CN107570911B - Lead-free high-temperature soldering paste for mobile phone and computer mainboard and preparation method thereof - Google Patents
Lead-free high-temperature soldering paste for mobile phone and computer mainboard and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a lead-free high-temperature soldering paste for mobile phones and computer mainboards, which comprises the following components, by weight, 46% of resin, 18% of solvent, 7% of thixotropic agent, 28% of active agent, 0.5% of corrosion inhibitor and 0.5% of antioxidant. The invention also discloses a preparation method thereof, which precisely controls the viscosity, thixotropy and activity release time of the solder paste by selecting raw materials and adjusting the production process, and is matched with a reflow curve in the SMT reflow process, so that the defects easily generated in the precise soldering process are reduced to the greatest extent.
Description
Technical Field
The invention belongs to the technical field of soldering paste for soldering in the electronic industry, and relates to lead-free high-temperature soldering paste for mobile phones and computer mainboards and a preparation method thereof.
Background
Solder paste is one of the most commonly used electronic accessories in the electronics industry and plays a very important role in the electronics industry. The soldering paste is a paste-like substance and is formed by mixing and stirring alloy solder powder and soldering paste. The alloy solder powder is spherical powder, and is divided into high-temperature, medium-temperature and low-temperature alloys according to the melting point of the alloy in industrial application. The high-temperature alloy is most commonly tin-silver-copper alloy (SnAg3.0Cu0.5, SnAg1.0Cu0.5 and SnAg0.3Cu0.7), the medium-temperature alloy is most commonly tin-lead alloy (Sn63Pb37), and the low-temperature alloy is most commonly tin-bismuth alloy (Sn42Bi 58). The key parameters of the alloy solder powder are sphericity, particle size distribution and surface oxidation degree. The flux paste is a paste mixture and is formed by reacting and combining a plurality of chemical substances. The main materials for producing the flux paste are rosin, solvent, activator, thixotropic agent and corrosion inhibitor. During production, various substances are heated, stirred, vacuumized, cooled and ground according to a certain proportion and adding sequence, and finally the soldering paste is produced. The flux paste mainly plays three roles, namely, the flux paste is mixed and stirred with the alloy solder powder to play a role of a carrier, and the solder powder is ensured not to be settled in the transportation and use processes. Secondly, the alloy solder powder is protected from oxidation before transportation and use, and meanwhile, the oxide on the surface of the solder powder is not corroded. Thirdly, the solder paste plays a role in removing oxides on the surface of the solder powder in the using process of the solder paste.
The soldering paste mainly plays two roles in the SMT process of the electronic industry, one is the physical connection role, namely the physical connection between a component and a circuit board is realized through the melting of alloy solder powder; the first is the electric connection function, namely the electric circulation between the component and the circuit board is realized through the melting of the alloy solder powder.
Along with the development of the electronic industry, circuit boards and electronic components of mobile phones and computer mainboards are smaller and smaller, and the integration degree of the components is gradually increased. This results in smaller device pitch on the circuit board and smaller distances between the pins of the multi-pin device. A slight bond will cause an electrical short and a slight void will cause an electrical open. The occurrence of these phenomena has become more demanding for SMT processes, the most important of which is the more demanding solder paste requirements.
The existing soldering paste in the domestic market can meet the requirements when facing conventional products such as telephone sets, interphones, routers, refrigerators, washing machines and other household appliances, and is often inferior to the Japanese soldering paste when facing mobile phones and computer mainboards. The daily series soldering paste is expensive, and the purchase period is long, so that the production requirement is difficult to ensure. The domestic solder paste has short transportation period and low price, but the defects of short circuit and open circuit are easy to occur in the actual use process, which brings much trouble to the actual production and brings great burden to the repair post of the production line.
The thixotropy of the solder paste is an important parameter of the solder paste, and is directly reflected on the collapse resistance of the solder paste. In the SMT process, the printed solder paste is printed on the circuit board for a period of time and distance from the reflow process. The collapse resistance of the solder paste ensures that the solder paste does not collapse in the process, otherwise the bridging is generated before the soldering is started, and the short circuit inevitably occurs after the soldering. The active components of the solder paste are key parameters of the solder paste, and the activity of some previous solder pastes is released at a low temperature, namely at normal temperature, so that oxides on the surface of alloy solder powder can be damaged in advance to cause the agglomeration of the solder powder. The active temperature is too high and not feasible, so that the activity is not reflected in the SMT reflow process at a later time, and the welding effect is influenced.
In order to cope with the trend of increasingly precise components and reduce the defects of precise devices such as mobile phones, computer mainboards and the like in SMT welding, the inventor of the invention further researches the defects and develops a lead-free high-temperature soldering paste for the mobile phones and the computer mainboards and a preparation method thereof.
Disclosure of Invention
The invention aims to solve the technical problem of providing a lead-free high-temperature soldering paste for mobile phones and computer mainboards and a preparation method thereof, which precisely control the viscosity, thixotropy and activity release time of the soldering paste by selecting raw materials and adjusting the production process, and are matched with a reflow curve in the SMT reflow process so as to furthest reduce the defects easily generated in precision soldering.
In order to solve the technical problems, the technical solution of the invention is as follows:
a lead-free high-temperature soldering paste for mobile phones and computer mainboards comprises, by weight, 46% of resin, 18% of solvent, 7% of thixotropic agent, 28% of active agent, 0.5% of corrosion inhibitor and 0.5% of antioxidant; the active agent is 4% of maleic acid, 2% of sebacic acid, 2% of dimer acid BX-H017%, 5% of dibutyl maleate, 5% of 2-phenylimidazole and 5% of dibutyl succinate, and the resin is 28% of AR120 rosin, 12% of Portal AX-E resin and 300R 6% of polyisobutylene.
Preferably, the solvent is in particular tetraglyme.
Preferably, the thixotropic agent is ethylene bis-stearamide, and the corrosion inhibitor is selected from benzotriazole.
Preferably, the antioxidant is specifically 2, 6-di-tert-butyl-4-methylphenol.
A preparation method of lead-free high-temperature soldering paste for mobile phones and computer mainboards comprises the following steps:
(1) respectively weighing the resin and the solvent according to the proportion, stirring and heating the mixture on heating equipment until the resin is completely dissolved to obtain a mixture A;
(2) adding the thixotropic agent weighed in advance into the A at 150 ℃, continuously stirring until the material is completely dissolved, quickly filtering to a cooling barrel, continuously and manually stirring and cooling to 110 ℃ in cold water, standing and cooling for 3-4 hours at 11 +/-3 ℃ to obtain a mixture B;
(3) taking out the mixture B, placing the mixture B at room temperature, adding an active agent, a corrosion inhibitor and an antioxidant after 8 hours, grinding and emulsifying to obtain a mixture C;
(4) grinding the mixture C into paste to obtain the soldering paste.
Preferably, the flux paste and the alloy solder powder are mixed and stirred to form the flux paste, and the flux paste comprises the following components in percentage by weight: 85-94% of alloy solder powder and 6-15% of flux paste, and the components of the alloy solder powder are SnAg3.0Cu0.5, SnAg1.0Cu0.5 and SnAg0.3Cu0.7.
Preferably, in step (4), the fineness of the pasty substance is less than 10 μm.
A preparation method of lead-free high-temperature soldering paste for mobile phones and computer mainboards comprises the following steps:
(1) respectively weighing AR120 rosin, Portal AX-E resin, polyisobutylene 300R and tetraethylene glycol dimethyl ether according to the proportion, stirring and heating the materials on heating equipment until the resins are completely dissolved to obtain a mixture A;
(2) adding ethylene bis stearamide weighed in advance into the A at 150 ℃, continuously stirring until the materials are completely dissolved, quickly filtering to a cooling barrel, continuously and manually stirring and cooling to 110 ℃ in cold water, standing and cooling for 3-4 hours at 11 +/-3 ℃ to obtain a mixture B;
(3) taking out the mixture B, placing the mixture B at room temperature, adding maleic acid, sebacic acid, dimer acid BX-H01, dibutyl maleate, 2-phenylimidazole, dibutyl succinate, benzotriazole and 2, 6-di-tert-butyl-4-methylphenol after 8 hours, grinding and emulsifying to obtain a mixture C.
(3) Grinding the mixture C into paste to obtain the soldering paste.
After the scheme is adopted, the thixotropic agent selected by the invention is ethylene bis stearamide, so that the thixotropic agent can provide good thixotropy for the solder paste, and in the production process of the solder paste, the thixotropic agent is heated and dissolved in a solvent, and can form a three-dimensional interconnected network structure after being cooled.
The window of the active agent selected by the invention is very large, and the reflux curve can be better matched by adding maleic acid, sebacic acid, dimer acid BX-H01, dibutyl maleate, 2-phenylimidazole and dibutyl succinate, and the idea of designing the active agent by matching the reflux curve is not available before. I.e. the active agent does not release activity at normal temperature before use of the solder paste. After reflow soldering of SMT is carried out, the active temperatures of maleic acid, sebacic acid and 2-phenylimidazole are 130-150 ℃ and are used for removing partial oxides on the surface of alloy solder powder in a preheating stage matched with a reflow curve, so that the solder powder is primarily combined together, and the shape of the solder paste is kept unchanged; the active temperature of dibutyl maleate and dibutyl succinate is 150-190 ℃, and the dibutyl maleate and dibutyl succinate are used for removing surface oxides of the circuit board bonding pad in a constant temperature stage matched with a reflux curve to prepare for combining with molten alloy solder powder; the activity temperature of the dimer acid is 190-230 ℃, and the dimer acid is used for removing oxides on the surface of the alloy solder powder to promote the melting and fusion of the alloy solder powder in a peak value reflow stage matched with a reflow curve. Meanwhile, the redundant part of the active agent is completely volatilized, so that the situation that the active agent is remained on the surface of the circuit board after being cooled to corrode the circuit board is avoided.
Detailed Description
The invention discloses a lead-free high-temperature soldering paste for mobile phones and computer mainboards, which comprises the following components, by weight, 46% of resin, 18% of solvent, 7% of thixotropic agent, 28% of active agent, 0.5% of corrosion inhibitor and 0.5% of antioxidant. Under the condition of the mixture ratio, the product has the best effect.
Preferably, the resin is AR120 rosin, Portal AX-E resin or polyisobutylene 300R. Can be purchased directly from the market.
Preferably, the solvent is in particular tetraglyme. The solvent can be used as a carrier to well dissolve the resin and the active agent, and provides proper viscosity for the finally produced soldering paste. Meanwhile, the solvent has a higher boiling point, so that the soldering paste can not become hard due to premature volatilization of the solvent when the soldering paste is subjected to reflow soldering, and the active agent can play a role in the whole reflow soldering process.
Preferably, the active agent is maleic acid, sebacic acid, dimer acid BX-H01, dibutyl maleate, 2-phenylimidazole, dibutyl succinate. The active temperature of maleic acid, sebacic acid and 2-phenylimidazole is 130-150 ℃, and the active temperature is used for removing partial oxide on the surface of the alloy solder powder in a preheating stage matched with a reflux curve, so that the solder powder is primarily combined together, and the shape of the solder paste is kept unchanged; the active temperature of dibutyl maleate and dibutyl succinate is 150-190 ℃, and the dibutyl maleate and dibutyl succinate are used for removing surface oxides of the circuit board bonding pad in a constant temperature stage matched with a reflux curve to prepare for combining with molten alloy solder powder; the activity temperature of the dimer acid is 190-230 ℃, and the dimer acid is used for removing oxides on the surface of the alloy solder powder to promote the melting and fusion of the alloy solder powder in a peak value reflow stage matched with a reflow curve.
Preferably, the corrosion inhibitor is selected from benzotriazole. The anti-corrosion effect on copper and its alloy, silver and its alloy is especially obvious, and the alloy component for said soldering paste is tin-silver-copper alloy, so that the effect of using benzotriazole as corrosion inhibitor is obvious.
Preferably, the antioxidant is specifically 2, 6-di-tert-butyl-4-methylphenol. The antioxidant has a high boiling point, can play a role in the whole reflow soldering process, can prevent the secondary oxidation of the alloy solder powder and a circuit board pad in the using process, and lays a good foundation for the use of an active agent.
The significant effect achieved by the present invention will now be illustrated by the test results of the specific examples, which are detailed in table 1. The manner of carrying out the invention is not limited to the examples but is merely illustrative.
Table 1: components of the examples
| Examples | Percent (%) |
| AR120 rosin | 28 |
| Proal AX-E resin | 12 |
| Polyisobutylene 300R | 6 |
| Tetraethylene glycol dimethyl ether | 18 |
| Ethylene distearic acid amide | 7 |
| Maleic acid | 4 |
| Sebacic acid | 2 |
| Dimer acid BX-H01 | 7 |
| 2-phenylimidazoles | 5 |
| Maleic acid dibutyl ester | 5 |
| Dibutyl succinate | 5 |
| 2, 6-di-tert-butyl-4-methylphenol | 0.5 |
| Benzotriazole | 0.5 |
The components are prepared according to the following steps:
(1) respectively weighing AR120 rosin, Portal AX-E resin, polyisobutylene 300R and tetraethylene glycol dimethyl ether according to the proportion, stirring and heating the materials on heating equipment until the resins are completely dissolved to obtain a mixture A;
(2) adding ethylene bis stearamide weighed in advance into the A at 150 ℃, continuously stirring until the materials are completely dissolved, quickly filtering to a cooling barrel, continuously and manually stirring and cooling to 110 ℃ in cold water, standing and cooling for 3-4 hours at 11 +/-3 ℃ to obtain a mixture B;
(3) taking out the mixture B, placing the mixture B at room temperature, adding maleic acid, sebacic acid, dimer acid BX-H01, dibutyl maleate, 2-phenylimidazole, dibutyl succinate, benzotriazole and 2, 6-di-tert-butyl-4-methylphenol after 8 hours, grinding and emulsifying to obtain a mixture C;
(4) grinding the mixture C into paste to obtain the soldering paste.
The flux paste obtained in this embodiment and the alloy solder powder are fully stirred and mixed under the vacuum condition to form the solder paste. The alloy solder powder selects SnAg3.0Cu0.5 (the particle size is 20-38 microns), and the mass ratio of the flux paste to the alloy solder powder is 10: 90 to obtain the soldering paste. The solder paste is tested on a mobile phone mainboard: and after the processes of printing, surface mounting and reflowing, checking the welding quality of components on the mainboard of the mobile phone. The test results are shown in table 2, the yield of the patch reaches 100%, and the effect is remarkable.
Table 2: experimental results of examples
| Parameter(s) | Percent ratio (%) |
| Yield of the mounted chip | 100 |
| Bridging rate after mounting | 0 |
| Bridging rate after reflow | 0 |
| Empty welding rate of welding spot | 0 |
| Void fraction of solder joint | 0.5 |
The above-mentioned embodiments are only preferred embodiments of the present invention, and do not limit the technical scope of the present invention, so that the changes and modifications made by the claims and the specification of the present invention should fall within the scope of the present invention.
Claims (8)
1. The lead-free high-temperature soldering paste for mobile phones and computer mainboards is characterized by comprising the following components in parts by weight: the anti-corrosion coating comprises, by weight, 46% of resin, 18% of solvent, 7% of thixotropic agent, 28% of active agent, 0.5% of corrosion inhibitor, 0.5% of antioxidant, 4% of maleic acid, 2% of sebacic acid, 2% of dimer acid BX-H017%, 5% of dibutyl maleate, 5% of 2-phenylimidazole and 5% of dibutyl succinate, and 28% of AR120 rosin, 12% of Portal AX-E resin and 300R 6% of polyisobutylene.
2. The lead-free high-temperature soldering paste for the mobile phone and the computer mainboard as recited in claim 1, wherein: the solvent is specifically tetraethylene glycol dimethyl ether.
3. The lead-free high-temperature soldering paste for the mobile phone and the computer mainboard as recited in claim 1, wherein: the thixotropic agent is ethylene bis-stearamide, and the corrosion inhibitor is selected from benzotriazole.
4. The lead-free high-temperature soldering paste for the mobile phone and the computer mainboard as recited in claim 1, wherein: the antioxidant is specifically 2, 6-di-tert-butyl-4-methylphenol.
5. The method for preparing the lead-free high-temperature soldering paste for the mobile phone and the computer mainboard according to claim 1, wherein the method comprises the following steps: the method comprises the following steps: (1) respectively weighing the resin and the solvent according to the proportion, stirring and heating the mixture on heating equipment until the resin is completely dissolved to obtain a mixture A; (2) adding the thixotropic agent weighed in advance into the mixture A at 150 ℃, continuously stirring until the materials are completely dissolved, quickly filtering to a cooling barrel, continuously and manually stirring and cooling to 110 ℃ in cold water, standing and cooling for 3-4 hours at 11 +/-3 ℃ to obtain a mixture B; (3) taking out the mixture B, placing the mixture B at room temperature, adding an active agent, a corrosion inhibitor and an antioxidant after 8 hours, grinding and emulsifying to obtain a mixture C; (4) grinding the mixture C into paste to obtain the soldering paste.
6. The preparation method of the lead-free high-temperature soldering paste for the mobile phone and the computer mainboard according to claim 5, wherein the preparation method comprises the following steps: in step (4), the fineness of the pasty material is less than 10 microns.
7. The preparation method of the lead-free high-temperature soldering paste for the mobile phone and the computer mainboard according to claim 5, wherein the preparation method comprises the following steps: the method comprises the following steps: (1) respectively weighing AR120 rosin, Portal AX-E resin, polyisobutylene 300R and tetraethylene glycol dimethyl ether according to the proportion, stirring and heating the materials on heating equipment until the resins are completely dissolved to obtain a mixture A; (2) adding ethylene bis stearamide weighed in advance into the mixture A at 150 ℃, continuously stirring until the materials are completely dissolved, quickly filtering to a cooling barrel, continuously and manually stirring and cooling to 110 ℃ in cold water, standing and cooling for 3-4 hours at 11 +/-3 ℃ to obtain a mixture B; (3) taking out the mixture B, placing the mixture B at room temperature, adding maleic acid, sebacic acid, dimer acid BX-H01, dibutyl maleate, 2-phenylimidazole, dibutyl succinate, benzotriazole and 2, 6-di-tert-butyl-4-methylphenol after 8 hours, grinding and emulsifying to obtain a mixture C; (4) grinding the mixture C into paste to obtain the soldering paste.
8. A solder paste using the lead-free high-temperature soldering paste for mobile phones and computer motherboards of claim 1, which is characterized in that: mixing the flux paste and the alloy solder powder according to the claim 1 by the mass ratio of 10: 90, and the components are SnAg3.0Cu0.5, and are mixed and stirred to form the alloy solder powder.
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| JP6540833B1 (en) * | 2018-01-17 | 2019-07-10 | 千住金属工業株式会社 | Flux and solder paste |
| CN108161280A (en) * | 2018-02-07 | 2018-06-15 | 合肥安力电力工程有限公司 | A kind of lead-free solder scaling powder and preparation method thereof |
| JP6617793B2 (en) * | 2018-06-01 | 2019-12-11 | 千住金属工業株式会社 | Solder paste flux and solder paste |
| CN109773373B (en) * | 2018-11-23 | 2021-04-30 | 东莞市星马焊锡有限公司 | Formula and preparation process of water-cleaning type soldering paste soldering flux |
| CN111299896B (en) * | 2020-03-11 | 2021-07-20 | 漳州佳联化工有限公司 | Soldering paste and preparation method thereof |
| CN113210931A (en) * | 2021-05-13 | 2021-08-06 | 北京达博长城锡焊料有限公司 | Soldering flux for solder paste, preparation method thereof and halogen-free and lead-free solder paste |
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| CN101564805A (en) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
| JP5400606B2 (en) * | 2009-12-29 | 2014-01-29 | 株式会社タムラ製作所 | Solder paste and flux |
| CN102513735A (en) * | 2011-12-27 | 2012-06-27 | 厦门市及时雨焊料有限公司 | Flux paste for high-bismuth content solder paste and preparation method thereof |
| CN103084755A (en) * | 2013-01-31 | 2013-05-08 | 广东普赛特电子科技股份有限公司 | Blending modification halogen-free solder paste and preparation method thereof |
| CN104028912A (en) * | 2014-06-18 | 2014-09-10 | 谢光玉 | Lead-free solder paste |
| JP6138846B2 (en) * | 2015-03-26 | 2017-05-31 | 株式会社タムラ製作所 | Solder composition and method for producing electronic substrate using the same |
| CN106271221B (en) * | 2016-09-09 | 2018-08-17 | 成都九十度工业产品设计有限公司 | A kind of scaling powder for leadless soldering tin paste |
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