substrate, arranging a conductive film on the surface of the functional layer when only the last part of the functional layer is not manufactured, and applying the last part of functional layer material on the conductive film, wherein at least part of the functional layer material fills the holes of the conductive film, so that the conductive film and the second part of the functional layer are embedded into each other.

In some embodiments, the conductive film of the first electrode and/or the second electrode of the device is disposed adjacent to the functional layer. The preparation can be carried out by the following method: the method comprises the steps of preparing a conductive film on a hard substrate (such as glass), arranging Polyimide (PI) or other coatable materials on the conductive film, curing, and peeling the conductive film and the polyimide layer from the hard substrate together, wherein the peeling surface of the conductive film is very flat, the conductive material is exposed on the surface, and the functional layer is arranged on the surface, so that the conductive film and the functional layer can be arranged adjacently.

In some embodiments, the first electrode of the device is compounded from a conductive film and a bottom electrode material; in some embodiments, the second electrode is compounded from a conductive film and a top electrode material. The first electrode can be prepared by the following method: firstly, a conductive film is manufactured on a substrate, a bottom electrode material (such as ITO) is sputtered on the conductive film, and the conductive film is embedded into the bottom electrode material; alternatively, a conductive film is formed on a substrate, and then a bottom electrode material in a solution state is applied to the conductive film, followed by high-temperature annealing to form a composite film. The alternative preparation method of the second electrode is the same as that of the first electrode, and only the bottom electrode material is replaced by the top electrode material.

In some embodiments, the device includes a carrier transport layer, a portion of the material of the carrier transport layer is embedded in a conductive film, and a portion of the surface of the conductive film is covered by the carrier transport layer. The carrier transport layer includes at least one of a hole injection layer, an electron injection layer, and an electron transport layer.

The advantageous effects of the present application will be further described below with reference to specific examples and comparative examples.

Examples 1 to 5

1. And (3) synthesis of silver nanowires:

the method is characterized in that ethylene glycol is used as a solvent, silver nitrate and halogen salt such as sodium bromide, sodium chloride, copper chloride and the like with certain concentration are assisted by polyvinylpyrrolidone (PVP) serving as a stabilizer, and the growth morphology of the silver nanowires is adjusted by means of controlling reaction time, temperature, sample adding rate, PVP molecular weight, concentration and the like, so that the silver nanowires with different diameters and lengths are obtained. The synthesis of silver nanowires belongs to the prior art, and any method can be selected by a person skilled in the art.

In the embodiment of the application, silver nanowires with the diameter of 20nm and the length of 30um are taken as research objects to illustrate the beneficial effects of the application.

2. Silver nanowire ligand exchange:

by direct addition of a quantity of the target ligand, or by introduction of a ligand exchange aid such as Nitrosotetrafluoroborate (NOBF)₄) And (3) replacing the PVP ligand on the surface of the silver nanowire synthesized in the step (1) with the target ligand by methods such as improving the replacement capability of the target ligand. Ligand exchange methods are known in the art and any method can be selected by the person skilled in the art.

The mass ratio of the ligand in the silver nanowire is measured by a thermal weight loss analyzer, and the surface tension of the ink is measured by a surface tension meter.

The parameters of the silver nanowires and ink are detailed in table 1.

TABLE 1

The 'mass ratio of the ligand' is obtained by dividing the mass of the ligand on the surface of the silver nanowire by the mass of the silver nanowire; the mass of the silver nanowires in the mass ratio of the silver nanowires in the ink comprises the mass of ligands on the surfaces of the silver nanowires; the above-mentioned "mass ratio of solvent in ink" and "mass ratio of additive in ink" are calculated by comparing the mass of solvent/additive with the mass of ink. In the embodiment 1, the amine group of the ligand octylamine is connected on the surface of the silver nanowire, and the carbon chain is free outside; in the embodiment 2, the amino group of the ligand butanolamine is connected on the surface of the silver nanowire; in example 3, the ligand mercaptoethaneThe thiol group of the acid is bonded to the surface of the silver nanowire. In example 5, SnO₂The average particle size of the nanoparticles was about 0.79 nm. The symbol "to" means "about".

It should be noted that the degree of replacement of the PVP ligand on the surface of the silver nanowire with the target ligand mainly depends on the degree of coordination ability of the target ligand itself. As can be seen from the thermal desorption analysis, the surfaces of the silver nanowires obtained in the examples 1 to 4 only have a very small amount of PVP ligand residues, and the target ligand is replaced completely, so that the affinity and the hydrophobicity of the silver nanowires after ligand exchange can be evaluated according to the HLB value of the target ligand. The surface of the silver nanowire obtained in example 5 is SnO₂Mixed ligand of nanoparticles and PVP, in which SnO₂The nanoparticles are mainly used to reduce the sheet resistance of the conductive film, but have little effect on the affinity of the silver nanowires, so the affinity of the silver nanowires of example 5 can be evaluated only according to the HLB value of the PVP ligand.

Examples 6 to 8

And (3) conducting film and manufacturing: the inks of the above embodiments 1 to 5 were selected to be combined with the first ink and the second ink, and an KTQ-III type film coater was used to fabricate the conductive film, wherein the coating process was as follows:

the white glass substrate is sequentially cleaned by acetone, isopropanol and ultrapure water in an ultrasonic mode, then is dried by nitrogen, the surface to be coated is treated by plasma (plasma), then is placed on a marble platform of a thousand-level dust-free chamber, a first ink is transferred to a substrate by a liquid transfer gun, the substrate is coated by an KTQ-III type film coating device at a certain gap (gap) and speed, after the substrate is dried in the air, a second ink is transferred by the liquid transfer gun, the coating process is repeated, after the substrate is dried in the air, the substrate coated with a conductive material is transferred to a glove box in a nitrogen atmosphere, and a hot plate is used for baking at 80 ℃ for 30 minutes to obtain the conductive film, wherein the specific parameters are shown in table 2. The thickness of the conductive film is obtained by scanning an electron microscope SEM shooting section, the transmittance is measured by an ultraviolet visible spectrophotometer, and the sheet resistance is obtained by a four-probe sheet resistance tester.

Example 9

The difference from example 6 is that: the coating operations of the first ink and the second ink were repeated 1 time each on the substrate coated with the conductive material.

Comparative examples 1 to 3

The differences from examples 6, 7 and 8 are: the silver nanowires were not ligand-exchanged and had a PVP ligand on the surface, and the mass ratio of the ligand in the first ink and the second ink of comparative example 1 and the mass ratio of the silver nanowires in the inks were respectively kept in agreement with the conditions of the two inks used in example 6, the above-mentioned parameters of comparative example 2 were kept in agreement with example 7, and the above-mentioned parameters of comparative example 3 were kept in agreement with example 8.

TABLE 2

The manufacturing process of the conductive film is combined to manufacture the electroluminescent device, and the structure of the device is as follows: PSS/hole transport layer (thickness 40nm) TFB/red quantum dot layer (thickness 25 nm)/zinc oxide electron transport layer (thickness 50 nm)/top electrode. Wherein:

PEDOT: PSS hole injection layer: filtering with 0.22 μm N66 filter head, setting 3500rpm, spinning PEDOT: PSS on white glass substrate/bottom electrode for 45s, annealing at 150 deg.C in air for 20min, and annealing with O₂Plasma treatment was carried out for 4min, followed by rapid transfer of the sheet into a glove box.

TFB hole transport layer: filtering 8mg/mL TFB ethylbenzene solution by using a 0.22-micron PTFE filter head, spin-coating at 3000rpm to form a film, and then placing on a 150 ℃ hot bench for annealing for 20min to finish the manufacture of the hole transport layer.

Red quantum dot layer: setting 2000rpm and 45s parameters, and spin-coating a quantum dot solution on the hole transport layer, wherein the red quantum dot is a quantum dot with a CdSe/CdZnSe/ZnSeS structure, the optical concentration (OD) is 30-40 at 400nm, and the red quantum dot is dissolved in an n-octane solution without annealing treatment.

Zinc oxide electron transport layer: the zinc oxide nanocrystal solution was spin coated on the quantum dot layer with parameters of 3000rpm for 30 s.

Example 10

The electroluminescent device is a top emitting device, the bottom electrode is a reflecting electrode of 120nm Ag +15nm ITO, and the top electrode adopts the conductive film in the embodiment 6 and has the thickness of about 85 nm.

Example 11

The electroluminescent device was a bottom-emitting device, the bottom electrode was the conductive film of example 7 and was about 105nm thick, and the top electrode was an Ag electrode and was 100nm thick.

Example 12

The electroluminescent device is a double-sided light emitting device, the bottom electrode is standard ITO and has a thickness of 150nm, and the top electrode is the conductive film in embodiment 8 and has a thickness of about 350 nm.

Comparative example 4

This comparative example differs from example 10 in that: the conductive film obtained in comparative example 1 was used as a top electrode.

Comparative example 5

This comparative example differs from example 11 in that: the conductive film obtained in comparative example 2 was used as a bottom electrode.

Comparative example 6

This comparative example is different from example 12 in that the conductive film obtained in comparative example 3 is used as a top electrode.

The light emission uniformity of the resulting devices of examples 10-12 and comparative examples 4-6 was characterized by microscopy at 500 times magnification and the external quantum efficiency EQE of the devices was tested by PR670, where the external quantum efficiency in example 12 and comparative example 6 is the sum of the two-sided external quantum efficiency. The results are reported in Table 3.

TABLE 3

Numbering	Example 10	Example 11	Example 12	Comparative example 4	Comparative example 5	Comparative example 6
							EQE(％)	17.5	17.7	16.6	14.3	13.7	11.1

As can be seen by comparing fig. 1 and 2, fig. 3 and 4, and fig. 5 and 6, respectively, the electroluminescent device using the conductive film manufactured by the embodiment of the present application has significantly improved light emission uniformity; in contrast, in the electroluminescent device manufactured by using the conductive film in the prior art, the obvious agglomeration phenomenon of the silver nanowires can be observed. In addition, under the conditions that the conductive films of examples 10 to 12 and comparative examples 4 to 6 have the same solid content and the same manufacturing process, the conductive film of the example has smaller sheet resistance and higher light transmittance due to the improved distribution uniformity of the silver nanowires, so that the external quantum efficiency of the electroluminescent device is higher.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The conductive film is characterized by comprising a first conductive material and a second conductive material, wherein the first conductive material comprises a first conductor and a first ligand coated on the surface of the first conductor, the second conductive material comprises a second conductor and a second ligand coated on the surface of the second conductor, and the first ligand and the second ligand are mutually repulsive in affinity and hydrophobicity.

2. The conductive film according to claim 1, wherein the first conductor and the second conductor are metal nanowires.

3. The conductive film of claim 2, wherein the first and second electrical conductors are silver nanowires.

4. The conductive film according to claim 1, wherein a weight ratio of the first conductive material to the second conductive material is 1:10 to 10: 1.

5. The conductive film according to claim 4, wherein a weight ratio of the first conductive material to the second conductive material is 1:3 to 3: 1.

6. The conductive film according to claim 1, wherein the mass of the first ligand accounts for 0.1% to 10% of the total mass of the first conductive material; the mass of the second ligand accounts for 0.1-10% of the total mass of the second conductive material.

7. The conductive film according to claim 6, wherein the mass of the first ligand is 0.5% to 5% of the total mass of the first conductive material; the mass of the second ligand accounts for 0.5-5% of the total mass of the second conductive material.

8. The conductive film according to claim 3, wherein the silver nanowires have a diameter of 10 to 100nm and a length of 10 to 100 μm.

9. The conductive film according to claim 8, wherein the silver nanowires have a diameter of 10 to 40nm and a length of 20 to 40 μm.

10. The conductive film of claim 1, wherein the first ligand and the second ligand are each independently selected from any one or more of nanoparticle ligands, organic small molecule ligands, and polymeric ligands.

11. The conductive film of claim 10, wherein the nanoparticle ligand is an inorganic nanoparticle ligand or an organic nanoparticle ligand, and the inorganic nanoparticle ligand is selected from the group consisting of inorganic salts, metal oxide particles, metal particles, and SiO₂At least one of nano-microspheres, wherein the organic nanoparticle ligand is selected from at least one of micelle microspheres and polymer microspheres.

12. The conductive film of claim 10, wherein the organic small molecule ligand has a structural expression of X-Y, wherein X is used to coordinate with the surface of the first or second electrical conductor, and Y has a structure including a hydrophilic group selected from at least one of a hydroxyl group, a carboxyl group, an aldehyde group, an amino group, an amine group, a sulfonic group, and a sulfite group, or a hydrophobic group selected from at least one of a saturated aliphatic hydrocarbon group, an unsaturated aliphatic hydrocarbon group, a halogen, an aromatic hydrocarbon group, an ester group, and a nitro group.

13. The conductive film of claim 12 wherein X is selected from the group consisting of thiol, amino, carboxyl, sulfonate, or phosphate groups.

14. The conductive film of claim 10 wherein the polymeric ligand is selected from one or more of PVP, PEO, PEG, PIB, PVK, PVB, PSS, cyclic olefin copolymer and fluorine-containing resin.

15. The conductive film of claim 2 or 3, wherein the sheet resistance of the conductive film is less than or equal to 500 Ω/□.

16. The conductive film of claim 15, wherein the sheet resistance of the conductive film is less than or equal to 100 Ω/□.

17. The conductive film according to claim 15, wherein the conductive film has a transmittance of 70% or more in the visible light range.

18. The conductive film according to claim 17, wherein the conductive film has a transmittance of 85% or more in a visible light range.

19. A device comprising the conductive film of any of claims 1 to 18.

20. The device according to claim 19, comprising a first electrode, a functional layer and a second electrode stacked in this order, wherein the first electrode and/or the second electrode comprises the conductive film.

21. The device of claim 20, wherein the functional layer has a first portion of the functional layer adjacent to the first electrode and a second portion of the functional layer adjacent to the second electrode, the device having at least one of the following characteristics a and B: a, the conductive film of the first electrode and the first partial functional layer are embedded into each other; and B, the conductive film of the second electrode and the second partial functional layer are embedded into each other.

22. The device according to claim 20, wherein the conductive film of the first electrode and/or the second electrode is disposed adjacent to the functional layer.

23. The device of claim 20, wherein the first electrode is a composite of the conductive film and a bottom electrode material.

24. The device of claim 23, wherein the second electrode is compounded from the conductive film and a top electrode material.

25. The device of claim 19, comprising a carrier transport layer, wherein a portion of the material of the carrier transport layer is embedded in the conductive film, and wherein a portion of the surface of the conductive film is covered by the carrier transport layer.