CN112756845A - Silver soldering paste and preparation method thereof - Google Patents
Silver soldering paste and preparation method thereof Download PDFInfo
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- CN112756845A CN112756845A CN202110057266.XA CN202110057266A CN112756845A CN 112756845 A CN112756845 A CN 112756845A CN 202110057266 A CN202110057266 A CN 202110057266A CN 112756845 A CN112756845 A CN 112756845A
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- silver
- silver solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The application relates to a silver soldering paste and a preparation method thereof, wherein the silver soldering paste comprises the following components in percentage by mass: 65-95% of silver solder, 0-30% of silver solder, 5-10% of adhesive and the silver solder comprises the following components: 1. ag and Cu; 2. ag, Cu, Zn, Sn; 3. ag, Cu, Zn, Ni and trace element Si. The preparation method of the silver soldering paste comprises the following steps: s1: preparing silver solder powder by using an air atomization method and screening; if the silver solder paste does not contain silver solder flux to step S4: s2: weighing the powdery silver brazing flux, dehydrating, drying and screening; s3: grinding and screening the silver brazing flux powder and the powdery silver brazing flux and uniformly mixing; s4: weighing a solvent, a binder and an active agent according to the proportion of the silver solder paste, adding the solvent, the binder and the active agent into a beaker, heating and stirring the mixture until the solvent, the binder and the active agent are completely dissolved, adding a thixotropic agent into the beaker, stirring the mixture until the thixotropic agent is completely dissolved to prepare an adhesive, and standing the adhesive for a period of time; s5: if the silver solder paste contains silver solder, the mixed powder obtained in the step S3, or the silver solder powder obtained in the step S1 and the paste obtained in the step S4 are kneaded and stirred. The coating has excellent viscosity, thixotropy, collapse resistance and storage performance.
Description
Technical Field
The application relates to a silver soldering paste and a preparation method thereof, which are mainly suitable for the soldering connection of copper, copper alloy and stainless steel on a valve body device.
Background
At present, in the welding process of some valve body devices, annular, filiform and strip-shaped solders are mostly adopted for brazing, but with the development of miniaturization, diversification and complication of the shapes of brazed devices, the traditional annular, filiform and strip-shaped solders cannot meet the production requirements of high efficiency and automation. Some complex valve bodies have more than 10 welding points, and the welding rings or welding wires are used for brazing, so that the efficiency is low, the quality is unstable, and meanwhile, the surfaces of welding materials and welding devices are manually coated with soldering flux, so that the welding efficiency is influenced. For the welding seam of the special-shaped joint, the requirement on the shape of the welding ring is high, the shape of the welding ring needs to be completely matched with the shape of the joint, and the production cost of the welding ring is greatly increased.
Aiming at the brazing solder of valve body devices, the flexible brazing solder paste is used for replacing the traditional annular, filamentous and strip-shaped solder to realize efficient and automatic welding production. Compared with the traditional welding wire, welding ring and welding rod, the silver soldering paste has the biggest characteristic that automatic dispensing equipment is utilized to automatically dispense and coat complex parts and special-shaped parts, the dispensed parts enter a continuous tunnel furnace to be brazed, and a plurality of welding spots are welded simultaneously, so that the continuity and the automation of the whole brazing process can be realized. The soldered joint has clean surface and high welding strength and does not need cleaning.
Disclosure of Invention
The technical problem solved by the application is to overcome the defects in the prior art, and provide the silver soldering paste and the preparation method thereof, which are mainly used for automatic soldering of valve body devices and have excellent viscosity, thixotropy, collapse resistance and storage performance.
The technical scheme adopted by the application for solving the technical problems comprises the following steps: the silver soldering paste comprises the following components in percentage by mass: 65-95% of silver solder, 0-30% of silver brazing agent and 5-10% of adhesive.
The main elements of the silver solder are Ag and Cu. As one of the preferred schemes, the selected silver solder comprises the following components in percentage by mass: 71-73% of Ag, Cu: 27 to 29 percent.
The main elements of the silver solder are Ag, Cu, Zn and Sn. As one of the preferred schemes, the selected silver solder comprises the following components in percentage by mass: 55-57% of Ag, Cu: 21-23%, Zn: 15-19%, Sn: 4.5 to 5.5 percent.
The main elements of the silver solder are Ag, Cu, Zn, Ni and Si. As one of the preferred schemes, the selected silver solder comprises the following components in percentage by mass: 49-51% of Ag, Cu: 19-21%, Zn: 26-30%, Ni: 1.5-2.5%, Si: trace amount.
The adhesive consists of 50-70% of solvent, 10-40% of binder, 5-10% of active agent and 0.5-5% of thixotropic agent by mass percent.
The solvent is one or more of polyalcohol, turpentine, white oil, esters and iso-feilone.
The binder is one or a combination of more than two of acrylic resin, epoxy resin, hydroxyethyl cellulose and polyurethane.
The active agent is one or the combination of more than two of benzene, monohydric alcohol, ester, dibasic acid and cyclohexylamine.
The thixotropic agent is one or the combination of more than two of fumed silica, organic bentonite, hydrogenated castor oil and polyamide wax.
The technical scheme that this application solved above-mentioned technical problem and adopted still includes: the preparation method of the silver soldering paste comprises the following steps of preparing materials according to the components:
s1: preparing silver-based alloy powder (powdery silver solder, referred to as silver solder powder for short) by using an air atomization method, and sieving the atomized silver solder powder by using a 200-mesh screen to obtain the silver solder powder below 200 meshes;
if the silver solder paste contains silver solder (silver solder is needed), the steps are performed in sequence (the steps S2 and S3 are performed first, and then the step S4 is performed), otherwise, the step S4 is skipped (namely, the steps S2 and S3 are skipped):
s2: weighing the powdery silver soldering flux, dehydrating and drying the powdery silver soldering flux, and then sieving the powdery silver soldering flux by using a 200-mesh screen to obtain the powdery silver soldering flux below 200 meshes;
s3: adding silver solder powder below 200 meshes and powdery silver soldering flux into a grinding and screening machine for grinding and screening, wherein the mesh size of the grinding machine is 200 meshes, the grinding time is 20-30 minutes, and the silver solder powder below 200 meshes and the powdery silver soldering flux are uniformly mixed;
s4: weighing a solvent, a binder and an active agent according to the proportion of the silver solder paste, adding the solvent, the binder and the active agent into a beaker, heating to 60-100 ℃, stirring until the solvent, the binder and the active agent are completely dissolved, then forming a colloid, adding a thixotropic agent which accords with the proportion of the silver solder paste into the colloid, stirring until the thixotropic agent is completely dissolved, and standing the obtained adhesive for a period of time (usually not less than 4 hours) for use;
s5: if the silver solder paste contains silver solder, the mixed powder obtained in the step S3, or the silver solder powder obtained in the step S1 and the paste obtained in the step S4 are kneaded and stirred in a kneader, and the silver solder paste is obtained, and the obtained silver solder paste is canned with plastic to be sealed.
The silver soldering paste can be used for gas shielded welding or vacuum brazing in a furnace, can also be used for flame welding and high-frequency welding in an atmospheric environment, and can also ensure the stability of welding quality while improving the welding efficiency of valve body devices. The solder paste has the advantages of moderate viscosity and thixotropic index, easiness in dispensing, excellent heat collapse resistance, and no rapid collapse and deformation after partial decomposition and volatilization of a solvent at high temperature.
Detailed Description
The application relates to a silver soldering paste and a preparation scheme thereof, wherein the silver soldering paste comprises the following components in percentage by mass: 65-95% of silver solder, 0-30% of silver brazing agent and 5-10% of adhesive.
Wherein the main elements of the silver solder are Ag and Cu; as one of the preferred schemes, the selected silver solder comprises the following components in percentage by mass: 71-73% of Ag, Cu: 27 to 29 percent.
As one of the preferred schemes, the selected silver solder comprises the following components in percentage by mass: 55-57% of Ag, Cu: 21-23%, Zn: 15-19%, Sn: 4.5 to 5.5 percent.
As one of the preferred schemes, the selected silver solder comprises the following components in percentage by mass: 49-51% of Ag, Cu: 19-21%, Zn: 26-30%, Ni: 1.5-2.5%, Si: 0.1 percent.
The adhesive consists of 50-70% of solvent, 10-40% of binder, 5-10% of active agent and 0.5-5% of thixotropic agent by mass percent.
The solvent is one or more of polyalcohol, turpentine, white oil, esters and iso-feilone.
The binder is one or a combination of more than two of acrylic resin, epoxy resin, hydroxyethyl cellulose and polyurethane.
The active agent is one or the combination of more than two of benzene, monohydric alcohol, ester, dibasic acid and cyclohexylamine.
The thixotropic agent is one or the combination of more than two of fumed silica, organic bentonite, hydrogenated castor oil and polyamide wax.
The present application will be described in further detail with reference to the following examples, which are illustrative of the present application and are not intended to limit the present application.
Example 1:
firstly, the raw materials were prepared from the following components (example 1 ratio table):
then, the specific preparation steps are as follows:
(1) placing the prepared AgCuZnSn short ingot into an atomizing furnace, heating and melting to 850-900 DEG C
Starting atomization for milling, and sieving the obtained powder by using a 200-mesh screen sieve to obtain silver solder powder of-200 meshes (which means not more than 200 meshes, the same below);
(2) weighing epoxy resin, white oil and cyclohexylamine according to the proportioning table of the embodiment 1, putting the epoxy resin, the white oil and the cyclohexylamine into a beaker for heating and stirring, heating the temperature to 80 ℃, mechanically stirring until the cyclohexylamine and the epoxy resin are completely diluted and dissolved, adding hydrogenated castor oil and polyamide wax for stirring to obtain a finished adhesive, and standing for more than 4 hours;
(3) dehydrating and drying the powdery silver soldering flux, and screening by using a 200-mesh screen;
(4) weighing silver solder powder of-200 meshes in a total proportion of 80% and powdery silver solder of-200 meshes in a total proportion of 10% according to the mass percentage, and putting the silver solder powder and the powdery silver solder into a grinding and screening machine for grinding and mixing for 20 minutes;
(5) weighing adhesive with the total proportion of 10 percent, adding the adhesive into the mixed powder, kneading and stirring to prepare the finished product of the silver-based soldering paste.
The silver brazing paste prepared according to the embodiment 1 has the advantages of low melting temperature, stable selected adhesive components, moderate boiling point, main volatilization during heating, difficult high-temperature carbonization under protective atmosphere, stable effect due to the addition of the polyamide wax, capability of ensuring that the solder paste does not generate serious deformation and sagging in the slow heating process, and is mainly used for gas shielded welding in a furnace, stainless steel or brass for connecting valve body devices, good welding surface residue, good gap filling performance and high welding strength.
Example 2:
firstly, the raw materials were prepared from the following components (example 2 ratio table):
then, the specific preparation steps are as follows:
(1) placing the AgCu short ingot prepared by smelting into an atomizing furnace, heating and melting to 900-950 ℃,
starting atomization to prepare powder, and screening the obtained powder by using a 200-mesh screen to obtain silver solder powder of-200 meshes;
(2) weighing hydroxyethyl cellulose and polyol according to the proportioning table of the embodiment 2, putting the hydroxyethyl cellulose and the polyol into a beaker for heating and stirring, wherein the heating temperature is 70 ℃, the hydroxyethyl cellulose is completely dissolved, adding epoxy resin, stirring and mixing uniformly, finally adding hydrogenated castor oil, stirring to obtain a finished adhesive, and standing for more than 4 hours;
(3) weighing 7% of adhesive in total proportion and 93% of silver solder powder of-200 meshes in total proportion by mass, kneading and stirring to prepare the finished product of the silver-based soldering paste.
The silver solder paste prepared according to the embodiment 2 has moderate melting temperature and good fluidity, the selected adhesive component can mainly contain volatile substances, the fluidity of the silver solder paste can be ensured to a greater extent, and the silver solder paste does not contain soldering flux and can not generate corrosive residues, is mainly used for vacuum brazing and is mainly applied to devices with small welding deformation and high requirements on the quality of the welded surface.
Example 3:
firstly, the raw materials were prepared from the following components (example 3 ratio table):
then, the specific preparation steps are as follows:
(1) placing the prepared AgCuZnNiSi short ingot into an atomizing furnace, heating and melting to 850-900 ℃,
starting atomization to prepare powder, and screening the obtained powder by using a 200-mesh screen to obtain silver solder powder of-200 meshes;
(2) weighing hydroxyethyl cellulose, epoxy resin and esters according to the proportioning table of the embodiment 3, putting the weighed hydroxyethyl cellulose, epoxy resin and esters into a beaker for heating and stirring, wherein the heating temperature is 60-80 ℃, mechanically stirring until the hydroxyethyl cellulose and the epoxy resin are completely diluted and dissolved, adding methanol, polyamide wax and organic bentonite for stirring to obtain a finished adhesive, and standing for more than 4 hours;
(3) dehydrating and drying the powdery silver soldering flux, and screening by using a 200-mesh screen;
(4) weighing silver solder powder with a total proportion of 70 percent to 200 meshes and powdery silver solder with a total proportion of 20 percent to 200 meshes according to the mass percent, putting the silver solder powder and the powdery silver solder into a grinding and screening machine, and grinding and mixing for 20 minutes;
(5) weighing adhesive with the total proportion of 10 percent, adding the adhesive into the mixed powder, kneading and stirring to prepare the finished product of the silver-based soldering paste.
The silver solder paste welding joint prepared according to the embodiment 3 has excellent mechanical properties, the selected adhesive components are easy to decompose when heated in air, the combustion residue is low, and the silver solder paste welding joint is mainly used for flame brazing and high-frequency brazing in the atmosphere.
Example 4:
first, the raw material preparation was carried out as follows (example 4 ratio table):
then, the specific preparation steps are as follows:
(1) placing the prepared AgCuZnSn short ingot into an atomizing furnace, heating and melting to 850-,
starting atomization to prepare powder, and screening the obtained powder by using a 200-mesh screen to obtain silver solder powder of-200 meshes;
(2) weighing the high molecular polymer and the ester solvent according to the proportioning table of the embodiment 4, putting the high molecular polymer and the ester solvent into a beaker, heating and stirring the mixture at the temperature of 80 ℃, mechanically stirring the mixture until the high molecular polymer is completely dissolved, adding hydrogenated castor oil into the mixture, stirring the mixture to obtain a finished adhesive, and standing the adhesive for more than 4 hours;
(3) dehydrating and drying the powdery silver soldering flux, and screening by using a 200-mesh screen;
(4) weighing silver solder powder of-200 meshes in a total proportion of 80% and powdery silver solder of-200 meshes in a total proportion of 10% according to the mass percentage, and putting the silver solder powder and the powdery silver solder into a grinding and screening machine for grinding and mixing for 20 minutes;
(5) weighing adhesive with the total proportion of 10 percent, adding the adhesive into the mixed powder, kneading and stirring to prepare the finished product of the silver-based soldering paste.
Compared with the silver solder paste prepared in the embodiment 1, the silver solder paste prepared in the embodiment 4 adopts the high molecular polymer and the lipid as the bonding agents, can adjust the fluidity of the silver solder paste, and is mainly used for gas shielded welding in a furnace.
Claims (8)
1. The silver soldering paste is characterized by comprising the following components in percentage by mass: 65-95% of silver solder, 0-30% of silver solder and 5-10% of adhesive, wherein the silver solder comprises the following three composition modes: 1. ag and Cu; 2. ag, Cu, Zn, Sn; 3. ag, Cu, Zn, Ni and trace element Si.
2. The silver solder paste according to claim 1, wherein: the adhesive consists of 50-70% of solvent, 10-40% of binder, 5-10% of active agent and 0.5-5% of thixotropic agent by mass percent.
3. The silver solder paste according to claim 2, wherein: the solvent is one or the combination of more than two of polyalcohol, turpentine, white oil, esters and iso-feilone.
4. The silver solder paste according to claim 2, wherein: the binder is one or the combination of more than two of acrylic resin, epoxy resin, hydroxyethyl cellulose and polyurethane.
5. The silver solder paste according to claim 2, wherein: the active agent is one or the combination of more than two of benzene, monohydric alcohol, ester, dibasic acid and cyclohexylamine.
6. The silver solder paste according to claim 2, wherein: the thixotropic agent is one or the combination of more than two of fumed silica, organic bentonite, hydrogenated castor oil and polyamide wax.
7. The method for preparing silver solder paste according to any one of claims 1 to 6, which is characterized by comprising the following steps:
s1: preparing silver solder powder by using an air atomization method, and sieving the silver solder powder prepared by atomization by using a 200-mesh screen to obtain the silver solder powder below 200 meshes;
if the silver solder paste contains silver solder in the following order or else jump to step S4:
s2: weighing the powdery silver soldering flux, dehydrating and drying the powdery silver soldering flux, and then sieving the powdery silver soldering flux by using a 200-mesh screen to obtain the powdery silver soldering flux below 200 meshes;
s3: adding silver solder powder below 200 meshes and powdery silver soldering flux into a grinding and screening machine for grinding and screening, wherein the mesh size of the grinding machine is 200 meshes, the grinding time is 20-30 minutes, and the silver solder powder below 200 meshes and the powdery silver soldering flux are uniformly mixed;
s4: weighing a solvent, a binder and an active agent according to the proportion of the silver soldering paste, adding the solvent, the binder and the active agent into a beaker, heating and stirring the mixture until the solvent, the binder and the active agent are completely dissolved, adding a thixotropic agent according with the proportion of the silver soldering paste, stirring the mixture until the thixotropic agent is completely dissolved, and standing the obtained adhesive for a period of time;
s5: if the silver solder paste contains powdered silver solder, the mixed powder obtained in the step S3, or the silver solder powder obtained in the step S1 and the adhesive obtained in the step S4 are added to a kneader and kneaded and stirred.
8. The method for producing silver solder paste according to claim 7, wherein: the heating temperature is between 60 and 100 ℃, and the standing time of the adhesive is not less than 4 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110057266.XA CN112756845A (en) | 2021-01-15 | 2021-01-15 | Silver soldering paste and preparation method thereof |
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| CN202110057266.XA CN112756845A (en) | 2021-01-15 | 2021-01-15 | Silver soldering paste and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115609189A (en) * | 2022-12-16 | 2023-01-17 | 西安稀有金属材料研究院有限公司 | Pasty titanium-based brazing material for titanium alloy vacuum brazing and preparation method thereof |
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| CN101301705A (en) * | 2007-12-05 | 2008-11-12 | 东莞市普赛特电子科技有限公司 | Needle cylinder injection type leadless solder paste for heat radiator welding |
| CN101992361A (en) * | 2009-08-27 | 2011-03-30 | 厦门市及时雨焊料有限公司 | Air pressure spot coating soldering paste for connector |
| CN103100800A (en) * | 2013-03-11 | 2013-05-15 | 河南理工大学 | Paste solder for hard soldering of SiCp/Al composite material and preparation method and use method thereof |
| CN103659053A (en) * | 2012-09-13 | 2014-03-26 | 莫文剑 | Copper welding paste for braze welding and preparation method thereof |
| JP2016026879A (en) * | 2014-06-27 | 2016-02-18 | 株式会社タムラ製作所 | Lead-free solder alloy containing solder paste composition, solder joint body structure, and electronic circuit board |
| CN106181117A (en) * | 2016-07-07 | 2016-12-07 | 兰州理工大学 | A kind of money base solder paste and preparation method thereof |
| CN107322187A (en) * | 2017-09-05 | 2017-11-07 | 广州先艺电子科技有限公司 | A kind of active soldering paste of silver-bearing copper titanium |
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2021
- 2021-01-15 CN CN202110057266.XA patent/CN112756845A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1064637A (en) * | 1991-03-14 | 1992-09-23 | 中国有色金属工业总公司昆明贵金属研究所 | The method for welding of money base soldering paste and Silver Jewelry |
| CN101301705A (en) * | 2007-12-05 | 2008-11-12 | 东莞市普赛特电子科技有限公司 | Needle cylinder injection type leadless solder paste for heat radiator welding |
| CN101992361A (en) * | 2009-08-27 | 2011-03-30 | 厦门市及时雨焊料有限公司 | Air pressure spot coating soldering paste for connector |
| CN103659053A (en) * | 2012-09-13 | 2014-03-26 | 莫文剑 | Copper welding paste for braze welding and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115609189A (en) * | 2022-12-16 | 2023-01-17 | 西安稀有金属材料研究院有限公司 | Pasty titanium-based brazing material for titanium alloy vacuum brazing and preparation method thereof |
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Application publication date: 20210507 |
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