CN101301705A - Needle cylinder injection type leadless solder paste for heat radiator welding - Google Patents
Needle cylinder injection type leadless solder paste for heat radiator welding Download PDFInfo
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- CN101301705A CN101301705A CNA2007100321286A CN200710032128A CN101301705A CN 101301705 A CN101301705 A CN 101301705A CN A2007100321286 A CNA2007100321286 A CN A2007100321286A CN 200710032128 A CN200710032128 A CN 200710032128A CN 101301705 A CN101301705 A CN 101301705A
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Abstract
The invention discloses a needle cylinder injection-typed lead-free solder paste used for the welding of radiators; the lead-free solder paste contains a tin-bismuth-rare earth lead-free solder mixed with a soldering flux. The soldering flux comprises 40 to 45 percent of resin (such as hydrogenation resin glycerol and alkyd resin), 10 to 15 percent of active agent (such as alkyl poly-glycosides and monoethanolamide sulfosuccinate), 2.1 to 3.1 percent of thixotropic agent (such as amide modified hydrogenated castor oil and Ethylene bis stearamide stearic amide), 0.8 to 1.2 percent of special additive (such as release agent, antioxidant and resist), and residual quantity of solvent (such as glycol dipropionate ether acetate and 1,3-propanediol). The needle cylinder injection typed lead-free solder paste of the invention has low welding temperature, comparatively low viscosity, better rheological property under the action of the pressure, and better anti-collapse performance after the solder paste is coated, and is especially applicable to the welding of the radiators, and is beneficial to precisely controlling the dosage of the welding paste and saving the cost.
Description
Technical field
The present invention relates to the welding of a kind of electronic product and use lead-free solder paste, be specially adapted on the radiator needle cylinder injection type of soldering paste and drip and be coated with.
Background technology
Heat radiation has become a big stumbling-block of restriction chip performance high speed development, is the life-critical big problem of whole information industry even global economy.Radiator welding reliably is the respond well assurance of chip cooling.Along with the attention of people to environmental protection and self health, soldering paste is unleaded imperative.Because chip cooling is relatively poor with the radiator thermal shock resistance, need select the lower soldering paste of welding temperature during welding.Existing lead-free solder paste has series such as Xi-Yin, tin-copper, and its welding temperature can't satisfy the instructions for use of radiator mostly more than 200 ℃.In addition, generally the soldering paste printing process of Cai Yonging can't be carried out effective radiator welding, has seriously hindered the application of heat dissipation technology on chip cooling.
Patent CN1895836A discloses a kind of low-temperature lead-free soldering paste of being made up of tin-bismuth alloy electroplating powder and solder flux, this soldering paste mixes by resin, solvent, surfactant, thixotropic agent, be heated to fully and leave standstill to room temperature after the dissolving, stir in the vacuum dispersion machine with the Sn-Bi solder after 72 hours in refrigeration under 1～5 ℃ the environment, the sealing packing is made.This soldering paste welding temperature is lower, is applicable to the components and parts that thermal shock resistance is relatively poor.But the used coating method of this soldering paste is traditional mould printing, is not suitable for the needle cylinder injection type coating of soldering paste on the radiator.
Summary of the invention
The purpose of this invention is to provide a kind of needle cylinder injection type leadless solder paste, satisfy the needs of radiator welding.For realizing the object of the invention, adopt following technical scheme:
Needle cylinder injection type leadless solder paste of the present invention is composed of the following components: 87～90% solders, 10～13% brazing fluxes (mass percent does not specify that percentage is mass percent in the eight-legged essay).
In the above-mentioned needle cylinder injection type leadless solder paste, the component of solder is: 39.5～43.98% tin, 56～60 bismuths, 0.02～0.5% mixed rare earth of lanthanum and cerium.
One of the tin bismuth is that alloy melting point is low, can obtain the solder alloy of 139～232 ℃ of fusion temperature scopes, is particularly suitable for low temperature brazing, and the potential substitute of tin-lead solder.But because bismuth is thick unusually after surpassing 140 ℃, performance becomes fragile, and makes the mechanical property of sn-bi alloy worsen; The wetability of alloy is subjected to impurity effect very big in addition, makes the service reliability variation of scolder.The present invention adds mixed rare earth of lanthanum and cerium in sn-bi alloy, but crystal grain thinning improves the scolder tissue, because the mixed rare earth of lanthanum and cerium element can promote the row nuclear of alloy in process of setting, alloy structure is played the metamorphic homogenization treatment effect, thereby improve the mechanical property of alloy.Simultaneously, the adding of mixed rare earth of lanthanum and cerium helps reducing scolder, welded part contacts with oxygen, make the surface tension between welded part and the liquid solder reduce, therefore can make wetting easier generation, significantly improve the wetability of scolder, thereby improve the service reliability of scolder.If content of rare earth is less than 0.001%, its effect is not obvious; If content of rare earth is higher than 1%, then make the scolder fusing point raise degradation.Mixed rare earth of lanthanum and cerium content among the present invention is preferably 0.02～0.5%, and lanthanum accounts for 30～40% in mixed rare earth of lanthanum and cerium, and cerium accounts for 40～50%, and praseodymium accounts for 8%, and neodymium accounts for 5%, and surplus is other rare earths, and rare earth element accounts for more than 98% of gross mass; Bi content is preferably 56～60%; Tin content is preferably 39.5～43.98%.Good in order to ensure soldering paste modest viscosity, thixotropic property, benefit needle cylinder injection, solder is unsuitable meticulous, and should satisfy narrow, the smooth surface of particle size distribution.The solder diameter is preferably 45～75 μ m.
In the above-mentioned needle cylinder injection type leadless solder paste, the component of brazing flux is: 40～45% resins, 10～15% activating agents, 2.1～3.1% thixotropic agent, 0.8～1.2% special additive, surplus are solvent.
Resin can be selected one or more the combination in Foral glyceride, alkyd resins, rosin polyol ester, rosin modified phenolic resin, rosin cis-butenedioic anhydride polyol ester, the newtrex glyceride.Components contents is not particularly limited in the resin, be preferably 50～65% Foral glyceride respectively with the combination of 35～50% rosin polyol esters, rosin modified phenolic resin, alkyd resins.The content of resin in brazing flux is preferably 40～45%.
Activating agent adopts green surfactant, can select one or more the combination in FMEE, MES, alkyl polyglycoside, the single ethanol amide succinate.Components contents is not particularly limited in the activating agent, be preferably 50～70% alkyl polyglycosides respectively with the combination of 30～50% FMEEs, MES or single ethanol amide succinate.The content of activating agent in brazing flux is preferably 10～15%.
Thixotropic agent can be selected one or more the combination in the two stearic amides of rilanit special, second two supports, the modified hydrogenated castor oil of acid amides, NPE, OPEO, the organobentonite.The thixotropic agent component be preferably the modified hydrogenated castor oil of 40～50% acid amides respectively with the combination of the two stearic amides of 50～60% second two support, NPE, OPEO, rilanit special.The content of thixotropic agent in brazing flux is preferably 2.1～3.1%.This preferred thixotropic agent can make the soldering paste of making obtain suitable viscosity and deposition characteristics, and play the effect of stopping up in the soldering paste injection process of preventing, and can effectively avoid soldering paste in injection process because injection nozzle is separated agile and part is bonded at the soldering paste of chewing in bond pad surface takes on the pad.
The content of special additive in brazing flux is preferably 0.8～1.2%, comprises releasing agent, antioxidant and resist.The combination of one or more in releasing agent selection silicone emulsion, dimethicone, the diethyl silicone oil.Components contents is not particularly limited in the releasing agent.The content of releasing agent in special additive is preferably 30～40%.The combination of one or more in the single phenol of antioxidant selection alkylation, alkylation polyphenol, the thiobisphenol.Components contents is not particularly limited in the antioxidant.The content of antioxidant in special additive is preferably 25～35%.The combination of one or more in resist selection polyvinylpyrrolidone, polyethyene diamine, the polybenzimidazoles.Components contents is not particularly limited in the resist.The content of resist in special additive is preferably 25～45%.
Solvent can select 1, the combination of one or more in ammediol, propylene glycol monomethyl ether, propane diols butyl ether, propylene glycol monomethyl ether, butyl acetate, MEK, cyclohexanone, diethylene glycol dimethyl ether, dipropylene glycol methyl ether, DPG ether, NHD, triethylene glycol methyl ether, tri ethylene glycol ethyl ether, dimethyl adipate, diethylene glycol ether acetate, ethylene glycol ether acetate, 1-Methoxy-2-propyl acetate, the propylene glycol monomethyl ether acetate.Components contents is not particularly limited in the solvent.Except that resin, activating agent, thixotropic agent, special additive, surplus is a solvent in the brazing flux.
The preparation method of needle cylinder injection type leadless solder paste for heat radiator welding of the present invention is: at first by the brazing flux component ratio each component is mixed, leave standstill after the heating for dissolving to room temperature, make required brazing flux in refrigeration under 5～10 ℃ of environment after 48 hours; Prepare required lead-free brazing by the solder component ratio with conventional method then; Secondly in selected ratio brazing flux and solder are put in the vacuum dispersion machine and stir; Adopt hydraulic press with the soldering paste that the modulates syringe of packing at last, obtain needle cylinder injection type leadless solder paste, under 5～10 ℃ of conditions, refrigerate then.
Needle cylinder injection type leadless solder paste of the present invention, welding temperature is at 145～170 ℃, viscosity is relatively low, rheological characteristic is better under pressure, the anti-preferably performance of caving in is arranged after the soldering paste coating, be particularly useful for radiator welding, solved the unleaded difficult problem of radiator welding, and adopt needle cylinder injection to drip the mode of being coated with and carry out the soldering paste coating and not only solved soldering paste effectively is coated with on radiator, and benefit accurate control, can not cause the waste of soldering paste.
[specific embodiment]
Table 1 is that the brazing flux among each embodiment is formed.
Embodiment 1: 87% spherical lead-free brazing powder and 13% brazing flux are stirred, wherein consisting of of solder: 42.3% tin, 57.5% bismuth and 0.2% mixed rare earth of lanthanum and cerium; The composition of brazing flux sees Table embodiment 1 in 1, and it is mixed, and leaves standstill after the heating for dissolving to room temperature, makes required brazing flux in refrigeration under 5～10 ℃ of environment after 48 hours, and then mixes with solder.Adopt hydraulic press with the soldering paste that the modulates syringe of packing into, prepare needle cylinder injection type leadless solder paste, refrigeration is standby under 5～10 ℃ of conditions then.
Embodiment 2: compare the consisting of of solder with embodiment 1: 42.48% tin, 58% bismuth and 0.02% mixed rare earth of lanthanum and cerium; The composition of brazing flux sees Table embodiment 2 in 1.
Embodiment 3: compare with embodiment 1,88% spherical lead-free brazing powder and 12% brazing flux are stirred, wherein consisting of of solder: 42.2% tin, 57.5% bismuth and 0.3% mixed rare earth of lanthanum and cerium; The composition of brazing flux sees Table embodiment 3 in 1.
Embodiment 4: compare with embodiment 1,88% spherical lead-free brazing powder and 12% brazing flux are stirred, wherein consisting of of solder: 41.96% tin, 58% bismuth and 0.04% mixed rare earth of lanthanum and cerium; The composition of brazing flux sees Table embodiment 4 in 1.
Embodiment 5: compare with embodiment 1,89% spherical lead-free brazing powder and 11% brazing flux are stirred, wherein consisting of of solder: 42.15% tin, 57.5% bismuth and 0.35% mixed rare earth of lanthanum and cerium; The composition of brazing flux sees Table embodiment 5 in 1.
Embodiment 6: compare with embodiment 1,89% spherical lead-free brazing powder and 11% brazing flux are stirred, wherein consisting of of solder: 41.95% tin, 58% bismuth and 0.05% mixed rare earth of lanthanum and cerium; The composition of brazing flux sees Table embodiment 6 in 1.
Embodiment 7: compare with embodiment 1,90% spherical lead-free brazing powder and 10% brazing flux are stirred, wherein consisting of of solder: 42.1% tin, 57.5% bismuth and 0.4% mixed rare earth of lanthanum and cerium; The composition of brazing flux sees Table embodiment 7 in 1.
Embodiment 8: compare with embodiment 1,90% spherical lead-free brazing powder and 10% brazing flux are stirred, wherein consisting of of solder: 41.94% tin, 58% bismuth and 0.06% mixed rare earth of lanthanum and cerium; The composition of brazing flux sees Table embodiment 8 in 1.
Brazing flux among each embodiment of table 1 is formed
Mass percent (wt.%)
| Title | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Embodiment 8 |
| The Foral glyceride | 27 | 28 | 27.5 | 28 | 28 | 28.5 | 28 | 28.5 |
| Alkyd resins | 15 | 15 | 15 | 15 | 15.5 | 15 | 15.5 | 15 |
| Alkyl polyglycoside | 8 | 8 | 8 | 7.5 | 8 | 8 | 8 | 8 |
| The single ethanol amide succinate | 5 | 5 | 6 | 6 | 5 | 6 | 5 | 6 |
| The modified hydrogenated castor oil of acid amides | 1 | 1.5 | 1 | 1.2 | 1 | 1.5 | 1.4 | 1.6 |
| NPE | 1.5 | 1.5 | 1.5 | 1.6 | 1.6 | 1.2 | 1.4 | 1.4 |
| Dimethicone | 0.3 | 0.4 | 0.4 | 0.3 | 0.3 | 0.4 | 0.3 | 0.4 |
| The single phenol of alkylation | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
| Polyvinylpyrrolidone | 0.4 | 0.3 | 0.3 | 0.4 | 0.4 | 0.3 | 0.4 | 0.3 |
| Ethylene glycol ether acetate | 25 | 30 | 28 | 28 | 28 | 30 | 28 | 30 |
| 1, ammediol | 16.5 | 10 | 12 | 11.7 | 11.9 | 8.8 | 11.7 | 8.5 |
Claims (5)
1. one kind is used for the needle cylinder injection type leadless solder paste that radiator welds, and it is composed of the following components to press mass percent: 87～90% solders, 10～13% brazing fluxes.
2. needle cylinder injection type leadless solder paste according to claim 1 is characterized in that: described solder is made up of 39.5～43.98% tin, 56～60% bismuths and 0.02～0.5% mixed rare earth of lanthanum and cerium by mass percentage.
3. needle cylinder injection type leadless solder paste according to claim 1 is characterized in that: described brazing flux is a solvent composition by 40～45% resins, 10～15% activating agents, 2.1～3.1% thixotropic agent, 0.8～1.2% special additive, surplus by mass percentage.
4. needle cylinder injection type leadless solder paste according to claim 3 is characterized in that: described resin be 50～65% Foral glyceride respectively with the combination of 35～50% rosin polyol esters, rosin modified phenolic resin, alkyd resins; Described activating agent be 50～70% alkyl polyglycosides respectively with the combination of 30～50% FMEEs, MES or single ethanol amide succinate; Described thixotropic agent be the modified hydrogenated castor oil of 40～50% acid amides respectively with the combination of the two stearic amides of 50～60% second two support, NPE, OPEO, rilanit special; Described special additive is that 30～40% releasing agents, 25～35% antioxidant and 25～45% resists are formed; Described solvent is 1, the combination of one or more in ammediol, propylene glycol monomethyl ether, propane diols butyl ether, propylene glycol monomethyl ether, butyl acetate, MEK, cyclohexanone, diethylene glycol dimethyl ether, dipropylene glycol methyl ether, DPG ether, NHD, triethylene glycol methyl ether, tri ethylene glycol ethyl ether, dimethyl adipate, diethylene glycol ether acetate, ethylene glycol ether acetate, 1-Methoxy-2-propyl acetate, the propylene glycol monomethyl ether acetate.
5. needle cylinder injection type leadless solder paste according to claim 4 is characterized in that: described releasing agent is one or more the combination in silicone emulsion, dimethicone, the diethyl silicone oil; Described antioxidant is one or more the combination in the single phenol of alkylation, alkylation polyphenol, the thiobisphenol; Described resist is one or more the combination in polyvinylpyrrolidone, polyethyene diamine, the polybenzimidazoles.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007100321286A CN101301705A (en) | 2007-12-05 | 2007-12-05 | Needle cylinder injection type leadless solder paste for heat radiator welding |
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| CNA2007100321286A CN101301705A (en) | 2007-12-05 | 2007-12-05 | Needle cylinder injection type leadless solder paste for heat radiator welding |
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Cited By (12)
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| CN102248321A (en) * | 2011-07-06 | 2011-11-23 | 江西理工大学 | Lead-free solder paste used for halogen-free LED (light-emitting diode) lamp |
| CN102357747A (en) * | 2011-09-06 | 2012-02-22 | 云南锡业锡材有限公司 | Lead-free solder paste for ultrafine solder powder and preparation method thereof |
| CN102848093A (en) * | 2011-07-01 | 2013-01-02 | 北京有色金属与稀土应用研究所 | Lead-free soldering paste, preparation method and application thereof for low temperature brazing for aluminum radiator |
| WO2013017883A1 (en) * | 2011-08-02 | 2013-02-07 | Fry's Metals, Inc. | High impact toughness solder alloy |
| CN103008921A (en) * | 2012-12-26 | 2013-04-03 | 广东中实金属有限公司 | Halogen-free scaling powder used for lead-free solder paste and preparation method thereof |
| TWI579098B (en) * | 2014-12-25 | 2017-04-21 | Senju Metal Industry Co | Core solder flux, flux solder flux, core solder and flux solder |
| CN106607650A (en) * | 2015-10-23 | 2017-05-03 | 东莞市天铖锡业有限公司 | Rare earth cerium solder alloy soldering paste |
| CN106825982A (en) * | 2017-02-07 | 2017-06-13 | 深圳市斯特纳新材料有限公司 | A kind of anti-collapse leadless soldering tin paste of low viscosity and preparation method thereof |
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| CN109759743A (en) * | 2019-03-22 | 2019-05-17 | 东莞市众禹新材料有限公司 | Lead-free high-temperature tin cream |
| CN112756845A (en) * | 2021-01-15 | 2021-05-07 | 杭州华光焊接新材料股份有限公司 | Silver soldering paste and preparation method thereof |
| CN114845830A (en) * | 2019-12-27 | 2022-08-02 | 哈利玛化成株式会社 | Method for coating brazing material and method for manufacturing metal member for brazing |
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- 2007-12-05 CN CNA2007100321286A patent/CN101301705A/en active Pending
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| CN102848093A (en) * | 2011-07-01 | 2013-01-02 | 北京有色金属与稀土应用研究所 | Lead-free soldering paste, preparation method and application thereof for low temperature brazing for aluminum radiator |
| CN102848093B (en) * | 2011-07-01 | 2015-05-13 | 北京有色金属与稀土应用研究所 | Lead-free soldering paste, preparation method and application thereof for low temperature brazing for aluminum radiator |
| CN102248321A (en) * | 2011-07-06 | 2011-11-23 | 江西理工大学 | Lead-free solder paste used for halogen-free LED (light-emitting diode) lamp |
| KR102045951B1 (en) | 2011-08-02 | 2019-11-18 | 알파 어셈블리 솔루션스 인크. | High impact toughness solder alloy |
| WO2013017883A1 (en) * | 2011-08-02 | 2013-02-07 | Fry's Metals, Inc. | High impact toughness solder alloy |
| KR20140050090A (en) * | 2011-08-02 | 2014-04-28 | 알파 메탈즈, 인코포레이티드 | High impact toughness solder alloy |
| CN103906598A (en) * | 2011-08-02 | 2014-07-02 | 阿尔法金属公司 | High impact toughness solder alloy |
| JP2014524354A (en) * | 2011-08-02 | 2014-09-22 | アルファ・メタルズ・インコーポレイテッド | High impact toughness solder alloy |
| CN102357747A (en) * | 2011-09-06 | 2012-02-22 | 云南锡业锡材有限公司 | Lead-free solder paste for ultrafine solder powder and preparation method thereof |
| CN102357747B (en) * | 2011-09-06 | 2016-08-10 | 云南锡业锡材有限公司 | Leadless soldering tin paste of ultra-fine solder powder and preparation method thereof |
| CN103008921A (en) * | 2012-12-26 | 2013-04-03 | 广东中实金属有限公司 | Halogen-free scaling powder used for lead-free solder paste and preparation method thereof |
| TWI579098B (en) * | 2014-12-25 | 2017-04-21 | Senju Metal Industry Co | Core solder flux, flux solder flux, core solder and flux solder |
| CN106607650A (en) * | 2015-10-23 | 2017-05-03 | 东莞市天铖锡业有限公司 | Rare earth cerium solder alloy soldering paste |
| CN106825982A (en) * | 2017-02-07 | 2017-06-13 | 深圳市斯特纳新材料有限公司 | A kind of anti-collapse leadless soldering tin paste of low viscosity and preparation method thereof |
| CN106825982B (en) * | 2017-02-07 | 2019-04-16 | 深圳市斯特纳新材料有限公司 | A kind of anti-collapse leadless soldering tin paste of low viscosity and preparation method thereof |
| CN107891232A (en) * | 2017-12-06 | 2018-04-10 | 江苏广昇新材料有限公司 | A kind of lead-free and halogen-free weld-aiding cream and preparation method thereof |
| CN107891232B (en) * | 2017-12-06 | 2020-03-17 | 江苏广昇新材料有限公司 | Lead-free halogen-free soldering paste and preparation method thereof |
| CN109759743A (en) * | 2019-03-22 | 2019-05-17 | 东莞市众禹新材料有限公司 | Lead-free high-temperature tin cream |
| CN114845830A (en) * | 2019-12-27 | 2022-08-02 | 哈利玛化成株式会社 | Method for coating brazing material and method for manufacturing metal member for brazing |
| CN114845830B (en) * | 2019-12-27 | 2024-03-01 | 哈利玛化成株式会社 | Method for applying brazing material and method for manufacturing metal member for brazing |
| CN112756845A (en) * | 2021-01-15 | 2021-05-07 | 杭州华光焊接新材料股份有限公司 | Silver soldering paste and preparation method thereof |
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Open date: 20081112 |